Method for producing laminate film having adhesive layer

Abstract

To provide a method for producing a laminate film suitable for efficiently producing a laminate film having an adhesive layer.SOLUTION: There is provided a method for producing a laminate film which comprises a half cutting step and a full cutting step. In the half cutting step, a film layer 10 and an adhesive layer 20 are fused to form half-cut grooves G1 by irradiation and scanning of laser light L1 from a film layer 30 side to a work film W comprising a carrier film C, the film layer 10, the adhesive layer 20 and a film layer 30 in this order in the thickness direction H. In the full cutting step, the film layer 30, the adhesive layer 20 and the film layer 10 are fused to form full-cut grooves G2 by irradiation and scanning of laser light L2 from the film layer 30 side to the work film W. The half-cut grooves G1 and the full-cut grooves G2 extend adjacent and parallel to each other and are continuously connected in the adjacent direction in the direction of the extension.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for producing a laminated film having a pressure-sensitive adhesive layer. [Background technology]

[0002] A display panel has a laminated structure including elements such as a pixel panel, a polarizing film, a touch panel, and a cover film. In the manufacturing process of such a display panel, for example, an optically transparent adhesive sheet (optical adhesive sheet) is used to bond the elements included in the laminated structure. The optical adhesive sheet is manufactured, for example, in a form in which both sides of the sheet are covered with release liners (in the form of a laminated film having an adhesive layer).

[0003] Meanwhile, development of repeatedly foldable display panels for, for example, smartphones and tablet terminals is progressing. Specifically, a foldable display panel can be repeatedly deformed between a curved shape and a flat non-bent shape. In such a foldable display panel, each element in the laminated structure is made to be repeatedly foldable, and a thin optical adhesive sheet is used for bonding between such elements. An optical adhesive sheet for flexible devices such as a foldable display panel is described, for example, in Patent Document 1 below. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2018-111754 A Summary of the Invention [Problem to be solved by the invention]

[0005] Conventionally, an optical adhesive sheet for a display panel is produced, for example, as follows.

[0006] First, a work film W' is prepared as shown in Fig. 18A. The work film W' is composed of a laminate sheet 90 as a long original sheet, and a long carrier film C' that supports the laminate sheet 90. The laminate sheet 90 has a release liner 91, an adhesive layer 92, and a release liner 93, in this order in the thickness direction H. The release liner 91 is in releasable contact with one side of the adhesive layer 92. The release liner 93 is in releasable contact with the other side of the adhesive layer 92. The carrier film C' supports the laminate sheet 90 from the release liner 91 side.

[0007] Next, as shown in FIG. 18B, the adhesive layer 92 of the laminated sheet 90 is pressed to form a plurality of discrete adhesive sheets 92A (pressing process). In the press process, as shown in FIG. 19, the blade 101 of the blade die 100 is pressed into the laminated sheet 90 from the release liner 93 side until it reaches the release liner 91. This forms an adhesive sheet 92A of a predetermined shape in plan view in the adhesive layer 92. In this process, a peripheral portion 92a is formed around the adhesive sheet 92A in the adhesive layer 92. The release liner 93 is also pressed to form a release liner 93A of the same shape in plan view as the adhesive layer 92, and a peripheral portion 93a is formed around the release liner 93A. Also, a cutting groove 95 (FIG. 18B) is formed in the laminated sheet 90 from the release liner 93 side to the release liner 91.

[0008] FIG. 20 shows an example of a conventional press working process. In the press working process shown in FIG. 20, a workpiece film W' flowing through a production line passes between a pair of nip rollers 201, 201, a press working machine 202, and a pair of nip rollers 203, 203, in this order. The press working machine 202 includes an intermittent feed device, a working stage, and a blade die arranged above the stage (all not shown). Between the pair of nip rollers 201, 201 and the press working machine 202, the workpiece film W' is slackened. Between the press working machine 202 and the pair of nip rollers 203, 203, the workpiece film W' is slackened. Between the nip rollers 201, 201 and the nip rollers 203, 203, the workpiece film W' is intermittently fed by an intermittent feed device of the press working machine 202. As a result, an unworked area of ​​the workpiece film W' is intermittently supplied onto the working stage of the press working machine 202. On the processing stage, press processing is performed by a blade die on each unprocessed area of ​​the intermittently supplied workpiece film W'.

[0009] After this pressing process, as shown in Figure 18C, peripheral portions 92a, 93a (Figure 18B) are removed from release liner 91 (removal process). Thereafter, as shown in Figure 18D, long release liner 91 is cut into sheet-shaped release liners 91A by pressing with another pressing machine. This results in sheet-shaped laminate film 90A (release liner 91A / adhesive sheet 92A / release liner 93A) having an adhesive layer.

[0010] Release liner 91A has an extending end 91a that extends outward beyond the edge of adhesive sheet 92A in plane direction D perpendicular to thickness direction H. Laminated film 90A including release liner 91A having such an extending end 91a serves to prevent adhesive sheet 92A from protruding from the film end. Such protruding adhesive sheet 92A (adhesive layer) is undesirable because it can cause the ends of adhesive sheets 92A of adjacent laminated films 90A to adhere to each other (blocking) when laminated films 90A are stacked.

[0011] In the conventional manufacturing method described above, a press processing step (FIG. 18B) is performed on each unprocessed area of ​​the workpiece film W' that is intermittently fed onto the processing stage of the press processing machine 202. That is, the workpiece film W' is alternately fed and stopped in order to process the outer shape of the adhesive sheet. To achieve such intermittent feeding, an intermittent feeding device is required, and the device must be controlled. Such a conventional manufacturing method is not preferable from the viewpoint of the manufacturing efficiency of a laminated film having an adhesive layer.

[0012] Furthermore, in the conventional manufacturing method described above, a removal step (FIG. 18C) is required after the press processing step (FIG. 18B). The removal step exposes the release liner 91 between adjacent pressure-sensitive adhesive sheets 92A on the release liner 91. The exposed portions of the release liner 91 are then cut in a cutting step (FIG. 18D) to form release liner 91A having extended end portion 91a. However, the above-mentioned removal step reduces the manufacturing efficiency of the laminated film having a pressure-sensitive adhesive layer.

[0013] The present invention provides a method for producing a laminated film suitable for efficiently producing a laminated film having a pressure-sensitive adhesive layer. [Means for solving the problem]

[0014] The present invention [1] is a roll-to-roll manufacturing method for a laminated film having an adhesive layer, the method including: a preparation step of preparing a long work film having a carrier film, a first film layer, an adhesive layer, and a second film layer in this order in the thickness direction; a half-cut step of irradiating and scanning the work film with a first laser light from the second film layer side to melt the second film layer and the adhesive layer to form a half-cut groove; and a full-cut step of irradiating and scanning the work film with a second laser light from the second film layer side to melt the second film layer, the adhesive layer, and the first film layer to form a full-cut groove, the half-cut groove and the full-cut groove extending parallel to each other and adjacent to each other, and being continuous in the extension direction and connected in the adjacent direction.

