Ceramic electronic component and manufacturing method thereof

Abstract

To provide a ceramic electronic component and a manufacturing method thereof that can suppress oxidation of the surface of an external electrode.SOLUTION: A ceramic electronic component includes a laminated chip in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately laminated, and that has a substantially rectangular parallelepiped shape, and is formed such that the plurality of internal electrode layers are alternately exposed on opposing first and second end surfaces of the substantially rectangular parallelepiped shape, an external electrode provided on the first end surface and the second end surface, and a plating layer provided on the external electrode, and the external electrode includes a base metal layer provided on the layered chip side and containing a base metal as a main component and having an oxidation-reduction potential of less than 0.9 V, and a noble metal layer that is provided closer to the plating layer than the base metal layer and has a noble metal of 90 at% or more and a thickness of 1 μm or less and has an oxidation-reduction potential of 0.9 V or more.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a ceramic electronic component and a method for manufacturing the same. [Background technology]

[0002] Ceramic electronic components such as multilayer ceramic capacitors are used in high-frequency communication systems, such as mobile phones. Such ceramic electronic components have a structure in which dielectric layers and internal electrode layers are alternately laminated. The internal electrode layers are alternately connected to a pair of external electrodes (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2022-85502 Summary of the Invention [Problem to be solved by the invention]

[0004] A plating film is often provided on the surface of the external electrode. The plating process is carried out using the external electrode as a base layer. If the surface of the external electrode is oxidized, the plating process is hindered, so a polishing process such as barrel polishing is carried out before the plating process. However, when the polishing process is carried out, there is a risk that internal cracks will occur due to impact.

[0005] The present invention has been made in view of the above-mentioned problems, and has an object to provide a ceramic electronic component capable of suppressing oxidation of the surfaces of its external electrodes, and a method for manufacturing the same. [Means for solving the problem]

[0006] The ceramic electronic component of the present invention comprises a laminated chip having a generally rectangular parallelepiped shape in which a number of dielectric layers and a number of internal electrode layers are alternately stacked, with the internal electrode layers alternately exposed at opposing first and second end faces of the generally rectangular parallelepiped shape, external electrodes provided on the first and second end faces, and a plating layer provided on the external electrodes, wherein the external electrodes comprise a base metal layer provided on the laminated chip side and mainly composed of a base metal having an oxidation-reduction potential of less than 0.9 V, and a precious metal layer provided on the plating layer side of the base metal layer, the precious metal layer being 90 at% or more of a precious metal having an oxidation-reduction potential of 0.9 V or more and having a thickness of 1 μm or less.

[0007] In the ceramic electronic component, the precious metal layer may have a thickness of 0.5 μm or more.

[0008] In the ceramic electronic component, the precious metal layer may cover the entire base metal layer.

[0009] In the ceramic electronic component, when the external electrodes are subjected to a line analysis in a thickness direction, a concentration peak of the base metal may appear in the laminated chip, and a concentration peak of the precious metal may appear in the plating layer.

[0010] In the ceramic electronic component, the noble metal may be Au, Pt, or Pd.

[0011] In the ceramic electronic component, the base metal may be Ni.

[0012] A method for manufacturing a ceramic electronic component according to the present invention includes the steps of alternately stacking dielectric green sheets and internal electrode patterns for internal electrode layers to form a ceramic laminate having a substantially rectangular parallelepiped shape, and alternately exposing the laminated internal electrode patterns on opposing first and second end faces of the ceramic laminate; forming external electrodes on the first and second end faces during or after firing of the ceramic laminate; and forming a plating layer on the external electrodes, wherein the step of forming the external electrodes includes the step of forming a precious metal layer having a thickness of 1 μm or less and containing 90 at% or more of a precious metal having an oxidation-reduction potential of 0.9 V or more on a base metal layer mainly composed of a base metal having an oxidation-reduction potential of less than 0.9 V.

[0013] In the above-mentioned method for manufacturing a ceramic electronic component, the step of forming the external electrode may include the steps of forming a film of a base metal paste containing powder of the base metal, forming a film of a precious metal paste having powder of the precious metal dispersed in a solvent on the base metal paste, and simultaneously firing the base metal paste and the precious metal paste.

