Inspection device

Abstract

To enable stable inspection of high frequency properties of an inspection target.SOLUTION: An inspection device is provided, comprising a probe, and an insulative block provided with a first hole for the probe to be inserted and a second hole connected to the first hole to allow the probe to be inserted, the second hole having a smaller diameter than the first hole. A ratio of a thickness of the insulative block to a depth of the first hole is 1.40 or less.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to an inspection apparatus.

Background Art

[0002] In recent years, various inspection apparatuses for inspecting semiconductor devices such as integrated circuits (ICs) have been developed. For example, Patent Document 1 describes a high-frequency probe socket. This probe socket includes a plurality of probes and a noise shielding body. The plurality of probes are inserted into the noise shielding body.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] For example, the high-frequency characteristics of a test object such as a semiconductor device may be inspected using an inspection apparatus such as the high-frequency probe socket described in Patent Document 1. In this inspection, it may be required to stably inspect the high-frequency characteristics of the test object.

[0005] An example of the object of the present invention is to stably inspect the high-frequency characteristics of a test object. Other objects of the present invention will become apparent from the description herein.

Means for Solving the Problems

[0006] One aspect of the present invention is a probe, an insulating block provided with a first hole through which the probe is inserted, and a second hole communicating with the first hole through which the probe is inserted and having a diameter smaller than that of the first hole, and The inspection device has a ratio of the thickness of the insulating block to the depth of the first hole of 1.40 or less.

[0007] One aspect of the present invention is, probe and, A conductive block through which the probe is inserted, Equipped with, The inspection device has a conductive block with a protrusion that contacts the inspection substrate. [Effects of the Invention]

[0008] According to the above embodiment of the present invention, the high-frequency characteristics of the object under inspection can be stably inspected. [Brief explanation of the drawing]

[0009] [Figure 1] This is an overhead perspective view showing the inspection apparatus according to the embodiment together with the inspection substrate. [Figure 2] This is a downward perspective view showing an inspection apparatus according to an embodiment. [Figure 3] This figure shows the AA' cross-section of Figure 1 together with the object under inspection and the inspection substrate. [Figure 4] This is a magnified view of a portion of Figure 3. [Figure 5] This is a cross-sectional view showing the inspection apparatus for a comparative example, together with the object to be inspected and the inspection substrate. [Figure 6] This is a magnified view of a portion of Figure 5. [Modes for carrying out the invention]

[0010] Embodiments of the present invention will be described below with reference to the drawings. In all drawings, similar components are denoted by the same reference numerals, and their descriptions are omitted where appropriate.

[0011] Figure 1 is an upper perspective view showing the inspection apparatus 10 according to the embodiment together with the inspection substrate 30. Figure 2 is a lower perspective view showing the inspection apparatus 10 according to the embodiment. Figure 3 is a diagram showing the AA' cross-section of Figure 1 together with the object to be inspected 20 and the inspection substrate 30. Figure 4 is an enlarged view of a part of Figure 3.

[0012] To explain the directions, we define the X, Y, and Z directions. The Z direction is parallel to the vertical direction. The X direction is one of the horizontal directions perpendicular to the Z direction. The Y direction is one of the horizontal directions perpendicular to both the Z and X directions. In this embodiment, the X direction is described as the left-right direction, the Y direction as the front-back direction, and the Z direction as the up-down direction. In each figure, the directions indicated by the arrows of the X, Y, and Z axes are defined as the left, front, and up directions, respectively. In Figures 3 and 4, the white circle with a black dot indicating the Y direction indicates that the direction indicated by the Y-axis arrow is from the back of the page towards the front.

[0013] As shown in Figure 1, the inspection device 10 comprises two ground probes 110, six connection probes 120, a pin plate 130, a pin block 140, and a retainer 150. As shown in Figure 3, each ground probe 110 has a ground barrel 112 and a ground plunger 114. Each connection probe 120 has a connection barrel 122, a first connection plunger 124, and a second connection plunger 126.

[0014] As shown in Figure 3, the object to be inspected 20 is positioned above the inspection device 10. The object to be inspected 20 is, for example, a semiconductor device such as an integrated circuit (IC). Below the inspection device 10, the inspection board 30 is positioned. The inspection board 30 is, for example, a wiring board such as a printed circuit board (PCB). The object to be inspected 20 and the inspection board 30 are electrically connected to each other via the inspection device 10.

