Curved surface profiling polishing device and technology based on force rheology and chemical synergistic effect

Abstract

The invention provides a curved surface profiling polishing device and process based on force rheology and a chemical synergistic effect. The device comprises a bottom box body, a driving motor and a main shaft are arranged in the bottom box body, and a polishing head with a profiling tool is installed on the main shaft and is immersed in a polishing solution with a specific formula. A lead screw module is arranged at the top of the box body and used for accurately controlling the position and posture of the curved-surface workpiece, the outer contour surface of the polishing tool is matched with the curved surface of the workpiece in height, and efficient profiling polishing is achieved. According to the device, the stability and efficiency of force rheological polishing are improved by optimizing the structural design and improving a polishing solution system. Especially, through height matching of the profiling polishing tool and the curved surface of the workpiece, the technical bottlenecks that a traditional method is difficult to adapt to complex curved surfaces and polishing quality is difficult to guarantee are effectively broken through. And by optimizing polishing parameters, nanoscale precision machining of the surface of the curved-surface workpiece is achieved, and the surface quality is remarkably improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of mechanical polishing, in particular to a curved surface profiling polishing device and process based on force flow and chemical synergistic effect. BACKGROUND

[0002] In the field of mechanical engineering, the surface quality of components has a crucial impact on their performance and lifespan. Particularly for key components with complex curved surfaces, such as aircraft engine blades and turbine discs, the surface quality requirements are even more stringent. High surface quality not only significantly reduces the friction coefficient but also effectively reduces stress concentration phenomena caused by surface roughness. This is particularly important for components that bear cyclic loads or move at high speeds, as surface defects often become the starting point for crack initiation, thereby accelerating the process of fatigue failure. In addition, high-quality surface treatment can reduce wear and tear, extend the service life of components, and reduce maintenance costs.

[0003] However, traditional mechanical polishing techniques, although widely used, still have some limitations. First, mechanical polishing processes can easily introduce surface and subsurface damage, such as micro-cracks, plastic deformation, and residual stress, which may become the origin of fatigue failure of components during service. Second, mechanical polishing has limited processing capabilities for complex geometries or microstructures, making it difficult to achieve uniform material removal, resulting in poor surface consistency. Especially when dealing with components with complex curved surfaces, traditional polishing methods often cannot achieve precise curved surface profiling, causing local over-polishing or under-polishing phenomena. In addition, mechanical polishing usually relies on the experience and technical level of operators, and the control of process parameters is difficult, which can easily cause unstable surface quality. Finally, the heat generated during mechanical polishing can cause local temperature rise, which in turn can cause changes in the microstructure of the material, affecting the mechanical properties of the component.

[0004] The unique feature of the curved surface profiling polishing technology based on shear thickening effect and chemical action synergy proposed in this study is its excellent curved surface profiling capability. The polishing medium can adaptively conform to the complex curved surface profile, solving the problem of uneven polishing and unstable quality caused by the inability of traditional methods to achieve dynamic conforming, ensuring consistent polishing results throughout the surface, and enabling efficient and uniform polishing of complex curved surfaces and microstructures while reducing surface and subsurface damage. This composite polishing method provides an innovative and reliable solution for the manufacturing of high-precision and high-performance mechanical components, especially those with complex curved surface features. By precisely controlling the rheological properties and chemical activity of the polishing medium, it is possible to achieve profiling polishing of complex curved surface parts, ensuring the consistency of surface quality and process stability. SUMMARY

[0005] In view of the above-mentioned defects of the prior art, the purpose of the present application is to provide a solution to the problem of poor surface quality of mechanical parts.

