Mounting substrate and manufacturing method thereof

Abstract

To provide a mounting substrate enabling improvement of accuracy of a mounting position where a component is mounted to a housing, and a manufacturing method of a mounting substrate.SOLUTION: A mounting substrate 10 mounted to a housing 30 constituting a case of an image capturing device, comprises: a mounting portion 11 to which a component 20 is mounted; and a fitting portion 40 fitted to the housing. The fitting portion is formed in accordance with any one of a design position and a mounting position when the component is mounted to the mounting position deviated from the design position. Also, a manufacturing method of the mounting substrate, includes steps of: preparing an aggregate substrate which includes a plurality of mounting substrates and has a coupling portion coupling a plurality of mounting substrates and a frame portion; mounting the component to the design position to the mounting portion; calculating deviation of the design position and the mounting position of the component mounted to the mounting portion; and dividing each of the plurality of mounting substrates from the aggregate substrate by cutting the couple portion. The step of dividing the mounting substrates, includes a formation of a portion mounted to the housing in the coupling portion in accordance with the deviation of the calculated design position and the mounting position.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present disclosure relates to a mounting board and a manufacturing method thereof. [Background technology]

[0002] Conventionally, there has been known a wiring board having a product board on which components are mounted, a throwaway board used for fixing when mounting the components, and a joint portion that joins the product board and the throwaway board (see, for example, Patent Document 1). After components are mounted on the product board, the joint portion of this wiring board is cut and the wiring board is divided into the product board on which the components are mounted and the throwaway board. Then, the product board on which the components are mounted is attached, for example, to a housing in which the product board is to be attached. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2003-304038 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, when a component to be mounted on a mounting board such as a product board is a component such as an image sensor, for which the accuracy of the mounting position relative to the housing is important, the component is required to be mounted at a predetermined design position relative to the housing. However, the mounting position of the component relative to the housing is based on the mounting position of the mounting board on which the component is mounted. Therefore, the mounting board, which is the reference for the mounting position of the component, is required to be mounted at the predetermined design position relative to the housing.

[0005] However, there is a possibility that the components may be mounted on the mounting board at positions different from the design positions. In this case, even if the mounting board is attached to the housing at the designed positions, the components will be attached to the housing at positions different from the design positions. Such a deviation of the attachment positions from the designed positions is not preferable when the components mounted on the mounting board are components for which the accuracy of the attachment position to the housing is important.

[0006] An object of the present disclosure is to provide a mounting board capable of improving the accuracy of the mounting positions of components relative to a housing, and a manufacturing method thereof. [Means for solving the problem]

[0007] According to one aspect of the disclosure, The mounting board to be attached to the housing (30) is The electronic component (20) includes a mounting portion (11) on which the electronic component (20) is mounted and a mounting portion (40) that is attached to a housing, When a component is mounted at a mounting position that is shifted from a predetermined design position, the attachment portion is formed in accordance with the deviation between the design position and the mounting position.

[0008] From another perspective, A method for manufacturing a mounting board having a mounting portion (11) on which a component (20) is mounted and attached to a housing (30) that is an attachment target, comprises the steps of: A method for manufacturing a semiconductor device comprising the steps of: preparing an aggregate substrate (1) including a plurality of mounting substrates, the aggregate substrate (1) having a frame portion (3) surrounding each of the plurality of mounting substrates and a coupling portion (12) coupling the plurality of mounting substrates to the frame portion; Mounting components at predetermined design positions for mounting portions of each of a plurality of mounting boards; Detecting a mounting position of each of the components mounted on the mounting portion of each of the multiple mounting boards, and calculating a deviation between a design position and the mounting position; cutting the joints and separating each of the plurality of mounting substrates from the aggregate substrate; The coupling portion is a portion attached to the housing, Cutting the joints and separating the mounting board from the aggregate board includes forming the portion of the joints to be attached to the housing in accordance with the calculated deviation between the design position and the mounting position.

[0009] According to this, even if a component is mounted on a mounting board deviated from its designed position, the mounting position of the component relative to the housing can be brought closer to the designed position, thereby improving the accuracy of the mounting position of the component relative to the housing.

