Laminate-type electronic component

Abstract

To increase a capacity per unit volume.SOLUTION: A laminate-type electronic component 1000 comprises: a main body 110 including dielectric layers 111 and internal electrodes 121, 122, and having first and second faces opposed to each other in a first direction, third and fourth faces opposed to each other in a second direction, and fifth and sixth faces opposed to each other in a third direction; a first external electrode 131 including a first connection part 131a disposed on the third face, and a first band part 131b extending from the first connection part to part of the first face, and a third band part 131c extending from the first connection part to part of the second face; a second external electrode 132 including a second connection part 132a disposed on the fourth face, and a second band part 132b extending from the second connection part to part of the first face, and a fourth band part 132c extending from the second connection part to part of the second face; an insulation layer 151 located over the first and second connection parts and covering the second to fourth band parts; and first and second plating layers 141, 142 disposed over the first and second band parts. The insulation layer contains a silicon-based resin.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products, such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small, yet ensuring high capacitance, and being easy to mount, and can be used as components in various electronic devices. As various electronic devices, such as computers and mobile devices, become smaller and have higher output, there is an increasing demand for multilayer ceramic capacitors to be smaller and have higher capacitance. In addition, with the recent increase in interest in automotive electrical components, multilayer ceramic capacitors are also being required to have high reliability characteristics for use in automobiles and infotainment systems.

[0004] To miniaturize and increase the capacitance of multilayer ceramic capacitors, the internal electrodes and dielectric layers must be thinned to increase the number of layers, and the volume of parts that do not affect the formation of capacitance must be minimized to increase the effective volume fraction required to realize capacitance. Also, to mount as many components as possible within a limited board area, the mounting space must be minimized.

[0005] Furthermore, as the size and capacitance of multilayer ceramic capacitors become smaller, the thickness of the margins becomes thinner, which may facilitate penetration of external moisture or plating solution, thereby potentially reducing reliability. Therefore, a solution is needed to protect multilayer ceramic capacitors from external moisture or plating solution penetration. Summary of the Invention [Problem to be solved by the invention]

[0006] One of several objects of the present invention is to provide a multilayer electronic component having improved capacitance per unit volume.

[0007] One of several objects of the present invention is to provide a multilayer electronic component with improved reliability.

[0008] One of several objects of the present invention is to provide a laminated electronic component that can minimize packaging space.

[0009] However, the object of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0010] A multilayer electronic component according to one embodiment of the present invention includes a main body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer sandwiched therebetween, the main body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction; a first connecting portion disposed on the third surface; a first band portion extending from the first connecting portion to a portion of the first surface; and a third band portion extending from the first connecting portion to a portion of the second surface. a second external electrode including a second connection portion disposed on the fourth surface, a second band portion extending from the second connection portion to a portion of the first surface, and a fourth band portion extending from the second connection portion to a portion of the second surface; an insulating layer disposed on the first and second connection portions and arranged to cover the second surface, the third and fourth band portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the insulating layer can include a silicone-based resin.

[0011] a first external electrode including a first connecting portion disposed on the third surface and a first band portion extending from the first connecting portion to a portion of the first surface; a second external electrode including a second connecting portion disposed on the fourth surface and a second band portion extending from the second connecting portion to a portion of the first surface; an insulating layer disposed on the second surface and extending onto the first and second connecting portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the insulating layer may include a silicone resin.

[0012] A multilayer electronic component according to one embodiment of the present invention includes a main body including a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer sandwiched therebetween, the main body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction; a first connecting portion arranged on the third surface, a first band portion extending from the first connecting portion to a portion of the first surface, and a first corner portion extending from the first connecting portion to a corner connecting the second surface and the third surface; a second connecting portion arranged on the fourth surface, a second band portion extending from the second connecting portion to a portion of the first surface, and a second corner portion extending from the second connecting portion to a corner connecting the second surface and the fourth surface; the second external electrode including a second corner portion disposed by extension thereof; an insulating layer disposed on the first and second connection portions and disposed so as to cover the second surface and the first and second corner portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein when an average size in the second direction from an extension of the third surface to an end of the first corner portion is defined as B3, an average size in the second direction from an extension of the fourth surface to an end of the second corner portion is defined as B4, an average size in the second direction of a region where the third surface and the second internal electrode are separated from each other is defined as G1, and an average size in the second direction of a region where the fourth surface and the first internal electrode are separated from each other is defined as G2, B3≦G1 and B4≦G2 are satisfied, and the insulating layer can contain a silicone-based resin.

[0013] a first insulating layer disposed on the first connecting electrode, a second insulating layer disposed on the second connecting electrode, a first plating layer disposed on the first band electrode, a first plating layer disposed on the second band electrode, a first insulating layer disposed on the second connecting electrode, a first plating layer disposed on the second band electrode, a first plating layer disposed on the second band electrode, a first insulating layer disposed on the first connecting electrode, a first plating layer disposed on the second band electrode, a first plating layer disposed on the second band electrode, and a second insulating layer disposed on the first connecting electrode. [Effects of the Invention]

[0014] One of the various effects of the present invention is that by providing an insulating layer on the connection portions of the external electrodes and a plating layer on the band portions of the external electrodes, the capacity per unit volume of the multilayer electronic component is improved while also improving its reliability.

[0015] One of the various advantages of the present invention is that it minimizes the mounting space required for a multilayer electronic component.

[0016] One of the various effects of the present invention is that the insulating layer contains a silicone resin, which prevents penetration of moisture and plating solution, improving moisture resistance reliability and suppressing the occurrence and propagation of cracks.

[0017] However, the various beneficial advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 2] 2 is a schematic perspective view of a main body of the multilayer electronic component of FIG. 1. [Figure 3] FIG. 2 is a cross-sectional view taken along line II' in FIG. [Figure 4] FIG. 3 is an exploded perspective view schematically showing the main body of FIG. 2 in an exploded state. [Figure 5] 2 is a schematic perspective view of a substrate on which the multilayer electronic component of FIG. 1 is mounted. [Figure 6] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 7] FIG. 7 is a cross-sectional view taken along line II-II' in FIG. [Figure 8] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 9] FIG. 9 is a cross-sectional view taken along line III-III' in FIG. 8. [Figure 10] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 11] FIG. 11 is a cross-sectional view taken along line IV-IV′ in FIG. [Figure 12] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 13] FIG. 13 is a cross-sectional view taken along line VV' in FIG. [Figure 14] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 15] FIG. 15 is a cross-sectional view taken along line VI-VI' in FIG. [Figure 16] This shows a modification of FIG. [Figure 17] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 18] FIG. 18 is a cross-sectional view taken along line VII-VII′ in FIG. [Figure 19] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 20]FIG. 20 is a cross-sectional view taken along line VIII-VIII′ in FIG. 19. [Figure 21] This shows a modification of FIG. [Figure 22] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 23] FIG. 23 is a cross-sectional view taken along line IX-IX' in FIG. 22. [Figure 24] This shows a modification of FIG. [Figure 25] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 26] FIG. 26 is a cross-sectional view taken along line XX' in FIG. 25. [Figure 27] This shows a modification of FIG. [Figure 28] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 29] FIG. 29 is a cross-sectional view taken along line XI-XI′ in FIG. 28. [Figure 30] This shows a modification of FIG. [Figure 31] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 32] FIG. 32 is a cross-sectional view taken along line XII-XII′ in FIG. 31. [Figure 33] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 34] 34 is a cross-sectional view taken along line XIII-XIII' in FIG. 33. [Figure 35] This shows a modification of FIG. [Figure 36] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 37] FIG. 37 is a cross-sectional view taken along line XIV-XIV′ in FIG. 36. [Figure 38] FIG. 37 is an enlarged view of the K1 region in FIG. 36. DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements designated by the same reference numerals in the drawings are the same elements.

[0020] In order to clearly explain the present invention in the drawings, parts that are not relevant to the explanation have been omitted, and the size and thickness of each component shown in the drawings have been arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited to those shown in the drawings. Components that have the same function within the same concept will be described using the same reference numerals. Furthermore, throughout the specification, when a part is said to "include" a certain component, this does not mean that other components are excluded, but that the part may further include other components, unless otherwise specified to the contrary.

[0021] In the drawings, the first direction can be defined as the stacking direction or thickness T direction, the second direction can be defined as the length L direction, and the third direction can be defined as the width W direction.

[0022] FIG. 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is a schematic perspective view of the main body of the multilayer electronic component of FIG. 1, FIG. 3 is a cross-sectional view taken along line II' of FIG. 1, FIG. 4 is a schematic exploded perspective view of the main body of FIG. 2, and FIG. 5 is a schematic perspective view of a substrate on which the multilayer electronic component of FIG. 1 is mounted.

[0023] A multilayer electronic component 1000 according to one embodiment of the present invention will now be described with reference to FIGS.

[0024] A multilayer electronic component 1000 according to one embodiment of the present invention includes a main body 110 including a dielectric layer 111, first and second internal electrodes 121, 122 alternately arranged with the dielectric layer sandwiched therebetween, and including first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces and facing each other in a third direction; a first connecting portion 131a arranged on the third surface, a first band portion 131b extending from the first connecting portion to a portion of the first surface, and a third band portion 131c extending from the first connecting portion to a portion of the second surface. The semiconductor device may include a first external electrode 131, a second external electrode 132 including a second connection portion 132a arranged on the fourth surface, a second band portion 132b extending from the second connection portion to a portion of the first surface, and a fourth band portion 132c extending from the second connection portion to a portion of the second surface, an insulating layer 151 arranged on the first and second connection portions and arranged to cover the second surface, third and fourth band portions 131c, 132c, a first plating layer 141 arranged on the first band portion 131b, and a second plating layer 142 arranged on the second band portion 132b, wherein the insulating layer 151 may include a silicone-based resin.

[0025] The body 110 is formed by alternately stacking dielectric layers 111 and internal electrodes 121 and 122. There is no particular limitation on the specific shape of the body 110, but as shown in the figure, the body 110 may have a hexahedral shape or a similar shape. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may have a substantially hexahedral shape, although not a hexahedral shape with perfectly straight lines.

[0026] The main body 110 may have first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in a second direction, and fifth and sixth surfaces 5, 6 connected to the first and second surfaces 1, 2 and connected to the third and fourth surfaces 3, 4 and facing each other in the third direction.

[0027] In one embodiment, the main body 110 includes a 1-3 corner connecting the first surface and the third surface, a 1-4 corner connecting the first surface and the fourth surface, a 2-3 corner connecting the second surface and the third surface, and a 2-4 corner connecting the second surface and the fourth surface, and the 1-3 corner and the 2-3 corner may have a shape that is contracted toward the center of the main body in the first direction as they approach the third surface, and the 1-4 corner and the 2-4 corner may have a shape that is contracted toward the center of the main body in the first direction as they approach the fourth surface.

[0028] Since a marginal region where the internal electrodes 121, 122 are not disposed overlaps the dielectric layer 111, a step is generated due to the thickness of the internal electrodes 121, 122, and the corners connecting the first surface and the third to fifth surfaces and / or the corners connecting the second surface and the third to fifth surfaces may have a shape that shrinks toward the center in the first direction of the main body 110 when viewed from the first surface or the second surface. Alternatively, due to shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 may have a shape that shrinks toward the center in the first direction of the main body 110 when viewed from the first surface or the second surface. Alternatively, in order to prevent chipping defects, the corners connecting each surface of the body 110 may be rounded through a separate process, so that the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces may have a rounded shape.

