Laminate type electronic component

Abstract

To provide a laminate type electronic component which has improved capacity per unit volume.SOLUTION: A laminate type electronic component includes: a body 110 having a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface which are connected to the first and second surfaces and face each other in a second direction, and a fifth surface and a six surface which are connected to the first to fourth surfaces and face each other in a third direction; a first external electrode 131 which includes a first connection part 131a arranged on the third surface, a first band part 131b extending to a part of the first surface from the first connection part, and a third band part 131c extending to a part of the second surface from the first connection part; a second external electrode 132 which includes a second connection part 132a arranged on the fourth surface, a second band part 132a extending to a part of the first surface from the second connection part and a fourth band part 132c extending to a part of the second surface from the second connection part; an insulation layer 151 which is arranged on the first and second connection parts, is composed of an aluminum oxide, and covers the second surface and the third and fourth band parts; a first plating layer 141 on the first band part; and a second plating layer 142 on the second band part.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors that are attached to the printed circuit boards of various electronic products, such as visual devices like liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small in size, yet having high capacitance, and being easy to mount, and therefore can be used as components in various electronic devices. As various electronic devices, such as computers and mobile devices, become smaller and have higher output, there is an increasing demand for multilayer ceramic capacitors that are smaller in size and have higher capacitance.

[0004] Furthermore, in recent years, there has been growing interest in automotive electrical components in the industry, and high reliability characteristics are being demanded of multilayer ceramic capacitors for use in automobiles or infotainment systems.

[0005] In order to miniaturize and increase the capacitance of multilayer ceramic capacitors, it is necessary to increase the number of layers by forming the internal electrodes and dielectric layers thinly, minimize the volume of parts that do not affect the formation of capacitance, and increase the effective volume fraction required to realize capacitance.

[0006] Furthermore, in order to mount as many components as possible within the limited area of ​​the board, it is necessary to minimize the mounting space.

[0007] In addition, as multilayer ceramic capacitors become smaller and have higher capacitance, the thickness of the margins is becoming thinner, which increases the likelihood of external moisture penetration or plating solution penetration, which may result in reduced reliability. Therefore, there is a need for a method for protecting multilayer ceramic capacitors from external moisture penetration or plating solution penetration. Summary of the Invention [Problem to be solved by the invention]

[0008] One of the various objects of the present invention is to provide a multilayer electronic component with improved capacitance per unit volume.

[0009] One of the various objects of the present invention is to provide a multilayer electronic component with improved reliability.

[0010] One of the various objects of the present invention is to provide a multilayer electronic component that can minimize packaging space.

[0011] However, the scope of the present invention is not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0012] A multilayer electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer sandwiched therebetween, the multilayer electronic component comprising a body having first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing each other in the third direction; a first connecting portion disposed on the third surface; a first band portion extending from the first connecting portion to a portion of the first surface; and a third band portion extending from the first connecting portion to a portion of the second surface. The semiconductor device includes a first external electrode, a second external electrode including a second connection portion disposed on the fourth surface, a second band portion extending from the second connection portion to a portion of the first surface, and a fourth band portion extending from the second connection portion to a portion of the second surface, an insulating layer disposed on the first and second connection portions and arranged to cover the second surface, the third and fourth band portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion, wherein the insulating layer includes an oxide including aluminum (Al).

[0013] a first external electrode including a first connecting portion disposed on the third surface and a first band portion extending from the first connecting portion to a portion of the first surface; a second external electrode including a second connecting portion disposed on the fourth surface and a second band portion extending from the second connecting portion to a portion of the first surface; an insulating layer disposed on the second surface and extending over the first and second connecting portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the insulating layer can include an oxide containing aluminum (Al).

[0014] A multilayer electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer sandwiched therebetween, the main body having first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing each other in the third direction; a first external electrode including a first connection portion arranged on the third surface, a first band portion extending from the first connection portion to a portion of the first surface, and a first corner portion extending from the first connection portion to a corner connecting the second surface and the third surface; a second connection portion arranged on the fourth surface, a second band portion extending from the second connection portion to a portion of the first surface, and a second external electrode extending from the second connection portion to a corner connecting the second surface and the fourth surface; the second external electrode including a second corner portion formed by the second plating layer, an insulating layer disposed on the first and second connection portions and disposed so as to cover the second surface and the first and second corner portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion, wherein, when an average size in the second direction from an extension of the third surface to an end of the first corner portion is defined as B3, an average size in the second direction from an extension of the fourth surface to an end of the second corner portion is defined as B4, an average size in the second direction of a region where the third surface and the second internal electrode are separated from each other is defined as G1, and an average size in the second direction of a region where the fourth surface and the first internal electrode are separated from each other is defined as G2, the relationships B3≦G1 and B4≦G2 are satisfied, and the insulating layer can contain an oxide containing aluminum (Al).

[0015] a first insulating layer disposed on the first connecting electrode, a second insulating layer disposed on the second connecting electrode, a first plating layer disposed on the first band electrode, and a second plating layer disposed on the second band electrode; a first insulating layer disposed on the second connecting electrode, a first plating layer disposed on the second band electrode, and a second insulating layer disposed on the first connecting electrode; a first insulating layer disposed on the second connecting electrode, a first plating layer disposed on the first band electrode, and a second plating layer disposed on the second band electrode; [Effects of the Invention]

[0016] One of the various effects of the present invention is that by providing an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, the capacity per unit volume of the multilayer electronic component is improved and reliability is also improved.

[0017] One of the various advantages of the present invention is that it minimizes the mounting space required for a multilayer electronic component.

[0018] One of the various effects of the present invention is that the insulating layer contains an oxide containing aluminum (Al), which improves moisture resistance reliability and acid resistance to plating solutions and suppresses the occurrence and propagation of cracks.

[0019] However, the various beneficial advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0020] [Figure 1]1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 2] 2 is a schematic perspective view of a main body of the multilayer electronic component of FIG. 1. [Figure 3] FIG. 2 is a cross-sectional view taken along II' in FIG. [Figure 4] FIG. 3 is an exploded perspective view schematically showing the main body of FIG. 2 in an exploded state. [Figure 5] 2 is a schematic perspective view of a substrate on which the multilayer electronic component of FIG. 1 is mounted. [Figure 6] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 7] FIG. 7 is a cross-sectional view taken along line II-II' in FIG. [Figure 8] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 9] FIG. 9 is a cross-sectional view taken along the line III-III' in FIG. 8. [Figure 10] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 11] FIG. 11 is a cross-sectional view taken along line IV-IV' of FIG. [Figure 12] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 13] FIG. 13 is a cross-sectional view taken along the line VV′ of FIG. [Figure 14] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 15] FIG. 15 is a cross-sectional view taken along line VI-VI' of FIG. [Figure 16] This shows a modification of FIG. [Figure 17] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 18] FIG. 18 is a cross-sectional view taken along line VII-VII' of FIG. [Figure 19]1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 20] FIG. 20 is a cross-sectional view taken along line VIII-VIII' in FIG. 19. [Figure 21] This shows a modification of FIG. [Figure 22] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 23] FIG. 23 is a cross-sectional view taken along line IX-IX' of FIG. 22. [Figure 24] This shows a modification of FIG. [Figure 25] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 26] FIG. 26 is a cross-sectional view taken along the line XX' of FIG. 25. [Figure 27] This shows a modification of FIG. [Figure 28] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 29] FIG. 29 is a cross-sectional view taken along the line XI-XI′ of FIG. 28. [Figure 30] This shows a modification of FIG. [Figure 31] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 32] FIG. 32 is a cross-sectional view taken along line XII-XII' of FIG. [Figure 33] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 34] FIG. 33 is a cross-sectional view taken along line XIII-XIII′ of FIG. [Figure 35] This shows a modification of FIG. [Figure 36] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 37] FIG. 37 is a cross-sectional view taken along line XIV-XIV′ of FIG. 36. [Figure 38]FIG. 37 is an enlarged view of the K1 region in FIG. 36. DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation.

[0022] In order to clearly explain the present invention, parts not relevant to the description are omitted in the drawings, thicknesses are exaggerated to clearly show various layers and regions, and components having the same function within the same concept are denoted by the same reference numerals. Furthermore, throughout the specification, the term "comprises" a certain component does not mean that it excludes other components, but that it may further include other components, unless otherwise specified.

[0023] In the drawings, the first direction can be defined as the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0024] Fig. 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention. Fig. 2 is a schematic perspective view of the main body of the multilayer electronic component of Fig. 1. Fig. 3 is a cross-sectional view taken along II' in Fig. 1. Fig. 4 is a schematic exploded perspective view of the main body of Fig. 2. Fig. 5 is a schematic perspective view of a substrate on which the multilayer electronic component of Fig. 1 is mounted.

[0025] A multilayer electronic component 1000 according to one embodiment of the present invention will now be described with reference to FIGS.

[0026] A multilayer electronic component 1000 according to one embodiment of the present invention includes a main body 110 including a dielectric layer 111 and first and second internal electrodes 121, 122 alternately arranged with the dielectric layer sandwiched therebetween, the main body 110 having first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces 111 and 122 facing each other in the second direction, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces 5, 6 facing each other in the third direction; a first external electrode 1000 including a first connecting portion 131a arranged on the third surface, a first band portion 131b extending from the first connecting portion 131a to a portion of the first surface, and a third band portion 131c extending from the first connecting portion 131a to a portion of the second surface; The external electrode 132 includes a pole 131, a second connection portion 132a arranged on the fourth surface, a second band portion 132b extending from the second connection portion to a portion of the first surface, and a fourth band portion 132c extending from the second connection portion to a portion of the second surface, an insulating layer 151 arranged on the first and second connection portions and arranged to cover the second surface, the third and fourth band portions 131c, 132c, a first plating layer 141 arranged on the first band portion 131b, and a second plating layer 142 arranged on the second band portion 132b, wherein the insulating layer 151 can include an oxide including aluminum (Al).

[0027] The body 110 is formed by alternately laminating dielectric layers 111 and internal electrodes 121 and 122 .

[0028] The specific shape of the body 110 is not particularly limited, but as shown, the body 110 may have a hexahedral shape or a shape similar thereto. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may have a substantially hexahedral shape, although not a hexahedral shape with perfectly straight lines.

[0029] The main body 110 may have first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in a second direction, and fifth and sixth surfaces 5, 6 connected to the first and second surfaces 1, 2 and also connected to the third and fourth surfaces 3, 4 and facing each other in the third direction.

[0030] In one embodiment, the main body 110 includes a 1-3 corner connecting the first surface and the third surface, a 1-4 corner connecting the first surface and the fourth surface, a 2-3 corner connecting the second surface and the third surface, and a 2-4 corner connecting the second surface and the fourth surface, and the 1-3 corner and the 2-3 corner may have a shape that is contracted toward the center of the main body in the first direction as they approach the third surface, and the 1-4 corner and the 2-4 corner may have a shape that is contracted toward the center of the main body in the first direction as they approach the fourth surface.

[0031] A marginal region where the internal electrodes 121, 122 are not disposed overlaps the dielectric layer 111, resulting in a step due to the thickness of the internal electrodes 121, 122, and the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces may have a shape that is shrunk toward the center of the body 110 in the first direction relative to the first surface or the second surface. Alternatively, due to shrinkage behavior during the sintering process of the body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 may have a shape that is shrunk toward the center of the body 110 in the first direction relative to the first surface or the second surface. Alternatively, in order to prevent chipping defects, the corners connecting each surface of the body 110 may be rounded through a separate process, so that the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces may have a rounded shape.

[0032] The corners may include a 1-3 corner connecting the first and third surfaces, a 1-4 corner connecting the first and fourth surfaces, a 2-3 corner connecting the second and third surfaces, and a 2-4 corner connecting the second and fourth surfaces. The corners may also include a 1-5 corner connecting the first and fifth surfaces, a 1-6 corner connecting the first and sixth surfaces, a 2-5 corner connecting the second and fifth surfaces, and a 2-6 corner connecting the second and sixth surfaces. The first to sixth surfaces of the main body 110 are substantially flat, and non-flat areas may be considered corners. Hereinafter, the extension of each surface may refer to a line extending from the flat portion of each surface.

