Alignment apparatus, alignment method, film deposition apparatus, and method for manufacturing electronic devices

Abstract

To provide an alignment device, alignment method and film deposition apparatus, capable of accurately performing alignment.SOLUTION: An alignment device capable of positioning first and second members includes: imaging means capable of imaging the first and second members; detection means for detecting a first alignment mark from a first image obtained by imaging the first and second members having the first alignment mark by the imaging means; and position control means for controlling a relative position between the first and second members on the basis of a position of the first alignment mark detected by the detection means. The detection means sets a part of area in the first image as a search area to detect the first alignment mark in the search area.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to an alignment apparatus, an alignment method, and a film forming apparatus. [Background technology]

[0002] Organic electroluminescent displays are in the limelight as flat panel displays. As self-emitting displays, organic electroluminescent displays are superior to liquid crystal panel displays in terms of response speed, viewing angle, thinness, etc., and are rapidly replacing existing liquid crystal panel displays in monitors, televisions, various mobile terminals such as smartphones, etc. Their application fields are also expanding to include automotive displays, etc.

[0003] An organic electroluminescent display has a basic structure in which an organic layer that emits light is formed between two opposing electrodes (cathode and anode electrodes). The organic layer and electrode metal layer of an organic electroluminescent display are manufactured by depositing a deposition material onto a substrate in a vacuum chamber through a mask on which a desired pixel pattern is formed. In order to deposit the deposition material in the desired pattern at the desired position on the substrate, a process (called alignment) is performed to precisely align the mask and substrate before deposition onto the substrate. In addition, in a film deposition apparatus configured to transport the substrate on a substrate carrier, alignment between the substrate and substrate carrier is also important for high-precision film deposition.

[0004] Patent Document 1 describes a substrate inspection device that inspects the substrate for defects and cracks at its edges by irradiating the substrate with a laser beam and photographing the substrate with a camera. In this substrate inspection device, the position of the substrate is obtained by performing image recognition processing on the substrate image photographed by the camera. Patent Document 2 describes a technique for detecting the position of an alignment mark in a mark photographed image by comparing a mark photographed image obtained by photographing an alignment mark provided on the substrate with a camera with a model image created from an actual image of the alignment mark photographed in advance by a camera. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2020-003469 A [Patent Document 2] JP 2020-169391 A Summary of the Invention [Problem to be solved by the invention]

[0006] If there is dirt on the object being photographed when photographing an alignment mark for alignment, the dirt may be erroneously detected as an alignment mark in the photographed image, making it impossible to perform alignment with high accuracy.

[0007] An object of the present invention is to provide an alignment apparatus, an alignment method, and a film forming apparatus that are capable of performing alignment with high precision. [Means for solving the problem]

[0008] The present invention provides an alignment device for aligning a first member and a second member, An imaging means capable of imaging the first member and the second member; a detection means for detecting the first alignment mark from a first image obtained by imaging the first member and the second member, on which the first alignment mark is provided, by the imaging means; a position adjusting means for adjusting a relative position between the first member and the second member based on the position of the first alignment mark detected by the detection means; having The alignment device is characterized in that the detection means sets a partial area in the first image as a search area and detects the first alignment mark within the search area.

[0009] The present invention provides a method for manufacturing a semiconductor device, comprising: a detection step of detecting the first alignment mark from a first image obtained by the imaging step; a position adjusting step of adjusting a relative position between the first member and the second member based on the position of the first alignment mark detected in the detection step; An alignment method comprising: The alignment method is characterized in that in the detection step, a partial area in the first image is set as a search area, and the first alignment mark is detected within the search area. Effect of the Invention

[0010] According to the present invention, it is possible to provide an alignment apparatus, an alignment method, and a film forming apparatus capable of performing alignment with high precision. [Brief description of the drawings]

[0011] [Figure 1] FIG. 2 is a schematic diagram of a part of a manufacturing line for an organic EL display device according to an embodiment of the present invention. [Diagram 2] FIG. 1 is a diagram illustrating a schematic configuration of a film forming apparatus. [Diagram 3] FIG. 1 is a diagram illustrating a schematic configuration of an alignment apparatus. [Figure 4] 11A to 11C are diagrams illustrating an alignment process between a mask and a cooling plate. [Diagram 5] 1A and 1B are diagrams illustrating an example of image data obtained by imaging in an alignment process. [Figure 6] FIG. 2 is a diagram for explaining alignment between a substrate and a mask. [Figure 7] FIG. 2 is a diagram for explaining alignment between a substrate and a mask. [Figure 8] 11A and 11B are diagrams illustrating a pattern matching method between a mark photographed image and a reference model image. [Figure 9] 1A to 1C are diagrams illustrating a method for manufacturing an electronic device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Example 1 Preferred embodiments of the present invention will be described below with reference to the drawings. However, the following embodiments merely exemplify preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. Furthermore, unless otherwise specified, the hardware and software configurations, process flow, manufacturing conditions, dimensions, materials, shapes, etc. of the device in the following description are not intended to limit the scope of the present invention to these alone.

[0013] The present invention can be preferably applied to an apparatus for forming a patterned thin film (material layer) on the surface of a substrate by vacuum deposition. Any material can be selected for the substrate material, such as glass, a polymeric material film, or metal, and any material can be selected for the deposition material, such as an organic material or a metallic material (metal, metal oxide, etc.). Specifically, the technology of the present invention can be applied to manufacturing apparatuses for organic electronic devices (e.g., organic EL display devices, thin-film solar cells), optical components, and the like. Among these, forming an organic EL display element by evaporating a deposition material in a manufacturing apparatus for an organic EL display device is one of the preferred application examples of the present invention.

[0014] <Electronic device manufacturing line> Fig. 1 is a top view showing a schematic diagram of a part of the configuration of a manufacturing line for electronic devices. The manufacturing line in Fig. 1 is used, for example, to manufacture display panels for organic electroluminescence (EL) display devices for smartphones. In the case of display panels for smartphones, for example, an organic EL film is formed on a substrate measuring approximately 1800 mm x approximately 1500 mm, and then the substrate is diced to produce multiple small panels.

[0015] 1, a manufacturing line for electronic devices generally has a plurality of film formation chambers 11, 12 and a transfer chamber 13. A transfer robot 14 that holds and transfers a substrate 10 is provided inside the transfer chamber 13. The transfer robot 14 is, for example, a robot having a structure in which a robot hand that holds the substrate 10 is attached to an articulated arm, and is a transfer means that carries the substrate 10 in and out of each film formation chamber.

[0016] Each of the film formation chambers 11 and 12 is provided with a film formation device (also called a deposition device). A series of film formation processes, such as the transfer of the substrate 10 to the transfer robot 14, adjustment (alignment) of the relative positions of the substrate 10 and the mask 15, fixing the substrate 10 on the mask 15, and film formation (deposition), are automatically performed by the film formation device. The configuration of the film formation device in the film formation chamber will be described below.