[0029] The corners may include a 1-3 corner connecting the first and third surfaces, a 1-4 corner connecting the first and fourth surfaces, a 2-3 corner connecting the second and third surfaces, and a 2-4 corner connecting the second and fourth surfaces. The corners may also include a 1-5 corner connecting the first and fifth surfaces, a 1-6 corner connecting the first and sixth surfaces, a 2-5 corner connecting the second and fifth surfaces, and a 2-6 corner connecting the second and sixth surfaces. The first to sixth surfaces of the main body 110 may be generally flat surfaces, and non-flat areas may be defined as corners. Hereinafter, the extension line of each surface may refer to a line extended from the flat portion of each surface.

[0030] In this case, the areas of the external electrodes 131, 132 arranged on the corners of the main body 110 can be called corner portions, the areas arranged on the third and fourth surfaces of the main body 110 can be called connection portions, and the areas arranged on the first and second surfaces of the main body can be called band portions.

[0031] On the other hand, in order to suppress steps caused by the internal electrodes 121, 122, if the laminated internal electrodes are cut so as to be exposed on the fifth and sixth surfaces 5, 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form margin portions 114, 115, the portions connecting the first surface to the fifth and sixth surfaces and the portions connecting the second surface to the fifth and sixth surfaces do not need to have a contracted shape.

[0032] The plurality of dielectric layers 111 forming the body 110 are in a sintered state, and the boundaries between adjacent dielectric layers 111 can be integrated to the extent that they are difficult to see without using a scanning electron microscope (SEM).

[0033] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0034] In addition, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the powder such as barium titanate (BaTiO3) as the raw material for forming the dielectric layer 111 according to the purpose of the present invention.

[0035] On the other hand, the average thickness td of the dielectric layer 111 does not need to be particularly limited. However, generally, when the dielectric layer is formed thin with a thickness less than 0.6 μm, especially when the thickness of the dielectric layer is 0.35 μm or less, there is a risk of reduced reliability. According to an embodiment of the present invention, by disposing the insulating layer on the connection portion of the external electrode and disposing the plating layer on the band portion of the external electrode, it is possible to prevent moisture penetration from the outside, penetration of the plating solution, etc., and improve reliability. Therefore, excellent reliability can be ensured even when the average thickness of the dielectric layer 111 is 0.35 μm or less.

[0036] Therefore, when the average thickness of the dielectric layer 111 is 0.35 μm or less, the reliability improvement effect according to the present invention may be more significant. The average thickness td of the dielectric layer 111 may refer to the average thickness of the dielectric layer 111 disposed between the first and second internal electrodes 121 and 122.

[0037] The average thickness of the dielectric layer 111 can be measured by scanning an image of a cross section of the body 110 in the length and thickness direction (LT) using a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, in the scanned image, the thickness of one dielectric layer can be measured at 30 equally spaced points in the length direction to calculate an average value. The 30 equally spaced points can be designated by the capacitance forming portion Ac. Furthermore, if this average value measurement is extended to 10 dielectric layers and an average value is measured, the average thickness of the dielectric layer can be further generalized.

[0038] The main body 110 may include a capacitance forming portion Ac disposed inside the main body 110 and including a first internal electrode 121 and a second internal electrode 122 disposed to face each other with a dielectric layer 111 therebetween to form a capacitance, and cover portions 112 and 113 formed on the upper and lower sides of the capacitance forming portion Ac in a first direction. The capacitance forming portion Ac is a portion that contributes to forming the capacitance of the capacitor, and may be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 therebetween.

[0039] The cover parts 112 and 113 may include an upper cover part 112 disposed on an upper part of the capacitance forming part Ac in the first direction and a lower cover part 113 disposed on a lower part of the capacitance forming part Ac in the first direction.

[0040] The upper cover part 112 and the lower cover part 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitance forming part Ac in the thickness direction, respectively, and may basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0041] The upper cover part 112 and the lower cover part 113 do not include internal electrodes and may include the same material as the dielectric layer 111. That is, the upper cover part 112 and the lower cover part 113 may include a ceramic material, for example, a barium titanate (BaTiO)-based ceramic material.

[0042] Meanwhile, the average thickness of the covers 112, 113 does not need to be particularly limited. However, to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average thickness tc of the covers 112, 113 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, it is possible to prevent penetration of moisture and plating solution from the outside and improve reliability, so that excellent reliability can be ensured even when the average thickness tc of the covers 112, 113 is 15 μm or less.

[0043] The average thickness tc of the cover parts 112, 113 may refer to the size in the first direction, and may be the average value of the size in the first direction of the cover parts 112, 113 measured at five equally spaced points on the top or bottom of the capacitance forming part Ac.

[0044] In addition, margin portions 114, 115 may be arranged on the side surfaces of the capacitance forming portion Ac. The margin portions 114, 115 may include a first margin portion 114 arranged on the fifth surface 5 of the main body 110 and a second margin portion 115 arranged on the sixth surface 6. That is, the margin portions 114, 115 may be arranged on both end surfaces in the width direction of the main body 110.

[0045] 3, the margin portions 114 and 115 may refer to regions between both ends of the first and second internal electrodes 121 and 122 and the boundary surface of the body 110 in a cross-section of the body 110 cut in the width-thickness (WT) direction. The margin portions 114 and 115 may basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0046] The margin portions 114, 115 may be formed by applying a conductive paste to the ceramic green sheets except for the areas where the margin portions are to be formed to form internal electrodes. In addition, in order to suppress steps due to the internal electrodes 121, 122, the margin portions 114, 115 may be formed by cutting the laminated internal electrodes so that they are exposed on the fifth and sixth surfaces 5, 6 of the main body, and then laminating a single dielectric layer or two or more dielectric layers in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac.

[0047] Meanwhile, the width of the margin portions 114, 115 does not need to be particularly limited. However, to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average width of the margin portions 114, 115 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, it is possible to prevent penetration of moisture and plating solution from the outside, thereby improving reliability. Therefore, excellent reliability can be ensured even when the average width of the margin portions 114, 115 is 15 μm or less.

[0048] The average width of the margin portions 114, 115 may refer to the average size of the margin portions 114, 115 in the third direction, and may be the average value of the sizes of the margin portions 114, 115 in the third direction measured at five equally spaced points on the side of the capacitance forming portion Ac.

[0049] The internal electrodes 121 and 122 are alternately stacked with the dielectric layers 111. The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are alternately arranged to face each other with the dielectric layer 111 constituting the body 110 sandwiched therebetween, and may be exposed to third and fourth surfaces 3 and 4 of the body 110, respectively.

[0050] 3, the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. A first external electrode 131 may be disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0051] That is, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrodes 121 may be formed at a predetermined distance apart on the fourth surface 4, and the second internal electrodes 122 may be formed at a predetermined distance apart on the third surface 3.

[0052] At this time, the first and second internal electrodes 121 and 122 may be electrically isolated from each other by the dielectric layer 111 disposed therebetween. The body 110 may be formed by alternately stacking ceramic green sheets on which the first internal electrodes 121 are printed and ceramic green sheets on which the second internal electrodes 122 are printed, and then firing the stacked sheets.

[0053] There are no particular limitations on the material forming the internal electrodes 121 and 122, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0054] The internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes, which may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, on a ceramic green sheet. The conductive paste for internal electrodes may be printed by screen printing or gravure printing, but the present invention is not limited thereto.

[0055] On the other hand, there is no need to particularly limit the average thickness te of the internal electrodes 121, 122. However, when the internal electrodes are generally formed to a thickness of less than 0.6 μm, there is a risk of reliability decreasing, especially when the thickness of the internal electrodes is 0.35 μm or less.

[0056] According to one embodiment of the present invention, by disposing an insulating layer on the connection portion of the external electrode and disposing a plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture and plating solution from the outside and improve reliability, so that excellent reliability can be ensured even when the average thickness of the internal electrodes 121, 122 is 0.35 μm or less. Therefore, when the average thickness of the internal electrodes 121, 122 is 0.35 μm or less, the effects of the present invention are more pronounced, and it is possible to more easily achieve miniaturization and high capacity of multilayer electronic components.

[0057] The average thickness te of the internal electrodes 121, 122 may refer to the average thickness of the internal electrodes 121, 122. The average thickness of the internal electrodes 121, 122 can be measured by scanning an image of a cross section of the body 110 in the length and thickness direction (LT) using a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, in the scanned image, the thickness of one internal electrode can be measured at 30 equally spaced points in the length direction to calculate an average value. The 30 equally spaced points can be designated as the capacitance forming portion Ac. Furthermore, if this average measurement is extended to 10 internal electrodes, the average thickness of the internal electrodes can be further generalized.

[0058] The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110. The external electrodes 131 and 132 may include first and second external electrodes 131 and 132 disposed on the third and fourth surfaces 3 and 4 of the body 110, respectively, and connected to the first and second internal electrodes 121 and 122, respectively.

[0059] The external electrodes 131 and 132 may include a first external electrode 131 including a first connection portion 131a disposed on the third surface and a first band portion 131b extending from the first connection portion to a portion of the first surface, and a second external electrode 132 including a second connection portion 132a disposed on the fourth surface and a second band portion 132b extending from the second connection portion to a portion of the first surface. The first connection portion 131a may be connected to the first internal electrode 121 on the third surface, and the second connection portion 132a may be connected to the second internal electrode 122 on the fourth surface.

[0060] The first external electrode 131 may include a third band portion 131c extending from the first connection portion 131a to a portion of the second surface, and the second external electrode 132 may include a fourth band portion 132c extending from the second connection portion 132a to a portion of the second surface. The first external electrode 131 may include a first side band portion extending from the first connection portion 131a to a portion of the fifth and sixth surfaces, and the second external electrode 132 may include a second side band portion extending from the second connection portion 132a to a portion of the fifth and sixth surfaces.

[0061] However, the third band portion, fourth band portion, first side band portion, and second side band portion may not be essential components of the present invention. The first and second external electrodes 131 and 132 do not have to be arranged on the second surface, nor on the fifth and sixth surfaces. By not arranging the first and second external electrodes 131 and 132 on the second surface, the first and second external electrodes 131 and 132 may be arranged below an extension of the second surface of the main body. Furthermore, the first and second connecting portions 131a and 132a may be arranged spaced apart from the fifth and sixth surfaces, and the first and second connecting portions 131a and 132a may be arranged spaced apart from the second surface. Furthermore, the first and second band portions 131b and 132b may also be arranged spaced apart from the fifth and sixth surfaces.

[0062] Meanwhile, when the first and second external electrodes 131, 132 include the third and fourth band portions 131c, 132c, an insulating layer is illustrated disposed on the third and fourth band portions 131c, 132c, but this is not limitative, and a plating layer may be disposed on the third and fourth band portions 131c, 132c to improve ease of mounting. Furthermore, the first and second external electrodes 131, 132 may include the third and fourth band portions 131c, 132c but may not include side band portions, in which case the first and second connection portions 131a, 132a and the first to fourth band portions 131a, 132b, 131c, 132c may be spaced apart from the fifth and sixth surfaces.

[0063] In this embodiment, the multilayer electronic component 1000 has a structure having two external electrodes 131 and 132, but the number and shape of the external electrodes 131 and 132 can be changed depending on the shape of the internal electrodes 121 and 122 and other purposes.

[0064] Meanwhile, the external electrodes 131 and 132 may be formed using any material that has electrical conductivity, such as a metal, and the specific material may be determined taking into consideration electrical properties, structural stability, etc., and may further have a multi-layer structure.

[0065] The external electrodes 131 and 132 may be fired electrodes containing a conductive metal and glass, or may be resin-based electrodes containing a conductive metal and resin.