[0006] To achieve the above-mentioned purpose of the present application, the technical solutions of the present application are as follows:

[0007] A curved surface copying and polishing device based on the synergistic effect of rheological flow and chemistry,

[0008] It comprises a box body, which is enclosed to form a closed space by front, rear, left and right baffles; the upper surface of the box body is set as an xy plane, and the depth direction of the box body is a z direction;

[0009] A motor 6 is arranged inside the box body, which drives the main shaft 10 to rotate through a speed reducer 13;

[0010] A lead screw module 2 is arranged above the box body, the execution end of which is connected to a clamping plate 16, which is connected to a curved workpiece 19 through a clamping block (17);

[0011] An equipment inner groove 15 is arranged on the upper surface of the box body, which is internally provided with a polishing liquid groove 14, the top end of the main shaft 10 penetrates through the equipment inner groove 15 and the polishing liquid groove 14 to connect a polishing head 5, the polishing head 5 is immersed in the polishing liquid, the polishing head 5 is connected to a copying and polishing tool 20 through an adjusting clamp 21, and the polishing outer contour surface of the copying and polishing tool 20 matches the curved surface of the curved workpiece 19.

[0012] As a preferred mode, the lead screw module comprises a y-direction lead screw, an x-direction lead screw in sliding connection with the y-direction lead screw, and a z-direction lead screw in sliding connection with the x-direction lead screw, and the execution end is in sliding connection with the z-direction lead screw.

[0013] As a preferred mode, the clamping plate 16 is provided with a clamping block 17, and the clamping block 17 is clamped with the curved workpiece 19.

[0014] As a preferred mode, the back surface of the clamping plate 16 is provided with a rib plate 18.

[0015] As a preferred mode, the motor 6 is connected to a double diaphragm elastic coupling 12 through a speed reducer 13, and the double diaphragm elastic coupling 12 drives the main shaft 10 to rotate.

[0016] As a preferred mode, the bottom of the polishing head 5 is connected to the copying and polishing tool 20 through the adjusting clamp 21.

[0017] As a preferred mode, the clamping block 17 is internally provided with a clamping groove for clamping the workpiece, and / or a limiting screw is arranged above the clamping groove to prevent the workpiece from falling out of the clamping groove.

[0018] As a preferred mode, the main shaft 10 is connected to a flange plate 11 through a deep groove ball bearing A8 and a deep groove ball bearing B9, and the main shaft is guaranteed to be concentric through the flange plate 11.

[0019] As a preferred mode, the top end of the main shaft 10 is connected to the polishing head 5 by an internal hexagonal bolt 7.

[0020] And / or the inner groove 15 of the device is connected to the rack 3 by a screw.

[0021] As a preferred mode, the curved surface of the curved workpiece 19 is selected from one of the following: a rotational surface, a cylindrical surface, a conical surface, a ruled surface, a lofted surface, a translational swept surface, a rotational swept surface, a general swept surface, a stretched surface, a free-form surface, and a parametric surface.

[0022] A second object of the present application is to provide a process for curved surface copying polishing based on the force flow rheology and chemical synergistic effect using the device, comprising the following steps:

[0023] The first step, the formula of the polishing liquid includes: 14% moisture content and 0-20wt% white corn starch, 0-40wt% abrasive particles, 0.01-30wt% oxidizing agent, 35wt% deionized water, acidic pH adjuster, the acidic pH adjuster is used to adjust the pH value of the polishing liquid to 2-6, wt% represents mass percentage;

[0024] The abrasive particles include one or more of the following: silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide, titanium oxide, iron oxide, magnesium oxide, zinc oxide, silicon carbide, boron carbide, tungsten carbide, titanium carbide, tantalum carbide, vanadium carbide, boron nitride, silicon nitride, aluminum nitride, titanium nitride, zirconium nitride, diamond, and cubic boron nitride, the particle size of the abrasive particles is in the range of 20-200nm, and silicon dioxide is preferred.

[0025] The oxidizing agent includes one or more of the following: hydrogen peroxide, ammonium persulfate, potassium persulfate, sodium persulfate, peroxyacetic acid, potassium permanganate, potassium ferricyanide, potassium dichromate, potassium ferrate, ammonium ceric nitrate, ferric nitrate, copper nitrate, silver nitrate, aluminum nitrate, sodium hypochlorite, potassium bromate, sodium chlorite, manganese dioxide, lead dioxide, and periodic acid, and hydrogen peroxide is preferred.

