Electronic device

Abstract

To provide an electronic device that can reduce the number of assembly steps while ensuring a sufficient heat dissipation path.SOLUTION: An electronic device includes a first board (40) on which an electronic component (41) is mounted, a case (20) provided with a board insertion opening (21) and having slide grooves (22) formed on both side walls through which the first board (40) is slid and inserted, the case in which the first board (40) is inserted from the board insertion opening (21) into the slide grooves (22) for storage, and a cover (30) connected to the case (20) and closing the board insertion opening (21) of the case (20). The case (20) is provided with a case side positioning portion (24) for positioning the first board (40), and the cover (30) is provided with a cover side positioning portion (32) for positioning the first board (40).SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] This application relates to electronic devices. [Background technology]

[0002] A typical configuration for conventional electronic devices is one in which an electronic board is built into a housing consisting of a case and a cover, and when the electronic board is placed inside the housing, it is often fixed between the electronic board and the housing with screws.

[0003] In addition, in order to dissipate heat generated by electronic components mounted on an electronic board to a surface exposed to the outside air, such as the electronic device's casing, a structure is often used in which the electronic components are in contact with the casing using a material with good thermal conductivity.

[0004] For example, in Patent Document 1, an electronic board is first fixed to a metal member with good thermal conductivity with screws, and then inserted into a housing. The electronic board and the housing are then further fixed with screws, and a metal member is placed in contact between the electronic board and the housing to ensure a heat dissipation path. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 4770933 Summary of the Invention [Problem to be solved by the invention]

[0006] The electronic device described in the above-mentioned conventional Patent Document 1 is configured to use screws to fasten the frame that secures the first and second substrates, between the frame and the case, and between the heat dissipation block and the case, which poses the problem of increased assembly man-hours.

[0007] Another problem is that the configuration does not allow for the use of a material such as a thermal interface material (TIM) between the electric circuit unit and the case that reduces the thermal resistance of the path that transfers heat generated by electronic components to the housing.

[0008] The present application discloses technology for solving the above-mentioned problems, and aims to provide an electronic device that can ensure a sufficient heat dissipation path while reducing the assembly man-hours. [Means for solving the problem]

[0009] The electronic device disclosed in the present application is an electronic device comprising a board on which electronic components are mounted, a case having a board insertion opening and slide grooves on both side walls for sliding the board to be inserted, in which the board is inserted from the board insertion opening into the slide groove for storage, and a cover connected to the case and closing the board insertion opening of the case, wherein the case is provided with a case side positioning portion having a portion for positioning the board in the thickness direction and a portion for positioning the board in a direction perpendicular to the thickness of the board, and the cover is provided with a cover side positioning portion having a portion for positioning the board in the thickness direction and a portion for positioning the board in the direction perpendicular to the thickness of the board.

[0010] The electronic device disclosed in the present application is an electronic device comprising: a first board on which electronic components are mounted; a second board on which electronic components are mounted; a case having a board insertion opening and an attachment opening, and having a first slide groove for slidingly inserting the first board and a second slide groove for slidingly inserting the second board on both side walls, the first board being inserted from the board insertion opening into the first slide groove and the second board being inserted from the board insertion opening into the second slide groove, and a cover connected to the case and closing the board insertion opening of the case, the case having a portion for positioning the first board in a thickness direction and The cover is provided with a first case side positioning portion having a portion for positioning the first substrate in a direction perpendicular to the thickness thereof and a second case side positioning portion having a portion for positioning the second substrate in a thickness direction and a portion for positioning the second substrate in a direction perpendicular to the thickness thereof, and the cover is provided with a first cover side positioning portion having a portion for positioning the first substrate in the thickness direction and a portion for positioning the first substrate in a direction perpendicular to the thickness thereof and a second cover side positioning portion having a portion for positioning the second substrate in the thickness direction and a portion for positioning the second substrate in a direction perpendicular to the thickness thereof, and a relay member is provided between the first substrate and the second substrate to connect the first substrate and the second substrate. Effect of the Invention

[0011] According to the electronic device disclosed in the present application, it is possible to obtain an electronic device that can ensure a sufficient heat dissipation path while reducing the number of assembly steps. [Brief description of the drawings]

[0012] [Figure 1] 1 is a perspective view showing an electronic device according to a first embodiment. [Diagram 2] 1 is a perspective view showing an exploded state of an electronic device according to a first embodiment. [Diagram 3] 1 is a perspective view showing an exploded state of an electronic device according to a first embodiment. [Figure 4]FIG. 1 is a plan view showing an electronic device according to a first embodiment. [Diagram 5] 5 is a cross-sectional view taken along line AA of FIG. 4, showing the electronic device according to the first embodiment. [Figure 6] 5 is an enlarged cross-sectional view taken along line BB in FIG. 4, showing the electronic device according to the first embodiment. [Figure 7] 5 is an enlarged cross-sectional view taken along line CC in FIG. 4, showing the electronic device according to the first embodiment. [Figure 8] 1 is a plan view showing an arrangement of electronic components in the electronic device according to embodiment 1. FIG. [Figure 9] FIG. 11 is a perspective view of an electronic device according to a second embodiment. [Figure 10] FIG. 11 is a perspective view showing an exploded state of the electronic device according to the second embodiment. [Figure 11] FIG. 11 is a perspective view showing an exploded state of the electronic device according to the second embodiment. [Figure 12] FIG. 11 is a plan view showing an electronic device according to a second embodiment. [Figure 13] 13 is a cross-sectional view taken along line A1-A1 of FIG. 12, showing the electronic device according to the second embodiment. [Figure 14] 13 is an enlarged cross-sectional view taken along line B1-B1 of FIG. 12, showing the electronic device according to the second embodiment. [Figure 15] 13 is an enlarged cross-sectional view taken along line A1-A1 of FIG. 12, showing the electronic device according to the second embodiment. [Figure 16] 11 is a plan view showing an arrangement of electronic components in an electronic device according to a second embodiment. FIG. [Figure 17] FIG. 11 is a perspective view showing an electronic device according to a third embodiment. [Figure 18] FIG. 11 is a perspective view showing an exploded state of the electronic device according to the third embodiment. [Figure 19] FIG. 11 is a perspective view showing an exploded state of the electronic device according to the third embodiment. [Figure 20] FIG. 11 is a plan view showing an electronic device according to a third embodiment. [Figure 21] 21 is a cross-sectional view taken along line A2-A2 of FIG. 20, showing the electronic device according to embodiment 3. FIG. [Figure 22] 21 is an enlarged cross-sectional view taken along line B2-B2 of FIG. 20, showing the electronic device according to embodiment 3. FIG. [Diagram 23] 21 is an enlarged cross-sectional view taken along line C2-C2 of FIG. 20, showing the electronic device according to embodiment 3. FIG. [Figure 24] FIG. 11 is a plan view showing an arrangement of electronic components in an electronic device according to a third embodiment. [Diagram 25] FIG. 11 is a plan view showing an arrangement of electronic components in an electronic device according to a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Embodiment 1 Hereinafter, the first embodiment of the present invention will be described with reference to Figs. 1 to 8, and the same or equivalent members and parts in each drawing will be described with the same reference numerals. Fig. 1 is a perspective view showing an electronic device according to the first embodiment. Fig. 2 is a perspective view showing an exploded state of the electronic device according to the first embodiment, seen from the positive direction of the x-axis. Fig. 3 is a perspective view showing an exploded state of the electronic device according to the first embodiment, seen from the negative direction of the x-axis. Fig. 4 is a plan view in the xy plane showing the electronic device according to the first embodiment. Fig. 5 is a cross-sectional view in the yz plane taken along the line AA in Fig. 4 showing the electronic device according to the first embodiment. Fig. 6 is an enlarged cross-sectional view in the xz plane taken along the line BB in Fig. 4 showing the electronic device according to the first embodiment. Fig. 7 is an enlarged cross-sectional view in the xz plane taken along the line CC in Fig. 4 showing the electronic device according to the first embodiment. Fig. 8 is a plan view showing the arrangement of electronic components in the electronic device according to the first embodiment, and is a schematic view of the xy plane.

[0014] 1 is a perspective view of an electronic device 1, showing a housing 10 that houses a board 40 extending on the xy plane. The housing 10 is mainly composed of a case 20 into which the board 40 is slid and inserted, and a cover 30 that is overlaid on the case 20 in the x-axis direction and closes a board insertion opening 21 of the case 20, which will be described later. An engagement protrusion 23 is provided on a side wall of the case 20, and a fitting piece 31 having an engagement recess 31a that engages with the engagement protrusion 23 of the case 20 is provided on the cover 30. In addition, fins 28 that enhance the heat dissipation effect are provided on the top surface of the case 20.

[0015] The electronic device 1 is connected to an external power supply device (not shown) and a communication device (not shown) via a connector (not shown). When the electronic device 1 is attached to a stay or the like with one surface of the case 20 as an installation surface, the case 20 may be provided with a fastening portion (not shown) for fastening to another portion.

[0016] 2 and 3 are exploded perspective views of electronic device 1, showing that case 20 and cover 30 have therebetween a board 40 housed in the internal space therebetween.