[0066] The external electrodes 131 and 132 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body, or may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0067] The conductive metal contained in the external electrodes 131, 132 may be, but is not limited to, a material with excellent electrical conductivity. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. Preferably, the external electrodes 131, 132 may contain one or more of Ni and Ni alloys. This may further improve connectivity with the internal electrodes 121, 122 containing Ni.

[0068] The insulating layer 151 may be disposed on the first and second connecting portions 131a and 132a. The first and second connecting portions 131a and 132a are portions connected to the internal electrodes 121 and 122, and therefore may serve as a path for the penetration of a plating solution during a plating process or moisture during actual use. In the present invention, the insulating layer 151 is disposed on the connecting portions 131a and 132a, thereby preventing the penetration of moisture or plating solution from the outside.

[0069] The insulating layer 151 may be disposed to be in contact with the first and second plating layers 141 and 142. In this case, the insulating layer 151 may be in contact with the first and second plating layers 141 and 142 in a manner that partially covers the edges of the first and second plating layers 141 and 142, or the first and second plating layers 141 and 142 may be in contact with the insulating layer 151 in a manner that partially covers the edges of the insulating layer 151.

[0070] The insulating layer 151 may be disposed on the first and second connecting portions 131a and 132a and may be disposed to cover the second surface and the third and fourth band portions 131c and 132c. In this case, the insulating layer 151 may be disposed to cover the regions of the second surface where the third and fourth band portions 131c and 132c are not disposed, and the third and fourth band portions 131c and 132c. As a result, the insulating layer 151 covers the regions where the ends of the third and fourth band portions 131c and 132c contact the main body 110, blocking a path for moisture penetration and further improving moisture resistance reliability.

[0071] The insulating layer 151 may be disposed on the second surface and extended to the first and second connection portions 131a and 132a. If the external electrodes 131 and 132 are not disposed on the second surface, the insulating layer may be disposed to cover the entire second surface. Meanwhile, the insulating layer 151 does not necessarily have to be disposed on the second surface. The insulating layer may be disposed on part or all of the second surface. Alternatively, the insulating layer may be divided into two parts, each disposed on the first and second connection portions 131a and 132a. If the insulating layer is not disposed on the entire second surface, it may be disposed below an extension of the second surface. If the insulating layer is not disposed on the second surface, it may be extended to the fifth and sixth surfaces on the first and second connection portions 131a and 132a to form a single insulating layer.

[0072] Furthermore, the insulating layer 151 may be disposed to cover the first and second side band portions and parts of the fifth and sixth surfaces, and in this case, parts of the fifth and sixth surfaces that are not covered by the insulating layer 151 may be exposed to the outside.

[0073] Furthermore, insulating layer 151 may be arranged to cover all of the first and second side band portions and the fifth and sixth surfaces, in which case moisture resistance reliability can be improved because the fifth and sixth surfaces are not exposed to the outside, and connecting portions 131a and 132a are not directly exposed to the outside, improving the reliability of multilayer electronic component 1000. More specifically, the insulating layer can cover all of the first and second side band portions and all of the fifth and sixth surfaces except for the areas where the first and second side band portions are formed.

[0074] The insulating layer 151 can prevent the formation of plating layers 141 and 142 on the external electrodes 131 and 132 on which the insulating layer 151 is disposed, and can also improve sealing properties to minimize penetration of moisture, plating solution, etc. from the outside.

[0075] The insulating layer 151 may include a silicone-based resin. Conventionally, glass-based materials have been used for insulating layers. However, due to the characteristics of glass-based materials, significant agglomeration occurs during sintering, making it difficult to form a uniform film. Furthermore, the sintering process requires heat, which generates stress within the body and can lead to cracks or delamination. When using an insulating layer containing a glass-based material, the insulating layer containing the glass-based material is fired after the external electrodes. However, during the firing process, the metal material of the external electrodes may diffuse into the internal electrodes, potentially causing radial cracks. Furthermore, glass-based materials are generally hard, making them susceptible to cracking even with a small impact.

[0076] The present invention aims to solve the problems inherent in glass-based insulating layers by using a silicone-based resin instead of a glass-based material for the insulating layer. Silicon-based resin refers to a thermosetting synthetic resin produced by polymerizing an organic derivative of silicon. Silicon-based resins can be cured at temperatures below 400°C, which is relatively lower than the sintering temperature of glass-based materials, thereby suppressing cracks due to thermal shrinkage and radiation cracks due to metal diffusion. Furthermore, while glass-based insulating layers must be formed to a thickness of at least several microns, insulating layers made of silicone-based resins have the advantage of being easily adjustable in thickness from a few nanometers to several microns. Furthermore, unlike glass-based, acrylic, and epoxy resins, silicone-based resins have excellent water repellency, thereby effectively preventing penetration of plating solutions. Silicon-based resins also have excellent bonding strength with substrates. In particular, when hydroxyl groups are present on the surface of a substrate, they can easily bond with the hydroxyl groups during deposition, further enhancing their bonding strength with the substrate. In addition, it is difficult to form an insulating layer using acrylic resins and epoxy resins by vapor phase deposition and liquid phase deposition methods, but silicone resins have the advantage of being easy to form by vapor phase deposition and liquid phase deposition, and have the advantage of being able to apply various formation methods.

[0077] Silicon-based resins can contain siloxane bonds (Si-O bonds) in which silicon (Si) atoms are bonded to oxygen (O) atoms, which allows the silicone-based resins to exhibit excellent heat resistance, chemical resistance, and durability.

[0078] While common resins such as acrylic resins and epoxy resins have a carbon backbone, the molecular structure of silicon resins has a siloxane bond (Si-O bond) as the backbone, and they can have a structure in which methyl groups, phenyl groups, hydroxyl groups, etc. are added.

[0079] Whether or not a silicon-based resin contains a siloxane bond (Si-O bond) can be confirmed by checking whether or not a peak corresponding to the siloxane bond (Si-O bond) appears during analysis using FT-IR, GC-MS (gas chromatograph-mass spectrometer), etc.

[0080] In one embodiment, the silicone-based resin may contain a methyl group (-CH3), which significantly improves heat resistance, allowing the multilayer electronic component 1000 to be used in high-temperature environments and improving high-temperature reliability.

[0081] Meanwhile, the content of the silicone-based resin contained in the insulating layer 151 does not need to be particularly limited, but may be, for example, 10 wt% or more. If the content of the silicone-based resin is less than 10 wt%, it may be vulnerable to external impact. In contrast, the upper limit of the content of the silicone-based resin contained in the insulating layer 151 does not need to be particularly limited, and the insulating layer 151 may be made of silicone-based resin, excluding impurities.

[0082] In one embodiment, the insulating layer 151 may contain, in addition to a silicone-based resin, a ceramic additive such as at least one selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. The ceramic additive has excellent bonding strength with the dielectric material contained in the main body 100 and the glass contained in the external electrodes 131 and 132, and therefore may improve bonding strength between the main body 100 and the external electrodes 131 and 132.

[0083] In this case, the content of the ceramic additive may be 10 wt% or less (excluding 0 wt%). If the content of the ceramic additive exceeds 10 wt%, the multilayer electronic component may be vulnerable to external impacts and may have reduced strength.

[0084] The method for forming the insulating layer 151 is not particularly limited. For example, after the external electrodes 131 and 132 are formed on the main body 100, the insulating layer 151 may be formed by printing a silicone-based resin, transferring a silicone-based resin sheet, or dipping in a paste containing a silicone-based resin. Furthermore, since silicone-based resin can be easily formed by vapor phase deposition or liquid phase deposition, the insulating layer 151 may be formed by vapor phase deposition or liquid phase deposition. Alternatively, the insulating layer 151 may be formed by applying one or more of the above methods.

[0085] In one embodiment, the insulating layer 151 is disposed so as to be in direct contact with the first and second external electrodes 131, 132, and the first and second external electrodes 131, 132 may include a conductive metal and glass. As a result, the plating layers 141, 142 do not need to be disposed in the areas of the outer surfaces of the first and second external electrodes 131, 132 where the insulating layer 151 is disposed, thereby effectively preventing the external electrodes from being corroded by a plating solution.

[0086] In this case, the first plating layer 141 may be disposed to cover the end of the insulating layer 151 located on the first external electrode 131, and the second plating layer 142 may be disposed to cover the end of the insulating layer 151 located on the second external electrode 132. By forming the insulating layer 151 before forming the plating layers 141, 142 on the external electrodes 131, 132, it is possible to more reliably prevent penetration of a plating solution during the formation of the plating layers. By forming the insulating layer before the plating layer, it is possible to achieve a configuration in which the plating layers 141, 142 cover the end of the insulating layer 151. Silicon-based resins have excellent water repellency, unlike glass-based, acrylic-based, and epoxy-based resins. Therefore, by forming the insulating layer 151 first, it is possible to effectively prevent penetration of a plating solution during the plating process.

[0087] In one embodiment, the insulating layer 151 is disposed so as to be in direct contact with the first and second external electrodes 131, 132, and the first and second external electrodes 131, 132 may contain a conductive metal and a resin. As a result, the plating layers 141, 142 do not need to be disposed in the areas of the outer surfaces of the first and second external electrodes 131, 132 where the insulating layer 151 is disposed, which effectively prevents the external electrodes from being corroded by the plating solution.

[0088] In this case, the first plating layer 141 may be disposed to cover the end of the insulating layer 151 located on the first external electrode 131, and the second plating layer 142 may be disposed to cover the end of the insulating layer 151 located on the second external electrode 132. By forming the insulating layer 151 before forming the plating layers 141, 142 on the external electrodes 131, 132, it is possible to more reliably prevent penetration of a plating solution during the formation of the plating layers. By forming the insulating layer before the plating layer, it is possible to have the plating layers 141, 142 cover the end of the insulating layer 151. Silicon-based resins have excellent water repellency, unlike glass-based, acrylic, and epoxy-based resins. Therefore, by forming the insulating layer 151 first, it is possible to effectively prevent penetration of a plating solution during the plating process.

[0089] In one embodiment, the average thickness t2 of the insulating layer 151 may be 20 nm or more and 2 μm or less. While a glass-based insulating layer must be formed to a thickness of at least several μm, an insulating layer made of a silicone-based resin can easily be adjusted to a thickness of several nm to several μm. Furthermore, while it is difficult to form an insulating layer using acrylic resin or epoxy resin by vapor deposition or liquid deposition, a silicone-based resin can be formed by vapor deposition or liquid deposition. Therefore, using a silicone-based resin not only allows for a thin insulating layer, but also ensures sufficient moisture resistance reliability due to its excellent water repellency. If the average thickness t2 of the insulating layer 151 is less than 20 nm, the effects of suppressing cracks due to thermal shrinkage, radial cracks due to metal diffusion, and the like, and the effects of improving moisture resistance reliability may not be sufficiently ensured.

[0090] On the other hand, if the average thickness t2 of the insulating layer 151 exceeds 2 μm, the overall size of the multilayer electronic component may become large, which may result in a decrease in capacitance per unit volume. The average thickness t2 of the insulating layer 151 may be an average value of thicknesses measured at five equally spaced points on the first and second connecting portions 131a and 132a. More specifically, the average thickness t2 may be an average value of thicknesses of the insulating layer measured at the center point in the first direction of the first and second connecting portions 131a and 132a, two points spaced 5 μm apart in the first direction from the center point in the first direction, and two points spaced 10 μm apart in the first direction.

[0091] The first and second plating layers 141 and 142 may be disposed on the first and second band portions 131b and 132b, respectively. The plating layers 141 and 142 may improve mounting characteristics, and by disposing the plating layers 141 and 142 on the band portions 131b and 132b, mounting space may be minimized and reliability may be improved by minimizing penetration of a plating solution into the internal electrodes. One end of the first and second plating layers 141 and 142 may contact the first surface, and the other end may contact the insulating layer 151.