[0033] In this case, in the external electrodes 131 and 132, the areas arranged on the corners of the main body 110 can be corner portions, the areas arranged on the third and fourth surfaces of the main body 110 can be connection portions, and the areas arranged on the first and second surfaces of the main body can be band portions.

[0034] On the other hand, in order to suppress the steps caused by the internal electrodes 121, 122, if the internal electrodes are cut after lamination so as to be exposed on the fifth and sixth surfaces 5, 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form margin portions 114, 115, the portions connecting the first surface to the fifth and sixth surfaces and the portions connecting the second surface to the fifth and sixth surfaces may not have a contracted shape.

[0035] The plurality of dielectric layers 111 constituting the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 may be integrated to such an extent that they are difficult to identify without using a scanning electron microscope (SEM).

[0036] According to one embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O s (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0037] In addition, for the raw material for forming the dielectric layer 111, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to powders such as barium titanate (BaTiO3) according to the purpose of the present invention.

[0038] On the other hand, the average thickness td of the dielectric layer 111 does not need to be particularly limited.

[0039] However, generally, when the dielectric layer is formed thin with a thickness less than 0.6 μm, especially when the thickness of the dielectric layer is 0.35 μm or less, the reliability may decrease.

[0040] According to one embodiment of the present invention, by disposing an insulating layer on the connection portion of the external electrode and disposing a plating layer on the band portion of the external electrode, it is possible to prevent moisture penetration from the outside, penetration of the plating solution, etc., and improve the reliability. Therefore, even when the average thickness of the dielectric layer 111 is 0.35 μm or less, excellent reliability can be ensured.

[0041] Therefore, when the average thickness of the dielectric layer 111 is 0.35 μm or less, the effect of improving reliability according to the present invention can be more significant.

[0042] The average thickness td of the dielectric layer 111 may refer to the average thickness of the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122.

[0043] The average thickness of the dielectric layer 111 can be measured by scanning an image of a cross section of the body 110 in the length and thickness direction (LT) using a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, the thickness of one dielectric layer in the scanned image can be measured at 30 equally spaced points in the length direction, and the average thickness can be calculated. The 30 equally spaced points can be designated as capacitance forming portions Ac. Furthermore, if this average thickness measurement is extended to 10 dielectric layers, the average thickness of the dielectric layers can be further generalized.

[0044] The main body 110 is arranged inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 arranged opposite each other with a dielectric layer 111 sandwiched therebetween, and may include a capacitance forming portion Ac in which capacitance is formed, and cover portions 112, 113 formed at the top and bottom of the capacitance forming portion Ac in a first direction.

[0045] The capacitance forming portion Ac is a portion that contributes to forming the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 sandwiched therebetween.

[0046] The cover parts 112, 113 may include an upper cover part 112 arranged at the top of the capacitance forming part Ac in the first direction, and a lower cover part 113 arranged at the bottom of the capacitance forming part Ac in the first direction.

[0047] The upper cover part 112 and the lower cover part 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming part Ac, respectively, and basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0048] The upper cover part 112 and the lower cover part 113 do not include an internal electrode and may include the same material as the dielectric layer 111 .

[0049] That is, the upper cover part 112 and the lower cover part 113 may include a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0050] Meanwhile, the average thickness of the covers 112, 113 does not need to be particularly limited. However, to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average thickness tc of the covers 112, 113 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, it is possible to prevent penetration of moisture and plating solution from the outside and improve reliability, so that excellent reliability can be ensured even when the average thickness tc of the covers 112, 113 is 15 μm or less.

[0051] The average thickness tc of the cover parts 112, 113 means the size in the first direction, and may be the average value of the size in the first direction of the cover parts 112, 113 measured at five equally spaced points on the top or bottom of the capacitance forming part Ac.

[0052] Additionally, margin portions 114 and 115 may be arranged on the side surfaces of the capacitance forming portion Ac.

[0053] The margin portions 114, 115 may include a first margin portion 114 disposed on the fifth surface 5 of the main body 110 and a second margin portion 115 disposed on the sixth surface 6. That is, the margin portions 114, 115 may be disposed on both end surfaces of the main body 110 in the width direction.

[0054] The margin portions 114, 115 may refer to the regions between both ends of the first and second internal electrodes 121, 122 and the boundary surface of the body 110 in a cross-section of the body 110 cut in the width-thickness (WT) direction, as shown in FIG. 3.

[0055] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0056] The margin portions 114 and 115 can be formed by applying a conductive paste to the ceramic green sheet except for the areas where the margin portions are to be formed, thereby forming internal electrodes.

[0057] In addition, in order to reduce the steps caused by the internal electrodes 121, 122, margin portions 114, 115 may be formed by cutting the internal electrodes after lamination so that they are exposed on the fifth and sixth surfaces 5, 6 of the main body, and then laminating a single dielectric layer or two or more dielectric layers in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac.

[0058] Meanwhile, the width of the margin portions 114, 115 does not need to be particularly limited. However, to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average width of the margin portions 114, 115 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, by disposing an insulating layer on the connection portion of the external electrode and disposing a plating layer on the band portion of the external electrode, it is possible to prevent penetration of moisture and plating solution from the outside and improve reliability, so that excellent reliability can be ensured even when the average width of the margin portions 114, 115 is 15 μm or less.

[0059] The average width of the margin portions 114, 115 means the average size of the margin portions 114, 115 in the third direction, and may be the average value of the sizes of the margin portions 114, 115 in the third direction measured at five equally spaced points on the side of the capacitance forming portion Ac.

[0060] The internal electrodes 121 and 122 are arranged alternately with the dielectric layers 111 .

[0061] The internal electrodes 121, 122 may include first and second internal electrodes 121, 122. The first and second internal electrodes 121, 122 are alternately arranged to face each other across the dielectric layer 111 constituting the body 110, and may be exposed to third and fourth surfaces 3, 4 of the body 110, respectively.

[0062] 3, the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. A first external electrode 131 may be disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0063] That is, the first internal electrode 121 is connected to the first external electrode 131 but not to the second external electrode 132, and the second internal electrode 122 is connected to the second external electrode 132 but not to the first external electrode 131. Therefore, the first internal electrode 121 may be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 may be formed at a certain distance from the third surface 3.

[0064] At this time, the first and second internal electrodes 121 and 122 may be electrically isolated from each other by the dielectric layer 111 disposed therebetween.

[0065] The body 110 can be formed by alternately stacking ceramic green sheets on which the first internal electrodes 121 are printed and ceramic green sheets on which the second internal electrodes 122 are printed, and then firing the stack.

[0066] There are no particular limitations on the material forming the internal electrodes 121 and 122, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can contain one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0067] The internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof onto a ceramic green sheet. The conductive paste for internal electrodes may be printed by screen printing or gravure printing, but the present invention is not limited thereto.

[0068] On the other hand, the average thickness te of the internal electrodes 121, 122 does not need to be particularly limited.

[0069] However, in general, when the internal electrodes are formed thinly, with a thickness of less than 0.6 μm, and particularly when the thickness of the internal electrodes is 0.35 μm or less, there is a risk of the reliability decreasing.

[0070] According to one embodiment of the present invention, an insulating layer is placed on the connection portion of the external electrode and a plating layer is placed on the band portion of the external electrode, thereby preventing the penetration of moisture and plating solution from the outside and improving reliability, so that excellent reliability can be ensured even when the average thickness of the internal electrodes 121, 122 is 0.35 μm or less.

[0071] Therefore, when the average thickness of the internal electrodes 121, 122 is 0.35 μm or less, the effects of the present invention become more pronounced, and it becomes easier to achieve a smaller multilayer electronic component with a higher capacity.

[0072] The average thickness te of the internal electrodes 121 and 122 may refer to the average thickness of the internal electrodes 121 and 122.

[0073] The average thickness of the internal electrodes 121, 122 can be measured by scanning an image of a cross section of the body 110 in the length and thickness direction (LT) using a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, the thickness of one internal electrode in the scanned image can be measured at 30 equally spaced points in the length direction, and the average thickness can be calculated. The 30 equally spaced points can be designated as the capacitance forming portion Ac. Furthermore, if this average measurement is extended to 10 internal electrodes, the average thickness of the internal electrodes can be further generalized.

[0074] The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110. The external electrodes 131 and 132 may include first and second external electrodes 131 and 132 disposed on the third and fourth surfaces 3 and 4 of the body 110, respectively, and connected to the first and second internal electrodes 121 and 122, respectively.

[0075] The external electrodes 131, 132 may include a first external electrode 131 including a first connection portion 131a disposed on the third surface and a first band portion 131b extending from the first connection portion to a portion of the first surface, and a second external electrode 132 including a second connection portion 132a disposed on the fourth surface and a second band portion 132b extending from the second connection portion to a portion of the first surface. The first connection portion 131a may be connected to the first internal electrode 121 on the third surface, and the second connection portion 132a may be connected to the second internal electrode 122 on the fourth surface.

[0076] The first external electrode 131 may include a third band portion 131c extending from the first connecting portion 131a to a portion of the second surface, and the second external electrode 132 may include a fourth band portion 132c extending from the second connecting portion 132a to a portion of the second surface. The first external electrode 131 may include a first side band portion extending from the first connecting portion 131a to a portion of the fifth and sixth surfaces, and the second external electrode 132 may include a second side band portion extending from the second connecting portion 132a to a portion of the fifth and sixth surfaces.

[0077] However, the third band portion, fourth band portion, first side band portion, and second side band portion are not necessarily required components of the present invention. The first and second external electrodes 131 and 132 do not have to be arranged on the second surface, nor on the fifth and sixth surfaces. By not arranging the first and second external electrodes 131 and 132 on the second surface, the first and second external electrodes 131 and 132 can be arranged below an extension of the second surface of the main body. Furthermore, the first and second connecting portions 131a and 132a can be arranged away from the fifth and sixth surfaces, and the first and second connecting portions 131a and 132a can be arranged away from the second surface. Furthermore, the first and second band portions 131b and 132b can also be arranged away from the fifth and sixth surfaces.

[0078] Meanwhile, when the first and second external electrodes 131, 132 include the third and fourth band portions 131c, 132c, an insulating layer is shown disposed on the third and fourth band portions 131c, 132c, but this is not limited thereto, and a plating layer may be disposed on the third and fourth band portions 131c, 132c to improve ease of mounting. Also, the first and second external electrodes 131, 132 may include the third and fourth band portions 131c, 132c but not include side band portions, in which case the first and second connection portions 131a, 132a and the first to fourth band portions 131b, 132b, 131c, 132c may be spaced apart from the fifth and sixth surfaces.

[0079] In this embodiment, the multilayer electronic component 1000 has a structure including two external electrodes 131 and 132, but the number and shape of the external electrodes 131 and 132 can be modified depending on the shape of the internal electrodes 121 and 122 and other purposes.

[0080] Meanwhile, the external electrodes 131 and 132 may be formed using any material that has electrical conductivity, such as a metal, and the specific material may be determined taking into consideration electrical properties, structural stability, etc., and may further have a multi-layer structure.

[0081] The external electrodes 131 and 132 may be fired electrodes containing a conductive metal and glass, or may be resin-based electrodes containing a conductive metal and resin.

[0082] The external electrodes 131 and 132 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body, or by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0083] The conductive metal contained in the external electrodes 131, 132 may be, but is not limited to, a material with excellent electrical conductivity. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. Preferably, the external electrodes 131, 132 may contain one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121, 122 containing Ni.

[0084] An insulating layer 151 may be disposed on the first and second connection portions 131a and 132a.

[0085] The first and second connecting portions 131a, 132a are portions connected to the internal electrodes 121, 122, and therefore may become paths for the penetration of plating solution during the plating process or moisture during actual use. In the present invention, an insulating layer 151 is disposed on the connecting portions 131a, 132a, thereby preventing the penetration of moisture or plating solution from the outside.

