Substrate cleaning device and substrate polishing device

Abstract

To efficiently remove a particle attached to a substrate after polishing processing.SOLUTION: A substrate cleaning device is provided on a polishing device having: a polishing table that has a polishing surface for performing a substrate polishing; and a top ring that holds a substrate with a membrane while surrounding an outer periphery part of the substrate with a retainer ring to apply a pressure toward the polishing surface. The substrate cleaning device cleans a front surface of the substrate after the polishing, and is provided so as to correspond to a cleaning position of the top ring. The substrate cleaning device comprises: a first injection unit that injects a cleaning liquid toward the substrate at the cleaning position; and a second injection unit that injects the cleaning liquid toward the substrate at the cleaning position. The second injection unit is arranged at a downstream side or an upstream side of the first injection unit with respect to a rotational direction of the top ring at the cleaning position. An injection nozzle constructing the second injection unit is inclined toward the first injection unit. The second injection unit energizes the cleaning liquid injected from the first injection unit toward the outer peripheral part of the substrate.SELECTED DRAWING: Figure 7

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