Laminate-type electronic component

Abstract

To provide a laminate-type electronic component which enables the increase in capacity per unit volume.SOLUTION: A laminate-type electronic component 1000' comprises: a main body 110 including dielectric layers 111 and internal electrodes 121, 122; a first external electrode 131' including a first connection part 131a', a first band part 131b' and a third band part 131c'; a second external electrode 132' including a second connection part 132a', a second band part 132b' and a fourth band part 132c'; an insulation layer 151 disposed over the first and second connection parts so as to cover the second to fourth band parts; a first plating layer 141 disposed on the first band part; and a second plating layer 142 disposed on the second band part. In the laminate-type electronic component, a first additional electrode layer 134 is disposed between the first connection part and the third face of the main body, and a second additional electrode layer 135 is disposed between the second connection part and the fourth face of the main body. The first and second external electrodes contain Cu. The first and second additional electrode layers contain Ni.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small, yet guaranteeing high capacitance, and being easy to mount, so they can be used as components in various electronic devices.

[0004] In recent years, with the miniaturization and multi-functionalization of electronic products, there has been an increasing demand for higher integration and higher capacitance of multilayer ceramic capacitors, and the space between multilayer ceramic capacitors is being minimized.

[0005] Furthermore, multilayer ceramic capacitors are increasingly being used in automobiles and infotainment systems, leading to growing demands for high reliability, high strength, and miniaturization.

[0006] To miniaturize and increase the capacitance of multilayer ceramic capacitors, it is necessary to form the internal electrodes and dielectric layers thinly and increase the number of layers. This requires minimizing the volume of parts that do not affect capacitance formation and increasing the effective volume fraction necessary to achieve the desired capacitance.

[0007] Furthermore, in order to mount as many components as possible within the limited area of ​​the circuit board, it is necessary to minimize the mounting space.

[0008] Furthermore, as multilayer ceramic capacitors become smaller and their capacitance increases, the margin thickness decreases. This makes them more susceptible to external moisture penetration or plating solution penetration, potentially leading to a decrease in reliability. Therefore, there is a need for methods to protect multilayer ceramic capacitors from external moisture penetration or plating solution penetration. [Overview of the project] [Problems that the invention aims to solve]

[0009] One of the various objectives of the present invention is to provide a stacked electronic component with improved capacity per unit volume.

[0010] One of the various objectives of the present invention is to provide a multilayer electronic component with improved reliability.

[0011] One of the various objectives of the present invention is to provide a stacked electronic component that can minimize the mounting space.

[0012] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0013] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately on either side of the dielectric layer, and comprises a body having first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction, a first external electrode including a first connecting portion on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a third band portion extending from the first connecting portion to a part of the second surface, and a second connecting portion on the fourth surface, extending from the second connecting portion to a part of the first surface The device includes a second external electrode including a second band portion and a fourth band portion extending from the second connection portion to a part of the second surface; an insulating layer disposed on the first and second connection portions and disposed to cover the second surface, the third and fourth band portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. A first additional electrode layer is disposed between the first connection portion and the third surface, and a second additional electrode layer is disposed between the second connection portion and the fourth surface. The first and second external electrodes contain Cu, and the first and second additional electrode layers may contain one or more of Ni and Ni alloys.

[0014] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately on either side of the dielectric layer, and comprises a body having first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; a first external electrode including a first connecting portion on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a third band portion extending from the first connecting portion to a part of the second surface; and a second connecting portion on the fourth surface, a second band portion extending from the second connecting portion to a part of the first surface, and a third band portion extending from the second connecting portion to a part of the second surface. The device includes a second external electrode including a fourth band portion extending to a part of the second surface, an insulating layer disposed on the first and second connection portions and arranged to cover the second surface, the third and fourth band portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion, wherein the first and second external electrodes include one or more of Ni and Ni alloys, and when H1 is the average size in a first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes, and H2 is the average size in a first direction from the extension line of the first surface to the edge of the plating layer disposed on the first and second connection portions, the condition H1 > H2 can be satisfied.

[0015] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately on either side of the dielectric layer, and comprises a body having first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction, and a first external electrode including a first connecting portion arranged on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a third band portion extending from the first connecting portion to a part of the second surface, and arranged on the fourth surface The device includes a second external electrode comprising a second connecting portion, a second band portion extending from the second connecting portion to a part of the first surface, and a fourth band portion extending from the second connecting portion to a part of the second surface; an insulating layer disposed on the first and second connecting portions and disposed to cover the second surface, the third and fourth band portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the first and second external electrodes include one or more of Ni and Ni alloys, and the third and fourth band portions may not have plating layers.

[0016] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately on either side of the dielectric layer, and comprises a body having first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; a first external electrode including a first connecting portion arranged on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a third band portion extending from the first connecting portion to a part of the second surface; and a second connecting portion arranged on the fourth surface. The device includes a second external electrode including a second band portion extending from the second connection portion to a part of the first surface, and a fourth band portion extending from the second connection portion to a part of the second surface; an insulating layer disposed on the first and second connection portions and disposed to cover the second surface, the third and fourth band portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the first and second external electrodes include one or more of Ni and Ni alloys, and the insulating layer may be disposed to extend to the second surface so as to cover the ends of the third and fourth band portions.

[0017] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately on either side of the dielectric layer, and comprises a body having first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction, a first external electrode including a first connecting portion arranged on the third surface and a first band portion extending from the first connecting portion to a part of the first surface, and a third external electrode arranged on the fourth surface The device includes a second external electrode comprising a connection portion and a second band portion extending from the second connection portion to a part of the first surface; an insulating layer disposed on the first and second connection portions and arranged to cover the second surface, the third and fourth band portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the first and second external electrodes comprise one or more of Ni and Ni alloys, and the first and second external electrodes may be arranged below the extension line of the second surface.

[0018] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately on either side of the dielectric layer, and comprises a body having first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; a first external electrode including a first connecting portion on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a first corner portion extending from the first connecting portion to the corner connecting the second and third surfaces; a second external electrode including a second connecting portion on the fourth surface, a second band portion extending from the second connecting portion to a part of the first surface, and a second corner portion extending from the second connecting portion to the corner connecting the second and fourth surfaces; and a first external electrode disposed on the first and second connecting portions, and on the second surface, first The device includes an insulating layer positioned to cover the first and second corner portions, a first plating layer positioned on the first band portion, and a second plating layer positioned on the second band portion, wherein when the average size in the second direction from the extension line of the third surface to the end of the first corner portion is B3, the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4, the average size in the second direction of the region separated from the third surface and the second internal electrode is G1, and the average size in the second direction of the region separated from the fourth surface and the first internal electrode is G2, the conditions B3≦G1 and B4≦G2 are satisfied, a first additional electrode layer is positioned between the first connection portion and the third surface, a second additional electrode layer is positioned between the second connection portion and the fourth surface, the first and second external electrodes contain Cu, and the first and second additional electrode layers may contain one or more of Ni and Ni alloys.

[0019] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, and first and second internal electrodes alternately arranged sandwiching the dielectric layer, having first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction; a main body, a first connection electrode disposed on the third surface, and a first external electrode including a first band electrode disposed on the first surface and connected to the first connection electrode; a second connection electrode disposed on the fourth surface, and a second external electrode including a second band electrode disposed on the first surface and connected to the second connection electrode; a first insulating layer disposed on the first connection electrode, a second insulating layer disposed on the second connection electrode, a first plating layer disposed on the first band electrode, and a second plating layer disposed on the second band electrode. A first additional electrode layer is disposed between the first connection electrode and the third surface, and a second additional electrode layer is disposed between the second connection electrode and the fourth surface. The first and second connection electrodes contain Cu, and the first and second additional electrode layers can contain one or more of Ni and Ni alloys.

Advantages of the Invention

[0020] One of the various advantages of the present invention is that by disposing an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, the capacitance per unit volume of the multilayer electronic component is improved and the reliability is improved.

[0021] One of the various advantages of the present invention is that the mounting space of the multilayer electronic component is minimized.

[0022] One of the various advantages of the present invention is that by including one or more of Ni and Ni alloys in the external electrode, the generation and propagation of radiation cracks are suppressed.

[0023] One of the various advantages of the present invention is that by including one or more of Ni and Ni alloys between the external electrode and the third and fourth surfaces of the main body, the generation and propagation of radiation cracks are suppressed.

[0024] However, the diverse and beneficial advantages and effects of the present invention are not limited to the above content, and can be more easily understood during the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0025] [Figure 1] It is a perspective view schematically showing a stacked electronic component according to an embodiment of the present invention. [Figure 2] It is a perspective view schematically showing the main body of the stacked electronic component of FIG. 1. [Figure 3] It is a cross-sectional view taken along I-I' of FIG. 1. [Figure 4] It is an exploded perspective view schematically showing the main body of FIG. 2 after being disassembled. [Figure 5] It is a perspective view schematically showing a substrate on which the stacked electronic component of FIG. 1 is mounted. [Figure 6] It is a perspective view schematically showing a stacked electronic component according to an embodiment of the present invention. [Figure 7] It is a cross-sectional view taken along II-II' of FIG. 6. [Figure 8] It schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 9] It is a cross-sectional view taken along III-III' of FIG. 8. [Figure 10] It schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 11] It is a cross-sectional view taken along IV-IV' of FIG. 10. [Figure 12] It schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 13] It is a cross-sectional view taken along V-V' of FIG. 12. [Figure 14] It schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 15] It is a cross-sectional view taken along VI-VI' of FIG. 14. [Figure 16]This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 17] This is a cross-sectional view along line VII-VII' in Figure 16. [Figure 18] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 19] This is a cross-sectional view along line VIII-VIII' in Figure 18. [Figure 20] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 21] This is a cross-sectional view along the line IX-IX' in Figure 20. [Figure 22] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 23] This is a cross-sectional view along line X-X' in Figure 22. [Figure 24] This shows a modified version of Figure 20. [Figure 25] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 26] This is a cross-sectional view along line XI-XI' in Figure 25. [Figure 27] This shows a modified version of Figure 25. [Figure 28] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 29] This is a cross-sectional view along line XII-XII' in Figure 26. [Figure 30] This shows a modified version of Figure 28. [Figure 31] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 32] This is a cross-sectional view along line XIII-XIII' in Figure 31. [Figure 33] This shows a modified version of Figure 31. [Figure 34] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 35] This is a cross-sectional view along line XIV-XIV' in Figure 34. [Figure 36] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 37] This is a cross-sectional view along line XV-XV' in Figure 36. [Figure 38] This shows a modified version of Figure 36. [Figure 39] This is a schematic perspective view of a stacked electronic component 3000 according to one embodiment of the present invention. [Figure 40] This is a cross-sectional view along line XVI-XVI' in Figure 39. [Figure 41] This is a magnified view of the K1 region in Figure 40. [Modes for carrying out the invention]

[0026] Preferred embodiments of the present invention will be described below with reference to the attached drawings. However, embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person with average skill in the art. Accordingly, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation.

[0027] In order to clearly explain the present invention, parts unrelated to the explanation are omitted in the drawings, thicknesses are enlarged to clearly represent various layers and regions, and components with the same function within the scope of the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a component is "included," unless otherwise stated, it does not mean that other components are excluded, but rather that other components may be included.

[0028] In drawings, the first direction can be defined as the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0029] The following describes a stacked electronic component 1000 according to one embodiment of the present invention, with reference to Figures 1 to 5.

[0030] A stacked electronic component 1000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, and comprises a body 110 having first and second surfaces 1 and 2 facing in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in a third direction, and a first connecting portion 131a located on the third surface, a first band portion 131b extending from the first connecting portion to a part of the first surface, and a third band portion extending from the first connecting portion to a part of the second surface. The device may include a first external electrode 131 including a dome portion 131c; a second external electrode 132 including a second connecting portion 132a disposed on the fourth surface, a second band portion 132b extending from the second connecting portion to a part of the first surface, and a fourth band portion 132c extending from the second connecting portion to a part of the second surface; an insulating layer 151 disposed on the first and second connecting portions and disposed to cover the second surface, the third and fourth band portions 131c and 132c; a first plating layer 141 disposed on the first band portion 131b; and a second plating layer 142 disposed on the second band portion 132b.