[0010] The reference symbols in parentheses attached to each component indicate an example of the correspondence between the component and specific components described in the embodiments described below. [Brief description of the drawings]

[0011] [Figure 1] 1 is a schematic diagram of an aggregate substrate including a mounting substrate according to an embodiment of the present invention. [Diagram 2] 1 is a diagram showing a state in which the mounting substrate according to the embodiment is separated from the aggregate substrate. FIG. [Diagram 3] FIG. 2 is a diagram showing a state in which the mounting board according to the embodiment is attached to a housing. [Figure 4] FIG. 13 is a diagram showing a state in which a component is mounted at an angle on a mounting board serving as a comparative example. [Diagram 5] 13 is a diagram showing a state in which a mounting board of a comparative example on which components are mounted at an angle is attached to a housing. FIG. [Figure 6] 1 is a diagram showing a state in which a component is mounted at an angle on the mounting board of the embodiment; [Figure 7] 1 is a diagram showing a state in which the mounting board of the present embodiment, on which components are mounted at an angle, is attached to a housing. FIG. [Figure 8] 1 is a schematic diagram of an aggregate substrate including a mounting substrate before components are mounted thereon; [Figure 9] 1A to 1C are diagrams illustrating a method for detecting the mounting position of a component mounted on a mounting board. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] An embodiment of the present disclosure will be described with reference to Figs. 1 to 9. As shown in Fig. 1, a plurality of mounting substrates 10 are formed on an aggregate substrate 1. The aggregate substrate 1 is, for example, a printed wiring board in which wiring made mainly of a conductive material is provided on an insulating substrate such as a resin or ceramic substrate. In this embodiment, the aggregate substrate 1 includes six mounting substrates 10. These six mounting substrates 10 are designed to be cut in a later process.

[0013] The aggregate substrate 1 has a frame portion 3 surrounding each of the six mounting substrates 10. In addition, the aggregate substrate 1 has cutout portions 5 formed between the six mounting substrates 10 and between the six mounting substrates 10 and the frame portion 3 to facilitate cutting of the six mounting substrates 10.

[0014] The mounting board 10 is a portion on which various electronic components (not shown) including components 20 are mounted. The mounting board 10 has a mounting section 11 on which the components 20 are mounted, and a coupling section 12 that couples the mounting board 10 to the frame section 3. As shown in FIG. 1, the components 20 are mounted on the mounting section 11 of each of the six mounting boards 10. Specifically, the components 20 are placed on the surface of the mounting section 11, and the components 20 are surface-mounted by soldering through reflow. Thereafter, the coupling section 12 of the collective board 1 is cut off. As a result, the six mounting boards 10 are separated from the collective board 1 and formed, as shown in FIG. 2.

[0015] The mounting portion 11 has a thin plate shape, and is formed into a rectangular shape when viewed from a direction perpendicular to the plate surface of the mounting substrate 10. The mounting portion 11 has a pair of long sides 111, 112 and a pair of short sides 113, 114 that form the rectangular shape. The pair of long sides 111, 112 extend linearly and are parallel to each other. The pair of short sides 113, 114 are shorter than the pair of long sides 111, 112, extend linearly, and are parallel to each other. The mounting substrate 10 is cut from the collective substrate 1 with the coupling portion 12 coupled to the end portions of the pair of long sides 111, 112.

[0016] The component 20 may be, for example, an image sensor such as a CCD or a CMOS used in an image capturing device (not shown) such as a digital camera. CCD stands for Charge Coupled Device. CMOS stands for Complementary Metal Oxide Semiconductor. In this embodiment, an example will be described in which the component 20 is an image sensor used in an image capturing device provided in a vehicle.

[0017] The component 20, which is an image sensor, is required to be mounted at a predetermined design position on the surface of the mounting board 10 so that the image capturing device can capture an image normally. The component 20 of this embodiment has a rectangular shape when viewed from a direction perpendicular to the surface of the mounting board 10. As shown in FIG. 2, the design positions of the component 20 are determined so that each of the four end faces of the component 20 is parallel to a pair of long sides 111, 112 and a pair of short sides 113, 114 of the mounting board 10. Hereinafter, among the four end faces of the component 20, a pair of end faces whose design positions are determined to be parallel to the pair of long sides 111, 112 are referred to as a pair of first end faces 21, 22. Among the four end faces of the component 20, a pair of end faces whose design positions are determined to be parallel to the pair of short sides 113, 114 are also referred to as a pair of second end faces 23, 24.