[0017] The case 20 has a generally rectangular parallelepiped shape and is hollow so that the board 40 on which electronic components 41 are mounted can be stored inside. As shown in Fig. 3, the case 20 has a board insertion opening 21 on one side in the yz plane, and a slide groove 22 is provided along the x-axis direction along which the board 40 fits when the board 40 is inserted by sliding it in the x-axis direction through the board insertion opening 21 of the case 20. The size of the slide groove 22 in the z direction is greater than the thickness of the board 40.

[0018] An engagement protrusion 23 is provided near the board insertion opening 21 on each of two side walls 20a, 20b in the xz plane of the case 20. The engagement protrusion 23 is fitted into an engagement recess 31a of a fitting piece 31 provided on the cover 30 to fasten the case 20 and the cover 30 together. Examples of the shape of the engagement protrusion 23 include a tapered or curved shape such as a wedge shape or a trapezoid.

[0019] The case 20 is made of a material with high thermal conductivity, such as a metal, a thermally conductive resin, a material in which a thermally conductive resin is metal-plated, etc. Furthermore, it is desirable to perform a surface treatment to increase the emissivity, such as anodizing or painting, on the outer surface of the case 20.

[0020] The cover 30 has a generally U-shape that closes the board insertion opening 21 of the case 20. Two faces of the cover 30 in the xz plane are provided with mating pieces 31 each having an engagement recess 31a. The engagement recess 31a of the mating piece 31 may have any shape as long as it can fit with the engagement protrusion 23 provided on the side walls 20a, 20b of the case 20. One cover-side positioning portion 32 is provided in the yz plane of the cover 30. The cover-side positioning portion 32 is provided at a position on the cover 30 diagonally opposite to a case-side positioning portion 24 described later.

[0021] An inner surface 30a and an outer surface 30b of the cover 30 in the yz plane are parallel to the yz plane or curve in the positive direction of the x-axis when the cover 30 is not attached to the case 20. The cover 30 is made of a metal plate, resin, rubber, or the like.

[0022] The substrate 40 has a plurality of electronic components mounted on a substantially rectangular base material. The size of the xy plane of the substrate 40 is substantially the same as the size of the xy plane of the housing 10, and an electronic component 41 is mounted on the upper surface of the substrate 40, and an electronic component 42 is mounted on the lower surface of the substrate 40. The substrate is made of a combination of glass epoxy material, thermosetting resin, fluororesin, metal material, etc.

[0023] The internal structure of the electronic device 1 will be described with reference to Fig. 4 to Fig. 7. The case 20 is provided with one case side positioning part 24 at a position furthest from the cover 30 of the slide groove 22 on the line BB in Fig. 4, and is provided at a position diagonally opposite to the cover side positioning part 32.

[0024] The shape of the case side positioning portion 24 will be described with reference to Fig. 6. The case side positioning portion 24 is composed of inclined portions 24a and 24b that are inclined so that the width of the slide groove 22 becomes narrower than the width of the other slide grooves 22 as the upper surface 22a and the lower surface 22b in the xy plane of the slide groove 22 move away from the cover 30, and a wall surface 24c in the yz plane that contacts the inclined portions 24a and 24b. The size of the gap in the z-axis direction formed by the inclined portions 24a and 24b is equal to or smaller than the thickness of the substrate 40.

[0025] The portion of the case side positioning portion 24 that positions the case side positioning portion 24 in the z direction, which is the thickness direction of the substrate 40, is the inclined portion 24a and the inclined portion 24b of the slide groove 22, and the portion of the case side positioning portion 24 that positions the case side positioning portion 24 in the x direction, which is perpendicular to the thickness of the substrate 40, is the wall surface 24c in the yz plane that contacts the inclined portion 24a and the inclined portion 24b of the case 20.

[0026] The substrate 40 is inserted into the slide groove 22, and the front end of the substrate 40 is inserted between the inclined portions 24a and 24b of the slide groove 22, thereby positioning the substrate 40 in the thickness direction, that is, the z direction. Then, the front end surface of the substrate 40 abuts against the wall surface 24c, thereby positioning the substrate 40 in the x axis direction, which is the direction perpendicular to the thickness of the substrate 40.

[0027] The cover 30 has one cover-side positioning portion 32 provided on line CC in Fig. 4. The shape of the cover-side positioning portion 32 will be described with reference to Fig. 7. The cover-side positioning portion 32 is composed of a first clamping piece 33 and a second clamping piece 34 that protrude in the x-axis direction on the case 20 side from an inner surface 30a of the cover 30 on the case 20 side in the yz plane.

[0028] The first clamping piece 33 and the second clamping piece 34 each have a flat surface 33a and a flat surface 34a sandwiched between them. The flat surface 33a of the first clamping piece 33 has an inclined portion 33b that inclines toward the substrate 40 as it approaches the inner surface 30a of the cover 30, and the flat surface 34a of the second clamping piece 34 has an inclined portion 34b that inclines toward the substrate 40 as it approaches the inner surface 30a of the cover 30.

[0029] The size of the gap in the z-axis direction formed by the inclined portion 33b of the first clamping piece 33 and the inclined portion 34b of the second clamping piece 34 is equal to or smaller than the thickness of the substrate 40. The gap formed by the inclined portions 33b and 34b becomes smaller toward the inner surface 30a of the cover 30.

[0030] The portion of the cover side positioning portion 32 that positions the cover side positioning portion 32 in the z direction, that is, the thickness direction of the substrate 40, is the inclined portion 33b of the first clamping piece 33 and the inclined portion 34b of the second clamping piece 34 that protrude from the inner surface 30a of the cover 30, and the portion of the cover side positioning portion 32 that positions the cover side positioning portion 32 in the x direction, that is, the direction perpendicular to the thickness of the substrate 40, is the wall surface 35 of the inner surface 30a of the cover 30 that contacts the inclined portion 33b of the first clamping piece 33 and the inclined portion 34b of the second clamping piece 34.

[0031] After the board 40 is inserted into the case 20, the engaging recess 31a of the fitting piece 31 provided on the cover 30 engages with the engaging protrusion 23 of the case 20 to close the board insertion opening 21 of the case 20, thereby attaching the cover 30 to the case 20. As a result, the inclined portion 33b of the first clamping piece 33 and the inclined portion 34b of the second clamping piece 34 of the cover side positioning portion 32 protruding from the inner surface 30a of the cover 30 are inserted into the rear end of the board 40, so that the board 40 is positioned in the z direction, which is the thickness direction. Then, the wall surface 35 of the inner surface 30a of the cover 30 abuts against the rear end surface of the board 40, so that the board 40 is positioned in the x axis direction, which is the direction perpendicular to the thickness of the board 40.

[0032] Among the electronic components mounted on the substrate 40, the electronic component 41 that generates the most heat is positioned approximately on a diagonal straight line 50 connecting the case side positioning portion 24 provided on the case 20 and the cover side positioning portion 32 provided on the cover 30, as shown in FIG. 8.

[0033] The configuration around the board 40 on which electronic component 41 that generates a large amount of heat is mounted will be described with reference to Fig. 5. Case 20 is provided with protruding portion 25a that protrudes from the position of electronic component 41 that generates a large amount of heat so as to be close to electronic component 41. In addition, protruding portion 25b that protrudes from the position of electronic component 41 on the back surface of board 40 on which electronic component 41 is mounted so as to be close to board 40 is provided.

[0034] The shapes of the protrusions 25a and 25b provided on the case 20 are similar to those of the electronic component 41 in the xy plane, and are larger than the electronic component 41 so as to be able to cover the entire electronic component 41. The protrusion 25a has a through hole 26a that penetrates the inside and outside of the case 20 approximately at the center of the protrusion. The protrusion 25b also has a through hole 26b that penetrates the inside and outside of the case 20.

[0035] Gaps are provided between protrusion 25a of case 20 and electronic component 41, and between protrusion 25b of case 20 and substrate 40. Through hole 26a and the gaps between protrusion 25a and electronic component 41 are filled with heat dissipation material 27. Through hole 26b and the gaps between protrusion 25b and substrate 40 do not necessarily need to be filled with heat dissipation material.

[0036] Fins 28 are provided on the outside of case 20 in an area where protrusion 25a of case 20 is provided. Heat generated by electronic component 41 that generates a large amount of heat is transferred to case 20 via filled heat dissipation material 27, protrusion 25a, and protrusion 25b, and is dissipated from the surface of case 20 and fins 28 to the outside air.

[0037] Furthermore, electronic component 42 is mounted on the back surface of substrate 40, and case 20 is provided with protrusion 43 that protrudes from the position of electronic component 42 so as to be close to electronic component 42. Heat generated by electronic component 42 is transferred to case 20 via protrusion 43, and is dissipated from the surface of case 20 and fins 28 to the outside air.

[0038] A method of assembling electronic device 1 will be described. The thickness direction of substrate 40 is aligned with slide groove 22 provided in case 20, and substrate 40 is slid in the x-axis direction along slide groove 22 and inserted into the inside of the case. After substrate 40 is stored in case 20, cover 30 is attached so that recess 31 of cover 30 mates with protrusion 23 of case 20.

[0039] When the cover 30 is attached to the case 20, the substrate 40 is pressed in the x-axis direction by the cover 30 until the tip surface of the substrate 40 comes into contact with the wall surface 24c of the case-side positioning portion 24 of the case 20, and the planes 30a and 30b of the cover bulge in a bow shape in the negative direction of the x-axis or are parallel to the yz plane. This determines the position of the substrate 40 in the x-axis direction.

