Parts for cleaning processing cups in semiconductor manufacturing equipment

JP1790116SActive Publication Date: 2025-01-29TOKYO ELECTRON LTD
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Patent Information

Application Number
JP2024017278D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2024-08-22
Publication Date
2025-01-29
Estimated Expiration
2049-08-22

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Abstract

This article is a part used to remove processing liquid adhering to the inside of a processing cup in a substrate processing apparatus during a cleaning process in semiconductor manufacturing. This article is attached to a rotating body and used, for example, in a processing cup of a peripheral processing apparatus that performs peripheral coating of a substrate. When cleaning the processing cup, this article is rotated by the rotating body, and a cleaning liquid is supplied from a cleaning nozzle to an opening at the bottom of this article, and is ejected from an opening at the outer periphery of this article toward the inside of the processing cup via a flow path in this article.
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