[0015] The manufacturing method of the laminated film having the adhesive layer includes the half-cut process and the full-cut process as described above. In the half-cut process, a half-cut groove (from the second film layer side to the first film layer in the work film) is formed by irradiation and scanning with the first laser light. This causes the adhesive layer and the second film layer to be contoured. That is, an individualized adhesive layer is formed in the adhesive layer, and an individualized second film is formed in the second film layer. In the full-cut process, a full-cut groove (from the second film layer side to the carrier film in the work film) is formed by irradiation and scanning with the second laser light. This causes the first film layer to be contoured. That is, an individualized first film is formed in the first film layer. The half-cut process and the full-cut process are performed in this order, or the full-cut process and the half-cut process are performed in this order, and the half-cut groove and the full-cut groove are formed adjacent to each other. Specifically, the half-cut groove and the full-cut groove extend adjacent to each other in parallel, and are continuously connected in the extension direction in the adjacent direction. In the singulated first film, the portions facing the half-cut grooves and full-cut grooves extend outward in a plane direction perpendicular to the thickness direction beyond the edges of the singulated adhesive layer on the first film. Thus, according to this manufacturing method, it is possible to manufacture a laminated film having an adhesive layer (comprising the first film, the adhesive layer, and the third film in this order in the thickness direction), in which the first film has an extending end portion.

[0016] In this manufacturing method, the laminated film having an adhesive layer is contoured by laser processing. Laser processing is suitable for continuously contouring the work film while it is continuously flowing (it is not necessary to feed the work film intermittently for contour processing). Therefore, this manufacturing method is suitable for efficiently manufacturing the laminated film having an adhesive layer.

[0017] In the half-cut process of this manufacturing method, the material of the work film is evaporated and removed in the portion where the laser light is irradiated to the work film. This forms a half-cut groove. In the full-cut process, the material of the work film is evaporated and removed in the portion where the laser light is irradiated to the work film. This forms a full-cut groove. The half-cut groove and the full-cut groove extend adjacent to each other in parallel as described above, and are continuously connected in the adjacent direction in the extension direction. The half-cut groove and the full-cut groove connected in this way define the outer shape of the laminated film (first film, adhesive, second film) on the carrier film. Therefore, in this manufacturing method, the above-mentioned removal process (the process of removing the surrounding portion around the adhesive layer etc. that has been contoured) is not necessary as for the conventional manufacturing method. Therefore, this manufacturing method is suitable for efficiently manufacturing a laminated film having an adhesive layer.

[0018] As described above, the present production method is suitable for efficiently producing a laminated film having a pressure-sensitive adhesive layer (comprising a first film, a pressure-sensitive adhesive layer, and a third film in this order in the thickness direction).

[0019] The present invention [2] includes the method for producing a laminated film having a pressure-sensitive adhesive layer described in [1] above, wherein in the half-cut process, the melting of the second film layer and the pressure-sensitive adhesive layer by irradiation and scanning with the first laser light is repeated multiple times while shifting the melting point in a direction intersecting the direction of the scanning, thereby forming the half-cut groove.

[0020] This half-cut process is preferable for forming a wide half-cut groove. The wider the groove width of the half-cut groove, the longer the extended end portion of the first film that can be produced. The longer the extended end portion, the more the above-mentioned blocking can be suppressed.

[0021] The present invention [3] includes a method for producing a laminated film having an adhesive layer described in [1] or [2] above, which does not include loosening the work film before or after the half-cut process.

[0022] This manufacturing method does not require adjustment or control to slacken the work film before and after the half-cut process on the manufacturing line, and is preferable for efficiently manufacturing a laminated film having an adhesive layer.

[0023] The present invention [4] includes a method for producing a laminated film having an adhesive layer described in [1] to [3] above, which does not include slackening the work film before or after the full cutting process.

[0024] This manufacturing method does not require adjustment or control to slacken the work film before and after the full cutting process on the production line, and is preferable for efficiently manufacturing a laminated film having an adhesive layer.

[0025] The present invention [5] includes a method for producing a laminated film having an adhesive layer described in any one of [1] to [4] above, wherein in the first film layer and the adhesive layer exposed in the adjacent half-cut groove and full-cut groove, the distance between the outer end in the surface direction of the first film layer and the inner end in the surface direction of the adhesive layer is 1 mm or less.

[0026] The area between the outer end in the plane direction of the first film layer exposed in the half-cut groove and the full-cut groove and the inner end in the plane direction of the adhesive layer is a part of the edge area that can be used as an alignment mark (edge ​​alignment mark) for edge detection of the laminated film to be manufactured. Therefore, a configuration in which the distance between the outer end in the plane direction of the first film layer and the inner end in the plane direction of the adhesive layer is 1 mm or less is preferable for suppressing erroneous detection of the edge alignment mark by the detection camera (if the edge alignment mark is too large, erroneous detection will occur).

[0027] The present invention [6] includes a method for manufacturing a laminated film having an adhesive layer described in any one of [1] to [5] above, in which the first half-cut groove, the full-cut groove, and the second half-cut groove are formed so as to be adjacent to and connected in this order in the longitudinal direction of the work film, and a separation distance between adjacent adhesive layers in the longitudinal direction via the first half-cut groove, the full-cut groove, and the second half-cut groove is 2 mm or less.

[0028] Such a configuration is preferable for realizing high productivity of the laminated film.

[0029] The present invention [7] includes the method for producing a laminated film having a pressure-sensitive adhesive layer according to any one of the above [1] to [6], wherein the first laser beam is a Gaussian laser beam or a top-hat laser beam.

[0030] Such a configuration is preferable for appropriately forming the half-cut groove in the half-cutting step. [Brief description of the drawings]

[0031] [Figure 1] 1A, 1B, and 1C are process diagrams of a first embodiment of a laminated film manufacturing method of the present invention, in which Fig. 1A shows a preparation process, Fig. 1B shows a half-cut process, and Fig. 1C shows a full-cut process. [Diagram 2] 1B is a schematic plan view of an example of a region in the workpiece film after a half-cut process (FIG. 1B). FIG. [Diagram 3] 1C is a schematic plan view of an example of a region in the workpiece film after a full cutting process (FIG. 1C). FIG. [Figure 4] FIG. 1D is a partially enlarged cross-sectional view of the workpiece film after the full cut process (FIG. 1C). [Diagram 5] FIG. 2 is a perspective view of a laser processing device that performs a half-cut process and a full-cut process. [Figure 6] 6 is a cross-sectional view of the laser processing apparatus shown in FIG. 5. [Figure 7]FIG. 2 is a schematic diagram of an internal configuration of a laser processing unit. [Figure 8] FIG. 1 is a perspective view of an example of a galvanometer scanner. [Figure 9] 1 shows a modified example of the half-cut process, in which the second film layer and the adhesive layer are melted by irradiation and scanning with a first laser light, and the melting points are shifted in a direction intersecting the scanning direction and repeated multiple times to form half-cut grooves. [Figure 10] 10 is a schematic plan view of an example of a region of the workpiece film after the half-cut process shown in FIG. 9. FIG. [Figure 11] This shows the full-cut process after the half-cut process shown in FIG. [Figure 12] 12 is a schematic plan view of an example of a region of the workpiece film after the full cutting process shown in FIG. 11. [Figure 13] 11 is a partially enlarged cross-sectional view of the work film after the full cutting process shown in FIG. 10. FIG. [Figure 14] 14A and 14B are process diagrams of a modified example of the laminated film manufacturing method of the present invention, where Fig. 14A shows a full-cut process and Fig. 14B shows a half-cut process. [Figure 15] 15A to 15C are process diagrams of a second embodiment of a laminated film manufacturing method of the present invention, in which Fig. 15A shows a preparation process, Fig. 15B shows a half-cut process, and Fig. 15C shows a full-cut process. [Figure 16] FIG. 15C is a schematic plan view of an example of a region in the workpiece film after a half-cut process (FIG. 15B). [Figure 17] 15C is a schematic plan view of an example of a region in the workpiece film after a full cutting process (FIG. 15C). FIG. [Figure 18] 18A shows an example of a conventional method for manufacturing a laminated film having an adhesive layer, in which Fig. 18A shows a process for preparing a work film, Fig. 18B shows a pressing process, Fig. 18C shows a removing process, and Fig. 18D shows a cutting process. [Figure 19] This shows the press processing process using a blade die. [Figure 20] 1 shows an example of a conventional press working process. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] The laminated film manufacturing method according to the first embodiment of the present invention is a roll-to-roll method for manufacturing a sheet-shaped laminated film having an adhesive layer. As shown in Figures 1A to 1C, the manufacturing method includes a preparation step (Figure 1A), a half-cut step (Figure 1B), and a full-cut step (Figure 1C).

