ACF attaching device and ACF attaching method

Abstract

To provide an ACF attaching device and others that can suppress reduction in productivity.SOLUTION: An ACF attaching device 10 comprises an attaching part 110, an imaging part 120 and a determination part 220. The attaching part 110 is configured to: attach, to a substrate, a first ACF segment having a first one end and a first other end located on an opposite side to the first one end; and attach, to the substrate, a second ACF segment having a second one end adjacent to the first other end in the substrate and a second other end located on an opposite side to the second one end. The imaging part 120 is configured to: capture a first image including the first one end; capture a second image including the first other end and the second one end; and capture a third image including the second other end. The determination part 220 is configured to: determine whether or not an attachment state of the first ACF segment is good on the basis of the first image and second image; and determines whether or not an attachment state of the second ACF segment is good on the basis of the second image and third image.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to an ACF (Anisotropic Conductive Film) joining device and an ACF joining method for joining an ACF to a substrate. [Background technology]

[0002] Conventionally, there are devices that attach ACF (ACF pieces) as adhesive members for bonding components to a board. There are also devices that determine whether or not the ACF is properly attached to a board based on an image (image data) generated by a camera capturing an image of the state after the ACF is attached to the board by this type of device (see, for example, Patent Document 1). For example, the device disclosed in Patent Document 1 inspects both ends of the attached ACF every time a sheet of ACF is attached. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-049237 A Summary of the Invention [Problem to be solved by the invention]

[0004] The more ACFs are attached to a board, the more ACF inspection processes are required, and the more ACFs are attached to a board, the lower the productivity is when producing display panels and other products with components attached to the board.

[0005] The present invention provides an ACF application device and the like that can suppress a decrease in productivity. [Means for solving the problem]

[0006] The ACF attachment device according to one aspect of the present invention is a device for attaching anisotropic conductive film (ACF) to a substrate. the imaging unit captures a first image including the first end, a second image including the first end and the second end, and a third image including the second end; the judging unit judges whether the attached state of the ACF section is good or bad based on the image obtained by the imaging unit, wherein the attaching unit attaches a first ACF section to the substrate, the first ACF section having a first end and a first other end located opposite the first end, and attaches a second ACF section to the substrate, the second ACF section having a second end on the substrate adjacent to the first other end and a second other end located opposite the second end; the imaging unit captures a first image including the first end, a second image including the first other end and the second end, and a third image including the second other end; the judging unit judges whether the attached state of the first ACF section is good or bad based on the first image and the second image, and judges whether the attached state of the second ACF section is good or bad based on the second image and the third image.

[0007] Moreover, an ACF attachment method according to one embodiment of the present invention includes a first attachment step of attaching a first ACF (Anisotropic Conductive Film) slice to a substrate, the first ACF slice having a first end and a first other end located opposite the first end; a first imaging step of capturing a first image including the first end with an imaging unit; a second attachment step of attaching a second ACF slice to the substrate, the second ACF slice having a second end adjacent to the first other end on the substrate and a second other end located opposite the second end; a second imaging step of capturing a second image including the first other end and the second end with the imaging unit; a third imaging step of capturing a third image including the second other end with the imaging unit; and a determination step of determining whether the attachment state of the first ACF slice is good or bad based on the first image and the second image, and determining whether the attachment state of the second ACF slice is good or bad based on the second image and the third image. Effect of the Invention

[0008] According to the present invention, it is possible to provide an ACF application device and the like that can suppress a decrease in productivity. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing an ACF joining work unit according to the first embodiment. [Diagram 2] FIG. 2 is a perspective view showing an attachment portion according to the first embodiment. [Diagram 3] FIG. 3 is a block diagram showing a functional configuration of the ACF joining device according to the first embodiment. [Figure 4] FIG. 4 is a flowchart showing a processing procedure of the ACF joining device according to the first embodiment. [Diagram 5] FIG. 5 is a flowchart showing a specific processing procedure of the joining step and the imaging step in the ACF joining device according to the first embodiment. [Figure 6] FIG. 6 is a diagram for explaining a specific processing procedure of the joining step and the imaging step in the ACF joining device according to the first embodiment. [Figure 7] FIG. 7 is a block diagram showing a functional configuration of an ACF joining device according to the second embodiment. [Figure 8] FIG. 8 is a flowchart showing a specific processing procedure of the joining step and the imaging step in the ACF joining device according to the second embodiment. [Figure 9] FIG. 9 is a diagram for explaining a specific processing procedure of the joining step and the imaging step in the ACF joining device according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. Note that each of the embodiments described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, the arrangement and connection of the components, steps, and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims will be described as optional components.

[0011] In addition, each drawing is a schematic diagram and is not necessarily a precise illustration. In addition, in each drawing, the same components are denoted by the same reference numerals.

[0012] In addition, in this specification, ordinal numbers such as "first" and "second" do not refer to the number or order of components, unless otherwise specified, but are used for the purpose of avoiding confusion and distinguishing between components of the same type.

[0013] In addition, in this specification, when a term is used in comparison with, for example, equal to or greater than a threshold value and less than a threshold value, it means that the distinction is made with the threshold value as the boundary, and may mean greater than the threshold value and less than the threshold value, respectively.

[0014] (Embodiment 1) [composition] First, the configuration of the ACF joining device according to the first embodiment will be described.

[0015] Fig. 1 is a perspective view showing an ACF joining work unit 100 according to embodiment 1. Fig. 2 is a perspective view showing a joining unit 110 according to embodiment 1. Fig. 3 is a block diagram showing the functional configuration of the ACF joining device 10 according to embodiment 1.

[0016] The ACF attachment device 10 is a device that attaches an ACF (more specifically, an ACF piece cut and peeled off from a tape 310) for bonding a component to a substrate 300. Specifically, the ACF attachment device 10 attaches a piece of the ACF layer of the tape 310 to the substrate 300 placed on a stage 140 by using a pressure bonding head 116.