[0026] The acidic pH adjuster includes one or more of the following: hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, citric acid, oxalic acid, tartaric acid, malic acid, polyacrylic acid, sodium phosphate, formic acid, lactic acid, aluminum sulfate, ammonium chloride, sulfamic acid, polystyrene sulfonic acid, polymethacrylic acid, and ethylenediaminetetraacetic acid, and nitric acid is preferred.

[0027] The second step, the preparation of the polishing liquid: according to the above formula, first add deionized water, then add abrasive particles and oxidizing agent in sequence, after fully stirring, add the acidic pH adjuster to adjust the pH value of the solution to 2-6, then add white corn starch to the solution, fully stir, and then add to the polishing tank after uniform stirring;

[0028] The third step is the polishing process: After adding the polishing liquid to the polishing liquid tank, the workpiece is clamped by the clamping plate. The polishing head speed and the gap between the workpiece and the edge of the polishing head are set. When the cylindrical polishing tool rotates, the linear velocity in the tangential direction is the highest, while the normal velocity is almost zero. Therefore, near the tangent, the shear rate of the fluid polishing slurry reaches its peak, triggering a strong shear thickening effect. The speed and stroke of the sample moving back and forth in the x-axis direction are set to ensure that the entire plane is uniformly subjected to the maximum shear thickening effect. The polishing time is set to 1 hour. After the polishing is completed, the workpiece surface is cleaned with ethanol.

[0029] The working principle of this invention is as follows:

[0030] The lead screw module 2 moves the workpiece to adjust its position on the x, y, and z axes. When adjusted to a suitable position (e.g., setting the gap between the workpiece and the polishing head), the motor drives the spindle to rotate. The spindle then drives the polishing head to polish the workpiece in the polishing fluid. The contour polishing tool uses rubber damping material to increase shear force and clamp the workpiece. The polishing head speed is set. When the cylindrical polishing tool rotates, the linear velocity in the tangential direction is the highest, while the normal velocity is almost zero. Therefore, near the tangent, the shear rate of the fluid (polishing slurry) reaches its peak, triggering a strong shear thickening effect. The sample's back-and-forth movement speed and stroke in the x-axis direction are set to ensure that the entire plane is uniformly subjected to the maximum shear thickening effect and is polished by the maximum shear thickening force. The polishing time is set to 1 hour, and the workpiece surface is cleaned with ethanol afterward.

[0031] Contour polishing based on the synergistic effect of force-rheology and chemical processes is an advanced polishing technique that combines mechanical action, rheological control, and chemical reaction. Its core principle is to enhance mechanical cutting force by controlling the rheological properties of non-Newtonian fluids (such as shear-thickening slurries), while simultaneously introducing chemical oxidants (such as H₂O₂) to promote surface chemical reactions, achieving efficient and low-damage material removal. This technique utilizes the synergistic effect of force-rheology and chemical corrosion to achieve nanoscale surface roughness (Sa < 3 nm) in precision machining.

[0032] The beneficial effects of this invention are as follows:

[0033] 1. The curved surface contour polishing device and process provided by this invention, based on the synergistic effect of mechanorheology and chemistry, effectively overcomes the problems of complex mechanical structures leading to easy wear and leakage of sealing components and decreased precision of transmission parts in traditional mechanorheological polishing, as well as the problems of complex formulation and poor storage stability of multiphase polishing fluid systems. These defects significantly affect the reliability and process stability of the system. By adding chemical action to traditional mechanorheological polishing, nanoscale roughness of curved workpiece surfaces is achieved, improving surface quality.