[0033] In the preparation step, a long work film W is prepared as shown in Fig. 1A. The work film W includes a laminate film X and a carrier film C. The laminate film X is a long original film. The carrier film C supports the laminate film X.

[0034] The laminated film X includes a film layer 10 (first film layer), an adhesive layer 20, and a film layer 30 (second film layer) in this order in the thickness direction H. The adhesive layer 20 has a first surface 20a and a second surface 20b opposite to the first surface 20a. The film layer 10 is in contact with the first surface 20a. The film layer 30 is in contact with the second surface 20b. The laminated film X extends in a planar direction perpendicular to the thickness direction H.

[0035] The carrier film C is a single-sided adhesive film having an adhesive surface on one side in the thickness direction H. In the workpiece film W, the adhesive surface of the carrier film C is bonded to the film layer 10 side of the laminated film X. That is, the workpiece film W specifically includes the carrier film C, the film layer 10, the adhesive layer 20, and the film layer 30 in this order in the thickness direction H.

[0036] In this embodiment, the carrier film C is wider than the laminated film X in a width direction D2 (FIGS. 2 and 3) perpendicular to the flow direction D1 of the workpiece film W. The laminated film X is disposed at the center position of the width direction D2 on the carrier film C. The width (length in the width direction D2) of the laminated film X is, for example, 200 mm or more, preferably 280 mm or more, more preferably 400 mm or more, and is, for example, 2000 mm or less, preferably 1800 mm or less, more preferably 1600 mm or less. Such a workpiece film W is run through the production line.

[0037] In this embodiment, the film layer 10 is a release liner. Examples of materials for the release liner include polyester, polyolefin, and polycarbonate. Examples of polyester include polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate. Examples of polyolefin include polyethylene, polypropylene, and cycloolefin polymer (COP). The film layer 10 as a release liner is in peelable contact with the first surface 20a of the adhesive layer 20. The surface of such a film layer 10 (the surface on the adhesive layer 20 side) is preferably subjected to a release treatment. Examples of the release treatment include a silicone release treatment and a fluorine release treatment. From the viewpoint of ensuring a protective function for the adhesive layer 20, the thickness of the film layer 10 is preferably 10 μm or more, more preferably 15 μm or more, and even more preferably 20 μm or more. From the viewpoint of making the laminated film X thinner, the thickness of the film layer 10 is preferably 150 μm or less, more preferably 120 μm or less, and even more preferably 100 μm or less.

[0038] The adhesive layer 20 is formed from an adhesive composition. The adhesive composition includes a base polymer. The base polymer is an adhesive component that exhibits adhesiveness. Examples of the base polymer include an acrylic polymer, a polyurethane polymer, a polyamide polymer, and a polyvinyl ether polymer. The base polymer may be used alone or in combination of two or more kinds. From the viewpoint of ensuring good transparency and adhesiveness in the adhesive layer 20, an acrylic polymer is preferably used as the base polymer.

[0039] The acrylic polymer is a polymer of a monomer component containing 50% by mass or more of a (meth)acrylic acid ester. "(Meth)acrylic" means acrylic and / or methacrylic. As the (meth)acrylic acid ester, preferably, a (meth)acrylic acid alkyl ester is used, and more preferably, a (meth)acrylic acid alkyl ester having an alkyl group with 1 to 20 carbon atoms is used. The monomer component may contain a copolymerizable monomer that is copolymerizable with the (meth)acrylic acid alkyl ester. Examples of the copolymerizable monomer include a hydroxyl group-containing monomer, a carboxyl group-containing monomer, and a monomer having a nitrogen atom-containing ring.

[0040] The haze of the adhesive layer 20 is preferably 3% or less, more preferably 2% or less, and even more preferably 1% or less. The haze of the adhesive layer 20 can be measured using a haze meter in accordance with JIS K7136 (2000). Examples of haze meters include "NDH2000" manufactured by Nippon Denshoku Industries Co., Ltd. and "HM-150 type" manufactured by Murakami Color Research Laboratory Co., Ltd.

[0041] The shear storage modulus of the adhesive layer 20 at 25 ° C. is preferably 10 kPa or more, more preferably 15 kPa or more, even more preferably 20 kPa or more, and particularly preferably 25 kPa or more, from the viewpoint of ensuring the cohesive force of the adhesive layer 20. The shear storage modulus of the adhesive layer 20 at 25 ° C. is 100 kPa or less, preferably 80 kPa or less, more preferably 70 kPa or less, even more preferably 60 kPa or less, and particularly preferably 50 kPa or less, from the viewpoint of realizing the softness required for the optical adhesive sheet for flexible device use in the adhesive layer 20. Examples of the method for adjusting the shear storage modulus include selection of the type of base polymer in the adhesive layer 20, adjustment of the molecular weight, adjustment of the blending amount, adjustment of the glass transition temperature, and adjustment of the degree of crosslinking. Examples of the method for adjusting the shear storage modulus include selection of components other than the base polymer in the adhesive layer 20 and adjustment of the blending amount. The shear storage modulus of the adhesive layer is determined by dynamic viscoelasticity measurement. The measurement can be performed using a dynamic viscoelasticity measuring device, "Advanced Rheometric Expansion System (ARES)" manufactured by Rheometric Scientific Corp. In the measurement, the measurement mode is shear mode, the measurement temperature range is -40°C to 100°C, the heating rate is 5°C / min, and the frequency is 1Hz.

[0042] The film layer 30 is, for example, a release liner, a functional optical film, or a substrate film (support film).