[0086] The insulating layer 151 may be disposed to be in contact with the first and second plating layers 141 and 142. In this case, the insulating layer 151 may be in contact with the first and second plating layers 141 and 142 in a manner that covers a portion of the edge of the insulating layer 151, or the first and second plating layers 141 and 142 may be in contact with the insulating layer 151 in a manner that covers a portion of the edge of the insulating layer 151.

[0087] The insulating layer 151 may be disposed on the first and second connecting portions 131a and 132a and may be disposed to cover the second surface and the third and fourth band portions 131c and 132c. In this case, the insulating layer 151 may be disposed to cover the regions of the second surface where the third and fourth band portions 131c and 132c are not disposed and the third and fourth band portions 131c and 132c. As a result, the insulating layer 151 covers the regions where the ends of the third and fourth band portions 131c and 132c contact the main body 110, blocking a path for moisture penetration and further improving moisture resistance reliability.

[0088] The insulating layer 151 may be disposed on the second surface and extend to the first and second connection portions 131a and 132a. If the external electrodes 131 and 132 are not disposed on the second surface, the insulating layer may be disposed to cover the entire second surface. Meanwhile, the insulating layer 151 does not necessarily have to be disposed on the second surface. The insulating layer may be disposed on part or all of the second surface, and may be divided into two parts, each disposed on the first and second connection portions 131a and 132a. If the insulating layer is not disposed on the entire second surface, it may be disposed below an extension of the second surface. Alternatively, if the insulating layer is not disposed on the second surface, it may extend from the first and second connection portions 131a and 132a to the fifth and sixth surfaces to form a single insulating layer.

[0089] Furthermore, the insulating layer 151 may be disposed to cover the first and second side band portions and parts of the fifth and sixth surfaces. In this case, parts of the fifth and sixth surfaces that are not covered by the insulating layer 151 may be exposed to the outside.

[0090] Furthermore, insulating layer 151 can be arranged to cover all of the first and second side band portions and the fifth and sixth surfaces, in which case moisture resistance reliability can be improved because the fifth and sixth surfaces are not exposed to the outside, and connecting portions 131a, 132a are not directly exposed to the outside, improving the reliability of multilayer electronic component 1000. More specifically, the insulating layer can cover all of the first and second side band portions and cover all of the areas of the fifth and sixth surfaces except for the areas where the first and second side band portions are formed.

[0091] The insulating layer 151 can prevent the formation of plating layers 141, 142 on the external electrodes 131, 132 on which the insulating layer 151 is disposed, and can improve sealing properties and minimize penetration of moisture, plating solution, etc. from the outside.

[0092] The insulating layer 151 may include an oxide containing aluminum (Al).

[0093] Conventionally, glass-based materials have been used for insulating layers, but due to the characteristics of glass, they tend to clump easily during sintering, making it difficult to form a uniform film. The sintering process requires heat, which generates stress within the body, potentially resulting in cracks or delamination. Furthermore, when using an insulating layer containing a glass-based material, the insulating layer is fired after the external electrodes, but this can lead to the metal of the external electrodes diffusing into the internal electrodes during the firing process, potentially causing radial cracks. Furthermore, glass-based materials are generally hard, so they can easily break even with a small impact.

[0094] In this invention, we have attempted to solve the problems inherent in glass-based insulating layers by using an oxide containing aluminum (Al) instead of a glass-based insulating layer.Oxides containing aluminum (Al) not only have insulating properties but also have superior impact resistance compared to glass-based insulating layers.

[0095] Furthermore, when the insulating layer 151 is formed using an oxide containing aluminum (Al), a more uniform and dense film can be formed than when a glass-based material is used, and the moisture resistance reliability can be effectively improved.

[0096] Furthermore, when the insulating layer 151 is formed using an oxide containing aluminum (Al), the hardness, strength, abrasion resistance, and moisture resistance reliability can be effectively improved compared to when other inorganic materials are used, and the insulating layer 151 has excellent corrosion resistance against acidic solutions such as plating solutions.

[0097] The method for forming the insulating layer 151 does not need to be particularly limited.

[0098] For example, after forming the external electrodes 131 and 132 on the main body 110, the insulating layer 151 including an oxide containing aluminum (Al) may be formed using atomic layer deposition (ALD). That is, the insulating layer 151 may be formed by atomic layer deposition, which makes it easier to form a dense and uniform insulating layer 151 and to easily adjust the thickness of the insulating layer 151. The atomic layer deposition may be performed at a temperature range of about 60°C to about 200°C, but is not limited thereto. Any method that can form a uniform and dense insulating layer 151, such as a sol-gel coating method or a powder coating method, may be used.

[0099] The type of oxide containing aluminum (Al) contained in the insulating layer 151 is not particularly limited, but may be, for example, Al2O3.

[0100] Oxides containing aluminum (Al), such as Al2O3, have higher physical, chemical, mechanical, and thermal stability than common metals and ceramic materials.

[0101] Meanwhile, when the insulating layer 151 containing Al2O3 is formed by sintering, abnormal grain growth may occur during shrinkage depending on the purity of Al2O3, the dispersion of the powder, and the type of binder. Therefore, according to one embodiment, the insulating layer 151 containing an oxide containing aluminum (Al) of the present invention is formed by atomic layer deposition, thereby fundamentally preventing the above-mentioned problem caused by abnormal grain growth of the oxide containing aluminum (Al).

[0102] Furthermore, when the insulating layer 151 is formed by a sintering method rather than an atomic layer deposition method, the insulating layer 151 containing Al can further contain an oxide containing Mg, thereby forming an insulating layer having a dense and uniform microstructure.

[0103] Therefore, in one embodiment, the insulating layer 151 further contains an oxide containing Mg, thereby improving the strength and uniformity of the insulating layer 151, thereby improving the moisture resistance reliability and acid resistance to plating solutions of the multilayer electronic component 1000, and further improving the effect of suppressing the occurrence and propagation of cracks.

[0104] In one embodiment, the insulating layer 151 may have a ratio of the moles of Al atoms to the total moles of the remaining elements excluding oxygen atoms of 0.95 or more. That is, the insulating layer 151 may be substantially made of an oxide containing aluminum (Al), excluding elements detected as impurities. In this case, the oxide containing aluminum (Al) may be Al2O3. This can further improve the effects of suppressing cracks due to thermal contraction and radial cracks due to metal diffusion, improving moisture resistance reliability, and improving corrosion resistance to plating solutions, etc.

[0105] In this case, the composition of the insulating layer 151 can be calculated from an image observed using SEM-EDS (Scanning Electron Microscope-Energy Dispersive X-ray Spectroscopy). Specifically, the multilayer electronic component is polished up to the center in the width direction (third direction) to expose a cross section in the length direction and thickness direction (LT cross section), and then the number of moles of each element contained in the insulating layer can be measured using EDS in a central region among five equal regions obtained by dividing the insulating layer in the thickness direction, and the number of moles of Al atoms relative to the total number of moles of the remaining elements excluding oxygen atoms can be calculated.

[0106] In one embodiment, the insulating layer 151 is disposed so as to be in direct contact with the first and second external electrodes 131, 132, and the first and second external electrodes 131, 132 may contain a conductive metal and a resin. As a result, the plating layers 141, 142 are not disposed in the areas of the outer surfaces of the first and second external electrodes 131, 132 where the insulating layer 151 is disposed, thereby effectively preventing the external electrodes from being corroded by the plating solution.

[0107] In this case, the first plating layer 141 may be disposed to cover the end of the insulating layer 151 located on the first external electrode 131, and the second plating layer 142 may be disposed to cover the end of the insulating layer 151 located on the second external electrode 132. By forming the insulating layer 151 before forming the plating layers 141, 142 on the external electrodes 131, 132, it is possible to more reliably prevent penetration of the plating solution during the formation of the plating layers. By forming the insulating layer before the plating layer, it is possible for the plating layers 141, 142 to have a shape that covers the end of the insulating layer 151.

[0108] If the average thickness t2 of the insulating layer 151 is less than 50 nm, there is a risk that the effects of suppressing cracks due to thermal contraction and radial cracks due to metal diffusion, and the effects of improving moisture resistance reliability may not be sufficiently ensured.

[0109] If the average thickness t2 of the insulating layer 151 is less than 600 nm, the insulating layer 151 may be damaged by the plating solution.

[0110] Therefore, in one embodiment, by setting the average thickness t2 of the insulating layer 151 to 50 nm or more, it is possible to sufficiently ensure the effects of suppressing radiation cracks and improving moisture resistance reliability. Preferably, by setting the average thickness of the insulating layer 151 to 600 nm or more, it is possible to ensure excellent corrosion resistance against the plating solution, and more preferably, by setting the average thickness of the insulating layer 151 to 800 nm or more, it is possible to ensure remarkable corrosion resistance against the plating solution.

[0111] There is no particular upper limit to the average thickness t2 of the insulating layer 151. However, if the average thickness t2 of the insulating layer exceeds 1000 nm, excessive costs may be incurred in the process, and it may be difficult to miniaturize the multilayer electronic component.

[0112] Therefore, it is preferable that the average thickness t2 of the insulating layer 151 be 1000 nm or less.

[0113] In this case, the average thickness t2 of the insulating layer 151 may be an average value of thickness values ​​of the insulating layer measured at the center point in the first direction of the first and second connection parts 131a and 132a, two points spaced 5 μm apart from the center point in the first direction, and two points spaced 10 μm apart from the center point in the first direction.

[0114] Table 1 below shows an evaluation of the moisture resistance reliability depending on the average thickness of the insulating layer 151 made of Al2O3 and formed using the atomic layer deposition method.

[0115] Specifically, for each test number, Al2O3 was coated on a PI (Polyimide) file to different average thicknesses using atomic layer deposition, and then the moisture permeability was measured at a relative humidity of 100% and a temperature of 37.8°C.

[0116] The moisture resistance reliability was evaluated by forming an Al2O3 insulating layer on a PI file, but the same can be understood for the insulating layer 151 of the multilayer electronic component according to the embodiment of the present invention.

[0117] [Table 1] *:Comparative example

[0118] Test No. 1 is the case where the average thickness of the insulating layer 151 made of Al2O3 is less than 50 nm, and it is clear that the effect of suppressing moisture permeation is insufficient.

[0119] Test numbers 2 and 3 are cases where the average thickness of the insulating layer 151 made of Al2O3 is 50 nm or more and the moisture permeability is 0 mg / m 2 It can be confirmed that the moisture permeation suppression effect is remarkable.

[0120] Therefore, by setting the average thickness t2 of the insulating layer 151 of the multilayer electronic component 1000 according to one embodiment to 50 nm or more, moisture permeation can be prevented and excellent moisture resistance reliability can be ensured.

[0121] Table 2 below shows an evaluation of corrosion resistance to plating solutions based on the average thickness of insulating layer 151 made of Al2O3 and formed using atomic layer deposition.

[0122] Specifically, the entire surface of the main body and external electrodes was coated with Al2O3 using atomic layer deposition, and then plating was performed.Then, when the surface in the width-thickness direction was observed with an optical microscope, damage to the insulating layer was observed, and if the damaged area was plated, it was evaluated as NG, and if there was no damage to the insulating layer and no plating layer was formed, it was evaluated as OK, and the number of such areas was then identified.

[0123] The above corrosion resistance evaluation was carried out by preparing 20 samples with different thicknesses per test number, and the entire surfaces of the body and external electrodes were coated with Al2O3 for evaluation, but the same can be understood for the insulating layer 151 of the multilayer electronic component according to various embodiments of the present invention.

[0124] [Table 2] *Comparative example

[0125] Test No. 1 is the case where the average thickness of the insulating layer is 400 nm, and it can be confirmed that the corrosion resistance to the plating solution is insufficient.

[0126] Test No. 2 is the case where the average thickness of the insulating layer is 600 nm, and it can be confirmed that the insulating layer has excellent corrosion resistance against the plating solution.

[0127] Test numbers 3 and 4 are the cases where the average thickness of the insulating layer is 800 nm or more, and it can be confirmed that the corrosion resistance to the plating solution is remarkable.