[0031] The main body 110 has dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0032] The specific shape of the main body 110 is not particularly limited, but as shown in the figure, the main body 110 may have a hexahedral shape or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 may not have a perfectly straight hexahedral shape, but may have a substantially hexahedral shape.

[0033] The main body 110 may have first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2 and connected to the third and fourth surfaces 3 and 4 and facing each other in a third direction.

[0034] In one embodiment, the main body 110 includes a first-to-third corner connecting the first and third surfaces, a first-to-fourth corner connecting the first and fourth surfaces, a second-to-third corner connecting the second and third surfaces, and a second-to-fourth corner connecting the second and fourth surfaces, wherein the first-to-third corner and the first-to-fourth corner have a shape that contracts towards the center of the main body in the first direction as they approach the third surface, and the second-to-third corner and the second-to-fourth corner have a shape that contracts towards the center of the main body in the first direction as they approach the fourth surface.

[0035] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference is created due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third to sixth surfaces and / or the corners connecting the second surface with the third to sixth surfaces may have a shape that is contracted toward the center of the body 110 in the first direction when the first or second surface is used as a reference. Alternatively, due to the contraction behavior during the sintering process of the body, the corners connecting the first surface 1 with the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 with the third to sixth surfaces 3, 4, 5, and 6 may have a shape that is contracted toward the center of the body 110 in the first direction when the first or second surface is used as a reference. Alternatively, to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process, thereby allowing the corners connecting the first face with the third to sixth faces and / or the corners connecting the second face with the third to sixth faces to have a rounded shape.

[0036] The above-mentioned corners may include the 1st-3rd corner connecting the 1st and 3rd faces, the 1st-4th corner connecting the 1st and 4th faces, the 2nd-3rd corner connecting the 2nd and 3rd faces, and the 2nd-4th corner connecting the 2nd and 4th faces. Additionally, the corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. However, in order to suppress the step caused by the internal electrodes 121 and 122, if the internal electrodes are cut after lamination so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, the portions connecting the first surface with the fifth and sixth surfaces and the portions connecting the second surface with the fifth and sixth surfaces may not have a contracted form.

[0037] On the other hand, the first to sixth surfaces of the main body 110 are almost flat, and the non-flat areas can be considered corners. Hereafter, the extensions of each surface may refer to lines extended from the flat parts of each surface.

[0038] The multiple dielectric layers 111 that make up the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0039] According to one embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate-based materials, lead-composite perovskite-based materials, or strontium titanate-based materials can be used. The barium titanate-based material may include BaTiO3-based ceramic powder, and examples of the ceramic powder include BaTiO3, BaTiO3 in which Ca (calcium), Zr (zirconium), etc. are partially solid-dissolved (BaTiO3). 1-x Ca x )TiO3(0 <x<1)、Ba(Ti 1-y Cay )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. can be mentioned.

[0040] Also, for the raw material for forming the dielectric layer 111, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to powders such as barium titanate (BaTiO3) according to the object of the present invention.

[0041] On the other hand, the average thickness td of the dielectric layer 111 does not need to be particularly limited.

[0042] However, generally, when the dielectric layer is formed thin with a thickness of less than 0.6 μm, especially when the thickness of the dielectric layer is 0.35 μm or less, there is a risk of reduced reliability.

[0043] According to one embodiment of the present invention, by disposing an insulating layer on the connection portion of the external electrode and disposing a plating layer on the band portion of the external electrode, it is possible to prevent moisture penetration from the outside, penetration of the plating solution, etc., and improve reliability. Therefore, even when the average thickness of the dielectric layer 111 is 0.35 μm or less, excellent reliability can be ensured.

[0044] Therefore, when the average thickness of the dielectric layer 111 is 0.35 μm or less, the effect of improving reliability according to the present invention can become more remarkable.

[0045] The average thickness td of the dielectric layer 111 can mean the average thickness of the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122.

[0046] The average thickness of the dielectric layer 111 can be measured by image scanning the cross-section of the main body 110 in the length and thickness direction (LT) with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of one dielectric layer in the scanned image can be measured at 30 equally spaced points in the length direction, and the average value can be calculated. These 30 equally spaced points can be specified by the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 dielectric layers, the average thickness of the dielectric layers can be further generalized.

[0047] The main body 110 may include a capacitance forming portion Ac which is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 which are arranged to face each other with a dielectric layer 111 in between, and cover portions 112 and 113 which are formed on the upper and lower parts of the capacitance forming portion Ac in a first direction.

[0048] Furthermore, the capacitance-forming portion Ac is a part that contributes to the capacitance formation of the capacitor, and can be formed by repeatedly stacking multiple first and second internal electrodes 121 and 122 with a dielectric layer 111 in between.

[0049] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the volume forming portion Ac in the first direction, and a lower cover portion 113 positioned below the volume forming portion Ac in the first direction.

[0050] The upper cover portion 112 and the lower cover portion 113 described above can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0051] The upper cover portion 112 and the lower cover portion 113 described above do not include internal electrodes and may contain the same material as the dielectric layer 111.

[0052] In other words, the upper cover portion 112 and the lower cover portion 113 can include ceramic materials, for example, barium titanate (BaTiO3) based ceramic materials.

[0053] On the other hand, the average thickness of the cover portions 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average thickness tc of the cover portions 112 and 113 can be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging the insulating layer on the connection portion of the external electrode and the plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even when the average thickness tc of the cover portions 112 and 113 is 15 μm or less, excellent reliability can be ensured.

[0054] The average thickness tc of the cover portions 112 and 113 represents the size in the first direction and can be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0055] Furthermore, margin portions 114 and 115 can be arranged on the side surface of the volume-forming portion Ac.

[0056] The margin portions 114 and 115 may include a first margin portion 114 located on the fifth surface 5 of the main body 110 and a second margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 can be located on both end surfaces in the width direction of the ceramic main body 110.

[0057] As shown in Figure 3, the margin portions 114 and 115 may refer to the regions between the interface between both ends of the first and second internal electrodes 121 and 122 and the body 110 in a cross-section obtained by cutting the main body 110 in the width-thickness (WT) direction.

[0058] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0059] The margin portions 114 and 115 can be formed by applying a conductive paste to the ceramic green sheet, excluding the areas where the margin portions should be formed, to form internal electrodes.

[0060] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after lamination the internal electrodes are cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers may be laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115.

[0061] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average width of the margin portions 114 and 115 can be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging the insulating layer on the connection portion of the external electrode and the plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even when the average width of the margin portions 114 and 115 is 15 μm or less, excellent reliability can be ensured.

[0062] The average width of the margin portions 114 and 115 refers to the average size of the margin portions 114 and 115 in the third direction, and can be the average value of the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the volume forming portion Ac.

[0063] The internal electrodes 121 and 122 are arranged alternately with the dielectric layer 111.

[0064] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are arranged alternately so as to face each other across the dielectric layer 111 that constitutes the main body 110, and can be exposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0065] Referring to Figure 3, the first internal electrode 121 can be exposed via the third surface 3, separated from the fourth surface 4, and the second internal electrode 122 can be exposed via the fourth surface 4, separated from the third surface 3. The first external electrode 131 can be placed on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 can be placed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0066] In other words, the first internal electrode 121 is not connected to the second external electrode 132, but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131, but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3.

[0067] At this time, the first and second internal electrodes 121 and 122 can be electrically isolated from each other by the dielectric layer 111 placed between them.

[0068] The main body 110 can be formed by alternately stacking ceramic green sheets printed with the first internal electrode 121 and ceramic green sheets printed with the second internal electrode 122, and then firing them.

[0069] The materials used to form the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0070] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following on a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. While screen printing or gravure printing can be used as the printing method for the conductive paste for internal electrodes, the present invention is not limited to these methods.

[0071] On the other hand, the average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited.

[0072] However, generally speaking, when the internal electrode is formed to a thickness of less than 0.6 μm, especially when the thickness of the internal electrode is 0.35 μm or less, reliability may be reduced.

[0073] According to one embodiment of the present invention, by placing an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even when the average thickness of the internal electrodes 121 and 122 is 0.35 μm or less, excellent reliability can be ensured.

[0074] Therefore, when the average thickness of the internal electrodes 121 and 122 is 0.35 μm or less, the effects of the present invention can become more pronounced, and miniaturization and increased capacitance of the stacked electronic component can be achieved more easily.

[0075] The average thickness te of the internal electrodes 121 and 122 mentioned above may represent the average thickness of the internal electrodes 121 and 122.

[0076] The average thickness of the internal electrodes 121 and 122 can be measured by image scanning the cross-section of the main body 110 in the length and thickness direction (LT) using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of one internal electrode in the scanned image can be measured at 30 equally spaced points in the length direction, and the average value can be calculated. These 30 equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 internal electrodes, the average thickness of the internal electrodes can be further generalized.

[0077] External electrodes 131 and 132 can be arranged on the third surface 3 and fourth surface 4 of the main body 110. The external electrodes 131 and 132 may include first and second external electrodes 131 and 132, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively.

[0078] The external electrodes 131 and 132 may include a first external electrode 131 having a first connecting portion 131a located on the third surface and a first band portion 131b extending from the first connecting portion to a part of the first surface, and a second external electrode 132 having a second connecting portion 132a located on the fourth surface and a second band portion 132b extending from the second connecting portion to a part of the first surface. The first connecting portion 131a may be connected to the first internal electrode 121 on the third surface, and the second connecting portion 132a may be connected to the second internal electrode 122 on the fourth surface.

[0079] Furthermore, the first external electrode 131 may include a third band portion 131c extending from the first connection portion 131a to a part of the second surface, and the second external electrode 132 may include a fourth band portion 132c extending from the second connection portion 132a to a part of the second surface. In addition, the first external electrode 131 may include a first side band portion extending from the first connection portion 131a to a part of the fifth and sixth surfaces, and the second external electrode 132 may include a second side band portion extending from the second connection portion 132a to a part of the fifth and sixth surfaces. However, the third band portion, the fourth band portion, the first side band portion, and the second side band portion are not necessarily essential components in the present invention. The first and second external electrodes 131 and 132 do not have to be placed on the second surface, nor do they have to be placed on the fifth and sixth surfaces. By not arranging the first and second external electrodes 131 and 132 on the second surface, the first and second external electrodes 131 and 132 can be positioned below the extension line of the second surface of the main body. Furthermore, the first and second connecting portions 131a and 132a can be positioned away from the fifth and sixth surfaces, and the first and second connecting portions 131a and 132a can be positioned away from the second surface. In addition, the first and second band portions 131b and 132b can also be positioned away from the fifth and sixth surfaces.

[0080] On the other hand, when the first and second external electrodes 131 and 132 include the third and fourth band portions 131c and 132c, it is indicated that an insulating layer is placed on the third and fourth band portions 131c and 132c, but it is not limited to this, and a plating layer can be placed on the third and fourth band portions 131c and 132c to improve ease of mounting. Also, the first and second external electrodes 131 and 132 can include the third and fourth band portions 131c and 132c but not the side band portions, in which case the first and second connecting portions 131a and 132a and the first to fourth band portions 131b, 132b, 131c, and 132c can be separated from the fifth and sixth surfaces.

[0081] In this embodiment, a structure is described in which the stacked electronic component 1000 has two external electrodes 131 and 132. However, the number and shape of the external electrodes 131 and 132 can be modified according to the shape of the internal electrodes 121 and 122 or other purposes.

[0082] On the other hand, the external electrodes 131 and 132 can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, they can have a multilayer structure.

[0083] The external electrodes 131 and 132 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0084] Furthermore, the external electrodes 131 and 132 may be formed in a configuration in which a fired electrode and a resin-based electrode are formed sequentially on the main body. Alternatively, the external electrodes 131 and 132 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0085] The conductive metal included in the external electrodes 131 and 132 can be any material with excellent electrical conductivity, but is not particularly limited. For example, the conductive metal can be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes 131 and 132 can include one or more of Ni and Ni alloys, which can further improve connectivity with the internal electrodes 121 and 122 containing Ni.

[0086] The insulating layer 151 can be placed on the first and second connection portions 131a and 132a.