[0017] <Film forming equipment> 2 is a cross-sectional view showing a schematic configuration of the film forming apparatus 2. In the following description, an XYZ Cartesian coordinate system is used in which the vertical direction is the Z direction. It is assumed that the substrate 10 is fixed parallel to a horizontal plane (XY plane) during film formation, and the direction parallel to the short side of the substrate 10 is the X direction, and the direction parallel to the long side is the Y direction. The rotation angle around the Z axis is represented by θ.

[0018] The film forming apparatus 2 includes a vacuum chamber 20 that defines a space in which a film forming process is performed. The inside of the vacuum chamber 20 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas.

[0019] The upper part of the vacuum chamber 20 of the film formation apparatus 2 is provided with a substrate holding unit 21 that holds and transports the substrate 10, a mask holding unit 22 that holds and transports the mask 15, a cooling plate 23 for cooling the substrate 10, a magnet plate 24 for applying a magnetic force to the metallic mask 15, and a mask stand 25 on which the mask 15 whose position has been adjusted is placed. The lower part of the vacuum chamber 20 of the film formation apparatus is provided with a film formation source 26 in which deposition material is stored.

[0020] The substrate holding unit 21 is a means for holding and transporting the substrate 10 received from the transport robot 14 in the transport chamber 13, and is also called a substrate holder.

[0021] The mask holding unit 22 is a means for holding and transporting the mask 15 that has been carried into the vacuum chamber 20 of the film forming apparatus 2 until the mask 15 is placed on the mask table 25 .

[0022] A frame-shaped mask stage 25 fixed to the vacuum chamber 20 is installed below the substrate holding unit 21, and a mask 15 having an opening pattern corresponding to the thin film pattern to be formed on the substrate 10 is placed on the mask stage 25. In particular, the mask 15 used for manufacturing organic EL elements for smartphones is a metal mask with a fine opening pattern formed therein, and is also called an FMM (Fine Metal Mask).

[0023] The cooling plate 23 is installed above the support portion of the substrate holding unit 21 and is in close contact with the surface of the substrate 10 opposite to the mask 15 during film formation, thereby suppressing the rise in temperature of the substrate 10 during film formation. It is a plate-shaped component that serves to prevent the alteration and deterioration of organic materials.

[0024] A magnet plate 24 is provided on the cooling plate 23 to apply a magnetic force to the metal mask 15 to prevent the mask 15 from bending and to bring the mask 15 into close contact with the substrate 10. The magnet plate 24 may be made of a permanent magnet or an electromagnet and may be divided into a plurality of modules. The magnet plate 24 may also be formed integrally with the cooling plate 23.

[0025] The film formation source 26 includes a crucible (not shown) that contains the deposition material to be deposited on the substrate 10, a heater (not shown) for heating the crucible, and a shutter (not shown) that prevents the deposition material from scattering onto the substrate 10 until the evaporation rate from the deposition source becomes constant. The film formation source 26 can have various configurations depending on the application, such as a point deposition source, a linear deposition source, or a revolver deposition source.

[0026] Although not shown in FIG. 2, the film forming apparatus 2 includes a film thickness monitor (not shown) for measuring the thickness of the film deposited on the substrate 10, and a film thickness calculation unit (not shown).

[0027] On the external upper surface of the vacuum chamber 20 of the film forming apparatus 2, there are provided a lifting mechanism for raising and lowering the substrate holding unit 21, the mask holding unit 22, the cooling plate 23 / magnet plate 24, etc. in the vertical direction (Z direction, third direction), and a driving mechanism (alignment stage) for moving the substrate holding unit 21 and / or the mask holding unit 22 parallel to the horizontal plane (X direction, Y direction, θ direction) for aligning the substrate 10 with the mask 15 or for aligning the mask 15 with the cooling plate / magnet plate.

[0028] The lifting mechanism for raising and lowering the cooling plate 23 and the magnet plate 24 in the Z direction is separate / independent from the alignment stage for moving the substrate holding unit 21 in the XYθ direction, and even when the substrate holding unit 21 connected to the alignment stage moves in XYθ direction due to XYθ movement of the alignment stage, the cooling plate / magnet plate lifting mechanism is fixed in the XYθ direction without moving in XYθ direction.

[0029] In order to align the mask 15 and the substrate 10, the film forming apparatus 2 is provided with an alignment camera 40 that photographs alignment marks formed on the substrate 10 and the mask 15 through a window 28 provided in the ceiling of the vacuum chamber 20. The alignment camera 40 is disposed so that predetermined areas of the cooling plate 23, the substrate 10, and the mask 15 can be included in the field of view. Mask alignment for aligning the cooling plate 23 and the mask 15, and substrate alignment for aligning the mask 15 and the substrate 10 are performed by image processing by the control unit 29 based on image data of the predetermined areas of the cooling plate 23, the substrate 10, and the mask 15 photographed by the alignment camera 40.

[0030] Each step of the film formation process performed in the film formation apparatus of this embodiment will be described below. First, a new mask 15 is carried into the vacuum chamber 20 of the film formation apparatus and placed on the mask holding unit 22. A mask alignment process is then performed to adjust the position of the mask 15 placed on the mask holding unit 22 relative to the position of the cooling plate 23. The mask 15, whose position has been adjusted relative to the cooling plate 23, is lowered by the mask holding unit 22 and placed on the mask stage 25.

[0031] The substrate 10 is carried into the vacuum chamber 20 by the transfer robot 14 in the transfer chamber 13 and placed on the substrate holding unit 21. This is followed by a substrate alignment process in which the relative positions of the substrate 10 and the mask 15 are measured and adjusted. Once the substrate alignment process is complete, the substrate holding unit 21 is lowered by the lifting mechanism to place the substrate 10 on the mask 15, and then the cooling plate 23 and magnet plate 24 are lowered by the lifting mechanism to bring the substrate 10 and the mask 15 into close contact with each other. In this state, the shutter of the film formation source 26 is opened, and vapor is evaporated from the crucible of the film formation source 26. The emitted deposition material is deposited on the substrate 10 through the fine pattern openings of the mask 15 .

[0032] When the thickness of the deposition material deposited on the substrate 10 reaches a predetermined thickness, the shutter of the deposition source 26 is closed, and then the transfer robot 14 transfers the substrate 10 from the vacuum chamber 20 to the transfer chamber 13. After repeating the process from substrate transfer to substrate removal for a predetermined number of substrates 10, the mask 15, which has been deposited with the deposition material and can no longer be used, is transferred out of the deposition apparatus, and a new mask 15 is transferred into the deposition apparatus.