[0014] In the above-mentioned method for manufacturing a ceramic electronic component, the step of forming the external electrodes may include the steps of forming a film from a base metal paste containing powder of the base metal, forming a film of the precious metal by a vacuum film formation method, and simultaneously firing the base metal paste and the precious metal.

[0015] In the above-mentioned method for manufacturing a ceramic electronic component, the step of forming the external electrodes may include the steps of forming a film of a base metal paste containing powder of the base metal, simultaneously firing the ceramic laminate and the base metal paste, and then applying and firing a precious metal paste in which the precious metal is dispersed in a solvent onto the base metal layer.

[0016] In the above-mentioned method for manufacturing a ceramic electronic component, the step of forming the external electrode may include a step of forming a film of a base metal paste containing powder of the base metal, simultaneously firing the ceramic laminate and the base metal paste, and then forming a film of the precious metal on the base metal layer by a vacuum film formation method to form the precious metal layer. Effect of the Invention

[0017] According to the present invention, it is possible to provide a ceramic electronic component capable of suppressing oxidation of the surfaces of its external electrodes, and a method for manufacturing the same. [Brief description of the drawings]

[0018] [Figure 1] FIG. 2 is a partial cross-sectional perspective view of a multilayer ceramic capacitor. [Diagram 2] 2 is a cross-sectional view taken along line AA in FIG. 1. [Diagram 3] FIG. 2 is a cross-sectional view taken along line BB in FIG. [Figure 4] 10(a) and 10(b) are enlarged cross-sectional views of the vicinity of the external electrodes. [Diagram 5] 1A to 1C are diagrams illustrating a flow of a method for manufacturing a multilayer ceramic capacitor. [Figure 6] 1(a) and (b) are diagrams illustrating the lamination process. [Figure 7] 1(a) to 1(e) are diagrams illustrating the steps from the coating process to the plating process. [Figure 8] FIG. 13 is a diagram showing the results of a moisture resistance test. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Hereinafter, an embodiment will be described with reference to the drawings.

[0020] (Embodiment) FIG. 1 is a partial cross-sectional perspective view of a multilayer ceramic capacitor 100 according to an embodiment. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. FIG. 3 is a cross-sectional view taken along line BB in FIG. 1. As illustrated in FIGS. 1 to 3, the multilayer ceramic capacitor 100 includes a laminated chip 10 having a substantially rectangular parallelepiped shape, and external electrodes 20a, 20b provided on any two opposing end faces of the laminated chip 10. Of the four faces of the laminated chip 10 other than the two end faces, the two faces other than the top and bottom faces in the stacking direction are referred to as side faces. The external electrodes 20a, 20b extend on the top, bottom and two side faces in the stacking direction of the laminated chip 10. However, the external electrodes 20a and 20b are spaced apart from each other.

[0021] The laminated chip 10 has a configuration in which dielectric layers 11 containing a ceramic material that functions as a dielectric and internal electrode layers 12 mainly composed of metal are alternately laminated. In other words, the laminated chip 10 includes a plurality of internal electrode layers 12 facing each other, and a dielectric layer 11 sandwiched between the plurality of internal electrode layers 12. The edges in the direction in which each internal electrode layer 12 extends are alternately exposed to a first end face on which the external electrode 20a of the laminated chip 10 is provided and a second end face on which the external electrode 20b is provided. The internal electrode layer 12 connected to the external electrode 20a is not connected to the external electrode 20b. The internal electrode layer 12 connected to the external electrode 20b is not connected to the external electrode 20a. Therefore, each internal electrode layer 12 is alternately conductive to the external electrode 20a and the external electrode 20b. In addition, in the laminate of the dielectric layers 11 and the internal electrode layers 12, the internal electrode layer 12 is disposed in the uppermost layer in the lamination direction, and the internal electrode layer 12 is also disposed in the lowermost layer in the lamination direction, and the upper and lower surfaces of the laminate are covered with a cover layer 13. The cover layer 13 is mainly composed of a ceramic material. For example, the cover layer 13 may have the same composition as the dielectric layers 11 or may have a different composition.