[0128] Therefore, by making the average thickness t2 of the insulating layer 151 of the multilayer electronic component 1000 according to one embodiment equal to or greater than 600 nm, excellent corrosion resistance to the plating solution can be ensured, and preferably, by making the average thickness t2 of the insulating layer 151 equal to or greater than 800 nm, significant corrosion resistance to the plating solution can be ensured.

[0129] The first and second plating layers 141 and 142 may be disposed on the first and second band portions 131b and 132b, respectively. The plating layers 141 and 142 may serve to improve mounting characteristics. By disposing the plating layers 141 and 142 on the band portions 131b and 132b, mounting space may be minimized and reliability may be improved by minimizing penetration of a plating solution into the internal electrodes. One end of the first and second plating layers 141 and 142 may contact the first surface, and the other end may contact the insulating layer 151.

[0130] The type of the plating layers 141 and 142 is not particularly limited, and may be a plating layer containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and alloys thereof, and may be formed of a plurality of layers.

[0131] As a more specific example of the plating layers 141 and 142, the plating layers 141 and 142 may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the first and second band portions 131b and 132b.

[0132] In one embodiment, the first and second plating layers 141, 142 may be disposed to extend and cover a portion of the first and second connecting portions 131a, 132a, respectively. When the average size in the first direction from the first internal electrode 121, 122 that is disposed closest to the first surface 1 is defined as H1, and the average size in the first direction from an extension of the first surface 1 to the ends of the first and second plating layers 141, 142 disposed on the first and second connecting portions 131a, 132a is defined as H2, the relationship H1>H2 may be satisfied. This can suppress penetration of a plating solution into the internal electrodes during a plating process, thereby improving reliability.

[0133] H1 and H2 may be average values ​​obtained by measuring cross sections (LT cross sections) obtained by cutting the body 110 in the first and second directions at five points equally spaced in the third direction. H1 may be an average value obtained by measuring at a point where the internal electrode disposed closest to the first surface 1 is connected to the external electrode in each cross section, and H2 may be an average value obtained by measuring based on an end of the plating layer that contacts the external electrode, and the extension line of the first surface that serves as the reference when measuring H1 and H2 may be the same.

[0134] In one embodiment, the first plating layer 141 may be disposed so as to cover the end of the insulating layer 151 that is disposed on the first external electrode 131, and the second plating layer 142 may be disposed so as to cover the end of the insulating layer 151 that is disposed on the second external electrode 132. This may strengthen the bonding strength between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0135] In one embodiment, the insulating layer 151 may be arranged to cover the end of the first plating layer 141 that is located on the first external electrode 131, and the insulating layer 151 may be arranged to cover the end of the second plating layer 142 that is located on the second external electrode 132. This may strengthen the bonding strength between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0136] In one embodiment, when the average size of the main body 110 in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the following relationships can be satisfied: 0.2≦B1 / L≦0.4 and 0.2≦B2 / L≦0.4.

[0137] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient bonding strength. On the other hand, if B2 / L exceeds 0.4, leakage current may occur between the first band portion 131b and the second band portion 132b under high voltage current, and the first band portion 131b and the second band portion 132b may be electrically connected due to plating bleeding during the plating process.

[0138] B1, B2, and L may be average values ​​measured on a cross section (LT cross section) obtained by cutting the body 110 in the first and second directions at five points equally spaced in the third direction.

[0139] Referring to FIG. 5 which shows a mounting substrate 1100 on which a laminated electronic component 1000 is mounted, plating layers 141 and 142 of the laminated electronic component 1000 can be joined to electrode pads 181 and 182 arranged on a substrate 180 by solders 191 and 192.

[0140] On the other hand, when the internal electrodes 121, 122 are stacked in the first direction, the multilayer electronic component 1000 can be horizontally mounted on the substrate 180 so that the internal electrodes 121, 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and when the internal electrodes 121, 122 are stacked in the third direction, the multilayer electronic component can be vertically mounted on the substrate so that the internal electrodes 121, 122 are perpendicular to the mounting surface.

[0141] The size of the multilayer electronic component 1000 does not need to be particularly limited.

[0142] However, in order to achieve both miniaturization and high capacitance, it is necessary to reduce the thickness of the dielectric layers and internal electrodes and increase the number of layers. Therefore, the effect of improving reliability and capacitance per unit volume according to the present invention can be more pronounced in a multilayer electronic component 1000 having a size of 1005 (length x width, 1.0 mm x 0.5 mm) or less.

[0143] Therefore, taking into consideration manufacturing errors, the size of the external electrodes, etc., the reliability improvement effect according to the present invention can be more significant when the length of the multilayer electronic component 1000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the multilayer electronic component 1000 may refer to the maximum size of the multilayer electronic component 1000 in the second direction, and the width of the multilayer electronic component 1000 may refer to the maximum size of the multilayer electronic component 1000 in the third direction.

[0144] FIG. 6 is a schematic perspective view of a multilayer electronic component 1001 according to one embodiment of the present invention, and FIG. 7 is a cross-sectional view taken along line II-II' in FIG.

[0145] 6 and 7, in a multilayer electronic component 1001 according to an embodiment of the present invention, first and second plating layers 141-1 and 142-1 may be disposed below an extension line E1 of the first surface, thereby minimizing the height of the solder during mounting and minimizing the mounting space.

[0146] In addition, the insulating layer 151-1 may extend to an extension line of the first surface or less and be disposed so as to contact the first and second plating layers 141-1 and 142-1.

[0147] FIG. 8 is a schematic perspective view of a multilayer electronic component 1002 according to one embodiment of the present invention, and FIG. 9 is a cross-sectional view taken along line III-III' in FIG.

[0148] 8 and 9, a multilayer electronic component 1002 according to an embodiment of the present invention may further include an additional insulating layer 161 disposed on the first surface 1 and between the first band portion 131b and the second band portion 132b, thereby preventing leakage current that may occur between the first band portion 131b and the second band portion 132b under high voltage.

[0149] The type of additional insulating layer 161 does not need to be particularly limited. For example, similar to insulating layer 151, additional insulating layer 161 may contain an oxide containing aluminum (Al). However, additional insulating layer 161 and insulating layer 151 do not need to be limited to the same material and may be formed of different materials. For example, they may contain one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or may contain glass.

[0150] FIG. 10 is a schematic perspective view of a multilayer electronic component 1003 according to one embodiment of the present invention, and FIG. 11 is a cross-sectional view taken along line IV-IV' in FIG.

[0151] Referring to FIGS. 10 and 11, in a stacked electronic component 1003 according to an embodiment, the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-3 and 142-3 disposed on the first and second connection portions 131a and 132a is H2. When this is the case, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the adhesion strength can be improved.

[0152] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because if H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0153] H1, H2, and T can be values obtained by averaging the values measured in a cross-section (L-T cross-section) obtained by cutting the main body 110 in the first and second directions at five points having equal intervals in the third direction. H1 is a value obtained by averaging the values measured at the points where the internal electrode closest to the first surface 1 is connected to the external electrode in each cross-section, and H2 can be a value obtained by averaging the values measured based on the ends of the plating layers in contact with the external electrode in each cross-section. The extension line of the first surface serving as a reference during the measurement of H1 and H2 can be the same. Also, T can be a value obtained by measuring the maximum size of the main body 110 in the first direction in each cross-section and then averaging the values.

[0154] FIG. 12 schematically shows a perspective view of a stacked electronic component 1004 according to an embodiment of the present invention, and FIG. 13 is a cross-sectional view taken along V-V' of FIG. 12.

[0155] Referring to FIGS. 12 and 13, in a stacked electronic component 1004 according to an embodiment of the present invention, the average length B1 of the first band portion 131b-4 may be longer than the average length B3 of the third band portion 131c-4, and the average length of the second band portion 132b-4 may be longer than the average length B4 of the fourth band portion 132c-4. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0156] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 131b-4 is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 132b-4 is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the third band portion 131c-4 is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the fourth band portion 132c-4 is B4, B3 < B1 and B4 < B2 can be satisfied.

[0157] At this time, when the average size of the main body 11 in the second direction is L, 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 can be satisfied.

[0158] B1, B2, B3, B4, and L can be values obtained by averaging the values measured in a cross-section (L-T cross-section) obtained by cutting the main body 110 at five points having equal intervals in the third direction in the first and second directions.

[0159] Also, the first external electrode 131-4 may include a first side surface band portion extending from the first connection portion 131a-4 to a part of the fifth and sixth surfaces, and the second external electrode 132-4 may include a second side surface band portion extending from the second connection portion 132a-4 to a part of the fifth and sixth surfaces. At this time, the size in the second direction of the first and second side surface band portions can gradually increase as it gets closer to the first surface. That is, the first and second side surface band portions can be arranged in a tapered or trapezoidal shape.

[0160] Furthermore, when the average size in the second direction from an extension of the third surface to the end of the third band portion 131c-4 is B3, the average size in the second direction from an extension of the fourth surface to the end of the fourth band portion 132c-4 is B4, the average size in the second direction of the region where the third surface and the second internal electrode 122 are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode 121 are separated is G2, it is possible to satisfy B3≦G1 and B4≦G2. This makes it possible to minimize the volume occupied by the external electrodes and increase the capacitance per unit volume of the multilayer electronic component 1004.

[0161] The above G1 and G2 can be defined as the average value of the size in the second direction measured for any five second internal electrodes located in the center of the first direction in a cross section of the body cut in the first and second directions at the center of the third direction, and G1 can be defined as the average value of the size in the second direction measured for any five first internal electrodes located in the center of the first direction in a region separated up to the fourth surface.

[0162] Furthermore, it can be further generalized by determining G1 and G2 in a cross section (LT cross section) obtained by cutting the main body 110 in the first and second directions at five points equally spaced in the third direction, and taking the average values ​​as G1 and G2.

[0163] However, it is not intended to limit the present invention to B3≦G1 and B4≦G2, and cases where B3≧G1 and B4≧G2 are satisfied may also be included in one embodiment of the present invention. Thus, in one embodiment, when the average size in the second direction from an extension of the third surface to an end of the third band portion is B3, the average size in the second direction from an extension of the fourth surface to the end of the fourth band portion is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, B3≧G1 and B4≧G2 may be satisfied.

[0164] In one embodiment, when the average size in the second direction from the extension line E3 of the third surface to the end of the first band portion is B1 and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, B1 ≧ G1 and B2 ≧ G2 can be satisfied, thereby improving the bonding strength of the multilayer electronic component 1004 to the substrate 180.

[0165] FIG. 14 is a schematic perspective view of a multilayer electronic component 1005 according to one embodiment of the present invention, and FIG. 15 is a cross-sectional view taken along line VI-VI' in FIG.

[0166] 14 and 15, the first and second external electrodes 131-5 and 132-5 of a multilayer electronic component 1005 according to an embodiment of the present invention may be arranged on the third, fourth, and first surfaces, rather than on the second surface, and thus may have an L-shape. That is, the first and second external electrodes 131-5 and 132-5 may be arranged below an extension of the second surface.

[0167] The first external electrode 131-5 includes a first connecting portion 131a-5 arranged on the third surface 3 and a first band portion 131b-5 extending from the first connecting portion 131a-5 to a portion of the first surface 1, and the second external electrode 132-5 includes a second connecting portion 132a-5 arranged on the fourth surface 4 and a second band portion 132b-5 extending from the second connecting portion 132a-5 to a portion of the first surface 1. Because the external electrodes 131-5 and 132-5 are not arranged on the second surface 2, the insulating layer 151-5 can be arranged to cover the entire second surface 2. This can minimize the volume occupied by the external electrodes 131-5 and 132-5, thereby further improving the capacitance per unit volume of the multilayer electronic component 1005. However, the insulating layer 151-5 does not need to be limited to covering the entire second surface 2, and may have a form in which the insulating layer does not cover part or all of the second surface 2, but is separated and covers the first and second connection portions 131a-5, 132a-5 respectively.