[0015] Referring to Figure 1, the arrangement of the two ground probes 110 and the six connection probes 120 will be described.

[0016] When viewed from the Z direction, the two ground probes 110 are arranged substantially parallel to each other in the X direction. In the example shown in FIG. 1, when viewed from the Z direction, the two ground probes 110 are arranged on both sides in the X direction with respect to the horizontal center of the retainer 150.

[0017] When viewed from the Z direction, the six connection probes 120 include three connection probes 120 located on the left side of the two ground probes 110 and three connection probes 120 located on the right side of the two ground probes 110. When viewed from the Z direction, the three connection probes 120 on the left side are arranged substantially parallel to each other and at substantially equal intervals in the Y direction. When viewed from the Z direction, the three connection probes 120 on the right side are arranged substantially parallel to each other and at substantially equal intervals in the Y direction. When viewed from the Z direction, the central connection probe 120 among the three connection probes 120 on the left side and the central connection probe 120 among the three connection probes 120 on the right side are arranged substantially parallel to the two ground probes 110 in the X direction.

[0018] The arrangement of the two ground probes 110 and the six connection probes 120 is not limited to the example described using FIG. 1. The arrangement of the ground probes 110 and the connection probes 120 is appropriately changed according to conditions such as the arrangement of the electrodes of the inspection object 20 and the arrangement of the electrodes of the inspection substrate 30.

[0019] Next, referring to FIG. 3, the configuration of each ground probe 110 and each connection probe 120 will be described. Unless otherwise specified, the configuration described below for the ground probe 110 is similarly applicable to the two ground probes 110. Unless otherwise specified, the configuration described below for the connection probe 120 is similarly applicable to the six connection probes 120.

[0020] The ground barrel 112 extends substantially parallel to the Z direction. The ground barrel 112 is inserted through a ground insertion hole 160 provided in the pin block 140 and retainer 150. As a result, the pin block 140 and retainer 150 serve as supports that substantially support the ground probe 110 in the Z direction. The lower end of the ground insertion hole 160 does not penetrate the pin block 140 in the Z direction. In the example shown in Figure 3, the lower end of the ground insertion hole 160 is located above the lower end surface of the protrusion 142 of the pin block 140, which will be described later, in the Z direction. Specifically, in the example shown in Figure 3, the lower end of the ground insertion hole 160 is located approximately in the center of the pin block 140 in the Z direction. However, the lower end of the ground insertion hole 160 may be shifted above or below the approximately center of the pin block 140 in the Z direction in the Z direction.

[0021] The gland plunger 114 is positioned on the upper end side of the gland barrel 112. The upper end of the gland insertion hole 160 opens upward on the upper surface of the retainer 150. This allows the upper end of the gland plunger 114 to protrude upward from the upper surface of the retainer 150 through the upper end of the gland insertion hole 160. The gland plunger 114 is biased upward by a spring (not shown) located inside the gland barrel 112. Therefore, the upper end of the gland plunger 114 can contact the gland electrode 22 located on the lower surface of the object under inspection 20 while the gland plunger 114 is biased upward.

[0022] The connecting barrel 122 extends substantially parallel to the Z direction. The connecting barrel 122 is inserted through a connecting insertion hole 170 provided in the pin plate 130, pin block 140, and retainer 150. In this way, the pin plate 130 and retainer 150 become supports for the connecting probe 120. The connecting insertion hole 170 penetrates the retainer 150, pin block 140, and pin plate 130 in the Z direction between the upper surface of the retainer 150 and the lower surface of the pin plate 130.

[0023] The first connecting plunger 124 is positioned on the upper end side of the connecting barrel 122. The upper end of the connecting insertion hole 170 opens upward on the upper surface of the retainer 150. This allows the upper end of the first connecting plunger 124 to protrude upward from the upper surface of the retainer 150 through the upper end of the connecting insertion hole 170. The first connecting plunger 124 is biased upward by a spring (not shown) located inside the connecting barrel 122. Therefore, the upper end of the first connecting plunger 124 can contact the connecting electrode 24 located on the lower surface of the object under inspection 20 while the first connecting plunger 124 is biased upward.

[0024] The second connecting plunger 126 is located on the lower end side of the connecting barrel 122. The lower end of the connecting insertion hole 170 opens downward on the lower surface of the pin plate 130. This allows the lower end of the second connecting plunger 126 to protrude downward from the lower surface of the pin plate 130 through the lower end of the connecting insertion hole 170. The second connecting plunger 126 is biased downward by a spring (not shown) located inside the connecting barrel 122. Therefore, the lower end of the second connecting plunger 126 can contact a contact portion 34 located on the upper surface of the inspection substrate 30 while the second connecting plunger 126 is biased downward. For example, an electrode (not shown) is located on the contact portion 34 of the inspection substrate 30.