[0087] Since the first and second connection parts 131a and 132a are connected to the internal electrodes 121 and 122, they could potentially become pathways for the penetration of plating solution during the plating process or for the penetration of moisture during actual use. In the present invention, since an insulating layer 151 is placed on the connection parts 131a and 132a, it is possible to prevent the penetration of moisture or plating solution from the outside.

[0088] The insulating layer 151 can be positioned in contact with the first and second plating layers 141 and 142. In this case, the insulating layer 151 may be in contact with the first and second plating layers 141 and 142 in a manner that covers a portion of their edges, or the first and second plating layers 141 and 142 may be in contact with the insulating layer 151 in a manner that covers a portion of its edges.

[0089] The insulating layer 151 can be placed on the first and second connection portions 131a and 132a and positioned to cover the second surface and the third and fourth band portions 131c and 132c. In this case, the insulating layer 151 can be positioned to cover the area on the second surface where the third and fourth band portions 131c and 132c are not located, and the third and fourth band portions 131c and 132c themselves. This allows the insulating layer 151 to cover the area where the ends of the third and fourth band portions 131c and 132c are in contact with the main body 110, thereby blocking the moisture penetration path and further improving moisture resistance reliability.

[0090] The insulating layer 151 is positioned on the first and second connection portions 131a and 132a and can extend to the second surface so as to cover the ends of the third band portion 131c and the fourth band portion 132c. That is, it is not positioned to cover the entire second surface of the main body 110, but to cover all the areas on the second surface where the third and fourth band portions 131c and 132c are located, and in particular, it can be positioned to cover the ends of the third band portion 131c and the fourth band portion 132c located on the second surface. As a result, the gap between the third and fourth band portions 131c and 132c and the main body can be sealed by the insulating layer 151, thereby improving the airtightness of the laminated electronic component 1000.

[0091] The insulating layer 151 is positioned on the second surface and can extend over the first and second connection portions 131a and 132a. Furthermore, if the external electrodes 131 and 132 are not positioned on the second surface, the insulating layer can be positioned to cover the entire second surface. On the other hand, the insulating layer 151 does not necessarily have to be positioned on the second surface. The insulating layer does not have to be positioned on part or all of the second surface; it may be separated into two parts, each positioned on the first and second connection portions 131a and 132a. If the insulating layer is not positioned on the entire second surface, it can be positioned below the extension of the second surface. Also, even if the insulating layer is not positioned on the second surface, it can extend from the first and second connection portions 131a and 132a to the fifth and sixth surfaces, forming a single insulating layer.

[0092] Furthermore, the insulating layer 151 can be positioned to cover the first and second side band portions, and parts of the fifth and sixth surfaces. In this case, parts of the fifth and sixth surfaces not covered by the insulating layer 151 can be exposed to the outside.

[0093] Furthermore, the insulating layer 151 can be arranged to cover the first and second side band portions, the fifth surface, and the sixth surface entirely. In this case, the fifth and sixth surfaces are not exposed to the outside, thus improving moisture resistance reliability. Also, the connection portions 131a and 132a are not directly exposed to the outside, thus improving the reliability of the laminated electronic component 1000. More specifically, the insulating layer can cover the first and second side band portions entirely, and the fifth and sixth surfaces can cover all areas except those where the first and second side band portions are formed.

[0094] The insulating layer 151 can prevent the formation of plating layers 141 and 142 on the external electrodes 131 and 132 on which the insulating layer 151 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solutions, etc., from the outside.

[0095] The material constituting the insulating layer 151 is not particularly limited, and the insulating layer 151 can contain an insulating material and have electrically insulating properties. For example, the insulating material contained in the insulating layer 151 may be one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or it may be glass. More specifically, the material constituting the insulating layer 151 is preferably a glass material with excellent resistance to plating solutions, and a glass material having a Si mole fraction of 20 mol% or more and 65 mol% or less. In one embodiment, by including glass in the insulating layer 151, it is possible to prevent cracks from occurring in the multilayer electronic component 1000 due to thermal shrinkage that occurs during the solder reflow process when mounting the multilayer electronic component 1000 on a substrate.

[0096] On the other hand, if the insulating layer 151 contains glass, the high temperature required to fire the glass may induce thermal stress in the laminated electronic component during the formation process of the insulating layer 151. Also, if the external electrodes 131 and 132 contain Cu, there is a risk that radiation cracks may be induced due to diffusion into the Ni internal electrodes.

[0097] According to one embodiment of the present invention, the occurrence and propagation of radiative cracks can be effectively suppressed by ensuring that the external electrodes 131 and 132 include one or more of Ni and Ni alloys. According to one embodiment of the present invention, the occurrence and propagation of radiative cracks can be effectively suppressed by arranging first and second additional electrode layers 134 and 135 containing one or more of Ni and Ni alloys between the external electrodes 131' and 132' containing Cu and the third and fourth surfaces. Therefore, when the insulating layer 151 contains glass, the effect of the present invention in suppressing the occurrence and propagation of radiative cracks can be made even more pronounced.

[0098] The method for forming the insulating layer 151 is not particularly limited. For example, after forming external electrodes 131 and 132 on the main body 110, the insulating layer 151 can be formed by applying a paste containing glass powder, or by dipping the device in a paste containing glass and then heat-treating it.

[0099] The first and second plating layers 141 and 142 can be placed on the first and second band portions 131b and 132b, respectively. The plating layers 141 and 142 can play a role in improving mounting characteristics. By placing the plating layers 141 and 142 on the first and second band portions 131b and 132b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. One end of the first and second plating layers 141 and 142 can be in contact with the first surface, and the other end can be in contact with the insulating layer 151.

[0100] On the other hand, the plating layers 141 and 142 can preferably not be placed in the third and fourth band portions 131c and 132c. This minimizes the volume occupied by the plating layers 141 and 142, thereby improving the capacity per unit volume of the multilayer electronic component 1000.

[0101] The types of plating layers 141 and 142 are not particularly limited and can be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and can be formed in multiple layers.

[0102] As a more specific example of the plating layers 141 and 142, the plating layers 141 and 142 can be Ni plating layers or Sn plating layers, and can be configured such that the Ni plating layer and the Sn plating layer are formed sequentially on the first and second band portions 131b and 132b.

[0103] In one embodiment, the first and second plating layers 141 and 142 can be arranged to extend and cover a portion of the first and second connecting portions 131a and 132a, respectively. When H1 is the average size in the first direction from the first internal electrodes 121 and 122 to the internal electrode closest to the first surface 1, and H2 is the average size in the first direction from the extension of the first surface 1 to the ends of the first and second plating layers 141 and 142 arranged on the first and second connecting portions 131a and 132a, it is possible to satisfy H1 > H2. This suppresses the penetration of the plating solution into the internal electrodes during the plating process, thereby improving reliability.

[0104] H1 and H2 can be the average of values ​​measured in cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 can be the average of values ​​measured at the point in each cross-section where the internal electrode closest to the first surface 1 is connected to the external electrode, and H2 can be the average of values ​​measured with reference to the edge of the plating layer in contact with the external electrode. The extension line of the first surface used as a reference when measuring H1 and H2 can be the same.

[0105] In one embodiment, the first plating layer 141 can be positioned to cover the end of the insulating layer 151 that is located on the first external electrode 131, and the second plating layer 142 can be positioned to cover the end of the insulating layer 151 that is located on the second external electrode 132. This strengthens the bonding force between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0106] In one embodiment, the insulating layer 151 can be positioned to cover the end of the first plating layer 141 that is located on the first external electrode 131, and the insulating layer 151 can be positioned to cover the end of the second plating layer 142 that is located on the second external electrode 132. This strengthens the bonding force between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0107] In one embodiment, when the average size of the main body 110 in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the conditions 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied.

[0108] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient adhesion strength. On the other hand, if B2 / L exceeds 0.4, there is a risk of leakage current occurring between the first band portion 131b and the second band portion 132b under high voltage current, and there is a risk that the first band portion 131b and the second band portion 132b may become electrically connected due to plating bleeding during the plating process.

[0109] B1, B2, and L can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0110] Referring to Figure 5, which shows a mounting substrate 1100 on which a multilayer electronic component 1000 is mounted, the plating layers 141 and 142 of the multilayer electronic component 1000 can be joined to electrode pads 181 and 182 placed on the substrate 180 by solder 191 and 192.

[0111] On the other hand, when the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 1000 can be horizontally mounted on the substrate 180 such that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and when the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate such that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0112] There is no particular limit to the size of the stacked electronic component 1000.

[0113] However, in order to achieve both miniaturization and high capacitance, it is necessary to reduce the thickness of the dielectric layer and internal electrodes and increase the number of layers. Therefore, in a stacked electronic component 1000 having a size of 1005 (length x width, 1.0 mm x 0.5 mm) or less, the reliability and capacitance improvement effect per unit volume according to the present invention can be made more pronounced.

[0114] Therefore, considering manufacturing tolerances, the size of external electrodes, etc., the reliability improvement effect according to the present invention can be more pronounced when the length of the stacked electronic component 1000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 1000 refers to the maximum size of the stacked electronic component 1000 in the second direction, and the width of the stacked electronic component 1000 refers to the maximum size of the stacked electronic component 1000 in the third direction.

[0115] Conventional multilayer electronic components involve forming external electrodes on the main body after firing and then firing again. During this firing process, stress is generated, and this stress can lead to the occurrence of radial cracks.

[0116] In particular, when the insulating layer contains glass material, the firing temperature required to form the insulating layer becomes higher, further increasing the likelihood of such radial cracks occurring.

[0117] The first and second external electrodes 131 and 132 of the stacked electronic component 1000 according to one embodiment of the present invention may include one or more of Ni and Ni alloys.

[0118] This prevents the Ni contained in the external electrodes 131 and 132 from diffusing into the internal electrodes 121 and 122, which contain Ni in the conductive metal, thereby suppressing the occurrence and propagation of radial cracks. Furthermore, by ensuring that the external electrodes 131 and 132 contain one or more of Ni and Ni alloys, the hermetic sealing of the main body 110 is improved, preventing a decrease in reliability due to the penetration of the plating solution. These effects can be even more pronounced when the external electrodes 131 and 132 contain Ni as the main component.

[0119] The Ni content in the first and second external electrodes may be 50 mol% or more relative to 100 mol of conductive metal in the external electrodes, but is not limited to this.

[0120] Furthermore, the Ni alloy is not particularly limited as long as it is a conductive metal with excellent electrical conductivity. For example, it can be an alloy containing Ni and one or more selected from Cu, Cr, Ag, Sn, and Pd.

[0121] The components of the first and second external electrodes 131 and 132 can be calculated from images observed using SEM-EDS (Scanning Electron Microscope-Energy Dispersive X-ray Spectroscopy). Specifically, after polishing the multilayer electronic component to the center in the width direction (third direction) to expose the cross-sections in the length and thickness directions (LT cross-sections), the number of moles of each conductive metal element contained in the external electrode can be measured using EDS in the central region of one of the five equally spaced regions obtained by dividing the external electrode in the thickness direction.

[0122] On the other hand, in one embodiment, the first and second plating layers 141 and 142 can be arranged to extend and cover a portion of the first and second connecting portions 131a and 132a, respectively. In this case, the ends of the first and second plating layers 141 and 142 can be in contact with the insulating layer 151, respectively.

[0123] In a stacked electronic component 1000 according to one embodiment of the present invention, when the average size in the first direction from the first internal electrodes 121 and 122 to the internal electrode closest to the first surface 1 is H1, and the average size in the first direction from the extension of the first surface 1 to the ends of the first and second plating layers 141 and 142 arranged on the first and second connection parts 131a and 132a is H2, it is possible to satisfy H1 > H2. This suppresses the penetration of the plating solution into the internal electrodes during the plating process, further improving reliability.

[0124] H1 and H2 can be the average of values ​​measured in cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 can be the average of values ​​measured at the point in each cross-section where the internal electrode closest to the first surface 1 is connected to the external electrode, and H2 can be the average of values ​​measured with reference to the edge of the plating layer in contact with the external electrode. The extension line of the first surface used as a reference when measuring H1 and H2 can be the same.

[0125] In the following, a stacked electronic component 1000' according to one embodiment of the present invention will be described with reference to Figures 6 and 7, but explanations that overlap with those of the stacked electronic component 1000 according to one embodiment of the present invention will be omitted.

[0126] Figure 6 is a schematic perspective view of a stacked electronic component 1000' according to one embodiment of the present invention.

