Laminated electronic component

Abstract

To provide a laminated electronic component capable of improving the reliability and the moisture resistance reliability while improving capacity per unit volume, and of minimizing a mounting space.SOLUTION: A laminated electronic component 1000 is configured by a main body 110 that includes a dielectric layer 111 and first internal electrodes 121 and second internal electrodes 122 arranged alternately while interposing the dielectric layer therebetween, and that includes first and second surfaces opposed to each other in a first direction, third and fourth surfaces opposed to each other in a second direction and coupled with the first and second surfaces, and fifth and sixth surfaces opposed to each other in a third direction and coupled with the first to fourth surfaces. On the third and fourth surfaces, a first connection part 131a and a second connection part 132a are arranged, respectively. Further, an insulating layer 151 arranged so as to extend to the first and second connection parts is provided on the second surface. A region arranged on the second surface of the insulating layer has a convex shape in the first direction.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] These multilayer ceramic capacitors offer the advantages of being small yet guaranteeing high capacitance and being easy to mount, making them suitable for use as components in various electronic devices. With the miniaturization and increased power output of various electronic devices such as computers and mobile devices, the demand for smaller and higher-capacitance multilayer ceramic capacitors is growing. Furthermore, with the recent increase in industry interest in automotive electronic components, multilayer ceramic capacitors are required to have high reliability characteristics for use in automobiles or infotainment systems.

[0004] To miniaturize and increase the capacitance of multilayer ceramic capacitors, the internal electrodes and dielectric layers must be made thinner and the number of layers increased. This requires minimizing the volume of parts that do not affect capacitance formation and increasing the effective volume fraction necessary to achieve the required capacitance. Furthermore, to mount as many components as possible within a limited substrate area, the mounting space must be minimized.

[0005] Furthermore, as multilayer ceramic capacitors become smaller and their capacitance increases, the margin thickness decreases, making it easier for moisture or plating solutions to penetrate from the outside, which can potentially weaken their reliability. Therefore, there is a need for a method to protect multilayer ceramic capacitors from moisture or plating solution penetration from the outside. [Overview of the project] [Problems that the invention aims to solve]

[0006] One of the several objectives of the present invention is to provide a stacked electronic component with improved reliability.

[0007] One of the several objectives of the present invention is to provide a multilayer electronic component with improved moisture resistance reliability.

[0008] One of the several objectives of the present invention is to provide a stacked electronic component with improved capacity per unit volume.

[0009] One of the several objectives of the present invention is to provide a stacked electronic component that can minimize the mounting space.

[0010] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0011] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer in between, a body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, and a first external electrode including a first connecting portion arranged on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a third band portion extending from the first connecting portion to a part of the second surface. The device includes a second external electrode comprising a second connecting portion disposed on the fourth surface, a second band portion extending from the second connecting portion to a part of the first surface, and a fourth band portion extending from the second connecting portion to a part of the second surface; an insulating layer disposed on the second surface and extending over the first and second connecting portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the insulating layer includes glass, and the portion of the insulating layer disposed on the second surface may have a convex shape in the first direction.

[0012] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in between, a body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, a first external electrode including a first connecting portion on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a first corner portion extending from the first connecting portion to the corner connecting the second and third surfaces, a second connecting portion on the fourth surface, a second band portion extending from the second connecting portion to a part of the first surface, and a second corner portion extending from the second connecting portion to the corner connecting the second and fourth surfaces The device includes a second external electrode, an insulating layer disposed on the first and second connection portions and positioned to cover the second surface, first and second corner portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion, wherein B3 is the average size in the second direction from the extension line of the third surface to the end of the first corner portion, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, satisfying B3 ≤ G1 and B4 ≤ G2, the insulating layer includes glass, and the region of the insulating layer disposed on the second surface may have a convex shape in the first direction.

[0013] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in between, and comprises a body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; a first external electrode including a first connection portion arranged on the third surface and a first band portion extending from the first connection portion to a part of the first surface; a second external electrode including a second connection portion arranged on the fourth surface and a second band portion extending from the second connection portion to a part of the first surface; an insulating layer arranged on the second surface and extending over the first and second connection portions; a first plating layer arranged on the first band portion; and a second plating layer arranged on the second band portion, wherein the insulating layer includes glass, and the region of the insulating layer arranged on the second surface may have a convex shape in the first direction.

[0014] A stacked electronic component according to one embodiment of the present invention includes a body comprising a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in between, the body comprising first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; a first external electrode comprising a first connecting electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connecting electrode; a second external electrode comprising a second connecting electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connecting electrode; an insulating layer disposed on the second surface and extending over the first and second connecting electrodes; a first plating layer disposed on the first band electrode; and a second plating layer disposed on the second band electrode, wherein the insulating layer comprises glass, and the region of the insulating layer disposed on the second surface may have a convex shape in the first direction. [Effects of the Invention]

[0015] One of the various effects of the present invention is that by disposing an insulating layer on the connection portion of the external electrode and disposing a plating layer on the band portion of the external electrode, the capacitance per unit volume of the multilayer electronic component is improved while the reliability is improved.

[0016] One of the various effects of the present invention is that the mounting space of the multilayer electronic component is minimized.

[0017] One of the various effects of the present invention is that the moisture resistance reliability is improved by making the insulating layer convex.

[0018] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of describing the specific embodiments of the present invention.

Brief Description of the Drawings

[0019] [Figure 1] Schematically shows a perspective view of a multilayer electronic component according to an embodiment of the present invention. [Figure 2] Schematically shows a perspective view of the main body of the multilayer electronic component of FIG. 1. [Figure 3] A cross-sectional view taken along line I-I' of FIG. 1. [Figure 4] An exploded perspective view schematically showing the main body of FIG. 2 disassembled. [Figure 5] Schematically shows a perspective view of a substrate on which the multilayer electronic component of FIG. 1 is mounted. [Figure 6] Schematically shows a perspective view of a multilayer electronic component according to an embodiment of the present invention. [Figure 7] A cross-sectional view taken along line II-II' of FIG. 6. [Figure 8] Schematically shows a perspective view of a multilayer electronic component according to an embodiment of the present invention. [Figure 9] A cross-sectional view taken along line III-III' of FIG. 8. [Figure 10] Schematically shows a perspective view of a multilayer electronic component according to an embodiment of the present invention. [Figure 11] This is a cross-sectional view along the line IV-IV' in Figure 10. [Figure 12] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 13] This is a cross-sectional view along the line V-V' in Figure 12. [Figure 14] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 15] This is a cross-sectional view along the line VI-VI' in Figure 14. [Figure 16] This shows a modified version of Figure 14. [Figure 17] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 18] This is a cross-sectional view along the line VII-VII' in Figure 17. [Figure 19] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 20] This is a cross-sectional view along line VIII-VIII' in Figure 19. [Figure 21] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 22] This is a cross-sectional view along the line IX-IX' in Figure 21. [Figure 23] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 24] This is a cross-sectional view along the line X-X' in Figure 23. [Figure 25] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 26] This is a cross-sectional view along the line XI-XI' in Figure 25. [Figure 27] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 28] This is a cross-sectional view along the line XII-XII' in Figure 27. [Figure 29]This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 30] This is a cross-sectional view along the line XIII-XIII' in Figure 29. [Figure 31] This is a magnified view of the K1 region in Figure 30. [Modes for carrying out the invention]

[0020] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0021] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation; therefore, the present invention is not necessarily limited to what is shown. Components with the same function within the scope of the same concept are described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a component, this does not mean that other components are excluded, but rather that other components may be further included, unless otherwise stated.

[0022] In the drawing, the first direction can be defined as the lamination direction or the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0023] Figure 1 schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention, Figure 2 schematically shows a perspective view of the main body of the stacked electronic component in Figure 1, Figure 3 is a cross-sectional view along the line I-I' in Figure 1, Figure 4 is an exploded perspective view schematically showing the main body of Figure 2 disassembled, and Figure 5 schematically shows a perspective view of a substrate on which the stacked electronic component in Figure 1 is mounted.

[0024] A stacked electronic component 1000 according to one embodiment of the present invention will be described below with reference to Figures 1 to 5.

[0025] A stacked electronic component 1000 according to one embodiment of the present invention includes a dielectric layer 111, first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, a body 110 including first and second surfaces 1 and 2 facing in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in a third direction, and a first external electrode 131 including a first connecting portion 131a arranged on the third surface, a first band portion 131b extending from the first connecting portion to a part of the first surface, and a third band portion 131c extending from the first connecting portion to a part of the second surface, The device includes a second external electrode 132 comprising a second connecting portion 132a arranged on the fourth surface, a second band portion 132b extending from the second connecting portion to a part of the first surface, and a fourth band portion 132c extending from the second connecting portion to a part of the second surface; an insulating layer 151 arranged on the second surface and extending over the first and second connecting portions 131a and 132a; a first plating layer 141 arranged on the first band portion 131b; and a second plating layer 142 arranged on the second band portion 132b, wherein the insulating layer 151 contains glass, and the portion of the insulating layer arranged on the second surface may have a convex shape in the first direction.

[0026] The main body 110 consists of alternating layers of dielectric layers 111 and internal electrodes 121 and 122. There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be a hexahedron or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 is not a perfectly straight hexahedron, but can be substantially hexahedron-shaped.

[0027] The main body 110 may have first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2 and connected to the third and fourth surfaces 3 and 4 and facing each other in a third direction.

[0028] In one embodiment, the main body 110 includes a first-to-third corner connecting the first and third surfaces, a first-to-fourth corner connecting the first and fourth surfaces, a second-to-third corner connecting the second and third surfaces, and a second-to-fourth corner connecting the second and fourth surfaces. The first-to-third corner and the second-to-third corner have a shape that contracts towards the center of the main body in the first direction as they approach the third surface, and the first-to-fourth corner and the second-to-fourth corner can have a shape that contracts towards the center of the main body in the first direction as they approach the fourth surface.

[0029] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference is generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface and the third to fifth surfaces and / or the second surface and the third to fifth surfaces may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, and 6 may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, in order to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process to round the corners connecting the first face with the third to sixth faces and / or the corners connecting the second face with the third to sixth faces.