[0025] The connection electrodes 24 of the object under test 20 and the contact portion 34 of the test substrate 30 are electrically connected to each other via connection probes 120. The six connection probes 120 are independently used as power or signal probes. For example, of the three connection probes 120 on the left side shown in Figure 1, the central connection probe 120 is a power probe. Of the three connection probes 120 on the left side shown in Figure 1, the two connection probes 120 on either side are signal probes. Of the three connection probes 120 on the right side shown in Figure 1, the central connection probe 120 is a power probe. Of the three connection probes 120 on the right side shown in Figure 1, the two connection probes 120 on either side are signal probes.

[0026] Next, the pin plate 130, pin block 140, and retainer 150 will be described with reference to Figures 1 to 3.

[0027] The pin plate 130 is an insulating block such as a resin block. The pin plate 130 is located below the pin block 140. As shown in Figures 1 and 2, the pin plate 130 has a roughly rectangular shape when viewed from the Z direction. However, the shape of the pin plate 130 is not limited to this example.

[0028] The pin block 140 is a conductive block such as a metal block. The pin block 140 is positioned between the pin plate 130 and the retainer 150 in the Z direction. As shown in Figures 1 and 2, the pin block 140 has a roughly rectangular shape when viewed from the Z direction. However, the shape of the pin block 140 is not limited to this example.

[0029] The retainer 150 is an insulating block such as a resin block. The retainer 150 is positioned above the pin block 140 in the Z direction. As shown in Figures 1 and 2, the retainer 150 has a roughly rectangular shape when viewed from the Z direction. However, the shape of the retainer 150 is not limited to this example.

[0030] As shown in Figures 2 and 3, the pin plate 130 is provided with a through hole 132. The through hole 132 penetrates the pin plate 130 in the Z direction. A protrusion 142 is provided on the lower surface of the pin block 140. The protrusion 142 penetrates the through hole 132 of the pin plate 130 in the Z direction. As shown in Figure 3, the lower end surface of the protrusion 142 is in contact with a ground contact portion 32 located on the upper surface of the inspection substrate 30. For example, a ground electrode (not shown) is placed on the ground contact portion 32 of the inspection substrate 30. This allows the ground electrode 22 of the object to be inspected 20 and the ground contact portion 32 of the inspection substrate 30 to be electrically connected to each other via the ground probe 110, the pin block 140, and the protrusion 142.

[0031] As shown in Figure 3, the horizontal peripheral portion of the through hole 132 on the lower surface of the pin plate 130 faces the upper surface of the inspection substrate 30 in the Z direction via a gap 134. In other words, the height of the protrusion 142 in the Z direction is greater than the thickness of the pin plate 130 in the Z direction. Therefore, the lower end surface of the protrusion 142 can be made to protrude downward from the lower surface of the pin plate 130. Thus, compared to the case where the lower surface of the pin plate 130 is in contact with the upper surface of the inspection substrate 30, the lower end surface of the protrusion 142 can be reliably brought into contact with the ground contact portion 32 of the inspection substrate 30. However, the lower surface of the pin plate 130 may be in contact with the upper surface of the inspection substrate 30.

[0032] The two ground probes 110 are positioned so as to overlap with the protrusion 142 of the pin block 140 in the Z direction. Therefore, compared to the case where the two ground probes 110 are positioned horizontally offset from the aforementioned position on the pin block 140, it is easier to electrically connect the two ground probes 110 and the protrusion 142 to each other. However, the two ground probes 110 may be positioned horizontally offset from the aforementioned position on the pin block 140.

[0033] Next, with reference to Figure 4, the upper end of the ground probe 110 and its surrounding area will be described.

[0034] The portion of the gland insertion hole 160 that penetrates the retainer 150 in the Z direction includes a large diameter hole 162, a small diameter hole 164, and a tapered hole 166. The large diameter hole 162 is located below the tapered hole 166. The upper end of the large diameter hole 162 communicates with the lower end of the tapered hole 166. The small diameter hole 164 is located above the tapered hole 166. The lower end of the small diameter hole 164 communicates with the upper end of the tapered hole 166. The horizontal diameter of the small diameter hole 164 is less than the horizontal diameter of the large diameter hole 162. The horizontal diameter of the tapered hole 166 decreases from bottom to top.