[0017] The ACF bonding apparatus 10 is, for example, a part of a component mounting system for producing a display panel or the like. In this component mounting system, for example, the ACF bonding apparatus 10 bonds an ACF piece to an electrode provided on a substrate 300, and a component pressure-bonding apparatus (not shown) thermocompresses the substrate 300 and a component via the ACF piece. The ACF bonding apparatus 10 bonds the ACF piece to the substrate 300 transported from an upstream apparatus by a transport unit 130, for example. The substrate 300 to which the ACF piece has been attached is transported by the transport unit 130, for example, to a component pressure-bonding apparatus located downstream of the ACF bonding apparatus 10.

[0018] Tape 310 is composed of an ACF slice and a base layer that is a separator for supporting the ACF slice. The ACF slice is a layer made of tape-shaped ACF. The base layer is a tape-shaped film made of a resin such as polyethylene terephthalate.

[0019] The ACF application device 10 cuts (half-cuts) the ACF section to a predetermined size so that the ACF section remains held by the base layer with the cutter 114. Furthermore, the ACF application device 10 peels the ACF section from the base layer by pinching and moving the base layer with two peeling pins of the peeling unit 115. Furthermore, the ACF application device 10 adjusts the position of the substrate 300 placed on the stage 140, and uses the pressure bonding head 116 to apply the ACF section cut to the predetermined size to the substrate 300.

[0020] An example of the substrate 300 is a film-like flexible substrate made of resin, etc. The substrate 300 may be a rigid substrate such as a glass substrate.

[0021] Examples of components that can be attached to the substrate 300 via ACF pieces include electronic components such as ICs (Integrated Circuits), TCPs (Tape Carrier Packages), and FPCs (Flexible Printed Circuits).

[0022] As shown in FIG. 3, the ACF application device 10 includes an ACF application work unit 100 and a control device 200.

[0023] The ACF attachment work section 100 is a mechanism that attaches an ACF piece to a substrate 300 carried in from upstream and transports the substrate downstream.

[0024] The ACF application work section 100 includes an application section 110, an imaging section 120, and a transport section .

[0025] The attachment unit 110 is a mechanism that attaches an ACF piece to the substrate 300. Specifically, the attachment unit 110 attaches a plurality of ACF pieces to the substrate 300 so that they are aligned. For example, the attachment unit 110 attaches a first ACF piece having a first end and a first other end located opposite the first end to the substrate 300, and attaches a second ACF piece having a second end adjacent (adjacent) to the first other end on the substrate 300 and a second other end located opposite the second end to the substrate 300. For example, the tape 310 is cut into a plurality of pieces so that the ACF pieces are long. Also, for example, the attachment unit 110 attaches a plurality of ACF pieces to the substrate 300 so that they are aligned in a row in the longitudinal direction of each ACF piece. For example, one end of the ACF segment refers to one end in the longitudinal direction of the ACF segment, and the other end of the ACF segment refers to the other end located opposite to the one end in the longitudinal direction of the ACF segment.

[0026] For example, two ACF segments being adjacent to each other means that the two ACF segments are arranged side by side at a predetermined interval (for example, without contact).

[0027] The joining section 110 includes a reel 111 , a feed roller 112 , a collection section 113 , a cutter 114 , a peeling section 115 , a pressure bonding head 116 , and a backup stage 117 .

[0028] Although not shown, these components are supported by a drive mechanism for driving (moving) the components such as the guide and the motor, and by a support member for fixing the position, etc. Furthermore, these components or the drive mechanism for driving these components are connected to a control device 200 provided in the ACF application device 10 so as to be able to communicate wirelessly or via a control line, and are controlled by the control device 200 to perform predetermined operations.

[0029] The reel 111 is a reel that stores the tape 310 and supplies the stored tape 310. One end of the tape 310 is connected to a feed roller 112, and the tape 310 is wound up and supplied below the compression head 116 as the feed roller 112 rotates.

[0030] The feed roller 112 is a roller that rotates so that the tape 310 moves to a predetermined position.

[0031] The recovery unit 113 is a storage unit that is rotated by a motor (not shown) and takes up the tape 310.

[0032] Cutter 114 is a blade that cuts the ACF section supported by the base layer of tape 310. For example, cutter 114 cuts the ACF on tape 310 by driving a drive mechanism having a guide and a motor (not shown) by control device 200. Specifically, cutter 114 does not cut the base layer of tape 310, but cuts the ACF layer of tape 310, that is, cuts half the tape 310 to form the ACF section. As a result, the ACF section is moved below compression head 116 and above backup stage 117 in a state where it has been cut to a predetermined size by cutter 114 and is supported by the base layer.

[0033] The peeling unit 115 is a mechanism for peeling the ACF section from the base layer. The peeling unit 115 has, for example, two peeling pins and a drive mechanism for driving the two peeling pins. The peeling unit 115, for example, sandwiches and moves the base layer to peel the ACF section from the base layer. Specifically, after the ACF section is attached to the substrate 300 by the pressure bonding head 116, the peeling unit 115 sandwiches the base layer with the two peeling pins and moves the two peeling pins. As a result, the peeling pins enter between the base layer and the ACF section in contact with the substrate 300, and the ACF section in contact with the substrate 300 can be peeled off from the base layer.

[0034] The compression head 116 is a head that compresses the ACF section onto the substrate 300. For example, the compression head 116 is moved up and down by a drive mechanism having a guide and a motor (not shown) driven by the control device 200, thereby compressing the ACF section onto the substrate 300.

[0035] The backup stage 117 is a base that supports the edge of the substrate 300 placed on the stage 140 .