[0127] Figure 7 is a cross-sectional view along line II-II' in Figure 6.

[0128] Referring to Figures 6 and 7, a stacked electronic component 1000' according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, and comprises a body 110 having first and second surfaces 1 and 2 facing in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in a third direction, and a first connecting portion 131a' located on the third surface, a first band portion 131b' extending from the first connecting portion to a part of the first surface, and the second The device may include: a first external electrode 131' including a third band portion 131c' extending to a part of the surface; a second external electrode 132' including a second connecting portion 132a' disposed on the fourth surface, a second band portion 132b' extending from the second connecting portion to a part of the first surface, and a fourth band portion 132c' extending from the second connecting portion to a part of the second surface; an insulating layer 151' disposed on the first and second connecting portions and arranged to cover the second surface, third and fourth band portions; a first plating layer 141' disposed on the first band portion; and a second plating layer 142' disposed on the second band portion.

[0129] External electrodes 131' and 132' can be arranged on the third surface 3 and fourth surface 4 of the main body 110. The external electrodes 131' and 132' may include first and second external electrodes 131' and 132' that are arranged on the third and fourth surfaces 3 and 4 of the main body 110, respectively, and connected to first and second internal electrodes 121 and 122, respectively.

[0130] The external electrodes 131' and 132' may include a first external electrode 131' which includes a first connecting portion 131a' located on the third surface, a first band portion 131b' extending from the first connecting portion to a part of the first surface, and a third band portion 131c' extending from the first connecting portion to a part of the second surface, and a second external electrode 132' which includes a second connecting portion 132a' located on the fourth surface, a second band portion 132b' extending from the second connecting portion to a part of the first surface, and a fourth band portion 132c' extending from the second connecting portion to a part of the second surface.

[0131] A first additional electrode layer 134 can be arranged between the first connection portion 131a' and the third surface of the stacked electronic component 1000' according to one embodiment of the present invention, and a second additional electrode layer 135 can be arranged between the second connection portion 132a' and the fourth surface.

[0132] In one embodiment, the first additional electrode layer 134 can be positioned within the range that does not deviate from the third surface, and the second additional electrode layer 135 can be positioned within the range that does not deviate from the fourth surface. This allows the stacked electronic component 1000' to be further miniaturized.

[0133] The additional electrode layers 134 and 135 may be firing electrodes containing conductive metal and glass, or they may be plating layers made of conductive metal.

[0134] The first and second additional electrode layers 134 and 135 can improve the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 131' and 132', provide excellent bonding strength with the external electrodes 131' and 132', and play a role in further improving the mechanical bonding strength of the external electrodes 131' and 132'. Furthermore, as described later, by including one or more of Ni and Ni alloys, they can play a role in suppressing the occurrence and propagation of radial cracks.

[0135] The first and second external electrodes 131' and 132' of the stacked electronic component 1000' according to one embodiment of the present invention may contain Cu, preferably Cu as the main component. This improves the electrical conductivity of the external electrodes 131' and 132', and the ductility of Cu improves the bending strength of the stacked electronic component 1000'. Furthermore, since Cu has excellent wettability to metal plating layers, when the external electrodes 131' and 132' contain Cu, the plating properties to the plating layers 141 and 142 described later can be improved.

[0136] On the other hand, if a glass component is included in the insulating layer 151' to protect the multilayer electronic component 1000' from tensile stress due to thermal contraction of the solder 191 and 192, the firing temperature for forming the insulating layer 151' becomes higher. Therefore, there is a risk that radial cracks may occur in the multilayer electronic component 1000' due to such thermal stress.

[0137] In particular, if the first and second external electrodes 131' and 132' contain Cu or contain Cu as the main component, the high heat required to form the insulating layer 151' may cause the Cu in the external electrodes 131' and 132' to diffuse into the Ni-containing internal electrodes, potentially increasing the likelihood of radiation cracks occurring.

[0138] The first and second additional electrode layers 134 and 135 of the stacked electronic component 1000' according to one embodiment of the present invention contain one or more of Ni and Ni alloy, thereby suppressing the propagation of radiation cracks due to thermal stress toward the internal electrodes 121 and 122, and suppressing the diffusion of Cu from the external electrodes 131' and 132' toward the Ni-containing internal electrodes 121 and 122, thereby suppressing the occurrence and propagation of radiation cracks.

[0139] More preferably, in one embodiment, the first and second additional electrode layers 134 and 135 of the stacked electronic component 1000' contain Ni as the main component, which further suppresses the phenomenon of radiation cracks propagating toward the internal electrodes 121 and 122, and the phenomenon of Cu contained in the external electrodes 131' and 132' diffusing toward the Ni-containing internal electrodes 121 and 122, thereby suppressing the occurrence and propagation of radiation cracks.

[0140] On the other hand, the Cu content in the first and second external electrodes 131' and 132' may be 50 mol% or more relative to 100 mol of conductive metal contained in the external electrodes, but is not limited thereto. Similarly, the Ni content in the first and second additional electrode layers 134 and 135 may be 50 mol% or more relative to 100 mol of conductive metal contained in the additional electrode layers, but is not limited thereto.

[0141] Furthermore, the Ni alloy is not particularly limited as long as it is a conductive metal with excellent electrical conductivity. For example, it can be an alloy containing Ni and one or more selected from Cu, Cr, Ag, Sn, and Pd.

[0142] The components of the first and second additional electrode layers 134 and 135 can be calculated from images observed using SEM-EDS (Scanning Electron Microscope-Energy Dispersive X-ray Spectroscopy). Specifically, after polishing the multilayer electronic component to the center in the width direction (third direction) to expose the cross-sections in the length and thickness directions (LT cross-sections), the number of moles of conductive metal elements contained in the additional electrode layer can be measured using EDS in the central region of one of the five equally spaced regions obtained by dividing the additional electrode layer in the thickness direction.

[0143] In the following, various embodiments of the present invention will be described in detail, but descriptions that overlap with those of stacked electronic component 1000 and stacked electronic component 1000' according to one embodiment of the present invention will be omitted.

[0144] In describing the various embodiments of the present invention, the explanation will be based on a structure in which no additional electrode layer is arranged between the external electrode and the third or fourth surface, such as the stacked electronic component 1000 according to one embodiment of the present invention. However, the same applies to a structure in which an additional electrode layer is arranged between the external electrode and the third or fourth surface, such as the stacked electronic component 1000' according to one embodiment of the present invention.

[0145] Figure 8 is a schematic perspective view of a stacked electronic component 1001 according to one embodiment of the present invention, and Figure 9 is a cross-sectional view along line III-III' in Figure 8.

[0146] Referring to Figures 8 and 9, in the stacked electronic component 1001 according to one embodiment of the present invention, the first and second plating layers 141-1 and 142-1 can be positioned below the extension line E1 of the first surface. This makes it possible to minimize the height of the solder during mounting and to minimize the mounting space.

[0147] Furthermore, the insulating layer 151-1 can extend below the extension line of the first surface and be positioned in contact with the first and second plating layers 141-1 and 142-1.

[0148] Figure 10 is a schematic perspective view of a stacked electronic component 1002 according to one embodiment of the present invention, and Figure 11 is a cross-sectional view along line IV-IV' in Figure 10.

[0149] Referring to Figures 10 and 11, the stacked electronic component 1002 according to one embodiment of the present invention may further include an additional insulating layer 161 disposed on the first surface 1 and positioned between the first band portion 131b and the second band portion 132b. This makes it possible to prevent leakage current and the like that which may occur between the first band portion 131b and the second band portion 132b under high voltage current.

[0150] The type of additional insulating layer 161 is not particularly limited. For example, the additional insulating layer 161 may include glass, similar to the insulating layer 151. However, the additional insulating layer 161 and the insulating layer 151 are not limited to the same material and may be formed from different materials. For example, one or more materials selected from epoxy resin, acrylic resin, ethyl cellulose, etc., may be included.

[0151] Figure 12 is a schematic perspective view of a stacked electronic component 1003 according to one embodiment of the present invention, and Figure 13 is a cross-sectional view along line V-V' in Figure 12.

[0152] Referring to FIGS. 12 and 13, in a stacked electronic component 1003 according to an embodiment, the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-3 and 142-3 disposed on the first and second connection portions 131a and 132a is H2. When this is the case, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0153] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0154] H1, H2, and T can be values obtained by averaging the values measured in a cross section (L-T cross section) obtained by cutting the main body 110 at five points having equal intervals in the third direction in the first and second directions. H1 is a value obtained by averaging the values measured at the points where the internal electrode closest to the first surface 1 is connected to the external electrode in each cross section, and H2 can be a value obtained by averaging the values measured based on the ends of the plating layers in contact with the external electrode in each cross section. The extension line of the first surface serving as a reference during the measurement of H1 and H2 can be the same. Also, T can be a value obtained by measuring the maximum size of the main body 110 in the first direction in each cross section and then averaging.

[0155] FIG. 14 schematically shows a perspective view of a stacked electronic component 1004 according to an embodiment of the present invention, and FIG. 15 is a cross-sectional view taken along VI-VI' of FIG. 14.

[0156] Referring to FIGS. 14 and 15, in a stacked electronic component 1004 according to an embodiment of the present invention, the average length B1 of the first band portion 131b-4 can be longer than the average length B3 of the third band portion 131c-4, and the average length of the second band portion 132b-4 can be longer than the average length B4 of the fourth band portion 132c-4. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0157] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 131b-4 is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 132b-4 is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the third band portion 131c-4 is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the fourth band portion 132c-4 is B4, B3 < B1 and B4 < B2 can be satisfied.

[0158] At this time, when the average size in the second direction of the main body 110 is L, 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 can be satisfied.

[0159] B1, B2, B3, B4, and L can be values obtained by averaging values measured in a cross-section (L-T cross-section) obtained by cutting the main body 110 in the first and second directions at five points having equal intervals in the third direction.

[0160] In addition, the first external electrode 131-4 can include a first side surface band portion extending from the first connection portion 131a-4 to a part of the fifth and sixth surfaces, and the second external electrode 132-4 can include a second side surface band portion extending from the second connection portion 132a-4 to a part of the fifth and sixth surfaces. At this time, the size in the second direction of the first and second side surface band portions can gradually increase as it gets closer to the first surface. That is, the first and second side surface band portions can be arranged in a tapered or trapezoidal shape.

[0161] Furthermore, when B3 is the average size in the second direction from the extension line of the third surface to the end of the third band portion 131c-4, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the fourth band portion 132c-4, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This minimizes the volume occupied by the external electrodes and increases the capacity per unit volume of the stacked electronic component 1004.

[0162] The above G1 and G2 can be defined as follows: G1 is the average size in the second direction, separated to the third plane, measured for any five second internal electrodes located in the center of the first direction, and G2 is the average size in the second direction, separated to the fourth plane, measured for any five first internal electrodes located in the center of the first direction.

[0163] Furthermore, the method can be further generalized by determining G1 and G2 from cross-sections (LT cross-sections) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions, and then averaging these values ​​to obtain G1 and G2.

[0164] However, there is no intention to limit the present invention to B3≦G1 and B4≦G2, and the case where B3≧G1 and B4≧G2 are satisfied can also be included in one embodiment of the present invention. Therefore, in one embodiment, when B3 is the average size in the second direction from the extension line of the third surface to the end of the third band portion, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the fourth band portion, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, B3≧G1 and B4≧G2 can be satisfied.

[0165] Figure 16 is a schematic perspective view of a stacked electronic component 1005 according to one embodiment of the present invention, and Figure 17 is a cross-sectional view along line VII-VII' in Figure 16.

[0166] Referring to Figures 16 and 17, the first and second external electrodes 131-5 and 132-5 of the stacked electronic component 1005 according to one embodiment of the present invention are not arranged on the second surface, but on the third, fourth, and first surfaces, and can have an L-shape. That is, the first and second external electrodes 131-5 and 132-5 can be arranged below the extension of the second surface.

