Cooling system in magnetron sputtering coating equipment
By implementing independent circulating cooling for the rotating cathode, gas supply components, and top plate of the vacuum coating chamber in the magnetron sputtering equipment, the problem of uneven gas supply was solved, thereby improving coating quality and equipment stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHENJIANG DELIKE VACUUM EQUIP TECH CO LTD
- Filing Date
- 2025-04-24
- Publication Date
- 2026-05-19
AI Technical Summary
Existing magnetron sputtering equipment lacks effective cooling of the gas supply components, resulting in uneven gas supply, which affects coating quality and equipment stability.
A cooling system was designed, including a main water supply pipe and a main water return pipe, which independently circulate and cool the rotating cathode, the gas supply assembly, and the top plate of the vacuum coating chamber, respectively. The gas supply plate is cooled by a serpentine cooling channel and cooling pipes.
Effective cooling of the rotating cathode, gas supply components, and vacuum coating chamber top plate was achieved, improving coating quality and equipment stability, and ensuring uniform gas supply and the sealing performance of the vacuum coating chamber.
Smart Images

Figure CN224258758U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of magnetron sputtering coating equipment, and in particular to a cooling system in a magnetron sputtering coating equipment. Background Technology
[0002] Magnetron sputtering is a coating technique that increases plasma density and sputtering rate by introducing a magnetic field on the surface of a target cathode and using the magnetic field to confine charged particles. It is mainly used to prepare thin films of various materials such as metals, semiconductors, and insulators.
[0003] During magnetron sputtering, the ion beam bombarding the target surface generates a large amount of heat, which can cause the equipment to overheat, thereby affecting the stability of the equipment and the quality of the sputtered coating.
[0004] However, existing magnetron sputtering equipment usually uses circulating cooling water to cool the target core (magnetic rod), but no cooling is provided for other components such as the gas supply component. The lack of cooling will cause the gas supply component to deform at high temperatures, resulting in uneven gas supply to different parts of the workpiece and ultimately affecting the quality of the sputtered coating. Utility Model Content
[0005] The purpose of this invention is to provide a cooling system in a magnetron sputtering coating equipment to solve the problem that uneven gas supply to different parts of the workpiece affects the quality of sputtering coating.
[0006] To solve the above-mentioned technical problems, this utility model provides a cooling system for a magnetron sputtering coating equipment, which provides a cooling medium for the cooling circulation of the rotating cathode, gas supply components and the top plate of the vacuum coating chamber in the magnetron sputtering coating equipment.
[0007] The cooling system includes a main water supply pipe and a main water return pipe. The main water supply pipe has a first water inlet, and the main water return pipe has a first water return outlet. The first water inlet and the first water return outlet form a group, corresponding to a rotating cathode within the coating chamber, where circulating cooling water cools the rotating cathode. The main water supply pipe has a second water inlet, and the main water return pipe has a second water return outlet. The second water inlet and the second water return outlet form a group, corresponding to an air supply assembly on one side of the coating chamber, where circulating cooling water cools the air supply assembly. The main water supply pipe has a third water inlet, and the main water return pipe has a third water return outlet. The third water inlet and the third water return outlet form a group, corresponding to an annular cooling channel on the top plate of the vacuum coating chamber, where circulating cooling water cools the top plate of the vacuum coating chamber.
[0008] Preferably, there are two of each of the first water supply port and the first water return port, which correspond to the two rotating cathodes in the coating chamber, respectively.
[0009] Preferably, a first water supply valve is installed on each of the two first water supply ports to control the cooling water supply to the rotating cathode;
[0010] Each of the two first return water inlets is equipped with a first return water flow meter to monitor the flow rate of cooling water in the rotating cathode.
[0011] Preferably, there are two of each of the second water supply port and the second water return port, which correspond to the air supply components on both sides of the coating chamber, respectively.
[0012] Preferably, a second return water flow meter is installed on each of the two second return water inlets to monitor the flow rate of cooling water in the air supply assembly.
[0013] Preferably, the air supply assembly includes an air supply plate and a cooling plate, which are separated by a carbon film.
[0014] Preferably, the cooling plate has a serpentine cooling channel, through which the cooling medium circulating in the serpentine cooling channel cools and lowers the temperature of the air supply plate.
