Information processing device and program
Patent Information
- Application Number
- JP2023030132
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-02-28
- Publication Date
- 2026-03-06
AI Technical Summary
Existing methods for high-precision alignment in lithography processes face challenges in efficiently determining and adjusting parameters for sample shot areas without overfitting, necessitating a method to predict high-order components with high precision and ease of parameter adjustment verification.
A system and method that utilizes a first regression model to determine sample shot areas, displays these areas on a user interface, and allows for re-determination using a second regression model, enabling visual confirmation of parameter adjustments through a user interface screen.
Facilitates easy verification of parameter adjustments, enhancing the precision and efficiency of alignment by allowing users to visually assess and adjust sample shot area determinations and their effects on alignment accuracy.
Smart Images

Figure 00000000_0000_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to an information processing device and a program. [Background technology]
[0002] The exposure apparatus can transfer the pattern of the original onto multiple layers on the substrate by superimposing them on each other. In order to superimpose each layer with high accuracy, it is necessary to align each shot area of the substrate with respect to the original. The alignment can be performed, for example, by detecting an alignment mark arranged for each shot area on the substrate, and based on position information of the alignment mark obtained by the detection and position information of the pattern of the original.
[0003] To achieve highly accurate alignment, it would be ideal to detect alignment marks for all shot areas on the substrate. However, this is not realistic from the viewpoint of productivity. Therefore, a global alignment method is generally adopted for aligning all shot areas on the substrate with the original (see Patent Documents 1 and 2).
[0004] In the global alignment method, it is assumed that the relative positions of all shot areas on a substrate can be expressed as a function of the position coordinates of the shot areas. Based on this assumption, alignment marks are measured only for some shot areas (sample shot areas) among the multiple shot areas on a substrate. Next, parameters of the function model are estimated using regression analysis-like statistical calculation processing from the assumed function model and the results of the position measurement. Then, using the estimated parameters and function model, the position coordinates of each shot area in the stage coordinate system are calculated and alignment is performed. In the global alignment method, a polynomial model with the stage coordinates as variables is generally used. Scaling, rotation, uniform offset, etc., which are first-order polynomials of the stage coordinates, are mainly used (see Patent Document 3).
[0005] A method has also been proposed that uses a regression model that takes into account the higher-order components of the arrangement of shot areas on a substrate as parameters (see Patent Document 4).Furthermore, a method has also been proposed in which multiple sample points are measured in advance, coefficients are selected using the data and a regression model having a regularization term, and the selected coefficients are used to calculate position information of the shot areas. [Prior art documents] [Patent documents]
[0006] [Patent Document 1] Japanese Unexamined Patent Publication No. 61-44429 [Patent Document 2] Japanese Patent Application Publication No. 62-84516 [Patent Document 3] Japanese Patent Application Publication No. 6-349705 [Patent Document 4] Patent No. 3230271 Summary of the Invention [Problem to be solved by the invention]
[0007] In order to perform high-precision correction with a small number of sample shot areas (number of sample points), a method is being considered for predicting high-order components of a substrate with high precision (without overlearning) using a model with a high degree of freedom. This method may include, for example, creating a second regression model consisting of some of a first regression model consisting of a plurality of terms, and determining a plurality of sample shot areas using the second regression model.
[0008] However, in order to confirm the effect at present, it is necessary to actually measure using the parameters determined by the prediction for the created second regression model and calculate the overlay error. Therefore, it is desirable to be able to easily compare parameters before and after the prediction and predict the impact when adjusting the parameters without performing such actual measurements.