[0167] The first external electrode 131-5 includes a first connection portion 131a-5 located on the third surface 3 and a first band portion 131b-5 extending from the first connection portion 131a-5 to a part of the first surface 1, and the second external electrode 132-5 may include a second connection portion 132a-5 located on the fourth surface 4 and a second band portion 132b-5 extending from the second connection portion 132a-5 to a part of the first surface 1. Since the external electrodes 131-5 and 132-5 are not located on the second surface 2, the insulating layer 151-5 can be arranged to cover the entire second surface 2. This minimizes the volume occupied by the external electrodes 131-5 and 132-5, thereby improving the capacitance per unit volume of the multilayer electronic component 1005. However, the insulating layer 151-5 is not limited to covering the entire second surface 2. The insulating layer may not cover part or all of the second surface 2, but may be separated and cover the first and second connection portions 131a-5 and 132a-5, respectively.

[0168] Furthermore, reliability can be further improved by arranging the insulating layer 151-5 to cover a portion of the fifth and sixth surfaces. In this case, the portions of the fifth and sixth surfaces not covered by the insulating layer 151-5 can be exposed to the outside.

[0169] Furthermore, the insulating layer 151-5 can be positioned to cover the entire fifth and sixth surfaces. In this case, since the fifth and sixth surfaces are not exposed to the outside, moisture resistance reliability can be further improved.

[0170] A first plating layer 141-5 is disposed on the first band portion 131b-5, and a second plating layer 142-5 is disposed on the second band portion 132b-5. The first and second plating layers 141-5 and 142-5 can be extended and disposed up to a part on the first and second connection portions 131a-5 and 132a-5.

[0171] At this time, the external electrodes 131-5 and 132-5 may not be disposed on the fifth and sixth surfaces 5 and 6 either. That is, the external electrodes 131-5 and 132-5 can have a form of being disposed only on the third, fourth, and first surfaces.

[0172] From the first surface 1, when the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-5 and 142-5 disposed on the first and second connection portions 131a-5 and 132a-5 is H2, H1 < H2 can be satisfied. Thereby, the area contacting the solder during mounting can be increased, the fixing strength can be improved, the area where the external electrodes 131-5 and 132-5 contact the plating layers 141-5 and 142-5 can be increased, and an increase in ESR (Equivalent Series Resistance) can be suppressed.

[0173] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is equal to or greater than T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0174] Furthermore, the first and second plating layers 141-5 and 142-5 can be arranged so as to cover a portion of the insulating layer 151-1 on the third and fourth surfaces. That is, the plating layers 141-5 and 142-5 can be arranged so as to cover the edges of the insulating layer 151-5 on the third and fourth surfaces. This strengthens the bonding force between the insulating layer 151-5 and the plating layers 141-5 and 142-5, thereby improving the reliability of the multilayer electronic component 1005.

[0175] Furthermore, the insulating layer 151-5 can be positioned so as to cover a portion of the first and second plating layers 141-5 and 142-5 on its third and fourth surfaces. That is, the insulating layer 151-5 can be positioned so as to cover the edges of the plating layers 141-5 and 142-5 on its third and fourth surfaces. This strengthens the bonding force between the insulating layer 151-5 and the plating layers 141-5 and 142-5, thereby improving the reliability of the multilayer electronic component 1005.

[0176] Figure 18 is a schematic perspective view of a stacked electronic component 1006 according to one embodiment of the present invention, and Figure 19 is a cross-sectional view along line VIII-VIII' in Figure 18.

[0177] Referring to Figures 18 and 19, the average thickness t1 of the first and second plating layers 141-6 and 142-6 of the multilayer electronic component 1006 according to one embodiment of the present invention can be thinner than the average thickness t2 of the insulating layer 151-6.

[0178] The insulating layer 151-6 plays a role in preventing the penetration of moisture or plating solution from the outside, but its weak connectivity with the plating layers 141-6 and 142-6 may cause delamination of the plating layers 141-6 and 142-6. If delamination of the plating layers occurs, the adhesion strength to the substrate 180 may decrease. Here, delamination of the plating layers 141-6 and 142-6 may mean that a part of the plating layer comes off or is physically separated from the external electrodes 131-5 and 132-5. Due to the weak connectivity between the plating layer and the insulating layer, there is a higher possibility of gaps forming at the interface between the insulating layer and the plating layer, or of foreign matter entering, making it more vulnerable to external impacts and increasing the likelihood of delamination.

[0179] According to one embodiment of the present invention, by making the average thickness t1 of the plating layer thinner than the average thickness t2 of the insulating layer, the contact area between the plating layer and the insulating layer can be reduced, thereby suppressing the occurrence of delamination and improving the adhesion strength of the multilayer electronic component 1006 to the substrate 180.

[0180] The average thickness t1 of the first and second plating layers 141-6 and 142-6 is the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a-5 and 132a-5 or the first and second band portions 131b-5 and 132b-5, and the average thickness t2 of the insulating layer 151-6 is the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a-5 and 132a-5.

[0181] Figure 20 is a schematic perspective view of a stacked electronic component 2000 according to one embodiment of the present invention. Figure 21 is a cross-sectional view along line IX-IX' in Figure 20.

[0182] Hereinafter, with reference to Figures 20 and 21, a stacked electronic component 2000 according to one embodiment of the present invention will be described in detail. However, any content that overlaps with the above description may be omitted to avoid redundant explanation.

[0183] A stacked electronic component 2000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, and comprises a body 110 having first and second surfaces 1 and 2 facing in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in a third direction, a first external electrode 231 including a first connecting electrode 231a arranged on the third surface and a first band electrode 231b arranged on the first surface and connected to the first connecting electrode, and arranged on the fourth surface The device includes a second connecting electrode 232a placed on the first surface and a second band electrode 232b arranged on the first surface and connected to the second connecting electrode, a first insulating layer 251 arranged on the first connecting electrode, a second insulating layer 252 arranged on the second connecting electrode, a first plating layer 241 arranged on the first band electrode, and a second plating layer 242 arranged on the second band electrode, wherein the first and second connecting electrodes 231a and 232a contain one or more of Ni and Ni alloys, and the first and second band electrodes 231b and 232b may contain Cu.

[0184] The first connecting electrode 231a can be positioned on the third surface 3 and connected to the first internal electrode 121, and the second connecting electrode 232a can be positioned on the fourth surface 4 and connected to the second internal electrode 122. In addition, a first insulating layer 251 can be positioned on the first connecting electrode 231a, and a second insulating layer 252 can be positioned on the second connecting electrode 232a.

[0185] Conventionally, when forming external electrodes, a paste containing a conductive metal was used, and the surface where the internal electrodes of the main body were exposed was mainly dipped into the paste. However, external electrodes formed by the dipping method sometimes had excessively thick thickness in the center in the thickness direction. Furthermore, even without the problem of thickness variation of external electrodes due to the dipping method, since the internal electrodes are exposed on the third and fourth surfaces of the main body, the thickness of the external electrodes placed on the third and fourth surfaces was formed to be above a certain level in order to suppress the penetration of moisture and plating solution through the external electrodes.

[0186] In contrast, in the present invention, since insulating layers 251 and 252 are arranged on the connecting electrodes 231a and 232a, sufficient reliability can be ensured even if the thickness of the connecting electrodes 231a and 232a on the third and fourth surfaces where the internal electrodes are exposed is reduced.

[0187] The first and second connecting electrodes 231a and 232a can be configured to correspond to the third and fourth surfaces, respectively, and the surfaces extending from the first and second connecting electrodes 231a and 232a toward the main body 110 can have the same area as the third and fourth surfaces of the main body 110, respectively. The first and second connecting electrodes 231a and 232a can be positioned within a range that does not deviate from the third and fourth surfaces 3 and 4, respectively. The connecting electrodes 231a and 232a can be positioned so as not to extend to the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the main body 110. Specifically, in one embodiment, the first and second connecting electrodes 231a and 232a can be positioned away from the fifth and sixth surfaces. This ensures sufficient connectivity between the internal electrodes 121 and 122 and the external electrodes 231 and 232, minimizes the volume occupied by the external electrodes, and increases the capacity per unit volume of the stacked electronic component 2000.

[0188] From this perspective, the first and second connecting electrodes 231a and 232a can be arranged at a distance from the second surface 2. That is, by not arranging the external electrodes 231 and 232 on the second surface, the volume occupied by the external electrodes 231 and 232 can be further minimized, and the capacity per unit volume of the stacked electronic component 2000 can be further increased.

[0189] However, the connecting electrodes 231a and 232a may include corner portions that extend to and are positioned on the corners of the main body 110. That is, in one embodiment, the first connecting electrode includes a corner portion (not shown) that extends and is positioned on the first-third and second-third corners, and the second connecting electrode may include a corner portion (not shown) that extends and is positioned on the first-fourth and second-fourth corners.

[0190] Furthermore, the connecting electrodes 231a and 232a can have a more uniform and thinner thickness compared to external electrodes formed by the conventional dipping method.

[0191] The method for forming the connecting electrodes 231a and 232a is not particularly limited. For example, they can be formed by transferring sheets containing a conductive metal, an organic substance such as a binder, to the third and fourth surfaces.

[0192] The thickness of the connecting electrodes 231a and 232a is not particularly limited, but can be, for example, 2 to 7 μm. Here, the thickness of the connecting electrodes 231a and 232a refers to the maximum thickness and may refer to the size of the connecting electrodes 231a and 232a in the second direction.

[0193] In one embodiment, the first and second connecting electrodes 231a and 232a may contain the same metal and glass as the metal contained in the internal electrodes 121 and 122. By containing the same metal as the metal contained in the internal electrodes 121 and 122, the electrical connectivity with the internal electrodes 121 and 122 can be improved, and by containing glass, the bonding strength with the main body 110 and / or insulating layers 251 and 252 can be improved. In this case, the same metal as the metal contained in the internal electrodes 121 and 122 may be Ni.

[0194] In one embodiment, by ensuring that the first and second connecting electrodes 231a and 232a contain one or more of Ni and Ni alloy, it is possible to suppress the occurrence of radial cracks in the laminated electronic component 2000 due to stress generated during the formation of the insulating layers 251 and 252.

[0195] Preferably, the first and second connecting electrodes 231a and 232a contain Ni as the main component, which further suppresses the occurrence of radial cracks.

[0196] The Ni content in the first and second connecting electrodes 231a and 232a described above may be 50 mol% or more relative to 100 mol of conductive metal contained in the connecting electrodes, but is not limited thereto, and may mean that it is included in an amount sufficient to suppress the occurrence and propagation of radial cracks.

[0197] The components of the first and second connecting electrodes 231a and 232a can be measured in the same manner as the method for measuring the components of the first and second external electrodes 131 and 132 described above.

[0198] The first and second insulating layers 251 and 252 are positioned on the first and second connecting electrodes 231a and 232a, respectively, and can serve to prevent the formation of a plating layer on the first and second connecting electrodes 231a and 232a. In addition, the first and second insulating layers 251 and 252 can improve sealing properties and minimize the penetration of moisture, plating solution, etc., from the outside.

[0199] The materials constituting the first and second insulating layers 251 and 252 are not particularly limited, and the first and second insulating layers 251 and 252 can contain insulating material and have electrically insulating properties. For example, the insulating material contained in the first and second insulating layers 251 and 252 can have electrically insulating properties. For example, the insulating material contained in insulating layer 151 may be one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or it may be glass. More specifically, the materials constituting the first and second insulating layers 251 and 252 are glass materials with excellent resistance to plating solutions, and glass materials with a Si mole fraction of 20 mol% or more and 65 mol% or less are preferred. In one embodiment, by including glass in the first and second insulating layers 251 and 252, it is possible to prevent cracks from occurring in the laminated electronic component 2000 due to thermal shrinkage that occurs during the solder reflow process when mounting the laminated electronic component 2000 on a substrate.

[0200] On the other hand, if the first and second insulating layers 251 and 252 contain glass material, the high temperature required to fire the glass may induce thermal stress in the laminated electronic component during the formation of the first and second insulating layers 251 and 252. Also, if the external electrodes 231 and 232 contain Cu, there is a risk of radiative cracking being induced due to diffusion into the Ni internal electrodes.

[0201] According to a multilayer electronic component 2000 of one embodiment of the present invention, the generation and propagation of radiative cracks can be effectively suppressed by ensuring that the first and second connecting electrodes 231a and 232a include one or more of Ni and Ni alloys. According to a multilayer electronic component 2000' of one embodiment of the present invention, the generation and propagation of radiative cracks can be effectively suppressed by arranging the first and second additional electrode layers 234 and 235 between the first and second connecting electrodes 231a and 232a and the third and fourth surfaces. Therefore, when the first and second insulating layers 251 and 252 include glass, the effect of the present invention in suppressing the generation and propagation of radiative cracks can be made even more pronounced.