[0022] The main component of the dielectric layer 11 can be a ceramic material having a perovskite structure represented by the general formula ABO3. The perovskite structure has an ABO3 structure that deviates from the stoichiometric composition. 3-αFor example, the ceramic material may include BaTiO3 (barium titanate), CaZrO3 (calcium zirconate), CaTiO3 (calcium titanate), SrTiO3 (strontium titanate), MgTiO3 (magnesium titanate), BaTiO3 (barium titanate) which forms a perovskite structure, 1-x-y Ca x Sr y Ti 1-z Zr z O3 (0≦x≦1, 0≦y≦1, 0≦z≦1), etc. 1-x-y Ca x Sr y Ti 1-z Zr z O3 includes barium strontium titanate, barium calcium titanate, barium zirconate, barium titanate zirconate, calcium titanate zirconate and barium calcium titanate zirconate.

[0023] An additive may be added to the dielectric layer 11. Examples of additives to the dielectric layer 11 include oxides of magnesium (Mg), manganese (Mn), molybdenum (Mo), vanadium (V), chromium (Cr), rare earth elements (yttrium (Y), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), and ytterbium (Yb)), oxides containing cobalt (Co), nickel (Ni), lithium (Li), boron (B), sodium (Na), potassium (K), or silicon (Si), or glasses containing Co, Ni, Li, B, Na, K, or Si.

[0024] The internal electrode layers 12 are mainly composed of base metals such as Ni, copper (Cu), tin (Sn), etc., or alloys containing these metals. The internal electrode layers 12 may be mainly composed of precious metals such as platinum (Pt), palladium (Pd), silver (Ag), gold (Au), etc., or alloys containing these metals.

[0025] The size of the multilayer ceramic capacitor 100 is, for example, 0.25 mm long, 0.125 mm wide, and 0.125 mm high, or 0.4 mm long, 0.2 mm wide, and 0.2 mm high, or 0.6 mm long, 0.3 mm wide, and 0.3 mm high, or 0.6 mm long, 0.3 mm wide, and 0.110 mm high, or 1.0 mm long, 0.5 mm wide, and 0.5 mm high, or 1.0 mm long, 0.5 mm wide, and 0.1 mm high, or 3.2 mm long, 1.6 mm wide, and 1.6 mm high, or 4.5 mm long, 3.2 mm wide, and 2.5 mm high, but is not limited to these sizes. For example, the length and width may be interchanged for these sizes. The multilayer ceramic capacitor 100 may also be a three-terminal multilayer ceramic capacitor having three external electrodes.

[0026] The thickness of each dielectric layer 11 is, for example, 0.3 μm to 20 μm, or 0.3 μm to 10 μm, or 0.4 μm to 8 μm, or 0.5 μm to 5 μm. The thickness of each dielectric layer 11 can be measured by exposing the cross section of the multilayer ceramic capacitor 100, for example, as shown in FIG. 2, by mechanical polishing, and then obtaining the average thickness value at 10 points from an image taken by a microscope such as a scanning transmission electron microscope.

[0027] The thickness of each internal electrode layer 12 is, for example, 0.1 μm to 2 μm, or 0.2 μm to 1 μm, or 0.3 μm to 0.8 μm. The thickness of each internal electrode layer 12 can be measured by exposing the cross section of the multilayer ceramic capacitor 100, for example, as shown in FIG. 2, by mechanical polishing, and then obtaining the average thickness value at 10 points from an image taken by a microscope such as a scanning transmission electron microscope.

[0028] In the multilayer ceramic capacitor 100, the number of layers of the internal electrode layers 12 is, for example, about 50 to 500. In addition, in the multilayer ceramic capacitor 100, the lamination density of the internal electrode layers 12 is about 20 layers / mm to 1500 layers / mm.

[0029] 2, a region where the internal electrode layer 12 connected to the external electrode 20a and the internal electrode layer 12 connected to the external electrode 20b face each other is a region where capacitance is generated in the multilayer ceramic capacitor 100. Therefore, the region where capacitance is generated is referred to as a capacitive portion 14. In other words, the capacitive portion 14 is a region where adjacent internal electrode layers connected to different external electrodes face each other.