[0033] <Alignment stage> The configuration of the alignment stage 30 of the first embodiment will be described below with reference to Fig. 3. On the outer upper surface (first outer surface) of the vacuum chamber 20, there are installed the alignment stage 30, which is a position adjustment means for moving the substrate holding unit 21 and the mask holding unit 22 in the XYθ directions to adjust the position of the substrate 10 relative to the mask 15 and the position of the mask 15 relative to the cooling plate / magnet plate, a substrate Z-axis lifting mechanism 31 (substrate third direction driving mechanism) for lifting and lowering the substrate holding unit 21 in the Z-axis direction, a cooling plate Z-axis lifting mechanism 32 (cooling plate third direction driving mechanism) for lifting and lowering the cooling plate 23 and / or the magnet plate 24 in the Z-axis direction, and a mask Z-axis lifting mechanism 33 (mask third direction driving mechanism) for lifting and lowering the mask 15 in the Z-axis direction.

[0034] The alignment stage 30 receives driving forces in the XYθ directions from an alignment stage driving motor 301 (first motor) fixed to the outer upper surface of the vacuum chamber through a linear guide (first driving force transmission mechanism). That is, a guide rail (not shown) is fixed and installed on the outer upper surface of the vacuum chamber, and a linear block is movably installed on the guide rail. An alignment stage base plate 302 (first base plate) is mounted on the linear block. By moving the linear block in the XYθ directions by the driving force from the alignment stage driving motor 301 fixed to the outer upper surface of the vacuum chamber, the alignment stage base plate 302 mounted on the linear block, i.e., the entire alignment stage 30, can be moved in the XYθ directions.

[0035] The lifting mechanism for raising and lowering the substrate holding unit 21 and the lifting mechanism for raising and lowering the mask holding unit 22 are mounted on the alignment stage 30 as described below, so that the substrate holding unit 21 and the mask holding unit 22 move in the XYθ directions together with the substrate 10 and mask 15 held by them, respectively, as the alignment stage moves in the XYθ directions.

[0036] The substrate Z-axis lifting mechanism 31 is a mechanism for lifting and lowering the substrate holding unit 21 in the Z-axis direction, and is installed on the alignment stage base plate 302. The substrate holding unit 21 in the vacuum chamber 20 is connected to the substrate Z-axis lifting mechanism 31 through the external upper surface of the vacuum chamber 20. The substrate Z-axis lifting mechanism 31 includes a substrate lifting drive motor 311 (third motor) and a linear guide 312 as a substrate lifting drive force transmission mechanism (third drive force transmission mechanism) for transmitting the drive force of the substrate lifting drive motor 311 to the substrate holding unit 21. In the first embodiment, the linear guide 312 is used as the substrate lifting drive force transmission mechanism, but the present invention is not limited thereto, and a ball screw or the like may also be used.

[0037] The cooling plate Z-axis lifting mechanism 32 includes a cooling plate lifting drive motor 321 (second motor) for driving the cooling plate 23 and / or the magnet plate 24 in the Z direction and a ball screw 322 as a cooling plate lifting drive force transmission mechanism (second drive force transmission mechanism), and is installed on a cooling plate Z-axis lifting mechanism base plate 323 (second base plate) fixed to the outer upper surface of the vacuum chamber. In the first embodiment, the ball screw 322 is used as the cooling plate lifting drive force transmission mechanism, but the present invention is not limited thereto, and a linear guide or the like may also be used.

[0038] Thus, in Example 1, the cooling plate Z-axis lifting mechanism 32 is not installed on the alignment stage 30, but is installed on a cooling plate Z-axis lifting mechanism base plate 323 that is separated / independent from the alignment stage 30 and fixed to the external upper surface of the vacuum chamber 20. Therefore, even if the alignment stage 30 moves in the XYθ directions, the cooling plate Z-axis lifting mechanism 32 does not move in the XYθ directions but is fixed in the XYθ directions.

[0039] The mask Z-axis lifting mechanism 33 is a mechanism for lifting and lowering the mask holding unit 22 in the Z-axis direction, and is mounted on the alignment stage 30. The mask holding unit 22 in the vacuum chamber 20 is connected to the mask Z-axis lifting mechanism 33 through the external upper surface of the vacuum chamber 20. The mask Z-axis lifting mechanism 33 includes a mask lifting drive motor 331 (fourth motor) and a ball screw 332 (fourth drive force transmission mechanism), and performs the function of discharging the used mask 15 by the transfer robot when replacing the mask 15, receiving a new mask 15, and lifting and lowering the mask holding unit 22 until the mask 15 is placed on the mask stage 25 after the mask alignment process.

[0040] The control unit 29 controls the alignment stage drive motor 301, the substrate lift drive motor 311, the cooling plate lift drive motor 321, and the mask lift drive motor 331, thereby controlling the operations of the alignment stage 30, the substrate Z-axis lift mechanism 31, the cooling plate Z-axis lift mechanism 32, and the mask Z-axis lift mechanism 33. The operations of the alignment stage 30, the substrate Z-axis lift mechanism 31, the cooling plate Z-axis lift mechanism 32, and the mask Z-axis lift mechanism 33 in the following description are performed under the control of the control unit 29. In FIG. 3, the connection lines between the control unit 29 and the components to be controlled are omitted to avoid cluttering the drawing. The control unit 29 can store information in a storage unit 291 constituted by a non-volatile memory or the like, and can acquire information stored in the storage unit 291.

[0041] <Mask alignment> The mask 15 alignment process will be described with reference to Fig. 4. When it is time to replace the mask 15, the mask Z-axis lifting mechanism 33 drives the mask holding unit 22 in the Z-axis direction to lift the used mask 15 from the deposition position on the mask stage 25 to a discharge position where the transfer robot can receive the mask 15. The transfer robot receives the used mask 15 from the mask holding unit 22, discharges it outside the vacuum chamber, carries a new mask 15 into the vacuum chamber, and hands the new mask 15 to the mask holding unit 22 remaining at the discharge position.

[0042] 4(d) and 4(e), an alignment camera 40 installed on the outer upper surface of the vacuum chamber 20 is used to capture an image of the mask mark 16, which is an alignment mark of the mask 15 placed on the mask holding unit 22. As shown in FIG. 4(e), the alignment camera 40 can output an image of a virtual alignment mark 412 used for alignment with the mask mark 16, synthesized within image data 42 obtained by capturing the image. In other words, it is possible to make the virtual alignment mark 412 appear in the FOV of the alignment camera 40, and image data including an image of the subject and an image of the virtual alignment mark 412 can be output.

[0043] Image data 42 obtained by photographing with alignment camera 40 is sent to control unit 29, which performs image processing on the received image data 42 to measure the relative positions of virtual alignment mark 412 and mask mark 16. Based on the measurement results, mask holding unit 22 is moved in the XYθ directions by alignment stage 30 to adjust the position of mask 15. At this time, cooling plate Z-axis lifting mechanism 32 on which cooling plate 23 / magnet plate 24 are installed is installed separately and independently from alignment stage 30, so In addition, the positions of the cooling plate 23 / magnet plate 24 can be adjusted by moving them relative to the mask 15 held by the mask holding unit 22. Note that the shapes of the virtual alignment mark 412 and the mask mark 16 shown in Fig. 4(e) are merely examples and are not limited thereto. The virtual alignment mark 412 is configured in advance so that the mask 15 can be aligned with the cooling plate 23 and magnet plate 24 by aligning the virtual alignment mark 412 with the mask mark 16.