[0202] The method for forming the first and second insulating layers 251 and 252 is not particularly limited. For example, after forming external electrodes 231 and 232 on the main body 110, the first and second insulating layers 251 and 252 can be formed by applying a paste containing glass powder, dipping the electrodes in a paste containing glass, and then heat-treating them.

[0203] The first and second band electrodes 231b and 232b can be positioned on the first surface 1 of the main body 110. The first and second band electrodes 231b and 232b can be electrically connected to the first and second internal electrodes 121 and 122, respectively, by contacting the first and second connecting electrodes 231a and 232a.

[0204] Conventional dipping methods produce external electrodes that are thicker on the third and fourth surfaces and extend partially to the first, second, fifth, and sixth surfaces, making it difficult to secure a high effective volume ratio.

[0205] In contrast, according to one embodiment of the present invention, by arranging the first and second connecting electrodes 231a and 232a on the surface where the internal electrodes are exposed, and the first and second band electrodes 231b and 232b on the surface that is mounted on the substrate, a high effective volume ratio can be secured.

[0206] On the other hand, when the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 2000 can be horizontally mounted on the substrate so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting; when the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0207] The first and second band electrodes 231b and 232b may be formed using any electrically conductive material such as a metal, and the specific material can be determined by considering electrical properties, structural stability, etc. For example, the first and second band electrodes 231b and 232b can be firing electrodes containing conductive metal and glass, and can be formed by applying a paste containing conductive metal and glass to the first surface of the main body, but are not limited to this, and can be a plated layer in which conductive metal is plated onto the first surface of the main body.

[0208] The conductive metals included in the first and second band electrodes 231b and 232b can be materials with excellent electrical conductivity and are not particularly limited. For example, the conductive metals can be one or more of nickel (Ni), copper (Cu), and alloys thereof, and may include the same metals as those included in the internal electrodes 121 and 122.

[0209] On the other hand, in order to ensure sealing characteristics and high strength, in one embodiment, the first external electrode 231 may further include a third band electrode (not shown) arranged on the second surface 2 and connected to the first connecting electrode 231a, and the second external electrode 232 may further include a fourth band electrode (not shown) arranged on the second surface 2 and connected to the second connecting electrode 232a.

[0210] In one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, the following conditions can be met: B1≧G1, B3≦G1, B2≧G2, and B4≦G2. This minimizes the volume occupied by the external electrodes, increases the capacity per unit volume of the stacked electronic component 2000, and increases the area in contact with the solder during mounting, thereby improving the bonding strength.

[0211] However, there is no intention to limit the present invention to B1≧G1, B3≦G1, B2≧G2, and B4≦G2; rather, cases satisfying B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can also be included in one embodiment of the present invention. Therefore, in one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can be satisfied.

[0212] The first and second plating layers 241 and 242 can be placed on the first and second band electrodes 231b and 232b. The first and second plating layers 241 and 242 play a role in improving the mounting characteristics. The types of the first and second plating layers 241 and 242 are not particularly limited and can be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and can be formed in multiple layers.

[0213] As a more specific example of the first and second plating layers 241 and 242, the first and second plating layers 241 and 242 can be Ni plating layers or Sn plating layers, and the Ni plating layer and the Sn plating layer can be formed sequentially on the first and second band electrodes 231b and 232b.

[0214] In one embodiment, the first and second plating layers 241 and 242 can be arranged to extend and cover a portion of the first and second connecting electrodes 231a and 232a, respectively.

[0215] When H1 is the average size in the first direction from the first internal electrodes 121 and 122 that is closest to the first surface 1, and H2 is the average size in the first direction from the extension of the first surface 1 to the edges of the first and second plating layers 241 and 242 placed on the first and second connecting electrodes 231a and 232a, it is possible to satisfy H1 > H2. This suppresses the penetration of the plating solution into the internal electrodes during the plating process and improves reliability.

[0216] On the other hand, if the conductive metal contained in the first and second band electrodes 231b and 232b is mainly composed of Ni, Ni is easily oxidized by the plating solution and moisture, which may lead to a decrease in plating performance.

[0217] In one embodiment, by making the first and second band electrodes 231b and 232b contain Cu, the plating properties for the plating layers 241 and 242 described later can be improved. In particular, since the first and second band electrodes 231b and 232b are arranged and mounted on the first surface of the main body 110, mountability can also be improved.

[0218] Therefore, according to one embodiment, by having the first and second connecting electrodes 231a and 232a include one or more of Ni and Ni alloys, and the first and second band electrodes include Cu, it is possible to suppress radiation cracking and ensure good plating properties and mounting characteristics.

[0219] Preferably, the above effect can be further enhanced if the first and second connecting electrodes 231a and 232a mainly contain Ni, and the first and second band electrodes 231b and 232b mainly contain Cu.

[0220] The Ni content in the first and second connecting electrodes 231a and 232a described above may be 50 mol% or more relative to 100 mol of conductive metal contained in the connecting electrodes, but is not limited thereto, and may mean that it is included in an amount sufficient to suppress the occurrence and propagation of radial cracks.

[0221] The Cu content in the first and second band electrodes 231b and 232b described above may be 50 mol% or more per 100 mol of conductive metal contained in the band electrodes, but is not limited to this, and may mean that it is included in an amount sufficient to ensure adequate plating properties.

[0222] In one embodiment, the first plating layer 241 can be positioned to cover the end of the first insulating layer 251 that is located on the first external electrode 231, and the second plating layer 242 can be positioned to cover the end of the second insulating layer 252 that is located on the second external electrode 232. This strengthens the bonding force between the insulating layers 251, 252 and the plating layers 241, 242, thereby improving the reliability of the multilayer electronic component 2000.

[0223] In one embodiment, the first insulating layer 251 can be positioned to cover the edge of the first plating layer 241 that is located on the first external electrode 231, and the second insulating layer 252 can be positioned to cover the edge of the second plating layer 242 that is located on the second external electrode 232. This strengthens the bonding force between the insulating layers 251, 252 and the plating layers 241, 242, thereby improving the reliability of the multilayer electronic component 2000.

[0224] Figure 22 is a schematic perspective view of a stacked electronic component 2000' according to one embodiment of the present invention. Figure 23 is a cross-sectional view taken along line X-X' in Figure 22.

[0225] Referring to Figures 22 and 23, the stacked electronic component 2000' according to one embodiment of the present invention comprises the main body 110, a first external electrode 231' including a first connecting electrode 231a' disposed on the third surface and a first band electrode 231b' disposed on the first surface and connected to the first connecting electrode, a second connecting electrode 232a' disposed on the fourth surface and a second external electrode including a second band electrode 232b' disposed on the first surface and connected to the second connecting electrode The electrode includes an electrode 232', a first insulating layer 251' disposed on the first connecting electrode, a second insulating layer 252' disposed on the second connecting electrode, a first plating layer 241' disposed on the first band electrode, and a second plating layer 242' disposed on the second band electrode. A first additional electrode layer 234 can be disposed between the first connecting electrode and the third surface, and a second additional electrode layer 235 can be disposed between the second connecting electrode and the fourth surface.

[0226] In this case, the first and second connecting electrodes 231a' and 232a' contain Cu, and the additional electrode layers 234 and 235 contain one or more of Ni and Ni alloys, thereby suppressing the occurrence of radial cracks.

[0227] More preferably, the first and second connecting electrodes 231a' and 232a' contain Cu as the main component, and the additional electrode layers 234 and 235 contain Ni as the main component, which can further enhance the effect of suppressing the occurrence of radial cracks.

[0228] The following describes various embodiments of the stacked electronic components 2000 and 2000' according to one embodiment of the present invention. The description will be based on the stacked electronic component 2000, but the following embodiments are also applicable to the stacked electronic component 2000' in which an additional electrode layer is arranged.

[0229] Figure 24 shows a modified example of Figure 20. Referring to Figure 24, in a modified example 2001 of the stacked electronic component 2000 according to one embodiment of the present invention, the first and second insulating layers 251-1 and 252-1 can be connected to each other as a single insulating layer 253-1 by extending to the fifth and sixth surfaces 5 and 6. At this time, the connected first and second insulating layers 253-1 can be arranged to cover a portion of the fifth and sixth surfaces.

[0230] Figure 25 is a schematic perspective view of a stacked electronic component 2002 according to one embodiment of the present invention. Figure 26 is a cross-sectional view along line XI-XI' in Figure 25.

[0231] Referring to Figures 25 and 26, in the stacked electronic component 2002 according to one embodiment of the present invention, the first and second plating layers 241-2 and 242-2 can be positioned below the extension line of the first surface. This makes it possible to minimize the height of the solder during mounting and to minimize the mounting space.

[0232] Furthermore, the first and second insulating layers 251-2 and 252-2 can extend below the extension line of the first surface and be arranged in contact with the first and second plating layers 241-2 and 242-2.

[0233] Figure 27 shows a modified example of Figure 25. Referring to Figure 25, in a modified example 2003 of the stacked electronic component 2002 according to one embodiment of the present invention, the first and second insulating layers 251-3 and 252-3 can be connected to each other as a single insulating layer 253-3 by extending to the fifth and sixth surfaces 5 and 6. At this time, the connected first and second insulating layers 253-3 can be arranged to cover the entirety of the fifth and sixth surfaces.

[0234] Figure 28 is a schematic perspective view of a stacked electronic component 2004 according to one embodiment of the present invention. Figure 29 is a cross-sectional view along line XII-XII' in Figure 28.

[0235] Referring to Figures 28 and 29, the stacked electronic component 2004 according to one embodiment of the present invention may further include an additional insulating layer 261 disposed on the first surface 1 and positioned between the first band electrode 231b and the second band electrode 232b. This makes it possible to prevent leakage current and the like that which may occur between the first band electrode 231b and the second band electrode 232b under high voltage current.

[0236] The type of additional insulating layer 261 is not particularly limited. For example, the additional insulating layer 261 may include glass, just like the first and second insulating layers 251-2 and 252-2. However, the additional insulating layer 261 and the first and second insulating layers 251-2 and 252-2 are not limited to the same material and may be formed from different materials. For example, it may include one or more materials selected from epoxy resin, acrylic resin, ethyl cellulose, etc.

[0237] Figure 30 shows a modified example of Figure 28. Referring to Figure 30, in a modified example 2005 of the stacked electronic component 2004 according to one embodiment of the present invention, the first and second insulating layers 251-5 and 252-5 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, so that they can be connected as a single insulating layer 253-5.

[0238] Figure 31 is a schematic perspective view of a stacked electronic component 2006 according to one embodiment of the present invention. Figure 32 is a cross-sectional view taken along line XIII-XIII' in Figure 31.

[0239] Referring to FIGS. 31 and 32, a stacked electronic component 2006 according to an embodiment includes a first insulating layer 251-6 disposed on the first connection electrode 231a and a second insulating layer 252-6 disposed on the second connection electrode 232a. From the first surface 1, when the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 241-6 and 242-6 disposed on the first and second connection electrodes 231a and 232a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0240] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0241] FIG. 33 shows a modified example of FIG. 31. Referring to FIG. 33, a modified example 2007 of the stacked electronic component 2006 according to an embodiment of the present invention can be connected as one insulating layer 253-7 by the first and second insulating layers 251-7 and 252-7 extending to the fifth and sixth surfaces 5 and 6 and being connected to each other.

[0242] FIG. 34 schematically shows a perspective view of a stacked electronic component 2008 according to an embodiment of the present invention. FIG. 35 is a cross-sectional view taken along XIV-XIV' of FIG. 34.

[0243] Referring to FIGS. 34 and 35, a stacked electronic component 2008 according to an embodiment of the present invention can be connected as one insulating layer 253-8 by the first and second insulating layers 251-8 and 252-8 extending to the second, fifth, and sixth surfaces 2, 5, and 6 and being connected to each other. As shown in FIG. 35, the insulating layer 253-8 can be in a form that entirely covers the second surface, and the fifth and sixth surfaces can be in a form that only partially covers them.

