Substrate support seal cover band
JP1795827SActive Publication Date: 2025-04-10LAM RES CORP
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Patent Information
- Application Number
- JP2024023183D
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-04-10
- Estimated Expiration
- 2049-11-08
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Abstract
The article according to the present application (hereinafter referred to as "the article") is a seal cover band for covering a seal provided to protect a bonding layer constituting a substrate support, for example, an electrostatic chuck. In the substrate support, a base plate and a top plate are bonded by a bonding layer. The seal is disposed between the base plate and the top plate at the outer periphery of the substrate support, including the bonding layer. The article is fitted between the base plate and the top plate at the outer periphery of the substrate support to protect the seal, and covers the seal.
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