[0030] The region where the internal electrode layers 12 connected to the external electrodes 20a face each other without an internal electrode layer 12 connected to the external electrode 20b being interposed therebetween is called the end margin 15. The region where the internal electrode layers 12 connected to the external electrodes 20b face each other without an internal electrode layer 12 connected to the external electrode 20a being interposed therebetween is also the end margin 15. In other words, the end margin is a region where internal electrode layers connected to the same external electrode face each other without an internal electrode layer connected to a different external electrode being interposed therebetween. The end margin 15 is a region where no capacitance is generated. The end margin 15 may have the same composition as the dielectric layer 11 of the capacitance section 14, or may have a different composition.

[0031] As illustrated in Fig. 3, in the laminated chip 10, the regions extending from the two side surfaces of the laminated chip 10 to the internal electrode layers 12 are referred to as side margins 16. That is, the side margins 16 are regions provided to cover the ends of the multiple internal electrode layers 12 stacked in the laminated structure that extend to the two side surfaces. The side margins 16 are also regions that do not generate capacitance. The side margins 16 may have the same composition as the dielectric layer 11 of the capacitive section 14, or may have a different composition.

[0032] In many cases, a plating film is provided on the surfaces of the external electrodes 20a, 20b by plating. The plating is performed using the external electrodes as a base layer. If the surfaces of the external electrodes are oxidized, the plating is hindered, so a polishing process is performed before the plating process. However, when the polishing process is performed, there is a risk that internal cracks will occur due to impact. In this case, there is a risk of the insulation property being deteriorated.

[0033] In addition, if the surface of the external electrodes is oxidized, the formation of the plating layer is hindered unless the voltage during plating is increased. However, if the voltage is increased, hydrogen is generated by electrolysis of water and penetrates into the multilayer ceramic capacitor. In this case, the hydrogen may deteriorate the insulation properties.

[0034] Therefore, the multilayer ceramic capacitor 100 according to this embodiment has a configuration that can suppress oxidation of the surfaces of the external electrodes 20a, 20b. A specific configuration will be described below.

[0035] Fig. 4(a) is an enlarged cross-sectional view of the vicinity of the external electrode 20a. Fig. 4(b) is an enlarged cross-sectional view of the vicinity of the external electrode 20b. Hatching is omitted in Fig. 4(a) and Fig. 4(b). As illustrated in Fig. 4(a) and Fig. 4(b), the external electrode 20a and the external electrode 20b have a structure in which a precious metal layer 22 is formed on a base metal layer 21.

[0036] The base metal layer 21 is mainly composed of a base metal having an oxidation-reduction potential of less than 0.9V. The main components of the base metal layer 21 are, for example, Ni, Cu, Sn, etc. The main components of the base metal layer 21 may be an alloy of these base metals. The base metal layer 21 may contain an oxide. For example, the base metal layer 21 may contain ceramic particles that function as a co-material when fired simultaneously with the laminated chip 10. Alternatively, the base metal layer 21 may contain a glass component for the purpose of lowering the firing temperature when firing the fired laminated chip 10 and improving adhesion. Alternatively, the base metal layer 21 may have a structure in which a part of the main component base metal is oxidized.

[0037] The base metal layer 21 is in direct contact with the end face of the laminated chip 10, and is thereby connected to the internal electrode layer 12. The thickness of the base metal layer 21 is, for example, not less than 0.5 μm and not more than 30 μm.

[0038] The precious metal layer 22 is a layer having a thickness of 1 μm or less and a concentration of 90 at % or more of a precious metal having an oxidation-reduction potential of 0.9 V or more. For example, Pt, Pd, Ag, Au, etc. can be used as the precious metal. The concentration of an alloy of these precious metals may be 90 at % or more. The oxidation-reduction potential of Pt is +1.19 V, and the oxidation-reduction potential of Au is +1.52 V. For information on oxidation-reduction potentials, see "Fundamentals of Oxidation and Reduction - Water Purification Forum - Science and Technology - (water-solutions.jp)".