[0036] The imaging unit 120 is a camera that captures an image including the ACF section attached to the substrate 300. Specifically, the imaging unit 120 captures an image of the ACF section attached to the substrate 300 placed on the stage 140 to generate an image including the ACF section, that is, an image in which the ACF section is shown. In this embodiment, the imaging unit 120 captures a first image including a first end, a second image including the first other end and a second one end, and a third image including the second other end. In other words, the imaging unit 120 captures an image including each of the ends of two ACF sections adjacent to each other on the substrate 300.

[0037] For example, depending on the field of view dimensions (imageable range) of imaging unit 120, it may not be possible to image the entire ACF section attached to substrate 300. In such a case, imaging unit 120 captures, for example, images of one end and the other end of the ACF section. Here, in this embodiment, for example, when it is not possible to image the entire ACF section on substrate 300 and the distance between two adjacent ACF sections on substrate 300 is larger than the field of view dimensions, an image including each end of two adjacent ACF sections on substrate 300 is captured.

[0038] The transport unit 130 is a mechanism that receives the substrate 300 from upstream, moves it to a position where the ACF section can be attached to the substrate 300, and delivers the substrate 300 with the ACF section attached downstream. The transport unit 130 includes, for example, a stage 140, and a guide and a motor for moving the stage.

[0039] The stage 140 is a base on which the substrate 300 is placed. Specifically, the stage 140 holds the substrate 300 in a state where it does not overlap with the edge of the substrate 300 in a top view (i.e., the end of the substrate 300 protrudes). The stage 140 is, for example, a three-axis stage that is controlled by the control device 200 and can move in the up, down, left and right directions.

[0040] The control device 200 controls each of the components of the ACF pasting device 10. The control device 200 is a computer realized by, for example, a communication interface for communicating with each of the components of the ACF pasting device 10, a non-volatile memory in which a program is stored, a volatile memory which is a temporary storage area for executing the program, an input / output port for transmitting and receiving signals, a processor such as a CPU (Central Processing Unit) that executes the program, and the like.

[0041] The control device 200 includes an acquisition unit 210 , a determination unit 220 , a control unit 230 , an output unit 240 , and a storage unit 250 .

[0042] The acquisition unit 210 is a processing unit that acquires various information necessary for the operation of the control device 200. The acquisition unit 210 acquires an image including an ACF slice from the imaging unit 120, for example.

[0043] The determination unit 220 is a processing unit that determines whether the attachment state of the ACF section is good or bad based on the image obtained by the imaging unit 120. For example, the determination unit 220 determines whether or not there is a turnover, a chip, or the like at both ends of the ACF section. For example, the determination unit 220 determines whether or not there is a turnover, a chip, or the like at both ends of the ACF section based on whether or not both ends of the ACF section in the image are straight lines. For example, the determination unit 220 determines the attachment state of the ACF section as good if there is no turnover, a chip, or the like at both ends of the ACF section, and determines the attachment state of the ACF section as bad if there is turnover, a chip, or the like at both ends of the ACF section. Alternatively, the determination unit 220 may determine whether or not the length of the end of the ACF section (for example, the length of a side at a position adjacent to another ACF section on the substrate 300) is within a specified range (that is, whether it is within a specified range or outside a predetermined range) as the determination of the quality. For example, if the length of the end of the ACF section is within a specified range, the judgment unit 220 judges the attachment state of the ACF section to be good, and if the length of the end of the ACF section is determined to be outside the specified range, the judgment unit 220 judges the attachment state of the ACF section to be poor.

[0044] In this embodiment, the determination unit 220 determines whether the pasted state of the first ACF section is good or bad based on the first and second images, and determines whether the pasted state of the second ACF section is good or bad based on the second and third images. That is, when determining whether the pasted state of the ACF sections is good or bad, the determination unit 220 determines whether the pasted state of the two adjacent ACF sections is good or bad based on a common image.

[0045] The determination unit 220 may determine whether the attachment state of one end of the ACF piece is good or bad. Alternatively, the determination unit 220 may determine whether one end of the ACF piece (also referred to as one end) is good or bad, and when determining that the attachment state is good, may further determine whether the attachment state of the other end (also referred to as the other end) is good or bad.

[0046] Also, for example, the control device 200 may store appropriate image data for the judgment unit 220 to judge the quality of the ACF slice, and compare the appropriate image data with the image data generated by the imaging unit 120 to judge the quality of the ACF slice.

[0047] The control unit 230 is a processing unit that controls the operation and operation timing of each component of the ACF joining device 10, such as the joining unit 110, the imaging unit 120, and the transport unit 130. For example, the control unit 230 controls the operation of the joining unit 110 based on the judgment result of the judgment unit 220. For example, the control unit 230 causes the joining unit 110 to continue the operation when the judgment unit 220 judges the ACF to be good. On the other hand, for example, the control unit 230 causes the joining unit 110 to stop the operation when the judgment unit 220 judges the ACF to be bad. Alternatively, for example, when the judgment unit 220 judges the ACF to be bad, the control unit 230 controls the joining unit 110 to discard (for example, move to another location without passing it downstream) the substrate 300 to which the ACF judged to be bad is joined.

[0048] The output unit 240 is a processing unit for outputting information of the control device 200 to the outside. For example, the output unit 240 outputs information indicating the control content of the pasting unit 110 by the control unit 230 to the pasting unit 110. Also, for example, the output unit 240 outputs the determination result of the determination unit 220. For example, the output unit 240 outputs the determination result to a notification device such as a display and / or a speaker to notify the worker of the determination result by image and / or sound. When the determination unit 220 determines that the ACF is defective, the output unit 240 may output information indicating that the pasting unit 110 should stop operating and / or information indicating the board to which the ACF determined to be defective is pasted to a display device for display.

[0049] Processing units such as the acquisition unit 210, the determination unit 220, the control unit 230, and the output unit 240 are realized by, for example, a processor and a control program stored in a memory or the like and executed by the processor.

