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JP1822872SActive Publication Date: 2026-03-30SMK CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-09-19
Publication Date
2026-03-30

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  • Figure 0001822872000001
    Figure 0001822872000001
  • Figure 0001822872000002
    Figure 0001822872000002
  • Figure 0001822872000003
    Figure 0001822872000003
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Abstract

This item is mounted with its bottom facing the mounting surface of a printed circuit board, and is used by inserting a compatible mating contact; it is a contact that makes an electrical connection.
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