[0040] The substrate 40 is sandwiched between a gap surrounded by the inclined portions 24a and 24b of the case-side positioning portion 24 of the case 20 and a gap between the first clamping piece 33 and the second clamping piece 34 of the cover-side positioning portion 32 of the cover 30, and the position in the z-axis direction, which is the thickness direction of the substrate 40, is determined. After the substrate 40 is stored in the case 20 and the case 20 and the cover 30 are fixed, the heat dissipation material 27 is injected from the through-hole 26a provided in the case 20. The heat dissipation material 27 passes through the through-hole 26a from the outside of the case 20 and fills the gap between the protrusion 25a and the electronic component 41. The heat dissipation material 27 may be an adhesive, and it is preferable that the adhesive is of a type that hardens into a semi-solid state after filling.

[0041] In this way, in the first embodiment, it is possible to dispose the substrate 40 in the case 20 inside the housing 10 without using other fixing members such as screws, making it possible to reduce the number of assembly steps.

[0042] In addition, by arranging electronic component 41 that generates a large amount of heat on approximately the diagonal straight line 50 connecting case side positioning portion 24 of case 20 and cover side positioning portion 32 of cover 30, electronic component 41 that generates a large amount of heat can be arranged in a position with good positional accuracy within substrate 40.

[0043] By increasing the positional accuracy of electronic component 41 that generates a large amount of heat, it becomes possible to reduce the variation in the gap between electronic component 41 that generates a large amount of heat and case 20, and between substrate 40 on which electronic component 41 that generates a large amount of heat is mounted and case 20, making it possible to bring them closer together.

[0044] This makes it possible to reduce the gap between the protrusion 25a on the case 20 and the electronic component 41, and the gap between the protrusion 25b on the case 20 and the substrate 40, making it possible to ensure a sufficient heat dissipation path with a small amount of heat dissipation material 27.

[0045] Embodiment 2 A second embodiment of the present invention will be described with reference to Figs. 9 to 16, and in each drawing, the same or corresponding members and parts are denoted by the same reference numerals. Fig. 9 is a perspective view of an electronic device according to a second embodiment. Fig. 10 is a perspective view showing an exploded state of the electronic device according to the second embodiment, as seen from the positive direction of the x-axis. Fig. 11 is a perspective view showing an exploded state of the electronic device according to the second embodiment, as seen from the negative direction of the x-axis. Fig. 12 is a plan view in the xy plane showing the electronic device according to the second embodiment. Fig. 13 is a cross-sectional view in the xz plane taken along the line A1-A1 in Fig. 12 showing the electronic device according to the second embodiment. Fig. 14 is an enlarged cross-sectional view in the xz plane taken along the line B1-B1 in Fig. 12 showing the electronic device according to the second embodiment. Fig. 15 is an enlarged cross-sectional view in the xz plane taken along the line A1-A1 in Fig. 12 showing the electronic device according to the second embodiment. Fig. 16 is a plan view showing the arrangement of electronic components in the electronic device according to the second embodiment, and is a schematic diagram in the xy plane showing the arrangement of heat-generating components. The line A1-A1 is a position that passes through approximately the center of the housing 101 in the xy plane.

[0046] The second embodiment of the present invention differs from the first embodiment described above in terms of the positioning shapes of the case 20 and the cover 30, and the heat-dissipating protrusions of the case 20. In the second embodiment, the same parts as those in the first embodiment are given the same reference numerals and their explanations are omitted, and the following explanation focuses on the differences from the first embodiment.

[0047] 9 is a perspective view of electronic device 100 according to embodiment 2, showing housing 101 that houses substrate 401 extending on the xy plane. Housing 101 is mainly composed of case 201 into which substrate 401 is slidably inserted, and cover 301 that is placed on case 201 in the x-axis direction and closes substrate insertion opening 21 of case 201. Engagement protrusion 23 is provided on a side wall of case 201, and fitting piece 31 having engagement recess 31a that engages with engagement protrusion 23 of case 201 is provided on cover 301.

[0048] 10 and 11 are exploded perspective views of electronic device 100, showing that substrate 401 is disposed between case 201 and cover 301 to be housed in the internal space between them. In the yz plane of cover 301, cover side positioning portion 302 is provided at one location in the center of inner surface 30a of cover 301.

[0049] Case 201 has a substantially rectangular parallelepiped shape and is hollow so that board 401 on which electronic components 402a, 402b, and 402c are mounted can be stored inside. As shown in Fig. 11, case 201 has board insertion opening 21 on one surface in the yz plane, and slide groove 22 is provided along the x-axis direction along which board 401 fits when board 401 is inserted by sliding it in the x-axis direction through board insertion opening 21 of case 201. The size of slide groove 22 in the z direction is greater than the thickness of board 401.

[0050] An engagement protrusion 23 is provided near the board insertion opening 21 on each of two side walls 201a and 201b in the xz plane of the case 201. The engagement protrusion 23 fastens the case 201 and the cover 301 by fitting into an engagement recess 31a of a fitting piece 31 provided on the cover 301. Examples of the shape of the engagement protrusion 23 include a tapered or curved shape such as a wedge shape or a trapezoid.

[0051] Case 201 is made of a material with high thermal conductivity, such as metal, thermally conductive resin, a material in which thermally conductive resin is metal-plated, etc. Furthermore, it is desirable to perform a surface treatment to increase the emissivity, such as anodizing or painting, on the outer surface of case 201.

[0052] The cover 301 has a generally U-shape that closes the board insertion opening 21 of the case 201. Two faces of the cover 301 in the xz plane are provided with mating pieces 31 each having an engaging recess 31a. The engaging recess 31a of the mating piece 31 may have any shape as long as it can fit into the engaging protrusions 23 provided on the side walls 201a, 201b of the case 201. A cover side positioning portion 302 is provided in one location in the center of the inner surface 30a of the cover 301 in the yz plane.

[0053] An inner surface 301a and an outer surface 301b of cover 301 in the yz plane are parallel to the yz plane or have a bow-like shape bulging in the positive direction of the x-axis when cover 301 is not attached to case 201. Cover 301 is made of a metal plate, resin, rubber, or the like.

[0054] Substrate 401 is a substantially rectangular base material on which multiple electronic components are mounted. The size of the xy plane of substrate 401 is substantially the same as the size of the xy plane of housing 101, and electronic components 402a, 402b, and 402c are mounted on the upper surface of substrate 401, and electronic component 402d is mounted on the lower surface of substrate 401. The substrate is made of a combination of glass epoxy material, thermosetting resin, fluororesin, metal material, and the like.

[0055] The internal structure of electronic device 100 will be described with reference to Fig. 12 to Fig. 15. At both ends of the innermost part of case 201, case side positioning portion 204a is provided in one place on inner surface 201a which is furthest from cover 301 on line BB. Another case side positioning portion 204b is provided at a position on inner surface 201c of case 201, symmetrically with respect to line A1-A1. Since the shape of the case side positioning portion is the same for case side positioning portion 204a and case side positioning portion 204b, the description will be given using case side positioning portion 204a.

[0056] Case side positioning portion 204a is composed of upper clamping body 205 and lower clamping body 206 which protrude in the positive direction of the x-axis from rear surface 201a of case 201. Case side positioning portion 204a is spring-shaped to clamp and fix substrate 401, and an example will be described in embodiment 2 with reference to FIG.

[0057] The cross section of the upper clamping body 205 in the xz plane is inclined in the negative direction of the z axis as it moves away from the rear surface 201a of the case 201 along the x axis, and then inclined in the positive direction of the z axis. The cross section of the lower clamping body 206 in the xz plane protrudes in a substantially linear manner along the x axis from the rear surface 201a of the case 201, and is in a shape substantially parallel to the xy plane of the substrate 401. The tip of the substrate 401 is located in the space formed by the upper clamping body 205 and the lower clamping body 206, and the lower clamping body 206 may be inclined so that the entrance side during insertion is wider to make it easier to insert the substrate 401. The upper clamping body 205 and the lower clamping body 206 are shaped to have a width in the y axis direction.

[0058] Cover 301 is provided with one cover side positioning portion 302 in the center on line A1-A1. Cover side positioning portion 302 is composed of upper clamping body 303 and lower clamping body 304 which protrude in the x-axis direction from inner surface 301a of cover 301 on the case 201 side in the yz plane. The rear end of substrate 401 is positioned in the space formed by upper clamping body 303 and lower clamping body 304, and cover side positioning portion 302 has a spring shape which clamps and fixes substrate 401, and an example will be described in embodiment 2 with reference to FIG.

[0059] The cross section of the upper clamping body 303 in the xz plane is shaped to be inclined in the negative direction of the z axis and then inclined in the positive direction of the z axis as it moves away from the inner surface 301a of the cover 301 along the x axis. The cross section of the lower clamping body 304 in the xz plane protrudes in a substantially linear manner along the x axis from the inner surface 301a of the cover 301 and is shaped to be substantially parallel to the xy plane of the substrate 401. The lower clamping body 304 may be inclined so that the entrance side during insertion is wider, so that the substrate 401 can be easily inserted. The upper clamping body 303 and the lower clamping body 304 are shaped to have a width in the y axis direction.

