Universal Board

JP1821226SActive Publication Date: 2026-03-12大内山 士郎
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-06-02
Publication Date
2026-03-12

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Abstract

This design relates to a universal printed circuit board. The design focuses particularly on the metal wiring pattern formed on the top view, which is the front surface of the universal board, or the bottom view, which is the back surface. A printed circuit board has a circuit pattern made of a certain metal formed on its surface. By soldering various electrical components and connecting the circuit patterns together, an electrical circuit (electrical product) can be formed on the printed circuit board. Furthermore, a universal board has identical wiring circuit patterns arranged vertically and horizontally at intervals specified by a certain JIS standard. By soldering various electrical components onto this circuit pattern and similarly connecting the circuit patterns together, any electrical circuit product can be created. The specified circuit pattern spacing is approximately 0.1 inches (approximately 2.54 mm). Incidentally, by forming a similar electrical circuit pattern on the back (bottom) surface, it can be made into a universal board that can be used on both sides.
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