[0009] The present invention provides a technique that is advantageous for easily checking the effect of adjusting parameters related to the process of determining sample shot areas. [Means for solving the problem]
[0010] According to one aspect of the present invention, there is provided an information processing apparatus including: a processing unit that determines a plurality of sample shot areas from among a plurality of shot areas on a substrate using a first regression model constituted by a plurality of terms; and a display control unit that performs display control so that information of the plurality of sample shot areas determined by the processing unit is displayed on a user interface screen, wherein the processing unit re-determines the plurality of sample shot areas using a second regression model constituted by some of the plurality of terms, and the display control unit updates a display of the user interface screen so that information of the plurality of sample shot areas re-determined by the processing unit is displayed on the user interface screen. Effect of the Invention
[0011] According to the present invention, it is possible to provide a technique that is advantageous for easily checking the effect of adjusting parameters related to the process of determining sample shot areas. [Brief description of the drawings]
[0012] [Figure 1] FIG. 1 is a diagram showing the configuration of an exposure apparatus. [Diagram 2] FIG. 2 is a diagram showing the configuration of an alignment optical system. [Diagram 3] 4 is a flowchart of an exposure process. [Figure 4] FIG. 4 is a diagram showing an example of a sample shot area. [Diagram 5] 13 is a graph illustrating the relationship between the number of sample points and the correction residual. [Figure 6] FIG. 4 is a diagram showing an example of a user interface screen. [Figure 7] FIG. 4 is a diagram showing an example of a user interface screen. [Figure 8] FIG. 4 is a diagram showing an example of a user interface screen. [Figure 9] FIG. 4 is a diagram showing an example of a user interface screen. [Figure 10] FIG. 4 is a diagram showing an example of a user interface screen. [Figure 11] FIG. 4 is a diagram showing an example of a user interface screen. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0013] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.
[0014] First Embodiment 1 is a diagram showing the configuration of an exposure apparatus 1 according to an embodiment. The exposure apparatus 1 is a lithography apparatus used in the manufacturing process of devices such as semiconductor elements. In this embodiment, the exposure apparatus 1 projects a pattern of an original 2 (reticle or mask) onto a substrate 4 via a projection optical system 3 to expose the substrate 4.
[0015] 1, the exposure apparatus 1 has a projection optical system 3 that projects (reduced projection) a pattern formed on an original 2, and a chuck 5 that holds a substrate 4 on which a base pattern and alignment marks have been formed in a previous process. The exposure apparatus 1 also has a substrate stage 6 that holds the chuck 5 and positions the substrate 4 at a predetermined position, an alignment optical system 7 that measures the position of an alignment mark provided on the substrate 4, a control unit CN, a storage unit SU, and a display unit D.
[0016] The control unit CN is composed of, for example, a computer (information processing device) including a CPU, memory, etc., and performs overall control of each unit of the exposure apparatus 1 according to a program stored in the storage unit SU, etc. In this embodiment, the control unit CN can function as a processing unit that determines the arrangement (shot arrangement, area arrangement) of multiple shot areas (multiple areas on the substrate) on the substrate, in addition to controlling the exposure process that exposes the substrate 4 through the original 2. The display unit D displays a user interface screen (UI screen) that shows the settings, status, etc. of the exposure process. The control unit CN can also function as a display control unit that controls the display of the UI screen.
[0017] The storage unit SU stores a program and various information (data) required to control each part of the exposure apparatus 1 and perform an exposure process for exposing the substrate 4. The storage unit SU also stores a program and various information (data) required for the control unit CN to determine the arrangement of the sample shot area. The control unit CN, the storage unit SU, and the display unit D may be configured as an external device of the exposure apparatus 1. For example, an information processing device including the control unit CN, the storage unit SU, and the display unit D may be configured as a server device that manages the exposure apparatus 1. Alternatively, the information processing device including the control unit CN, the storage unit SU, and the display unit D may be configured as a simulation device that performs a simulation for determining the sample shot area. An input device (mouse, keyboard, etc.) (not shown) operated by a user is also connected to the control unit CN. The storage unit SU may be a semiconductor memory, a disk such as a hard disk, or another form of memory. The program for determining the arrangement of the sample shot area may be stored in a computer-readable memory medium, or may be provided to the information processing device via a communication facility such as an electric communication line.
[0018] 2 is a schematic diagram showing the configuration of the alignment optical system 7. The alignment optical system 7 has a function of optically detecting marks assigned to each shot area of the substrate 4 to obtain position measurement data, and in this embodiment, includes a light source 8, a beam splitter 9, lenses 10 and 13, and a sensor 14.
[0019] Light from the light source 8 is reflected by the beam splitter 9 and passes through a lens 10 to illuminate an alignment mark 11 or 12 provided on the substrate 4. The light diffracted by the alignment mark 11 or 12 passes through the lens 10, the beam splitter 9, and a lens 13 and is received by a sensor 14.
