Adhesive tape materials for semiconductor device manufacturing

Abstract

This product is an adhesive tape material used in the semiconductor device manufacturing process for dicing semiconductor wafers and die bonding semiconductor chips obtained by dicing. To use the tape, peel off the PET separator and attach the semiconductor wafer to the adhesive layer. The product has a product name label near the adhesive layer, which is attached to the surface of the base material. The product does not have a product name label near the adhesive layer where foreign matter is present and the adhesive layer cannot be used. Therefore, when using the product, purchasers can use the laminating device's sensor to detect the adhesive layer containing foreign matter and remove the adhesive layer.

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