[0030] The above-mentioned corners may include the 1st-3rd corner connecting the 1st and 3rd faces, the 1st-4th corner connecting the 1st and 4th faces, the 2nd-3rd corner connecting the 2nd and 3rd faces, and the 2nd-4th corner connecting the 2nd and 4th faces. Furthermore, the corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. The 1st to 6th faces of the main body 110 can generally be flat surfaces, and non-flat areas can be designated as corners. Hereinafter, the extension of each face may refer to a line extended from the flat portion of each face.

[0031] In this case, the regions of the external electrodes 131 and 132 located on the corners of the main body 110 can be designated as corner portions, the regions located on the third and fourth surfaces of the main body 110 can be designated as connecting portions, and the regions located on the first and second surfaces of the main body can be designated as band portions.

[0032] On one hand, in order to suppress the step formed by the internal electrodes 121 and 122, after cutting such that the internal electrodes after lamination are exposed on the fifth and sixth surfaces 5 and 6 of the main body, when a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form the margin portions 114 and 115, the portions connecting the first surface with the fifth and sixth surfaces and the portions connecting the second surface with the fifth and sixth surfaces do not necessarily have a shrunk form.

[0033] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0034] According to one embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as a sufficient capacitance can be obtained. For example, a barium titanate - based material, a lead - composite perovskite - based material, a strontium titanate - based material, etc. can be used. The barium titanate - based material can contain BaTiO3 - based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0035] Also, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the powder such as barium titanate (BaTiO3) for the raw material for forming the dielectric layer 111 according to the object of the present invention.

[0036] On the other hand, the average thickness td of the dielectric layer 111 does not need to be particularly limited. However, when the dielectric layer is formed thinly with a thickness of less than 0.6 μm, there was a risk of reduced reliability, especially when the thickness of the dielectric layer was 0.35 μm or less.

[0037] According to one embodiment of the present invention, the region of the insulating layer 151 located on the second surface has a convex shape, and the insulating layer 151 is extended and positioned over the connection portions 131a and 132a of the external electrodes. This prevents the penetration of moisture and plating solution from the outside, thereby improving reliability. As a result, excellent reliability can be ensured even when the average thickness of the dielectric layer 111 is 0.35 μm or less.

[0038] Therefore, the reliability improvement effect according to the present invention can be more pronounced when the average thickness of the dielectric layer 111 is 0.35 μm or less. The average thickness td of the dielectric layer 111 can mean the average thickness of the dielectric layer 111 disposed between the first and second internal electrodes 121 and 122.

[0039] The average thickness of the dielectric layer 111 can be measured by scanning an image of the cross-section of the main body 110 in the length and thickness direction (LT) with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, in the scanned image, the thickness of a single dielectric layer can be measured at 30 equally spaced points in the length direction, and the average value can be calculated. These 30 equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 dielectric layers and measuring the average values, the average thickness of the dielectric layer can be further generalized.

[0040] The main body 110 may include a capacitance forming section Ac which is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 which are arranged facing each other with a dielectric layer 111 in between to form a capacitance, and cover sections 112 and 113 which are formed on the upper and lower parts of the capacitance forming section Ac in the first direction. Furthermore, the capacitance forming section Ac is the part that contributes to the capacitance formation of the capacitor and can be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with a dielectric layer 111 in between.

[0041] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the volume-forming portion Ac in the first direction and a lower cover portion 113 positioned below the volume-forming portion Ac in the first direction.

[0042] The upper cover portion 112 and the lower cover portion 113 described above can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0043] The upper cover portion 112 and the lower cover portion 113 do not contain internal electrodes and may contain the same material as the dielectric layer 111. That is, the upper cover portion 112 and the lower cover portion 113 may contain ceramic materials, for example, barium titanate (BaTiO3) based ceramic materials.

[0044] On the other hand, the average thickness of the cover portions 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the stacked electronic component, the average thickness tc of the cover portions 112 and 113 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, the region placed on the second surface of the insulating layer 151 has a convex shape, and the insulating layer 151 is extended and placed on the connection portions 131a and 132a of the external electrodes, thereby preventing the penetration of moisture from the outside, the penetration of plating solution, etc., and improving reliability. Therefore, even if the average thickness tc of the cover portions 112 and 113 is 15 μm or less, excellent reliability can be ensured.

[0045] The average thickness tc of the cover portions 112 and 113 can represent the size in the first direction, and can be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0046] Furthermore, margin portions 114 and 115 can be arranged on the side surfaces of the volume-forming portion Ac. The margin portions 114 and 115 may include a first margin portion 114 arranged on the fifth surface 5 of the main body 110 and a second margin portion 115 arranged on the sixth surface 6. That is, the margin portions 114 and 115 can be arranged on both end surfaces in the width direction of the main body 110.

[0047] As shown in Figure 3, the margin portions 114 and 115 can refer to the areas between the interface between both ends of the first and second internal electrodes 121 and 122 and the body 110 in a cross-section obtained by cutting the main body 110 in the width-thickness (WT) direction. The margin portions 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0048] The margin portions 114 and 115 may be formed by applying conductive paste to the ceramic green sheet, except for the areas where the margin portions are formed, to form internal electrodes. In addition, in order to suppress the step caused by the internal electrodes 121 and 122, the laminated internal electrodes may be cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers may be laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form the margin portions 114 and 115.

[0049] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the margin portions 114 and 115 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, the region placed on the second surface of the insulating layer 151 has a convex shape, and the insulating layer 151 is extended and placed on the connection portions 131a and 132a of the external electrodes, thereby preventing the penetration of moisture from the outside, the penetration of plating solution, etc., and improving reliability. Therefore, even if the average width of the margin portions 114 and 115 is 15 μm or less, excellent reliability can be ensured.

[0050] The average width of the margin portions 114 and 115 can represent the average size of the margin portions 114 and 115 in the third direction, and can be the average value of the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the volume forming portion Ac.

[0051] The internal electrodes 121 and 122 are stacked alternately with the dielectric layer 111. The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are arranged alternately facing each other with the dielectric layer 111 constituting the main body 110 in between, and can be exposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0052] Referring to Figure 3, the first internal electrode 121 can be separated from the fourth surface 4 and exposed via the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed via the fourth surface 4. The first external electrode 131 can be placed on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 can be placed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0053] In other words, the first internal electrode 121 is not connected to the second external electrode 132, but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131, but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance apart on the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance apart on the third surface 3.

[0054] In this case, the first and second internal electrodes 121 and 122 can be electrically isolated from each other by a dielectric layer 111 placed in between. The main body 110 can be formed by alternately stacking ceramic green sheets printed with the first internal electrode 121 and ceramic green sheets printed with the second internal electrode 122, and then firing them.

[0055] The materials used to form the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0056] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following on a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. While screen printing or gravure printing can be used as the printing method for the conductive paste for internal electrodes, the present invention is not limited to these methods.

[0057] On the other hand, the average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited. However, when the internal electrodes are formed thinly with a thickness of less than 0.6 μm, reliability may decrease, especially when the thickness of the internal electrodes is 0.35 μm or less.

[0058] According to one embodiment of the present invention, the region of the insulating layer 151 located on the second surface has a convex shape, and the insulating layer 151 is extended and positioned over the connection portions 131a and 132a of the external electrodes. This prevents the penetration of moisture and plating solution from the outside, thereby improving reliability. As a result, excellent reliability can be ensured even when the average thickness of the internal electrodes 121 and 122 is 0.35 μm or less.

[0059] Therefore, when the thickness of the internal electrodes 121 and 122 is 0.35 μm or less on average, the effects of the present invention can be made more pronounced, and miniaturization and increased capacitance of the stacked electronic component can be achieved more easily.

[0060] The average thickness te of the internal electrodes 121 and 122 can be said to represent the average thickness of the internal electrodes 121 and 122. The average thickness of the internal electrodes 121 and 122 can be measured by scanning an image of the cross-section of the main body 110 in the length and thickness direction (LT) with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, in the scanned image, the thickness of one internal electrode can be measured at 30 equally spaced points in the length direction, and the average value can be calculated. The 30 equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 internal electrodes and measuring the average value, the average thickness of the internal electrodes can be further generalized.

[0061] External electrodes 131 and 132 can be arranged on the third surface 3 and fourth surface 4 of the main body 110. The external electrodes 131 and 132 may include first and second external electrodes 131 and 132, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively.

[0062] The external electrodes 131 and 132 may include a first external electrode 131 which includes a first connecting portion 131a located on the third surface and a first band portion 131b extending from the first connecting portion to a part of the first surface, and a second external electrode 132 which includes a second connecting portion 132a located on the fourth surface and a second band portion 132b extending from the second connecting portion to a part of the first surface. The first connecting portion 131a can be connected to the first internal electrode 121 on the third surface, and the second connecting portion 132a can be connected to the second internal electrode 122 on the fourth surface.

[0063] Furthermore, the first external electrode 131 may include a third band portion 131c extending from the first connection portion 131a to a part of the second surface, and the second external electrode 132 may include a fourth band portion 132c extending from the second connection portion 132a to a part of the second surface. In addition, the first external electrode 131 may include a first side band portion extending from the first connection portion 131a to a part of the fifth and sixth surfaces, and the second external electrode 132 may include a second side band portion extending from the second connection portion 132a to a part of the fifth and sixth surfaces.

[0064] However, the third band portion, the fourth band portion, the first side band portion, and the second side band portion are not essential components of the present invention. The first and second external electrodes 131 and 132 do not have to be placed on the second surface, nor do they have to be placed on the fifth and sixth surfaces. By not placing the first and second external electrodes 131 and 132 on the second surface, the first and second external electrodes 131 and 132 can be placed below the extension line of the second surface of the main body. In addition, the first and second connecting portions 131a and 132a can be placed at a distance from the fifth and sixth surfaces, and the first and second connecting portions 131a and 132a can be placed at a distance from the second surface. In addition, the first and second band portions 131b and 132b can also be placed at a distance from the fifth and sixth surfaces.

[0065] On the other hand, the first and second external electrodes 131 and 132 may include third and fourth band portions 131c and 132c, but may not include side band portions. In this case, the first and second connecting portions 131a and 132a, and the first to fourth band portions 131a, 132b, 131c, and 132c may be separated from the fifth and sixth surfaces.