[0039] A plating layer 30 is provided on the surface of the precious metal layer 22. The plating layer 30 is mainly composed of a metal such as Cu, Ni, aluminum (Al), zinc (Zn), or Sn, or an alloy of two or more of these metals. The plating layer 30 may be a plating layer of a single metal component, or may be a plurality of plating layers of different metal components. For example, the plating layer 30 has a structure in which a first plating layer 31, a second plating layer 32, and a third plating layer 33 are formed in this order from the precious metal layer 22 side. The first plating layer 31 is, for example, a Cu plating layer. The second plating layer 32 is, for example, a Ni plating layer. The third plating layer 33 is, for example, a Sn plating layer.

[0040] In this embodiment, since the surfaces of the external electrodes 20a, 20b are the precious metal layers 22, oxidation of the surfaces of the external electrodes 20a, 20b is suppressed. As a result, polishing such as barrel polishing can be omitted or the amount of polishing can be reduced before the plating process for forming the plating layer 30. As a result, it is possible to suppress impact damage, and therefore the occurrence of internal cracks in the laminated chip 10 can be suppressed. As a result, the deterioration of the insulation of the multilayer ceramic capacitor 100 can be suppressed. In addition, since oxidation of the surfaces of the external electrodes 20a, 20b is suppressed, the applied voltage during the plating process can be lowered. As a result, the generation of hydrogen can be suppressed. As a result, the deterioration of the insulation of the multilayer ceramic capacitor 100 can be suppressed.

[0041] Furthermore, since the thickness of the precious metal layer 22 is 1 μm or less, the manufacturing cost can be reduced.

[0042] On the other hand, if the precious metal layer 22 is too thin, there is a risk that oxidation of the surfaces of the external electrodes 20a, 20b cannot be sufficiently suppressed. Therefore, it is preferable to set a lower limit for the thickness of the precious metal layer 22. In this embodiment, the thickness of the precious metal layer 22 is preferably 0.5 μm or more, more preferably 0.6 μm or more, and even more preferably 0.7 μm or more.

[0043] From the viewpoint of making the precious metal layer 22 thin, the thickness of the precious metal layer 22 is preferably 0.9 μm or less, and more preferably 0.8 μm or less.

[0044] Moreover, it is preferable that the precious metal layer 22 covers the entire surface of the base metal layer 21 facing the plating layer 30. In this case, oxidation can be suppressed over the entire surfaces of the external electrodes 20a, 20b.

[0045] The base metal and the precious metal may be alloyed at the interface between the base metal layer 21 and the precious metal layer 22. The base metal and the precious metal are alloyed, which has the effect of suppressing peeling between different metals (improving adhesion).

[0046] Whether the base metal and the precious metal are alloyed or not, the concentration of the base metal is higher on the laminated chip 10 side and lower on the plating layer 30 side throughout the thickness of the external electrodes 20a, 20b, and the concentration of the precious metal is lower on the laminated chip 10 side and higher on the plating layer 30 side. For example, when the external electrodes 20a, 20b are line-analyzed in the thickness direction, a concentration peak of the base metal appears on the laminated chip 10 side, and a concentration peak of the precious metal appears on the plating layer 30 side.

[0047] From the viewpoint of improving the oxidation resistance of the precious metal layer 22, it is preferable for there to be a large difference between the oxidation-reduction potential of the base metal that is the main component of the base metal layer 21 and the oxidation-reduction potential of the precious metal contained in the precious metal layer 22. In this embodiment, the difference between the oxidation-reduction potential of the base metal that is the main component of the base metal layer 21 and the oxidation-reduction potential of the precious metal that is the main component of the precious metal layer 22 is preferably 1.0V or more, more preferably 1.2V or more, and even more preferably 1.4V or more.

[0048] Next, a description will be given of a method for manufacturing the multilayer ceramic capacitor 100. FIG.

[0049] (Raw powder production process) First, a dielectric material for forming the dielectric layer 11 is prepared. The A-site elements and B-site elements contained in the dielectric layer 11 are usually contained in the dielectric layer 11 in the form of a sintered body of ABO3 particles. For example, BaTiO3 is a tetragonal compound having a perovskite structure and exhibits a high dielectric constant. This BaTiO3 can generally be obtained by synthesizing barium titanate by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. Various methods have been known so far as a method for synthesizing the main component ceramic of the dielectric layer 11, such as a solid-phase method, a sol-gel method, a hydrothermal method, and the like. In this embodiment, any of these methods can be adopted.