[0020] With reference to FIG. 3, the exposure process in the exposure apparatus 1 will be described. Here, an overview of the process from aligning the substrate 4 to exposing it will be described. In S101, the substrate 4 is loaded into the exposure apparatus 1. In S102, the control unit CN performs pre-alignment. Specifically, the control unit CN detects alignment marks 11 for pre-alignment provided on the substrate 4 using the alignment optical system 7, and roughly determines the position of the substrate 4. At this time, the detection of the alignment marks 11 is performed for multiple shot areas of the substrate 4, and the overall shift and first-order linear components (magnification and rotation) of the substrate 4 are determined.
[0021] In S103, the control unit CN performs fine alignment. Specifically, first, based on the result of the pre-alignment, the control unit CN drives the substrate stage 6 to a position where the alignment mark 12 for fine alignment provided on the substrate 4 can be detected by the alignment optical system 7. Then, the control unit CN detects the alignment mark 12 provided in each of the multiple shot areas of the substrate 4 using the alignment optical system 7, and precisely obtains the overall shift and first-order linear components (magnification and rotation) of the substrate 4. At this time, by obtaining the positions of many shot areas, it is also possible to precisely obtain high-order deformation components of the substrate 4. This makes it possible to obtain the precise position of each shot area of the substrate 4, i.e., the shot arrangement.
[0022] In S104, the control unit CN exposes the substrate 4. Specifically, after fine alignment is performed, the control unit CN transfers the pattern of the original 2 onto each shot area of the substrate 4 via the projection optical system 3. In S105, the substrate 4 is unloaded from the exposure apparatus 1.
[0023] In this embodiment, if distortion occurs in the substrate 4, high-order deformation components are corrected in the fine alignment of S103. Here, a fifth-order polynomial model is used as a regression model for estimating the shot arrangement. However, the regression model is not limited to this. Any order model may be used as the regression model. Models other than polynomials (trigonometric function model or logarithmic model) may also be used.
[0024] When the deformation of the substrate is expressed by a fifth-order polynomial model, the positional shift (ShiftX, ShiftY) of each shot area is expressed by the following formula (1). Note that the positional shift of each shot area may be understood as a correction value for correcting such positional shift.
number
[0025] In formula (1), x and y represent the position of the shot area of the substrate 4. Based on the actual position measurement data of each shot area of the substrate 4, k1 to k 42 Then, based on the equation (1) in which the coefficients have been determined, the positional deviation (correction value) of each shot area is calculated.
[0026] In the global alignment method, alignment measurement is performed in sample shot areas, which are some of the shot areas among a plurality of shots on a substrate. An example of a sample shot area is shown in FIG. 4. In FIG. 4, 14 sample shot areas are set on a substrate as an example. In the global alignment method, alignment marks 12 arranged for each of these sample shot areas are detected using an alignment optical system 7.
[0027] FIG. 5 is a graph showing an example of the relationship between the number of sample shot areas (number of sample points) in a certain device and a correction residual error, which is an index of correction accuracy. The correction residual error refers to an arrangement error that cannot be removed by correction when the arrangement of a plurality of shot areas on a substrate is corrected using a plurality of determined sample shot areas. From the viewpoint of correction accuracy (measurement accuracy), it is desirable to have a large number of sample shot areas that are the subject of actual measurement. However, the more the number of sample shot areas is increased, the more disadvantageous it may be in terms of measurement throughput. The number of sample shot areas is appropriately determined in such a trade-off relationship between correction accuracy and throughput.
[0028] 6 is a diagram showing an example of a user interface (UI) screen 60 displayed on the display unit D regarding the determination of the sample shot areas. The UI screen 60 can include a graph display screen 61 showing the relationship between the number of sample points and the correction residual and productivity, a wafer map display screen 62 showing the results of the arrangement of the sample shot areas on the substrate, and a coefficient display screen 63 showing the application status of the coefficients of each term constituting the regression model.
[0029] In the example of FIG. 6, the graph display screen 61 displays a graph showing the transition of the correction residual with respect to the number of sample points and a graph showing the transition of the productivity with respect to the number of sample points. Here, the productivity is expressed as the number of substrates processed per unit time (wph). The user can look at the graph displayed on the graph display screen 61 to find a sample point number that allows a compromise between the correction residual and the productivity. In one example, the control unit CN as a processing unit determines a recommended value of the sample points (initial sample point number) based on the relationship between the sample points, the correction residual, and the productivity. Thereafter, the control unit CN provisionally determines the arrangement of the sample shot areas according to the initial sample points according to a predetermined selection algorithm. As the selection algorithm, a publicly known one can be used. The selection algorithm is, for example, an algorithm that selects under a predetermined constraint condition such that a set number of sample shot areas are arranged as evenly (without bias) as possible symmetrically with respect to the center of the substrate, or that the sample shot areas are arranged as many as possible on the outer side of the substrate. There may be a case where a further constraint condition is imposed that excludes the shot areas on the outermost periphery of the substrate from the selection target.