[0244] Figure 36 is a schematic perspective view of a stacked electronic component 2009 according to one embodiment of the present invention. Figure 37 is a cross-sectional view taken along line XV-XV' in Figure 36.

[0245] Referring to Figures 36 and 37, the average thickness t1' of the first and second plating layers 241-9, 242-9 of the stacked electronic component 2009 according to one embodiment of the present invention can be thinner than the average thickness t2' of the first and second insulating layers 251-9, 252-9.

[0246] According to one embodiment of the present invention, by making the average thickness t1' of the first and second plating layers 241-9 and 242-9 thinner than the average thickness t2' of the first and second insulating layers 251-9 and 252-9, the contact area between the plating layer and the insulating layer can be reduced, thereby suppressing the occurrence of delamination and improving the adhesion strength of the multilayer electronic component 2009 to the substrate 180.

[0247] The average thickness t1' of the first and second plating layers 241-9 and 242-9 is the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a or the first and second band electrodes 231b and 232b, and the average thickness t2' of the insulating layers 251-9 and 252-9 is the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a.

[0248] Figure 38 shows a modified example of Figure 36. Referring to Figure 38, in a modified example 2010 of the stacked electronic component 2009 according to one embodiment of the present invention, the first and second insulating layers 251-10 and 252-10 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, so that they can be connected as a single insulating layer 253-10.

[0249] Figure 39 is a schematic perspective view of a stacked electronic component 3000 according to one embodiment of the present invention. Figure 40 is a cross-sectional view along the line XVI-XVI' in Figure 39. Figure 41 is an enlarged view of region K1 in Figure 40.

[0250] Referring to Figures 39 to 41, a stacked electronic component 3000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, a body 110 having first and second faces facing in a first direction, third and fourth faces connected to the first and second faces and facing in a second direction, and fifth and sixth faces connected to the first to fourth faces and facing in a third direction, a first connecting portion 331a arranged on the third face of the body, a first band portion 331b extending from the first connecting portion to a part of the first face, and a first corner portion 331 extending from the first connecting portion to the corner connecting the second and third faces of the body. The device includes a first external electrode 331 including c, a second external electrode 332 including a second connecting portion 332a disposed on the fourth surface of the main body, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to a corner connecting the second and fourth surfaces of the main body, an insulating layer 351 disposed on the first and second connecting portions 331a, 332a and disposed to cover the second surface, the first and second corner portions, a first plating layer 341 disposed on the first band portion, and a second plating layer 342 disposed on the second band portion, wherein the first and second insulating layers may contain a silicone-based resin.

[0251] In one embodiment, when B3 is the average size in the second direction from the extension line of the third surface to the end of the first corner portion 331c, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion 332c, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This minimizes the volume occupied by the external electrodes 331 and 332 and increases the capacity per unit volume of the stacked electronic component 3000.

[0252] At this time, when B1 is the average size in the second direction from the extension line of the third surface to the end of the first band portion 331b, and B2 is the average size in the second direction from the extension line of the fourth surface to the end of the second band portion 332b, it is possible to satisfy B1≧G1 and B3≧G2. This increases the area in contact with the solder during mounting and improves the bonding strength.

[0253] A stacked electronic component 3000 according to one embodiment may include a body 110 having first and second faces facing in a first direction, third and fourth faces connected to the first and second faces facing in a second direction, and fifth and sixth faces connected to the first to fourth faces facing in a third direction. The body 110 of the stacked electronic component 3000 may have the same configuration as the body 110 of the stacked electronic component 1000, except that the end of the first or second face of the body is contracted, as described later.

[0254] External electrodes 331 and 332 can be arranged on the third surface 3 and fourth surface 4 of the main body 110. The external electrodes 331 and 332 may include first and second external electrodes 331 and 332, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively.

[0255] The external electrodes 331 and 332 may include a first external electrode 331 which includes a first connecting portion 331a located on the third surface, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 331c extending from the first connecting portion to the corner connecting the second and third surfaces, and a second external electrode 332 which includes a second connecting portion 332a located on the fourth surface, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to the corner connecting the second and fourth surfaces. The first connecting portion 331a may be connected to the first internal electrode 121 on the third surface, and the second connecting portion 332a may be connected to the second internal electrode 122 on the fourth surface.

[0256] In one embodiment, the first and second connecting portions 331a and 332a can be arranged at a distance from the fifth and sixth surfaces. This minimizes the proportion occupied by the external electrodes 331 and 332, allowing the stacked electronic component 3000 to be further miniaturized.

[0257] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference is created due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third to sixth surfaces and / or the corners connecting the second surface with the third to sixth surfaces may have a shape that is contracted toward the center of the body 110 in the first direction when the first or second surface is used as a reference. Alternatively, due to the contraction behavior during the sintering process of the body, the corners connecting the first surface 1 with the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 with the third to sixth surfaces 3, 4, 5, and 6 may have a shape that is contracted toward the center of the body 110 in the first direction when the first or second surface is used as a reference. Alternatively, to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process, thereby allowing the corners connecting the first face with the third to sixth faces and / or the corners connecting the second face with the third to sixth faces to have a rounded shape.

[0258] The above-mentioned corners may include the 1st-3rd corner C1-3 connecting the 1st and 3rd faces, the 1st-4th corner C1-4 connecting the 1st and 4th faces, the 2nd-3rd corner C2-3 connecting the 2nd and 3rd faces, and the 2nd-4th corner C2-4 connecting the 2nd and 4th faces. Additionally, the corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. However, in order to suppress the step caused by the internal electrodes 121 and 122, if the internal electrodes are cut after lamination so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, the portions connecting the first surface with the fifth and sixth surfaces and the portions connecting the second surface with the fifth and sixth surfaces may not have a contracted form.

[0259] On the other hand, the first to sixth surfaces of the main body 110 are almost flat, and the non-flat areas can be considered as corners. In addition, the areas of the external electrodes 331 and 332 that are located on the corners can be considered as corner sections.

[0260] From this perspective, the first and second corner portions 331c and 332c can be positioned below the extension line E2 of the second surface, and the first and second corner portions 331c and 332c can be positioned away from the second surface. That is, since the external electrodes 331 and 332 are not positioned on the second surface, the volume occupied by the external electrodes 331 and 332 can be further minimized, and the capacity per unit volume of the stacked electronic component 3000 can be further increased. In addition, the first corner portion 331c can be positioned on a part of the second-third corner C2-3 connecting the third surface and the second surface, and the second corner portion 332c can be positioned on a part of the second-fourth corner C2-4 connecting the fourth surface and the second surface.

[0261] The extension line E2 of the second face can be defined as follows:

[0262] In the length-thickness direction cross-section (L-T cross-section) obtained by cutting the stacked electronic component 3000 at the center in the width direction, seven straight lines P0, P1, P2, P3, P4, P5, P6, P7 in the thickness direction having equal intervals in the length direction from the third surface to the fourth surface are drawn, and a straight line passing through the point where P2 meets the second surface and the point where P4 meets the second surface can be defined as the extension line E2 of the second surface.

[0263] On the other hand, the external electrodes 331 and 332 may be formed of any material as long as it has electrical conductivity such as metal, and a specific material can be determined in consideration of electrical characteristics, structural stability, etc., and furthermore, it can have a multilayer structure.

[0264] The external electrodes 331 and 332 may be fired electrodes containing a conductive metal and glass, or may be resin-based electrodes containing a conductive metal and a resin.

[0265] Also, the external electrodes 331 and 332 can be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the external electrodes 331 and 332 may be formed by a method of transferring a sheet containing a conductive metal onto the main body, or may be formed by a method of transferring a sheet containing a conductive metal onto the fired electrode.

[0266] As the conductive metal contained in the external electrodes 331 and 332, a material having excellent electrical conductivity can be used, but it is not particularly limited. For example, the conductive metal can be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. Preferably, the external electrodes 331 and 332 can contain one or more of Ni and Ni alloys, whereby the connectivity with the internal electrodes 121 and 122 containing Ni can be further improved.

[0267] The insulating layer 351 can be disposed on the first and second connection portions 331a and 332a.

[0268] Since the first and second connection parts 331a and 332a are connected to the internal electrodes 121 and 122, they could potentially become pathways for the penetration of plating solution during the plating process or for the penetration of moisture during actual use. In the present invention, since an insulating layer 351 is placed on the connection parts 331a and 332a, it is possible to prevent the penetration of moisture or plating solution from the outside.

[0269] The insulating layer 351 can be positioned in contact with the first and second plating layers 341 and 342. In this case, the insulating layer 351 may be in contact with the first and second plating layers 341 and 342 in a manner that covers a portion of their edges, or the first and second plating layers 341 and 342 may be in contact with the insulating layer 351 in a manner that covers a portion of its edges.

[0270] The insulating layer 351 can be placed on the first and second connection portions 331a and 332a, and can be positioned to cover the second surface and the first and second corner portions 331c and 332c. Furthermore, by covering the area where the ends of the first and second corner portions 331c and 332c and the main body 110 are in contact with each other, the insulating layer 351 blocks the moisture penetration path, thereby further improving moisture resistance reliability.

[0271] The insulating layer 351 is positioned on the second surface and can extend over the first and second connection portions 331a and 332a. Furthermore, if the external electrodes 331 and 332 are not positioned on the second surface, the insulating layer can be positioned to cover the entire second surface. On the other hand, the insulating layer 351 does not necessarily have to be positioned on the second surface. The insulating layer may not be positioned on part or all of the second surface, and may be separated into two parts, each positioned on the first and second connection portions 331a and 332a. However, even in this case, the insulating layer can be positioned to cover the entire first and second corner portions 331c and 332c. If the insulating layer is not positioned on the entire second surface, it can be positioned below the extension of the second surface. Also, even if the insulating layer is not positioned on the second surface, it can extend from the first and second connection portions 331a and 332a to the fifth and sixth surfaces, forming a single insulating layer.

[0272] In one embodiment, the insulating layer 351 is arranged to cover a portion of the fifth and sixth surfaces, thereby improving reliability. In this case, the portions of the fifth and sixth surfaces not covered by the insulating layer can be exposed to the outside.

[0273] Furthermore, the insulating layer 351 can be positioned to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, thus further improving moisture resistance reliability.

[0274] The insulating layer 351 can prevent the formation of plating layers 341 and 342 on the external electrodes 331 and 332 on which the insulating layer 351 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solutions, etc., from the outside. The components, composition, average thickness, and effects of the insulating layer 351 are the same as those of the insulating layers 151, 251, 252, and 253 included in the multilayer electronic components 1000, 2000 or various embodiments thereof, so a detailed explanation of these is omitted.

[0275] The first and second plating layers 341 and 342 can be placed on the first and second band portions 331b and 332b, respectively. The plating layers 341 and 342 can improve mounting characteristics, and by placing the plating layers 341 and 342 on the band portions 331b and 332b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. One end of the first and second plating layers 341 and 342 can be in contact with the first surface, and the other end can be in contact with the insulating layer 351.

[0276] The types of plating layers 341 and 342 are not particularly limited and can be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and can be formed in multiple layers.

[0277] As a more specific example of the plating layers 341 and 342, the plating layers 341 and 342 can be Ni plating layers or Sn plating layers, and can be in a configuration in which the Ni plating layer and the Sn plating layer are formed sequentially on the first and second band portions 331b and 332b.

[0278] In one embodiment, the first plating layer 341 can be positioned to cover the end of the insulating layer 351 that is placed on the first external electrode 331, and the second plating layer 342 can be positioned to cover the end of the insulating layer 351 that is placed on the second external electrode 332. This strengthens the bonding force between the insulating layer 351 and the plating layers 341 and 342, improving the reliability of the multilayer electronic component 3000. Furthermore, by forming the insulating layer 351 before forming the plating layers 341 and 342 on the external electrodes 331 and 332, the penetration of the plating solution during the plating layer formation process can be more effectively suppressed. By forming the insulating layer before the plating layer, the plating layers 341 and 342 can have a configuration that covers the end of the insulating layer 351.

[0279] In one embodiment, the insulating layer 351 can be positioned to cover the end of the first plating layer 341 that is located on the first external electrode 331, and the insulating layer 351 can be positioned to cover the end of the second plating layer 342 that is located on the second external electrode 332. This strengthens the bonding force between the insulating layer 351 and the plating layers 341 and 342, thereby improving the reliability of the multilayer electronic component 3000.