[0044] As shown in FIG. 4(a) and FIG. 4(b), the alignment mark 411 of the alignment mark plate 41 installed on the lower surface of the cooling plate 23 or the upper surface of the magnet plate 24 and the mask mark 16, which is the alignment mark of the mask 15 placed on the mask holding unit 22, can be photographed by the alignment camera 40 to perform mask alignment. In this case, as shown in FIG. 4(c), the image data 42 obtained by the image pickup by the alignment camera 40 is photographed so that both the alignment mark 411 and the mask mark 16 are included in the image data 42. The image data 42 is transmitted to the control unit 29, and the control unit 29 performs image processing on the received image data 42 to measure the relative positions of the alignment mark 411 and the mask mark 16. In the example of FIG. 4(c), the planar shape of the alignment mark plate 41 is a convex shape, and the alignment mark 411 formed on the alignment mark plate 41 is formed by a circular opening, but the configuration of the alignment mark plate 41 and the alignment mark 411 is not limited to this. The mask mark 16 is a cross-shaped pattern formed on the frame of the mask 15, but the configuration of the mask mark 16 is not limited to this example. A plurality of mask marks 16 and a plurality of alignment marks 411 may be provided on the mask 15 and the cooling plate 23. In this case, a plurality of alignment cameras 40 are provided at positions corresponding to the positions of the alignment marks 411 and the mask marks 16, and mask alignment is performed based on a plurality of image data output from the plurality of alignment cameras 40, thereby enabling more accurate alignment.

[0045] If it is found based on the photographing results of the alignment marks that the relative positions of the cooling plate 23 / magnet plate 24 and the mask 15 placed on the mask holding unit 22 are misaligned in the X, Y, and θ directions, the mask holding unit 22 is moved in the X, Y, and θ directions by the alignment stage 30 to adjust the position of the mask 15 relative to the cooling plate 23 / magnet plate 24. At this time, the cooling plate Z-axis lifting mechanism 32 on which the cooling plate 23 / magnet plate 24 is installed is installed separately and independently from the alignment stage 30, so that the cooling plate 23 / magnet plate 24 can be moved relative to the mask 15 held by the mask holding unit 22 to adjust their positions.

[0046] When the alignment mark plate 41 is installed on the upper surface of the magnet plate 24, it is easy to install it on the magnet plate 24 and the installation position can be accurately determined. In contrast, when the alignment mark plate 41 is installed on the lower surface of the cooling plate 23, the alignment mark plate 41 must be embedded in the lower surface side of the cooling plate 23, which makes the installation more complicated, but since it can be installed closer to the mask mark 16 of the mask 15 on which the alignment camera 40 is focused, the recognition accuracy of the alignment mark by the alignment camera 40 can be improved.

[0047] The control unit 29 stores the position of the mask mark 16 in image data 42 captured in the mask alignment process, which is the alignment of the mask 15 and the cooling plate 23. The image data 42 corresponds to the field of view of the alignment camera 40. As shown in FIG. 5(a), the control unit 29 stores, for example, the coordinates (x1, y1) of the center point of the mask mark 16 as the position of the mask mark 16. Note that the control unit 29 may determine a search area, which will be described later, based on the position of the mask mark 16 in the image data 42, and store the position and size of the search area.

[0048] When the mask alignment is completed, the mask holding unit 22 is lowered by the mask Z-axis lifting mechanism 33 to lower the mask 15 from the discharge position to the deposition position on the mask table 25, and then the mask 15 is placed on the mask table 25. Through the above-described mask alignment process, the positions of the mask 15 and the cooling plate 23 / magnet plate 24 can be adjusted relatively.

[0049] <Substrate alignment> When the substrate 10 is carried into the vacuum chamber 20 of the film forming apparatus 2 by the transfer robot 14 of the transfer chamber 13 and placed on the substrate holding unit 21 waiting at the carry-in position, the substrate Z-axis lift mechanism 31 moves the substrate holding unit 21 down in the Z-axis direction to a measurement position at a fixed height above the mask 15. Then, as shown in Fig. 6, the alignment camera 40 photographs the alignment mark 17 (substrate mark) of the substrate 10 held by the substrate holding unit 21 and the alignment mark 16 (mask mark) of the mask 15 placed on the mask table 25. The image data obtained by the imaging by the alignment camera 40 is transmitted to the control unit 29, and the control unit 29 performs image processing on the received image data to measure the relative positions of the substrate mark 17 and the mask mark 16.

[0050] The alignment between the substrate 10 and the mask 15 (substrate alignment) will now be described. Fig. 7(A) is a top view of the substrate 10. Substrate marks 17a, 17b, 17c, and 17d (collectively referred to as substrate marks 17 as appropriate) are provided at the four corners of the substrate 10. The substrate marks 17a to 17d are simultaneously imaged by four corresponding alignment cameras 40a to 40d (collectively referred to as alignment cameras 40 as appropriate), and the positions of the center points of the substrate marks 17a to 17d are obtained based on the images captured. Positional information of the substrate 10 can be obtained from the positional relationship of the four points.

[0051] FIG. 7(B) is a top view of the mask 15. The mask 15 has a structure in which a mask foil 15b having a thickness of several μm to several tens of μm is welded and fixed to a frame-shaped mask frame 15a. The mask frame 15a supports the mask foil 15b so that the mask foil 15b does not bend when the mask foil 15b is pulled in its surface direction (X direction and Y direction). The mask foil 15b has a boundary portion where an opening corresponding to a pattern to be formed on the substrate 10 is formed, and when the mask 15 is placed on the substrate 10, the boundary portion is in close contact with the substrate 10 to block the film forming material flying toward the substrate 10 due to evaporation or sputtering. When a glass substrate or a substrate on which a resin film such as polyimide is formed on a glass substrate is used as the substrate 10, the main material of the mask frame 15a and the mask foil 15b can be iron or an iron alloy, for example, an iron alloy containing nickel.

[0052] Mask marks 16a, 16b, 16c, and 16d (collectively referred to as mask marks 16 as appropriate) are provided on the four corners of the mask frame 15a. Each of the mask marks 16a to 16d is imaged by the corresponding one of the four alignment cameras 40a to 40d, and the position of the center point of each of the mask marks 16a to 16d is obtained based on the image. Position information of the mask 15 can be obtained from the positional relationship of the four points. Note that the positions and numbers of the board mark 17, the mask mark 16, and the alignment cameras 40 are not limited to this example. In addition to the board mark 17, the board 10 may be provided with an alignment mark (angle mark) for angle adjustment.