[0092] The type of the plating layers 141, 142 is not particularly limited, and may be a plating layer containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and alloys thereof, or may be formed of a plurality of layers. As a more specific example of the plating layers 141, 142, the plating layers 141, 142 may be Ni plating layers or Sn plating layers, or may be formed in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the first and second band portions 131b, 132b.

[0093] In one embodiment, the first and second plating layers 141, 142 may be disposed so as to extend to partially cover the first and second connection portions 131a, 132a, respectively. When the average size in the first direction from the first internal electrode 121, 122 that is closest to the first surface 1 is defined as H1, and the average size in the first direction from an extension of the first surface 1 to the ends of the first and second plating layers 141, 142 that are disposed on the first and second connection portions 131a, 132a is defined as H2, the relationship H1>H2 may be satisfied. This can suppress penetration of a plating solution into the internal electrodes during a plating process, thereby improving reliability.

[0094] H1 and H2 may be average values ​​measured at a cross section (LT cross section) cut in the first and second directions at five points equally spaced in the third direction on the body 110. H1 may be an average value measured at a point where the internal electrode arranged closest to the first surface 1 is connected to the external electrode in each cross section, and H2 may be an average value measured based on an end of the plating layer that contacts the external electrode, and the extension line of the first surface that serves as the reference when measuring H1 and H2 may be the same.

[0095] In one embodiment, the first plating layer 141 may be disposed so as to cover the end of the insulating layer 151 that is disposed on the first external electrode 131, and the second plating layer 142 may be disposed so as to cover the end of the insulating layer 151 that is disposed on the second external electrode 132. This may strengthen the bonding strength between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0096] In one embodiment, the insulating layer 151 may be arranged to cover the end of the first plating layer 141 that is located on the first external electrode 131, and the insulating layer 151 may be arranged to cover the end of the second plating layer 142 that is located on the second external electrode 132. This may strengthen the bonding strength between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0097] In one embodiment, when the average size in the second direction of the main body 110 is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the relationships 0.2≦B1 / L≦0.4 and 0.2≦B2 / L≦0.4 can be satisfied.

[0098] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient bonding strength. On the other hand, if B2 / L is more than 0.4, leakage current may occur between the first band portion 131b and the second band portion 132b under high voltage, and the first band portion 131b and the second band portion 132b may be electrically connected due to plating bleeding during the plating process. B1, B2, and L may be average values ​​measured at a cross section (LT cross section) obtained by cutting the main body 110 in the first and second directions at five points equally spaced in the third direction.

[0099] Referring to FIG. 5 which shows a mounting substrate 1100 on which a laminated electronic component 1000 is mounted, the plating layers 141, 142 of the laminated electronic component 1000 can be joined to electrode pads 181, 182 arranged on a substrate 180 by solders 191, 192.

[0100] On the other hand, when the internal electrodes 121, 122 are stacked in the first direction, the multilayer electronic component 1000 can be horizontally mounted on the substrate 180 so that the internal electrodes 121, 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and when the internal electrodes 121, 122 are stacked in the third direction, the multilayer electronic component can be vertically mounted on the substrate so that the internal electrodes 121, 122 are perpendicular to the mounting surface.

[0101] There is no particular limitation on the size of the multilayer electronic component 1000. However, in order to simultaneously achieve miniaturization and high capacitance, the thicknesses of the dielectric layers and internal electrodes must be reduced and the number of layers must be increased. Therefore, in a multilayer electronic component 1000 having a size of 1005 (length x width, 1.0 mm x 0.5 mm) or less, the effect of improving reliability and capacitance per unit volume according to the present invention can be more pronounced.

[0102] Therefore, taking into consideration manufacturing errors, external electrode sizes, etc., the reliability improvement effect according to the present invention can be more significant when the length of the multilayer electronic component 1000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the multilayer electronic component 1000 may refer to the maximum size of the multilayer electronic component 1000 in the second direction, and the width of the multilayer electronic component 1000 may refer to the maximum size of the multilayer electronic component 1000 in the third direction.

[0103] FIG. 6 is a schematic perspective view of a multilayer electronic component 1001 according to an embodiment of the present invention, and FIG. 7 is a cross-sectional view taken along line II-II' in FIG. 6. Referring to FIGS. 6 and 7, in the multilayer electronic component 1001 according to an embodiment of the present invention, the first and second plating layers 141-1 and 142-1 may be disposed below an extension line E1 of the first surface. This minimizes the height of the solder during mounting, thereby minimizing the mounting space. In addition, the insulating layer 151-1 may be disposed below the extension line of the first surface so as to contact the first and second plating layers 141-1 and 142-1.

[0104] FIG. 8 schematically shows a perspective view of a stacked electronic component 1002 according to an embodiment of the present invention, and FIG. 9 is a cross-sectional view taken along line III-III' of FIG. 8. Referring to FIGS. 8 and 9, a stacked electronic component 1002 according to an embodiment of the present invention may be disposed on a first surface 1 and further include an additional insulating layer 161 disposed between a first band portion 131b and a second band portion 132b. Thereby, leakage current or the like that may occur between the first band portion 131b and the second band portion 132b under a high voltage current can be prevented.

[0105] The type of the additional insulating layer 161 does not need to be particularly limited. For example, the additional insulating layer 161 may include a silicon-based resin similar to the insulating layer 151. However, it is not necessary to limit the additional insulating layer 161 and the insulating layer 151 to the same material, and they may be formed of different materials. For example, it may include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., and may include glass. Further, the additional insulating layer 161 may include one or more selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. as additives in addition to the polymer resin. Thereby, the bonding strength with the main body or the external electrode can be improved.

[0106] FIG. 10 schematically shows a perspective view of a stacked electronic component 1003 according to an embodiment of the present invention, and FIG. 11 is a cross-sectional view taken along line IV-IV' of FIG. 10. Referring to FIGS. 10 and 11, for a stacked electronic component 1003 according to an embodiment, when the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-3 and 142-3 disposed on the first and second connection portions 131a and 132a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0107] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0108] H1, H2, and T may be values obtained by averaging the values measured in the cross-section (L-T cross-section) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 may be a value obtained by averaging the values measured at the points where the internal electrode closest to the first surface 1 in each cross-section is connected to the external electrode, H2 may be a value obtained by averaging the values measured based on the end of the plating layer in contact with the external electrode in each cross-section, and the extension line of the first surface serving as a reference during the measurement of H1 and H2 may be the same. Also, T may be a value obtained by averaging the values measured after measuring the maximum size of the main body 110 in the first direction in each cross-section.

[0109] FIG. 12 schematically shows a perspective view of a multilayer electronic component 1004 according to an embodiment of the present invention, and FIG. 13 is a cross-sectional view taken along the line V-V' of FIG. 12. Referring to FIGS. 12 and 13, in the multilayer electronic component 1004 according to an embodiment of the present invention, the average length B1 of the first band portion 131b-4 may be longer than the average length B3 of the third band portion 131c-4, and the average length of the second band portion 132b-4 may be longer than the average length B4 of the fourth band portion 132c-4. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0110] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 131b-4 is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 132b-4 is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the third band portion 131c-4 is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the fourth band portion 132c-4 is B4, B3 < B1 and B4 < B2 can be satisfied.

[0111] In this case, when the average size of the body 110 in the second direction is L, the following relationships may be satisfied: 0.2≦B1 / L≦0.4 and 0.2≦B2 / L≦0.4. B1, B2, B3, B4, and L may be average values ​​measured on a cross section (LT cross section) obtained by cutting the body 110 in the first and second directions at five points equally spaced in the third direction.

[0112] The first external electrode 131-4 may include a first side band portion extending from the first connection portion 131a-4 to portions of the fifth and sixth surfaces, and the second external electrode 132-4 may include a second side band portion extending from the second connection portion 132a-4 to portions of the fifth and sixth surfaces. The sizes of the first and second side band portions in the second direction may gradually increase toward the first surface. That is, the first and second side band portions may be arranged in a tapered or trapezoidal shape.

[0113] Furthermore, when the average size in the second direction from an extension of the third surface to an end of the third band portion 131c-4 is B3, the average size in the second direction from an extension of the fourth surface to an end of the fourth band portion 132c-4 is B4, the average size in the second direction of the region where the third surface and the second internal electrode 122 are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode 121 are separated is G2, it is possible to satisfy B3≦G1 and B4≦G2. This makes it possible to minimize the volume occupied by the external electrodes and increase the capacitance per unit volume of the multilayer electronic component 1004.

[0114] The above G1 and G2 can be defined as the average value of the size in the second direction measured up to the third plane for any five second internal electrodes located at the center in the first direction in a cross section of the body cut in the first and second directions at the center in the third direction, and G1 can be defined as the average value of the size in the second direction measured up to the fourth plane for any five first internal electrodes located at the center in the first direction.

[0115] Furthermore, it can be further generalized by determining G1 and G2 in a cross section (LT cross section) obtained by cutting the main body 110 in the first and second directions at five points equally spaced in the third direction, and taking the average values ​​as G1 and G2.

[0116] However, it is not intended that the present invention is limited to B3≦G1 and B4≦G2, and cases where B3 ≧ G1 and B4 ≧ G2 are satisfied may also be included in one embodiment of the present invention. Thus, in one embodiment, when the average size in the second direction from an extension of the third surface to an end of the third band portion is B3, the average size in the second direction from an extension of the fourth surface to the end of the fourth band portion is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, the relationships B3 ≧ G1 and B4 ≧ G2 may be satisfied.

[0117] In one embodiment, when the average size in the second direction from an extension of the third surface E3 to the end of the first band portion is B1 and the average size in the second direction from an extension of the fourth surface E3 to the end of the second band portion is B2, B1 ≧ G1 and B2 ≧ G2 can be satisfied, thereby improving the bonding strength of the multilayer electronic component 1004 to the substrate 180.

[0118] Fig. 14 is a schematic perspective view of a multilayer electronic component 1005 according to an embodiment of the present invention, and Fig. 15 is a cross-sectional view taken along line VI-VI' in Fig. 14. Referring to Figs. 14 and 15, the first and second external electrodes 131-5 and 132-5 of the multilayer electronic component 1005 according to an embodiment of the present invention may be arranged on the third, fourth, and first surfaces, respectively, rather than on the second surface, forming an L-shape. That is, the first and second external electrodes 131-5 and 132-5 may be arranged below an extension of the second surface.

[0119] The first external electrode 131-5 may include a first connecting portion 131a-5 disposed on the third surface 3 and a first band portion 131b-5 extending from the first connecting portion 131a-5 to a portion of the first surface 1, and the second external electrode 132-5 may include a second connecting portion 132a-5 disposed on the fourth surface 4 and a second band portion 132b-5 extending from the second connecting portion 132a-5 to a portion of the first surface 1. The external electrodes 131-5 and 132-5 are not disposed on the second surface 2, and the insulating layer 151-5 may be disposed to cover the entire second surface 2. This minimizes the volume occupied by the external electrodes 131-5 and 132-5, thereby further improving the capacitance per unit volume of the laminated electronic component 1005. However, the insulating layer 151-5 does not need to be limited to covering the entire second surface 2, and may have a form in which the insulating layer does not cover part or all of the second surface 2, but is separated and covers the first and second connection portions 131a-5, 132a-5 respectively.

[0120] Furthermore, the insulating layer 151-5 is arranged to cover a portion of the fifth and sixth surfaces, thereby further improving reliability. In this case, the portions of the fifth and sixth surfaces that are not covered by the insulating layer 151-5 can be exposed to the outside. Furthermore, the insulating layer 151-5 can be arranged to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, thereby further improving moisture resistance reliability.