[0066] In this embodiment, a structure is described in which the stacked electronic component 1000 has two external electrodes 131 and 132. However, the number and shape of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 or other purposes.

[0067] On the other hand, the external electrodes 131 and 132 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties, structural stability, etc. Furthermore, they may have a multilayer structure.

[0068] The external electrodes 131 and 132 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0069] The external electrodes 131 and 132 may be formed in a manner in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Alternatively, the external electrodes 131 and 132 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0070] While materials with excellent electrical conductivity can be used as the conductive metal in the external electrodes 131 and 132, they are not particularly limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes 131 and 132 may contain one or more of Ni and Ni alloys. This can further improve the connectivity with the internal electrodes 121 and 122 which contain Ni.

[0071] The insulating layer 151 is positioned on the second surface and can extend over the first and second connecting portions 131a and 132a. Since the first and second connecting portions 131a and 132a are connected to the internal electrodes 121 and 122, they can serve as pathways for the penetration of the plating solution during the plating process or for moisture penetration during actual use. In this invention, since the insulating layer 151 is positioned over the connecting portions 131a and 132a, it is possible to prevent the penetration of moisture from the outside or the penetration of the plating solution.

[0072] The insulating layer 151 can be positioned in contact with the first and second plating layers 141 and 142. In this case, the insulating layer 151 may be in contact with the first and second plating layers 141 and 142 in a manner that partially covers their edges, or the first and second plating layers 141 and 142 may be in contact with the insulating layer 151 in a manner that partially covers their edges.

[0073] The insulating layer 151 can be placed on the first and second connection portions 131a and 132a and positioned to cover the second surface and the third and fourth band portions 131c and 132c. In this case, the insulating layer 151 can be positioned to cover the area of ​​the second surface where the third and fourth band portions 131c and 132c are not located, and the third and fourth band portions 131c and 132c themselves. This allows the insulating layer 151 to cover the area where the ends of the third and fourth band portions 131c and 132c are in contact with the main body 110, thereby blocking the path of moisture penetration and further improving moisture resistance reliability.

[0074] The insulating layer 151 can be positioned to completely cover the second surface if the external electrodes 131 and 132 are not positioned on the second surface. Furthermore, the insulating layer 151 can be positioned to cover the first and second side band portions, and parts of the fifth and sixth surfaces. In this case, parts of the fifth and sixth surfaces not covered by the insulating layer 151 can be exposed to the outside.

[0075] Furthermore, the insulating layer 151 may be arranged to cover the first and second side band portions, the fifth surface, and the sixth surface entirely. In this case, the fifth and sixth surfaces are not exposed to the outside, thus improving moisture resistance reliability. The connection portions 131a and 132a are also not directly exposed to the outside, thus improving the reliability of the laminated electronic component 1000. More specifically, the insulating layer can cover the first and second side band portions entirely, and cover all areas of the fifth and sixth surfaces except for the areas where the first and second side band portions are formed.

[0076] The insulating layer 151 can prevent the formation of plating layers 141 and 142 on the external electrodes 131 and 132 on which the insulating layer 151 is placed, and can improve sealing properties to minimize the penetration of moisture, plating solution, etc. from the outside.

[0077] The insulating layer 151 includes glass, and the region of the insulating layer 151 located on the second surface may have a convex shape in the first direction. Furthermore, the size of the region of the insulating layer 151 located on the second surface may be larger in the first direction at the center of the second direction than at the end of the second direction. Also, the size of the region of the insulating layer 151 located on the second surface may be larger in the first direction at the center of the third direction than at the end of the third direction.

[0078] If the insulating layer 151 contains glass, due to the properties of the glass series, heat is required during the sintering process, which can generate stress within the main body and cause cracks, potentially reducing moisture resistance reliability. Furthermore, cracks are more likely to occur on the second surface of the main body, which has a large contact area with the insulating layer 151, and within the second surface, cracks are most likely to occur in the center in the second direction.

[0079] According to the present invention, by increasing the thickness of the insulating layer in the region of the insulating layer 151 that is located on the second surface and has a convex shape in the first direction and is in contact with the main body, moisture penetration can be blocked and humidity resistance reliability can be improved. By reducing the thickness of the insulating layer at the end of the second surface in the second direction, where the probability of crack occurrence is relatively low, it is possible to reduce the volume of the laminated electronic component and improve humidity resistance reliability while preventing a decrease in capacity per unit volume.

[0080] In one embodiment, the first internal electrode 121 is connected to the third surface and spaced apart from the fourth surface, and the second internal electrode 122 is connected to the fourth surface and spaced apart from the third surface. When G1 is the average size in the second direction of the region spaced apart from the third surface and the second internal electrode, G2 is the average size in the second direction of the region spaced apart from the fourth surface and the first internal electrode, L1a is the average size in the first direction from a point on the first surface spaced G1 away from the extension of the third surface to the outer surface of the insulating layer, L2a is the average size in the first direction from a point on the first surface spaced G2 away from the extension of the fourth surface to the outer surface of the insulating layer, and Lc is the average size in the first direction from the center of the first surface in the second direction to the outer surface of the insulating layer, the conditions 0.4 ≤ L1a / Lc ≤ 0.8 and 0.4 ≤ L2a / Lc ≤ 0.8 can be satisfied.

[0081] By satisfying 0.4 ≤ L1a / Lc ≤ 0.8 and 0.4 ≤ L2a / Lc ≤ 0.8, it is possible to improve moisture resistance reliability while preventing a decrease in capacity per unit volume. If L1a / Lc and L2a / Lc exceed 0.8, the effect of improving reliability due to the convex shape and preventing a decrease in capacity per unit volume may not be sufficient. If L1a / Lc and L2a / Lc are less than 0.4, the thickness of the insulating layer in the center of the second direction becomes excessively thick, which may lead to a decrease in capacity per unit volume.

[0082] In one embodiment, when the average size in the second direction from the extension line E3 of the third surface to the end B3e of the third band is B3, and the average size in the second direction from the extension line E4 of the fourth surface to the end B4e of the fourth band is B4, then B3≧G1 and B4≧G2 can be satisfied.

[0083] In this case, when L1b is the average size in the first direction from the end B3e of the third band to the outer surface of the insulating layer 151, and L2b is the average size in the first direction from the end B4e of the fourth band to the outer surface of the insulating layer 151, the following conditions can be satisfied: 1.1 × L1a ≤ L1b ≤ 0.9 × Lc and 1.1 × L2a ≤ L2b ≤ 0.9 × Lc. The ends B3e and B4e of the third and fourth bands can become the main pathways for moisture penetration. Therefore, by satisfying 1.1 × L1a ≤ L1b ≤ 0.9 × Lc and 1.1 × L2a ≤ L2b ≤ 0.9 × Lc, the thickness of the insulating layer at the ends B3e and B4e of the third and fourth bands can be increased to ensure a structure that is less susceptible to moisture penetration, thereby further improving moisture resistance reliability.

[0084] There is no need to specifically limit the numerical ranges of L1a, L2a, L1b, L2b, and Lc. For example, L1a and L2a may be 20-30 μm, L1b and L2b may be 24-36 μm, and Lc may be 28-40 μm.

[0085] The above G1 and G2 can be defined as follows: G1 is the average size in the second direction, measured for any five second internal electrodes located in the center of the first direction, and separated to the third surface, in a cross-section obtained by cutting the main body 110 in the first and second directions at the center of the third direction; and G2 is the average size in the second direction, measured for any five first internal electrodes located in the center of the first direction, and separated to the fourth surface.

[0086] Furthermore, the method can be further generalized by determining G1 and G2 from cross-sections (LT cross-sections) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions, and then averaging these values ​​to obtain G1 and G2.

[0087] The above-mentioned L1a, L2a, L1b, L2b, and Lc can be determined by first finding L1a, L2a, L1b, L2b, and Lc at three cross-sections obtained by cutting the main body in the first and second directions at points 4 / 10, 5 / 10, and 6 / 10 in the third direction, and then averaging these values.

[0088] The method for controlling the convex shape of the region on the second surface of the insulating layer 151 is not particularly limited. For example, after forming external electrodes 131 and 132 on the main body 110, the second surface of the main body can be dipped in a paste containing glass and then heat-treated to form an insulating layer in which the region on the second surface has a convex shape.

[0089] In one embodiment, the glass contained in the insulating layer 151 may be glass with excellent resistance to plating solutions, and may have a Si mole fraction of 20 mol% or more and 65 mol% or less.

[0090] In one embodiment, the insulating layer 151 is arranged in direct contact with the first and second external electrodes 131 and 132, and the first and second external electrodes 131 and 132 may include conductive metal and glass. Including glass in the first and second external electrodes 131 and 132 can improve the bonding strength with the insulating layer 151, and since the plating layers 141 and 142 do not need to be placed in the region of the outer surface of the first and second external electrodes 131 and 132 where the insulating layer 151 is located, corrosion of the external electrodes by the plating solution can be effectively suppressed.

[0091] In this case, the first plating layer 141 can be positioned to cover the end of the insulating layer 151 that is placed on the first external electrode 131, and the second plating layer 142 can be positioned to cover the end of the insulating layer 151 that is placed on the second external electrode 132. By forming the insulating layer 151 first before forming the plating layers 141 and 142 on the external electrodes 131 and 132, the penetration of the plating solution during the plating layer formation process can be suppressed more reliably. By forming the insulating layer before the plating layer, the plating layers 141 and 142 can have a configuration that covers the end of the insulating layer 151.

[0092] The first and second plating layers 141 and 142 can be placed on the first and second band portions 131b and 132b, respectively. The plating layers 141 and 142 can improve mounting characteristics, and by placing the plating layers 141 and 142 on the band portions 131b and 132b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. One end of the first and second plating layers 141 and 142 can be in contact with the first surface, and the other end can be in contact with the insulating layer 151.

[0093] The types of plating layers 141 and 142 are not particularly limited and may include one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and may be formed in multiple layers. To give a more specific example of plating layers 141 and 142, plating layers 141 and 142 may be Ni plating layers or Sn plating layers, and may be in a form in which Ni plating layers and Sn plating layers are formed sequentially on the first and second band portions 131b and 132b.