[0060] The parts of case side positioning portion 204a that position the z direction, which is the thickness direction of substrate 401, are upper clamp 205 and lower clamp 206, and the parts of case side positioning portion 204a that position the x direction, which is the direction perpendicular to the thickness of substrate 401, are wall surface 203 in the yz plane that contacts the base of upper clamp 205 and the base of lower clamp 206.

[0061] Substrate 401 is inserted into slide groove 22, and the front end of substrate 401 is inserted between upper clamp 205 and lower clamp 206, thereby positioning substrate 401 in the thickness direction, that is, the z direction. Then, the front end surface of substrate 401 abuts against wall surface 203, thereby positioning substrate 401 in the x axis direction, which is the direction perpendicular to the thickness of substrate 401.

[0062] The parts that position cover side positioning portion 302 of cover 301 in the z direction, which is the thickness direction of substrate 401, are upper clamping body 303 and lower clamping body 304 protruding from inner surface 301a of cover 301, and the parts that position cover side positioning portion 302 in the x direction, which is the direction perpendicular to the thickness of substrate 401, are wall surface 305 of inner surface 30a of cover 30 that contacts the base portion of upper clamping body 303 and the base portion of lower clamping body 304.

[0063] After the board 401 is inserted into the case 201, the engaging recess 31a of the fitting piece 31 provided on the cover 301 engages with the engaging protrusion 23 of the case 201 to close the board insertion opening 21 of the case 201, thereby attaching the cover 301 to the case 201. As a result, the upper clamp 303 and the lower clamp 304 of the cover side positioning part 302 protruding from the inner surface 301a of the cover 301 are inserted into the rear end of the board 401, so that the board 401 is positioned in the z direction, which is the thickness direction. Then, the wall surface 305 of the inner surface 301a of the cover 301 abuts against the rear end surface of the board 401, so that the board 401 is positioned in the x direction, which is the direction perpendicular to the thickness of the board 401.

[0064] Among the electronic components mounted on the substrate 401, those that generate a large amount of heat are located within the range surrounded by a straight line 501a connecting the case side positioning portion 204a and the case side positioning portion 204b provided on the case 201, a straight line 501b connecting the case side positioning portion 204a and the cover side positioning portion 302 provided on the cover 301, and a straight line 501c connecting the case side positioning portion 204b and the cover side positioning portion 302, as shown in FIG. 16.

[0065] In the second embodiment, four electronic components 402a, 402b, 402c, and 402d that generate a large amount of heat are arranged within an area surrounded by straight lines 501a, 501b, and 501c, with three components 402a, 402b, and 402c mounted on one side of a substrate 401 and 402d mounted on the opposite side. The configuration around electronic components 402a, 402b, and 402c will be described with reference to Fig. 13.

[0066] The electronic components are arranged as electronic components 402a, 402b, and 402c in the order of proximity to cover 301, i.e., in the negative direction of the x-axis. Protrusions 207a, 207b, and 207c are provided in the vicinity of electronic components 402a, 402b, and 402c so as to be close to electronic components 402a, 402b, and 402c.

[0067] The shapes of convex portions 207a, 207b, and 207c are similar to those of electronic components 402a, 402b, and 402c in the xy plane, and are larger than electronic components 402a, 402b, and 402c so as to be able to cover all of the electronic components. The height of convex portions 207a, 207b, and 207c in the z-axis direction is the highest, followed by convex portions 207b and 207c in that order.

[0068] In this way, in the second embodiment, the heights of convex parts 207a, 207b, and 207c provided on case 201 for heat dissipation increase in the direction in which board 401 is inserted, i.e., in the positive direction of the x-axis, so that when board 401 is inserted, board 401 can be assembled without interfering with convex parts 207a, 207b, and 207c. At the same time, a sufficient heat dissipation path can be secured by adopting a structure in which heat-generating components and heat dissipation parts are as close as possible to each other.

[0069] 13, electronic component 402d is provided on the back surface of substrate 401, and protrusion 403 arranged adjacent to electronic component 402d is provided on case 201. Furthermore, protrusion 404 is provided adjacent to the back surface of substrate 401 directly below electronic component 402a, which generates a large amount of heat.

[0070] Embodiment 3 A third embodiment of the present invention will be described with reference to Figs. 17 to 25, and in each drawing, the same or corresponding members and parts are denoted by the same reference numerals. Fig. 17 is a perspective view showing an electronic device according to a third embodiment. Fig. 18 is a perspective view showing an exploded state of the electronic device according to the third embodiment, as seen from the positive direction of the x-axis. Fig. 19 is a perspective view showing an exploded state of the electronic device according to the third embodiment, as seen from the negative direction of the x-axis. Fig. 20 is a plan view in the xy plane showing the electronic device according to the third embodiment. Fig. 21 is a cross-sectional view in the xz plane taken along the line A2-A2 in Fig. 20 showing the electronic device according to the third embodiment. Fig. 22 is an enlarged cross-sectional view in the xz plane taken along the line B2-B2 in Fig. 20 showing the electronic device according to the third embodiment. Fig. 23 is an enlarged cross-sectional view in the xz plane taken along the line C2-C2 in Fig. 20 showing the electronic device according to the third embodiment. Fig. 24 is a plan view showing the arrangement of electronic components in the electronic device according to the third embodiment, and is a schematic diagram in the xy plane showing the arrangement of heat-generating components. FIG. 25 is a plan view showing the arrangement of electronic components in the electronic device according to embodiment 3, and is a schematic diagram of the xy plane showing the arrangement of heat-generating components.

[0071] In the third embodiment of the present invention, the parts common to the first and second embodiments are given the same reference numerals and the description thereof is omitted, and the description will focus on the differences from the first and second embodiments.

[0072] 17 is a perspective view of electronic device 110 according to embodiment 3, showing housing 111 that houses first board 411 and second board 412 extending on the xy plane. Housing 111 is mainly composed of case 211 into which first board 411 and second board 412 are slidably inserted, and cover 311 that is superimposed on case 211 in the x-axis direction and closes board insertion opening 21 in the yz plane of case 211 for first board 411 and second board 412 mounted inside the housing. Engagement protrusion 23 is provided on a side wall of case 211, and fitting piece 31 having engagement recess 31a that engages with engagement protrusion 23 of case 211 is provided on cover 311.

[0073] A partially opened opening 218 is provided on the upper surface of one side of the xy plane of the case 211. One surface of a first substrate 411 is exposed from the opening 218, and a transmitting / receiving antenna module 413 is mounted on the first substrate 411 as an electronic component and is exposed on the outer surface of the case 211. A transmitting / receiving IC 414 is mounted on the rear surface of the first substrate 411 as an electronic component.

[0074] Figures 18 and 19 are exploded oblique views of electronic device 110, showing that first board 411 and second board 412 are arranged between case 211 and cover 311 and are stored in the internal space between them, and that relay member 611 is arranged between first board 411 and second board 412.

[0075] The case 211 is hollow so that it can accommodate the first board 411 on which the transmitting / receiving antenna module 413 and the transmitting / receiving IC 414 are mounted, and the second board 412 on which the electronic component 415 is mounted on the back side. As shown in FIG. 19, the case 211 has a board insertion opening 21 on one surface of the yz plane, and first slide grooves 212a and 212b are provided along the x-axis direction to which the first board 411 is fitted when the first board 411 is slid and inserted from the board insertion opening 21 of the case 211 in the x-axis direction. The size of the first slide grooves 212a and 212b in the z direction is greater than the thickness of the first board 411. In addition, second slide grooves 212c and 212d are provided along the x-axis direction to which the second board 412 is fitted when the second board 412 is slid and inserted from the board insertion opening 21 of the case 211 in the x-axis direction. The size of the second slide grooves 212c and 212d in the z direction is greater than the thickness of the second substrate 412.

[0076] An engagement protrusion 23 is provided near the board insertion opening 21 on each of two side walls 211a and 211b in the xz plane of the case 211. The engagement protrusion 23 fastens the case 211 and the cover 311 by fitting into an engagement recess 31a of a fitting piece 31 provided on the cover 311. Examples of the shape of the engagement protrusion 23 include a tapered or curved shape such as a wedge shape or a trapezoid.

[0077] Case 211 is made of a material with high thermal conductivity, such as metal, thermally conductive resin, a material in which thermally conductive resin is metal-plated, etc. Furthermore, it is desirable to perform a surface treatment to increase the emissivity, such as anodizing or painting, on the outer surface of case 211.

[0078] Case 211 has first case side positioning portions 214a and 214b provided at positions of first slide grooves 212a and 212b farthest from cover 311 in order to position first substrate 411. Case 211 also has second case side positioning portions 214c and 214d provided at positions of second slide grooves 212c and 212d farthest from cover 311 in order to position second substrate 412. A total of four case side positioning portions are provided.

[0079] Since the shape of the case side positioning portions is common to the first case side positioning portions 214a, 214b and the second case side positioning portions 214c, 214d, the first case side positioning portion 214a and the second case side positioning portion 214c will be described with reference to FIG. The case side first positioning portion 214a has inclined portions 222a and 222b that incline so that the width of the first slide groove 212a narrows as the upper surface 221a and lower surface 221b in the xy plane of the first slide groove 212a move away from the cover 311, and has case side first planar portion 223a and case side second planar portion 223b that are connected to inclined portions 222a and 222b and extend parallel to the xy plane in the direction away from the cover 311, and is composed of a wall surface 224 in the yz plane that contacts the case side first planar portion 223a and the case side second planar portion 223b, and a case side first protrusion 225a and a case side second protrusion 225b that are provided to partially narrow the gap formed by the case side first planar portion 223a and the case side second planar portion 223b. The size of the gap in the z-axis direction formed by first case side protrusion 225a and second case side protrusion 225b is equal to or smaller than the thickness of first substrate 411.