[0121] A first plating layer 141-5 is disposed on the first band portion 131b-5, and a second plating layer 142-5 is disposed on the second band portion 132b-5, and the first and second plating layers 141-5, 142-5 may be disposed to extend to a portion of the first and second connecting portions 132a-5, 132b-5. In this case, the external electrodes 131-5, 132-5 may not be disposed on the fifth and sixth surfaces 5, 6. In other words, the external electrodes 131-5, 132-5 may be disposed only on the third, fourth, and first surfaces.

[0122] From the first surface 1 to the internal electrodes 121 and 122, when the average size in the first direction from the internal electrode closest to the first surface 1 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-5 and 142-5 disposed on the first and second connection portions 131a-5 and 132a-5 is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength, and an increase in the area where the external electrodes 131-5 and 132-5 contact the plating layers 141-5 and 142-5 can be suppressed, and an increase in the equivalent series resistance (ESR) can be suppressed.

[0123] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0124] Also, the first and second plating layers 141-5 and 142-5 can be arranged to cover a part of the insulating layer 151-1 on the third and fourth surfaces. That is, the plating layers 141-5 and 142-5 can be arranged to cover the ends of the insulating layer 151-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened, and the reliability of the stacked electronic component 1005 can be improved.

[0125] Also, the insulating layer 151-5 can be arranged to cover a part of the first and second plating layers 141-5 and 142-5 on the third and fourth surfaces. That is, the insulating layer 151-5 can be arranged to cover the ends of the plating layers 141-5 and 142-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened, and the reliability of the stacked electronic component 1005 can be improved.

[0126] FIG. 16 illustrates a modification of FIG. 14. Referring to FIG. 16, in a modification 1006 of the multilayer electronic component 1005 according to an embodiment of the present invention, a first additional electrode layer 134 may be disposed between the first connection portion 131a-6 and the third surface, and a second additional electrode layer 135 may be disposed between the second connection portion 132a-6 and the fourth surface. The first additional electrode layer 134 may be disposed within a range not deviating from the third surface, and the second additional electrode layer 135 may be disposed within a range not deviating from the fourth surface. The first and second additional electrode layers 134 and 135 may improve electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 131-6 and 132-6, and may have excellent bonding strength with the external electrodes 131-6 and 132-6, thereby further improving the mechanical bonding strength of the external electrodes 131-6 and 132-6.

[0127] The first and second external electrodes 131-6 and 132-6 may have an L-shape, with the first and second external electrodes not being disposed on the second surface 1. The first external electrode 131-6 may include a first connection portion 131a-6 disposed on the first additional electrode layer 134 and a first band portion 131b-6 extending from the first connection portion 131a-6 to a portion of the first surface 1, and the second external electrode 132-6 may include a second connection portion 132a-6 disposed on the second additional electrode layer 135 and a second band portion 132b-6 extending from the second connection portion 132a-6 to a portion of the first surface 1.

[0128] Meanwhile, the first and second additional electrode layers 131-6 and 132-6 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined in consideration of electrical properties, structural stability, etc. Also, the first and second additional electrode layers 131-6 and 132-6 may be fired electrodes including conductive metal and glass, or resin-based electrodes including conductive metal and resin. Also, the first and second additional electrode layers 131-6 and 132-6 may be formed by transferring a sheet including conductive metal onto the main body.

[0129] The conductive metal contained in the first and second additional electrode layers 131-6 and 132-6 may be, but is not limited to, a material with excellent electrical conductivity. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. Preferably, the first and second additional electrode layers 131-6 and 132-6 may contain one or more of Ni and Ni alloys. This may further improve connectivity with the internal electrodes 121 and 122 containing Ni.

[0130] Fig. 17 is a schematic perspective view of a multilayer electronic component 1007 according to an embodiment of the present invention, and Fig. 18 is a cross-sectional view taken along line VII-VII' in Fig. 17. Referring to Fig. 17 and Fig. 18, the average thickness t1 of the first and second plating layers 141-6 and 142-6 of the multilayer electronic component 1007 according to an embodiment of the present invention may be thinner than the average thickness t2 of the insulating layer 151-6.

[0131] Although the insulating layer 151-6 serves to prevent penetration of external moisture or plating solution, its weak connectivity with the plating layers 141-6 and 142-6 may cause delamination of the plating layers 141-6 and 142-6. When the plating layers are delaminated, the adhesion strength to the substrate 180 may be reduced. Here, delamination of the plating layers 141-6 and 142-6 may refer to partial peeling of the plating layers or physical separation from the external electrodes 131-5 and 132-5. Because the connectivity between the plating layers and the insulating layer is weak, gaps at the interfaces between the insulating layer and the plating layer may widen, foreign matter may penetrate, and the insulating layer may become vulnerable to external impacts, increasing the likelihood of delamination.

[0132] According to one embodiment of the present invention, the average thickness t1 of the plating layer can be made thinner than the average thickness t2 of the insulating layer, thereby reducing the area where the plating layer and the insulating layer contact each other, thereby suppressing the occurrence of delamination and improving the bonding strength of the multilayer electronic component 1000 to the substrate 180.

[0133] The average thickness t1 of the first and second plating layers 141-6, 142-6 may be the average value of thicknesses measured at five equally spaced points on the first and second connection portions 131a-5, 132a-5 or the first and second band portions 131b-5, 132b-5, and the average thickness t2 of the insulating layer 151-6 may be the average value of thicknesses measured at five equally spaced points on the first and second connection portions 131a-5, 132a-5.

[0134] Fig. 19 is a schematic perspective view of a multilayer electronic component 2000 according to one embodiment of the present invention, and Fig. 20 is a cross-sectional view taken along line VIII-VIII' in Fig. 19. Hereinafter, the multilayer electronic component 2000 according to one embodiment of the present invention will be described in detail with reference to Figs. 19 and 20. However, content that overlaps with the content described above may be omitted to avoid redundant description.

[0135] A multilayer electronic component 2000 according to one embodiment of the present invention includes a body 110 including a dielectric layer 111, first and second internal electrodes 121, 122 alternately disposed with the dielectric layer sandwiched therebetween, first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces and facing each other in a third direction; a first connecting electrode 231a disposed on the third surface; and a first band electrode 231b disposed on the first surface and connected to the first connecting electrode. a second external electrode 232 including a second linking electrode 232a disposed on the fourth surface and a second band electrode 232b disposed on the first surface and connected to the second linking electrode; a first insulating layer 251 disposed on the first linking electrode; a second insulating layer 252 disposed on the second linking electrode; a first plating layer 241 disposed on the first band electrode; and a second plating layer 242 disposed on the second band electrode, wherein the first and second insulating layers 251 and 252 may contain a silicone resin.

[0136] The first linking electrode 231a may be disposed on the third surface 3 and connected to the first internal electrode 121, and the second linking electrode 231b may be disposed on the fourth surface 4 and connected to the second internal electrode 122. In addition, a first insulating layer 251 may be disposed on the first linking electrode 231a', and a second insulating layer 252 may be disposed on the second linking electrode 232a.

[0137] Conventionally, external electrodes have been formed by dipping the exposed surface of the body's internal electrodes into a paste containing a conductive metal. However, external electrodes formed using the dipping method can be excessively thick at the center of the thickness. Furthermore, even if the dipping method does not cause uneven thickness of the external electrodes, the internal electrodes are exposed on the third and fourth surfaces of the body, so the external electrodes on the third and fourth surfaces are formed to a certain thickness to prevent moisture and plating solution from penetrating through the external electrodes.

[0138] In contrast, in the present invention, insulating layers 251 and 252 are placed on the connecting electrodes 231a and 232a, so that sufficient reliability can be ensured even if the thickness of the connecting electrodes 231a and 232a on the third and fourth surfaces where the internal electrodes are exposed is made thin.

[0139] The first and second connecting electrodes 231a and 232a may correspond to the third and fourth surfaces, respectively, and the surfaces of the first and second connecting electrodes 231a and 232a facing the body 110 may have the same area as the third and fourth surfaces of the body 110, respectively. The first and second connecting electrodes 231a and 232a may be arranged so as not to deviate from the third and fourth surfaces 3 and 4, respectively. The connecting electrodes 231a and 232a may be arranged so as not to extend to the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the body 110. Specifically, in one embodiment, the first and second connecting electrodes 231a and 232a may be arranged spaced apart from the fifth and sixth surfaces. This minimizes the volume occupied by the external electrodes while ensuring sufficient connectivity between the internal electrodes 121 and 122 and the external electrodes 231 and 232, thereby increasing the capacitance per unit volume of the multilayer electronic component 2000.

[0140] From this perspective, the first and second connecting electrodes 231a and 232a may be disposed apart from the second surface 2. That is, since the external electrodes 231 and 232 are not disposed on the second surface 2, the volume occupied by the external electrodes 231 and 232 can be further minimized, and the capacitance per unit volume of the multilayer electronic component 2000 can be further increased.

[0141] However, the connecting electrodes 231a and 232a may include corner portions extending to and disposed on the corners of the body 110. That is, in one embodiment, the first connecting electrode may include corner portions extending to and disposed on the first-third corner and the second-third corner, and the second connecting electrode may include corner portions extending to and disposed on the first-fourth corner and the second-fourth corner.

[0142] Furthermore, the connecting electrodes 231a, 232a may have a uniform and thinner thickness than external electrodes formed by a conventional dipping method. The method for forming the connecting electrodes 231a, 232a is not particularly limited, and may be, for example, a method of transferring a sheet containing a conductive metal and an organic material such as a binder onto the third and fourth surfaces. However, the method is not limited thereto, and the connecting electrodes 231a, 232a may be formed by plating a conductive metal onto the third and fourth surfaces. That is, the connecting electrodes 231a, 232a may be a fired layer formed by firing a conductive metal, or a plated layer.

[0143] The thickness of the connecting electrodes 231a, 232a is not particularly limited, and may be, for example, 2 to 7 μm. Here, the thickness of the connecting electrodes 231a, 232a may refer to the maximum thickness or the size of the connecting electrodes 231a, 232a in the second direction.

[0144] In one embodiment, the first and second connecting electrodes 231a and 232a may include the same metal and glass as the internal electrodes 121 and 122. When the first and second connecting electrodes 231a and 232a include the same metal as the internal electrodes 121 and 122, electrical connectivity with the internal electrodes 121 and 122 may be improved, and when the first and second connecting electrodes 231a and 232a include glass, bonding strength with the body 110 and / or the insulating layers 251 and 252 may be improved. In this case, the same metal as the internal electrodes 121 and 122 may be Ni.

[0145] The first and second insulating layers 251 and 252 are disposed on the first and second connecting electrodes 231a and 232a, respectively, and serve to prevent a plating layer from being formed on the first and second connecting electrodes 231a and 232a. The first and second insulating layers 251 and 252 also improve sealing properties and minimize penetration of moisture, plating solution, and the like from the outside. The first and second insulating layers 251 and 252 may contain a silicone resin. This further improves moisture resistance reliability and prevents cracks due to thermal contraction and radial cracks due to metal diffusion.

[0146] The first and second band electrodes 231b and 232b may be disposed on the first surface 1 of the body 110. The first and second band electrodes 231b and 232b may be electrically connected to the first and second internal electrodes 121 and 122, respectively, by contacting the first and second connecting electrodes 231a and 232a, respectively.

[0147] External electrodes formed by a conventional dipping method are thickly formed on the third and fourth surfaces and extend partially to the first, second, fifth, and sixth surfaces, making it difficult to ensure a high effective volume ratio. In contrast, according to one embodiment of the present invention, first and second connecting electrodes 231a and 232a are disposed on the surface where the internal electrodes are exposed, and first and second band electrodes 231b and 232b are disposed on the surface that is mounted on the substrate, thereby ensuring a high effective volume ratio.

