Temperature adjustment module and temperature adjustment method
JP2024175649AActive Publication Date: 2024-12-18GIGA BYTE TECH CO LTD
Patent Information
- Application Number
- JP2024048970
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-06-06
- Filing Date
- 2024-03-26
- Publication Date
- 2024-12-18
- Estimated Expiration
- 2044-03-26
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Abstract
PURPOSE: To provide a temperature adjustment module and a temperature adjustment method that may effectively adjust a temperature of a peripheral circuit element on a mother board.SOLUTION: A temperature adjustment module includes a temperature control module, a temperature changing module, and a temperature sensor. The temperature changing module is in contact with a peripheral circuit element and electrically connected to the temperature control module. The temperature sensor is in contact with the peripheral circuit element and electrically connected to the temperature control module. When a cooling module on a main circuit element of a mother board cools the main circuit element, the temperature sensor detects a peripheral temperature of the peripheral circuit element. The temperature control module determines whether the peripheral temperature is lower than or higher than a target temperature to determine whether to operate the temperature changing module to perform temperature adjustment on the peripheral circuit element.SELECTED DRAWING: Figure 2
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Citation Information
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