[0080] The case side second positioning portion 214c has inclined portions 232a and 232b that incline so that the width of the second slide groove 212c narrows as the upper surface 231a and lower surface 231b in the xy plane of the second slide groove 212c move away from the cover 311, and has case side third planar portion 233a and case side fourth planar portion 233b that are connected to inclined portions 232a and 232b and extend parallel to the xy plane in the direction away from the cover 311, and is composed of a wall surface 234 in the yz plane that contacts the case side third planar portion 233a and the case side fourth planar portion 233b, and a case side third protrusion 235a and a case side fourth protrusion 235b that are provided to partially narrow the gap formed by the case side third planar portion 233a and the case side fourth planar portion 233b. The size of the gap in the z-axis direction formed by the third case side protrusion 235a and the fourth case side protrusion 235b is equal to or smaller than the thickness of the second substrate 412.

[0081] The parts of the case side first positioning portion 214a that position the first substrate 411 in the z direction, that is, the thickness direction, are the case side first flat portion 223a, the case side second flat portion 223b, the case side first protrusion 225a, and the case side second protrusion 225b, and the part of the case side first positioning portion 214a that positions the first substrate 411 in the x direction, that is, the direction perpendicular to the thickness of the first substrate 411, is the yz plane wall surface 224 that contacts the case side first flat portion 223a and the case side second flat portion 223b.

[0082] First substrate 411 is inserted into first slide groove 212a and first slide groove 212b, and the tip of first substrate 411 passes through inclined portion 222a and inclined portion 222b, and is inserted between first case side protrusion 225a and second case side protrusion 225b, whereby first substrate 411 is positioned in the thickness direction z direction. Then, the tip surface of first substrate 411 abuts against wall surface 224, whereby first substrate 411 is positioned in the x axis direction perpendicular to the thickness.

[0083] The parts that position the case side second positioning portion 214c in the z direction, that is, the thickness direction of the second substrate 412, are the case side third flat portion 233a, the case side fourth flat portion 233b, the case side third protrusion 235a, and the case side fourth protrusion 235b, and the part that positions the case side second positioning portion 214c in the x direction, that is, the direction perpendicular to the thickness of the second substrate 412, is the yz plane wall surface 234 that contacts the case side third flat portion 233a and the case side fourth flat portion 233b.

[0084] The second substrate 412 is inserted into the second slide grooves 212c and 212d, and the tip of the second substrate 412 passes through the inclined portions 232a and 232b, and is inserted between the case side third protrusion 235a and the case side fourth protrusion 235b, whereby the second substrate 412 is positioned in the thickness direction z direction. Then, the tip surface of the second substrate 412 abuts against the wall surface 234, whereby the second substrate 412 is positioned in the x axis direction, which is a direction perpendicular to the thickness.

[0085] As described above, the case side first positioning portion 214a and the case side second positioning portion 214c have been explained, but although not shown, the case side first positioning portion 214b and the case side second positioning portion 214d have the same configuration.

[0086] The cover-side first positioning portion 312a of the cover 311 is provided at one position shifted in the y-axis positive direction from approximately the center line of the cover 311 in the yz plane, and the cover-side second positioning portion 312b is provided at one position shifted in the y-axis negative direction from approximately the center line of the cover 311 in the yz plane. That is, two positions, one above and one below the y axis, are provided corresponding to the first substrate 411 and the second substrate 412. The cover-side positioning portion has a common shape to the cover-side first positioning portion 312a and the cover-side second positioning portion 312b, and the configuration thereof will be described with reference to FIG. 23.

[0087] In the central portion of the inner surface 311a of the cover 311 in the yz plane, a cover side first positioning portion 312a corresponding to the first substrate 411 and a cover side second positioning portion 312b corresponding to the second substrate 412 are provided at two positions at different heights in the z-axis direction.

[0088] The cover side first positioning portion 312a is composed of a first clamping piece 320a and a second clamping piece 320b that protrude in the positive direction of the x-axis from an inner surface 311a of the cover 311 on the case 211 side in the yz plane of the cover 311. The surface sandwiched by the first clamping piece 320a and the second clamping piece 320b has a lower surface side flat portion 321a and an upper surface side flat portion 321b that extend parallel to the xy plane toward the inner surface 311a of the cover 311, has an inclined portion 322a and an inclined portion 322b that incline toward the first board 411 side as they approach the inner surface 311a of the cover 311, and is connected to the inclined portion 322a and the inclined portion 322b, and extends in the direction of the inner surface 311a of the cover 311. The cover has a first cover-side flat portion 323a and a second cover-side flat portion 323b extending parallel to the xy plane, and is composed of a wall surface 324 in the yz plane in contact with the first cover-side flat portion 323a and the second cover-side flat portion 323b, and a first cover-side protrusion 325a and a second cover-side protrusion 325b provided to partially narrow the gap formed by the first cover-side flat portion 323a and the second cover-side flat portion 323b. The size of the gap in the z-axis direction formed by the first cover-side protrusion 325a and the second cover-side protrusion 325b is equal to or smaller than the thickness of the first substrate 411.

[0089] The cover side second positioning portion 312b is composed of a third clamping piece 330a and a fourth clamping piece 330b that protrude in the positive direction of the x-axis from an inner surface 311a of the cover 311 on the case 211 side in the yz plane of the cover 311. The surface sandwiched by the third clamping piece 330a and the fourth clamping piece 330b has a lower surface side flat portion 331a and an upper surface side flat portion 331b that extend parallel to the xy plane toward the inner surface 311a of the cover 311, and has inclined portions 332a and 332b that incline toward the second board 412 side as they approach the inner surface 311a of the cover 311, and are connected to the inclined portions 332a and 332b, and extend in the direction of the inner surface 311a of the cover 311. The cover-side third flat portion 333a and the cover-side fourth flat portion 333b extend parallel to the xy plane, and the cover-side third protrusion 335a and the cover-side fourth protrusion 335b are provided to partially narrow the gap formed by the cover-side third flat portion 333a and the cover-side fourth flat portion 333b, and the cover-side third flat portion 333a and the cover-side fourth flat portion 333b. The size of the gap in the z-axis direction formed by the cover-side third protrusion 335a and the cover-side fourth protrusion 335b is equal to or smaller than the thickness of the second substrate 412.

[0090] The part of cover side first positioning portion 312a that positions the z direction, that is the thickness direction of first substrate 411, is inclined portion 322a of first clamping piece 320a and inclined portion 322b of second clamping piece 320b, which are protruding from inner surface 311a of cover 311, and cover side first protrusion 325a and cover side second protrusion 325b, and the part of cover side first positioning portion 312a that positions the x direction, that is the direction perpendicular to the thickness of first substrate 411, is wall surface 324 of inner surface 311a of cover 311, which contacts cover side first flat portion 323a of first clamping piece 320a and cover side second flat portion 323b of second clamping piece 320b.

[0091] After the first substrate 411 is inserted into the case 211, the engaging recess 31a of the fitting piece 31 provided on the cover 311 engages with the engaging protrusion 23 of the case 211 to close the substrate insertion opening 21 of the case 211, and the cover 311 is attached to the case 211. As a result, the rear end of the first substrate 411 passes through the inclined portion 322a of the first clamping piece 320a and the inclined portion 322b of the second clamping piece 320b of the cover side first positioning portion 312a protruding from the inner surface 311a of the cover 311, and is inserted between the cover side first protrusion 325a and the cover side second protrusion 325b, so that the z direction of the thickness direction of the first substrate 411 is positioned. Then, the wall surface 324 of the inner surface 311a of the cover 311 abuts against the rear end surface of the first substrate 411, so that the x axis direction perpendicular to the thickness of the first substrate 411 is positioned.

[0092] The portion of the cover side second positioning portion 312b that positions the second substrate 412 in the thickness direction z is the inclined portion 332a of the third clamping piece 330a and the inclined portion 332b of the fourth clamping piece 330b that protrude from the inner surface 311a of the cover 311, and the cover side third protrusion 335a and the cover side fourth protrusion 335b. The portion of the cover side second positioning portion 312b that positions the second substrate 412 in the x direction perpendicular to the thickness of the second substrate 412 is the wall surface 334 of the inner surface 311a of the cover 311 that contacts the cover side third flat portion 333b of the third clamping piece 330a and the cover side fourth flat portion 333b of the fourth clamping piece 330b.

[0093] After the second board 412 is inserted into the case 211, the engaging recess 31a of the fitting piece 31 provided on the cover 311 engages with the engaging protrusion 23 of the case 211 to close the board insertion opening 21 of the case 211, and the cover 311 is attached to the case 211. As a result, the rear end of the second board 412 passes through the inclined portion 332a of the third clamping piece 330a and the inclined portion 332b of the fourth clamping piece 330b of the cover side second positioning portion 312b protruding from the inner surface 311a of the cover 311, and is inserted between the cover side third protrusion 335a and the cover side fourth protrusion 335b, so that the z direction of the thickness direction of the second board 412 is positioned. Then, the wall surface 334 of the inner surface 311a of the cover 311 abuts against the rear end surface of the second board 412, so that the x axis direction perpendicular to the thickness of the second board 412 is positioned.