[0034] 2. By leveraging the adaptive encapsulation properties of shear-thickening fluids and the synergistic effect of chemical reagents, uniform polishing of complex curves across the entire surface can be achieved without relying on high-precision mechanical trajectory control.

[0035] 3. Achieve a surface roughness of less than 3nm on curved workpieces, and maintain a material removal rate of 0.11mg / min, avoiding lattice damage caused by local over-polishing in traditional methods.

[0036] 4. The polishing medium is constructed using low-cost raw materials such as flour and deionized water, which reduces production costs while ensuring the accuracy of the contouring, thus meeting the processing needs of large batches of high-precision parts such as aero-engine blades. Attached Figure Description

[0037] Figure 1 Three-dimensional structural diagram of the overall assembly of the device of the present invention.

[0038] Figure 2 Front view of the device of the present invention.

[0039] Figure 3 Front view of the main axis of the device of the present invention.

[0040] Figure 4 A sectional view of the main axis of the device of the present invention.

[0041] Figure 5 The polishing liquid tank of the present invention

[0042] Figure 6 A front view of the clamping plate and clamping block of the device of the present invention.

[0043] Figure 7 A schematic diagram of the rib plate on the rear side of the clamping plate of the device of the present invention.

[0044] Figure 8 A schematic diagram of the polishing experiment using the device of this invention.

[0045] Figure 9 White light morphology of the workpiece surface polished by the device of the present invention.

[0046] Figure 10 Microscopic morphology of the workpiece surface polished by the device of the present invention.

[0047] 1-Right baffle, 2-Screw module, 3-Frame, 4-Front baffle, 5-Polishing head, 6-Motor, 7-Hex socket head cap screw, 8-Deep groove ball bearing A, 9-Deep groove ball bearing B, 10-Spindle, 11-Flange, 12-Double diaphragm flexible coupling, 13-Reducer, 14-Polishing fluid tank, 15-Inner tank of equipment, 16-Clamping plate, 17-Clamping block, 18-Rib plate, 19-Curved surface workpiece, 20-Contouring polishing tool, 21-Clamping clamp. Detailed Implementation

[0048] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0049] Examples 1-5

[0050] A curved surface contour polishing device based on the synergistic effect of mechanical rheology and chemistry includes: a box body, which is enclosed by front, rear, left and right baffles to form a closed space; the upper surface of the box body is set as the xy plane, and the depth direction of the box body is set as the z direction;

[0051] The motor 6, located inside the housing, drives the main shaft 10 to rotate via the reducer 13.

[0052] The lead screw module 2 located above the housing has a clamping plate 16 connected to its execution end. The clamping plate 16 is connected to the curved workpiece 19 through a clamping block (17).

[0053] The equipment inner tank 15 is located on the upper surface of the box, and a polishing liquid tank 14 is provided inside it. The top end of the main shaft 10 passes through the equipment inner tank 15 and the polishing liquid tank 14 to connect to the polishing head 5. The polishing head 5 is immersed in the polishing liquid. The polishing head 5 is connected to the contour polishing tool 20 through the adjusting clamp 21. The contour polishing tool 20 is matched with the curved workpiece 19.

[0054] The surface of the curved workpiece 19 is selected from one of the following: surface of revolution, cylindrical surface, conical surface, ruled surface, lofted surface, translational swept surface, rotating swept surface, general swept surface, extruded surface, freeform surface, and parametric surface.

[0055] As a preferred embodiment, the lead screw module includes a y-direction lead screw, an x-direction lead screw slidably connected to the y-direction lead screw, a z-direction lead screw slidably connected to the x-direction lead screw, and an actuator slidably connected to the z-direction lead screw.

[0056] As a preferred embodiment, the clamping plate 16 is provided with a clamping block 17, which is engaged with the curved workpiece 19.

[0057] As a preferred embodiment, the back of the clamping plate 16 is provided with a rib 18.

[0058] As a preferred embodiment, the motor 6 is connected to the double diaphragm elastic coupling 12 via the reducer 13, and the double diaphragm elastic coupling 12 drives the main shaft 10 to rotate.