[0035] The ground barrel 112 is provided with a wide section 112a. The horizontal diameter of the wide section 112a of the ground barrel 112 is larger than the horizontal diameter of the upper and lower portions of the wide section 112a in the Z direction. The wide section 112a is inserted through the large diameter hole 162. The horizontal diameter of the wide section 112a is less than the horizontal diameter of the large diameter hole 162. The horizontal diameter of the wide section 112a is greater than or equal to the horizontal diameter of the portion of the ground insertion hole 160 that penetrates the pin block 140 in the Z direction. Therefore, the lower surface of the wide section 112a can be hooked onto the horizontal peripheral portion of the ground insertion hole 160 on the upper surface of the pin block 140. This allows the lower surface of the wide section 112a to come into contact with that portion on the upper surface of the pin block 140. Therefore, the wide portion 112a and the upper surface of the pin block 140 can be electrically connected.

[0036] Next, an example of how to assemble the inspection device 10 will be described with reference to Figures 3 and 4. In this example, the inspection device 10 is assembled as follows.

[0037] First, each ground probe 110 is inserted into the ground insertion hole 160 of the pin block 140 from above. This causes the wide portion 112a of the ground probe 110 to catch on the horizontal peripheral portion of the ground insertion hole 160 on the upper surface of the pin block 140.

[0038] Next, the pin block 140 and the retainer 150 are stacked in the Z direction. This positions the retainer 150 above the pin block 140. The upper portion of each ground probe 110 is inserted through the large diameter hole 162, the small diameter hole 164, and the tapered hole 166 of the retainer 150.

[0039] Next, the pin block 140 and retainer 150 are inverted. This positions the pin block 140 above the retainer 150. With the pin block 140 positioned above the retainer 150, each connection probe 120 is inserted from above the pin block 140 into the connection holes 170 of the pin block 140 and retainer 150. Next, the pin plate 130 and pin block 140 are stacked in the Z direction. This causes the portion of each connection probe 120 opposite the retainer 150 to be inserted into the connection hole 170 of the pin plate 130.

[0040] In this way, the inspection device 10 is assembled.

[0041] In the example described above, the lower portion of the ground probe 110 is inserted into the ground insertion hole 160 of the pin block 140 before the upper portion of the ground probe 110 is inserted into the large-diameter hole 162, the small-diameter hole 164, and the tapered hole 166. Therefore, compared to the case where the upper portion of the ground probe 110 is inserted into the large-diameter hole 162, the small-diameter hole 164, and the tapered hole 166, and then the lower portion of the ground probe 110 is inserted into the ground insertion hole 160 of the pin block 140, the wider portion 112a of the ground probe 110 can be reliably brought into contact with the pin block 140.

[0042] Figure 5 is a cross-sectional view showing the inspection apparatus 10K according to the comparative example together with the object to be inspected 20 and the inspection substrate 30. Figure 6 is an enlarged view of a part of Figure 5. The inspection apparatus 10K according to the comparative example is the same as the inspection apparatus 10 according to the embodiment, except for the following points.

[0043] As shown in Figure 5, the inspection apparatus 10K according to the comparative example includes two upper ground probes 110K1, two lower ground probes 110K2, two connecting probes 120K, a pin plate 130K, a pin block 140K, and a retainer 150K.

[0044] As shown in Figure 5, each upper ground probe 110K1 has an upper ground barrel 112K1 and an upper ground plunger 114K1. The upper ground barrel 112K1 is inserted through the upper portion of the ground insertion hole 160K. The upper portion of the ground insertion hole 160K passes through the retainer 150K and the upper portion of the pin block 140K in the Z direction. The upper ground plunger 114K1 is located on the upper end side of the upper ground barrel 112K1. The upper ground plunger 114K1 is biased upward. The upper end of the upper ground plunger 114K1 is capable of contacting the ground electrode 22 of the object under inspection 20.

[0045] As shown in Figure 6, the portion of the gland insertion hole 160K in the comparative example that penetrates the retainer 150K in the Z direction includes a large diameter hole 162K, a small diameter hole 164K, and a tapered hole 166K.