[0050] The storage unit 250 is a storage device that stores various data indicating the size of the substrate 300, the attachment position and attachment direction of the ACF piece, the operation of each component, the timing of the operation, the timing of transferring the substrate 300 to a component crimping device or the like located downstream of the ACF attachment device 10, a control program executed by the processing unit, appropriate information used by the determination unit 220 to determine whether the attachment state of the ACF piece is good or bad, etc. The storage unit 250 is realized by, for example, a flash memory, a HDD (Hard Disk Drive), etc.

[0051] [Processing Procedure] Next, a processing procedure of the ACF joining device 10 according to the first embodiment will be described in detail.

[0052] FIG. 4 is a flowchart showing a processing procedure of the ACF joining device 10 according to the first embodiment.

[0053] First, the attachment unit 110 attaches an ACF piece to the substrate 300 (S10).

[0054] Next, the imaging section 120 captures an image including the ACF piece attached to the substrate 300 (S20).

[0055] Next, the judgment unit 220 judges whether the attachment state of the ACF section is good or bad based on the image obtained by the imaging unit 120 (S30).

[0056] Next, the control unit 230 executes a process according to the determination result of the determination unit 220 (S40).

[0057] Note that step S10 and step S20 may be performed alternately, or step S10 may be performed multiple times followed by step S20 being performed multiple times. Also, for example, step S30 may be performed for each ACF section at a stage where images used by determination unit 220 to determine each ACF section are available. Alternatively, for example, step S30 may be performed after all images to be captured on substrate 300 have been captured. Also, step S40 may not be performed, for example, when the attachment states of the multiple ACF sections on substrate 300 are all determined to be good.

[0058] Next, a specific example of the timing at which the ACF section is attached (attaching step) and the timing at which the image is captured (capturing step) will be described.

[0059] FIG. 5 is a flowchart showing a specific processing procedure of the joining step and the imaging step in the ACF joining device 10 according to the first embodiment.

[0060] First, the attachment unit 110 attaches a first ACF piece having a first end and a first other end located opposite the first end to the substrate 300 (S110).

[0061] Next, the pasting unit 110 captures a first image including a first end of the first ACF section with the imaging unit 120 (S120).

[0062] Next, the attachment unit 110 attaches to the substrate 300 a second ACF piece having a second end adjacent to the first other end of the first ACF piece on the substrate 300 and a second other end located opposite the second end (S130).

[0063] Next, the imaging section 120 captures a second image including the first other end of the first ACF segment and the second one end of the second ACF segment (S140).

[0064] Next, the attachment unit 110 attaches a third ACF piece to the substrate 300, the third ACF piece having a third end adjacent to the second other end of the second ACF piece on the substrate 300 and a third other end located opposite the third end (S150).

[0065] Next, the imaging section 120 captures a third image including the second other end of the second ACF (S160).

[0066] For example, after step S140, the determination unit 220 determines whether the pasting state of the first ACF section is good or bad based on the first and second images. Also, for example, after step S150, the determination unit 220 determines whether the pasting state of the second ACF section is good or bad based on the second and third images. For example, if the determination result of the determination unit 220 is good, the flow shown in Fig. 3 continues to be executed. On the other hand, for example, if the determination result of the determination unit 220 is bad, the control unit 230 causes the transport unit 130 to discard the substrate 300 and to carry a new substrate into the transport unit 130.

[0067] Note that after step S160, judgment unit 220 may judge whether the attachment state of the first ACF section is good or bad based on the first image and the second image, and may judge whether the attachment state of the second ACF section is good or bad based on the second image and the third image.

[0068] Also, for example, steps S110, S130, and S150 may be executed, and then steps S120, S140, and S160 may be executed.

[0069] Furthermore, for example, if three ACF sections are attached to substrate 300, an image including the other end of the third ACF section is captured after step S160, and the quality of the attachment state of the third ACF section is determined based on the third image and the captured image. Furthermore, for example, if four or more ACF sections are attached to substrate 300, further ACF sections are attached and imaged.

[0070] FIG. 6 is a diagram for explaining specific processing procedures of the joining step and the imaging step in the ACF joining apparatus 10 according to the first embodiment. Specifically, FIG. 6(a) is a diagram for explaining step S110 in FIG. 5. FIG. 6(b) is a diagram for explaining step S120 in FIG. 5. FIG. 6(c) is a diagram for explaining step S130 in FIG. 5. FIG. 6(d) is a diagram for explaining step S140 in FIG. 5. FIG. 6(e) is a diagram for explaining step S150 in FIG. 5. FIG. 6(f) is a diagram for explaining step S160 in FIG. 5.

[0071] In Fig. 6, the attachment positions (position of one end of the ACF pieces) of the ACF pieces (pieces 311, 312, and 313) are indicated by dashed and dotted lines. Also, in Fig. 6, the field of view (imaging range) of imaging unit 120 is indicated by dotted lines. Also, the center of the imaging range in the longitudinal direction of the ACF piece attached to substrate 300 is indicated as the imaging position by two-dot chain lines.

[0072] As shown in FIG. 6( a ), the attaching unit 110 attaches a piece 311 (first ACF piece) to a substrate 300 .

[0073] 6(b), the imaging section 120 captures an image of one end of the slice 311 to generate a first image including the one end of the slice 311. In the present embodiment, the one end of the slice 311 coincides with the imaging position.

[0074] Next, as shown in FIG. 6(c), the attaching unit 110 attaches the piece 312 (second ACF piece) to the substrate 300.

[0075] 6(d), the imaging section 120 captures an image of the other end of the slice 311 and one end of the slice 312 to generate a second image including the other end of the slice 311 and one end of the slice 312. In this embodiment, the center between the other end of the slice 311 and one end of the slice 312 coincides with the imaging position.