[0094] A transmitting / receiving antenna module 413 as an electronic component is mounted on one side of the first substrate 411. For example, a microstrip antenna or a waveguide slot antenna can be used as the antenna system. The transmitting / receiving antenna module 413 including a transmitting / receiving antenna as an electronic component constituting an antenna and the transmitting / receiving IC 414 may be mounted on the same side of the first substrate 411, or may be mounted on both sides (one main surface and the back surface) of the first substrate 411.

[0095] When the transmitting / receiving antenna module 413 and the transmitting / receiving IC 414 are mounted on the same surface, it is desirable that the mounting opening 218 provided in the case 211 be of a minimum size so as not to obstruct the radio waves emitted from the transmitting / receiving antenna of the transmitting / receiving antenna module 413, that the transmitting / receiving IC 414 be covered by the case 211, and that a convex portion be provided from the case 211 toward the transmitting / receiving IC 414.

[0096] In the third embodiment, a case will be described in which the transceiver IC 414, which generates a large amount of heat, is mounted on a surface (back surface) different from the mounting surface of the transceiver antenna module 413. As shown in Fig. 24, the transceiver IC 414 is located within a range surrounded by a straight line 511a connecting the case side first positioning portion 214a and the case side first positioning portion 214b provided on the case 211, a straight line 511b connecting the case side first positioning portion 214a and the cover side first positioning portion 312a provided on the cover 311, and a straight line 511c connecting the case side first positioning portion 214b and the cover side first positioning portion 312a.

[0097] Of the electronic components mounted on the second substrate 412, electronic component 415 that generates a large amount of heat is mounted on the second substrate 412. As shown in Fig. 25, electronic component 415 is located within a range surrounded by a straight line 512a connecting case side second positioning portion 214c and case side second positioning portion 214d provided on case 211, a straight line 512b connecting case side second positioning portion 214c and cover side second positioning portion 312b provided on cover 311, and a straight line 512c connecting case side second positioning portion 214d and cover side second positioning portion 312b.

[0098] The first substrate 411 and the second substrate 412 are connected to each other using a substrate body substrate connector or an FPC / FFC connector or the like (not shown).

[0099] The relay member 611 has a substantially rectangular parallelepiped shape, and has recesses 612 and 613 on both sides of the xy plane. The recesses 612 are provided to avoid interference with the electronic components 414 mounted on the first substrate 411, and the recesses 613 are provided to avoid interference with the electronic components 415 mounted on the second substrate 412. The relay member 611 also has four attachment portions 614 for fixing the first substrate 411 and the second substrate 412 to the relay member 611. The relay member 611 is made of a material with high thermal conductivity, such as a metal, a thermally conductive resin, or a material in which a thermally conductive resin is plated with a metal.

[0100] In the third embodiment, the mounting portion 614 of the relay board 611 is provided with four mounting portions 614a for mounting the first board 411, and four mounting portions 614b for mounting the second board 412. In the third embodiment, the mounting portions 614a and 614b are each formed as a screw hole.

[0101] The first substrate 411 has a through hole 411a formed in an attachment portion 614a for inserting the screw 501 therethrough, and the second substrate 412 has a through hole 412a formed in an attachment portion 614b for inserting the screw 511 therethrough.

[0102] The first substrate 411, the relay member 611 and the second substrate 412 are overlapped, and a screw 501 is inserted into the through hole 411a of the first substrate 411 and screwed into the mounting portion 614a of the relay member 611, and a screw 511 is inserted into the through hole 412a of the second substrate 412 and screwed into the mounting portion 614b of the relay member 611, thereby forming the first substrate 411, the relay member 611 and the second substrate 412 into an integrated configuration.

[0103] In this embodiment 3, the mounting portion 614a and the mounting portion 614b of the relay member 611 are respectively configured as screw holes, and are attached using screws 501 and 511. However, the present invention is not limited to this. The mounting portion 614a and the mounting portion 614b of the relay member 611 may be configured as engagement holes, and the mounting portion 614a and the mounting portion 614b may be configured as convex shapes, positioning pins, snap fits, or the like that engage with the engagement holes of the mounting portion 614a and the mounting portion 614b of the relay member 611, instead of screws 501 and 511, to achieve the same effect.

[0104] 21, the configuration around the transceiver IC 414 mounted on the first substrate 411 and the electronic component 415 mounted on the second substrate 412 will be described. A protruding portion 615 is provided near the transceiver IC 414 from the relay member 611 so as to be close to the transceiver IC 414. A protruding portion 215 is provided near the electronic component 415 from the case 211 so as to be close to the electronic component 415. A protruding portion 616 is provided from the relay member 616 so as to be close to the second substrate 412 on which the electronic component 415 is mounted.

[0105] The shape of the convex portion 615 of the relay member 611 is similar to that of the transceiver IC 414 in the xy plane, and is larger than the transceiver IC 414 so as to be able to cover the entire transceiver IC 414. The shapes of the convex portion 215 of the case 211 and the convex portion 616 of the relay member 611 are similar to that of the electronic component 415 in the xy plane, and are larger than the electronic component 415 so as to be able to cover the entire electronic component 415.

[0106] A method of assembling electronic device 110 will be described. First substrate 411 is fixed to mounting portion 614a of relay member 611 with screw 501, and second substrate 412 is fixed to mounting portion 614b of relay member 611 with screw 511. In this manner, first substrate 411, relay member 611, and second substrate 412 are integrated into one body.

[0107] The thickness direction of first substrate 411 is aligned with first slide groove 212a and first slide groove 212b of case 211, and the thickness direction of second substrate 412 is aligned with second slide groove 212c and second slide groove 212d of case 211, and first substrate 411 and second substrate 412 are simultaneously slid in the x-axis direction along first slide groove 212a and first slide groove 212b and second slide groove 212c and second slide groove 212d and inserted into case 211.

[0108] This allows the relay member 611 to be fixed to the first substrate 411 and the second substrate 412 to be disposed in the case 211. After the first substrate 411 and the second substrate 412 are disposed in the case 211, the cover 311 is attached to the case 211 by engaging the engaging recess 31a of the fitting piece 31 provided on the cover 311 with the engaging protrusion 23 of the case 211.

[0109] When cover 311 is attached to case 211, first substrate 411 is pressed in the x-axis direction by cover 311 until the tip surface of first substrate 411 contacts wall surfaces 224 of case-side first positioning portion 214a and case-side first positioning portion 214b of case 211, and inner surface 311a and outer surface 311b of cover 311 bulge like a bow in the negative direction of the x-axis or assume a shape parallel to the yz plane. This determines the position of first substrate 411 in the x-axis direction.

[0110] The first substrate 411 is sandwiched between the gap surrounded by the case side first protrusion 225a and the case side second protrusion 225b of the case side first positioning portion 214a and the case side first positioning portion 214b of the case 211, and the gap between the cover side first protrusion 325a and the cover side second protrusion 325b of the cover side first positioning portion 312a of the cover 311, and its position in the z-axis direction is determined.

[0111] Similarly, when the cover 311 is attached to the case 211, the second substrate 412 is pressed by the cover 311 in the x-axis direction until the end surface of the second substrate 412 comes into contact with the wall surfaces 224 of the case-side second positioning parts 214c and 214d of the case 211, and the inner surface 311a and the outer surface 311b of the cover 311 bulge in a bow shape in the negative direction of the x-axis or are parallel to the yz plane. This determines the position of the second substrate 412 in the x-axis direction.

[0112] The second substrate 412 is sandwiched between the gap surrounded by the case side third protrusion 235a and the case side fourth protrusion 235b of the case side second positioning portion 214c and the case side second positioning portion 214d of the case 211, and the gap between the cover side third protrusion 335a and the cover side fourth protrusion 335b of the cover side second positioning portion 312b of the cover 311, and its position in the z-axis direction is determined.

[0113] The positional relationship between the first substrate 411 and the second substrate 412 and the relay member 611 may be in a temporarily fixed state without being fixed so that it is uniquely determined, or the positional relationship between the first substrate 411 and the second substrate 412 and the case 211 may be uniquely determined when the first substrate 411 and the second substrate 412 are arranged inside the case 211 and then attached to the case side first positioning portions 214a, 214b, the case side second positioning portions 214c, 214d of the case 211, and the cover side first positioning portion 312a and the cover side second positioning portion 312b of the cover 311.

[0114] In this way, in the third embodiment, it is possible to insert first board 411 and second board 412 into housing 111 without using other fixing members such as screws, making it possible to reduce the number of assembly steps.

[0115] Furthermore, by arranging the transceiver IC 414, which generates a large amount of heat, within the area surrounded by the case side first positioning portion 214a, the case side first positioning portion 214b of the case 211 and the cover side first positioning portion 312a of the cover 311, the transceiver IC 414, which generates a large amount of heat, can be arranged in a position within the first board 411 with good positional accuracy.