[0168] In addition, by arranging the insulating layer 151-5 to cover a part of the fifth and sixth surfaces, the reliability can be further improved. At this time, a part of the fifth and sixth surfaces not covered by the insulating layer 151-5 can be exposed to the outside.

[0169] Furthermore, the insulating layer 151-5 can be arranged to cover the entire fifth and sixth surfaces. In this case, since the fifth and sixth surfaces are not exposed to the outside, the moisture resistance reliability can be further improved.

[0170] A first plating layer 141-5 is arranged on the first band portion 131b-5, and a second plating layer 142-5 is arranged on the second band portion 132b-5. The first and second plating layers 141-5 and 142-5 can be arranged to extend to a part on the first and second connection portions 131a-5 and 132a-5.

[0171] At this time, external electrodes 131-5 and 132-5 may not be arranged on the fifth and sixth surfaces 5 and 6 either. That is, the external electrodes 131-5 and 132-5 can have a form arranged only on the third, fourth, and first surfaces.

[0172] When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-5 and 142-5 arranged on the first and second connection portions 131a-5 and 132a-5 is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, the fixing strength can be improved, the area where the external electrodes 131-5 and 132-5 contact the plating layers 141-5 and 142-5 can be increased, and an increase in ESR (Equivalent Series Resistance) can be suppressed.

[0173] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because if H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0174] Also, the first and second plating layers 141-5 and 142-5 can be arranged to cover a part of the insulating layer 151-1 on the third and fourth surfaces. That is, the plating layers 141-5 and 142-5 can be arranged to cover the ends of the insulating layer 151-5 on the third and fourth surfaces. Thereby, the bonding force between the insulating layer 151-5 and the plating layers 141-5 and 142-5 is strengthened, and the reliability of the stacked electronic component 1005 can be improved.

[0175] Also, the insulating layer 151-5 can be arranged to cover a part of the first and second plating layers 141-5 and 142-5 on the third and fourth surfaces. That is, the insulating layer 151-5 can be arranged to cover the ends of the plating layers 141-5 and 142-5 on the third and fourth surfaces. Thereby, the bonding force between the insulating layer 151-5 and the plating layers 141-5 and 142-5 is strengthened, and the reliability of the stacked electronic component 1005 can be improved.

[0176] FIG. 16 shows a modified example of FIG. 14. Referring to FIG. 16, in a modified example 1006 of the stacked electronic component 1005 according to an embodiment of the present invention, a first additional electrode layer 134 can be arranged between the first connection portion 131a-6 and the third surface, and a second additional electrode layer 135 can be arranged between the second connection portion 132a-6 and the fourth surface. The first additional electrode layer 134 is arranged within a range that does not deviate from the third surface, and the second additional electrode layer 135 can be arranged within a range that does not deviate from the fourth surface. The first and second additional electrode layers 134 and 135 can improve the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 131-6 and 132-6, are excellent in the bonding force with the external electrodes 131-6 and 132-6, and can play a role in further improving the mechanical bonding force of the external electrodes 131-6 and 132-6.

[0177] The first and second external electrodes 131-6 and 132-6 may have an L-shape such that the first and second external electrodes are not disposed on the second surface.

[0178] The first external electrode 131-6 may include a first connection portion 131a-6 arranged on the first additional electrode layer 134 and a first band portion 131b-6 extending from the first connection portion 131a-6 to a portion of the first surface 1, and the second external electrode 132-6 may include a second connection portion 132a-6 arranged on the second additional electrode layer 135 and a second band portion 132b-6 extending from the second connection portion 132a-6 to a portion of the first surface 1.

[0179] Meanwhile, the first and second additional electrode layers 134, 135 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined in consideration of electrical properties, structural stability, etc. Also, the first and second additional electrode layers 134, 135 may be fired electrodes including conductive metal and glass, or resin-based electrodes including conductive metal and resin. Also, the first and second additional electrode layers 134, 135 may be formed by transferring a sheet including conductive metal onto the main body.

[0180] The conductive metal contained in the first and second additional electrode layers 134 and 135 may be, but is not limited to, a material with excellent electrical conductivity. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. Preferably, the first and second additional electrode layers 134 and 135 may include one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121 and 122 containing Ni.

[0181] FIG. 17 is a schematic perspective view of a multilayer electronic component 1007 according to one embodiment of the present invention, and FIG. 18 is a cross-sectional view taken along line VII-VII' in FIG.

[0182] 17 and 18, the average thickness t1 of the first and second plating layers 141-6 and 142-6 of the multilayer electronic component 1007 according to an embodiment of the present invention may be thinner than the average thickness t2 of the insulating layer 151-6.

[0183] The insulating layer 151-6 serves to prevent the penetration of moisture or plating solution from the outside, but due to weak connectivity with the plating layers 141-6 and 142-6, it may cause delamination of the plating layers 141-6 and 142-6. If delamination of the plating layers occurs, the adhesion strength to the substrate 180 may be reduced. Here, delamination of the plating layers 141-6 and 142-6 may refer to the detachment of a portion of the plating layer or physical separation from the external electrodes 131-5 and 132-5. The weak connectivity between the plating layer and the insulating layer increases the possibility of gaps at the interface between the insulating layer and the plating layer, the possibility of foreign matter entering, and vulnerability to external impacts, etc., making delamination more likely.

[0184] According to one embodiment of the present invention, by making the average thickness t1 of the plating layer thinner than the average thickness t2 of the insulating layer, the area where the plating layer and the insulating layer contact each other can be reduced, thereby suppressing the occurrence of delamination and improving the bonding strength of the multilayer electronic component 1000 to the substrate 180.

[0185] The average thickness t1 of the first and second plating layers 141-6, 142-6 may be the average value of thicknesses measured at five equally spaced points on the first and second connection portions 131a-5, 132a-5 or the first and second band portions 131b-5, 132b-5, and the average thickness t2 of the insulating layer 151-6 may be the average value of thicknesses measured at five equally spaced points on the first and second connection portions 131a-5, 132a-5.

[0186] 19 is a schematic perspective view of a multilayer electronic component 2000 according to one embodiment of the present invention, and FIG. 20 is a cross-sectional view taken along line VIII-VIII′ of FIG.

[0187] Hereinafter, a multilayer electronic component 2000 according to an embodiment of the present invention will be described in detail with reference to Figures 19 and 20. However, content that overlaps with the above content may be omitted to avoid redundant description.

[0188] A multilayer electronic component 2000 according to one embodiment of the present invention includes a body 110 including a dielectric layer 111 and first and second internal electrodes 121, 122 alternately arranged with the dielectric layer sandwiched therebetween, the body 110 having first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces 111 and 112 and facing each other in the second direction, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces 5, 6 and facing each other in the third direction; a first connecting electrode 231a arranged on the third surface; and a first band electrode 231b arranged on the first surface and connected to the first connecting electrode. The semiconductor device includes a first external electrode 231, a second external electrode 232 including a second linking electrode 232a arranged on the fourth surface and a second band electrode 232b arranged on the first surface and connected to the second linking electrode, a first insulating layer 251 arranged on the first linking electrode, a second insulating layer 252 arranged on the second linking electrode, a first plating layer 241 arranged on the first band electrode, and a second plating layer 242 arranged on the second band electrode, and the first and second insulating layers 251, 252 can include an oxide containing aluminum (Al).

[0189] The first linking electrode 231a may be disposed on the third surface 3 and connected to the first internal electrode 121, and the second linking electrode 232a may be disposed on the fourth surface 4 and connected to the second internal electrode 122. In addition, a first insulating layer 251 may be disposed on the first linking electrode 231a, and a second insulating layer 252 may be disposed on the second linking electrode 232a.

[0190] Conventionally, external electrodes have been formed by dipping the exposed surface of the body's internal electrodes into a paste containing a conductive metal. However, external electrodes formed using the dipping method often have an excessively thick central portion. Furthermore, even if the dipping method does not result in uneven external electrode thickness, the external electrodes on the third and fourth surfaces of the body are exposed, so the thickness of the external electrodes on the third and fourth surfaces must be greater than a certain level to prevent moisture and plating solution from penetrating through the external electrodes.

[0191] In contrast, in the present invention, insulating layers 251 and 252 are placed on the connecting electrodes 231a and 232a, so that sufficient reliability can be ensured even if the thickness of the connecting electrodes 231a and 232a on the third and fourth surfaces where the internal electrodes are exposed is made thin.

[0192] The first and second connecting electrodes 231a and 232a may correspond to the third and fourth surfaces, respectively, and the surfaces of the first and second connecting electrodes 231a and 232a facing the body 110 may have the same areas as the third and fourth surfaces of the body 110, respectively. The first and second connecting electrodes 231a and 232a may be arranged so as not to deviate from the third and fourth surfaces 3 and 4, respectively. The connecting electrodes 231a and 232a may be arranged so as not to extend to the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the body 110. Specifically, in one embodiment, the first and second connecting electrodes 231a and 232a may be arranged to be spaced apart from the fifth and sixth surfaces. This ensures sufficient connectivity between the internal electrodes 121 and 122 and the external electrodes 231 and 232, minimizes the volume occupied by the external electrodes, and increases the capacitance per unit volume of the multilayer electronic component 2000.

[0193] From this perspective, the first and second connecting electrodes 231a and 232a may be disposed apart from the second surface 2. That is, since the external electrodes 231 and 232 are not disposed on the second surface 2, the volume occupied by the external electrodes 231 and 232 can be further minimized, and the capacitance per unit volume of the multilayer electronic component 2000 can be further increased.

[0194] However, the connecting electrodes 231a and 232a may include corner portions extending to and disposed on the corners of the main body 110. That is, in one embodiment, the first connecting electrode may include corner portions (not shown) extending to and disposed on the first-third corner and the second-third corner, and the second connecting electrode may include corner portions (not shown) extending to and disposed on the first-fourth corner and the second-fourth corner.

[0195] Furthermore, the connecting electrodes 231a and 232a may have a uniform and thinner thickness than external electrodes formed by a conventional dipping method.

[0196] The method for forming the connecting electrodes 231a, 232a is not particularly limited. For example, the connecting electrodes 231a, 232a may be formed by transferring a sheet containing a conductive metal, an organic material such as a binder, etc. to the third and fourth surfaces, but the method is not limited thereto and the connecting electrodes 231a, 232a may be formed by plating the third and fourth surfaces with a conductive metal. That is, the connecting electrodes 231a, 232a may be a fired layer formed by firing a conductive metal, or a plated layer.

[0197] The thickness of the connecting electrodes 231a, 232a is not particularly limited, but may be, for example, 2 to 7 μm. Here, the thickness of the connecting electrodes 231a, 232a refers to the maximum thickness, and may refer to the size of the connecting electrodes 231a, 232a in the second direction.

[0198] In one embodiment, the first and second connecting electrodes 231a and 232a may include the same metal and glass as the metal included in the internal electrodes 121 and 122. When the first and second connecting electrodes 231a and 232a include the same metal as the metal included in the internal electrodes 121 and 122, electrical connectivity with the internal electrodes 121 and 122 may be improved, and when the first and second connecting electrodes 231a and 232a include glass, bonding strength with the body 110 and / or the insulating layers 251 and 252 may be improved. In this case, the same metal as the metal included in the internal electrodes 121 and 122 may be Ni.

[0199] The first and second insulating layers 251 and 252 are disposed on the first and second connecting electrodes 231a and 232a, respectively, and serve to prevent a plating layer from being formed on the first and second connecting electrodes 231a and 232a. In addition, the first and second insulating layers 251 and 252 improve sealing properties and minimize penetration of moisture, plating solution, etc. from the outside.

[0200] The first and second insulating layers 251, 252 may include an oxide containing aluminum (Al).

[0201] This can further improve the moisture resistance reliability, and can suppress cracks due to thermal contraction and radial cracks due to metal diffusion.

[0202] The first and second band electrodes 231b and 232b may be disposed on the first surface 1 of the body 110. The first and second band electrodes 231b and 232b may be in contact with the first and second connecting electrodes 231a and 232a, respectively, and thereby be electrically connected to the first and second internal electrodes 121 and 122, respectively.