[0094] In one embodiment, the first and second plating layers 141 and 142 can be arranged to extend and partially cover the first and second connecting portions 131a and 132a, respectively. When H1 is the average size in the first direction from the first and second internal electrodes 121 and 122 to the internal electrode closest to the first surface 1, and H2 is the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 141 and 142 arranged on the first and second connecting portions 131a and 132a, it is possible to satisfy H1 > H2 (or H1 ≥ H2). This suppresses the penetration of the plating solution into the internal electrodes during the plating process and improves reliability.

[0095] H1 and H2 may be the average of values ​​measured in cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 may be the average of values ​​measured at the point where the internal electrode closest to the first surface 1 is connected to the external electrode in each cross-section, and H2 may be the average of values ​​measured with reference to the edge of the plating layer in contact with the external electrode, and the extension line of the first surface that serves as the reference when measuring H1 and H2 may be the same.

[0096] In one embodiment, the first plating layer 141 can be positioned to cover the end of the insulating layer 151 that is located on the first external electrode 131, and the second plating layer 142 can be positioned to cover the end of the insulating layer 151 that is located on the second external electrode 132. This strengthens the bonding force between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0097] In one embodiment, the insulating layer 151 can be positioned to cover the edge of the first plating layer 141 that is located on the first external electrode 131, and the insulating layer 151 can be positioned to cover the edge of the second plating layer 142 that is located on the second external electrode 132. This strengthens the bonding force between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0098] In one embodiment, when the average size of the main body 110 in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the conditions 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied.

[0099] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient adhesion strength. On the other hand, if B2 / L exceeds 0.4, there is a risk of leakage current occurring between the first band portion 131b and the second band portion 132b under high voltage current, and there is a risk that the first band portion 131b and the second band portion 132b may be electrically connected due to plating seepage or the like during the plating process. B1, B2, and L may be the average of values ​​measured in cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0100] Referring to Figure 5, which shows a mounting substrate 1100 on which a multilayer electronic component 1000 is mounted, the plating layers 141 and 142 of the multilayer electronic component 1000 can be joined to electrode pads 181 and 182 placed on the substrate 180 by solder 191 and 192.

[0101] On the other hand, when the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 1000 can be horizontally mounted on the substrate 180 so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting; when the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0102] The size of the stacked electronic component 1000 is not particularly limited. However, in order to achieve miniaturization and high capacitance simultaneously, the thickness of the dielectric layer and internal electrodes must be reduced and the number of layers increased. Therefore, in stacked electronic components 1000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less, the reliability and capacitance improvement effects per unit volume according to the present invention can be more pronounced.

[0103] Therefore, considering manufacturing tolerances, external electrode size, etc., the reliability improvement effect according to the present invention can be more pronounced when the length of the stacked electronic component 1000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 1000 can mean the maximum size of the stacked electronic component 1000 in the second direction, and the width of the stacked electronic component 1000 can mean the maximum size of the stacked electronic component 1000 in the third direction.

[0104] Figure 6 schematically shows a perspective view of a multilayer electronic component 1001 according to one embodiment of the present invention, and Figure 7 is a cross-sectional view along the line II-II' in Figure 6. Referring to Figures 6 and 7, in the multilayer electronic component 1001 according to one embodiment of the present invention, the first and second plating layers 141-1 and 142-1 can be positioned below the extension line E1 of the first surface. This makes it possible to minimize the height of the solder during mounting and to minimize the mounting space. In addition, the insulating layer 151-1 can be extended below the extension line of the first surface and positioned in contact with the first and second plating layers 141-1 and 142-1.

[0105] Figure 8 schematically shows a perspective view of a multilayer electronic component 1002 according to one embodiment of the present invention, and Figure 9 is a cross-sectional view along the line III-III' in Figure 8. Referring to Figures 8 and 9, the multilayer electronic component 1002 according to one embodiment of the present invention may further include an additional insulating layer 161 disposed on the first surface 1 and positioned between the first band portion 131b and the second band portion 132b. This makes it possible to prevent leakage currents that may occur between the first band portion 131b and the second band portion 132b under high voltage current.

[0106] The type of the additional insulating layer 161 does not need to be particularly limited. For example, the additional insulating layer 161 can contain glass in the same manner as the insulating layer 151. However, it is not necessary to limit the additional insulating layer 161 and the insulating layer 151 to the same material, and they may be formed of different materials. For example, it can contain one or more polymer resins selected from epoxy resin, acrylic resin, ethyl cellulose, etc. Further, in addition to the polymer resin, the additional insulating layer 161 can contain one or more selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. as additives. Thereby, the bonding force with the main body or the external electrode can be improved.

[0107] FIG. 10 schematically shows a perspective view of a multilayer electronic component 1003 according to an embodiment of the present invention, and FIG. 11 is a cross-sectional view taken along line IV-IV' of FIG. 10. Referring to FIGS. 10 and 11, in the multilayer electronic component 1003 according to an embodiment, when the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-3 and 142-3 disposed on the first and second connection portions 131a and 132a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0108] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0109] H1, H2, and T may be values obtained by averaging the values measured in the cross-section (L-T cross-section) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 may be a value obtained by averaging the values measured at the points where the internal electrodes closest to the first surface 1 in each cross-section are connected to the external electrodes. H2 may be a value obtained by averaging the values measured based on the ends of the plating layers in contact with the external electrodes in each cross-section. The extension lines of the first surface used as the reference during the measurement of H1 and H2 may be the same. Also, T may be a value obtained by averaging the values measured after measuring the maximum size of the main body 110 in the first direction in each cross-section. The insulating layer 151-3 can be arranged to contact the ends of the plating layers 141-3 and 142-3.

[0110] FIG. 12 schematically shows a perspective view of a stacked electronic component 1004 according to an embodiment of the present invention, and FIG. 13 is a cross-sectional view taken along the line V-V' of FIG. 12. Referring to FIGS. 12 and 13, in the stacked electronic component 1004 according to an embodiment of the present invention, the average length B1 of the first band portion 131b-4 may be longer than the average length B3 of the third band portion 131c-4, and the average length of the second band portion 132b-4 may be longer than the average length B4 of the fourth band portion 132c-4. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0111] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 131b-4 is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 132b-4 is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the third band portion 131c-4 is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the fourth band portion 132c-4 is B4, B3 < B1 and B4 < B2 can be satisfied.

[0112] In this case, when L is the average size of the main body 110 in the second direction, the conditions 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied. B1, B2, B3, B4, and L may be the average values ​​obtained by measuring the cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0113] Furthermore, the first external electrode 131-4 may include a first side band portion extending from the first connection portion 131a-4 to a part of the fifth and sixth surfaces, and the second external electrode 132-4 may include a second side band portion extending from the second connection portion 132a-4 to a part of the fifth and sixth surfaces. In this case, the size of the first and second side band portions in the second direction may gradually increase as they approach the first surface. That is, the first and second side band portions may be arranged in a tapered or trapezoidal shape.

[0114] Furthermore, when B3 is the average size in the second direction from the extension of the third surface to the end of the third band portion 141c-4, B4 is the average size in the second direction from the extension of the fourth surface to the end of the fourth band portion 142c-4, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This makes it possible to minimize the volume occupied by the external electrodes and increase the capacity per unit volume of the stacked electronic component 1004.

[0115] The above G1 and G2 can be defined as follows: In a cross-section obtained by cutting the main body in the first and second directions at the center of the third direction, G1 is the average value of the size in the second direction at the distance to the third surface, measured for any five second internal electrodes located in the center of the first direction, and G2 is the average value of the size in the second direction of the region at the distance to the fourth surface, measured for any five first internal electrodes located in the center of the first direction.

[0116] Furthermore, the method can be further generalized by determining G1 and G2 from cross-sections (LT cross-sections) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions, and then averaging these values ​​to obtain G1 and G2.

[0117] However, the present invention is not intended to be limited to B3≦G1 and B4≦G2, and a case satisfying B3≧G1 and B4≧G2 can also be included in one embodiment of the present invention. Therefore, in one embodiment, when B3 is the average size in the second direction from the extension line of the third surface to the end of the third band portion, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the fourth band portion, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, then B3≧G1 and B4≧G2 can be satisfied.

[0118] In one embodiment, when B1 is the average size in the second direction from the extension line of the third surface E3 to the end of the first band portion, and B2 is the average size in the second direction from the extension line of the fourth surface to the end of the second band portion, B1≧G1 and B2≧G2 can be satisfied. This makes it possible to improve the bonding strength of the multilayer electronic component 1004 to the substrate 180.

[0119] Figure 14 schematically shows a perspective view of a stacked electronic component 1005 according to one embodiment of the present invention, and Figure 15 is a cross-sectional view along the line VI-VI' in Figure 14. Referring to Figures 14 and 15, the first and second external electrodes 131-5 and 132-5 of the stacked electronic component 1005 according to one embodiment of the present invention are not arranged on the second surface, but are arranged on the third, fourth, and first surfaces, and can have an L-shape. That is, the first and second external electrodes 131-5 and 132-5 can be arranged below the extension line E2 of the second surface.

[0120] The first external electrode 131-5 may include a first connection portion 131a-5 located on the third surface 3 and a first band portion 131b-5 extending from the first connection portion 131a-5 to a part of the first surface 1. The second external electrode 132-5 may include a second connection portion 132a-5 located on the fourth surface 4 and a second band portion 132b-5 extending from the second connection portion 132a-5 to a part of the first surface 1. The external electrodes 131-5 and 132-5 may not be located on the second surface 2, and the insulating layer 151-5 may be arranged to cover the entire second surface 2. This minimizes the volume occupied by the external electrodes 131-5 and 132-5, thereby improving the capacitance per unit volume of the multilayer electronic component 1005.

[0121] Furthermore, the insulating layer 151-5 can be positioned to cover parts of the fifth and sixth surfaces to further improve reliability. In this case, the parts of the fifth and sixth surfaces not covered by the insulating layer 151-5 can be exposed to the outside. Moreover, the insulating layer 151-5 can be positioned to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, thereby further improving moisture resistance reliability.