[0030] Thereafter, the control unit CN determines the arrangement of the sample shot areas by a method using a regression model for the provisionally determined arrangement of the sample shot areas. The determination method can include, for example, a first step of creating a second regression model consisting of some of the multiple terms from a first regression model consisting of the multiple terms, and a second step of determining the arrangement of the sample shot areas using the second regression model. The control unit CN controls the UI screen 60 so that information on the determined arrangement of the sample shot areas is displayed on a wafer map display screen 62. The control unit CN also controls the UI screen 60 so that the application status of the coefficients of each term constituting the second regression model is displayed on a coefficient display screen 63. Here, since a quintic polynomial model is assumed as the first regression model, high-order correction coefficients k1 to k are displayed as candidates to be applied. 42These are displayed on the coefficient display screen 63. The coefficient display screen 63 also displays which of these coefficients were applied to the regression model that was ultimately used. For example, in the example of Fig. 6, whether or not each coefficient has been applied is displayed based on whether or not a check is placed in the checkbox for that coefficient. A checked coefficient is applied to the regression model, and an unchecked coefficient is not applied to the regression model.
[0031] The number of sample points can be changed by a user operation. For example, when the mouse pointer is placed over the graph on the graph display screen 61, a partial area 101 including the position of the mouse pointer is displayed in a specific color by a rollover effect. When the mouse is clicked in this state, the number of sample points corresponding to the partial area 101 is set. In this way, the number of sample shot areas can be specified by the user. That is, in this embodiment, the graph display screen 61 is a specification screen on which the user specifies the number of sample shot areas.
[0032] The wafer map display screen 62 is a display screen that displays information on the position of each of the multiple sample shot areas on the substrate. In response to the number of sample points being specified or changed, the control unit CN redetermines the arrangement of the shot areas. Thereafter, the control unit CN updates the display so that the redetermined arrangement of the sample shot areas is displayed on the wafer map display screen 62. In addition, the control unit CN updates the display so that the coefficients applied to the regression model when redetermining the arrangement of the sample shot areas are displayed on the coefficient display screen 63.
[0033] Fig. 6 shows the results when 16 sample points are set, and Fig. 7 shows the results when 32 sample points are set. In this way, for the number of sample points arbitrarily specified by the user, the expected correction accuracy and productivity, the optimum arrangement of sample shot areas, and whether or not each high-order correction coefficient is applied are displayed. This allows the user to easily check the effect of adjusting the parameters for determining the sample shot areas.
[0034] Also, the correction residual for each shot area may be displayed on the wafer map display screen 62. For example, as shown in FIG. 8, the correction residual for each shot area may be displayed on the wafer map display screen 62 by an arrow indicating the direction and size in the XY plane. This allows the user to easily check the correction effect for each shot area. Hereinafter, the display by the arrow indicating the direction and size in the XY plane is also referred to as a "vector display." Also, the display of the direction and size of the correction residual for each shot area is not limited to the display mode of FIG. 8. For example, the size of each of the correction residual for each shot area in the X direction and the Y direction may be displayed by an arrow or a numerical value.
[0035] In one example, the user can change the arrangement of the sample shot areas on the wafer map display screen 62 by operating the mouse and / or keyboard. For example, the user can move any sample shot area to another area by dragging it with the mouse. When the arrangement of the sample shot areas is changed, the control unit CN recalculates the correction residual and updates the vector display of the correction residual of each shot area. FIG. 9 shows an example in which the sample shot arrangement shown in FIG. 8 is changed by a user operation. Here, some sample shot areas are moved to the outer periphery side of the substrate in order to reduce the correction residual on the outer periphery side of the substrate. However, in this case, the sample shot areas arranged near the substrate center become sparse, so that the correction residual near the substrate center may be sacrificed. The user can compare the state of the correction residual before and after the movement of the sample shot areas as shown in FIG. 8 and FIG. 9. This makes it possible to easily confirm and compare the correction effect (between multiple conditions at the same productivity) resulting from changing the sample shot arrangement.