[0053] 7C is a diagram showing a schematic diagram of the visual field 44 of the alignment camera 40 and a pair of the board mark 17 and the mask mark 16 captured within the visual field 44. If both the board mark 17 and the mask mark 16 are simultaneously within the visual field 44 of the alignment camera 40, the board mark 17 and the mask mark 16 are determined based on image data obtained by capturing an image of the visual field 44. The positional relationship of the center points can be obtained. The coordinates of the center points of the board mark 17 and the mask mark 16 are obtained by image processing executed by the control unit 29 based on image data obtained by imaging with the alignment camera 40. The image processing may be performed by an image processing device provided separately from the control unit 29. The shapes of the board mark 17 and the mask mark 16 are not limited to the square and cross shapes exemplified in Fig. 7, but it is preferable to use, as the alignment marks, shapes such as an x ​​mark or a circle that have symmetry and make it easy to calculate the center position.

[0054] The alignment cameras 40 are installed at positions where they can capture images of the substrate marks 17 provided on the substrate 10 and the mask marks 16 provided on the mask 15, both of which are supported inside the vacuum chamber 20. When aligning the substrate 10 and the mask 15, the substrate marks 17 and the mask marks 16 are included within the imaging field of the alignment cameras 40. The control unit 29 acquires the positions of the substrate 10 and the mask 15 based on image data including the images of the substrate marks 17 and the mask marks 16 captured by the alignment cameras 40, and measures the relative positional relationship between the substrate 10 and the mask 15 in the direction along the film formation surface of the substrate 10.

[0055] The control unit 29 analyzes the image data 43 captured by the alignment camera 40 to detect the board mark 17 and the mask mark 16, and obtains the positions of the board mark 17 and the mask mark 16. If dirt is present on the surface of the board 10, noise images 19a and 19b corresponding to the dirt will be present in the image data 43, as shown in FIG. 5(b). In this case, there is a possibility that the noise images 19a and 19b will be erroneously detected as mask marks in image processing. If this occurs, the accurate position of the mask mark 16 cannot be obtained, and as a result, the alignment between the board 10 and the mask 15 cannot be performed with high accuracy.

[0056] Therefore, in the first embodiment, the control unit 29 stores the position (x1, y1) of the mask mark 16 detected in the image data 42 shown in FIG. 5(a) captured in the mask alignment process. Then, based on the position of the mask mark 16, a mask mark search area 160 is set to search for the mask mark 16 in the image data 43 captured in the substrate alignment process. The mask mark search area 160 can be, for example, a rectangular area having a predetermined width ΔX in the X direction and a predetermined width ΔY in the Y direction centered on the position (x1, y1) of the mask mark 16. Note that the method of setting the mask mark search area 160 (size and shape) is not limited to this example, and for example, a circular or elliptical area centered on the position (x1, y1) of the mask mark 16 may be set.

[0057] The control unit 29 searches for the mask mark 16 only in the mask mark search area 160 of the image data 43 captured in the substrate alignment process. The method of searching for the mask mark 16 can be, for example, image processing of pattern matching that searches for a position having the highest correlation value with the model image of the mask mark 16.

[0058] As shown in FIG. 8, image data (e.g., luminance data for each pixel) of an area in the search area 160 having the same size as the reference model image 310 is compared with data (e.g., luminance data for each pixel) of the reference model image 310, and a correlation value between these images (e.g., a parameter value representing the degree to which the luminance data of all pixels in the reference model image 310 and the area in the search area 160 match) is calculated. If the calculated correlation value exceeds a predetermined threshold value and there is a sufficient correlation, it is determined that the mask mark 16 corresponding to the reference model image 310 is present in the search area 160. If the calculated correlation value does not reach the predetermined threshold value (i.e., if it is determined that the image of the area in the search area 160 does not match the reference model image 310 sufficiently), the area in the search area 160 is moved by one pixel on the XY plane, and the same process is repeated for other areas in the search area 160 to determine whether the reference model image 310 is present in the search area 160. If there are multiple regions in the search region 160 whose correlation value with the reference model image 310 exceeds a threshold, the position of the region with the largest correlation value can be identified as the position of the mask mark 16 corresponding to the reference model image 310.

[0059] In this case, the reference model image 310 of the mask mark 16 used can be created by artificially synthesizing it using software based on the design data of the mask mark 16 (size, shape, etc.) (artificial image model), or it can be created by taking real images of the alignment marks of the substrate 10 or mask 15 with a camera, extracting the brightness data for each pixel, and storing this in a memory means (real image model).

[0060] Since the position of the alignment camera 40 is fixed and its focus is adjusted to the deposition position, the mask mark 16 on the image captured by the alignment camera 40 has a different shape (e.g., size) depending on the position (height) of the substrate 10 (depending on whether the substrate 10 is at the deposition position or the measurement position), and the degree of focus is different. Therefore, it is possible to create reference model images 310 at both the measurement position and the deposition position, and determine whether to apply the real image model or the artificial image model depending on the degree of focus. Note that the method of searching for the mask mark 16 is not limited to the above example.

[0061] Even if noise images 19a and 19b are present in the image data 43 obtained by capturing the mask 15 and the substrate 10 by the alignment camera 40 due to the presence of dirt on the substrate 10, the noise image is not present in the mask mark search area 160, or even if it is present, it is a very small noise image that does not pattern match the mask mark search area 160 and the reference model image 310, so that it is possible to suppress erroneous detection of the noise images 19a and 19b as mask marks. This allows the mask mark 16 to be detected with high accuracy, and as a result, the substrate 10 and the mask 15 can be aligned with high accuracy. In addition, since the size of the search area for the mask mark 16 is limited to the size of the mask mark search area 160, the load of image processing required for detecting the mask mark can be reduced compared to the case where the mask mark 16 is searched for in the entire image data 43, and the processing speed can be improved.

[0062] The process of setting the mask mark search region 160 in the image data 43 may be executed during the period from when the substrate 10 is carried into the vacuum chamber 20 until the substrate holding unit 21 is lowered in the Z-axis direction by the substrate Z-axis lifting mechanism 31 and moves to a measurement position at a determined height above the mask 15. By doing so, the mask mark search region 160 will have been determined at the time when the substrate 10 reaches the measurement position and the alignment camera 40 photographs the substrate mark 17 and the mask mark 16. Therefore, as soon as the alignment camera 40 obtains the image data 43, image processing for searching for the mask mark 16 within the mask mark search region 160 can be started, and the alignment processing time can be further shortened.