[0076] Next, as shown in FIG. 6(e), the attaching unit 110 attaches the piece 313 (the third ACF piece) to the substrate 300.

[0077] 6(f), imaging section 120 captures the other end of slice 312 and one end of slice 313 to generate a third image including the other end of slice 312 and one end of slice 313. In this embodiment, the center between the other end of slice 312 and one end of slice 313 coincides with the imaging position.

[0078] As described above, the pasting unit 110 pastes the first ACF section having a first end and a first other end located on the opposite side of the first end to the substrate, and pastes the second ACF section having a second end adjacent to the first other end on the substrate and a second other end located on the opposite side of the second end to the substrate. The imaging unit 120 also takes a first image including the first end, a second image including the first other end and the second end, and a third image including the second other end. The judging unit 220 also judges whether the pasting state of the first ACF section is good or bad based on the first and second images, and judges whether the pasting state of the second ACF section is good or bad based on the second and third images. Steps S110 and S130 are specific examples of step S10. Steps S120, S140, and S150 are specific examples of step S20.

[0079] (Embodiment 2) Next, we will explain the ACF application device 10 according to embodiment 2. In the explanation of embodiment 2, the differences from embodiment 1 will be mainly explained, and the configurations substantially similar to those of embodiment 1 will be given the same reference numerals, and the explanation will be simplified or omitted in some cases.

[0080] [composition] FIG. 7 is a block diagram showing a functional configuration of an ACF joining device 11 according to the second embodiment.

[0081] The ACF application device 11 according to the second embodiment differs from the ACF application device 10 according to the first embodiment in that a control device 201 having a comparison unit 260 is provided.

[0082] The comparison unit 260 is a processing unit that compares the distance between two adjacent ACF slices on the substrate with the field of view dimension of the imaging unit 120. Specifically, the comparison unit 260 compares the distance between the first other end and the second one end with the field of view dimension of the imaging unit 120.

[0083] The interval between two adjacent ACF pieces on a substrate is determined, for example, by the type of substrate to which the ACF pieces are attached (more specifically, the arrangement of electrode parts provided on the substrate to which the ACF pieces are attached). For example, the interval between the first other end and the second one end is the length between pieces 311 and 312 shown in FIG. 6. For example, information indicating the interval between two adjacent ACF pieces on a substrate is stored in advance in storage unit 250. Also, the field of view dimension of imaging unit 120 is, for example, the length of one side of the imaging range shown in FIG. 6 (specifically, the longitudinal length of an ACF piece such as piece 311 in the imaging range). Also, for example, information indicating the field of view dimension of imaging unit 120 is stored in advance in storage unit 250.

[0084] For example, when the comparison unit 260 determines that the distance between the first other end and the second one end is greater than the field of view dimension, the imaging unit 120 captures a fourth image including the first other end and a fifth image including the second one end instead of the second image. Furthermore, when the comparison unit 260 determines that the distance between the first other end and the second one end is greater than the field of view dimension, the determination unit 220 determines whether the attachment state of the first ACF section is good or bad based on the first image and the fourth image, and determines whether the attachment state of the second ACF section is good or bad based on the fifth image and the third image. On the other hand, when the comparison unit 260 determines that the distance between the first other end and the second one end is equal to or less than the field of view dimension, the imaging unit 120 captures the first image, the second image, and the third image. Furthermore, for example, if the comparison unit 260 determines that the distance between the first other end and the second one end is equal to or less than the field of view dimension, the judgment unit 220 judges whether the attachment state of the first ACF section is good or bad based on the first image and the second image, and judges whether the attachment state of the second ACF section is good or bad based on the second image and the third image.

[0085] That is, when the comparison section 260 determines that the distance between the first other end and the second one end is greater than the field of view dimension, the imaging section 120 captures a fourth image including the first other end but not the second one end, and captures a fifth image including the second one end but not the first other end. In this case, the imaging section 120 does not capture the second image. On the other hand, when the comparison section 260 determines that the distance between the first other end and the second one end is equal to or less than the field of view dimension, the imaging section 120 does not capture the fourth image and the fifth image, and captures the second image.

[0086] Furthermore, when the comparison unit 260 determines that the distance between the first other end and the second one end is greater than the field of view dimension, the determination unit 220 determines whether the pasted state of the first ACF section is good or bad based on the first and fourth images without using the second image, and determines whether the pasted state of the second ACF section is good or bad based on the fifth and third images. On the other hand, when the comparison unit 260 determines that the distance between the first other end and the second one end is equal to or less than the field of view dimension, the determination unit 220 determines whether the pasted state of the first ACF section is good or bad based on the first and second images without using the fourth and fifth images, and determines whether the pasted state of the second ACF section is good or bad based on the second and third images.

[0087] The comparison unit 260 is realized by, for example, a processor and a control program stored in a memory or the like and executed by the processor.

[0088] [Processing Procedure] FIG. 8 is a flowchart showing a specific processing procedure of the joining step and the imaging step in the ACF joining device 11 according to the second embodiment.

[0089] First, the pasting section 110 and the imaging section 120 execute steps S110 to S130 in the same manner as above.

[0090] After step S130, the comparison unit 260 compares the distance between the first other end and the second one end with the field of view dimension of the imaging unit 120. Specifically, the comparison unit 260 determines whether the distance between the first other end and the second one end is larger than the field of view dimension of the imaging unit 120 (S200).

[0091] If the comparison section 260 determines that the distance between the first other end and the second one end is larger than the field of view dimension of the imaging section 120 (Yes in S200), the imaging section 120 captures a fourth image including the first other end (S210).

[0092] Next, the imaging section 120 captures a fifth image including the second end (S220).

[0093] Next, the pasting section 110 and the imaging section 120 execute steps S150 and S160 in the same manner as above.