[0046] As shown in Figure 5, each lower ground probe 110K2 has a lower ground barrel 112K2 and a lower ground plunger 114K2. The lower ground barrel 112K2 is inserted into the lower portion of the ground insertion hole 160K. The lower portion of the ground insertion hole 160K penetrates the pin plate 130K and the lower portion of the pin block 140K in the Z direction. The lower ground plunger 114K2 is located on the lower end side of the lower ground barrel 112K2. The lower ground plunger 114K2 is biased downward. The lower end of the lower ground plunger 114K2 is capable of contacting the ground contact portion 32 of the inspection substrate 30.

[0047] We will compare the embodiment with the comparative example.

[0048] As shown in Figures 4 and 6, the thickness T in the Z direction of the portion of the retainer 150 through which the ground probe 110 is inserted according to the embodiment is thinner than the thickness TK in the Z direction of the portion of the retainer 150K through which the upper ground probe 110K1 is inserted according to the comparative example. Therefore, in the embodiment, the inductance in the retainer 150 can be reduced compared to the comparative example. As a result, in the embodiment, the high-frequency characteristics of the object under test 20 can be stably inspected compared to the comparative example. The thickness T in the Z direction of the above portion of the retainer 150 according to the embodiment is not limited to the following, but for example, it is 0.4 mm or more and 0.6 mm or less.

[0049] As shown in Figures 4 and 6, the depth D in the Z direction of the large-diameter hole 162 according to the embodiment is deeper than the depth DK in the Z direction of the large-diameter hole 162K according to the comparative example. The depth D of the large-diameter hole 162 according to the embodiment is not limited to the following, but for example, it is 0.2 mm or more and 0.4 mm or less.

[0050] As shown in Figures 4 and 6, the ratio T / D of the thickness T to the depth D in the embodiment is greater than the ratio TK / DK of the thickness TK to the depth DK in the comparative example. In the embodiment, the ratio T / D was set to 1.30 and the loss (in dB) of the inspection device 10 was measured under 8 GHz bandwidth conditions. In the comparative example, the ratio TK / DK was set to 1.50 and the loss (in dB) of the inspection device 10K was measured under the same conditions as in the embodiment. The loss in the embodiment was about 10 dB lower than the loss in the comparative example. Therefore, it can be said that the smaller the ratio T / D in the embodiment, the more stably the high-frequency characteristics of the object under inspection 20 can be inspected. Accordingly, the ratio T / D in the embodiment can be 1.40 or less, preferably 1.30 or less.

[0051] The lower limit of the ratio T / D according to the embodiment can be determined, for example, from the viewpoint of the strength of the retainer 150. For example, the smaller the ratio T / D according to the embodiment, the lower the strength of the retainer 150 tends to be. For this reason, the ratio T / D according to the embodiment may be, for example, 1.20 or higher.

[0052] In the comparative example, as shown in Figure 5, the pin block 140K is electrically connected to the ground contact portion 32 of the inspection substrate 30 via the lower ground probe 110K2. In the comparative example, the pin block 140K does not have a protrusion 142 whose lower end surface contacts the ground contact portion 32, as in the embodiment. In contrast, in the embodiment, as shown in Figure 3, the pin block 140 is electrically connected to the ground contact portion 32 of the inspection substrate 30 via the protrusion 142. Therefore, the contact area between the lower end surface of the protrusion 142 and the ground contact portion 32 of the inspection substrate 30 in the embodiment can be made larger than the contact area between the lower end of the lower ground probe 110K2 and the ground contact portion 32 of the inspection substrate 30 in the comparative example. For this reason, in the embodiment, the ground connection between the pin block 140 and the inspection substrate 30 can be strengthened compared to the comparative example. As a result, in the embodiment, the high-frequency characteristics of the object under inspection 20 can be stably inspected compared to the comparative example.

[0053] The embodiments of the present invention have been described above with reference to the drawings, but these are merely examples of the present invention, and various other configurations can also be adopted.

[0054] According to this specification, inspection apparatuses in the following embodiments are provided. (Aspect 1) In embodiment 1, the inspection device comprises a probe, an insulating block having a first hole through which the probe is inserted, and a second hole communicating with the first hole and through which the probe is inserted, the second hole having a smaller diameter than the first hole, wherein the ratio of the thickness of the insulating block to the depth of the first hole is 1.40 or less.

[0055] The "probe" corresponds to the "ground probe" in the above-described embodiment. The "insulating block" corresponds to the "retainer" in the above-described embodiment. The "first hole" corresponds to the "large diameter hole" in the above-described embodiment. The "second hole" corresponds to the "small diameter hole" in the above-described embodiment.

