Heat sink
JP1805060SActive Publication Date: 2025-08-01LSI COOLER
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Patent Information
- Application Number
- JP2025001843D
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2025-01-31
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2050-01-31
Smart Images
Figure 0001805060000001 
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Abstract
The article related to this design is a heat sink that is used by being attached to an object to be cooled. It is formed of aluminum or an aluminum alloy, and a plurality of fins, for example, fins having a height of 25 mm, a width of 1.2 mm to 1.5 mm, and a thickness of 3 mm, are provided in a two-dimensional array on a base having a thickness of 200 ± 20 μm. The base can be deformed according to the shape of the object to be cooled and maintain the deformed state.
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