[0018] It should be noted that electronic components other than the image sensor may be mounted on the mounting board 10.

[0019] The mounting board 10 separated from the collective board 1 is attached to a housing 30 of an image pickup device (not shown) as shown in FIG. 3. The housing 30 is a housing part constituting a case of the image pickup device, and is a part that is directly attached to a vehicle. The housing 30 is formed, for example, in a bottomed rectangular tube shape, and is configured to be able to accommodate the mounting board 10 on which the components 20 are mounted. The housing 30 also has an inner peripheral surface 31 to which the mounting board 10 is attached. The inner peripheral surface 31 is formed in a planar shape that extends linearly when viewed from a direction perpendicular to the plate surface of the mounting board 10, and is set to face one of the pair of long sides 111 and 112 of the mounting board 10 when the mounting board 10 is accommodated.

[0020] The mounting board 10 has the joints 12 attached to the housing 30. Hereinafter, the two joints 12 attached to the housing 30 among the four joints 12 of the mounting board 10 are also referred to as the attachment parts 40. The mounting board 10 is attached to the housing 30 by connecting the attachment surfaces 41, which are the ends of the two attachment parts 40 attached to the housing 30, to the inner circumferential surface 31 inside the housing 30. Specifically, the mounting surface 41 of the mounting board 10 is pressed against the inner circumferential surface 31 of the housing 30 to be fixed to the housing 30. As a result, the mounting position of the mounting board 10 relative to the housing 30 is determined. Then, the mounting position of the component 20 mounted on the mounting board 10 relative to the housing 30 is determined. In this case, the mounting position of the component 20 relative to the housing 30 is based on the mounting position of the mounting board 10 on which the component 20 is mounted to the housing 30. As shown in FIG. 3, the design position of the component 20 in this embodiment is determined so that the pair of first end faces 21 and 22 are parallel to the inner circumferential surface 31.

[0021] Incidentally, the component 20 mounted on the mounting board 10 may be mounted shifted from its designed position. For example, as shown in the comparative example of Fig. 4, the component 20 is mounted on the surface of the mounting board 10 at an angle θ from its designed position. That is, the component 20 is mounted such that the pair of first end faces 21, 22 are inclined at the angle θ with respect to the pair of long side portions 111, 112, respectively, and the pair of second end faces 23, 24 are inclined at the angle θ with respect to the pair of short side portions 113, 114, respectively.

[0022] In such a case, when cutting each of the two mounting portions 40 from the collective substrate 1, it is assumed that the two mounting surfaces 41 are cut so as to be parallel to the pair of long sides 111, 112 of the mounting substrate 10. In other words, it is assumed that when mounting substrate 10 is attached to the housing 30, the two mounting portions 40 are cut so that the pair of long sides 111, 112 of the mounting substrate 10 are parallel to the inner peripheral surface 31 of the housing 30. It is assumed that the mounting surfaces 41 are then pressed against the inner peripheral surface 31 of the housing 30 to fix the mounting substrate 10 to the housing 30.

[0023] 5, component 20 is attached to housing 30 tilted at angle θ from the designed position. This is because the attachment position of mounting board 10 to housing 30 is used as the reference for the attachment position of component 20. In other words, when component 20 is mounted on mounting board 10 shifted from the designed position, if component 20 is attached to housing 30 based on mounting board 10, component 20 will be attached to housing 30 shifted from the designed position.

[0024] However, if the image sensor component 20 is attached to the housing 30 tilted at an angle θ from the design position, the image capturing device will capture a tilted image. In this case, the image capturing device needs to perform software processing such as correcting the tilted image, which is not preferable.

[0025] For this reason, as shown in FIG. 6, the mounting board 10 of this embodiment is formed such that the mounting surfaces 41 of the two mounting portions 40 are inclined along the inclination of the component 20 according to the deviation from the design position of the component 20. Specifically, the two mounting surfaces 41 are cut so that the angle between the direction extending along the long side portion 111 and the direction extending along the two mounting surfaces 41 is an angle θ that is the deviation from the design position of the component 20. That is, the mounting board 10 is cut along a virtual straight line VL in which the two mounting surfaces 41 extend at an angle θ with respect to the direction extending along the long side portion 111. In other words, the two mounting surfaces 41 are cut along the direction in which the pair of first end faces 21, 22 extend. As a result, the two mounting surfaces 41 and the pair of first end faces 21, 22 are parallel to each other.