[0280] In one embodiment, the first and second plating layers 341 and 342 can be arranged to extend so as to cover a portion of the first and second connecting portions 331a and 332a, respectively. When H1 is the average size in the first direction from the first and second internal electrodes 121 and 122 to the internal electrode closest to the first surface 1, and H2 is the average size in the first direction from the extension of the first surface 1 to the ends of the first and second plating layers 341 and 342 arranged on the first and second connecting portions 331a and 332a, it is possible to satisfy H1 > H2. This suppresses the penetration of the plating solution into the internal electrodes during the plating process, thereby improving reliability.

[0281] In one embodiment, when the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface to the ends of the plating layers 341 and 342 disposed on the first and second connection portions 331a and 332a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved. More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may be reduced.

[0282] In one embodiment, the first and second plating layers 341 and 342 can be disposed below the extension line of the first surface. Thereby, the height of the solder during mounting can be minimized, and the mounting space can be minimized. Further, the insulating layer 351 can be disposed so as to extend below the extension line of the first surface and contact the first and second plating layers 341 and 342.

[0283] In one embodiment, when the average size of the main body in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 can be satisfied.

[0284] When B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient fixing strength. On the other hand, when B2 / L exceeds 0.4, there is a risk of leakage current occurring between the first band portion 331b and the second band portion 332b under a high voltage current, and there is a risk that the first band portion 331b and the second band portion 332b may be electrically connected due to plating bleeding or the like during the plating process.

[0285] In one embodiment, an additional insulating layer disposed on the first surface and between the first band portion 331b and the second band portion 332b can be further included. Thereby, leakage current and the like that may occur between the first band portion 331b and the second band portion 332b under high voltage current can be prevented.

[0286] The type of the additional insulating layer does not need to be particularly limited. For example, the additional insulating layer can include a silicone-based resin, similar to the insulating layer 351. However, it is not necessary to limit the additional insulating layer and the insulating layer 351 to the same material, and they may be formed of different materials. For example, it may include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., and may include glass.

[0287] In one embodiment, when the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, B3 < B1 and B4 < B2 can be satisfied. The average length B1 of the first band portion 331b can be longer than the average length B3 of the first corner portion 331c, and the average length of the second band portion 332b can be longer than the average length B4 of the second corner portion 332c. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0288] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 331b is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 332b is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the first corner portion 331c is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the second corner portion 332c is B4, B3 < B1 and B4 < B2 can be satisfied.

[0289] In one embodiment, the average thickness of the first and second plating layers 341 and 342 can be thinner than the average thickness of the insulating layer 351.

[0290] The insulating layer 351 plays a role in preventing the penetration of moisture or plating solution from the outside, but its weak connectivity with the plating layers 341 and 342 may cause delamination of the plating layers. If delamination of the plating layers occurs, the adhesion strength to the substrate may decrease. Here, delamination of the plating layers may mean that a part of the plating layer comes off or is physically separated from the external electrodes 331 and 332. Due to the weak connectivity between the plating layers and the insulating layer, there is a higher possibility of gaps forming at the interface between the insulating layer and the plating layer, or of foreign matter entering, making it more vulnerable to external impacts and increasing the likelihood of delamination.

[0291] According to one embodiment of the present invention, by making the average thickness of the plating layer thinner than the average thickness of the insulating layer, the contact area between the plating layer and the insulating layer can be reduced, thereby suppressing the occurrence of delamination and improving the adhesion strength of the multilayer electronic component 3000 to the substrate.

[0292] There is no particular limit to the size of the 3000 multilayer electronic component.

[0293] However, in order to achieve both miniaturization and high capacitance, it is necessary to reduce the thickness of the dielectric layer and internal electrodes and increase the number of layers. Therefore, in a stacked electronic component 3000 having a size of 1005 (length x width, 1.0 mm x 0.5 mm) or less, the reliability and capacitance improvement effect per unit volume according to the present invention can be more pronounced.

[0294] Therefore, considering manufacturing tolerances, the size of external electrodes, etc., the reliability improvement effect according to the present invention can be more pronounced when the length of the stacked electronic component 3000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 3000 refers to the maximum size of the stacked electronic component 3000 in the second direction, and the width of the stacked electronic component 3000 refers to the maximum size of the stacked electronic component 3000 in the third direction.

[0295] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims attached. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by a person with ordinary skill in the art, and these also fall within the scope of the present invention.

[0296] On the other hand, the expression "one embodiment" used in the present invention does not mean that each embodiment is identical to the others, but is provided to emphasize and explain the unique and distinct features of each embodiment. However, the above-presented embodiment does not exclude cases where it is implemented in combination with the features of other embodiments. For example, even if a matter described in a particular embodiment is not described in another embodiment, it can be interpreted as a description related to the other embodiment, as long as the other embodiment does not describe that matter in the opposite way or in a way that contradicts it.

[0297] Furthermore, the terms used in this invention are explained for illustrative purposes only and are not intended to limit the invention. In this context, singular expressions include plurals unless they clearly have a different meaning in context. [Explanation of Symbols]

[0298] 1000, 2000, 3000 Stacked Electronic Components 1100 Mounting board 110 Main Unit 111 Dielectric layer 112, 113 Cover section 114, 115 Margin section 121, 122 Internal electrode 131, 231, 331 1st external electrode 132, 232, 332 2nd external electrode 134, 135 Additional electrode layer 141, 142, 241, 242, 341, 342 Plating layer 151, 251, 252, 253, 351 Insulating layer 161, 261 Additional insulating layer 180 circuit boards 181, 182 Electrode Pads 191, 192 Handa

Claims

1. A body including a dielectric layer, and first and second internal electrodes alternately disposed with the dielectric layer therebetween, the body including first and second faces facing each other in a first direction, third and fourth faces connected to the first and second faces and facing each other in a second direction, and fifth and sixth faces connected to the first to fourth faces and facing each other in a third direction, a first external electrode including a first connection portion disposed on the third face and a first band portion extending from the first connection portion to a part of the first face, a second external electrode including a second connection portion disposed on the fourth face and a second band portion extending from the second connection portion to a part of the first face, a first insulating layer disposed on the first connection portion and a second insulating layer disposed on the second connection portion, a first plating layer disposed on the first band portion, a second plating layer disposed on the second band portion, a first additional electrode layer disposed between the first connection portion and the third face, a second additional electrode layer disposed between the second connection portion and the fourth face, and wherein the first and second insulating layers contain glass, the first and second external electrodes contain copper (Cu), and the first and second additional electrode layers contain one or more of Ni and Ni alloys, a multilayer electronic component.

2. The multilayer electronic component according to claim 1, wherein the glass contained in the first and second insulating layers contains Si.

3. The multilayer electronic component according to claim 2, wherein a molar fraction of Si contained in the first and second insulating layers is 20 mol% or more and 65 mol% or less.

4. The multilayer electronic component according to claim 1, wherein when an average size in the first direction from the first face to the internal electrode closest to the first face among the first and second internal electrodes is H1, and an average size in the first direction from an extension line of the first face to an end of the plating layer disposed on the first and second connection portions is H2, H1 > H2 is satisfied.

5. The multilayer electronic component according to claim 1, wherein when an average size in the first direction from the first face to the internal electrode closest to the first face among the first and second internal electrodes is H1, and an average size in the first direction from an extension line of the first face to an end of the plating layer disposed on the first and second connection portions is H2, H1 < H2 is satisfied.

6. When an average size in the first direction of the body is T, the multilayer electronic component according to claim 5, wherein H2 < T / 2 is satisfied.

7. The laminated electronic component according to claim 1, wherein the first and second plating layers are disposed below the extension line of the first surface.

8. When the average size of the main body in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, The laminated electronic component according to claim 1, satisfying 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.

4.

9. The laminated electronic component according to claim 1, further including an additional insulating layer disposed on the first surface and between the first band portion and the second band portion.

10. The laminated electronic component according to claim 1, wherein the average thickness of the dielectric layer is 0.35 μm or less.

11. The laminated electronic component according to claim 1, wherein the average thickness of the first and second internal electrodes is 0.35 μm or less.

12. The main body includes a capacitance forming portion including first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and a cover portion disposed between both end faces of the capacitance forming portion in the first direction. The laminated electronic component according to claim 1, wherein the average size of the cover portion in the first direction is 15 μm or less.

13. The laminated electronic component according to claim 1, wherein the average thickness of the first and second plating layers is thinner than the average thickness of the regions disposed on the first and second connection portions among the first and second insulating layers.

14. The laminated electronic component according to claim 1, wherein the first plating layer is disposed so as to cover the end close to the first surface of the first insulating layer, and the second plating layer is disposed so as to cover the end close to the first surface of the second insulating layer.

15. The laminated electronic component according to claim 1, wherein the first insulating layer is disposed so as to cover the end disposed on the first external electrode of the first plating layer, and the second insulating layer is disposed so as to cover the end disposed on the second external electrode of the second plating layer.

16. The first external electrode includes a first side surface band portion extending from the first connection portion to a part of the fifth and sixth surfaces. The second external electrode includes a second side surface band portion extending from the second connection portion to a part of the fifth and sixth surfaces. The laminated electronic component according to claim 1, wherein the size in the second direction of the first and second side surface band portions increases as it gets closer to the first surface.

17. The laminated electronic component according to claim 1, wherein the first and second external electrodes are arranged so as to be separated from the fifth and sixth surfaces.

18. The laminated electronic component according to claim 1, wherein the first and second external electrodes are arranged so as to be separated from the second surface.

19. The laminated electronic component according to claim 1, wherein the first and second insulating layers extend to the second surface and are connected to each other.

20. The laminated electronic component according to claim 1, wherein the first and second insulating layers extend to the fifth and sixth surfaces and are connected to each other.

21. The laminated electronic component according to claim 1, wherein the first and second insulating layers are not arranged on the second surface, fifth surface and sixth surface.

22. The first external electrode includes a third band portion extending from the first connection portion to a part of the second surface, The laminated electronic component according to claim 1, wherein the second external electrode includes a fourth band portion extending from the second connection portion to a part of the second surface.

23. The main body includes a first-3 corner connecting the first surface and the third surface, a first-4 corner connecting the first surface and the fourth surface, a second-3 corner connecting the second surface and the third surface, and a second-4 corner connecting the second surface and the fourth surface. The first-3 corner and the second-3 corner have a form that contracts toward the center of the main body in the first direction as they approach the third surface, and the first-4 corner and the second-4 corner have a form that contracts toward the center of the main body in the first direction as they approach the fourth surface. The laminated electronic component according to claim 1, wherein the first external electrode includes a first corner portion extending and arranged on the first-3 corner and the second-3 corner at the first connection portion, and the second external electrode includes a second corner portion extending and arranged on the first-4 corner and the second-4 corner from the second connection portion.

24. When the average size in the second direction from the extension line of the third surface to the end of the first corner portion is B3, the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, The laminated electronic component according to claim 23, which satisfies B3≤G1 and B4≤G2.

25. The first external electrode includes a first connection electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connection electrode. The laminated electronic component according to claim 1, wherein the second external electrode includes a second connection electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connection electrode.

26. The laminated electronic component according to claim 25, wherein the first and second connection electrodes are disposed at a distance from the fifth and sixth surfaces.

27. The laminated electronic component according to claim 25, wherein the first and second connection electrodes are disposed at a distance from the second surface.

28. The first external electrode further includes a third band electrode disposed on the second surface and connected to the first connection electrode. The laminated electronic component according to claim 25, wherein the second external electrode further includes a fourth band electrode disposed on the second surface and connected to the second connection electrode.

29. The laminated electronic component according to claim 25, wherein the first connection electrode and the second connection electrode include the same metal as the metal included in the internal electrode.

30. The laminated electronic component according to claim 25, wherein the first band electrode and the second band electrode are fired electrodes including a conductive metal and glass.

31. The laminated electronic component according to claim 25, wherein the first connection electrode and the second connection electrode are fired electrodes including a conductive metal and glass.

32. The laminated electronic component according to claim 25, wherein the first band electrode and the second band electrode are plating layers.

33. The laminated electronic component according to claim 25, wherein the first connection electrode and the second connection electrode are plating layers.

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