Dicing tape support for substrate processing equipment

Abstract

This product is used in a substrate processing apparatus during the dicing process of a substrate (wafer to be processed) on a dicing tape attached to a dicing frame, and is used when the substrate is subjected to liquid processing such as cleaning. As shown in the "Reference Diagram Showing the Usage State," this product is removably installed in the groove of the frame support part. The product has a protrusion on its top surface that is slightly higher than the protrusion on the inside of the frame support part. This protrusion abuts the dicing tape to form a seal, reducing the occurrence of vacuum loss errors during liquid processing of the dicing tape held by suction.

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