[0036] In one example, the user can change the check / uncheck status of each checkbox in the coefficient display screen 63 by operating the mouse and / or keyboard. That is, the coefficient display screen 63 is a selection screen for selecting some or all of the multiple terms constituting the regression model by user designation. This changes the application status of the coefficients of each term constituting the second regression model. When the check / uncheck status of any checkbox in the coefficient display screen 63 is changed, the control unit CN recalculates the correction residual and updates the vector display of the correction residual of each shot area. In FIG. 10, the combination of high-order correction coefficients is changed for the sample shot arrangement in FIG. 9. For example, if a specific high-order correction coefficient tends to overcorrect from the trend of the correction residual, the user can uncheck the coefficient. After that, when the correction residual is recalculated and the vector display of the correction residual of each shot area is updated, the user can visually check the change trend of the correction residual. In this way, the correction effect (between multiple conditions at the same productivity) by adjusting the application state of the high-order correction coefficient can be easily confirmed and compared.
[0037] 11 shows an example in which the UI screen 60 additionally has a regression model polynomial display screen 64. The polynomial display screen 64 displays terms used in the fifth-order polynomial in the application state of the high-order correction coefficient so that terms not used can be identified. This makes it easy to grasp the application state of the high-order correction coefficient and the correction accuracy and productivity expected for the corresponding calculation formula.
[0038] <Embodiment of the article manufacturing method> The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The article manufacturing method of the present embodiment includes a step of forming a latent image pattern on a photosensitive agent applied to a substrate using the above-mentioned exposure apparatus (a step of exposing the substrate), and a step of developing the substrate on which the latent image pattern has been formed in the step. Furthermore, the manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.
[0039] <Other embodiments> The present invention can also be realized by a process in which a program for implementing one or more of the functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read and execute the program. The present invention can also be realized by a circuit (e.g., ASIC) for implementing one or more of the functions.
[0040] The disclosure of this specification includes at least the following information processing device and program. (Item 1) a processing unit that determines a plurality of sample shot areas from among a plurality of shot areas on a substrate using a first regression model configured with a plurality of terms; a display control unit that performs display control so that information on the plurality of sample shot regions determined by the processing unit is displayed on a user interface screen, the processing unit redetermines a plurality of sample shot areas using a second regression model configured with some of the plurality of terms; the display control unit updates the display of the user interface screen so that information about the plurality of sample shot regions redetermined by the processing unit is displayed on the user interface screen. 23. An information processing apparatus comprising: (Item 2) the user interface screen includes a selection screen for selecting the part of the items from the plurality of items by user designation; The second regression model is configured with the part of terms selected via the selection screen. 2. The information processing device according to item 1, (Item 3) 3. The information processing device according to item 2, wherein the selection screen includes check boxes for specifying selection of each of the plurality of items. (Item 4) 4. The information processing device according to item 2 or 3, characterized in that, in response to the part of terms being changed via the selection screen, the processing unit redetermines a plurality of sample shot areas using the second regression model configured with the changed part of terms. (Item 5) 2. The information processing device according to item 1, wherein the processing unit re-determines a plurality of sample shot regions using the second regression model in response to a number of sample shot regions being designated by a user. (Item 6) 6. The information processing device according to item 5, wherein the user interface screen includes a designation screen for a user to designate the number of sample shot areas. (Item 7) the information on the plurality of sample shot areas includes information on positions of the respective sample shot areas on the substrate, the user interface screen includes a display screen that displays positions of each of the plurality of sample shot areas on the substrate. 7. The information processing device according to any one of items 1 to 6, (Item 8) the information on the plurality of sample shot areas further includes information on correction residuals for each of the plurality of shot areas when an arrangement of the plurality of shot areas is corrected using the plurality of sample shot areas, the display control unit displays the information on the correction residuals for each of the plurality of shot areas on the display screen. 8. The information processing device according to item 7, (Item 9) 9. The information processing device according to item 8, wherein the display control unit displays the information on the correction residuals of each of the plurality of shot regions in a vector display. (Item 10) 5. The information processing device according to any one of items 2 to 4, characterized in that the user interface screen further includes a display screen that displays a polynomial representing the second regression model composed of the part of terms selected via the selection screen. (Item 11) a processing unit that performs processing to determine a plurality of sample shot areas from a plurality of shot areas on a substrate; a display control unit that controls display of a user interface screen, The processing unit includes: Enter the number of sample shot areas specified by the user, determining the input number of sample shot regions using a second regression model that is configured from a portion of terms in a first regression model that is configured from a plurality of terms; the display control unit displays information on the determined sample shot area and information on the polynomial that constitutes the second regression model on the user interface screen. 23. An information processing apparatus comprising: (Item 12) 12. A program for causing a computer to function as a processing unit in the information processing device according to any one of items 1 to 11.