[0094] In this case, for example, the determination unit 220 determines whether the pasting state of the first ACF section is good or bad based on the first and fourth images after step S210. Also, in this case, for example, the determination unit 220 determines whether the pasting state of the second ACF section is good or bad based on the fifth and third images after step S160.

[0095] On the other hand, if the comparison unit 260 determines that the distance between the first other end and the second one end is equal to or less than the field of view dimension of the imaging unit 120 (Yes in S200), the pasting unit 110 and the imaging unit 120 execute steps S140 to S160 in the same manner as described above.

[0096] As described above, for example, if the answer is No in step S200, the same process as that in the flowchart shown in Fig. 5 is performed. On the other hand, if the answer is Yes in step S200, the fourth and fifth images are captured instead of the second image, and the attachment state of the ACF section is judged based on the fourth and fifth images.

[0097] Note that after step S160, judgment unit 220 may judge whether the attachment state of the first ACF section is good or bad based on the first and fourth images, and may judge whether the attachment state of the second ACF section is good or bad based on the fifth and third images.

[0098] Also, for example, steps S120, S210 and S220 may be executed after steps S110, S130 and S150 are executed.

[0099] Also, for example, step S200 may be executed at the start of processing (for example, before step S110). In this case, for example, if the answer is Yes in step S200, steps S110 to S160 are executed. On the other hand, for example, if the answer is Yes in step S200, steps S110 to S130 are executed, thereafter steps S210 and S220 are executed, and thereafter steps S150 and S160 are executed.

[0100] FIG. 9 is a diagram showing specific processing procedures of the joining step and the imaging step in the ACF joining apparatus 11 according to the second embodiment. FIG. 9 is a diagram for explaining specific processing procedures executed in the case of Yes in step S200. Specifically, FIG. 9(a) is a diagram for explaining step S110 in FIG. 8. FIG. 9(b) is a diagram for explaining step S120 in FIG. 8. FIG. 9(c) is a diagram for explaining step S130 in FIG. 8. FIG. 9(d) is a diagram for explaining step S210 in FIG. 8. FIG. 9(e) is a diagram for explaining step S220 in FIG. 8. FIG. 9(f) is a diagram for explaining step S150 in FIG. 8. FIG. 9(g) is a diagram for explaining step S160 in FIG. 8.

[0101] In Fig. 9, the attachment positions (positions of one ends of the ACF pieces) of the ACF pieces (pieces 311, 312, and 313) are indicated by dashed and dotted lines. Also, in Fig. 9, the field of view (imaging range) of imaging unit 120 is indicated by dotted lines. Also, the center of the imaging range in the longitudinal direction of the ACF piece attached to substrate 300A is indicated as the imaging position by two-dot chain lines.

[0102] As shown in FIG. 9(a), the attaching unit 110 attaches a piece 311 (first ACF piece) to a substrate 300A.

[0103] 9(b), the imaging section 120 captures an image of one end of the slice 311 to generate a first image including the one end of the slice 311. In the present embodiment, the one end of the slice 311 coincides with the imaging position.

[0104] Next, as shown in FIG. 9(c), the attaching unit 110 attaches the piece 312 (second ACF piece) to the substrate 300A.

[0105] Here, suppose that substrate 300A differs from substrate 300 shown in FIG. 6 in that the interval between adjacent ACF slices is larger than the field of view dimension.

[0106] In this case, the imaging section 120 then captures an image of the other end of the slice 311 as shown in FIG. 9(d) to generate a fourth image including the other end of the slice 311.

[0107] In this case, the imaging section 120 then captures an image of one end of the slice 312 as shown in FIG. 9(e) to generate a fifth image including the one end of the slice 312.

[0108] Next, as shown in FIG. 9(f), the bonding unit 110 bonds the piece 313 (the third ACF piece) to the substrate 300A.

[0109] 9(g), the imaging section 120 captures an image of the other end of the slice 312 and one end of the slice 313 to generate a third image including the other end of the slice 312 and one end of the slice 313. In this embodiment, the center between the other end of the slice 312 and one end of the slice 313 coincides with the imaging position.

[0110] As described above, the ACF pasting device 11 determines the imaging position of the imaging section 120 based on the comparison result of the comparison section 260, that is, determines which image including the end of the ACF slice is to be captured. Specifically, when the comparison section 260 determines that the distance between the first other end and the second one end is equal to or smaller than the field of view dimension of the imaging section 120, that is, when an image including multiple ends can be generated, the ACF pasting device 11 captures an image including multiple ends. On the other hand, when the comparison section 260 determines that the distance between the first other end and the second one end is larger than the field of view dimension of the imaging section 120, that is, when an image including multiple ends cannot be generated, the ACF pasting device 11 captures an image including one end.

[0111] (Effects, etc.) Below, examples of technologies that can be obtained from the disclosure of this specification will be given, and effects and the like that can be obtained from the exemplified technologies will be described.

[0112] The first technique includes a bonding unit 110 that bonds an ACF section to a substrate, an imaging unit 120 that captures an image including the ACF section bonded to the substrate, and a judging unit 220 that judges whether the bonded state of the ACF section is good or bad based on the image obtained by the imaging unit 120. The bonding unit 110 bonds a first ACF section to the substrate, the first ACF section having a first end and a first other end located on the opposite side to the first end, and a second end adjacent to the first other end on the substrate and a second end located on the opposite side to the second end. a second ACF section having a second other end that is aligned with the substrate, an imaging section 120 capturing a first image including the first one end, a second image including the first other end and the second one end, and a third image including the second other end, and a judgment section 220 judging whether the attachment state of the first ACF section is good or bad based on the first and second images, and judging whether the attachment state of the second ACF section is good or bad based on the second and third images.