[0148] On the other hand, when the internal electrodes 121, 122 are stacked in the first direction, the multilayer electronic component 2000 can be horizontally mounted on a substrate so that the internal electrodes 121, 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and when the internal electrodes 121, 122 are stacked in the third direction, the multilayer electronic component can be vertically mounted on a substrate so that the internal electrodes 121, 122 are perpendicular to the mounting surface.

[0149] The first and second band electrodes 231b, 232b may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined in consideration of electrical properties, structural stability, etc. For example, the first and second band electrodes 231b, 232b may be fired electrodes including conductive metal and glass, or may be formed by applying a paste including conductive metal and glass to the first surface of the main body, but are not limited thereto, and may be a plating layer formed by plating a conductive metal on the first surface of the main body.

[0150] The conductive metal contained in the first and second band electrodes 231b and 232b may be, but is not limited to, a material with excellent electrical conductivity. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof, or may include the same metal as the metal contained in the internal electrodes 121 and 122.

[0151] Meanwhile, in one embodiment, the first external electrode 231 may further include a third band electrode (not shown) disposed on the second surface 2 and connected to the first connecting electrode 231a, and the second external electrode 232 may further include a fourth band electrode (not shown) disposed on the second surface 2 and connected to the second connecting electrode 232a.

[0152] In one embodiment, when the distance from an extension line E3 of the third surface to an end of the first band electrode 231b is B1, the distance from an extension line E4 of the fourth surface to an end of the second band electrode 232b is B2, the distance from the extension line E4 of the fourth surface to an end of the second band electrode 232b is B3, the distance from the extension line E4 of the fourth surface to an end of the fourth band electrode (not shown) is B4, the average size in the second direction of the region where the third surface and the second internal electrode 122 are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode 121 are separated is G2, the following relationships can be satisfied: B1 ≧ G1, B3 ≦ G1, B2 ≧ G2, and B4 ≦ G2. This minimizes the volume occupied by the external electrodes, thereby increasing the capacitance per unit volume of the multilayer electronic component 2000, and also increases the area in contact with solder during mounting, thereby improving bonding strength.

[0153] However, it is not intended to limit the present invention to B1≧G1, B3≧G1, B2≧G2, and B4≦G2, and cases where B1≧G1, B3≧G1, B2≧G2, and B4≧G2 may also be included in one embodiment of the present invention. Therefore, in one embodiment, when B1 is the distance from an extension line E3 of the third surface to an end of the first band electrode 231b, B2 is the distance from an extension line E4 of the fourth surface to an end of the second band electrode 232b, B3 is the distance from the extension line E4 of the third surface to an end of the third band electrode (not shown), B4 is the distance from the extension line E4 of the fourth surface to an end of the fourth band electrode (not shown), G1 is the average size in the second direction of a region where the third surface and the second internal electrode 122 are separated, and G2 is the average size in the second direction of a region where the fourth surface and the first internal electrode 121 are separated, the relationships B1≧G1, B3≧G1, B2≧G2, and B4≧G2 may be satisfied. This allows either the first or second surface to be used as a mounting surface, improving the ease of mounting.

[0154] The first and second plating layers 241 and 242 may be disposed on the first and second band electrodes 231b and 232b. The first and second plating layers 241 and 242 serve to improve mounting characteristics. The type of the first and second plating layers 241 and 242 is not particularly limited, and they may be plating layers containing one or more of Ni, Sn, Pd, and alloys thereof, or may be formed of multiple layers.

[0155] To give a more specific example of the first and second plating layers 241, 242, the first and second plating layers 241, 242 may be Ni plating layers or Sn plating layers, or may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the first and second band electrodes 231b, 232b.

[0156] In one embodiment, the first and second plating layers 241, 242 may be disposed to extend to partially cover the first and second connecting electrodes 231a, 232a, respectively. When the average size in the first direction from the first surface 1 to the internal electrode (121, 122) closest to the first surface 1 is H1, and the average size in the first direction from the extension of the first surface 1 to the ends of the first and second plating layers 241, 242 disposed on the first and second connecting electrodes 231a, 232a is H2, H1 > H2 may be satisfied. This can suppress penetration of a plating solution into the internal electrodes during a plating process, thereby improving reliability.

[0157] In one embodiment, the first and second insulating layers 251 and 252 are disposed in direct contact with the first and second connecting electrodes 231a and 232a, respectively, and the first and second connecting electrodes 231a and 232a may include conductive metal and glass. As a result, the plating layers 241 and 242 do not need to be disposed in the areas of the outer surfaces of the first and second connecting electrodes 231a and 232a where the insulating layers 251 and 252 are disposed, thereby effectively preventing corrosion of the external electrodes by a plating solution.

[0158] In one embodiment, the first and second insulating layers 251 and 252 are disposed in direct contact with the first and second connecting electrodes 231a and 232a, respectively, and the first and second connecting electrodes 231a and 232a may include a conductive metal and a resin. This eliminates the need to dispose the plating layers 241 and 242 on the outer surfaces of the first and second connecting electrodes 231a and 232a where the insulating layers 251 and 252 are disposed, thereby effectively preventing corrosion of the external electrodes by a plating solution.

[0159] In one embodiment, the first plating layer 241 may be disposed to cover the end of the first insulating layer 251 located on the first external electrode 231, and the second plating layer 242 may be disposed to cover the end of the second insulating layer 252 located on the second external electrode 232. This may strengthen the bonding strength between the insulating layers 251, 252 and the plating layers 241, 242, thereby improving the reliability of the multilayer electronic component 3000. Furthermore, by forming the first and second insulating layers 251, 252 before forming the plating layers 241, 242 on the external electrodes 231, 232, it is possible to more reliably suppress penetration of the plating solution during the formation of the plating layers. By forming the insulating layers before the plating layers, the plating layers 241, 242 may cover the ends of the insulating layers 251, 252.

[0160] In one embodiment, the first insulating layer 251 may be arranged to cover the end of the first plating layer 241 that is located on the first external electrode 231, and the second insulating layer 252 may be arranged to cover the end of the second plating layer 242 that is located on the second external electrode 232. This may strengthen the bonding strength between the insulating layer 251 and the plating layers 241 and 242, thereby improving the reliability of the multilayer electronic component 3000.

[0161] Fig. 21 shows a modification of Fig. 19. Referring to Fig. 21, in a modification 2001 of a multilayer electronic component 2000 according to an embodiment of the present invention, first and second insulating layers 251-1 and 252-1 may be connected to each other by extending to fifth and sixth surfaces 5 and 6, respectively, to form a single insulating layer 253-1. In this case, the connected first and second insulating layers 253-1 may be disposed to cover portions of the fifth and sixth surfaces.

[0162] FIG. 22 is a schematic perspective view of a multilayer electronic component 2002 according to an embodiment of the present invention, and FIG. 23 is a cross-sectional view taken along line IX-IX' in FIG. 22. Referring to FIGS. 22 and 23, in the multilayer electronic component 2002 according to an embodiment of the present invention, the first and second plating layers 241-2 and 242-2 may be disposed below an extension of the first surface. This minimizes the height of the solder during mounting, thereby minimizing the mounting space. In addition, the first and second insulating layers 251-2 and 252-2 may be disposed below an extension of the first surface so as to contact the first and second plating layers 241-2 and 242-2.

[0163] Fig. 24 shows a modification of Fig. 22. Referring to Fig. 24, in a modification 2003 of the multilayer electronic component 2002 according to an embodiment of the present invention, the first and second insulating layers 251-3 and 252-3 may be connected to each other by extending to the fifth and sixth surfaces 5 and 6, respectively, to form a single insulating layer 253-3. In this case, the connected first and second insulating layers 253-3 may be disposed to cover the entire fifth and sixth surfaces.

[0164] Fig. 25 is a schematic perspective view of a multilayer electronic component 2004 according to an embodiment of the present invention, and Fig. 26 is a cross-sectional view taken along line X-X' in Fig. 25. Referring to Fig. 25 and Fig. 26, the multilayer electronic component 2004 according to an embodiment of the present invention may further include an additional insulating layer 261 disposed on the first surface 1 and between the first band electrode 231b and the second band electrode 232b. This can prevent leakage current, etc., that may occur between the first band electrode 231b and the second band electrode 232b under high voltage.

[0165] The type of the additional insulating layer 261 is not particularly limited. For example, the additional insulating layer 261 may contain a silicone resin, similar to the first and second insulating layers 251-2 and 252-2. However, the additional insulating layer 261 and the first and second insulating layers 251-2 and 252-2 do not have to be made of the same material and may be made of different materials. For example, the additional insulating layer 261 may contain one or more selected from the group consisting of epoxy resin, acrylic resin, ethyl cellulose, etc., or may contain glass.

[0166] Fig. 27 shows a modification of Fig. 25. Referring to Fig. 27, in a modification 2005 of the multilayer electronic component 2004 according to an embodiment of the present invention, the first and second insulating layers 251-5 and 252-5 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, so that they can be connected as a single insulating layer 253-5.

[0167] FIG. 28 schematically shows a perspective view of a stacked electronic component 2006 according to an embodiment of the present invention, and FIG. 29 is a cross-sectional view taken along line XI-XI' of FIG. 28. Referring to FIGS. 28 and 29, a stacked electronic component 2006 according to an embodiment includes a first insulating layer 251-6 disposed on the first connection electrode 231a and a second insulating layer 252-6 disposed on the second connection electrode 232a. When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 241-6 and 242-6 disposed on the first and second connection electrodes 231a and 232a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0168] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0169] FIG. 30 shows a modified example of FIG. 28. Referring to FIG. 30, in a modified example 2007 of a stacked electronic component 2006 according to an embodiment of the present invention, the first and second insulating layers 251-7 and 252-7 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, so that they can be connected as one insulating layer 253-7.

[0170] Fig. 31 is a schematic perspective view of a multilayer electronic component 2008 according to an embodiment of the present invention, and Fig. 32 is a cross-sectional view taken along line XII-XII' in Fig. 31. Referring to Figs. 31 and 32, in the multilayer electronic component 2008 according to an embodiment of the present invention, the first and second insulating layers 251-8 and 252-8 extend to the second, fifth, and sixth sides 2, 5, and 6 and are connected to each other, thereby forming a single insulating layer 253-8. As shown in Fig. 33, the insulating layer 253-8 may cover the entire second side, or may cover only portions of the fifth and sixth sides.

[0171] Fig. 33 is a schematic perspective view of a multilayer electronic component 2009 according to an embodiment of the present invention, and Fig. 34 is a cross-sectional view taken along line XIII-XIII' in Fig. 33. Referring to Figs. 35 and 36, the average thickness t1 of the first and second plating layers 241-9 and 242-9 of the multilayer electronic component 2009 according to an embodiment of the present invention may be thinner than the average thickness t2 of the first and second insulating layers 251-9 and 252-9.

[0172] According to one embodiment of the present invention, the average thickness t1 of the first and second plating layers 241-9, 242-9 can be made thinner than the average thickness t2 of the first and second insulating layers 251-9, 252-9 to reduce the area where the plating layers and insulating layers contact, thereby suppressing the occurrence of delamination and improving the bonding strength of the multilayer electronic component 2009 to the substrate 180.

[0173] The average thickness t1 of the first and second plating layers 241-9, 242-9 may be an average value of thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a, 232a or the first and second band electrodes 231b, 232b, and the average thickness t2 of the insulating layers 251-9, 252-9 may be an average value of thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a, 232a.