[0050] A specific additive compound is added to the obtained ceramic powder according to the purpose. Examples of the additive compound include oxides of magnesium (Mg), manganese (Mn), molybdenum (Mo), vanadium (V), chromium (Cr), rare earth elements (yttrium (Y), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm) and ytterbium (Yb)), oxides containing cobalt (Co), nickel (Ni), lithium (Li), boron (B), sodium (Na), potassium (K) or silicon (Si), or glasses containing Co, Ni, Li, B, Na, K or Si. Of these, SiO2 mainly functions as a sintering aid.

[0051] For example, a compound containing an additive compound is wet-mixed with a ceramic raw material powder, and then dried and pulverized to prepare a ceramic material. For example, the ceramic material obtained as described above may be pulverized as necessary to adjust the particle size, or may be combined with a classification process to adjust the particle size. Through the above steps, a dielectric material is obtained.

[0052] (Lamination process) Next, a binder such as polyvinyl butyral (PVB) resin, an organic solvent such as ethanol or toluene, and a plasticizer are added to the obtained raw material powder and wet mixed. The obtained slurry is used to coat a dielectric green sheet 52 on a substrate 51 by, for example, a die coater method or a doctor blade method, and then dried. The substrate 51 is, for example, a polyethylene terephthalate (PET) film.

[0053] Next, as illustrated in Fig. 6(a), an internal electrode pattern 53 is formed on a dielectric green sheet 52. In Fig. 6(a), as an example, four layers of internal electrode patterns 53 are formed at predetermined intervals on the dielectric green sheet 52. The dielectric green sheet 52 on which the internal electrode patterns 53 are formed is defined as a lamination unit.

[0054] The internal electrode patterns 53 use a metal paste of the main component metal of the internal electrode layers 12. The film formation method may be printing, sputtering, vapor deposition, etc. The shape of each internal electrode pattern 53 corresponds to the internal electrode layer 12.

[0055] Next, while peeling off the dielectric green sheet 52 from the base material 51, the lamination units are laminated as shown in FIG. 6(b).

[0056] Next, a predetermined number of cover sheets 54 (e.g., 2 to 10 layers) are laminated on the top and bottom of the laminate obtained by laminating the lamination units, and are thermocompression bonded, and then cut into a predetermined chip size (e.g., 1.0 mm x 0.5 mm). In the example of FIG. 6(b), cutting is performed along the dotted lines. The cover sheet 54 may be of the same composition as the dielectric green sheet 52, or may have a different additive. FIG. 7(a) illustrates the cut molded body.

[0057] (Coating process) The ceramic laminate thus obtained is subjected to a binder removal process in an N2 atmosphere, and then a base metal paste 61 that will become the base metal layer 21 is applied by a dipping method or the like, as shown in Fig. 7(b) as an example. The base metal paste 61 contains base metal powder that is the main component of the base metal layer 21. The base metal paste 61 also contains ceramic particles as a co-material. The base metal paste 61 also contains a binder, a solvent, and the like. For example, the base metal paste 61 is applied to two end faces of the laminate where the internal electrode pattern 53 is exposed.

[0058] 7(c), a precious metal paste 62 that will become the precious metal layer 22 is applied onto the base metal paste 61 by a dipping method or the like. For example, a solvent in which a powder of a precious metal that is contained in the precious metal layer 22 at % or more is dispersed can be used as the precious metal paste 62. A spin coating method or the like may be used instead of the dipping method. Alternatively, instead of the precious metal paste 62, a film of the metal that is the main component of the precious metal layer 22 may be formed by a vacuum film formation method such as sputtering or vapor deposition.

[0059] (Firing process) Then, oxygen partial pressure 10 -5 ~10 -8 The laminated chip 10 and the external electrodes 20a, 20b are fired simultaneously in a reducing atmosphere of 1 atm at 1100 to 1300° C. In this manner, the laminated chip 10 and the external electrodes 20a, 20b can be fired simultaneously, as shown in FIG.

[0060] (Reoxidation treatment process) After that, a re-oxidation treatment may be performed at 600° C. to 1000° C. in an N2 gas atmosphere.

