Polishing pad

Abstract

This product is a polishing pad primarily used for polishing workpieces, such as wafers used in manufacturing electronic devices and electronic components. It consists of a polishing layer and a substrate layer supporting the polishing layer. Cylindrical protrusions are formed on the surface of the polishing layer. As shown in the enlarged reference diagram for explaining the arrangement of the protrusions, the center of each protrusion is located on an Archimedes' spiral, expressed by the polar equation r = aθ. In the polar equation, r is the distance from the center of the surface of the polishing layer, a is a constant, and θ is the rotation angle. Furthermore, the spacing between the spirals, L1, is equal to the center-to-center distance, L2, between adjacent protrusions in the spiral direction (L1 = L2). By arranging the protrusions in this manner, various protrusions can be brought into contact with the center of the workpiece during polishing, enabling stable polishing even at the center of the workpiece.

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