Polishing Pad
JP1797351SActive Publication Date: 2025-04-30FUJIBO HLDG
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Patent Information
- Application Number
- JP2024025662D
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-04-30
- Estimated Expiration
- 2049-12-11
Smart Images
Figure 0001797351000001 
Figure 0001797351000002 
Figure 0001797351000003
Abstract
This article is mainly used for polishing electronic devices and electronic components. This article is composed of an abrasive layer and a base layer, and the abrasive layer has recesses at equal intervals around its circumference. In addition, the abrasive layer has concentric grooves on its surface.
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