[0061] (Plating process) 7(e), a plating layer 30 may be formed on the precious metal layer 22 by plating, thereby completing the multilayer ceramic capacitor 100.

[0062] It is to be noted that the precious metal layer 22 does not have to be fired at the same time as the laminated chip 10. For example, the laminated chip 10 and the base metal layer 21 are fired at the same time, and then the precious metal paste 62 is applied. Thereafter, the precious metal paste 62 may be baked at, for example, about 700°C to 900°C to form the precious metal layer 22, and then the plating layer 30 may be formed. Alternatively, the precious metal layer 22 may be formed by forming a film of a precious metal on the base metal layer 21 by a vacuum film formation method.

[0063] In addition, the base metal layer 21 and the precious metal layer 22 do not have to be fired at the same time as the laminated chip 10. For example, a base metal paste 61 is applied to the first end face and the second end face of the laminated chip 10 obtained by firing by a dipping method or the like. The base metal paste 61 contains a glass component. A precious metal paste 62 is applied onto the base metal paste 61. Thereafter, the base metal paste 61 and the precious metal paste 62 are baked at, for example, about 700°C to 900°C to form the base metal layer 21 and the precious metal layer 22. Thereafter, the plating layer 30 may be formed.

[0064] According to the manufacturing method of this embodiment, since the precious metal layer 22 is formed as the surface of the external electrodes 20a, 20b, oxidation of the surface of the external electrodes 20a, 20b is suppressed. For example, even if a firing process or a reoxidation process is performed, oxidation of the surface of the external electrodes 20a, 20b is suppressed. As a result, polishing such as barrel polishing before the plating process for forming the plating layer 30 can be omitted or the amount of polishing can be reduced. As a result, it is possible to suppress impact damage, and therefore the occurrence of internal cracks in the laminated chip 10 can be suppressed. As a result, the deterioration of the insulation of the multilayer ceramic capacitor 100 can be suppressed. In addition, since oxidation of the surface of the external electrodes 20a, 20b is suppressed, the applied voltage during the plating process can be lowered. As a result, the generation of hydrogen can be suppressed. As a result, the deterioration of the insulation of the multilayer ceramic capacitor 100 can be suppressed.

[0065] When the base metal layer 21 and the precious metal layer 22 are formed, a part of the base metal that is the main component of the base metal layer 21 and a part of the precious metal that is the main component of the precious metal layer 22 may form an alloy. For example, a layer of the alloy may be formed at the interface between the base metal layer 21 and the precious metal layer 22.

[0066] Although the above-described embodiments have been described with reference to a multilayer ceramic capacitor as an example of a ceramic electronic component, the present invention is not limited thereto. For example, the configurations of the above-described embodiments can be applied to other multilayer ceramic electronic components such as varistors and thermistors. EXAMPLES

[0067] The multilayer ceramic capacitor according to the above embodiment was fabricated, and its characteristics were examined.

[0068] (Example) An internal electrode pattern of Ni paste containing Ni powder was printed on a dielectric green sheet containing barium titanate powder. The obtained laminated units were laminated, sandwiched between cover sheets, pressed, and cut into a predetermined shape to obtain a molded body. Ni paste was applied to two end faces of the molded body by the dip method. The Ni paste contained ceramic particles as a co-material. The Ni paste also contained a binder and a solvent. Next, Au paste was applied on the Ni paste by the dip method or the like. A solvent in which Au was dispersed was used as the Au paste. The molded body was fired to obtain a laminated chip, a base metal layer, and a precious metal layer at the same time. After that, a Cu plating layer, a Ni plating layer, and a Sn plating layer were formed in order.

[0069] (Comparative Example) In the comparative example, the precious metal paste was not applied on the base metal paste, and the voltage during the plating process was higher than that in the example. The other conditions were the same as those in the example.

[0070] A moisture resistance test (85°C, 85% Rh, 6.3 V) was conducted on the multilayer ceramic capacitors of the examples and comparative examples. Figure 8 shows the relationship between the time elapsed from the start of the measurement (test time (hr)) and the measured IR. The IR was normalized with the value at 0 hr of the test being 1. As shown in Figure 8, in the comparative example, the IR significantly decreased with the passage of the test time. This is believed to be because hydrogen was generated during the plating process and diffused into the multilayer chip. On the other hand, in the examples, the decrease in IR was suppressed even when the test time was extended. This is believed to be because the plating process was possible at a low voltage, suppressing the generation of hydrogen.