[0043] Examples of the material of the release liner include polyester, polyolefin, and polycarbonate. Specifically, the materials of the release liner described above with respect to the film layer 10 are included. The film layer 30 as the release liner is in peelable contact with the second surface 20b of the adhesive layer 20. The surface of such a film layer 30 (the surface on the adhesive layer 20 side) is preferably subjected to a release treatment. Examples of the release treatment include a silicone release treatment and a fluorine release treatment. From the viewpoint of ensuring the protective function for the adhesive layer 20, the thickness of the film layer 30 as the release liner is preferably 10 μm or more, more preferably 15 μm or more, and even more preferably 20 μm or more. From the viewpoint of making the laminated film X thinner, the thickness of the film layer 30 as the release liner is preferably 150 μm or less, more preferably 120 μm or less, and even more preferably 100 μm or less.

[0044] Examples of the functional optical film include a polarizing film and a retardation film. The functional optical film may be other optical films such as a panel reinforcement material. When the film layer 30 is a functional optical film, the second surface 20b of the adhesive layer 20 is bonded to the film layer 30. The film layer 30 as a functional optical film and the adhesive layer 20 form a functional optical film with an adhesive layer.

[0045] The polarizing film may be, for example, a hydrophilic polymer film that has been dyed with a dichroic substance and then stretched. The dichroic substance may be, for example, iodine and a dichroic dye. The hydrophilic polymer film may be, for example, a polyvinyl alcohol (PVA) film, a partially formalized PVA film, and a partially saponified film of an ethylene-vinyl acetate copolymer. The polarizing film may also be a polyene-oriented film. The material of the polyene-oriented film may be, for example, a dehydrated product of PVA and a dehydrochlorinated product of polyvinyl chloride. The polarizing film may have a protective film bonded to one surface and / or the other surface in the thickness direction via an adhesive. The thickness of the polarizing film is preferably 10 μm or more, more preferably 20 μm or more, from the viewpoint of ensuring the function, strength, and durability of the polarizing film. The thickness of the polarizing film is preferably 500 μm or less, more preferably 300 μm or less, from the viewpoint of making the laminated film X thinner.

[0046] Examples of the retardation film include λ / 2 wavelength film, λ / 4 wavelength film, and viewing angle compensation film. Examples of the material of the retardation film include polymer films that are birefringent by stretching. Examples of the polymer films include cellulose films and polyester films. Examples of the cellulose films include triacetyl cellulose films. Examples of the polyester films include polyethylene terephthalate films, polyethylene naphthalate films, and polybutylene terephthalate films. Examples of the retardation film include films that include a substrate such as a cellulose film and an orientation layer on the substrate. The orientation layer is formed from a liquid crystal compound such as a liquid crystal polymer. The thickness of the retardation film is preferably 1 μm or more, more preferably 2 μm or more, from the viewpoint of ensuring the function and strength of the retardation film. The thickness of the retardation film is preferably 100 μm or less, more preferably 80 μm or less, from the viewpoint of making the laminated film X thinner.

[0047] Examples of the material of the base film include the materials mentioned above as the material of the release liner. When the film layer 30 is a base film, the second surface 20b of the adhesive layer 20 is bonded to such a film layer 30. The film layer 30 as a base film and the adhesive layer 20 form, for example, a one-sided adhesive sheet. The film layer 30 as a base film and the adhesive layer 20 may form a surface protection film with an adhesive layer. From the viewpoint of ensuring the strength as a base, the thickness of the base film is preferably 10 μm or more, more preferably 20 μm or more, and even more preferably 30 μm or more. From the viewpoint of making the laminated film X thinner, the thickness of the base film is preferably 200 μm or less, more preferably 150 μm or less, and even more preferably 100 μm or less.

[0048] The laminated film X can be produced, for example, as follows. First, the above-mentioned adhesive composition is applied onto the film layer 30 to form a coating film. Next, the film layer 10 is laminated onto the coating film on the film layer 30. Next, the coating film between the film layers 10 and 30 is dried, and the coating film is irradiated with light as necessary. In this way, the adhesive layer 20 is formed between the film layers 10 and 30. Examples of methods for applying the adhesive composition include roll coating, kiss roll coating, gravure coating, reverse coating, roll brushing, spray coating, dip roll coating, bar coating, knife coating, air knife coating, curtain coating, lip coating, and die coating. The drying temperature for the coating film is, for example, 50°C to 200°C. The drying time is, for example, 5 seconds to 20 minutes.

[0049] In the half-cut process, as shown in FIG. 1B, a half-cut groove G1 is formed by laser processing the workpiece film W. Specifically, a laser processing device irradiates and scans the workpiece film W with laser light L1 (first laser light) from the film layer 30 side, thereby melting the film layer 30 and the adhesive layer 20 in the laminated film X to form the half-cut groove G1. The half-cut groove G1 is formed so as to follow a predetermined processing line (designed cutting line) in the workpiece film W. As a result, in the adhesive layer 20, an individualized adhesive layer 21 and a peripheral portion 22 around the adhesive layer 21 are formed. In addition, in the film layer 30, a film 31 on the adhesive layer 21 and a peripheral portion 32 around the film 31 are formed. In the film layer 10, a groove G1a (a part of the half-cut groove G1) is formed. The groove G1a is formed along the end face 21e of the adhesive layer 21. FIG. 2 is a plan view that shows a schematic example of an area in the workpiece film W after the half-cut process. In Fig. 2, the half-cut groove G1 is shown with hatching. The partial cross-sectional view shown in Fig. 1B corresponds to a partial cross-sectional view taken along line II in the workpiece film W shown in Fig. 2.

[0050] Examples of lasers for laser processing include gas lasers, solid-state lasers, and semiconductor lasers. Examples of gas lasers include excimer lasers and CO2 lasers (10.6 μm) (numbers in parentheses indicate the laser wavelengths. The same applies below for lasers). Examples of excimer lasers include F2 excimer lasers (157 nm), ArF excimer lasers (193 nm), KrF excimer lasers (248 nm), and XeCl excimer lasers (308 nm). Examples of solid-state lasers include Nd:YAG lasers (1064 nm), the second harmonic of Nd:YAG lasers (532 nm), the third harmonic of Nd:YAG lasers (355 nm), and the fourth harmonic of Nd:YAG lasers (266 nm). Examples of semiconductor lasers include semiconductor lasers with a wavelength of 405 nm. As the laser light L1 in the half-cutting step (FIG. 1B), a CO2 laser is preferable from the viewpoint of appropriately cutting both the pressure-sensitive adhesive layer 20 and the film layer 30 which are different in material and optical properties (such as absorbance).

[0051] The laser light L1 is preferably a Gaussian type laser light or a top hat type laser light. Such a configuration is preferable for appropriately forming the half-cut groove G1 in the half-cut process. The Gaussian type laser light is a laser light whose energy intensity distribution has a Gaussian distribution. The top hat type laser light is a laser light whose energy intensity distribution has a top hat shape.

[0052] The output of the laser light L1 is, for example, 2 to 500 W. The pulse frequency of the laser light L1 is, for example, 10 to 30 kHz. The spot diameter of the laser light L1 on the workpiece film W is, for example, 50 to 500 μm.