[0116] Similarly, in the case of the second substrate 412, by arranging the electronic component 415 that generates a large amount of heat within an area surrounded by the case-side second positioning portion 214c, the case-side second positioning portion 214d of the case 211, and the cover-side second positioning portion 312b of the cover 311, it is possible to arrange the electronic component 415 that generates a large amount of heat at a position with good positional accuracy within the second substrate 412. If the positional accuracy of the electronic component 415 that generates a large amount of heat can be increased, it is possible to reduce variations in the gap between the electronic component 415 that generates a large amount of heat and the case 211, and in the gap between the second substrate 412 on which the electronic component 415 is mounted and the relay member 611, and it is possible to bring them closer together.

[0117] This makes it possible to reduce the gap between convex portion 215 on case 211 and electronic component 415, and the gap between convex portion 616 on relay member 611 and second substrate 412, thereby ensuring a sufficient heat dissipation path without filling the gap between the heat-generating component and the heat dissipating component with a material with high thermal conductivity.

[0118] The positioning portion provided on the case or cover may be formed integrally with the case or cover, or may be made of a separate member and combined with it by insert molding or bonding.

[0119] The case or cover may be fixed by snap fitting or the like, or may be fixed by adhesion, caulking, welding or the like.

[0120] Although the present application describes various exemplary embodiments and examples, the various features, aspects, and functions described in one or more embodiments are not limited to application to a particular embodiment, but may be applied to the embodiments alone or in various combinations. Therefore, countless modifications not exemplified are assumed within the scope of the technology disclosed in the present specification, including, for example, modifying, adding, or omitting at least one component, and further, extracting at least one component and combining it with a component of another embodiment.

[0121] Various aspects of the present disclosure are summarized below as appendices.

[0122] (Appendix 1) An electronic device comprising: a board on which electronic components are mounted; a case having a board insertion opening and slide grooves formed on both side walls for sliding and inserting the board, the board being inserted from the board insertion opening into the slide grooves for storage; and a cover connected to the case and closing the board insertion opening of the case, the case is provided with a case side positioning portion having a portion for positioning the substrate in a thickness direction and a portion for positioning the substrate in a direction perpendicular to the thickness direction, The electronic device is characterized in that the cover is provided with a cover side positioning portion having a portion for positioning the board in a thickness direction and a portion for positioning the board in a direction perpendicular to the thickness of the board. (Appendix 2) The electronic device described in Appendix 1, characterized in that the case side positioning portion is provided at the rear of one side wall of the case, and the cover side positioning portion is provided on the cover diagonally opposite the case side positioning portion. (Appendix 3) The electronic device described in Appendix 2, wherein the electronic component is arranged on a line connecting the case side positioning portion and the cover side positioning portion. (Appendix 4) The electronic device described in any one of Appendix 1 to Appendix 3, characterized in that the case side positioning portion has an inclined portion in which the gap of the slide groove on the case side is smaller than the gap in other portions, the cover side positioning portion is arranged on the inner surface of the cover, protrudes toward the case, and is composed of a first clamping piece and a second clamping piece that face each other via the substrate, and has an inclined portion that inclines from the lower surface flat portion of the protruding end of the first clamping piece toward the first substrate side toward the inner surface of the cover, and has an inclined portion that inclines from the upper surface flat portion of the protruding end of the second clamping piece toward the first substrate side toward the inner surface of the cover. (Appendix 5) The electronic device described in Appendix 1, characterized in that the case side positioning portion is formed by a clamping body protruding from both ends of the rear wall of the case and clamping the board by elastic force, and the cover side positioning portion is formed by a clamping body arranged in the center of the inner surface of the cover and clamping the board by elastic force. (Appendix 6) The electronic device described in Appendix 2, characterized in that the electronic component is arranged within the range of a line connecting the case side positioning portion on one side and the case side positioning portion on the other side, a line connecting the case side positioning portion on one side and the cover side positioning portion, and a line connecting the case side positioning portion on the other side and the cover side positioning portion. (Appendix 7) 7. The electronic device according to claim 1, wherein the case has a protrusion protruding at least at the position of the electronic component. (Appendix 8) The electronic device described in Appendix 7, characterized in that a through hole is provided in the convex portion that penetrates the surface of the case, and a heat dissipation material is filled between the through hole, the convex portion, and the electronic component. (Appendix 9) 9. The electronic device according to claim 1, wherein the case has a protrusion protruding from the case at a position directly below the electronic component. (Appendix 10) The electronic device described in Appendix 8, characterized in that the protrusion provided on the case is higher on the rear wall side of the case than on the cover side along the insertion direction of the board. (Appendix 11) The electronic device according to any one of claims 1 to 10, further comprising a fin on the outside of the case. (Appendix 12) an electronic device comprising: a first board on which electronic components are mounted; a second board on which electronic components are mounted; a case having a board insertion opening and an attachment opening, and a first slide groove for slidingly inserting the first board and a second slide groove for slidingly inserting the second board on both side walls, the first board being inserted from the board insertion opening into the first slide groove and the second board being inserted from the board insertion opening into the second slide groove, and a cover connected to the case and closing the board insertion opening of the case, the case is provided with a case-side first positioning portion having a portion for positioning the first substrate in a thickness direction and a portion for positioning the first substrate in a direction perpendicular to the thickness direction, and a case-side second positioning portion having a portion for positioning the second substrate in a thickness direction and a portion for positioning the second substrate in a direction perpendicular to the thickness direction, the cover is provided with a cover-side first positioning portion having a portion for positioning the first substrate in a thickness direction and a portion for positioning the first substrate in a direction perpendicular to the thickness direction, and a cover-side second positioning portion having a portion for positioning the second substrate in a thickness direction and a portion for positioning the second substrate in a direction perpendicular to the thickness direction, An electronic device, comprising: a relay member provided between the first substrate and the second substrate, the relay member connecting the first substrate and the second substrate. (Appendix 13) 13. The electronic device according to claim 12, wherein the relay board has a protrusion at a position facing the first substrate and the second substrate. (Appendix 14) The electronic device described in Appendix 12 or Appendix 13, wherein the first substrate is exposed to the outside of the case. (Appendix 15) the case-side first positioning portions are provided on both ends of the rear wall of the case, and each has an inclined portion inclined from an upper surface of the first slide groove on the case side toward the first substrate and from a lower surface of the first slide groove on the case side toward the first substrate, the case-side first flat portion extends from an end of the inclined portion on the upper surface side of the first slide groove on the first substrate side toward the rear portion of the case side, a case-side first protrusion is disposed between the first substrate and the case-side first flat portion, the case-side second flat portion extends from an end of the inclined portion on the lower surface side of the first slide groove on the first substrate side toward the rear portion of the case side, and a case-side second protrusion is disposed between the first substrate and the case-side second flat portion, the case-side second positioning portions are provided on both ends of the rear wall of the case, and each has an inclined portion inclined from an upper surface of the second slide groove on the case side toward the second substrate and from a lower surface of the second slide groove on the case side toward the second substrate, the case-side second positioning portions have a case-side third flat portion extending from an end of the inclined portion on the upper surface side of the second slide groove on the second substrate side toward the rear portion of the case side, and a case-side third protrusion is disposed between the second substrate and the case-side third flat portion for sandwiching the second substrate, the case-side fourth flat portion is disposed from an end of the inclined portion on the lower surface side of the second slide groove on the second substrate side toward the rear portion of the case side, and a case-side fourth protrusion is disposed between the second substrate and the case-side fourth flat portion for sandwiching the second substrate, the cover-side first positioning portion is disposed in the center of the inner surface of the cover, protrudes toward the case, and is composed of a first clamping piece and a second clamping piece facing each other via the first substrate, the first clamping piece has an inclined portion inclined from a lower surface side flat portion of a protruding end portion of the first clamping piece toward the first substrate side toward the inner surface of the cover, and has a cover-side first flat portion from an end portion of the inclined portion on the first substrate side toward the inner surface of the cover, a cover-side first protrusion that clamps the first substrate is disposed between the first substrate and the cover-side first flat portion, the second clamping piece has an inclined portion inclined from an upper surface side flat portion of a protruding end portion of the second clamping piece toward the first substrate side toward the inner surface of the cover, and has a cover-side second flat portion from an end portion of the inclined portion on the first substrate side toward the inner surface of the cover, and a cover-side second protrusion that clamps the first substrate is disposed between the first substrate and the cover-side second flat portion, The electronic device according to any one of Supplementary Note 12 to Supplementary Note 14, characterized in that the cover-side second positioning portion is arranged in a center portion of an inner surface of the cover, protrudes toward the case, and is composed of a third clamping piece and a fourth clamping piece facing each other via the second substrate, the third clamping piece has an inclined portion inclined from a lower surface side flat portion of a protruding end portion of the third clamping piece toward the second substrate side toward the inner surface of the cover, and has a cover-side third flat portion from an end portion of the inclined portion on the second substrate side toward the inner surface of the cover, a cover-side third protrusion that clamps the second substrate is arranged between the first substrate and the cover-side third flat portion, the third clamping piece has an inclined portion inclined from a lower surface side flat portion of a protruding end portion of the third clamping piece toward the second substrate side toward the inner surface of the cover, and has a cover-side fourth flat portion from an end portion of the inclined portion on the second substrate side toward the inner surface of the cover, and a cover-side fourth protrusion that clamps the second substrate is arranged between the first substrate and the cover-side fourth flat portion. (Appendix 16) The electronic device described in any one of Supplementary Note 12 to Supplementary Note 15, characterized in that the electronic components mounted on the first board are arranged within a range of a line connecting the case side first positioning portion on one side and the case side first positioning portion on the other side, a line connecting the case side first positioning portion on one side and the cover side first positioning portion, and a line connecting the case side first positioning portion on the other side and the cover side first positioning portion, and the electronic components mounted on the second board are arranged within a range of a line connecting the case side second positioning portion on one side and the case side second positioning portion on the other side, a line connecting the case side second positioning portion on one side and the cover side second positioning portion, and a line connecting the case side second positioning portion on the other side and the cover side second positioning portion. (Appendix 17) The electronic device described in any one of Supplementary Note 12 to Supplementary Note 16, characterized in that the relay member is provided with a first fastening portion that fastens and fixes the first substrate, and a second fastening portion that fastens and fixes the second substrate. [Industrial Applicability]