[0071] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and variations are possible within the scope of the gist of the present invention described in the claims. [Explanation of symbols]

[0072] 10 Stacked Chip 11 Dielectric layer 12 Internal electrode layer 13 Cover Layer 14 Capacity part 15 End Margin 16 Side Margin 20a,20b external electrode 21 Base metal layer 22 Precious metal layer 30 Plating layer 31 First plating layer 32 Second plating layer 33 3rd plating layer 51 Base material 52 Dielectric green sheet 53 Internal electrode pattern 54 Cover Sheet 100 Multilayer ceramic capacitors

Claims

1. a laminated chip having a substantially rectangular parallelepiped shape in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately laminated, and the plurality of internal electrode layers are alternately exposed at first and second end faces opposing each other of the substantially rectangular parallelepiped shape; external electrodes provided on the first end surface and the second end surface; a plating layer provided on the external electrode, The external electrode is a ceramic electronic component characterized in that it comprises a base metal layer provided on the laminated chip side and composed mainly of a base metal having an oxidation-reduction potential of less than 0.9 V, and a precious metal layer provided on the plating layer side of the base metal layer, which contains 90 at% or more of a precious metal having an oxidation-reduction potential of 0.9 V or more and has a thickness of 1 μm or less.

2. 2. The ceramic electronic component according to claim 1, wherein the thickness of the precious metal layer is 0.5 μm or more.

3. 3. The ceramic electronic component according to claim 1, wherein the noble metal layer covers the entire base metal layer.

4. 3. The ceramic electronic component according to claim 1 or 2, characterized in that, when the external electrodes are subjected to a line analysis in the thickness direction, a concentration peak of the base metal appears in the laminated chip, and a concentration peak of the precious metal appears in the plating layer.

5. 3. The ceramic electronic component according to claim 1, wherein the noble metal is Au, Pt or Pd.

6. 3. The ceramic electronic component according to claim 1, wherein the base metal is Ni.

7. a step of alternately laminating dielectric green sheets and internal electrode patterns for internal electrode layers to form a ceramic laminate having a substantially rectangular parallelepiped shape, and exposing the laminated internal electrode patterns alternately on a first end face and a second end face opposite to each other of the ceramic laminate; forming external electrodes on the first end surface and the second end surface during or after firing of the ceramic laminate; forming a plating layer on the external electrodes; The method for manufacturing a ceramic electronic component, wherein the step of forming the external electrode includes a step of forming a precious metal layer having a thickness of 1 μm or less and containing 90 at % or more of a precious metal having an oxidation-reduction potential of 0.9 V or more on a base metal layer mainly composed of a base metal having an oxidation-reduction potential of less than 0.9 V.

8. The method for manufacturing a ceramic electronic component as described in claim 7, characterized in that the process for forming the external electrodes includes the steps of forming a film of a base metal paste containing powder of the base metal, forming a film of a precious metal paste having powder of the precious metal dispersed in a solvent on the base metal paste, and simultaneously firing the base metal paste and the precious metal paste.

9. The method for manufacturing a ceramic electronic component according to claim 7, characterized in that the process for forming the external electrodes includes the steps of forming a film of a base metal paste containing powder of the base metal, forming a film of the precious metal by a vacuum film forming method, and simultaneously firing the base metal paste and the precious metal.

10. The method for manufacturing a ceramic electronic component as described in claim 7, characterized in that the process for forming the external electrodes includes the steps of forming a film of a base metal paste containing powder of the base metal, simultaneously firing the ceramic laminate and the base metal paste, and then applying and baking a precious metal paste in which the precious metal is dispersed in a solvent onto the base metal layer.

11. The method for manufacturing a ceramic electronic component as described in claim 7, characterized in that the process for forming the external electrodes includes the steps of forming a film of a base metal paste containing powder of the base metal, simultaneously firing the ceramic laminate and the base metal paste, and then forming a film of the precious metal on the base metal layer by a vacuum film formation method to form the precious metal layer.

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