[0059] As a preferred embodiment, the bottom of the polishing head 5 is connected to the contour polishing tool 20 via an adjusting clamp 21.

[0060] As a preferred embodiment, the clamping block 17 is provided with a slot for engaging the workpiece, and / or a limiting screw is provided above the slot to prevent the workpiece from coming out of the slot.

[0061] In a preferred embodiment, the spindle 10 is connected to the flange 11 via deep groove ball bearings A8 and B9, and the spindle is ensured to be concentric via the flange 11.

[0062] As a preferred embodiment, the polishing head 5 is connected to the top of the spindle 10 via an internal hex bolt 7;

[0063] And / or the inner groove 15 of the equipment is connected to the frame 3 by screws.

[0064] The second objective of this embodiment is to provide a surface contour polishing process based on the synergistic effect of mechanical rheology and chemistry, comprising the following steps:

[0065] The first step is to formulate the polishing solution as follows: white corn starch with a moisture content of 14% and 0-20wt%, abrasive particles of 0-40wt%, oxidant of 0.01-30wt%, deionized water of 35wt%, and acidic pH adjuster. The acidic pH adjuster is used to adjust the pH of the polishing solution to 2-6. wt% indicates the mass percentage.

[0066] The abrasive particles include one or more of the following: silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide, titanium oxide, iron oxide, magnesium oxide, zinc oxide, silicon carbide, boron carbide, tungsten carbide, titanium carbide, tantalum carbide, vanadium carbide, boron nitride, silicon nitride, aluminum nitride, titanium nitride, zirconium nitride, diamond, and cubic boron nitride. The particle size of the abrasive particles is in the range of 20 to 200 nm, and silicon dioxide is preferred.

[0067] The oxidizing agent includes one or more of the following: hydrogen peroxide, ammonium persulfate, potassium persulfate, sodium persulfate, peracetic acid, potassium permanganate, potassium ferricyanide, potassium dichromate, potassium ferrate, ammonium percerate, ferric nitrate, copper nitrate, silver nitrate, aluminum nitrate, sodium hypochlorite, potassium bromate, sodium chlorite, manganese dioxide, lead dioxide, and periodic acid, preferably hydrogen peroxide.

[0068] Acidic pH adjusters include one or more of the following: hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, citric acid, oxalic acid, tartaric acid, malic acid, polyacrylic acid, sodium dihydrogen phosphate, formic acid, lactic acid, aluminum sulfate, ammonium chloride, aminosulfonic acid, polyacrylic acid, polystyrene sulfonic acid, polymethacrylic acid, and ethylenediaminetetraacetic acid, preferably nitric acid.

[0069] The second step is the preparation of the polishing solution: According to the above formula, first add deionized water, then add grinding particles and oxidant in sequence, stir thoroughly, then add an acidic pH adjuster to adjust the pH of the solution to 2-6, then add white corn starch to the solution, stir thoroughly, and then add it to the polishing tank.

[0070] The third step involves adding the polishing fluid to the polishing slurry tank, clamping the workpiece with clamps, setting the polishing head speed and the gap between the workpiece and the edge of the polishing head. When the cylindrical polishing tool rotates, the linear velocity in the tangential direction is the highest, while the normal velocity is almost zero. Therefore, near the tangent, the shear rate of the fluid polishing slurry reaches its peak, triggering a strong shear thickening effect. The speed and stroke of the sample moving back and forth in the x-axis direction are set to ensure that the entire plane is uniformly subjected to the maximum shear thickening effect. The polishing time is set to 1 hour, and the workpiece surface is cleaned with ethanol after the polishing is completed.

[0071] control group

[0072] The difference between the control group and the example is that the polishing solution of the control group does not contain an oxidant.

[0073] Table 1 shows the formulation components for the control group and Examples 1-5 of the present invention. The polishing liquid components for Examples 1-5 were prepared according to Table 1.

