Adhesive tape materials for semiconductor device manufacturing

Abstract

This product is an adhesive tape material used in the semiconductor device manufacturing process for dicing semiconductor wafers and die bonding the semiconductor chips obtained by dicing. To use the tape, the PET separator is peeled off and the semiconductor wafer is attached to the adhesive layer. The dicing tape has a marking on the surface of the base material that overlaps with the adhesive layer that cannot be used due to the presence of foreign matter. Therefore, when using the product, purchasers can use the laminating equipment's sensor to detect the adhesive layer containing foreign matter and remove the adhesive layer.

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