[0053] In the full-cut process, as shown in FIG. 1C, a full-cut groove G2 is formed by laser processing the workpiece film W. Specifically, a laser processing device irradiates and scans the workpiece film W with laser light L2 (second laser light) from the film layer 30 side, thereby melting the film layer 30, the adhesive layer 20, and the film layer 10 in the laminated film X to form the full-cut groove G2. The full-cut groove G2 is formed along the half-cut groove G1 as shown in FIG. 3 (in FIG. 3, the full-cut groove G2 is shown with finer hatching than the half-cut groove G1). The partial cross-sectional view shown in FIG. 1C corresponds to a partial cross-sectional view taken along line II-II in the workpiece film W shown in FIG. 3. The half-cut groove G1 and the full-cut groove G2 extend parallel to each other adjacent to each other, and are continuously connected in the extension direction to each other in the adjacent direction. In this embodiment, between adjacent laminated film forming regions in the flow direction D1, one full-cut groove G2 is formed between the half-cut groove G1a and the half-cut groove G1b adjacent in the flow direction D1.

[0054] The laser light L2 in the full cutting process (FIG. 1C) is preferably a CO2 laser from the viewpoint of appropriately cutting the adhesive layer 20 and the film layers 10, 30 which are different in material and optical properties (such as absorbance). The laser light L2 may be a Gaussian type laser light or a top hat type laser light. The output of the laser light L2 is, for example, 2 to 500 W. The pulse frequency of the laser light L2 is, for example, 10 to 30 kHz. The spot diameter of the laser light L2 on the workpiece film W is, for example, 50 to 500 μm.

[0055] In this process, the peripheral portions 22, 32 between the adjacent half-cut grooves G1 are evaporated and removed, and individual films 11 are formed in the film layer 10. Then, a laminated film Y (a laminated film having an adhesive layer) is formed on the carrier film C.

[0056] The laminated film Y includes a film 11, a pressure-sensitive adhesive layer 21, and a film 31 in this order in the thickness direction H. The pressure-sensitive adhesive layer 21 has a first surface 21a and a second surface 21b opposite to the first surface 21a. The film 11 contacts the first surface 21a. The film 31 contacts the second surface 21b. The film 11 has an extended end 12. As shown in FIG. 4, the extended end 12 extends outward from the end surface 21e of the pressure-sensitive adhesive layer 21 in a plane direction D perpendicular to the thickness direction H. The extended end 12 has a surface 12a that is flush with the end surface 21e of the pressure-sensitive adhesive layer 21 and a surface 12b that is outward from the surface 12a in the plane direction D, and is thinner than the main region 11A of the film 11 that contacts the pressure-sensitive adhesive layer 21. In this embodiment, a top portion 12c is formed between the surface 12a and the surface 12b. The film 31 has an end surface 31 e that is flush with and connected to the end surface 21 e of the pressure-sensitive adhesive layer 21 .

[0057] At the end of the laminated film Y, the end face 31e, the end face 21e, and a portion of the surface 12a adjacent to the end face 21e form a curved shape (R-shape) that widens outward and has a smaller radius of curvature toward the carrier film C in the thickness direction H. In addition, the surface 12b of the extended end 12 is inclined or curved so as to widen outward toward the carrier film C in the thickness direction H.

[0058] From the viewpoint of suppressing the above-mentioned blocking in the laminated film Y, the extension length d1 of the extending end 12 from the end face 21e in the plane direction D (the direction perpendicular to the end face 21e in the plan view) is preferably 0.1 mm or more, more preferably 0.2 mm or more. From the viewpoint of efficient production of the laminated film Y, the extension length d1 is preferably 0.5 mm or less, more preferably 0.4 mm or less.

[0059] The ratio (h2 / h1) of the minimum thickness h2 of the extended end portion 12 to the thickness h1 of the main region portion 11A of the film 11 is preferably 0.3 or more, and more preferably 0.4 or more, from the viewpoint of ensuring the strength of the extended end portion 12. The ratio (h2 / h1) is, for example, 0.7 or less, 0.8 or less, or 0.9 or less.

[0060] In the film 11 (part of the film layer 10) and the adhesive layer 21 (part of the adhesive layer 20) exposed in the adjacent half-cut groove G1 and full-cut groove G2, the distance d2 (FIG. 4) between the outer end of the film 11 in the plane direction D and the inner end of the adhesive layer 21 in the plane direction D is preferably 1 mm or less, more preferably 0.7 mm or less. The distance d2 is, for example, 0.1 mm or more or 0.2 mm or more. The region between the outer end of the film 11 in the plane direction D exposed in the half-cut groove G1 and the full-cut groove G2 and the inner end of the adhesive layer 21 in the plane direction D is a part of the edge region that can be used as an alignment mark (edge ​​alignment mark) for detecting the end of the laminated film Y to be manufactured. When the distance d2 is 1 mm or less (preferably 0.7 mm or less), erroneous detection of the edge alignment mark by the detection camera can be suppressed (if the edge alignment mark is too large, erroneous detection occurs).

[0061] Between adjacent laminated films Y in the flow direction D1 (length direction) of the work film W, one half-cut groove G1, a full-cut groove G2, and another half-cut groove G1 are formed adjacent to each other in this order so as to be connected. The separation distance d3 (FIG. 4) between the adhesive layers 21 (parts of the adhesive layer 20) adjacent in the flow direction D1 via the one half-cut groove G1, the full-cut groove G2, and the other half-cut groove G1 is preferably 2 mm or less, more preferably 1.7 mm or less, and even more preferably 1.5 mm or less. Such a configuration is preferable for realizing high productivity of the laminated film Y. The separation distance d3 is, for example, 0.5 mm or more, 0.7 mm or more, or 1.0 mm or more.

[0062] In this embodiment, a laser processing apparatus 100 shown in FIGS. 5 and 6 is used as the laser processing apparatus for carrying out the above-mentioned half-cut process (FIG. 1B) and full-cut process (FIG. 1C).

[0063] In this embodiment, the laser processing apparatus 100 includes a processing stage 110, a laser processing unit 120, and a control unit (not shown). Fig. 5 and Fig. 6 exemplarily illustrate a case where the laser processing apparatus 100 includes two laser processing units 120 (120A, 120B). The above-mentioned half-cut process is performed by the laser processing unit 120A. The above-mentioned full-cut process is performed by the laser processing unit 120B.

[0064] The processing stage 110 is a stage that supports the workpiece film W that flows through the production line. As shown in FIG. 6, the processing stage 110 has a support table 111 and a suction path 112. The support table 111 forms a support surface for the workpiece film W in the processing stage 110. The support table 111 has a plurality of suction holes 111a that penetrate the support table 111 in the thickness direction H. The suction path 112 is a space formed in the processing stage 110. The suction path 112 is located below the support table 111. Each suction hole 111a of the support table 111 communicates with the suction path 112. The suction path 112 is connected to a suction path of a vacuum pump (not shown). The suction path 112 is depressurized by the operation of the vacuum pump. The vacuum pump can select an operating state or a non-operating state according to the control by the control unit. When the workpiece film W is on the support table 111 , the suction path 112 is depressurized, so that the workpiece film W is sucked toward the support table 111 of the processing stage 110 .