[0203] External electrodes formed by the conventional dipping method are thick on the third and fourth sides and extend partially onto the first, second, fifth, and sixth sides, making it difficult to ensure a high effective volume ratio.

[0204] In contrast, according to one embodiment of the present invention, first and second connecting electrodes 231a, 232a are arranged on the surface where the internal electrodes are exposed, and first and second band electrodes 231b, 232b are arranged on the surface that is mounted on the substrate, thereby ensuring a high effective volume ratio.

[0205] On the other hand, when the internal electrodes 121, 122 are stacked in the first direction, the multilayer electronic component 2000 can be horizontally mounted on a substrate so that the internal electrodes 121, 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and when the internal electrodes 121, 122 are stacked in the third direction, the multilayer electronic component can be vertically mounted on a substrate so that the internal electrodes 121, 122 are perpendicular to the mounting surface.

[0206] The first and second band electrodes 231b and 232b may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined in consideration of electrical characteristics, structural stability, etc. For example, the first and second band electrodes 231b and 232b may be fired electrodes including conductive metal and glass, and may be formed by applying a paste including conductive metal and glass to the first surface of the main body, but are not limited thereto, and may be a plating layer formed by plating a conductive metal on the first surface of the main body.

[0207] The conductive metal included in the first and second band electrodes 231b and 232b may be a material with excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof, and may include the same metal as the metal included in the internal electrodes 121 and 122.

[0208] Meanwhile, in order to ensure sealing characteristics and high strength, in one embodiment, the first external electrode 231 may further include a third band electrode (not shown) disposed on the second surface 2 and connected to the first connecting electrode 231a, and the second external electrode 232 may further include a fourth band electrode (not shown) disposed on the second surface 2 and connected to the second connecting electrode 232a.

[0209] In one embodiment, when the distance from the extension line E3 of the third surface to the end of the first band electrode 231b is B1, the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b is B2, the distance from the extension line E4 of the third surface to the end of the third band electrode (not shown) is B3, the distance from the extension line E4 of the fourth surface to the end of the fourth band electrode (not shown) is B4, the average size in the second direction of the region where the third surface and the second internal electrode 122 are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode 121 are separated is G2, the relationships B1 ≧ G1, B3 ≦ G1, B2 ≧ G2, and B4 ≦ G2 can be satisfied. This minimizes the volume occupied by the external electrodes, increases the capacitance per unit volume of the multilayer electronic component 2000, and increases the area in contact with solder during mounting, thereby improving bonding strength.

[0210] However, it is not intended to limit the present invention to B1≧G1, B3≦G1, B2≧G2, and B4≦G2, and cases where B1≧G1, B3≧G1, B2≧G2, and B4≧G2 are satisfied can also be included in one embodiment of the present invention. Therefore, in one embodiment, when the distance from the extension line E3 of the third surface to the end of the first band electrode 231b is B1, the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b is B2, the distance from the extension line E4 of the third surface to the end of the third band electrode (not shown) is B3, the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown) is B4, the average size in the second direction of the area where the third surface and the second internal electrode 122 are separated is G1, and the average size in the second direction of the area where the fourth surface and the first internal electrode 121 are separated is G2, B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can be satisfied.

[0211] The first and second plating layers 241 and 242 may be disposed on the first and second band electrodes 231b and 232b. The first and second plating layers 241 and 242 serve to improve mounting characteristics. The type of the first and second plating layers 241 and 242 is not particularly limited, and may be a plating layer containing one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of multiple layers.

[0212] As a more specific example of the first and second plating layers 241, 242, the first and second plating layers 241, 242 may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the first and second band electrodes 231b, 232b.

[0213] In one embodiment, the first and second plating layers 241 and 242 may be disposed to extend and cover a portion of the first and second connecting electrodes 231a and 232a, respectively.

[0214] When the average size in the first direction from the first surface 1 to the internal electrode of the first and second internal electrodes 121, 122 that is arranged closest to the first surface 1 is defined as H1, and the average size in the first direction from an extension of the first surface 1 to the ends of the first and second plating layers 241, 242 arranged on the first and second connecting electrodes 231a, 232a is defined as H2, it is possible to satisfy H1>H2. This makes it possible to suppress penetration of the plating solution into the internal electrodes during the plating process, thereby improving reliability.

[0215] In one embodiment, the first and second insulating layers 251 and 252 are disposed in direct contact with the first and second connecting electrodes 231a and 232a, respectively, and the first and second connecting electrodes 231a and 232a may include conductive metal and glass. As a result, the plating layers 241 and 242 are not disposed in the areas of the outer surfaces of the first and second connecting electrodes 231a and 232a where the insulating layers 251 and 252 are disposed, thereby effectively preventing corrosion of the external electrodes by a plating solution.

[0216] In one embodiment, the first and second insulating layers 251 and 252 are disposed in direct contact with the first and second connecting electrodes 231a and 232a, respectively, and the first and second connecting electrodes 231a and 232a may contain conductive metal and resin. As a result, the plating layers 241 and 242 are not disposed in the areas of the outer surfaces of the first and second connecting electrodes 231a and 232a where the insulating layers 251 and 252 are disposed, thereby effectively preventing corrosion of the external electrodes by the plating solution.

[0217] In one embodiment, the first plating layer 241 may be disposed to cover the edge of the first insulating layer 251 located on the first external electrode 231, and the second plating layer 242 may be disposed to cover the edge of the second insulating layer 252 located on the second external electrode 232. This may strengthen the bonding strength between the insulating layers 251, 252 and the plating layers 241, 242, improving the reliability of the multilayer electronic component 2000. Furthermore, by forming the first and second insulating layers 251, 252 before forming the plating layers 241, 242 on the external electrodes 231, 232, it is possible to more reliably prevent penetration of the plating solution during the formation of the plating layers. By forming the insulating layers before the plating layers, the plating layers 241, 242 may cover the edges of the insulating layers 251, 252.

[0218] In one embodiment, the first insulating layer 251 may be arranged to cover the end of the first plating layer 241 that is located on the first external electrode 231, and the second insulating layer 252 may be arranged to cover the end of the second plating layer 242 that is located on the second external electrode 232. This may strengthen the bonding strength between the insulating layers 251, 252 and the plating layers 241, 242, thereby improving the reliability of the multilayer electronic component 2000.

[0219] Figure 21 shows a modification of Figure 19. Referring to Figure 21, in a modification 2001 of a multilayer electronic component 2000 according to an embodiment of the present invention, first and second insulating layers 251-1 and 252-1 may be connected to each other by extending to the fifth and sixth surfaces 5 and 6, respectively, to form a single insulating layer 253-1. In this case, the connected first and second insulating layers 253-1 may be disposed to cover portions of the fifth and sixth surfaces.

[0220] 22 is a schematic perspective view of a multilayer electronic component 2002 according to one embodiment of the present invention, and FIG. 23 is a cross-sectional view taken along line IX-IX' in FIG.

[0221] 22 and 23, in a multilayer electronic component 2002 according to an embodiment of the present invention, first and second plating layers 241-2 and 242-2 may be disposed below an extension of the first surface, thereby minimizing the height of the solder during mounting and minimizing the mounting space.

[0222] In addition, the first and second insulating layers 251-2 and 252-2 may be arranged to extend to an extension line of the first surface or less and contact the first and second plating layers 241-2 and 242-2.

[0223] Figure 24 shows a modification of Figure 22. Referring to Figure 24, in a modification 2003 of the multilayer electronic component 2002 according to an embodiment of the present invention, the first and second insulating layers 251-3 and 252-3 may be connected to each other by extending to the fifth and sixth surfaces 5 and 6, respectively, to form a single insulating layer 253-3. In this case, the connected first and second insulating layers 253-3 may be disposed to cover the entire fifth and sixth surfaces.

[0224] 25 is a schematic perspective view of a multilayer electronic component 2004 according to one embodiment of the present invention, and FIG. 26 is a cross-sectional view taken along line XX' of FIG.

[0225] 25 and 26, a multilayer electronic component 2004 according to an embodiment of the present invention may further include an additional insulating layer 261 disposed on the first surface 1 and between the first band electrode 231b and the second band electrode 232b, thereby preventing leakage current that may occur between the first band electrode 231b and the second band electrode 232b under high voltage.

[0226] The type of the additional insulating layer 261 does not need to be particularly limited. For example, the additional insulating layer 261 may include an oxide containing aluminum (Al), similar to the first and second insulating layers 251-2 and 252-2. However, the additional insulating layer 261 and the first and second insulating layers 251-2 and 252-2 do not need to be limited to the same material and may be formed of different materials. For example, the additional insulating layer 261 may include one or more selected from the group consisting of epoxy resin, acrylic resin, ethyl cellulose, etc., or may include glass.

[0227] Fig. 27 shows a modification of Fig. 25. Referring to Fig. 27, in a modification 2005 of the multilayer electronic component 2004 according to an embodiment of the present invention, the first and second insulating layers 251-5 and 252-5 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, so that they can be connected as a single insulating layer 253-5.

[0228] 28 is a schematic perspective view of a multilayer electronic component 2006 according to one embodiment of the present invention. FIG. 29 is a cross-sectional view taken along line XI-XI' in FIG.

[0229] Referring to FIGS. 28 and 29, a stacked electronic component 2006 according to an embodiment includes a first insulating layer 251-6 disposed on the first connection electrode 231a and a second insulating layer 252-6 disposed on the second connection electrode 232a. When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 241-6 and 242-6 disposed on the first and second connection electrodes 231a and 232a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0230] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because if H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0231] FIG. 30 shows a modified example of FIG. 28. Referring to FIG. 30, a modified example 2007 of the stacked electronic component 2006 according to an embodiment of the present invention can be connected as one insulating layer 253-7 by the first and second insulating layers 251-7 and 252-7 extending to the fifth and sixth surfaces 5 and 6 and being connected to each other.

[0232] FIG. 31 schematically shows a perspective view of a stacked electronic component 2008 according to an embodiment of the present invention. FIG. 32 is a cross-sectional view taken along XII-XII' of FIG. 31.

[0233] Referring to FIGS. 31 and 32, a stacked electronic component 2008 according to an embodiment of the present invention can be connected as one insulating layer 253-8 by the first and second insulating layers 251-8 and 252-8 extending to the second, fifth, and sixth surfaces 2, 5, and 6 and being connected to each other. As shown in FIG. 32, the insulating layer 253-8 can be in a form that entirely covers the second surface, and the fifth and sixth surfaces can be in a form that covers only a part.

[0234] 33 is a schematic perspective view of a multilayer electronic component 2009 according to one embodiment of the present invention. FIG. 34 is a cross-sectional view taken along line XIII-XIII' in FIG.

[0235] Referring to Figures 33 and 34, the average thickness t1 of the first and second plating layers 241-9, 242-9 of the multilayer electronic component 2009 according to one embodiment of the present invention may be thinner than the average thickness t2 of the first and second insulating layers 251-9, 252-9.

[0236] According to one embodiment of the present invention, by making the average thickness t1 of the first and second plating layers 241-9, 242-9 thinner than the average thickness t2 of the first and second insulating layers 251-9, 252-9, the area where the plating layers and the insulating layers contact can be reduced, thereby suppressing the occurrence of delamination and improving the bonding strength of the multilayer electronic component 2009 to the substrate 180.

[0237] The average thickness t1 of the first and second plating layers 241-9, 242-9 may be an average value of thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a, 232a or the first and second band electrodes 231b, 232b, and the average thickness t2 of the insulating layers 251-9, 252-9 may be an average value of thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a, 232a.

[0238] Fig. 35 shows a modification of Fig. 33. Referring to Fig. 35, in a modification 2010 of the multilayer electronic component 2009 according to an embodiment of the present invention, the first and second insulating layers 251-10 and 252-10 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, so that they can be connected as a single insulating layer 253-10.