[0063] The control unit 29 acquires the relative positional relationship between the substrate mark 17 and the mask mark 16 in a direction along the XY plane parallel to the film formation surface of the substrate 10, based on the positional information of the substrate mark 17 and the mask mark 16 acquired based on the analysis of the image data 43. The information on the relative positional relationship is, for example, the distance and angle between the substrate mark 17 and the mask mark 16. The control unit 29 calculates the movement amounts of the substrate 10 in the X, Y and θZ directions to bring the substrate mark 17 and the mask mark 16 closer to each other, based on the relative positional relationship between the substrate mark 17 and the mask mark 16. The control unit 29 converts the calculated movement amounts in the X, Y and θZ directions into the drive amount of the alignment stage drive motor 301 of the alignment stage 30, and outputs a control signal. As a result, the relative positions of the substrate 10 and the mask 15 move within the XY plane. At this time, the substrate 10 and The distance of the mask 15 in the Z direction does not change, but the position changes in the XY plane. The XY plane is a plane parallel to the deposition surface of the substrate 10 in an ideal state without bending, and in this embodiment, it is parallel to the horizontal plane. The alignment stage 30, the alignment camera 40, and the control unit 29 constitute an alignment device that performs alignment to adjust the relative positions of the substrate 10 and the mask 15 in the XY plane parallel to the deposition surface of the substrate 10 based on the measurement result of the relative positional relationship between the substrate 10 and the mask 15 in the direction along the deposition surface of the substrate 10 when the substrate 10 and the mask 15 are in a separated state.

[0064] In the first embodiment, an example of performing alignment using one type of alignment camera 40 has been described, but alignment can also be performed using two or more types of cameras with different magnifications and fields of view. For example, there is an alignment method using a camera with a relatively wide field of view but low magnification (low resolution) and a camera with a relatively narrow field of view but high magnification (high resolution). First, a rough alignment is performed using a low magnification camera to roughly adjust the positions of the board mark 17 and the mask mark 16 so that both are within the field of view of the high magnification camera, and then a fine alignment is performed using a high magnification camera to highly accurately adjust the positions of the board mark 17 and the mask mark 16. In the rough alignment, the mask 15 and the board 10 are held in a separated state that does not contact each other even when bending is taken into consideration, and in the fine alignment, the mask 15 and the board 10 are held in a state close enough to contact each other, and alignment can also be performed. Of the rough alignment and fine alignment, in the case of alignment performed using an alignment camera having the same field of view as the alignment camera 40 used in the previously performed mask alignment, the search process for the mask mark 16 can be performed after setting the mask mark search area 160 as described above.

[0065] In the above substrate alignment, an example has been described in which the positional relationship between the substrate 10 and the mask 15 is measured and aligned based on the images of the substrate mark 17 and the mask mark 16 in the image data 43 captured by the alignment camera 40, but in the substrate alignment, as shown in Fig. 5(c), a virtual alignment mark 412 may be configured to appear in the FOV of the alignment camera 40, and the positional relationship between the substrate 10 and the mask 15 may be measured and aligned based on the images of the virtual alignment mark 412 in the image data 43 and the mask mark 16 that actually exists on the mask 15. In this case, the correspondence between the position of the virtual alignment mark 412 appearing in the FOV of the alignment camera 40 and the position of the substrate 10 is previously obtained based on the configuration of the film forming apparatus 2, such as the positional relationship between the substrate holding unit 21 that holds the substrate 10 and the alignment camera 40, so that substrate alignment based on the virtual alignment mark 412 and the mask mark 16 can be performed. Even when the virtual alignment mark 412 is used in this way, as shown in Fig. 4(c), noise images 19a and 19b may appear in the image data 43 due to the presence of dirt or scratches on the substrate 10. In response to this, a search area 160 is set based on the position of the mask mark 16 in the image data 42 obtained by shooting during mask alignment shown in Fig. 4(a), and the search for the mask mark 16 is limited to the search area 160 in the image data 43, thereby preventing the noise images 19a and 19b from being erroneously recognized as mask marks. In addition, the load of image processing required for searching for the mask mark 16 can be reduced, and the processing time required for substrate alignment can be shortened.

[0066] In the first embodiment, the alignment stage 30 is driven to align the substrate 10 with the mask 15 in a separated state in which the substrate 10 and the mask 15 are held at a predetermined position where they do not come into contact with each other, taking into consideration bending. The position of the substrate 10 in the Z direction when alignment is performed is referred to as the alignment position. After the alignment of the substrate 10 and the mask 15 is completed, the substrate 10 is lowered and placed on the mask 15, switching to a placement state in which the substrate 10 and the mask 15 are in close contact with each other. The position of the substrate 10 in the Z direction at this time is referred to as the mask placement position. The alignment camera 40 measures the position of the substrate 10 when it is in the alignment position and when it is in the mask placement position. The control unit 29 captures images of the board mark 17 and the mask mark 16 when they are in at least two positions when the substrate 10 is placed on the mask 15. The control unit 29 captures images of the board mark 17 and the mask mark 16 with the alignment camera 40 at the alignment position in which they are separated, and performs alignment based on the captured images. After the alignment is completed, the control unit 29 captures images of the board mark 17 and the mask mark 16 with the alignment camera 40 at the mask placement position in which they are placed, and checks based on the captured images whether or not misalignment has occurred due to contact between the substrate 10 and the mask 15 or the like in the process of placing the substrate 10 on the mask 15. If misalignment has occurred, alignment is performed again at the alignment position.

[0067] In the process of carrying the substrate 10 into the vacuum chamber 20 of the film forming apparatus 2, if the substrate 10 is placed misaligned on the substrate holding unit 21 due to a transport error by the transport robot 14, a relative positional deviation occurs between the substrate 10 and the mask 15 placed on the mask table 25. In this case, the alignment stage 30 to which the substrate holding unit 21 is connected is moved in the XYθ directions to adjust the relative positions of the substrate 10 and the mask 15. Even if the alignment stage 30 is moved in the XYθ directions to adjust the position of the substrate 10 relative to the mask 15 on the mask table 25 in this way, in the first embodiment, since the cooling plate Z-axis lifting mechanism 32 is separated from the alignment stage 30 and independently fixed to the outer upper surface of the vacuum chamber 20, the cooling plate Z-axis lifting mechanism 32 does not move in the XYθ directions, and the positional adjustment state between the cooling plate 23 / magnet plate 24 and the mask 15 at the time of completion of mask alignment can be maintained.

[0068] In addition, if the substrate 10 is placed on the substrate holding unit 21 at a position that is shifted relative to the cooling plate 23 due to an error in the transportation of the substrate 10 by the transport robot 14, the position of the substrate 10 can be adjusted relative to the mask 15 on the mask table 25, thereby making it possible to adjust the position between the cooling plate 23, whose position has been adjusted relative to the mask 15 on the mask table 25 through the mask alignment process, and the substrate 10.

[0069] When the alignment of the substrate 10 with respect to the mask 15 is completed, the substrate holding unit 21 descends onto the mask 15 by the substrate Z-axis lifting mechanism 31, and lowers the substrate 10 onto the mask 15. This switches the substrate 10 to a placed state in which it is placed on the mask 15. The substrate Z-axis lifting mechanism 31 is a moving means that moves the substrate 10 in a direction intersecting the film formation surface so as to switch between the separated state and the placed state. In the first embodiment, the movement direction of the substrate 10 is approximately parallel to the Z direction.