[0065] As shown in FIG. 5, a pair of nip rollers N1, N1 are arranged on the upstream side of the manufacturing line of the processing stage 110. The workpiece film W is pinched between the pair of nip rollers N1, N1, and each nip roller N1 is rotated at a constant speed to pull and send the workpiece film W toward the processing stage 110. Meanwhile, a pair of nip rollers N2, N2 are arranged on the downstream side of the manufacturing line of the processing stage 110. The workpiece film W is pinched between the pair of nip rollers N2, N2, and each nip roller N2 is rotated at a constant speed to pull and send the workpiece film W toward the downstream side of the nip rollers N2, N2. The nip rollers N1, N1 and the nip rollers N2, N2 cause the workpiece film W to flow on the support stage 111 of the processing stage 110 in the length direction of the film (flow direction D1). In this state, the suction path 112 (FIG. 6) of the processing stage 110 is depressurized, so that the workpiece film W slides on the processing stage 110 while being sucked into the processing stage 110. This is preferable for precisely focusing the laser light L (laser light L1 in the half-cut process, and L2 in the full-cut process) on the adhesive layer 20 of the workpiece film W in the laser processing (half-cut process, full-cut process), and is therefore preferable for cutting the workpiece film W efficiently and with high precision.

[0066] 7, the laser processing unit 120 includes a housing 121, a laser light source 122, a beam expander 123, a movable lens 124, a condenser lens 125, and a galvano scanner S. The laser light source 122, the beam expander 123, the movable lens 124, the condenser lens 125, and the galvano scanner S are housed in the housing 121. The housing 121 has a laser light emission port (not shown).

[0067] The laser light source 122 oscillates laser light L (laser light L1 in the half-cut process, and laser light L2 in the full-cut process). As the laser light source, a CO2 laser light source is preferable from the viewpoint of appropriately cutting multiple layers having different materials and optical properties (such as absorbance).

[0068] The beam expander 123 is an optical component that adjusts the beam size of the laser light L. Other optical components may be disposed between the beam expander 123 and the movable lens 124. Examples of the other optical components include a collimator lens and a homogenizer.

[0069] The movable lens 124 is a lens that is displaceable in the optical axis direction of the laser light L. The displacement of the movable lens 124 in the optical axis direction changes the position of the focal point of the laser light L focused by the focusing lens 125 (the position of the focal point on the work film W). The position of the movable lens 124 in the optical axis direction can be adjusted according to the control by the control unit (position control of the movable lens 124).

[0070] The laser light L that has passed through the condenser lens 125 is reflected by the galvanometer scanner S. As shown in Fig. 7 and Fig. 8, the galvanometer scanner S includes a galvanometer mirror 126 (first galvanometer mirror), a galvanometer motor 127 (first galvanometer motor), a galvanometer mirror 128 (second galvanometer mirror), and a galvanometer motor 129 (second galvanometer motor).

[0071] The galvanometer mirror 126 has a mirror surface 126a capable of reflecting the laser light L. The galvanometer motor 127 has a motor shaft 127a connected to the galvanometer mirror 126. The motor shaft 127a extends in a first direction. The first direction is preferably a direction perpendicular to each of the flow direction D1 and the width direction D2 of the workpiece film W. The galvanometer motor 127 can swing the direction in which the mirror surface 126a of the galvanometer mirror 126 faces (first mirror surface direction) around a rotation axis extending along the motor shaft 127a. The galvanometer motor 127 can control the first mirror surface direction of the galvanometer mirror 126 according to the control by the control unit.

[0072] The galvanometer mirror 128 has a mirror surface 128a capable of reflecting the laser light L. The galvanometer motor 129 has a motor shaft 129a connected to the galvanometer mirror 128. The motor shaft 129a extends in a second direction. The second direction intersects with the first direction. The second direction is preferably perpendicular to the first direction. The second direction is preferably the width direction D2. The galvanometer motor 129 can swing the direction in which the mirror surface 128a of the galvanometer mirror 128 faces (second mirror surface direction) around a rotation axis extending along the motor shaft 129a. The galvanometer motor 129 can control the second mirror surface direction of the galvanometer mirror 128 according to the control by the control unit.

[0073] In the galvanometer scanner S, the laser light L is successively reflected by a mirror surface 126a of the galvanometer mirror 126 and a mirror surface 128a of the galvanometer mirror 128. After passing through a laser light exit port of the housing 121, the laser light L is irradiated onto the workpiece film W on the processing stage 110.

[0074] In the laser processing unit 120, the laser light L is scanned on the workpiece film W by controlling the first and second mirror surface directions of the galvanometer motors 127 and 129. Specifically, the laser light L is scanned in the flow direction D1 and the plane direction D2 by controlling the first and second mirror surface directions of the galvanometer motors 127 and 129 so that the irradiation spot on the workpiece film W of the laser light L from the laser processing unit 120 follows the line to be processed on the workpiece film W. In the laser processing unit 120, the laser light L is scanned within a predetermined range (scanning area) centered substantially directly below the galvanometer scanner S. In FIG. 5, the scanning area AR1 of the laser processing unit 120A and the scanning area AR2 of the laser processing unit 120B are arranged in this order in the flow direction D1. Furthermore, the position of the movable lens 124 is controlled according to the directions of the first and second mirror surfaces so that the size (spot diameter) of the irradiation spot of the scanned laser light L remains the same regardless of changes in the incident angle (the angle formed by the normal direction to the surface of the film and the optical axis direction of the laser light L) with respect to the workpiece film W. In addition, in scanning with the laser light L, the galvanometer scanner S (galvanometer motors 127, 129) is controlled by the control unit so that the position of the irradiation spot, which is determined by the combined speed (vector) of the transport speed (vector) of the workpiece film W and the scanning speed (vector) of the laser light L, follows the planned processing line on the workpiece film W.

[0075] The laser processing unit 120 may be provided with a telecentric type fθ lens at a position where the laser light L passes after the galvano scanner S. The fθ lens is useful for making the spot diameter of the irradiation spot of the laser light L the same regardless of the change in the incident angle of the laser light L to the work film W. When the laser processing unit 120 is provided with such an fθ lens, it is not necessarily required to provide the movable lens 124. When a telecentric type fθ lens having a diameter larger than the width (length in the width direction D2) of the scanning area assigned to the laser processing unit 120 can be used, it is preferable to use such an fθ lens. In addition, in the laser processing unit 120, the telecentric type fθ lens and the above-mentioned movable lens 124 may be used in combination.

[0076] In the manufacturing method of the laminated film, instead of the laser processing apparatus 100 as described above, a first laser processing apparatus performing laser cutting (laser slitting) in the flow direction D1 at one end side of the width direction D2 of the workpiece film W, a second laser processing apparatus performing laser cutting in the flow direction D1 at the other end side of the width direction D2 of the workpiece film W, and a third laser processing apparatus performing laser cutting in the width direction D2 of the workpiece film W may be used in combination. The first to third laser processing apparatuses are arranged in the manufacturing line, for example, in the order of the first laser processing apparatus, the second laser processing apparatus, and the third laser processing apparatus.