[0026] The mounting position of the component 20 when the mounting board 10 having the two mounting surfaces 41 is mounted to the housing 30 in this manner will be described with reference to FIG. 7. Assume that the mounting board 10 is fixed to the housing 30 by pressing the two mounting surfaces 41 formed according to the deviation from the design position of the component 20 against the inner peripheral surface 31 of the housing 30. Then, as shown in FIG. 7, the mounting board 10 is mounted at an angle θ with respect to the housing 30. Therefore, even if the component 20 is mounted on the mounting board 10 at an angle θ from the design position, the mounting position of the component 20 can be brought closer to the design position. Specifically, the component 20 is mounted to the housing 30 so that the pair of first end faces 21, 22 are parallel to the inner peripheral surface 31 of the housing 30.

[0027] Therefore, even if the component 20, which is an image sensor, is attached to the mounting board 10 tilted at an angle θ from the design position, it is not necessary for the image capturing device to perform software processing such as correcting the tilted image.

[0028] The above is a description of the configuration of the mounting board 10 of this embodiment.

[0029] Next, a method for manufacturing the mounting board 10 of this embodiment will be described.

[0030] First, for example, as shown in Fig. 8, an aggregate substrate 1 including six mounting substrates 10 before components 20 are mounted thereon is prepared. The aggregate substrate 1 has a frame portion 3. A cutout portion 5 is also formed in the aggregate substrate 1. Then, as shown in Fig. 1 described above, the components 20 are placed on the surface of each of the six mounting substrates 10, and the components 20 are surface-mounted by soldering through reflow.

[0031] 9, the mounting positions of the components 20 mounted on each of the six mounting boards 10 are detected by a camera 50. The mounting positions of the components 20 may be detected by, for example, using a reference point previously determined on the collective board 1 as the origin. Alternatively, the mounting positions of the components 20 may be detected by, for example, using a reference point previously determined on each of the six mounting boards 10 as the origin. Note that the detection method for the mounting positions of the components 20 may be a method other than the use of a camera 50.

[0032] Then, based on the detected mounting positions of the components 20 mounted on each of the six mounting boards 10, the deviation of each component 20 from its design position is calculated.

[0033] Then, the joints 12 are cut based on the calculated deviation of each component 20 from the design position. As a result, each of the six mounting boards 10 is separated from the collective board 1 as shown in FIG. 2 and FIG. 6. The mounting board 10 is also cut according to the deviation of each of the mounting surfaces 41 of the two mounting portions 40 from the design positions of the components 20. For example, as described above, when the components 20 are mounted on the mounting board 10 at an angle θ with respect to the pair of long sides 111, 112, the two mounting surfaces 41 are cut along the virtual straight line VL extending at an angle θ with respect to the extension direction of the pair of long sides 111, 112.

[0034] Each of the six mounting boards 10 separated from the collective board 1 is attached to the housing 30 with the two mounting surfaces 41 pressed against the inner peripheral surface 31 of the housing 30. This allows the mounting position of the component 20 to be brought closer to the designed position even if the component 20 is mounted on the mounting board 10 tilted at the angle θ from the designed position.

[0035] As described above, the mounting board 10 of this embodiment includes the mounting portion 11 on which the component 20 is mounted, and the attachment portion 40 that is attached to the housing 30. When the component 20 is mounted at a mounting position shifted from a predetermined design position, the attachment portion 40 is formed in accordance with the deviation between the design position and the mounting position.

[0036] According to this, even if the component 20 is mounted on the mounting board 10 deviated from its designed position, the mounting position of the component 20 relative to the housing 30 can be brought closer to the designed position. Therefore, the accuracy of the mounting position of the component 20 relative to the housing 30 can be improved.

[0037] Furthermore, according to the above embodiment, the following effects can be obtained.

