Cooling stamp to ease puncture pain

JP1791826SActive Publication Date: 2025-02-21大分纸业株式会社
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Patent Information

Application Number
JP2024018794D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2024-09-11
Publication Date
2025-02-21
Estimated Expiration
2049-09-11

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Abstract

This product is a cooling stamp for mitigating pain caused by punctures, such as when a puncture needle is inserted during dialysis or injection, by cooling the skin to relieve pain. As shown in [Reference Figure 2 showing the state of use], the cooling stamp is housed in the main body of a skin cooling device for mitigating pain caused by punctures and is cooled. A Peltier element for cooling and a control device are built into the main body of the device. As shown in [Reference Figure 1 showing the state of use], when in use, the cooling stamp is taken out and the lower end surface is pressed against the surface of the arm for about 10 to 15 seconds to cool the skin and relieve the pain caused by the puncture needle.
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