[0174] Fig. 35 shows a modification of Fig. 33. Referring to Fig. 35, in a modification 2010 of the multilayer electronic component 2009 according to an embodiment of the present invention, the first and second insulating layers 251-10 and 252-10 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, so that they can be connected as a single insulating layer 253-10.

[0175] FIG. 36 is a schematic perspective view of a multilayer electronic component 3000 according to one embodiment of the present invention, FIG. 37 is a cross-sectional view taken along line XIV-XIV' in FIG. 36, and FIG. 38 is an enlarged view of region K1 in FIG. 36.

[0176] 36 to 38, a multilayer electronic component 3000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121, 122 alternately arranged with the dielectric layer sandwiched therebetween, the multilayer electronic component 3000 including a main body 110 having first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction; a first connecting portion 331a disposed on the third surface of the main body; a first band portion 331b extending from the first connecting portion to a part of the first surface; a first corner portion 331b extending from the first connecting portion to a corner connecting the second surface and the third surface of the main body; a second external electrode 332 including a first connecting portion 332a disposed on the fourth surface of the main body, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to a corner connecting the second surface and the fourth surface of the main body; an insulating layer 351 disposed on the first and second connecting portions 331a, 332a and arranged to cover the second surface and the first and second corner portions; a first plating layer 341 disposed on the first band portion; and a second plating layer 342 disposed on the second band portion, wherein the first and second insulating layers may comprise a silicone-based resin.

[0177] In one embodiment, when the average size in the second direction from an extension of the third surface to an end of the first corner portion 331c is B3, the average size in the second direction from an extension of the fourth surface to an end of the second corner portion 332c is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, it is possible to satisfy B3≦G1 and B4≦G2. This minimizes the volume occupied by the external electrodes 331 and 332, and increases the capacitance per unit volume of the multilayer electronic component 3000.

[0178] In this case, when the average size in the second direction from an extension of the third surface to the end of the first band portion 331b is B1 and the average size in the second direction from an extension of the fourth surface to the end of the second band portion 332b is B2, B1 ≧ G1 and B3 ≧ G2 can be satisfied, thereby increasing the area in contact with solder during mounting and improving bonding strength.

[0179] A multilayer electronic component 3000 according to one embodiment may include a body 110 including a dielectric layer 111 and first and second internal electrodes 121, 122 alternately arranged with the dielectric layer sandwiched therebetween, the body 110 including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction. The body 110 of the multilayer electronic component 3000 may have the same configuration as the body 110 of the multilayer electronic component 1000, except that an end portion of the first or second surface of the body has a contracted shape, as will be described later.

[0180] The external electrodes 331 and 332 may be disposed on the third surface 3 and the fourth surface 4 of the body 110. The external electrodes 331 and 332 may include first and second external electrodes 331 and 332 disposed on the third and fourth surfaces 3 and 4 of the body 110, respectively, and connected to the first and second internal electrodes 121 and 122, respectively.

[0181] The external electrodes 331 and 332 may include a first external electrode 331 including a first connecting portion 331a disposed on the third surface, a first band portion 331b extending from the first connecting portion to a portion of the first surface, and a first corner portion 331c extending from the first connecting portion to a corner connecting the second surface and the third surface, and a second external electrode 132 including a second connecting portion 332a disposed on the fourth surface, a second band portion 332b extending from the second connecting portion to a portion of the first surface, and a second corner portion 332c extending from the second connecting portion to a corner connecting the second surface and the fourth surface. The first connecting portion 331a may be connected to the first internal electrode 121 at the third surface, and the second connecting portion 332a may be connected to the second internal electrode 122 at the fourth surface.

[0182] In an embodiment, the first and second connection portions 331a and 332a may be spaced apart from the fifth and sixth surfaces, thereby minimizing the specific gravity of the external electrodes 331 and 332, thereby further miniaturizing the multilayer electronic component 3000.

[0183] A marginal region where the internal electrodes 121, 122 are not disposed overlaps the dielectric layer 111, causing a step due to the thickness of the internal electrodes 121, 122, and the corners connecting the first surface and the third to fifth surfaces and / or the corners connecting the second surface and the third to fifth surfaces may have a shape that shrinks toward the center in the first direction of the main body 110 when viewed from the first surface or the second surface. Alternatively, due to shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 may have a shape that shrinks toward the center in the first direction of the main body 110 when viewed from the first surface or the second surface. Alternatively, in order to prevent chipping defects, etc., the corners connecting each surface of the main body 110 may be rounded through a separate process, so that the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces may have a rounded shape.

[0184] The corners may include a 1-3 corner c1-3 connecting the first and third faces, a 1-4 corner c1-4 connecting the first and fourth faces, a 2-3 corner c2-3 connecting the second and third faces, and a 2-4 corner c2-4 connecting the second and fourth faces. In addition, the corners may include a 1-5 corner connecting the first and fifth faces, a 1-6 corner connecting the first and sixth faces, a 2-5 corner connecting the second and fifth faces, and a 2-6 corner connecting the second and sixth faces. However, in order to suppress steps caused by the internal electrodes 121, 122, if the laminated internal electrodes are cut so as to be exposed on the fifth and sixth surfaces 5, 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form margin portions 114, 115, the portions connecting the first surface with the fifth and sixth surfaces and the portions connecting the second surface with the fifth and sixth surfaces may not have a contracted shape.

[0185] Meanwhile, the first to sixth surfaces of the main body 110 may be generally flat surfaces, and the non-flat areas may be corners. Also, the areas of the external electrodes 131 and 132 that are arranged on the corners may be corner portions.

[0186] From this perspective, the first and second corner portions 331c and 332c may be disposed below an extension line E2 of the second surface, and may be disposed spaced apart from the second surface. That is, since the external electrodes 331 and 332 are not disposed on the second surface, the volume occupied by the external electrodes 331 and 332 can be further minimized, thereby further increasing the capacitance per unit volume of the multilayer electronic component 3000. In addition, the first corner portion 331c may be disposed on a portion of the 2-3 corner C2-3 connecting the third surface and the second surface, and the second corner portion 332c may be disposed on a portion of the 2-4 corner C2-4 connecting the fourth surface and the second surface.

[0187] The extension line E2 of the second surface can be defined as follows: In a length-thickness cross section (LT cross section) obtained by cutting the multilayer electronic component 3000 at the center in the width direction, seven straight lines P0, P1, P2, P3, P4, P5, P6, and P7 are drawn in the thickness direction at equal intervals in the length direction from the third surface to the fourth surface, and the line passing through the point where P2 intersects with the second surface and the point where P4 intersects with the second surface can be defined as the extension line E2 of the second surface.

[0188] Meanwhile, the external electrodes 331 and 332 may be formed using any material that has electrical conductivity, such as a metal, and the specific material may be determined taking into consideration electrical properties, structural stability, etc., and may further have a multi-layer structure.

[0189] The external electrodes 331 and 332 may be fired electrodes containing a conductive metal and glass, or may be resin-based electrodes containing a conductive metal and resin.

[0190] The external electrodes 331 and 332 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body, or by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0191] The conductive metal contained in the external electrodes 331, 332 may be, but is not limited to, a material with excellent electrical conductivity. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. Preferably, the external electrodes 331, 332 may contain one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121, 122 containing Ni.

[0192] The insulating layer 351 may be disposed on the first and second connecting portions 331a and 332a. The first and second connecting portions 331a and 332a are portions connected to the internal electrodes 121 and 122, and therefore may serve as a path for the penetration of a plating solution during a plating process or moisture during actual use. In the present invention, the insulating layer 351 is disposed on the connecting portions 331a and 332a, thereby preventing the penetration of moisture or plating solution from the outside.

[0193] The insulating layer 351 may be disposed to be in contact with the first and second plating layers 341 and 342. In this case, the insulating layer 351 may be in contact with the first and second plating layers 341 and 342 in a manner that partially covers the edges of the first and second plating layers 341 and 342, or the first and second plating layers 341 and 342 may be in contact with the insulating layer 351 in a manner that partially covers the edges of the insulating layer 351.

[0194] The insulating layer 353 may be disposed on the first and second connection portions 331a and 332a and may be disposed to cover the second surface and the first and second corner portions 331c and 332c. In addition, the insulating layer 353 covers the areas where the ends of the first and second corner portions 331c and 332c contact the main body 110, thereby blocking a path for moisture penetration, thereby further improving moisture resistance reliability.

[0195] The insulating layer 351 may be disposed on the second surface and extend to the first and second connection portions 331a and 332a. If the external electrodes 331 and 332 are not disposed on the second surface, the insulating layer may be disposed to cover the entire second surface. Meanwhile, the insulating layer 351 does not necessarily have to be disposed on the second surface. The insulating layer may be separated into two parts, each disposed on the first and second connection portions 331a and 332a. Even in this case, the insulating layer may be disposed to cover the entire first and second corner portions 331c and 332c. If the insulating layer is not disposed on the entire second surface, it may be disposed below an extension of the second surface. If the insulating layer is not disposed on the second surface, it may extend to the fifth and sixth surfaces on the first and second connection portions 331a and 332a to form a single insulating layer.

[0196] In one embodiment, the insulating layer 351 is disposed to cover a portion of the fifth and sixth surfaces to improve reliability, and the portions of the fifth and sixth surfaces that are not covered by the insulating layer may be exposed to the outside.

[0197] Furthermore, the insulating layer 351 can be arranged to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, further improving the moisture resistance reliability.

[0198] The insulating layer 351 may prevent the formation of plating layers 341, 342 on the external electrodes 331, 332 on which the insulating layer 351 is disposed, and may improve sealing properties to minimize penetration of moisture, plating solution, etc. from the outside. The components, composition, average thickness, and effects of the insulating layer 351 are similar to those of the insulating layers 151, 251, 252, and 253 included in the multilayer electronic components 1000, 2000 or various embodiments thereof, and therefore, description thereof will be omitted.

[0199] The first and second plating layers 341 and 342 may be disposed on the first and second band portions 331b and 332b, respectively. The plating layers 341 and 342 may improve mounting characteristics, and by disposing the plating layers 341 and 342 on the band portions 331b and 332b, mounting space may be minimized and reliability may be improved by minimizing penetration of a plating solution into the internal electrodes. One end of the first and second plating layers 341 and 342 may contact the first surface, and the other end may contact the insulating layer 351.

[0200] The type of plating layers 341, 342 is not particularly limited, and may be a plating layer containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and alloys thereof, or may be formed of a plurality of layers. More specifically, the plating layers 341, 342 may be Ni plating layers or Sn plating layers, or may have a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the first and second band portions 331b, 332b.

[0201] In one embodiment, the insulating layer 351 is disposed so as to be in direct contact with the first and second external electrodes 331, 332, and the first and second external electrodes 331, 332 may include conductive metal and glass. As a result, the plating layers 341, 342 do not need to be disposed in the areas of the outer surfaces of the first and second external electrodes 331, 332 where the insulating layer 351 is disposed, thereby effectively preventing corrosion of the external electrodes by the plating solution.

[0202] In one embodiment, the insulating layer 351 is disposed so as to be in direct contact with the first and second external electrodes 331, 332, and the first and second external electrodes 331, 332 may contain a conductive metal and a resin. As a result, the plating layers 341, 342 do not need to be disposed in the areas of the outer surfaces of the first and second external electrodes 331, 332 where the insulating layer 351 is disposed, thereby effectively preventing corrosion of the external electrodes by the plating solution.