[0038] (1) In the above embodiment, the housing 30 has an inner circumferential surface 31 to which the mounting board 10 is attached. The mounting portion 40 has a mounting surface 41 that is attached to the inner circumferential surface 31. The mounting surface 41 is formed along the inclination of the component 20 when the component 20 is mounted at an angle with respect to the design position.

[0039] According to this, even if the component 20 is mounted on the mounting board 10 tilted from the designed position, the mounting position of the component 20 with respect to the housing 30 can be moved closer to the designed position by tilting the mounting position of the component 20 with respect to the housing 30. Therefore, the accuracy of the mounting position of the component 20 with respect to the housing 30 can be improved.

[0040] (2) In the above embodiment, a plurality of mounting substrates 10 are formed on the aggregate substrate 1. The aggregate substrate 1 has a frame portion 3 surrounding each of the plurality of mounting substrates 10. The mounting substrate 10 has a joining portion 12 that is joined to the frame portion 3 and is separated from the frame portion 3 with the components 20 mounted on the mounting portion 11. The joining portion 12 is configured as an attachment portion 40.

[0041] This simplifies the configuration of the mounting board 10 compared to a configuration in which the attachment portion 40 is provided separately from the coupling portion 12 .

[0042] (4) In the above embodiment, the component 20 is an image sensor.

[0043] As described above, when the component 20 is an image sensor, if the component 20, which is an image sensor, is attached to the housing 30 tilted from the design position, the image capturing device will capture a tilted image. In this case, the image capturing device needs to perform software processing such as correcting the tilted image.

[0044] In contrast, according to the mounting board 10 of this embodiment, even if the component 20, which is an image sensor, is attached to the mounting board 10 at an angle from the design position, it is possible to eliminate the need for software processing such as correcting the tilted image of the image capturing device.

[0045] (Other embodiments) Representative embodiments of the present disclosure have been described above, but the present disclosure is not limited to the above-described embodiments and can be modified in various ways, for example, as described below.

[0046] In the above embodiment, the mounting board 10 is attached to the housing 30 of the image capturing device, but the present invention is not limited to this. For example, the mounting board 10 may be attached to the housing of a device other than the image capturing device.

[0047] In the above embodiment, the component 20 is an image sensor, but the component 20 is not limited to this. For example, the component 20 may be a connector that can be fitted.

[0048] For example, if component 20 is an insertion connector, and the insertion connector is attached to housing 30 deviated from its designed position, it is necessary to adjust the position of the connector that fits into the insertion connector.

[0049] In contrast, according to the mounting board 10 of this embodiment, even if the component 20, which is the connector on the insertion side, is attached to the mounting board 10 deviated from the designed position, there is no need to adjust the position of the connector on the side that fits into the connector on the insertion side.

[0050] In the above embodiment, an example has been described in which the mounting surface 41 is formed along the inclination of the component 20 when the component 20 is mounted on the mounting board 10 at an angle, but the present invention is not limited to this. For example, assume that the component 20 is not inclined on the mounting board 10, but is mounted shifted from the design position along the direction in which the pair of second end faces 23, 24 extend.

[0051] Even in this case, by adjusting the cutting position of the coupling portion 12, which is the attachment portion 40, of the mounting board 10, even if the component 20 is mounted on the mounting board 10 deviated from the designed position, the attachment position of the component 20 relative to the housing 30 can be brought closer to the designed position. Therefore, the accuracy of the attachment position of the component 20 relative to the housing 30 can be improved.

[0052] In the above-described embodiments, it goes without saying that the elements constituting the embodiments are not necessarily essential, except in cases where it is particularly expressly stated that they are essential or where they are clearly considered to be essential in principle.

[0053] In the above-described embodiments, when numerical values ​​such as the number, values, amounts, ranges, etc. of components of the embodiments are mentioned, they are not limited to the specific numbers unless it is specifically stated as required or unless it is clearly limited to a specific number in principle.

[0054] In the above-described embodiments, when referring to the shapes, positional relationships, etc. of components, etc., there is no limitation to those shapes, positional relationships, etc., unless specifically stated or in principle limited to a specific shape, positional relationship, etc.

[0055] (In view of the present disclosure) The present disclosure described above can be understood from the following viewpoints, for example.