[0077] In the first laser processing device, the laser irradiation location on the workpiece film W is fixed, for example. Such a first laser processing device can process the outer shape of one end of the laminated film Y in the width direction D2 of the workpiece film W. In the second laser processing device, the laser irradiation location on the workpiece film W is fixed, for example. Such a second laser processing device can process the outer shape of the other end of the laminated film Y in the width direction D2 of the workpiece film W. The third laser processing device has a configuration that can scan the laser irradiation location on the workpiece film W in the width direction D2. The third laser processing device may be capable of scanning the laser irradiation location by a galvano scanner method, or may be capable of scanning the laser irradiation location by a gantry method. Such a third laser processing device can laser process the area between the laser processing locations by the first and second laser processing devices. That is, the third laser processing device can process the outer shapes of both ends of the laminated film Y in the flow direction D1 of the workpiece film W.

[0078] In this manufacturing method, after the half-cutting step (FIG. 1B) and the full-cutting step (FIG. 1C), the laminated film Y is removed from the carrier film C. This results in the laminated film Y. In this manner, the laminated film Y can be manufactured.

[0079] In this manufacturing method, the laminated film Y (laminate film having an adhesive layer) is contoured by laser processing as described above. Laser processing is suitable for continuously contouring the work film while it is continuously flowing (it is not necessary to feed the work film intermittently for contour processing). Therefore, this manufacturing method is suitable for efficiently manufacturing the laminated film Y.

[0080] In the half-cut process (FIG. 1B), the material of the work film W is evaporated and removed in the portion where the work film W is irradiated with the laser light L1. This forms the half-cut groove G1. In the full-cut process, the material of the work film W is evaporated and removed in the portion where the work film W is irradiated with the laser light. This forms the full-cut groove G2. As described above, the half-cut groove G1 and the full-cut groove G2 extend adjacent to each other in parallel, and are continuously connected in the extension direction in the adjacent direction. The half-cut groove G1 and the full-cut groove G2 connected in this way define the outer shape of the laminated film Y (film 11 / adhesive layer 21 / film 31) on the carrier film C. Therefore, in the present manufacturing method, the removal step described above in relation to the conventional manufacturing method is not required in manufacturing the laminated film Y (including the film 11 having the extended end portion 12). In the present manufacturing method, the removal step described above in relation to the conventional manufacturing method is not required in exposing the extended end portion 12. Therefore, this production method is suitable for producing the laminated film X efficiently.

[0081] As described above, the present production method is suitable for efficiently producing the laminated film Y (a laminated film having a pressure-sensitive adhesive layer).

[0082] In the half-cut process of the present manufacturing method, as shown in FIG. 9, the film layer 30 and the adhesive layer 20 may be melted by irradiation and scanning with the laser light L1 multiple times while shifting the melting points in a direction intersecting the scanning direction, thereby forming a half-cut groove G1. The half-cut groove G1 separates the adhesive layer 21 in the adhesive layer 20. FIG. 10 is a plan view that shows a schematic example of an area in the workpiece film W after such a half-cut process (the half-cut groove G1 is shown hatched in FIG. 10). The partial cross-sectional view shown in FIG. 9 corresponds to the partial cross-sectional view of the workpiece film W taken along line III-III shown in FIG. Such a half-cut process is preferable for forming a wide half-cut groove G1.

[0083] In the subsequent full-cut process, as shown in FIG. 11, the work film W is irradiated with and scanned with a laser beam L2 from the film layer 30 side to melt and cut the film layer 30, the adhesive layer 20, and the film layer 10 in the laminated film X to form a full-cut groove G2. The full-cut groove G2 is formed along the half-cut groove G1 as shown in FIG. 12 (in FIG. 12, the full-cut groove G2 is shown with finer hatching than the half-cut groove G1). The partial cross-sectional view shown in FIG. 11 corresponds to the partial cross-sectional view taken along the line IV-IV of the work film W shown in FIG. 12. Specifically, the full-cut groove G2 is formed along the half-cut groove G1 on the outer side of the half-cut groove G1 with respect to the adhesive layer 21 that has been divided by the half-cut groove G1. The half-cut groove G1 and the full-cut groove G2 extend parallel to each other adjacent to each other, and are continuously connected in the extension direction to each other in the adjacent direction.

[0084] Even after the half-cutting step (FIG. 9) and full-cutting step (FIG. 11) as described above, a laminated film Y (film 11 / adhesive layer 21 / film 31) including a film 11 having an extended end portion 12 is formed on the carrier film C as shown in FIG. 13. Inclusion of the half-cutting step (FIG. 9), which is preferable for forming a wide half-cut groove G1, is preferable for producing a laminated film Y including a film 11 having a longer extended end portion 12. The longer the extended end portion 12, the more the above-mentioned blocking can be suppressed.

[0085] The half-cut process (FIG. 9) of this modified example may be performed by one laser processing unit 120, or may be performed by multiple laser processing units 120 arranged in the flow direction D1 of the workpiece film W. When the half-cut process is performed by multiple laser processing units 120, a laser processing apparatus 100 is used that includes multiple laser processing units 120 for the half-cut process and a laser processing unit 120 for the full-cut process.

[0086] The full-cutting step and the half-cutting step may be performed in this order in the manufacturing method of the laminated film Y. Figures 14A and 14B show process diagrams in which the full-cutting step and the half-cutting step are performed in this order.

[0087] In the full-cut process, as shown in Fig. 14A, a full-cut groove G2 is formed by laser processing the workpiece film W. Specifically, the workpiece film W is irradiated with and scanned with laser light L2 (second laser light) from the film layer 30 side, thereby melting and cutting the film layer 30, the adhesive layer 20, and the film layer 10 in the laminated film X to form the full-cut groove G2. The full-cut groove G2 is formed so as to follow a predetermined planned processing line in the workpiece film W. Such a full-cut process is performed by the laser processing unit 120A of the laser processing device 100.

[0088] In the half-cut process, as shown in FIG. 14B, a half-cut groove G1 is formed by laser processing the workpiece film W. Specifically, the workpiece film W is irradiated with and scanned with a laser beam L1 (first laser beam) from the film layer 30 side to melt and cut the film layer 30 and the adhesive layer 20 in the laminated film X to form the half-cut groove G1. The half-cut groove G1 is formed along the full-cut groove G2 formed in advance. Specifically, the half-cut groove G1 is formed along the full-cut groove G2 on the inside of the full-cut groove G2 so as to contour the adhesive layer 21 within the area surrounded by the full-cut groove G2. The half-cut groove G1 and the full-cut groove G2 extend adjacent to each other in parallel, and are connected continuously in the extension direction in the adjacent direction. Such a half-cut process is performed by the laser processing unit 120B of the laser processing device 100.

[0089] The manufacturing method of the laminated film Y preferably does not include loosening the work film W before and after the half-cutting step. Such a manufacturing method does not require adjustment and control for loosening the work film W before and after the half-cutting step in the manufacturing line of the laminated film Y, and is preferable for efficiently manufacturing the laminated film Y having the adhesive layer 21.