[0015] Preferably, a cooling pipe is also connected to one side of the cooling plate. The cooling pipe includes an inlet pipe and an outlet pipe, which are respectively connected to the second water supply port and the second water return port through pipes. The cooling medium is introduced through the cooling pipe and circulates in the serpentine cooling channel to cool the air supply plate.
[0016] Compared with the prior art, the beneficial effects of this utility model are:
[0017] The cooling system of this invention can cool the rotating cathode, the gas supply assembly, and the top plate of the vacuum coating chamber in the magnetron sputtering coating equipment, and the three cooling systems are all independently circulating. The cooling of the rotating cathode is necessary to improve the coating quality; the cooling of the gas supply assembly is to prevent deformation of the gas supply plate, thereby ensuring the uniformity of the gas supply; and the cooling of the top plate of the vacuum coating chamber is to prevent deformation of the top plate, thereby ensuring the sealing performance of the vacuum coating chamber. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the structure of a magnetron sputtering coating equipment using the cooling system provided by this utility model;
[0019] Figure 2 This is a front view of a magnetron sputtering coating equipment using the cooling system provided by this utility model;
[0020] Figure 3 This is a top view of a magnetron sputtering coating equipment using the cooling system provided by this utility model;
[0021] Figure 4This is a structural diagram showing the positions of the main water supply pipe and the main water return pipe of the cooling system provided by this utility model;
[0022] Figure 5 This is an exploded view of the gas supply component provided by this utility model;
[0023] Figure 6 This is a cross-sectional view of the cooling plate provided by this utility model.
[0024] In the diagram: 100, Rotating cathode; 200, Gas supply assembly; 300, Vacuum coating chamber top plate; 1, Main water supply pipe; 2, Main return water pipe; 3, First water supply port; 4, First return water port; 5, Second water supply port; 6, Second return water port; 7, Third water supply port; 8, Third return water port; 9, First water supply valve; 10, First return water flow meter; 11, Second return water flow meter; 201, Gas supply plate; 202, Cooling plate; 203, Carbon film; 2021, Serpentine cooling channel; 2022, Cooling pipe. Detailed Implementation
[0025] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description and claims. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.
[0026] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Example
[0028] Please see Figure 1-3 This utility model provides a cooling system for a magnetron sputtering coating equipment, which provides a cooling medium for the cooling circulation of the rotating cathode 100, the gas supply component 200, and the top plate 300 of the vacuum coating chamber in the magnetron sputtering coating equipment.
[0029] For details, please refer to the following: Figure 4 The main water supply pipe 1 is provided with a first water supply port 3, and the main return water pipe 2 is provided with a first water return port 4. The first water supply port 3 and the first water return port 4 form a group, corresponding to a rotating cathode 100 in the coating chamber, and the circulating cooling water cools the rotating cathode 100. The main water supply pipe 1 is provided with a second water supply port 5, and the main return water pipe 2 is provided with a second water return port 6. The second water supply port 5 and the second water return port 6 form a group, corresponding to an air supply component 200 on one side of the coating chamber, and the circulating cooling water cools the air supply component 200. The main water supply pipe 1 is provided with a third water supply port 7, and the main return water pipe 2 is provided with a third water return port 8. The third water supply port 7 and the third water return port 8 form a group, corresponding to an annular cooling channel on the top plate 300 of the vacuum coating chamber, and the circulating cooling water cools the top plate 300 of the vacuum coating chamber.
[0030] In this embodiment, there are two of each of the first water supply port 3 and the first water return port 4, corresponding to the two rotating cathodes 100 in the coating chamber. A first water supply valve 9 is installed on each of the two first water supply ports 3 to control the cooling water supply to the rotating cathodes 100; a first return water flow meter 10 is installed on each of the two first water return ports 4 to monitor the flow rate of the cooling water in the rotating cathodes 100.
[0031] In this embodiment, there are two of each of the second water supply port 5 and the second water return port 6, which correspond to the air supply components 200 on both sides of the coating chamber respectively; a second return water flow meter 11 is installed on each of the two second water return ports 6 to monitor the flow rate of cooling water in the air supply components 200.
[0032] For details, please refer to Figure 5The air supply assembly 200 includes an air supply plate 201 and a cooling plate 202, which are separated by a carbon film 203.