[0056] [First viewpoint] A mounting board to be attached to a housing (30) as an attachment target, The electronic component (20) includes a mounting portion (11) on which the electronic component (20) is mounted and a mounting portion (40) that is attached to the housing, When the component is mounted at a mounting position deviated from a predetermined design position, the attachment portion is formed in accordance with the deviation between the design position and the mounting position.

[0057] [Second viewpoint] the housing has an inner circumferential surface to which the mounting board is attached, The mounting portion has a mounting surface (41) that is attached to the inner circumferential surface, The mounting board according to a first aspect, wherein the attachment surface is formed to follow an inclination of the component when the component is mounted at an inclination with respect to the design position.

[0058] [Third Perspective] The mounting substrate is formed in plurality on an aggregate substrate (1), The assembly substrate has a frame portion (3) surrounding each of the plurality of mounting substrates, the mounting board has a coupling portion (12) coupled to the frame portion and separated from the frame portion in a state in which the component is mounted on the mounting portion; The mounting board according to the first or second aspect, wherein the attachment portion is constituted by the coupling portion.

[0059] [Fourth viewpoint] The mounting board according to any one of the first to third aspects, wherein the component is an image sensor.

[0060] [Fifth viewpoint] A method for manufacturing a mounting board having a mounting portion (11) on which a component (20) is mounted and attached to a housing (30) that is an attachment target, comprising the steps of: preparing an aggregate substrate (1) including a plurality of the mounting substrates, the aggregate substrate (1) having a frame portion (3) surrounding each of the plurality of mounting substrates and a coupling portion (12) coupling the plurality of mounting substrates to the frame portion; Mounting the components at predetermined design positions for the mounting portions of each of the plurality of mounting boards; detecting a mounting position of each of the components mounted on the mounting portion of each of the plurality of mounting boards, and calculating a deviation between the design position and the mounting position; cutting the joints and separating the plurality of mounting substrates from the collective substrate; The coupling portion is a portion attached to the housing, cutting the joint portion and separating the mounting board from the aggregate board, the method for manufacturing a mounting board includes forming a portion of the joint portion to be attached to the housing in accordance with a calculated deviation between the design position and the mounting position. [Explanation of symbols]

[0061] 1. Collective board 3 Frame 11 Mounting section 12 Joint 20 parts 30 Case 40 Mounting part

Claims

1. A mounting board to be attached to a housing (30) as an attachment target, The electronic component (20) includes a mounting portion (11) on which the electronic component (20) is mounted and a mounting portion (40) that is attached to the housing, When the component is mounted at a mounting position deviated from a predetermined design position, the attachment portion is formed in accordance with the deviation between the design position and the mounting position.

2. the housing has an inner circumferential surface to which the mounting board is attached, The mounting portion has a mounting surface (41) that is attached to the inner circumferential surface, The mounting board according to claim 1 , wherein the mounting surface is formed to follow an inclination of the component when the component is mounted at an inclination with respect to the design position.

3. The mounting substrate is formed in plurality on an aggregate substrate (1), The assembly substrate has a frame portion (3) surrounding each of the plurality of mounting substrates, the mounting board has a coupling portion (12) coupled to the frame portion and separated from the frame portion in a state in which the component is mounted on the mounting portion; The mounting board according to claim 1 , wherein the attachment portion is formed by the coupling portion.

4. The mounting board according to claim 1 , wherein the component is an image sensor.

5. A method for manufacturing a mounting board having a mounting portion (11) on which a component (20) is mounted and attached to a housing (30) that is an attachment target, comprising the steps of: preparing an aggregate substrate (1) including a plurality of the mounting substrates, the aggregate substrate (1) having a frame portion (3) surrounding each of the plurality of mounting substrates and a coupling portion (12) coupling the plurality of mounting substrates to the frame portion; Mounting the components at predetermined design positions for the mounting portions of each of the plurality of mounting boards; detecting a mounting position of each of the components mounted on the mounting portion of each of the plurality of mounting boards, and calculating a deviation between the design position and the mounting position; cutting the joints and separating the plurality of mounting substrates from the collective substrate; The coupling portion is a portion attached to the housing, cutting the joint portion and separating the mounting board from the aggregate board, the method for manufacturing a mounting board includes forming a portion of the joint portion to be attached to the housing in accordance with a calculated deviation between the design position and the mounting position.

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