Polishing pad

Abstract

This product is a polishing pad primarily used for polishing workpieces, such as wafers used in manufacturing electronic devices and electronic components. It consists of a polishing layer and a substrate layer supporting the polishing layer. The surface of the polishing layer is formed with cylindrical convex portions and radial grooves. As shown in the enlarged reference diagram illustrating the arrangement of the convex portions, the center of each convex portion is located on an Archimedes' spiral, expressed by the polar equation r = aθ. In the polar equation, r is the distance from the center of the surface of the polishing layer, a is a constant, and θ is the rotation angle. Furthermore, the spacing between the spirals, L1, is equal to the center-to-center distance, L2, between adjacent convex portions in the spiral direction (L1 = L2). Two convex portions separated by a groove in the spiral direction are not considered "adjacent convex portions." This arrangement of the convex portions allows various convex portions to contact the center of the workpiece during polishing, enabling stable polishing even at the center of the workpiece.

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