[0033] For further information, please refer to the following: Figure 6 The cooling plate 202 has a serpentine cooling channel 2021, through which the cooling medium circulating in the serpentine cooling channel 2021 cools and lowers the temperature of the air supply plate 201.
[0034] Furthermore, a cooling pipe 2022 is connected to one side of the cooling plate 202. The cooling pipe 2022 includes an inlet pipe and an outlet pipe, which are respectively connected to the second water supply port 5 and the second water return port 6 through pipes. The cooling medium introduced by the cooling pipe 2022 circulates in the serpentine cooling channel 2021 to cool the air supply plate 201.
[0035] The cooling system of this invention can cool the rotating cathode 100, the gas supply assembly 200, and the vacuum coating chamber top plate 300 in the magnetron sputtering coating equipment, and the three cooling systems are all independently circulating. The cooling of the rotating cathode 100 is necessary to improve the coating quality. The cooling of the gas supply assembly 200 is to prevent the gas supply plate 202 from deforming, thereby ensuring the uniformity of the gas supply. The cooling of the vacuum coating chamber top plate 300 is to prevent the top plate from deforming, thereby ensuring the sealing performance of the vacuum coating chamber.
[0036] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.
Claims
1. A cooling system in a magnetron sputtering coating apparatus, providing a cooling medium for the cooling circulation of the rotating cathode (100), the gas supply assembly (200), and the top plate (300) of the vacuum coating chamber in the magnetron sputtering coating apparatus, characterized in that, It includes the main water supply pipe (1) and the main return water pipe (2); The main water supply pipe (1) is provided with a first water supply port (3), and the main return water pipe (2) is provided with a first return water port (4); the first water supply port (3) and the first return water port (4) form a group, corresponding to a rotating cathode (100) in the coating chamber, and the circulating cooling water cools the rotating cathode (100); The main water supply pipe (1) is provided with a second water supply port (5), and the main return water pipe (2) is provided with a second return water port (6); the second water supply port (5) and the second return water port (6) form a group, corresponding to the air supply component (200) on one side of the coating chamber, and the circulating cooling water cools the air supply component (200); The main water supply pipe (1) is provided with a third water supply port (7), and the main return water pipe (2) is provided with a third return water port (8); the third water supply port (7) and the third return water port (8) form a group, corresponding to the annular cooling channel on the top plate (300) of the vacuum coating chamber, and the circulating cooling water cools the top plate (300) of the vacuum coating chamber.
2. A cooling system in a magnetron sputter coating apparatus as defined in claim 1, characterized in that The first water supply port (3) and the first water return port (4) are each provided in two, corresponding to the two rotating cathodes (100) in the coating chamber respectively.
3. A cooling system for a magnetron sputter coating apparatus as defined in claim 2, wherein Each of the two first water inlets (3) is equipped with a first water supply valve (9) to control the cooling water supply to the rotating cathode (100); Each of the two first return water inlets (4) is equipped with a first return water flow meter (10) to monitor the flow rate of cooling water in the rotating cathode (100).
4. A cooling system for a magnetron sputter coating apparatus as defined in claim 1, wherein The second water supply port (5) and the second water return port (6) are each provided in two, corresponding to the air supply components (200) on both sides of the coating chamber respectively.
5. A cooling system for a magnetron sputter coating apparatus as defined in claim 4, wherein Two second return water inlets (6) are each equipped with a second return water flow meter (11) to monitor the flow rate of cooling water in the air supply assembly (200).
6. A cooling system for a magnetron sputter coating apparatus as defined in claim 5, wherein The air supply assembly (200) includes an air supply plate (201) and a cooling plate (202), which are separated by a carbon film (203).
7. A cooling system for a magnetron sputter coating apparatus as defined in claim 6, wherein The cooling plate (202) has a serpentine cooling channel (2021) inside, and the air supply plate (201) is cooled down by the cooling medium circulating in the serpentine cooling channel (2021).
8. A cooling system for a magnetron sputter coating apparatus as defined in claim 7, wherein The cooling plate (202) is also connected to a cooling pipe (2022) on one side. The cooling pipe (2022) includes an inlet pipe and an outlet pipe, which are connected to the second water supply port (5) and the second water return port (6) through pipes respectively. The cooling medium introduced by the cooling pipe (2022) circulates in the serpentine cooling channel (2021) to cool the air supply plate (201).