[0074] Table 1

[0075]

[0076]

[0077] Table 2 shows the material removal rate and surface roughness of the curved workpieces achieved in the control group and Examples 1-5 of the present invention.

[0078] Table 2

[0079] Control Material removal rate (mg / min) Surface roughness (nm) Control 0.04 12.68 Example 1 0.08 7.60 Example 2 0.18 5.45 Example 3 0.11 2.85 Example 4 0.10 5.10 Example 5 0.09 6.34

[0080] As shown in Table 2, the material removal rate of the control group under oxidant-free conditions was only 0.04 mg / min, while the surface roughness was as high as 12.68 nm. When 0.5 wt% metal oxide was introduced in Example 1, the material removal rate increased by 100% to 0.08 mg / min, and the surface roughness decreased by 40% to 7.6 nm. As the concentration of Example 3 increased to 2 wt%, the performance reached the optimal balance point: the removal rate further increased to 0.11 mg / min, which was 175% higher than the control group, and the surface roughness was significantly improved to 2.85 nm, a decrease of 77.5%. However, when the concentration in Examples 4-5 exceeded 2 wt%, a performance inflection point appeared, with the removal rate decreasing by about 9.1% and the surface roughness rebounding to 3.2 nm. This "increase then decrease" pattern indicates that a hydrogen peroxide concentration of 2 wt% formed the optimal oxidation-removal dynamic balance in this experimental system, which can effectively promote surface chemical reactions while avoiding the accumulation of a dense oxide layer due to excessive oxidation.

[0081] The working principle of this invention is as follows:

[0082] The lead screw module 2 moves the workpiece to adjust its position on the x, y, and z axes. When the position is adjusted to a suitable level (e.g., setting the gap between the workpiece and the polishing head), the motor drives the spindle to rotate. The spindle then drives the polishing head to polish the workpiece in the polishing fluid. The contour polishing tool uses rubber damping material to increase the shear force and clamp the workpiece. The polishing head speed is set. When the cylindrical polishing tool rotates, the linear velocity in the tangential direction is the highest, while the normal velocity is almost zero. Therefore, near the tangent, the shear rate of the fluid (polishing slurry) reaches its peak, triggering a strong shear thickening effect. The sample's back-and-forth movement speed and stroke in the x-axis direction are set to ensure that the entire plane is uniformly subjected to the maximum shear thickening effect and is polished by the maximum shear thickening force. The polishing time is set to 1 hour, after which the workpiece surface is cleaned with ethanol.

[0083] Mechanorheology-based chemical-assisted surface treatment is an advanced polishing technique that combines mechanical action, rheological control, and chemical reaction. Its core principle is to enhance mechanical cutting forces by controlling the rheological properties of non-Newtonian fluids (such as shear-thickening slurries), while simultaneously introducing chemical oxidants (such as H₂O₂) to promote surface chemical reactions, achieving efficient and low-damage material removal. This technology utilizes the synergistic effect of mechanorheology and chemical corrosion to achieve nanoscale surface roughness (Sa < 3 nm) in precision machining.

[0084] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A surface contour polishing device based on the synergistic effect of mechanorheology and chemistry, characterized in that, include: The enclosure is formed by front, rear, left, and right baffles to create a sealed space; The upper surface of the box is defined as the xy plane, and the depth direction of the box is defined as the z direction. A motor (6) located inside the housing drives the main shaft (10) to rotate via a reducer (13); The lead screw module (2) located above the box body has a clamping plate (16) connected to its execution end. The clamping plate (16) is connected to the curved workpiece (19) through the clamping block (17). The equipment inner tank (15) located on the upper surface of the box has a polishing liquid tank (14) inside. The top of the spindle (10) passes through the equipment inner tank (15) and the polishing liquid tank (14) to connect to the polishing head (5). The polishing head (5) is immersed in the polishing liquid. The polishing head (5) is connected to the contour polishing tool (20) through the adjusting clamp (21). The outer contour surface of the contour polishing tool (20) matches the curved surface of the curved workpiece (19).

