Substrate support seal cover band

JP1795825SActive Publication Date: 2025-04-10LAM RES CORP
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Patent Information

Application Number
JP2024023181D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2024-11-08
Publication Date
2025-04-10
Estimated Expiration
2049-11-08

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Abstract

The article according to the present application (hereinafter referred to as "the article") is a seal cover band for covering a seal provided to protect a bonding layer constituting a substrate support, for example, an electrostatic chuck. In the substrate support, a base plate and a top plate are bonded by a bonding layer. The seal is disposed between the base plate and the top plate at the outer periphery of the substrate support, including the bonding layer. The article is fitted between the base plate and the top plate at the outer periphery of the substrate support to protect the seal, and covers the seal.
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