Adhesive tape materials for semiconductor device manufacturing

Abstract

This product is an adhesive tape material used in the semiconductor device manufacturing process for dicing semiconductor wafers and die bonding the semiconductor chips obtained by dicing. To use the tape, the PET separator is peeled off and the semiconductor wafer is attached to the adhesive layer. The product features a barcode near the adhesive layer, which cannot be used due to the presence of foreign matter. The barcode is affixed to the surface of the substrate. Therefore, when using the product, purchasers can use the laminating device's sensor to detect the adhesive layer containing foreign matter and remove the adhesive layer.

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