[0113] According to this, since the first other end and the second one end are included in the second image, the attachment state of each end of the first ACF section and the second ACF section can be evaluated using the second image. Therefore, the time required for imaging can be reduced compared to the case where all of the ends of the first ACF section and the second ACF section are imaged individually. Therefore, according to the ACF application device according to one embodiment of the present disclosure, a decrease in productivity can be suppressed. Also, since fewer images are captured compared to the case where all of the ends of the first ACF section and the second ACF section are imaged individually, the amount of data of the captured images can be reduced.

[0114] Technology 2 is an ACF pasting device (e.g., ACF pasting device 11) described in Technology 1, which further includes a comparison section 260 that compares the distance between the first other end and the second one end with the field of view dimension of the imaging section 120, and if the comparison section 260 determines that the distance is larger than the field of view dimension, the imaging section 120 takes a fourth image including the first other end and a fifth image including the second one end instead of the second image, and the judgment section 220 judges whether the attachment state of the first ACF section is good or bad based on the first image and the fourth image, and judges whether the attachment state of the second ACF section is good or bad based on the fifth image and the third image.

[0115] Information indicating the distance between the first other end and the second one end and the field of view dimension of the imaging section 120 is stored in advance in the storage section 250, for example.

[0116] According to this, in a case where the second image cannot be captured by the imaging unit 120, the ACF application device can continue to perform the ACF application work without stopping the ACF application device due to an error, etc. Also, for example, even in an ACF application device configured such that the field of view dimensions of the imaging unit 120 cannot be changed, the fourth and fifth images can be captured when appropriate based on the comparison result of the comparison unit 260, and the quality of the application state of the ACF section can be determined.

[0117] Technology 3 is an ACF application device (e.g., ACF application device 11) described in Technology 1 or 2, in which, if comparison unit 260 determines that the distance is equal to or less than the field of view dimension, imaging unit 120 captures a first image, captures a second image, and captures a third image, and judgment unit 220 judges whether the attachment state of the first ACF section is good or bad based on the first and second images, and judges whether the attachment state of the second ACF section is good or bad based on the second and third images.

[0118] According to this, even in an ACF application device in which the field of view dimensions of the imaging unit 120 cannot be changed, if appropriate based on the comparison result of the comparison unit 260, a second image can be captured and the quality of the application state of the ACF section can be determined.

[0119] The fourth technique includes a first attachment step (S110) of attaching a first ACF piece having a first end and a first other end located opposite the first end to a substrate, a first imaging step (S120) of capturing a first image including the first end by an imaging unit 120, and a second attachment step (S130) of attaching a second ACF piece having a second end adjacent to the first other end on the substrate and a second other end located opposite the second end to the substrate. The ACF pasting method includes a second imaging step (S140) of capturing a second image including the first other end and the second one end with the imaging unit 120, a third imaging step (S160) of capturing a third image including the second other end with the imaging unit 120, and a judgment step (S30) of judging the quality of the pasting state of the first ACF section based on the first and second images, and judging the quality of the pasting state of the second ACF section based on the second and third images.

[0120] An ACF attachment method according to one embodiment of the present disclosure includes, for example, an attachment step (S10) of attaching an ACF slice to a substrate, an imaging step (S20) of capturing an image including the ACF slice attached to the substrate, and a determination step (S30) of determining whether the attachment state of the ACF slice is good or bad based on the image obtained by the imaging unit 120.

[0121] According to this, the same effects as those of the ACF joining device according to the first technique can be achieved.

[0122] Technique 5 is an ACF pasting method described in Technique 4, which further includes a comparison process (S200) of comparing the distance between the first other end and the second one end with the field of view dimension of the imaging unit 120. If the comparison process determines that the distance is larger than the field of view dimension (Yes in S200), the ACF pasting method includes, instead of the second imaging process, a fourth imaging process (S210) of capturing a fourth image including the first other end with the imaging unit 120, and a fifth imaging process (S220) of capturing a fifth image including the second one end with the imaging unit 120. In the judgment process, the attachment state of the first ACF section is judged based on the first image and the fourth image, and the attachment state of the second ACF section is judged based on the fifth image and the third image.

[0123] According to this, the same effects as those of the ACF joining device according to Technique 2 can be achieved.

[0124] Technique 6 is an ACF pasting method according to Technique 4 or 5, in which, if the comparison step determines that the distance is equal to or less than the field of view dimension (No in S200), the ACF pasting method includes a first imaging step, a second imaging step, and a third imaging step, and in the judgment step, the quality of the pasting state of the first ACF section is judged based on the first image and the second image, and the quality of the pasting state of the second ACF section is judged based on the second image and the third image.

[0125] According to this, the same effects as those of the ACF joining device according to Technique 3 can be achieved.

[0126] These comprehensive or specific aspects may be realized as a system, a method, an integrated circuit, a computer program, or a recording medium such as a computer-readable CD-ROM, or may be realized as any combination of a system, a method, an integrated circuit, a computer program, and a recording medium.

[0127] In addition, the present disclosure may be executed as a program that causes a computer to execute the ACF pasting method, and the present disclosure may be realized as a computer-readable non-transitory recording medium that stores the program.

[0128] Furthermore, for example, the present disclosure may be realized as a control device 200 including: a control unit 230 that causes the attachment unit 110 to attach to a substrate a first ACF section having a first end and a first other end located opposite the first end, and to attach to the substrate a second ACF section having a second end adjacent to the first other end on the substrate and a second other end located opposite the second end, and causes the imaging unit 120 to capture a first image including the first end, a second image including the first other end and the second end, and a third image including the second other end; and a judgment unit 220 that judges whether the attachment state of the first ACF section is good or bad based on the first and second images, and judges whether the attachment state of the second ACF section is good or bad based on the second and third images. For example, the present disclosure may be realized as a control method for causing the pasting unit 110 to paste a first ACF section having a first end and a first other end located opposite the first end onto a substrate, causing the pasting unit 110 to paste a second ACF section having a second end adjacent to the first other end on the substrate and a second other end located opposite the second end onto the substrate, causing the imaging unit 120 to capture a first image including the first end, a second image including the first other end and the second end, and a third image including the second other end, determining whether the pasted state of the first ACF section is good or bad based on the first and second images, and determining whether the pasted state of the second ACF section is good or bad based on the second and third images. The present disclosure may be realized as a program for causing a computer to execute the control method, or as a computer-readable non-transitory recording medium storing the program.