[0123] The present application is suitable for realizing an electronic device that can ensure a sufficient heat dissipation path while reducing the number of assembly steps. [Explanation of symbols]

[0124] 1,100,110 Electronic device, 10,101,111 Housing, 20,201,211 Case, 24,204a,204b Case side positioning portion, 214a,214b Case side first positioning portion, 214c,214d Case side second positioning portion, 30,301,311 Cover, 32,302 Cover side positioning portion, 312a Cover side first positioning portion, 312b Cover side second positioning portion, 40,401 Board, 411 First board, 412 Second board, 611 Relay member

Claims

1. An electronic device comprising: a board on which electronic components are mounted; a case having a board insertion opening and slide grooves formed on both side walls for sliding and inserting the board, the board being inserted from the board insertion opening into the slide grooves for storage; and a cover connected to the case and closing the board insertion opening of the case, the case is provided with a case side positioning portion having a portion for positioning the substrate in a thickness direction and a portion for positioning the substrate in a direction perpendicular to the thickness direction, The electronic device is characterized in that the cover is provided with a cover side positioning portion having a portion for positioning the board in a thickness direction and a portion for positioning the board in a direction perpendicular to the thickness of the board.

2. 2. The electronic device according to claim 1, wherein the case side positioning portion is provided at the rear of one side wall of the case, and the cover side positioning portion is provided on the cover diagonally opposite the case side positioning portion.

3. 3. The electronic device according to claim 2, wherein the electronic component is disposed on a line connecting the case-side positioning portion and the cover-side positioning portion.

4. The electronic device described in any one of claims 1 to 3, characterized in that the case side positioning portion has an inclined portion in which the gap of the slide groove on the case side is smaller than the gap in other portions, the cover side positioning portion is arranged on the inner surface of the cover, protrudes toward the case, and is composed of a first clamping piece and a second clamping piece that face each other via the board, and has an inclined portion that slopes from the lower surface flat portion of the protruding end of the first clamping piece toward the board toward the inner surface of the cover, and has an inclined portion that slopes from the upper surface flat portion of the protruding end of the second clamping piece toward the board toward the inner surface of the cover.

5. The electronic device described in claim 1, characterized in that the case side positioning portion is formed by a clamping body protruding from both ends of the rear wall of the case and clamping the board by elastic force, and the cover side positioning portion is formed by a clamping body arranged in the center of the inner surface of the cover and clamping the board by elastic force.

6. The electronic device described in claim 2, characterized in that the electronic component is arranged within a range of a line connecting the case side positioning portion on one side and the case side positioning portion on the other side, a line connecting the case side positioning portion on one side and the cover side positioning portion, and a line connecting the case side positioning portion on the other side and the cover side positioning portion.

7. 4. The electronic device according to claim 1, wherein the case has a protrusion that protrudes at least at a position where the electronic component is located.

8. 8. The electronic device according to claim 7, wherein the protrusion has a through hole penetrating through the surface of the case, and a heat dissipation material is filled between the through hole, the protrusion, and the electronic component.

9. 4. The electronic device according to claim 1, wherein the case has a protrusion provided directly below the electronic component.

10. 9. The electronic device according to claim 8, wherein the protrusion provided on the case has a height on a back wall side of the case that is higher than a height on the cover side along the insertion direction of the board.

11. 4. The electronic device according to claim 1, further comprising a fin provided on an outer side of the case.

12. an electronic device comprising: a first board on which electronic components are mounted; a second board on which electronic components are mounted; a case having a board insertion opening and an attachment opening, and having a first slide groove for slidingly inserting the first board and a second slide groove for slidingly inserting the second board on both side walls, the first board being inserted from the board insertion opening into the first slide groove and the second board being inserted from the board insertion opening into the second slide groove, and a cover connected to the case and closing the board insertion opening of the case, the case is provided with a case-side first positioning portion having a portion for positioning the first substrate in a thickness direction and a portion for positioning the first substrate in a direction perpendicular to the thickness thereof, and a case-side second positioning portion having a portion for positioning the second substrate in a thickness direction and a portion for positioning the second substrate in a direction perpendicular to the thickness thereof; the cover is provided with a cover-side first positioning portion having a portion for positioning the first substrate in a thickness direction and a portion for positioning the first substrate in a direction perpendicular to the thickness direction, and a cover-side second positioning portion having a portion for positioning the second substrate in a thickness direction and a portion for positioning the second substrate in a direction perpendicular to the thickness direction, An electronic device, comprising: a relay member provided between the first substrate and the second substrate, the relay member connecting the first substrate and the second substrate.

13. 13. The electronic device according to claim 12, wherein the relay board has a protrusion at a position facing the first substrate and the second substrate.

14. 14. The electronic device according to claim 12, wherein the first substrate is exposed to the outside of the case.

15. the case-side first positioning portions are provided on both ends of the rear wall of the case, and each has an inclined portion inclined from an upper surface of the first slide groove on the case side toward the first substrate and from a lower surface of the first slide groove on the case side toward the first substrate, the case-side first flat portion extends from an end of the inclined portion on the upper surface side of the first slide groove on the first substrate side toward the rear portion of the case side, a case-side first protrusion is disposed between the first substrate and the case-side first flat portion, the case-side second flat portion extends from an end of the inclined portion on the lower surface side of the first slide groove on the first substrate side toward the rear portion of the case side, and a case-side second protrusion is disposed between the first substrate and the case-side second flat portion, the case-side second positioning portions are provided on both end sides of the rear wall of the case, and each has an inclined portion inclined from an upper surface of the second slide groove on the case side toward the second substrate and from a lower surface of the second slide groove on the case side toward the second substrate, the case-side second positioning portions have a case-side third flat portion extending from an end of the inclined portion on the upper surface side of the second slide groove on the second substrate side toward the rear portion of the case side, a case-side third protrusion that holds the second substrate between the second substrate and the case-side third flat portion, the case-side fourth flat portion extending from an end of the inclined portion on the lower surface side of the second slide groove on the second substrate side toward the rear portion of the case side, and a case-side fourth protrusion that holds the second substrate between the second substrate and the case-side fourth flat portion, the cover-side first positioning portion is disposed in the center of the inner surface of the cover, protrudes toward the case, and is composed of a first clamping piece and a second clamping piece facing each other via the first substrate, the first clamping piece has an inclined portion inclined from a lower surface side flat portion of a protruding end portion of the first clamping piece toward the first substrate side toward the inner surface of the cover, and has a cover-side first flat portion from an end portion of the inclined portion on the first substrate side toward the inner surface of the cover, a cover-side first protrusion that clamps the first substrate is disposed between the first substrate and the cover-side first flat portion, the second clamping piece has an inclined portion inclined from an upper surface side flat portion of a protruding end portion of the second clamping piece toward the first substrate side toward the inner surface of the cover, and has a cover-side second flat portion from an end portion of the inclined portion on the first substrate side toward the inner surface of the cover, and a cover-side second protrusion that clamps the first substrate is disposed between the first substrate and the cover-side second flat portion, The electronic device according to claim 12 or 13, characterized in that the cover-side second positioning portion is arranged in the center of the inner surface of the cover, protrudes toward the case, and is composed of a third clamping piece and a fourth clamping piece facing each other via the second substrate, has an inclined portion that slopes from the lower surface side flat portion of the protruding end of the third clamping piece toward the second substrate toward the inner surface of the cover, and has a cover-side third flat portion from the end of the inclined portion on the second substrate side toward the inner surface of the cover, a cover-side third protrusion that clamps the second substrate is arranged between the first substrate and the cover-side third flat portion, has an inclined portion that slopes from the lower surface side flat portion of the protruding end of the third clamping piece toward the second substrate toward the inner surface of the cover, and has a cover-side fourth flat portion from the end of the inclined portion on the second substrate side toward the inner surface of the cover, and

16. The electronic device described in claim 12 or 13, characterized in that the electronic components mounted on the first board are arranged within a range of a line connecting the case side first positioning portion on one side and the case side first positioning portion on the other side, a line connecting the case side first positioning portion on one side and the cover side first positioning portion, and a line connecting the case side first positioning portion on the other side and the cover side first positioning portion, and the electronic components mounted on the second board are arranged within a range of a line connecting the case side second positioning portion on one side and the case side second positioning portion on the other side, a line connecting the case side second positioning portion on one side and the cover side second positioning portion, and a line connecting the case side second positioning portion on the other side and the cover side second positioning portion.

17. 14. The electronic device according to claim 12, wherein the relay member is provided with a first fastening portion for fastening the first substrate, and a second fastening portion for fastening the second substrate.

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