[0090] The manufacturing method of the laminated film Y preferably does not include loosening the work film W before and after the full cutting process. Such a manufacturing method does not require adjustment and control for loosening the work film W before and after the full cutting process in the manufacturing line of the laminated film Y, and is preferable for efficiently manufacturing the laminated film Y having the adhesive layer 21.

[0091] 15 to 17 show a laminated film manufacturing method according to a second embodiment of the present invention. As shown in Fig. 15A to 15C, this manufacturing method includes a preparation step (Fig. 15A), a half-cut step (Fig. 15B), and a full-cut step (Fig. 15C). In this manufacturing method, two full-cut grooves G2a, G2b are formed in the flow direction D1 between adjacent laminated film forming regions in the flow direction D1 by the full-cut step, as follows.

[0092] In the preparation step, as shown in Fig. 15A, a long workpiece film W is prepared. This preparation step is specifically similar to the preparation step described above with reference to Fig. 1A.

[0093] In the half-cut process, as shown in FIG. 15B, a half-cut groove G1 is formed by laser processing the workpiece film W. FIG. 16 is a plan view that shows a schematic example of an area in the workpiece film W after the half-cut process (FIG. 15B). In FIG. 16, the half-cut groove G1 is shown hatched. The partial cross-sectional view shown in FIG. 15B corresponds to the partial cross-sectional view taken along line VV in the workpiece film W shown in FIG. 16. In this manufacturing method (second embodiment), the half-cut groove G1a for one of the two laminated film forming areas adjacent to each other in the flow direction D1 and the half-cut groove G1b for the other are formed farther apart in the flow direction D1 than in the first embodiment described above. Other than this, the half-cut process in the second embodiment is the same as the half-cut process in the first embodiment.

[0094] In the full-cut process, as shown in FIG. 15C, a full-cut groove G2 is formed by laser processing the workpiece film W. As shown in FIG. 17, the full-cut groove G2 is formed along the half-cut groove G1 (in FIG. 17, the full-cut groove G2 is shown with finer hatching than the half-cut groove G1). The partial cross-sectional view shown in FIG. 15C corresponds to a partial cross-sectional view taken along line VI-VI in the workpiece film W shown in FIG. 17. In this embodiment, two full-cut grooves G2a, G2b are formed between the half-cut groove G1a and the half-cut groove G1b adjacent to each other in the flow direction D1 between the laminated film formation regions adjacent to each other in the flow direction D1. Other than this, the full-cut process in the second embodiment is the same as the full-cut process in the first embodiment.

[0095] After the half-cutting step (FIG. 15B) and the full-cutting step (FIG. 15C), the laminated film Y is removed from the carrier film C. This gives the laminated film Y. In this manner, the laminated film Y can be manufactured.

[0096] In this manufacturing method, the laminated film Y (laminate film having an adhesive layer) is contoured by laser processing as described above. Laser processing is suitable for continuously contouring the work film while it is continuously flowing (it is not necessary to feed the work film intermittently for contour processing). Therefore, this manufacturing method is suitable for efficiently manufacturing the laminated film Y.

[0097] In this manufacturing method, as in the manufacturing method of the first embodiment described above, the half-cut groove G1 and the full-cut groove G2 extend adjacent to each other in parallel, and are continuously connected in the extending direction in the adjacent direction. The half-cut groove G1 and the full-cut groove G2 connected in this way define the outer shape of the laminated film Y (film 11 / adhesive layer 21 / film 31) on the carrier film C. Therefore, in the manufacturing method of this embodiment, in manufacturing the laminated film Y (including the film 11 having the extending end portion 12), the removal step described above in the conventional manufacturing method is not required to expose the extending end portion 12. Therefore, this manufacturing method is suitable for efficiently manufacturing the laminated film Y.

[0098] As described above, this production method (second embodiment) is suitable for efficiently producing the laminated film Y (a laminated film having a pressure-sensitive adhesive layer) in the same manner as described above with respect to the first embodiment.

[0099] In the half-cut process of the present manufacturing method, as described above with reference to FIG. 9 in relation to the first embodiment, the film layer 30 and the adhesive layer 20 may be melted by irradiation and scanning with the laser light L1 multiple times while shifting the melting point in a direction intersecting the scanning direction to form a wide half-cut groove G1. In the present manufacturing method, as described above with reference to the first embodiment, the full-cut process and the half-cut process may be performed in this order. As described above with reference to the first embodiment, the present manufacturing method preferably does not include loosening the work film W before and after the half-cut process. As described above with reference to the first embodiment, the present manufacturing method preferably does not include loosening the work film W before and after the full-cut process. [Explanation of symbols]

[0100] W Work Film X Laminated film (Laminated film with adhesive layer) C Carrier Film H Thickness direction D plane direction D1 Flow direction D2 Width direction 10 Film layer (first film layer) 12 Extended end 20 Adhesive layer 30 Film layer (2nd film layer) G1 Half cut groove G2 full cut groove L1 laser beam (first laser beam) L2 laser light (second laser light)

Claims

1. A roll-to-roll method for producing a laminated film having a pressure-sensitive adhesive layer, comprising: A preparation process of preparing a long work film having a carrier film, a first film layer, an adhesive layer, and a second film layer in this order in a thickness direction; A half-cut process in which a first laser light is irradiated and scanned from the second film layer side to the work film to melt and cut the second film layer and the adhesive layer to form a half-cut groove; and a full-cut process for forming a full-cut groove by irradiating and scanning the work film with a second laser light from the second film layer side to melt-cut the second film layer, the adhesive layer and the first film layer, A method for producing a laminated film having a pressure-sensitive adhesive layer, in which the half-cut groove and the full-cut groove extend parallel to each other adjacently and are continuous in the extending direction and connected in the adjacent direction.

2. 2. The method for manufacturing a laminated film having a pressure-sensitive adhesive layer according to claim 1, wherein in the half-cut process, the melting of the second film layer and the pressure-sensitive adhesive layer by irradiation and scanning of the first laser light is repeated multiple times while shifting the melting point in a direction intersecting the scanning direction, thereby forming the half-cut groove.

3. The method for producing a laminated film having an adhesive layer according to claim 1, which does not include loosening the work film before or after the half-cutting step.

4. The method for producing a laminated film having an adhesive layer according to claim 1, which does not include loosening the work film before or after the full cutting step.

5. 5. A method for manufacturing a laminated film having a pressure-sensitive adhesive layer according to claim 1, wherein in the first film layer and the pressure-sensitive adhesive layer exposed in the adjacent half-cut groove and full-cut groove, the distance between the outer end in the surface direction of the first film layer and the inner end in the surface direction of the pressure-sensitive adhesive layer is 1 mm or less.

6. A method for manufacturing a laminated film having an adhesive layer described in any one of claims 1 to 4, wherein the first half-cut groove, the full-cut groove, and the second half-cut groove are formed adjacent to each other in this order in the longitudinal direction of the work film, and the separation distance between adjacent adhesive layers in the longitudinal direction via the first half-cut groove, the full-cut groove, and the second half-cut groove is 2 mm or less.

7. The method for producing a laminated film having a pressure-sensitive adhesive layer according to claim 1 , wherein the first laser beam is a Gaussian type laser beam or a top hat type laser beam.

Images