[0203] In one embodiment, the first plating layer 341 may be disposed to cover the end of the insulating layer 351 located on the first external electrode 331, and the second plating layer 342 may be disposed to cover the end of the insulating layer 351 located on the second external electrode 332. This may strengthen the bonding strength between the insulating layer 351 and the plating layers 341 and 342, thereby improving the reliability of the multilayer electronic component 3000. Furthermore, by forming the insulating layer 351 before forming the plating layers 341 and 342 on the external electrodes 331 and 332, it is possible to more reliably suppress penetration of the plating solution during the formation of the plating layers. By forming the insulating layer before the plating layer, the plating layers 341 and 342 may have a configuration in which the plating layers 341 and 342 cover the end of the insulating layer 351.

[0204] In one embodiment, the insulating layer 351 may be disposed to cover the end of the first plating layer 341 that is disposed on the first external electrode 331, and the insulating layer 351 may be disposed to cover the end of the second plating layer 342 that is disposed on the second external electrode 332. This may strengthen the bonding strength between the insulating layer 351 and the plating layers 341 and 342, thereby improving the reliability of the multilayer electronic component 3000.

[0205] In one embodiment, the first and second plating layers 341, 342 may be disposed to extend to partially cover the first and second connection portions 331a, 332a, respectively. When the average size in the first direction from the first internal electrode 121, 122, which is disposed closest to the first surface 1, is defined as H1, and the average size in the first direction from an extension of the first surface 1 to the ends of the first and second plating layers 141, 142 disposed on the first and second connection portions 131a, 132a is defined as H2, H1>H2 may be satisfied. This may prevent a plating solution from penetrating into the internal electrodes during a plating process, thereby improving reliability.

[0206] In one embodiment, when the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface to the ends of the plating layers 341 and 342 disposed on the first and second connection portions 331a and 332a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved. More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0207] In one embodiment, the first and second plating layers 341 and 342 can be disposed below the extension line of the first surface. Thereby, the height of the solder during mounting can be minimized, and the mounting space can be minimized. Also, the insulating layer 351 can be disposed to extend below the extension line of the first surface and contact the first and second plating layers 341 and 342.

[0208] In one embodiment, when the average size in the second direction of the main body is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 can be satisfied.

[0209] When B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient fixing strength. On the other hand, when B2 / L exceeds 0.4, there is a risk of leakage current occurring between the first band portion 331b and the second band portion 332b under high voltage current, and there is a risk that the first band portion 331b and the second band portion 332b may be electrically connected due to plating bleeding or the like during the plating process.

[0210] In one embodiment, an additional insulating layer can be further included, which is disposed on the first surface and between the first band portion 331b and the second band portion 332b. Thereby, leakage current and the like that may occur between the first band electrode 331b and the second band electrode 332b under high voltage current can be prevented.

[0211] The type of the additional insulating layer does not need to be particularly limited. For example, the additional insulating layer can include a silicon-based resin, similar to the insulating layer 351. However, it is not necessary to limit the additional insulating layer and the insulating layer 351 to the same material, and they may be formed of different materials. For example, it may include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., and may include glass.

[0212] In one embodiment, when the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, B3 < B1 and B4 < B2 can be satisfied. The average length B1 of the first band portion 331b may be longer than the average length B3 of the first corner portion 331c, and the average length of the second band portion may be longer than the average length B4 of the second corner portion 332. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0213] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 331b is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 332b is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the first corner portion 331c is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the second corner portion 332c is B4, B3 < B1 and B4 < B2 can be satisfied.

[0214] In one embodiment, the average thickness of the first and second plating layers 341, 342 may be thinner than the average thickness of the insulating layer 351. The insulating layer 351 serves to prevent penetration of external moisture or plating solution, but its weak connectivity with the plating layers 341, 342 may cause delamination of the plating layers. Delamination of the plating layers may result in a decrease in adhesive strength with the substrate. Here, delamination of the plating layers may refer to partial peeling of the plating layers or physical separation from the external electrodes 331, 332. Weak connectivity between the plating layers and the insulating layer increases the likelihood of gaps widening at the interfaces between the insulating layer and the plating layer, increasing the likelihood of infiltration of foreign matter, and increasing vulnerability to external impacts, etc., leading to increased susceptibility to delamination.

[0215] According to one embodiment of the present invention, by making the average thickness of the plating layer thinner than the average thickness of the insulating layer, the area where the plating layer and the insulating layer contact each other can be reduced, thereby suppressing the occurrence of delamination and improving the bonding strength with the multilayer electronic component 3000.

[0216] There is no particular limitation on the size of the multilayer electronic component 3000. However, in order to simultaneously achieve miniaturization and high capacitance, the thicknesses of the dielectric layers and internal electrodes must be reduced and the number of layers must be increased, and therefore, the effects of improving reliability and capacitance per unit volume according to the present invention can be more pronounced in a multilayer electronic component 3000 having a size of 1005 (length x width, 1.0 mm x 0.5 mm) or less.

[0217] Therefore, taking into consideration manufacturing errors, external electrode sizes, etc., the reliability improvement effect according to the present invention may be more pronounced when the length of the multilayer electronic component 3000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the multilayer electronic component 3000 may refer to the maximum size of the multilayer electronic component 3000 in the second direction, and the width of the multilayer electronic component 3000 may refer to the maximum size of the multilayer electronic component 3000 in the third direction.

[0218] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various substitutions, modifications, and changes may be made by a person skilled in the art without departing from the technical spirit of the present invention as set forth in the claims, and these also fall within the scope of the present invention.

[0219] It should be noted that the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-described one embodiment does not exclude being realized in combination with features of another embodiment. For example, even if a feature described in a particular embodiment is not described in another embodiment, it can be understood as a description of the other embodiment unless there is a description that contradicts or contradicts that feature in the other embodiment.

[0220] The terms used in the present invention are merely used to describe one embodiment and are not intended to limit the present invention. In this case, the singular expression includes the plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0221] 1000, 2000, 3000: Multilayer electronic components 1100: Mounting board 110:Main body 111: Dielectric layer 112, 113: Cover part 114, 115: Margin 121, 122: Internal electrode 131, 231, 331: 1st external electrode 132, 232, 332: 2nd external electrode 134, 135: Additional electrode layer 141, 142, 241, 242, 341, 342: plating layer 151, 251, 252, 253, 351: Insulating layers 161, 261: Additional insulating layer 180: Circuit board 181, 182: Electrode pads 191, 192: Handa

Claims

**Claim 1**: A laminated electronic component comprising a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer therebetween, a main body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a part of the first surface, a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a part of the first surface, an insulating layer including a first insulating layer disposed on the first connection portion so as to be in contact with the first connection portion and a second insulating layer disposed on the second connection portion so as to be in contact with the second connection portion, a plating layer including a first plating layer disposed on the first band portion and extending to an end close to the first surface of the first insulating layer and a second plating layer disposed on the second band portion and extending to an end close to the first surface of the second insulating layer, wherein the insulating layer contains a silicon-based resin. **Claim 2**: The laminated electronic component according to claim 1, wherein the silicon-based resin contains a siloxane bond in which a silicon (Si) atom and an oxygen (O) atom are bonded. **Claim 3**: The laminated electronic component according to claim 1, wherein the silicon-based resin contains a methyl group (-CH₃). **Claim 4**: The laminated electronic component according to claim 1, wherein the insulating layer further contains one or more selected from TiO₂, BaTiO₃, Al₂O₃, SiO₂, and BaO. **Claim 5**: The laminated electronic component according to claim 1, where when an average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes is H1, and an average size in the first direction from an extension line of the first surface to an end of the plating layer disposed on the first and second connection portions is H2, H1 > H2 is satisfied. **Claim 6**: The laminated electronic component according to claim 1, where when an average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes is H1, and an average size in the first direction from an extension line of the first surface to an end of the plating layer disposed on the first and second connection portions is H2, H1 < H2 is satisfied. When the average size of the main body in the first direction is T, The multilayer electronic component according to claim 6, wherein H2 < T / 2 is satisfied.

8. The multilayer electronic component according to claim 1, wherein the first and second plating layers are disposed below the extension line of the first surface.

9. When the average size of the main body in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, The multilayer electronic component according to claim 1, which satisfies 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.

4.

10. The multilayer electronic component according to claim 1, further including an additional insulating layer disposed on the first surface and between the first band portion and the second band portion.

11. The multilayer electronic component according to claim 1, wherein the average thickness of the dielectric layer is 0.35 μm or less.

12. The multilayer electronic component according to claim 1, wherein the average thicknesses of the first and second internal electrodes are each 0.35 μm or less.

13. A capacitance forming portion including first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and a cover portion disposed on both end surfaces of the capacitance forming portion in the first direction, The multilayer electronic component according to claim 1, wherein the average size of the cover portion in the first direction is 15 μm or less.

14. The multilayer electronic component according to claim 1, wherein the average thicknesses of the first and second plating layers are thinner than the average thickness of the region disposed on the first and second connection portions of the insulating layer.

15. The multilayer electronic component according to claim 1, wherein the first plating layer is disposed so as to cover the end of the first insulating layer close to the first surface, and the second plating layer is disposed so as to cover the end of the second insulating layer close to the first surface.

16. The multilayer electronic component according to claim 1, wherein the first insulating layer is disposed so as to cover the end disposed on the first external electrode of the first plating layer, and the second insulating layer is disposed so as to cover the end disposed on the second external electrode of the second plating layer.

17. The first external electrode includes a first side surface band portion extending from the first connection portion to a part of the fifth and sixth surfaces, The second external electrode includes a second side surface band portion extending from the second connection portion to a part of the fifth and sixth surfaces. The laminated electronic component according to claim 1, wherein the sizes of the first and second side band portions in the second direction increase as they approach the first surface.

18. The laminated electronic component according to claim 1, wherein the first and second external electrodes are arranged at a distance from the fifth and sixth surfaces.

19. The laminated electronic component according to claim 1, wherein the first and second external electrodes are arranged at a distance from the second surface.

20. The laminated electronic component according to claim 1, wherein the first and second insulating layers extend to the second surface and are connected to each other.

21. The laminated electronic component according to claim 1, wherein the first and second insulating layers extend to the fifth and sixth surfaces and are connected to each other.

22. The laminated electronic component according to claim 1, wherein the insulating layer is not arranged on the second, fifth, and sixth surfaces.

23. The first external electrode includes a third band portion extending from the first connection portion to a part of the second surface, The laminated electronic component according to claim 1, wherein the second external electrode includes a fourth band portion extending from the second connection portion to a part of the second surface.

24. The main body includes a first - 3 corner connecting the first surface and the third surface, a first - 4 corner connecting the first surface and the fourth surface, a second - 3 corner connecting the second surface and the third surface, and a second - 4 corner connecting the second surface and the fourth surface, The first - 3 corner and the second - 3 corner have a form that contracts toward the center of the main body in the first direction as they approach the third surface, and the first - 4 corner and the second - 4 corner have a form that contracts toward the center of the main body in the first direction as they approach the fourth surface, The laminated electronic component according to claim 1, wherein the first external electrode includes a first corner portion extending from the first connection portion and arranged on the first - 3 corner and the second - 3 corner, and the second external electrode includes a second corner portion extending from the second connection portion and arranged on the first - 4 corner and the second - 4 corner.

25. When the average size in the second direction from the extension line of the third surface to the end of the first corner portion is B3, the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the second internal electrode are separated is G2, The multilayer electronic component according to claim 24, satisfying B3 ≤ G1 and B4 ≤ G2.

26. The first external electrode includes a first connection electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connection electrode. The multilayer electronic component according to claim 1, wherein the second external electrode includes a second connection electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connection electrode.

27. The first external electrode further includes a third band electrode disposed on the second surface and connected to the first connection electrode. The multilayer electronic component according to claim 26, wherein the second external electrode further includes a fourth band electrode disposed on the second surface and connected to the second connection electrode.

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