[0239] Fig. 36 is a schematic perspective view of a multilayer electronic component 3000 according to one embodiment of the present invention. Fig. 37 is a cross-sectional view taken along line XIV-XIV' in Fig. 36. Fig. 38 is an enlarged view of region K1 in Fig. 36.

[0240] 36 to 38, a multilayer electronic component 3000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121, 122 alternately arranged with the dielectric layer sandwiched therebetween, and includes a main body 110 having first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing each other in the third direction, a first connecting portion 331a arranged on the third surface of the main body, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 331c extending from the first connecting portion to a corner connecting the second surface and the third surface of the main body. The second external electrode 332 includes a first external electrode 331, a second connection portion 332a arranged on the fourth surface of the main body, a second band portion 332b extending from the second connection portion to a part of the first surface, and a second corner portion 332c extending from the second connection portion to a corner connecting the second surface and the fourth surface of the main body, an insulating layer 351 arranged on the first and second connection portions 331a, 332a and arranged to cover the second surface and the first and second corner portions, a first plating layer 341 arranged on the first band portion, and a second plating layer 342 arranged on the second band portion, and the first and second insulating layers can include an oxide including aluminum (Al).

[0241] In one embodiment, when the average size in the second direction from an extension of the third surface to an end of the first corner portion 331c is B3, the average size in the second direction from an extension of the fourth surface to an end of the second corner portion 332c is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, it is possible to satisfy B3≦G1 and B4≦G2. This minimizes the volume occupied by the external electrodes 331, 332, and increases the capacitance per unit volume of the multilayer electronic component 3000.

[0242] In this case, when the average size in the second direction from an extension of the third surface to the end of the first band portion 331b is B1 and the average size in the second direction from an extension of the fourth surface to the end of the second band portion 332b is B2, B1 ≧ G1 and B3 ≧ G2 can be satisfied, thereby increasing the area in contact with solder during mounting and improving bonding strength.

[0243] A multilayer electronic component 3000 according to one embodiment may include a body 110 including a dielectric layer 111 and first and second internal electrodes 121, 122 alternately disposed with the dielectric layer sandwiched therebetween, the body 110 having first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces facing in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing in the third direction. The body 110 of the multilayer electronic component 3000 may have the same configuration as the body 110 of the multilayer electronic component 1000, except that an end portion of the first or second surface of the body has a contracted shape, as described below.

[0244] The external electrodes 331 and 332 may be disposed on the third surface 3 and the fourth surface 4 of the body 110. The external electrodes 331 and 332 may include first and second external electrodes 331 and 332 disposed on the third and fourth surfaces 3 and 4 of the body 110, respectively, and connected to the first and second internal electrodes 121 and 122, respectively.

[0245] The external electrodes 331, 332 may include a first external electrode 331 including a first connecting portion 331a disposed on the third surface, a first band portion 331b extending from the first connecting portion to a portion of the first surface, and a first corner portion 331c extending from the first connecting portion to a corner connecting the second surface and the third surface, and a second external electrode 132 including a second connecting portion 332a disposed on the fourth surface, a second band portion 332b extending from the second connecting portion to a portion of the first surface, and a second corner portion 332c extending from the second connecting portion to a corner connecting the second surface and the fourth surface. The first connecting portion 331a may be connected to the first internal electrode 121 on the third surface, and the second connecting portion 332a may be connected to the second internal electrode 122 on the fourth surface.

[0246] In one embodiment, the first and second connection portions 331a and 332a may be spaced apart from the fifth and sixth surfaces, thereby minimizing the area occupied by the external electrodes 331 and 332, and further miniaturizing the multilayer electronic component 3000.

[0247] A marginal region where the internal electrodes 121, 122 are not disposed overlaps the dielectric layer 111, resulting in a step due to the thickness of the internal electrodes 121, 122, and the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces may have a shape that is shrunk toward the center of the body 110 in the first direction relative to the first surface or the second surface. Alternatively, due to shrinkage behavior during the sintering process of the body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 may have a shape that is shrunk toward the center of the body 110 in the first direction relative to the first surface or the second surface. Alternatively, in order to prevent chipping defects, the corners connecting each surface of the body 110 may be rounded through a separate process, so that the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces may have a rounded shape.

[0248] The corners may include a 1-3 corner C1-3 connecting the first and third faces, a 1-4 corner C1-4 connecting the first and fourth faces, a 2-3 corner C2-3 connecting the second and third faces, and a 2-4 corner C2-4 connecting the second and fourth faces. The corners may also include a 1-5 corner connecting the first and fifth faces, a 1-6 corner connecting the first and sixth faces, a 2-5 corner connecting the second and fifth faces, and a 2-6 corner connecting the second and sixth faces. However, in order to suppress the steps caused by the internal electrodes 121, 122, if the internal electrodes are cut after lamination so as to be exposed on the fifth and sixth surfaces 5, 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form margin portions 114, 115, the portions connecting the first surface with the fifth and sixth surfaces and the portions connecting the second surface with the fifth and sixth surfaces may not have a contracted shape.

[0249] On the other hand, the first to sixth surfaces of the main body 110 are substantially flat surfaces, and the non-flat areas can be regarded as corners. Also, the areas of the external electrodes 131 and 132 that are arranged on the corners can be regarded as corner portions.

[0250] From this perspective, the first and second corner portions 331c and 332c may be disposed below an extension line E2 of the second surface, and may be disposed spaced apart from the second surface. That is, because the external electrodes 331 and 332 are not disposed on the second surface, the volume occupied by the external electrodes 331 and 332 can be further minimized, thereby further increasing the capacitance per unit volume of the multilayer electronic component 3000. In addition, the first corner portion 331c may be disposed on a portion of the 2-3 corner C2-3 connecting the third surface and the second surface, and the second corner portion 332c may be disposed on a portion of the 2-4 corner C2-4 connecting the fourth surface and the second surface.

[0251] The extension E2 of the second surface can be defined as follows:

[0252] In a length-thickness cross section (LT cross section) of laminated electronic component 3000 taken at the center in the width direction, seven straight lines P0, P1, P2, P3, P4, P5, P6, and P7 are drawn in the thickness direction at equal intervals in the length direction from the third surface to the fourth surface, and the line passing through the point where P2 meets the second surface and the point where P4 meets the second surface can be defined as an extension line E2 of the second surface.

[0253] Meanwhile, the external electrodes 331 and 332 may be formed using any material that has electrical conductivity, such as a metal, and the specific material may be determined taking into consideration electrical properties, structural stability, etc., and may further have a multi-layer structure.

[0254] The external electrodes 331 and 332 may be fired electrodes containing a conductive metal and glass, or may be resin-based electrodes containing a conductive metal and resin.

[0255] The external electrodes 331 and 332 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body, or by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0256] The conductive metal contained in the external electrodes 331, 332 may be, but is not limited to, a material with excellent electrical conductivity. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. Preferably, the external electrodes 331, 332 may contain one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121, 122 containing Ni.

[0257] An insulating layer 351 may be disposed on the first and second connection portions 331a and 332a.

[0258] The first and second connecting portions 331a, 332a are portions connected to the internal electrodes 121, 122, and therefore may become paths for the penetration of plating solution during the plating process or moisture during actual use. In the present invention, an insulating layer 351 is disposed on the connecting portions 331a, 332a, which can prevent the penetration of moisture or plating solution from the outside.

[0259] The insulating layer 351 may be disposed so as to be in contact with the first and second plating layers 341 and 342. In this case, the insulating layer 351 may be in contact with the first and second plating layers 341 and 342 in a manner that covers a portion of the edge thereof, or the first and second plating layers 341 and 342 may be in contact with the insulating layer 351 in a manner that covers a portion of the edge thereof.

[0260] The insulating layer 351 may be disposed on the first and second connection portions 331a and 332a and may be disposed to cover the second surface and the first and second corner portions 331c and 332c. In addition, the insulating layer 351 covers the areas where the ends of the first and second corner portions 331c and 332c contact the main body 110, thereby blocking a moisture penetration path and further improving moisture resistance reliability.

[0261] The insulating layer 351 may be disposed on the second surface and extend to the first and second connection portions 331a and 332a. If the external electrodes 331 and 332 are not disposed on the second surface, the insulating layer may be disposed to cover the entire second surface. Meanwhile, the insulating layer 351 does not necessarily have to be disposed on the second surface. The insulating layer may be disposed on part or all of the second surface, or may be divided into two parts, each disposed on the first and second connection portions 331a and 332a. Even in this case, the insulating layer may be disposed to cover the entire first and second corner portions 331c and 332c. If the insulating layer is not disposed on the entire second surface, it may be disposed below an extension of the second surface. Alternatively, the insulating layer may not be disposed on the second surface but may extend from the first and second connection portions 331a and 332a to the fifth and sixth surfaces to form a single insulating layer.

[0262] In one embodiment, the insulating layer 351 is disposed to cover a portion of the fifth and sixth surfaces, thereby improving reliability, and the portions of the fifth and sixth surfaces that are not covered by the insulating layer may be exposed to the outside.

[0263] Furthermore, the insulating layer 351 can be arranged to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, thereby further improving moisture resistance reliability.

[0264] The insulating layer 351 may serve to prevent plating layers 341, 342 from being formed on the external electrodes 331, 332 on which the insulating layer 351 is disposed, and may serve to improve sealing properties and minimize penetration of moisture, plating solution, etc. from the outside. The components, composition, average thickness, and resulting effects of the insulating layer 351 are the same as those of the insulating layers 151, 251, 252, 253 included in the multilayer electronic components 1000, 2000 or various embodiments thereof, and therefore, description thereof will be omitted.

[0265] The first and second plating layers 341 and 342 may be disposed on the first and second band portions 331b and 332b, respectively. The plating layers 341 and 342 may serve to improve mounting characteristics, and by disposing the plating layers 341 and 342 on the band portions 331b and 332b, mounting space may be minimized and reliability may be improved by minimizing penetration of a plating solution into the internal electrodes. One end of the first and second plating layers 341 and 342 may contact the first surface, and the other end may contact the insulating layer 351.

[0266] The type of the plating layers 341 and 342 is not particularly limited, and may be a plating layer containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and alloys thereof, and may be formed of a plurality of layers.

[0267] As a more specific example of the plating layers 341 and 342, the plating layers 341 and 342 may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the first and second band portions 331b and 332b.

[0268] In one embodiment, the insulating layer 351 is disposed so as to be in direct contact with the first and second external electrodes 331, 332, and the first and second external electrodes 331, 332 may include a conductive metal and glass. As a result, the plating layers 341, 342 are not disposed in the areas of the outer surfaces of the first and second external electrodes 331, 332 where the insulating layer 351 is disposed, thereby effectively preventing the external electrodes from being corroded by the plating solution.

[0269] In one embodiment, the insulating layer 351 is disposed so as to be in direct contact with the first and second external electrodes 331, 332, and the first and second external electrodes 331, 332 may contain a conductive metal and a resin. As a result, the plating layers 341, 342 are not disposed in the areas of the outer surfaces of the first and second external electrodes 331, 332 where the insulating layer 351 is disposed, thereby effectively preventing the external electrodes from being corroded by the plating solution.

[0270] In one embodiment, the first plating layer 341 may be disposed to cover the end of the insulating layer 351 located on the first external electrode 331, and the second plating layer 342 may be disposed to cover the end of the insulating layer 351 located on the second external electrode 332. This strengthens the bonding strength between the insulating layer 351 and the plating layers 341 and 342, improving the reliability of the multilayer electronic component 3000. Furthermore, by forming the insulating layer 351 before forming the plating layers 341 and 342 on the external electrodes 331 and 332, it is possible to more reliably prevent penetration of the plating solution during the plating layer formation process. By forming the insulating layer before the plating layer, the plating layers 341 and 342 can cover the end of the insulating layer 351.

[0271] In one embodiment, the insulating layer 351 is disposed to cover an end disposed on the first external electrode 331 of the first plating layer 341, and the insulating layer 351 can be disposed to cover an end disposed on the second external electrode 332 of the second plating layer 342. Thereby, the bonding force between the insulating layer 351 and the plating layers 341 and 342 can be strengthened, and the reliability of the stacked electronic component 3000 can be improved.