[0070] Next, the cooling plate Z-axis lifting mechanism 32 is driven to lower the cooling plate 23 and the magnet plate 24 and place them on the upper surface of the substrate 10. At this time, the metallic mask 15 is subjected to an attractive force by the magnetic force of the magnet plate 24, so that the substrate 10 and the mask 15 come into close contact with each other.

[0071] According to the first embodiment, when aligning the substrate 10 and the mask 15, even if the image data obtained by the alignment camera 40 contains noise components due to contamination of the substrate 10, etc., it is possible to detect the alignment mark accurately and quickly. Therefore, the alignment between the substrate 10 and the mask 15 can be performed with high accuracy.

[0072] In the first embodiment, an example was described in which, after performing mask alignment between the mask 15 and the cooling plate 23, substrate alignment between the substrate 10 and the mask 15 is performed, the mask mark search area 160 during substrate alignment is set based on the position of the mask mark 16 measured during mask alignment, but the present invention is not limited to this example.

[0073] For example, the present invention can be applied to a film forming apparatus having a configuration in which a substrate is held by a substrate carrier and the substrate carrier is transported by using rollers or a linear motor. In this case, when the substrate is placed on the substrate carrier, the operation of the hand transporting the substrate and the position of the substrate are controlled by the movement of the hand transporting the substrate and the position of the substrate. The positions of the substrate and the substrate carrier may deviate from the expected positions due to contact with the substrate carrier or the like. Therefore, an alignment camera can be used to photograph an alignment mark (substrate mark) provided on the substrate and an alignment mark (carrier mark) provided on the substrate carrier, and the obtained image data can be analyzed to perform alignment to correct the positional deviation between the substrate and the substrate carrier. Even in this case, if dirt is attached to the substrate or the substrate carrier, the dirt may be erroneously detected as an alignment mark. Therefore, prior to the alignment between the substrate and the substrate carrier, an image is captured in a state where only the substrate mark or the carrier mark is in the field of view of the alignment camera, and a search area is set based on the position of the detected substrate mark or carrier mark, and when aligning the substrate and the substrate carrier, image processing can be performed to search for the substrate mark or carrier mark within the search area limited to the image data obtained by the image capture. This can suppress erroneous detection of dirt as an alignment mark, and shorten the time required for image processing to search for the substrate mark or carrier mark.

[0074] Similarly, by applying the present invention to an alignment device that performs various alignments, such as alignment between an electrostatic chuck that attracts a substrate and a substrate, or alignment between a mask table on which a mask is placed in a vacuum chamber and a mask, the alignment accuracy can be improved and image processing can be accelerated. That is, the present invention can be applied to an alignment device that detects the positions of the first alignment mark and the second alignment mark from first image data obtained by photographing a first alignment mark provided on a first member and a second alignment mark provided on a second member, and adjusts the relative position between the first member and the second member based on the detection result. In this case, based on the second image data obtained by photographing only the first alignment mark, a partial area of ​​the first image data is set as a search area, and the first alignment mark is detected in the search area of ​​the first image data. The present invention can also be applied to an alignment device that uses an alignment camera capable of photographing an alignment mark that appears in the FOV and photographs the alignment mark installed on one of two members to be aligned, and aligns the two members based on the virtual alignment mark in the FOV and the alignment mark on the photographed member. That is, the present invention can be applied to an alignment device that aligns a first member and a second member, detects an alignment mark installed on the first member from first image data obtained by photographing the first member and the second member, and adjusts the relative position of the first member and the second member based on the detection result. In this case, a part of the first image data is set as a search area based on the position of the alignment mark of the first member in the second image data obtained by photographing only the first member, and detects the alignment mark in the search area of ​​the first image data.

[0075] The search area is not limited to the method of setting based on the second image data obtained by photographing only the first alignment mark. The position and size of the area in the first image data where the first alignment mark is likely to exist can be predicted to some extent in advance from information on the position of the first alignment mark on the first member. The predicted area where the first alignment mark is likely to exist may be set as the search area. In this case, the step of photographing only the first alignment mark prior to the alignment of the first member and the second member is not necessarily required. Information on the position and size of the area where the first alignment mark is likely to exist in the first image data may be stored in advance in a storage means 291 such as a non-volatile memory, and the control unit 29 may detect the first alignment mark from the first image data using the information on the search area obtained from the storage means 291. In the above embodiment, the information on the position (x1, y1) of the mask mark 16 detected during the preceding mask alignment is stored in the storage means 291, and the search area 160 is set based on the position information of the mask mark 16 read from the storage means 291 during substrate alignment, but the present invention is not limited to this example. For example, the search area 160 may be determined based on the position information of the mask mark 16 during mask alignment, and the information on the search area 160 may be stored in the storage means 291. In this case, the information on the search area 160 may be obtained from the storage means 291 during substrate alignment to perform detection processing of the mask marks 16.

[0076] <Electronic device manufacturing method> Next, an example of a method for manufacturing an electronic device using the film forming apparatus of this embodiment will be described below. As an example of the electronic device, the configuration of an organic EL display device and a method for manufacturing the same will be described.

[0077] First, the organic EL display device to be manufactured will be described. FIG. 9(a) is a general view of an organic EL display device 60, and FIG. 9(b) shows a cross-sectional structure of one pixel. As shown in FIG. 9(a), a plurality of pixels 62 each having a plurality of light-emitting elements are arranged in a matrix in a display area 61 of the organic EL display device 60. Although details will be described later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. Note that the pixel referred to here refers to the minimum unit that allows a desired color to be displayed in the display area 61. In the case of the organic EL display device according to this embodiment, the pixel 62 is configured by a combination of a first light-emitting element 62R, a second light-emitting element 62G, and a third light-emitting element 62B that emit light different from each other. The pixel 62 is often configured by a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited as long as it is at least one color.

[0078] FIG. 9(b) is a schematic partial cross-sectional view taken along line AB in FIG. 9(a). The pixel 62 has an organic EL element including a first electrode (anode) 64, a hole transport layer 65, any one of the light-emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68 on a substrate 63. Among these, the hole transport layer 65, the light-emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to organic layers. In this embodiment, the light-emitting layer 66R is an organic EL layer that emits red light, the light-emitting layer 66G is an organic EL layer that emits green light, and the light-emitting layer 66B is an organic EL layer that emits blue light. The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to the light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. The first electrode 64 is formed separately for each light-emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. In order to prevent the first electrode 64 and the second electrode 68 from being shorted by foreign matter, an insulating layer 69 is provided between the first electrodes 64. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 70 is provided to protect the organic EL element from moisture and oxygen.