[0122] A first plating layer 141-5 is placed on the first band portion 131b-5, and a second plating layer 142-5 is placed on the second band portion 132b-5. The first and second plating layers 141-5 and 142-5 can be extended to a portion of the first and second connecting portions 132a-5 and 132b-5. In this case, the external electrodes 131-5 and 132-5 do not necessarily have to be placed on the fifth and sixth surfaces 5 and 6. That is, the external electrodes 131-5 and 132-5 can be placed only on the third, fourth, and first surfaces.

[0123] From the first surface 1 to the internal electrodes 121 and 122, when the average size in the first direction from the internal electrode closest to the first surface 1 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-5 and 142-5 disposed on the first and second connection portions 131a-5 and 132a-5 is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength, and an increase in the equivalent series resistance (ESR) due to an increase in the area where the external electrodes 131-5 and 132-5 contact the plating layers 141-5 and 142-5 can be suppressed.

[0124] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0125] Also, the first and second plating layers 141-5 and 142-5 can be arranged to cover a part of the insulating layer 151-1 on the third and fourth surfaces. That is, the plating layers 141-5 and 142-5 can be arranged to cover the ends of the insulating layer 151-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened to improve the reliability of the stacked electronic component 1005.

[0126] Also, the insulating layer 151-5 can be arranged to cover a part of the first and second plating layers 141-5 and 142-5 on the third and fourth surfaces. That is, the insulating layer 151-5 can be arranged to cover the ends of the plating layers 141-5 and 142-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened to improve the reliability of the stacked electronic component 1005.

[0127] Figure 16 shows a modified example of Figure 14. Referring to Figure 16, in a modified example 1006 of the stacked electronic component 1005 according to one embodiment of the present invention, a first additional electrode layer 134 can be placed between the first connection portion 131a-6 and the third surface, and a second additional electrode layer 135 can be placed between the second connection portion 132a-6 and the fourth surface. The first additional electrode layer 134 can be placed within a range that does not deviate from the third surface, and the second additional electrode layer 135 can be placed within a range that does not deviate from the fourth surface. The first and second additional electrode layers 134 and 135 can improve the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 131-6 and 132-6, have excellent coupling strength with the external electrodes 131-6 and 132-6, and can play a role in further improving the mechanical coupling strength of the external electrodes 131-6 and 132-6.

[0128] The first and second external electrodes 131-6 and 132-6 may have an L-shape in which the first and second external electrodes are not arranged on the second surface. The first external electrode 131-6 may include a first connecting portion 131a-6 arranged on the first additional electrode layer 134 and a first band portion 131b-6 extending from the first connecting portion 131a-6 to a part of the first surface 1, and the second external electrode 132-6 may include a second connecting portion 132a-6 arranged on the second additional electrode layer 135 and a second band portion 132b-6 extending from the second connecting portion 132a-6 to a part of the first surface 1.

[0129] On the other hand, the first and second additional electrode layers 131-6 and 132-6 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined considering electrical properties, structural stability, etc. Furthermore, the first and second additional electrode layers 131-6 and 132-6 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin. In addition, the first and second additional electrode layers 131-6 and 132-6 may be formed by transferring a sheet containing conductive metal onto the main body.

[0130] While materials with excellent electrical conductivity can be used as the conductive metal in the first and second additional electrode layers 131-6 and 132-6, they are not particularly limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the first and second additional electrode layers 131-6 and 132-6 may contain one or more of Ni and Ni alloys. This can further improve connectivity with the internal electrodes 121 and 122 containing Ni.

[0131] Figure 17 schematically shows a perspective view of a multilayer electronic component 1007 according to one embodiment of the present invention, and Figure 18 is a cross-sectional view along the line VII-VII' in Figure 17. Referring to Figures 17 and 18, the average thickness t1 of the first and second plating layers 141-6 and 142-6 of the multilayer electronic component 1007 according to one embodiment of the present invention may be thinner than the average thickness t2 of the region of the insulating layer 151-6 located on the first and second connection portions.

[0132] The insulating layer 151-6 plays a role in preventing the penetration of moisture or plating solution from the outside, but its connectivity with the plating layers 141-6 and 142-6 is weak, which can cause delamination of the plating layers 141-6 and 142-6. If the plating layers are delaminated, the adhesion strength to the substrate 180 may decrease. Here, delamination of the plating layers 141-6 and 142-6 can mean that the plating layers are partially peeled off or physically separated from the external electrodes 131-5 and 132-5. Due to the weak connectivity between the plating layers and the insulating layer, the gap at the interface between the insulating layer and the plating layer may widen, or foreign matter may penetrate, making it more vulnerable to external impacts and increasing the likelihood of delamination.

[0133] According to one embodiment of the present invention, the average thickness t1 of the plating layer can be made thinner than the average thickness t2 of the region of the insulating layer 151-6 located on the connection portion, thereby reducing the contact area between the plating layer and the insulating layer. This suppresses the occurrence of delamination and improves the adhesion strength of the multilayer electronic component 1000 to the substrate 180.

[0134] The average thickness t1 of the first and second plating layers 141-6 and 142-6 may be the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a-5 and 132a-5 or the first and second band portions 131b-5 and 132b-5, and the average thickness t2 of the insulating layer 151-6 in the region located on the connection portion may be the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a-5 and 132a-5.

[0135] Figure 19 schematically shows a perspective view of a stacked electronic component 2000 according to one embodiment of the present invention, and Figure 20 is a cross-sectional view along line VIII-VIII' in Figure 19. Hereinafter, the stacked electronic component 2000 according to one embodiment of the present invention will be described in detail with reference to Figures 19 and 20. However, any content that overlaps with the above description may be omitted to avoid redundant explanation.

[0136] A stacked electronic component 2000 according to one embodiment of the present invention includes a dielectric layer 111, first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, a body 110 including first and second surfaces 1 and 2 facing in the first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in the third direction, and a first external electrode 231 including a first connecting electrode 231a arranged on the third surface and a first band electrode 231b arranged on the first surface and connected to the first connecting electrode. The device includes a second external electrode 232, which includes a second connecting electrode 232a disposed on the fourth surface and a second band electrode 232b disposed on the first surface and connected to the second connecting electrode; an insulating layer 251 disposed on the second surface and extending over the first and second connecting electrodes 231a and 232a; a first plating layer 241 disposed on the first band electrode; and a second plating layer 242 disposed on the second band electrode, wherein the insulating layer 251 contains glass, and the portion of the insulating layer 251 disposed on the second surface may have a convex shape in the first direction.

[0137] The first connecting electrode 231a is positioned on the third surface 3 and connected to the first internal electrode 121, and the second connecting electrode 231b is positioned on the fourth surface 4 and can be connected to the second internal electrode 122.

[0138] Conventionally, when forming external electrodes, a paste containing conductive metal was used, and the exposed surface of the main body's internal electrodes was dipped into the paste. However, external electrodes formed by this dipping method sometimes had excessively thick external electrodes in the center in the thickness direction. Furthermore, even without this problem of thickness imbalance of external electrodes by the dipping method, since the internal electrodes are exposed on the third and fourth surfaces of the main body, the external electrodes placed on the third and fourth surfaces were formed to have a thickness of at least a certain level in order to suppress the penetration of moisture and plating solution through the external electrodes.

[0139] In contrast, in the present invention, since the insulating layer 251 is placed on the connecting electrodes 231a and 232a, sufficient reliability can be ensured even if the thickness of the connecting electrodes 231a and 232a on the third and fourth surfaces where the internal electrodes are exposed is reduced.

[0140] The first and second connecting electrodes 231a and 232a may be configured to correspond to the third and fourth surfaces, respectively, and the surfaces of the first and second connecting electrodes 231a and 232a facing the main body 110 may have the same area as the third and fourth surfaces of the main body 110, respectively. The first and second connecting electrodes 231a and 232a can be positioned within a range that does not deviate from the third and fourth surfaces 3 and 4, respectively. The connecting electrodes 231a and 232a can be positioned so as not to extend to the first, second, fifth and sixth surfaces 1, 2, 5 and 6 of the main body 110. Specifically, in one embodiment, the first and second connecting electrodes 231a and 232a can be positioned at a distance from the fifth and sixth surfaces. This minimizes the volume occupied by the external electrodes while ensuring sufficient connectivity between the internal electrodes 121 and 122 and the external electrodes 231 and 232, thereby increasing the capacity per unit volume of the stacked electronic component 2000.

[0141] From this perspective, the first and second connecting electrodes 231a and 232a can be arranged at a distance from the second surface 2. That is, by not arranging the external electrodes 231 and 232 on the second surface, the volume occupied by the external electrodes 231 and 232 can be further minimized, and the capacity per unit volume of the stacked electronic component 2000 can be further increased.

[0142] However, the connecting electrodes 231a and 232a may include corner portions that extend to the corners of the main body 110 and are positioned on the corners. That is, in one embodiment, the first connecting electrode 231a includes a corner portion that extends and is positioned on the first to third corners and the second to third corners, and the second connecting electrode 232a may include a corner portion that extends and is positioned on the first to fourth corners and the second to fourth corners.

[0143] Furthermore, the connecting electrodes 231a and 232a can have a more uniform and thinner thickness compared to external electrodes formed by the conventional dipping method. The method for forming the connecting electrodes 231a and 232a is not particularly limited, but for example, they can be formed by transferring sheets containing conductive metal, organic substances such as binders, etc., to the third and fourth surfaces, but are not limited to this, and can also be formed by plating conductive metal onto the third and fourth surfaces. In other words, the connecting electrodes 231a and 232a may be a fired layer formed by firing conductive metal, or a plated layer.

[0144] The thickness of the connecting electrodes 231a and 232a is not particularly limited, but may be, for example, 2 to 7 μm. Here, the thickness of the connecting electrodes 231a and 232a can mean the maximum thickness, and can also mean the size of the connecting electrodes 231a and 232a in the second direction.

[0145] In one embodiment, the first and second connecting electrodes 231a and 232a may contain the same metal and glass as the metal contained in the internal electrodes 121 and 122. By including the same metal as the metal contained in the internal electrodes 121 and 122, the electrical connectivity with the internal electrodes 121 and 122 can be improved, and by including glass in the first and second connecting electrodes 231a and 232a, the bonding strength with the main body 110 and / or insulating layer 251 can be improved. In this case, the same metal as the metal contained in the internal electrodes 121 and 122 may be Ni.