[0272] In one embodiment, the first and second plating layers 341 and 342 can be extended and disposed to cover a part of the first and second connection portions 331a and 332a, respectively. When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 341 and 342 disposed on the first and second connection portions 331a and 332a is H2, H1 > H2 can be satisfied. Thereby, it is possible to suppress the plating solution from penetrating into the internal electrode during the plating process and improve the reliability.

[0273] In one embodiment, when the average size in the first direction from the first surface to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 341 and 342 disposed on the first and second connection portions 331a and 332a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved. More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0274] In one embodiment, the first and second plating layers 341 and 342 may be disposed below an extension of the first surface. This minimizes the height of the solder during mounting, thereby minimizing the mounting space. In addition, the insulating layer 351 may be disposed to extend below an extension of the first surface and contact the first and second plating layers 341 and 342.

[0275] In one embodiment, when the average size of the main body in the second direction is L, the average size in the second direction from the extension of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension of the fourth surface to the end of the second band portion is B2, the relationships 0.2≦B1 / L≦0.4 and 0.2≦B2 / L≦0.4 can be satisfied.

[0276] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient bonding strength. On the other hand, if B2 / L exceeds 0.4, leakage current may occur between the first band portion 331b and the second band portion 332b under high voltage current, and the first band portion 331b and the second band portion 332b may be electrically connected due to plating bleeding during the plating process.

[0277] In one embodiment, the semiconductor device may further include an additional insulating layer disposed on the first surface between the first band portion 331b and the second band portion 332b, thereby preventing leakage current that may occur between the first band portion 331b and the second band portion 332b under high voltage.

[0278] The type of the additional insulating layer does not need to be particularly limited. For example, the additional insulating layer may contain an oxide containing aluminum (Al), similar to insulating layer 351. However, the additional insulating layer and insulating layer 351 do not need to be limited to the same material, and may be formed of different materials. For example, the additional insulating layer may contain one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or may contain glass.

[0279] In one embodiment, when the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, B3 < B1 and B4 < B2 can be satisfied. The average length B1 of the first band portion 331b can be longer than the average length B3 of the first corner portion 331c, and the average length of the second band portion can be longer than the average length B4 of the second corner portion 332c. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0280] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 331b is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 332b is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the first corner portion 331c is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the second corner portion 332c is B4, B3 < B1 and B4 < B2 can be satisfied.

[0281] In one embodiment, the average thicknesses of the first and second plating layers 341 and 342 can be thinner than the average thickness of the insulating layer 351.

[0282] The insulating layer 351 serves to prevent moisture penetration from the outside or penetration of the plating solution. However, since the connectivity with the plating layers 341 and 342 is weak, there is a risk of causing delamination of the plating layer. When delamination of the plating layer occurs, the fixing strength with the substrate may decrease. Here, delamination of the plating layer may mean that a part of the plating layer comes off or is physically separated from the external electrodes 331 and 332. Since the connectivity between the plating layer and the insulating layer is weak, there is a high possibility that a gap occurs at the interface between the insulating layer and the plating layer or foreign matter intrudes, and it becomes vulnerable to external shocks and the possibility of delamination increases.

[0283] According to one embodiment of the present invention, by making the average thickness of the plating layer thinner than the average thickness of the insulating layer, the area where the plating layer and the insulating layer contact each other can be reduced, thereby suppressing the occurrence of delamination and improving the bonding strength of the multilayer electronic component 3000 to the substrate.

[0284] The size of the multilayer electronic component 3000 does not need to be particularly limited.

[0285] However, in order to achieve both miniaturization and high capacitance, it is necessary to reduce the thickness of the dielectric layers and internal electrodes and increase the number of layers. Therefore, the effect of improving reliability and capacitance per unit volume according to the present invention can be more pronounced in a multilayer electronic component 3000 having a size of 1005 mm (length x width, 1.0 mm x 0.5 mm) or less.

[0286] Therefore, taking into consideration manufacturing errors, the size of the external electrodes, etc., the reliability improvement effect according to the present invention can be more significant when the length of the multilayer electronic component 3000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the multilayer electronic component 3000 may refer to the maximum size of the multilayer electronic component 3000 in the second direction, and the width of the multilayer electronic component 3000 may refer to the maximum size of the multilayer electronic component 3000 in the third direction.

[0287] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications, and changes may be made by a person skilled in the art within the scope of the technical idea of ​​the present invention as set forth in the claims, and these also fall within the scope of the present invention.

[0288] Meanwhile, the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-described one embodiment does not exclude the case where it is implemented in combination with features of another embodiment. For example, even if a feature described in a particular embodiment is not described in another embodiment, it can be interpreted as a description related to the other embodiment unless the other embodiment provides a description opposite to or contradicts the feature.

[0289] Furthermore, the terms used in the present invention are merely used to explain an example and are not intended to limit the present invention. In this case, the singular expression includes the plural unless the context clearly indicates otherwise. [Explanation of symbols]

[0290] 1000, 2000, 3000 Multilayer electronic components 1100 Mounting board 110 Main Unit 111 Dielectric layer 112, 113 Cover 114, 115 Margin 121, 122 Internal electrode 131, 231, 331 1st external electrode 132, 232, 332 2nd external electrode 134, 135 Additional electrode layer 141, 142, 241, 242, 341, 342 plating layer 151, 251, 252, 253, 351 Insulation layer 161, 261 Additional insulating layer 180 boards 181, 182 Electrode pads 191, 192 Handa

Claims

1. A main body including a dielectric layer, and first and second internal electrodes alternately disposed with the dielectric layer therebetween, the main body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; A first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion to a part of the first surface; A second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion to a part of the first surface; A first insulating layer disposed on the first connection portion; A second insulating layer disposed on the second connection portion; A first plating layer disposed on the first band portion; A second plating layer disposed on the second band portion; and The first insulating layer and the second insulating layer include an oxide containing aluminum (Al); When an average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes is H1, and an average size in the first direction from an extension line of the first surface to an end of the first and second plating layers disposed on the first and second connection portions is H2, H1 ≧ H2 is satisfied; The first insulating layer is in contact with the first plating layer, and the second insulating layer is in contact with the second plating layer, a multilayer electronic component.

2. The multilayer electronic component according to claim 1, wherein an average thickness of the first and second insulating layers is 50 nm or more and 1000 nm or less.

3. The multilayer electronic component according to claim 1, wherein an average thickness of the first and second insulating layers is 600 nm or more and 1000 nm or less.

4. The multilayer electronic component according to claim 1, wherein an average thickness of the first and second insulating layers is 800 nm or more and 1000 nm or less.

5. The oxide containing the aluminum (Al) is Al ２ O ３ The multilayer electronic component according to claim 1, wherein the oxide is O

6. The multilayer electronic component according to claim 1, wherein a molar number of aluminum (Al) element with respect to a total molar number of elements other than oxygen among elements constituting the first and second insulating layers is 0.95 or more.

7. The multilayer electronic component according to claim 1, wherein the first and second insulating layers further include an oxide containing magnesium (Mg).

8. When an average size of the main body in the first direction is T, The multilayer electronic component according to claim 1, wherein H2 < T / 2 is satisfied.

9. The multilayer electronic component according to claim 1, wherein the first and second plating layers are disposed below an extension line of the first surface.

10. When the average size of the main body in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, The multilayer electronic component according to claim 1, satisfying 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.

4.

11. The multilayer electronic component according to claim 1, further comprising an additional insulating layer disposed on the first surface and disposed between the first band portion and the second band portion.

12. The multilayer electronic component according to claim 1, wherein the average thickness of the dielectric layer is 0.35 μm or less.

13. The multilayer electronic component according to claim 1, wherein the average thickness of the first and second internal electrodes is 0.35 μm or less.

14. The main body includes a capacitance forming portion including first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and cover portions disposed on both end surfaces of the capacitance forming portion in the first direction. The multilayer electronic component according to claim 1, wherein the average size of the cover portion in the first direction is 15 μm or less.

15. The multilayer electronic component according to claim 1, wherein the average thickness of the first and second plating layers is thinner than the average thickness of the regions disposed on the first and second connection portions among the first and second insulating layers.

16. The multilayer electronic component according to claim 1, wherein the first plating layer is disposed so as to cover the end close to the first surface of the first insulating layer, and the second plating layer is disposed so as to cover the end close to the first surface of the second insulating layer.

17. The multilayer electronic component according to claim 1, wherein the first insulating layer is disposed so as to cover the end disposed on the first external electrode of the first plating layer, and the second insulating layer is disposed so as to cover the end disposed on the second external electrode of the second plating layer.

18. The first external electrode includes a first side surface band portion extending from the first connection portion to a part of the fifth and sixth surfaces. The second external electrode includes a second side surface band portion extending from the second connection portion to a part of the fifth and sixth surfaces. The multilayer electronic component according to claim 1, wherein the size in the second direction of the first and second side surface band portions increases as it approaches the first surface.

19. The multilayer electronic component according to claim 1, wherein the first and second external electrodes are disposed spaced apart from the fifth and sixth surfaces.

20. The laminated electronic component according to claim 1, wherein the first and second external electrodes are arranged at a distance from the second surface.

21. The laminated electronic component according to claim 1, wherein the first and second insulating layers extend to the second surface and are connected to each other.

22. The laminated electronic component according to claim 1, wherein the first and second insulating layers extend to the fifth and sixth surfaces and are connected to each other.

23. The laminated electronic component according to claim 1, wherein the first and second insulating layers are not arranged on the second, fifth, and sixth surfaces.

24. The first external electrode further includes a third band portion extending from the first connection portion onto a part of the second surface, The laminated electronic component according to claim 1, wherein the second external electrode further includes a fourth band portion extending from the second connection portion onto a part of the second surface.

25. The main body includes a first - 3 corner connecting the first surface and the third surface, a first - 4 corner connecting the first surface and the fourth surface, a second - 3 corner connecting the second surface and the third surface, and a second - 4 corner connecting the second surface and the fourth surface, The first - 3 corner and the second - 3 corner have a form that contracts toward the center of the main body in the first direction as they approach the third surface, and the first - 4 corner and the second - 4 corner have a form that contracts toward the center of the main body in the first direction as they approach the fourth surface, The laminated electronic component according to claim 1, wherein the first external electrode includes a first corner portion extending and arranged from the first connection portion onto the first - 3 corner and the second - 3 corner, and the second external electrode includes a second corner portion extending and arranged from the second connection portion onto the first - 4 corner and the second - 4 corner.

26. When the average size in the second direction from the extension line of the third surface to the end of the first corner portion is B3, the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, The laminated electronic component according to claim 25, which satisfies B3 ≤ G1 and B4 ≤ G2.

27. The first external electrode includes a first connection electrode arranged on the third surface and a first band electrode arranged on the first surface and connected to the first connection electrode. The laminated electronic component according to claim 1, wherein the second external electrode includes a second connection electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connection electrode.

28. The laminated electronic component according to claim 27, wherein the first and second connection electrodes are disposed at a distance from the fifth and sixth surfaces.

29. The laminated electronic component according to claim 27, wherein the first and second connection electrodes are disposed at a distance from the second surface.

30. The first external electrode further includes a third band electrode disposed on the second surface and connected to the first connection electrode. The laminated electronic component according to claim 27, wherein the second external electrode further includes a fourth band electrode disposed on the second surface and connected to the second connection electrode.

31. The laminated electronic component according to claim 27, wherein the first connection electrode and the second connection electrode include the same metal as the metal contained in the internal electrode.

32. The laminated electronic component according to claim 27, wherein the first connection electrode and the second connection electrode are fired electrodes including a conductive metal and glass.

33. The laminated electronic component according to claim 27, wherein the first band electrode and the second band electrode are fired electrodes including a conductive metal and glass.

34. The laminated electronic component according to claim 27, wherein the first band electrode and the second band electrode are plating layers.

35. The laminated electronic component according to claim 27, wherein the first connection electrode and the second connection electrode are plating layers.

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