[0079] 9(b), the hole transport layer 65 and the electron transport layer 67 are shown as a single layer, but may be formed of multiple layers including a hole blocking layer and an electron blocking layer depending on the structure of the organic EL display element. In addition, a hole injection layer having an energy band structure that can smoothly inject holes from the first electrode 64 to the hole transport layer 65 can be formed between the first electrode 64 and the hole transport layer 65. Similarly, an electron injection layer can be formed between the second electrode 68 and the electron transport layer 67.

[0080] Next, an example of a method for manufacturing an organic EL display device will be specifically described. First, a substrate 63 on which a circuit (not shown) for driving the organic EL display device and a first electrode 64 are formed is prepared.

[0081] An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by lithography so as to form an opening in the portion where the first electrode 64 is formed, thereby forming an insulating layer 69. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0082] The substrate 63 with the patterned insulating layer 69 is carried into a first organic material film forming apparatus, the substrate is held by a substrate holding unit, and a hole transport layer 65 is formed as a common layer on the first electrodes 64 in the display area. The hole transport layer 65 is formed by vacuum deposition. In practice, the hole transport layer 65 is formed to be larger than the display area 61, so that a high-definition mask is not required.

[0083] Next, the substrate 63 on which the hole transport layer 65 has been formed is carried into a second organic material film forming apparatus and held by a substrate holding unit. The substrate and a mask are aligned, the substrate is placed on the mask, and a red light emitting layer 66R is formed on the portion of the substrate 63 where the red light emitting element is to be disposed.

[0084] According to this embodiment, by separating / independently configuring the cooling plate Z-axis lifting mechanism 32, which raises and lowers the cooling plate / magnet plate of the film formation apparatus, from the alignment stage 30, the relative positions between the cooling plate / magnet plate, substrate, and mask can be effectively adjusted even when the alignment stage 30 is driven to perform position correction in order to eliminate a transport error by the transport robot 14, thereby effectively reducing film formation defects.

[0085] Similar to the formation of the light-emitting layer 66R, a light-emitting layer 66G that emits green light is formed by a third organic material film formation apparatus, and further a light-emitting layer 66B that emits blue light is formed by a fourth organic material film formation apparatus. After the formation of the light-emitting layers 66R, 66G, and 66B is completed, an electron transport layer 67 is formed over the entire display area 61 by a fifth film formation apparatus. The electron transport layer 67 is formed as a layer common to the three light-emitting layers 66R, 66G, and 66B.

[0086] The substrate on which the electron transport layer 67 has been formed is moved in a metallic deposition material deposition apparatus to deposit a second electrode 68. Thereafter, the substrate is moved to a plasma CVD apparatus to deposit a protective layer 70, and the organic EL display device 60 is completed.

[0087] If the substrate 63 on which the insulating layer 69 is patterned is exposed to an atmosphere containing moisture or oxygen from the time when it is carried into the film forming apparatus until the formation of the protective layer 70 is completed, the light emitting layer made of an organic EL material may be deteriorated by moisture or oxygen. Therefore, in this example, the substrate is carried in and out of the film forming apparatus in a vacuum atmosphere or an inert gas atmosphere.

[0088] The above embodiment is merely an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, and may be modified appropriately within the scope of the technical concept thereof. [Explanation of symbols]

[0089] 10: substrate, 15: mask, 16: mask mark, 17: substrate mark, 29: control unit, 30: alignment stage, 40: alignment camera, 160: search area

Claims

1. An alignment device for aligning a first member and a second member, An imaging means capable of imaging the first member and the second member, A detection means for detecting the first alignment mark from a first image obtained by imaging the first member and the second member, which are provided with the first alignment mark, using the imaging means, A position adjustment means for adjusting the relative position of the first member and the second member based on the position of the first alignment mark detected by the detection means, It has, The alignment device is characterized in that the detection means sets a portion of the first image as a search area and detects the first alignment mark within the search area.

2. The imaging means composites an image of virtual alignment marks onto the first image obtained by imaging and outputs it. The detection means detects the first alignment mark and the virtual alignment mark included in the first image, The alignment device according to claim 1, wherein the position adjustment means adjusts the relative position of the first member and the second member based on the positions of the first alignment mark and the virtual alignment mark detected by the detection means.

3. The detection means detects the first alignment mark and the second alignment mark from the first image obtained by imaging the first member on which the first alignment mark is provided and the second member on which the second alignment mark is provided using the imaging means. The alignment device according to claim 1, wherein the position adjustment means adjusts the relative position of the first member and the second member based on the positions of the first alignment mark and the second alignment mark detected by the detection means.

4. The detection means detects the first alignment mark from a second image obtained by imaging the first member on which the first alignment mark is provided using the imaging means. The detection means, based on the position of the first alignment mark in the second image, The alignment device according to any one of claims 1 to 3, which sets the search area in the first image.

5. The system has a storage means for storing information about the position of the first alignment mark detected from the second image, The alignment device according to claim 4, wherein the detection means sets the search area in the first image based on the position of the first alignment mark in the second image acquired from the storage means.

6. The alignment apparatus according to any one of claims 1 to 3, wherein the detection means detects the first alignment mark by pattern matching with a model image corresponding to the first alignment mark within the search area.

7. The alignment device includes a conveying means for transporting the first member, A moving means for moving the first member, which has been brought in, to a measurement position where imaging can be performed by the imaging means, with respect to the second member placed in the alignment device, It has, The alignment apparatus according to any one of claims 1 to 3, wherein the detection means performs the process of setting the search area between the time the first member is brought in by the transport means and the time the first member is moved to the measurement position by the moving means.

8. The alignment apparatus according to any one of claims 1 to 3, wherein the first member is a mask, and the second member is a substrate on which a film-forming material is formed via the mask.

9. The alignment apparatus according to any one of claims 1 to 3, wherein the first member is a substrate, and the second member is a substrate carrier on which the substrate is placed and for transporting the substrate.

10. The alignment apparatus according to any one of claims 1 to 3, wherein the first member is a substrate and the second member is an electrostatic chuck for adsorbing the substrate.

11. The alignment device according to any one of claims 1 to 3, wherein the first member is a mask and the second member is a mask stand on which the mask is placed.

12. An imaging step of imaging a first member and a second member on which a first alignment mark is provided, A detection step for detecting the first alignment mark from the first image obtained by the imaging step, A position adjustment step is performed to adjust the relative positions of the first member and the second member based on the position of the first alignment mark detected in the detection step, An alignment method having, The alignment method is characterized in that, in the detection step, a portion of the first image is set as a search area, and the first alignment mark is detected within the search area.

13. The alignment device according to claim 8, A film deposition source for forming a thin film on the aforementioned substrate, A film deposition apparatus characterized by having a mask whose relative position is adjusted by the alignment device, and forming a thin film on the substrate with the film deposition source via the mask.

14. A method for manufacturing an electronic device, characterized by manufacturing an electronic device using the film deposition apparatus described in Claim 13.

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