[0146] The insulating layer 251 is placed on the first and second connecting electrodes 231a and 232a and can serve to prevent the formation of a plating layer on the first and second connecting electrodes 231a and 232a. In addition, the insulating layer 251 can improve sealing properties and minimize the penetration of moisture, plating solution, etc. from the outside.

[0147] The insulating layer 251 includes glass, and the region of the insulating layer located on the second surface may have a convex shape in the first direction. This makes it possible to improve moisture resistance reliability while preventing a decrease in capacitance per unit volume.

[0148] The first and second band electrodes 231b and 232b can be positioned on the first surface 1 of the main body 110. The first and second band electrodes 231b and 232b can be electrically connected to the first and second internal electrodes 121 and 122, respectively, by contacting the first and second connecting electrodes 231a and 232a.

[0149] Conventional dipping methods for forming external electrodes result in thicker electrodes on the third and fourth surfaces, and they extend to the first, second, fifth, and sixth surfaces, making it difficult to secure a high effective volume ratio. In contrast, according to one embodiment of the present invention, by arranging the first and second connecting electrodes 231a and 232a on the surface where the internal electrodes are exposed, and the first and second band electrodes 231b and 232b on the surface that will be mounted on the substrate, a high effective volume ratio can be secured.

[0150] On the other hand, when the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 2000 can be horizontally mounted on the substrate so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting; when the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0151] The first and second band electrodes 231b and 232b may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined considering electrical properties, structural stability, etc. For example, the first and second band electrodes 231b and 232b may be firing electrodes containing conductive metal and glass, and may be formed by applying a paste containing conductive metal and glass to the first surface of the main body, but are not limited to this, and may also be a plated layer in which conductive metal is plated onto the first surface of the main body.

[0152] While materials with excellent electrical conductivity can be used as the conductive metal in the first and second band electrodes 231b and 232b, they are not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys, and may also include the same metal as the metal contained in the internal electrodes 121 and 122.

[0153] On the other hand, in one embodiment, the first external electrode 231 further includes a third band electrode (not shown) disposed on the second surface 2 and connected to the first connecting electrode 231a, and the second external electrode 232 may further include a fourth band electrode (not shown) disposed on the second surface 2 and connected to the second connecting electrode 232a.

[0154] In one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B1≧G1, B3≦G1, B2≧G2, and B4≦G2 can be satisfied. This minimizes the volume occupied by the external electrodes, increases the capacity per unit volume of the stacked electronic component 2000, and increases the contact area with solder during mounting, thereby improving the bonding strength.

[0155] However, there is no intention to limit the present invention to B1≧G1, B3≦G1, B2≧G2, and B4≦G2, and a case satisfying B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can also be included in one embodiment of the present invention. Therefore, in one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can be satisfied. This allows either the first or second surface to be used as the mounting surface, thereby improving ease of implementation.

[0156] The first and second plating layers 241 and 242 can be placed on the first and second band electrodes 231b and 232b. The first and second plating layers 241 and 242 play a role in improving mounting characteristics. The types of the first and second plating layers 241 and 242 are not particularly limited and may be plating layers containing one or more of Ni, Sn, Pd and their alloys, and may be formed in multiple layers.

[0157] To give a more specific example of the first and second plating layers 241 and 242, the first and second plating layers 241 and 242 may be Ni plating layers or Sn plating layers, and the Ni plating layer and the Sn plating layer may be formed sequentially on the first and second band electrodes 231b and 232b.

[0158] In one embodiment, the first and second plating layers 241 and 242 can be arranged to extend and partially cover the first and second connecting electrodes 231a and 232a, respectively. When H1 is the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122, and H2 is the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 241 and 242 arranged on the first and second connecting electrodes 231a and 232a, it is possible to satisfy H1 > H2 (or H1 ≥ H2). This makes it possible to suppress the penetration of the plating solution into the internal electrodes during the plating process and improve reliability.

[0159] In one embodiment, the insulating layer 251 is arranged in direct contact with the first and second connecting electrodes 231a and 232a, and the first and second connecting electrodes 231a and 232a may include conductive metal and glass. As a result, the plating layers 241 and 242 do not need to be placed in the area of ​​the outer surface of the first and second connecting electrodes 231a and 232a where the insulating layer 251 is placed, thereby effectively preventing corrosion of the external electrodes by the plating solution.

[0160] In one embodiment, the first plating layer 241 can be positioned to cover the end of the insulating layer 251 that is located on the first external electrode 231, and the second plating layer 242 can be positioned to cover the end of the insulating layer 251 that is located on the second external electrode 232. This strengthens the bonding force between the insulating layer 251 and the plating layers 241 and 242, thereby improving the reliability of the multilayer electronic component 2000. Furthermore, by forming the insulating layer 251 before forming the plating layers 241 and 242 on the external electrodes 231 and 232, the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layer before the plating layer, the plating layers 241 and 242 can have a configuration that covers the end of the insulating layer 251.

[0161] In one embodiment, the insulating layer 251 can be positioned to cover the end of the first plating layer 241 that is located on the first external electrode 231, and to cover the end of the second plating layer 242 that is located on the second external electrode 232. This strengthens the bonding force between the insulating layer 251 and the plating layers 241 and 242, thereby improving the reliability of the multilayer electronic component 2000. In one embodiment, the insulating layer 251 can be positioned to cover parts of the fifth and sixth surfaces.

[0162] Figure 21 schematically shows a perspective view of a stacked electronic component 2001 according to one embodiment of the present invention, and Figure 22 is a cross-sectional view along the line IX-IX' in Figure 21. Referring to Figures 21 and 22, in the stacked electronic component 2002 according to one embodiment of the present invention, the first and second plating layers 241-1 and 242-1 can be positioned below the extension line of the first surface. This makes it possible to minimize the solder height during mounting and minimize the mounting space.

[0163] Furthermore, the insulating layer 251-1 can be extended to below the extension line of the first surface and arranged in contact with the first and second plating layers 241-1 and 242-1. In this case, the insulating layer 251-1 may be arranged to cover the entirety of the fifth and sixth surfaces.

[0164] FIG. 23 schematically shows a perspective view of a stacked electronic component 2002 according to an embodiment of the present invention, and FIG. 24 is a cross-sectional view taken along the line X-X' of FIG. 23. Referring to FIGS. 23 and 24, a stacked electronic component 2004 according to an embodiment of the present invention can be disposed on the first surface 1 and further include an additional insulating layer 261 disposed between the first band electrode 231b and the second band electrode 232b. Thereby, leakage current that may occur between the first band electrode 231b and the second band electrode 232b under a high voltage current can be prevented.

[0165] The type of the additional insulating layer 261 does not need to be particularly limited. For example, the additional insulating layer 261 can include glass, similar to the insulating layer 251-1. However, it is not necessary to limit the additional insulating layer 261 and the insulating layer 251-1 to the same material, and they may be formed of different materials. For example, the additional insulating layer 261 can include one or more polymer resins selected from epoxy resin, acrylic resin, ethyl cellulose, and the like.

[0166] FIG. 25 schematically shows a perspective view of a stacked electronic component 2003 according to an embodiment of the present invention, and FIG. 26 is a cross-sectional view taken along the line XI-XI' of FIG. 25. Referring to FIGS. 25 and 26, a stacked electronic component 2003 according to an embodiment includes an insulating layer 251-2 disposed on the first and second connection electrodes 231a and 232a. When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 241-2 and 242-2 disposed on the first and second connection electrodes 231a and 232a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0167] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because if H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0168] FIG. 27 schematically shows a perspective view of a stacked electronic component 2004 according to an embodiment of the present invention, and FIG. 28 is a cross-sectional view taken along the line XII-XII' of FIG. 27. Referring to FIGS. 27 and 28, the average thickness t1 of the first and second plating layers 241-3 and 242-3 of the stacked electronic component 2004 according to an embodiment of the present invention may be in a form thinner than the average thickness t2 of the region of the insulating layer 251-3 disposed on the first and second connecting electrodes.

[0169] According to an embodiment of the present invention, by making the average thickness t1 of the first and second plating layers 241-3 and 242-3 thinner than the average thickness t2 of the region of the insulating layer 251-3 disposed on the first and second connecting electrodes, the contact area between the plating layer and the insulating layer can be reduced, thereby suppressing the occurrence of delamination and improving the adhesion strength with the substrate 180 of the stacked electronic component 2004.

[0170] The average thickness t1 of the first and second plating layers 241-3 and 242-3 may be a value obtained by averaging the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a or the first and second band electrodes 231b and 232b, and the average thickness t2 of the region of the insulating layer 251-3 disposed on the first and second connecting electrodes may be a value obtained by averaging the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a.

[0171] FIG. illustrating a perspective view of a stacked electronic component 3000 according to an embodiment of the present invention, FIG. 30 is a cross-sectional view taken along the line XIII-XIII' of FIG. 29, and FIG. 31 is an enlarged view of the K1 region of FIG. 30.

[0172] Referring to Figures 29 to 31, a stacked electronic component 3000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, a body 110 including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, and a first external electrode 331 including a first connecting portion 331a arranged on the third surface of the body, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 331c extending from the first connecting portion to the corner connecting the second and third surfaces of the body, and The device includes a second external electrode 332 which includes a second connecting portion 332a located on the fourth surface of the main body, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to the corner connecting the second and fourth surfaces of the main body; an insulating layer 351 located on the first and second connecting portions 331a and 332a and positioned to cover the second surface, the first and second corner portions; a first plating layer 341 located on the first band portion; and a second plating layer 342 located on the second band portion, wherein the insulating layer 351 includes glass, and the portion of the insulating layer 351 located on the second surface may have a convex shape in the first direction.

[0173] In one embodiment, when B3 is the average size in the second direction from the extension line of the third surface to the end of the first corner portion 331c, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion 332c, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This minimizes the volume occupied by the external electrodes 331 and 332 and increases the capacity per unit volume of the stacked electronic component 3000.

[0174] In this case, if B1 is the average size in the second direction from the extension line of the third surface to the end of the first band portion 331b, and B2 is the average size in the second direction from the extension line of the fourth surface to the end of the second band portion 332b, then B1≧G1 and B3≧G2 can be satisfied. This increases the area in contact with the solder during mounting, thereby improving the bonding strength.

