Temperature adjustment module
JP2024175648AActive Publication Date: 2024-12-18GIGA BYTE TECH CO LTD
Patent Information
- Application Number
- JP2024048225
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-06-06
- Filing Date
- 2024-03-25
- Publication Date
- 2024-12-18
- Estimated Expiration
- 2044-03-25
Smart Images
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Abstract
PURPOSE: To provide a temperature adjustment module that may effectively adjust a temperature of a peripheral circuit element on a mother board.SOLUTION: A temperature adjustment module includes a temperature changing module and a temperature control module. The temperature changing module includes a temperature changing area. The temperature changing module is in contact with a peripheral circuit element on a motherboard through the temperature changing area and a heat conduction material. The temperature control module is electrically connected to the temperature changing module and configured to control a temperature of the temperature changing module to reach a target temperature. The temperature changing module further includes a printed circuit board in the temperature changing area, and the temperature of the temperature changing module is changed by at least one of a winding wire and an electronic component on the printed circuit board.SELECTED DRAWING: Figure 1
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Citation Information
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