[0041] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]
[0042] 1: exposure device, 2: original, 3: projection optical system, 4: substrate, 5: substrate chuck, 6: substrate stage, 7: alignment optical system, CN: control unit, SU: storage unit, D: display unit
Claims
1. a processing unit that determines a plurality of sample shot areas from among a plurality of shot areas on a substrate using a first regression model configured with a plurality of terms; a display control unit that performs display control so that information about the plurality of sample shot areas determined by the processing unit is displayed on a user interface screen, the processing unit redetermines a plurality of sample shot areas using a second regression model configured with some of the plurality of terms; the display control unit updates the display of the user interface screen so that information about the plurality of sample shot areas redetermined by the processing unit is displayed on the user interface screen.
1. An information processing device comprising:
2. the user interface screen includes a selection screen for selecting the part of the items from the plurality of items by user designation; The second regression model is configured with the part of terms selected via the selection screen.
2. The information processing apparatus according to claim 1, wherein:
3. 3. The information processing apparatus according to claim 2, wherein the selection screen includes check boxes for specifying selection of each of the plurality of items.
4. 3. The information processing apparatus according to claim 2, wherein, in response to a change made to the part of the terms via the selection screen, the processing unit redetermines a plurality of sample shot areas using the second regression model configured with the changed part of the terms.
5. 2. The information processing apparatus according to claim 1, wherein the processing unit redetermines a plurality of sample shot areas using the second regression model in response to a user specifying the number of sample shot areas.
6. 6. The information processing apparatus according to claim 5, wherein the user interface screen includes a designation screen for a user to designate the number of sample shot areas.
7. the information on the plurality of sample shot areas includes information on positions of the plurality of sample shot areas on the substrate, the user interface screen includes a display screen that displays the positions of the plurality of sample shot areas on the substrate, 2. The information processing apparatus according to claim 1, wherein:
8. the information on the plurality of sample shot areas further includes information on correction residuals for each of the plurality of shot areas when the arrangement of the plurality of shot areas is corrected using the plurality of sample shot areas, the display control unit displays the information on the correction residuals for each of the plurality of shot areas on the display screen.
8. The information processing apparatus according to claim 7,
9. The information processing apparatus according to claim 8 , wherein the display control unit displays the information on the correction residuals for each of the plurality of shot regions in a vector display.
10. 3. The information processing apparatus according to claim 2, wherein the user interface screen further includes a display screen that displays a polynomial representing the second regression model configured with the part of terms selected via the selection screen.
11. a processing unit that performs processing to determine a plurality of sample shot areas from a plurality of shot areas on a substrate; a display control unit that controls the display of a user interface screen, The processing unit Obtain the number of sample shot areas specified by the user; determining the acquired number of sample shot areas using a second regression model that is configured from some of the terms in a first regression model that is configured from a plurality of terms; the display control unit displays information about the determined sample shot area and information about the polynomial that constitutes the second regression model on the user interface screen.
1. An information processing device comprising:
12. An information processing device that controls the display of a user interface screen, an acquisition unit that acquires first information on a second regression model configured with some terms out of a plurality of terms configuring a first regression model for correcting an arrangement of a plurality of shot areas on a substrate, second information on a correction residual when the arrangement of the plurality of shot areas is corrected using the second regression model, and third information on the sample shot areas determined based on a relationship between the number of sample shot areas out of the plurality of shot areas and the correction residual; a display control unit that performs display control so that the first information, the second information, and the third information acquired by the acquisition unit are displayed on a user interface screen; An information processing device comprising:
13. A program that causes a computer to function as each unit in the information processing device according to any one of claims 1 to 12.