[0175] A stacked electronic component 3000 according to one embodiment may include a body 110 that includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, and has first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction. The body 110 of the stacked electronic component 3000 may have the same configuration as the body 110 of the stacked electronic component 1000, except that the end of the first or second surface of the body is contracted, as will be described later.

[0176] External electrodes 331 and 332 can be arranged on the third surface 3 and fourth surface 4 of the main body 110. The external electrodes 331 and 332 may include first and second external electrodes 331 and 332, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively.

[0177] The external electrodes 331 and 332 may include a first external electrode 331 which includes a first connecting portion 331a located on the third surface, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 331c extending from the first connecting portion to the corner connecting the second and third surfaces; and a second external electrode 132 which includes a second connecting portion 332a located on the fourth surface, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to the corner connecting the second and fourth surfaces. The first connecting portion 331a can be connected to the first internal electrode 121 on the third surface, and the second connecting portion 332a can be connected to the second internal electrode 122 on the fourth surface.

[0178] In one embodiment, the first and second connecting portions 331a and 332a can be arranged at a distance from the fifth and sixth surfaces. This minimizes the specific gravity occupied by the external electrodes 331 and 332, thereby further miniaturizing the stacked electronic component 3000.

[0179] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference is generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface and the third to fifth surfaces and / or the second surface and the third to fifth surfaces may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, and 6 may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, in order to prevent chipping defects, the corners connecting each surface of the main body 110 can be rounded by performing a separate process to round the corners connecting the first surface with the third to sixth surfaces and / or the corners connecting the second surface with the third to sixth surfaces.

[0180] The above corners may include the 1st-3rd corner c1-3 connecting the 1st and 3rd faces, the 1st-4th corner c1-4 connecting the 1st and 4th faces, the 2nd-3rd corner c2-3 connecting the 2nd and 3rd faces, and the 2nd-4th corner c2-4 connecting the 2nd and 4th faces. Additionally, the corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. However, in order to suppress the step caused by the internal electrodes 121 and 122, if the internal electrodes after lamination are cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, the portions connecting the first surface with the fifth and sixth surfaces and the portions connecting the second surface with the fifth and sixth surfaces may not have a contracted form.

[0181] On the other hand, the first to sixth surfaces of the main body 110 can generally be flat, and non-flat areas can be designated as corners. In addition, the areas of the external electrodes 131 and 132 that are located on the corners can be designated as corner sections.

[0182] From this perspective, the first and second corner portions 331c and 332c can be positioned below the extension line E2 of the second surface, and the first and second corner portions 331c and 332c can be positioned at a distance from the second surface. That is, by not positioning the external electrodes 331 and 332 on the second surface, the volume occupied by the external electrodes 331 and 332 can be further minimized, and the capacity per unit volume of the stacked electronic component 3000 can be further increased. In addition, the first corner portion 331c can be positioned on a part of the second-third corner C2-3 connecting the third surface and the second surface, and the second corner portion 332c can be positioned on a part of the second-fourth corner C2-4 connecting the fourth surface and the second surface.

[0183] The extension line E2 of the second surface can be defined as follows: In the length-thickness cross section (LT cross section) obtained by cutting the stacked electronic component 3000 in the center in the width direction, seven straight lines P0, P1, P2, P3, P4, P5, P6, and P7 are drawn in the thickness direction with equal intervals in the length direction from the third surface to the fourth surface. The extension line E2 of the second surface can be defined as the line passing through the point where P2 intersects the second surface and the point where P4 intersects the second surface.

[0184] On the other hand, the external electrodes 331 and 332 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties, structural stability, etc. Furthermore, they may have a multilayer structure.

[0185] The external electrodes 331 and 332 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0186] Furthermore, the external electrodes 331 and 332 may be formed in a manner in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the external electrodes 331 and 332 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0187] The conductive metal included in the external electrodes 331 and 332 can be any material with excellent electrical conductivity, but is not particularly limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes 331 and 332 may include one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121 and 122 which contain Ni.

[0188] The insulating layer 351 can be placed on the first and second connection portions 331a and 332a. Since the first and second connection portions 331a and 332a are connected to the internal electrodes 121 and 122, they can serve as pathways for the penetration of the plating solution during the plating process or for moisture penetration during actual use. In this invention, since the insulating layer 351 is placed on the connection portions 331a and 332a, it is possible to prevent the penetration of moisture from the outside or the penetration of the plating solution.

[0189] The insulating layer 351 can be positioned in contact with the first and second plating layers 341 and 342. In this case, the insulating layer 351 may be in contact with the first and second plating layers 341 and 342 in a manner that partially covers their edges, or the first and second plating layers 341 and 342 may be in contact with the insulating layer 351 in a manner that partially covers their edges.

[0190] The insulating layer 353 can be placed on the first and second connection portions 331a and 332a and positioned to cover the second surface and the first and second corner portions 331c and 332c. Furthermore, by having the insulating layer 351 cover the area where the ends of the first and second corner portions 331c and 332c and the main body 110 are in contact, thereby blocking the path of moisture penetration, the moisture resistance reliability can be further improved.

[0191] The insulating layer 351 is positioned on the second surface and can extend to the first and second connection portions 331a and 332a. Furthermore, if the external electrodes 331 and 332 are not positioned on the second surface, the insulating layer may be positioned to completely cover the second surface.

[0192] In one embodiment, the insulating layer 351 can be arranged to cover a portion of the fifth and sixth surfaces to improve reliability. In this case, the portion of the fifth and sixth surfaces not covered by the insulating layer can be exposed to the outside. Furthermore, the insulating layer 351 can be arranged to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, further improving moisture resistance reliability.

[0193] The insulating layer 351 can prevent the formation of plating layers 341 and 342 on the external electrodes 331 and 332 on which the insulating layer 351 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solutions, etc., from the outside. The characteristics and effects related to the insulating layer 351 are the same as those of the insulating layers 151 and 251 included in the multilayer electronic components 1000 and 2000, or various embodiments thereof, so a detailed explanation is omitted.

[0194] The first and second plating layers 341 and 342 can be placed on the first and second band portions 331b and 332b, respectively. The plating layers 341 and 342 can improve mounting characteristics, and by placing the plating layers 341 and 342 on the band portions 331b and 332b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. One end of the first and second plating layers 341 and 342 can be in contact with the first surface, and the other end can be in contact with the insulating layer 351.

[0195] The types of plating layers 341 and 342 are not particularly limited and may include one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and may be formed in multiple layers. To give a more specific example of plating layers 341 and 342, plating layers 341 and 342 may be Ni plating layers or Sn plating layers, and may be formed in a form in which Ni plating layers and Sn plating layers are sequentially formed on the first and second band portions 331b and 332b.

[0196] In one embodiment, the insulating layer 351 is arranged in direct contact with the first and second external electrodes 331 and 332, and the first and second external electrodes 331 and 332 may include conductive metal and glass. As a result, the plating layers 341 and 342 do not need to be placed in the area of ​​the outer surface of the first and second external electrodes 331 and 332 where the insulating layer 351 is placed, thereby effectively suppressing corrosion of the external electrodes by the plating solution.

[0197] In one embodiment, the first plating layer 341 can be positioned to cover the end of the insulating layer 351 that is placed on the first external electrode 331, and the second plating layer 342 can be positioned to cover the end of the insulating layer 351 that is placed on the second external electrode 332. This strengthens the bonding force between the insulating layer 351 and the plating layers 341 and 342, thereby improving the reliability of the multilayer electronic component 3000. Furthermore, by forming the insulating layer 351 before forming the plating layers 341 and 342 on the external electrodes 331 and 332, the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layer before the plating layer, the plating layers 341 and 342 can have a configuration that covers the end of the insulating layer 351.

[0198] In one embodiment, the insulating layer 351 can be positioned to cover the end of the first plating layer 341 that is located on the first external electrode 331, and the insulating layer 351 can be positioned to cover the end of the second plating layer 342 that is located on the second external electrode 332. This strengthens the bonding force between the insulating layer 351 and the plating layers 341 and 342, thereby improving the reliability of the multilayer electronic component 3000.

[0199] In one embodiment, the first and second plating layers 341 and 342 can be arranged to extend and partially cover the first and second connecting portions 331a and 332a, respectively. When H1 is the average size in the first direction from the first and second internal electrodes 121 and 122 to the internal electrode closest to the first surface 1, and H2 is the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 141 and 142 arranged on the first and second connecting portions 131a and 132a, it is possible to satisfy H1 > H2 (or H1 ≥ H2). This makes it possible to suppress the penetration of the plating solution into the internal electrodes during the plating process and improve reliability.

[0200] In one embodiment, when the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface to the ends of the plating layers 341 and 342 disposed on the first and second connection portions 331a and 332a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved. More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0201] In one embodiment, the first and second plating layers 341 and 342 can be disposed below the extension line of the first surface. Thereby, the height of the solder during mounting can be minimized, and the mounting space can be minimized. Further, the insulating layer 351 can be extended to below the extension line of the first surface and disposed to contact the first and second plating layers 341 and 342.

[0202] In one embodiment, when the average size in the second direction of the main body is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 can be satisfied.

[0203] When B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient fixing strength. On the other hand, when B2 / L exceeds 0.4, there is a risk of leakage current occurring between the first band portion 331b and the second band portion 332b under high voltage current, and there is a risk that the first band portion 331b and the second band portion 332b are electrically connected due to plating bleeding or the like during the plating process.

[0204] In one embodiment, an additional insulating layer disposed on the first surface and disposed between the first band portion 331b and the second band portion 332b can be further included. Thereby, leakage current and the like that may occur between the first band electrode 331b and the second band electrode 332b under a high voltage current can be prevented.

[0205] The type of the additional insulating layer does not need to be particularly limited. For example, the additional insulating layer can include glass similar to the insulating layer 351. However, it is not necessary to limit the additional insulating layer and the insulating layer 351 to the same material, and they may be formed of different materials. For example, it can include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, and the like.

[0206] In one embodiment, when the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, B3 < B1 and B4 < B2 can be satisfied. The average length B1 of the first band portion 331b may be longer than the average length B3 of the first corner portion 331c, and the average length of the second band portion may be longer than the average length B4 of the second corner portion 332. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0207] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 331b is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 332b is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the first corner portion 331c is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the second corner portion 332c is B4, B3 < B1 and B4 < B2 can be satisfied.