[0129] (Other embodiments) Although the ACF joining device according to the present embodiment and the like have been described based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments.

[0130] For example, all or some of the components of the processing unit such as the determination unit included in the ACF application device may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a HDD or semiconductor memory.

[0131] Furthermore, the components of the processing section of the ACF application device may be configured with one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

[0132] The one or more electronic circuits may include, for example, a semiconductor device, an IC, or an LSI (Large Scale Integration). The IC or LSI may be integrated into one chip or into multiple chips. Here, we refer to it as an IC or an LSI, but depending on the degree of integration, it may be called a system LSI, a VLSI (Very Large Scale Integration), or an ULSI (Ultra Large Scale Integration). Also, a Field Programmable Gate Array (FPGA), which is programmed after the LSI is manufactured, can be used for the same purpose.

[0133] The present invention can be realized not only as an ACF pasting device, but also as a program including, as steps, processes performed by each component of the ACF pasting device, and a computer-readable recording medium such as a DVD (Digital Versatile Disc) on which the program is recorded. In other words, the above-mentioned comprehensive or specific aspects may be realized as a system, a device, an integrated circuit, a computer program, or a computer-readable non-transitory recording medium, or as any combination of the system, device, integrated circuit, computer program, and recording medium.

[0134] In addition, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art may conceive, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope that does not deviate from the spirit of the present invention. [Industrial Applicability]

[0135] The present invention can be used in an ACF bonding apparatus that bonds an ACF to a substrate. [Explanation of symbols]

[0136] 10, 11 ACF attachment device 100 ACF pasting work section 110 Paste section 111 Reel 112 Feed roller 113 Recovery Department 114 Cutter 115 Peeling part 116 Crimping head 117 Backup Stage 120 Imaging unit 130 Conveyor 140 Stages 200, 201 Control device 210 Acquisition Department 220 Judgment section 230 Control Unit 240 Output section 250 Storage section 260 Comparison Section 300, 300A board 310 Tape 311, 312, 313 intercept

Claims

1. a bonding section for bonding an ACF (Anisotropic Conductive Film) piece to the substrate; an imaging unit that captures an image including the ACF section attached to the substrate; a determination unit that determines whether the ACF section is attached properly based on the image obtained by the imaging unit, The attachment unit includes: attaching a first ACF piece having a first end and a first other end located opposite to the first end to the substrate; a second ACF section having a second end adjacent to the first end on the substrate and a second end located on the opposite side to the second end is attached to the substrate; The imaging unit includes: capturing a first image including the first end; capturing a second image including the first other end and the second one end; capturing a third image including the second other end; The determination unit is determining whether or not the attachment state of the first ACF section is good based on the first image and the second image; determining whether or not the attachment state of the second ACF section is good based on the second image and the third image; ACF application device.

2. A comparison unit that compares a distance between the first other end and the second one end with a field of view dimension of the imaging unit, When the comparison unit determines that the interval is greater than the field of view dimension, The imaging unit, instead of the second image, capturing a fourth image including the first other end; capturing a fifth image including the second end; The determination unit is determining whether or not the attachment state of the first ACF section is good based on the first image and the fourth image; determining whether or not the attachment state of the second ACF section is good based on the fifth image and the third image; The ACF joining device according to claim 1 .

3. When the comparison unit determines that the distance is equal to or smaller than the field of view dimension, The imaging unit includes: Taking the first image; Taking the second image; Taking the third image; The determination unit is determining whether or not the attachment state of the first ACF section is good based on the first image and the second image; determining whether or not the attachment state of the second ACF section is good based on the second image and the third image; The ACF joining device according to claim 2 .

4. a first bonding step of bonding a first ACF (Anisotropic Conductive Film) piece having a first end and a first other end located opposite to the first end to a substrate; a first imaging step of capturing a first image including the first end by an imaging unit; a second bonding step of bonding a second ACF piece to the substrate, the second ACF piece having a second end adjacent to the first end and a second end located on the opposite side to the second end; a second imaging step of capturing a second image including the first other end and the second one end by the imaging unit; a third imaging step of capturing a third image including the second other end by the imaging unit; a determining step of determining whether or not the attachment state of the first ACF section is good based on the first image and the second image, and determining whether or not the attachment state of the second ACF section is good based on the second image and the third image, How to attach ACF.

5. The method further includes a comparison step of comparing a distance between the first other end and the second one end with a field of view dimension of the imaging unit, If the comparison step determines that the spacing is greater than the field of view dimension, The ACF attachment method further includes, instead of the second imaging step, a fourth imaging step of capturing a fourth image including the first other end by the imaging unit; a fifth imaging step of capturing a fifth image including the second end by the imaging unit, In the judging step, a quality of an attachment state of the first ACF section is judged based on the first image and the fourth image, and a quality of an attachment state of the second ACF section is judged based on the fifth image and the third image. The ACF attachment method according to claim 4.

6. If it is determined in the comparison step that the distance is equal to or less than the field of view dimension, The ACF attachment method includes the steps of: The first imaging step; The second imaging step; The third imaging step, In the judging step, a quality of an attachment state of the first ACF section is judged based on the first image and the second image, and a quality of an attachment state of the second ACF section is judged based on the second image and the third image. The ACF attachment method according to claim 5.

Images