[0056] According to the above-described embodiment, the smaller the ratio, the more stably the high-frequency characteristics of the object under inspection can be tested. Therefore, in the above-described embodiment, the high-frequency characteristics of the object under inspection can be tested more stably compared to when the ratio is higher than the value in the above-described embodiment.

[0057] (Aspect 2) In embodiment 2, the inspection device further comprises a conductive block through which the probe is inserted and which overlaps with the insulating block, and after the probe is inserted into the conductive block, the probe is inserted into the first hole and the second hole.

[0058] The "conductive block" corresponds to the "pin block" in the above-described embodiment.

[0059] According to the above embodiment, compared to the case where the probe is inserted into the conductive block after being inserted into the first and second holes, the probe can be reliably brought into contact with the conductive block.

[0060] (Aspect 3) In embodiment 3, the inspection device comprises a probe and a conductive block through which the probe is inserted, wherein the conductive block has a protrusion that contacts the inspection substrate.

[0061] The "probe" corresponds to the "ground probe" and "connection probe" in the above-described embodiment. The "conductive block" corresponds to the "pin block" in the above-described embodiment.

[0062] According to the above-described embodiment, the contact area between the protrusion and the inspection substrate can be made larger than the contact area between the probe and the inspection substrate when the probe is in contact with the inspection substrate. Therefore, in the above-described embodiment, the ground connection between the conductive block and the inspection substrate can be strengthened compared to when the probe is in contact with the inspection substrate. As a result, in the above-described embodiment, the high-frequency characteristics of the object under inspection can be inspected more stably compared to when the probe is in contact with the inspection substrate.

[0063] (Aspect 4) In embodiment 4, the inspection device further comprises an insulating block having a through hole through which the protrusion passes, and at least a portion of the surface of the insulating block on the side where the inspection substrate is located faces the inspection substrate with a gap in between.

[0064] The "insulating block" corresponds to the "pin plate" in the above-described embodiment.

[0065] According to the above embodiment, the protrusion can be reliably brought into contact with the inspection substrate, compared to the case where the insulating block is in contact with the inspection substrate.

[0066] (Aspect 5) In embodiment 5, the probe is positioned so as to overlap with the convex portion of the conductive block.

[0067] According to the above embodiment, compared to the case where the probe is positioned at a location offset from the position overlapping the convex portion of the conductive block, it is possible to electrically connect the probe and the convex portion to each other more easily. [Explanation of Symbols]

[0068] 10,10K inspection device 20 Subjects to Examination 22 Ground electrode 24 connecting electrodes 30 Inspection boards 32 Ground contact area 34 Contact area 110 Ground probe 110K1 Upper Ground Probe 110K2 Lower Ground Probe 112 Grand Barrel 112K1 Upper Ground Barrel 112K2 Lower Ground Barrel 112a Wide section 114 Grand plunger 114K1 Upper Ground Plunger 114K2 Lower Ground Plunger 120,120K connection probe 122 Connecting Barrel 124 First connection plunger 126 Second connection plunger 130, 130K pin plate 132 Through hole 134 gaps 140, 140K pin block 142 Convex part 150, 150K retainer 160, 160K Gland insertion hole 162,162K Large diameter bore 164,164K small diameter hole 166,166K tapered bore 170 Connection insertion holes

Claims

1. a probe, an insulating block provided with a first insertion hole through which the probe is inserted, a conductive block communicating with the first insertion hole and provided with a second insertion hole through which the probe is inserted, comprising the probe has a barrel including a widened portion, a diameter of the widened portion is larger than a diameter of the second insertion hole, an inspection device.

2. The first insertion hole of the insulating block includes a first hole and a second hole communicating with the first hole and having a diameter smaller than a diameter of the first hole, a ratio of a thickness of the insulating block to a depth of the first hole is 1.40 or less, the inspection device according to claim 1.

3. after the probe is inserted into the conductive block, the probe is inserted into the first hole and the second hole, the inspection device according to claim 2.

4. a conductive block having a convex portion for electrically connecting to an object to be connected, an insulating block having a through hole through which the convex portion of the conductive block penetrates, comprising at least a part of a surface of the insulating block on a side where the object to be connected is located faces the object to be connected with a gap therebetween, an inspection device.

5. further comprising a probe, the probe is disposed at a position overlapping the convex portion of the conductive block, the inspection device according to claim 4.

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