[0208] In one embodiment, the average thickness of the first and second plating layers 341 and 342 may be thinner than the average thickness of the region of the insulating layer 351 that is located on the first and second connection portions 331a and 332a.

[0209] The insulating layer 351 plays a role in preventing the penetration of moisture or plating solution from the outside, but its connection with the plating layers 341 and 342 is weak, which can cause delamination of the plating layers. When the plating layers are delaminated, the adhesion strength to the substrate may decrease. Here, delamination of the plating layers can mean that the plating layers are partially peeled off or physically separated from the external electrodes 331 and 332. Due to the weak connection between the plating layers and the insulating layer, the gap at the interface between the insulating layer and the plating layer is likely to widen, or foreign matter may penetrate, making it more vulnerable to external impacts and increasing the likelihood of delamination.

[0210] According to one embodiment of the present invention, by making the average thickness of the plating layers 341 and 342 thinner than the average thickness of the regions of the insulating layer 351 that are arranged on the first and second connection portions 331a and 332a, the area in contact between the plating layer and the insulating layer can be reduced, thereby suppressing the occurrence of delamination and improving the adhesion strength with the multilayer electronic component 3000.

[0211] There is no particular limit to the size of the multilayer electronic component 3000. However, in order to achieve both miniaturization and high capacitance simultaneously, the thickness of the dielectric layer and internal electrodes must be reduced and the number of layers increased. Therefore, the improvements in reliability and capacitance per unit volume according to the present invention can be more pronounced in multilayer electronic components 3000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less.

[0212] Therefore, considering manufacturing tolerances, external electrode size, etc., the reliability improvement effect according to the present invention can be more pronounced when the length of the stacked electronic component 3000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 3000 can mean the maximum size of the stacked electronic component 3000 in the second direction, and the width of the stacked electronic component 3000 can mean the maximum size of the stacked electronic component 3000 in the third direction.

[0213] As described above, embodiments of the present invention have been explained in detail, but the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0214] It should be noted that the expression "one embodiment" used in this invention does not mean that each embodiment is identical to the others, but is provided to emphasize and describe the unique and distinct characteristics of each embodiment. However, the above-presented embodiment does not preclude its realization in combination with the characteristics of other embodiments. For example, even if a matter described in a particular embodiment is not described in another embodiment, it can be understood as a description relating to the other embodiment, as long as there is no description in the other embodiment that contradicts or contradicts that matter.

[0215] The terms used in this invention are used solely to describe one embodiment and are not intended to limit the invention. In this context, singular expressions include plural expressions unless the context clearly indicates otherwise. [Explanation of Symbols]

[0216] 1000, 2000, 3000: Multilayer electronic components 1100: Mounted circuit board 110: Main unit 111: Dielectric layer 112, 113: Cover section 114, 115: Margin section 121, 122: Internal electrode 131, 231, 331: 1st external electrode 132, 232, 332: 2nd external electrode 134, 135: Additional electrode layer 141, 142, 241, 242, 341, 342: Plating layer 151, 251, 351: Insulating layer 161, 261: Additional insulating layer 180: Circuit board 181, 182: Electrode pads 191, 192: Handa

Claims

1. A main body including a dielectric layer, and a first internal electrode and a second internal electrode alternately arranged with the dielectric layer interposed therebetween, the main body including a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected from the first surface to the fourth surface and facing each other in a third direction; A first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a part of the first surface; A second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a part of the first surface; An insulating layer disposed on the second surface and extending on the first connection portion and the second connection portion; A first plating layer disposed on the first band portion; A second plating layer disposed on the second band portion; and The insulating layer contains glass, and a region of the insulating layer disposed on the second surface has a convex shape in the first direction, the multilayer electronic component.

2. The multilayer electronic component according to claim 1, wherein, in a region of the insulating layer disposed on the second surface, a size in the first direction at the center in the second direction is larger than a size in the first direction at an end in the second direction.

3. The multilayer electronic component according to claim 2, wherein, in a region of the insulating layer disposed on the second surface, a size in the first direction at the center in the third direction is larger than a size in the first direction at an end in the third direction.

4. The first internal electrode is connected to the third surface and is disposed at a distance from the fourth surface, the second internal electrode is connected to the fourth surface and is disposed at a distance from the third surface, Let the average size in the second direction of a region where the third surface and the second internal electrode are separated be G1, and the average size in the second direction of a region where the fourth surface and the first internal electrode are separated be G2. Among the first surface, when the average size in the first direction from a point separated by G1 from the extension line of the third surface to the outer surface of the insulating layer is L1a, the average size in the first direction from a point separated by G2 from the extension line of the fourth surface to the outer surface of the insulating layer is L2a, and the average size in the first direction from the center in the second direction of the first surface to the outer surface of the insulating layer is Lc, The multilayer electronic component according to any one of claims 1 to 3, satisfying 0.4 ≦ L1a / Lc ≦ 0.8 and 0.4 ≦ L2a / Lc ≦ 0.

8.

5. Among the first internal electrode and the second internal electrode from the first surface, when the average size in the first direction from the first surface to the internal electrode closest to the first surface is H1, and the average size in the first direction from the extension line of the first surface to the end of the plating layer disposed on the first connection portion and the second connection portion is H2, the multilayer electronic component according to any one of claims 1 to 3, which satisfies H1 > H2.

6. Among the first internal electrode and the second internal electrode from the first surface, when the average size in the first direction from the first surface to the internal electrode closest to the first surface is H1, and the average size in the first direction from the extension line of the first surface to the end of the plating layer disposed on the first connection portion and the second connection portion is H2, the multilayer electronic component according to any one of claims 1 to 3, which satisfies H1 < H2.

7. When the average size in the first direction of the main body is T, The multilayer electronic component according to claim 6, which satisfies H2 < T / 2.

8. The multilayer electronic component according to any one of claims 1 to 3, wherein the first plating layer and the second plating layer are disposed below the extension line of the first surface.

9. When the average size in the second direction of the main body is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, The multilayer electronic component according to any one of claims 1 to 3, which satisfies 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.

4.

10. The multilayer electronic component according to any one of claims 1 to 3, further including an additional insulating layer disposed on the first surface and between the first band portion and the second band portion.

11. The multilayer electronic component according to any one of claims 1 to 3, wherein the average thickness of the dielectric layer is 0.35 μm or less.

12. The multilayer electronic component according to any one of claims 1 to 3, wherein the average thickness of the first internal electrode and the second internal electrode is 0.35 μm or less.

13. The main body includes a capacitance forming portion including the first internal electrode and the second internal electrode alternately disposed with the dielectric layer interposed therebetween, and a cover portion disposed on both end surfaces in the first direction of the capacitance forming portion. The laminated electronic component according to any one of claims 1 to 3, wherein an average size of the cover portion in the first direction is 15 μm or less.

14. The laminated electronic component according to any one of claims 1 to 3, wherein an average thickness of the first plating layer and the second plating layer is smaller than an average thickness of a region of the insulating layer disposed on the first connection portion and the second connection portion.

15. The laminated electronic component according to any one of claims 1 to 3, wherein the first plating layer is disposed to cover an end portion disposed on the first external electrode of the insulating layer, and the second plating layer is disposed to cover an end portion disposed on the second external electrode of the insulating layer.

16. The laminated electronic component according to any one of claims 1 to 3, wherein the insulating layer is disposed to cover an end portion disposed on the first external electrode of the first plating layer, and the insulating layer is disposed to cover an end portion disposed on the second external electrode of the second plating layer.

17. The first external electrode includes a first side surface band portion extending from the first connection portion to a part of the fifth surface and the sixth surface. The second external electrode includes a second side surface band portion extending from the second connection portion to a part of the fifth surface and the sixth surface. The laminated electronic component according to any one of claims 1 to 3, wherein a size of the first side surface band portion and the second side surface band portion in the second direction increases as it approaches the first surface.

18. The main body includes a first - 3 corner connecting the first surface and the third surface, a first - 4 corner connecting the first surface and the fourth surface, a second - 3 corner connecting the second surface and the third surface, and a second - 4 corner connecting the second surface and the fourth surface. The first - 3 corner and the second - 3 corner have a form that contracts toward the center of the main body in the first direction as it approaches the third surface, and the first - 4 corner and the second - 4 corner have a form that contracts toward the center of the main body in the first direction as it approaches the fourth surface. The laminated electronic component according to any one of claims 1 to 3, wherein the first external electrode includes a first corner portion extending and disposed on the first - 3 corner and the second - 3 corner at the first connection portion, and the second external electrode includes a second corner portion extending and disposed on the first - 4 corner and the second - 4 corner from the second connection portion. When the average size in the second direction from the extension line of the third surface to the end of the first corner portion is B3, the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, The multilayer electronic component according to claim 18, satisfying B3≤G1 and B4≤G2.

20. The first external electrode includes a first connection electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connection electrode. The second external electrode includes a second connection electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connection electrode. The multilayer electronic component according to any one of claims 1 to 3.

21. The first external electrode further includes a third band electrode disposed on the second surface and connected to the first connection electrode. The second external electrode further includes a fourth band electrode disposed on the second surface and connected to the second connection electrode. The multilayer electronic component according to claim 20.

22. The first external electrode includes a third band portion extending from the first connection portion to a part of the second surface. The second external electrode includes a fourth band portion extending from the second connection portion to a part of the second surface. The multilayer electronic component according to any one of claims 1 to 3.

23. When the average size in the first direction from a point separated by G1 from the extension line of the third surface in the first surface to the outer surface of the insulating layer is L1a, and the average size in the first direction from a point separated by G2 from the extension line of the fourth surface in the first surface to the outer surface of the insulating layer is L2a. The average size in the first direction from the center in the second direction of the first surface to the outer surface of the insulating layer is Lc. When the average size in the first direction from the end of the third band portion to the outer surface of the insulating layer is L1b, and the average size in the first direction from the end of the fourth band portion to the outer surface of the insulating layer is L2b. The multilayer electronic component according to claim 22, satisfying 1.1×L1a≤L1b≤0.9×Lc and 1.1×L2a≤L2b≤0.9×Lc.

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