2. The apparatus according to claim 1, characterized in that: The lead screw module (2) includes a y-direction lead screw, an x-direction lead screw and a z-direction lead screw that are slidably connected in sequence, and the z-direction lead screw is provided with an actuation end.

3. The apparatus according to claim 1, characterized in that: The clamp (17) is provided with a slot with a limiting screw, and the main shaft (10) is connected to the flange (11) through a deep groove ball bearing A (8) and a deep groove ball bearing B (9).

4. The apparatus according to claim 1, characterized in that: The top of the spindle (10) is connected to the polishing head (5) by an internal hex bolt (7); and / or the inner groove (15) of the equipment is connected to the frame (3) by screws.

5. The apparatus according to claim 1, characterized in that: The surface of the workpiece (19) is selected from one of the following: surface of revolution, cylindrical surface, conical surface, ruled surface, lofted surface, translational swept surface, rotating swept surface, general swept surface, stretched surface, free surface, and parametric surface.

6. A process for surface contour polishing based on the synergistic effect of mechanorheology and chemistry using the apparatus described in any one of claims 1 to 5, characterized in that... Includes the following steps: The first step is to formulate the polishing solution as follows: white corn starch with a moisture content of less than 14% and 0-20wt%, 0-40wt% abrasive particles, 0.01-30wt% oxidant, 35wt% deionized water, and acidic pH adjuster. The acidic pH adjuster is used to adjust the pH of the polishing solution to 2-6. wt% indicates the mass percentage. The abrasive particles are selected from one or more of the following: silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide, titanium oxide, iron oxide, magnesium oxide, zinc oxide, silicon carbide, boron carbide, tungsten carbide, titanium carbide, tantalum carbide, vanadium carbide, boron nitride, silicon nitride, aluminum nitride, titanium nitride, zirconium nitride, diamond, and cubic boron nitride. The particle size of the abrasive particles is in the range of 20 to 200 nm. The oxidizing agent is selected from one or more of the following: hydrogen peroxide, ammonium persulfate, potassium persulfate, sodium persulfate, peracetic acid, potassium permanganate, potassium ferricyanide, potassium dichromate, potassium ferrate, ammonium percerate, ferric nitrate, copper nitrate, silver nitrate, aluminum nitrate, sodium hypochlorite, potassium bromate, sodium chlorite, manganese dioxide, lead dioxide, and periodic acid. The acidic pH adjuster is selected from one or more of the following: hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, citric acid, oxalic acid, tartaric acid, malic acid, polyacrylic acid, sodium dihydrogen phosphate, formic acid, lactic acid, aluminum sulfate, ammonium chloride, aminosulfonic acid, polyacrylic acid, polystyrene sulfonic acid, polymethacrylic acid, and ethylenediaminetetraacetic acid. The second step is the preparation of the polishing solution: According to the above formula, first add deionized water, then add grinding particles and oxidant in sequence, stir thoroughly, then add an acidic pH adjuster to adjust the pH of the solution to 2-6, then add white corn starch to the solution, stir thoroughly, and then add it to the polishing tank. The third step is the polishing process: After adding the polishing liquid to the polishing slurry tank, the workpiece is clamped by the clamping plate. The polishing head speed and the gap between the workpiece and the polishing head are set. When the cylindrical polishing tool rotates, the linear velocity in the tangential direction is the highest, while the normal velocity is almost zero. Therefore, near the tangent, the shear rate of the fluid polishing slurry reaches its peak, triggering a strong shear thickening effect. The speed and stroke of the sample moving back and forth in the x-axis direction are set to ensure that the entire plane is uniformly subjected to the maximum shear thickening effect. The polishing time is set to 1 hour. After the polishing is completed, the workpiece surface is cleaned with ethanol.

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