Substrate processing apparatus

Abstract

To provide a substrate processing apparatus that can easily transfer a substrate while allowing stable attitude change by providing a sufficient clearance to allow the apparatus to rise when transferring the substrate.SOLUTION: When the postures of multiple substrates W are changed, a posture changing unit 41 holds the multiple substrates W with a narrow gap between the upper surfaces of the multiple substrates W. Therefore, the multiple substrates W can be stably held and the postures can be stably changed. When the multiple substrates W are transferred in a horizontal posture, the posture changing unit 41 holds the multiple substrates W with a wide gap US between the upper surfaces of the multiple substrates W. Therefore, a bridge robot can easily transfer each of the multiple substrates W.SELECTED DRAWING: Figure 21

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus for performing predetermined processing on substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks. [Background technology]

[0002] Conventionally, this type of apparatus includes a batch module, a single-wafer module, and a rotation mechanism (see, for example, Patent Document 1). The batch module processes multiple substrates at once. The single-wafer module processes substrates one by one. In general, the drying process using the single-wafer module has a smaller processing atmosphere space that affects the substrates and has higher particle performance than the drying process using the batch module. Therefore, the single-wafer module is easier to improve the drying performance than the batch module. Therefore, for example, after the etching process and rinsing process are performed in the batch module, the drying process is performed in the single-wafer module.

[0003] In the batch-type module, multiple substrates are processed in a vertical position. On the other hand, in the single-wafer-type module, substrates are processed in a horizontal position. Therefore, the substrates in a vertical position that have finished processing in the batch-type module are converted to a horizontal position by a rotation mechanism before being transferred to the single-wafer-type module. The rotation mechanism includes an inversion chuck with grooves for clamping the substrates.

[0004] Specifically, the groove of the inversion chuck has a guide groove on the front side and a locking groove on the back side. The guide groove is configured in a V-shape to guide the periphery of the substrate. The locking groove has a shape that is slightly thicker than the thickness of the substrate so as to lock the end face of the substrate while preventing the substrate from moving significantly in the thickness direction. As a result, when the inversion chuck clamps the substrate, the periphery of the substrate is guided by the guide groove, and the end face of the substrate is gripped by the locking groove. Therefore, the substrate can be rotated stably. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2016-502275 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the conventional example having such a configuration has the following problems. That is, in the conventional device, the distance that the substrate can be raised in the locking groove of the inversion chuck is very short. Therefore, although the posture can be changed stably, there is a problem that it is difficult to control the hand that receives the substrate in the horizontal posture.

[0007] The present invention has been made in consideration of the above circumstances, and has an object to provide a substrate processing apparatus that can easily transfer substrates while allowing stable posture changes by providing a gap that allows sufficient lift when transferring the substrate. [Means for solving the problem]

[0008] In order to achieve the above object, the present invention has the following configuration. That is, the invention described in claim 1 is a substrate processing apparatus for processing substrates, comprising a batch processing section which processes a plurality of substrates collectively in a vertical position, a single substrate processing section which processes a single substrate in a horizontal position, a posture changing section which converts the plurality of substrates which have been processed in the batch processing section from a vertical position to a horizontal position, a first transport section which transports the plurality of substrates which have been processed in the batch processing section to the posture changing section, and a second transport section which transports the plurality of substrates which have been brought into a horizontal position in the posture changing section to the single substrate processing section, wherein the posture changing section holds the plurality of substrates with a narrow gap above their upper surfaces when changing the posture of the plurality of substrates, and holds the plurality of substrates with a wide gap above their upper surfaces when bringing the plurality of substrates into a horizontal position and transferring them.

[0009] [Function and Effect] According to the invention described in claim 1, a plurality of substrates processed in a batch processing section are transported by a first transport section to a posture changing section, and then are converted from a vertical posture to a horizontal posture in the posture changing section. The plurality of substrates converted to a horizontal posture are transferred one by one by a second transport section, and then are processed in a single-wafer processing section. When converting the posture of the plurality of substrates, the posture changing section holds the plurality of substrates in a state in which the gap above the upper surfaces of the plurality of substrates is narrow. Therefore, the plurality of substrates can be stably held, and the posture can be stably changed. When transferring the plurality of substrates in a horizontal posture, the posture changing section holds the plurality of substrates in a state in which the gap above the upper surfaces of the plurality of substrates is wide. Therefore, the second transport section can easily transfer each of the plurality of substrates.

[0010] Also, in the present invention, the posture conversion unit includes inversion chucks disposed to face each other in a radial direction of the plurality of substrates and clamping peripheral portions of the plurality of substrates, a drive mechanism for horizontally moving the inversion chuck across at least two locations: a first gap for transferring the plurality of substrates between the first transport unit and the second transport unit, and a second gap narrower than the first gap and clamping the plurality of substrates; and a rotation mechanism for rotating the inversion chuck in a surface direction of the plurality of substrates, the inversion chuck having a first groove for allowing the plurality of substrates to move in a thickness direction, and a rotation mechanism for rotating the inversion chuck in a surface direction of the plurality of substrates, the inversion chuck having a first groove for allowing the plurality of substrates to move in a thickness direction, and a rotation mechanism for rotating the inversion chuck in a surface direction of the plurality of substrates, the first groove being formed outward of the plurality of substrates from the first groove and configured to rotate the plurality of substrates in a thickness direction. and a second groove that clamps the plurality of substrates in a radial direction while restricting movement of the substrate in a vertical direction, and when the inversion chuck receives the plurality of substrates from the first transport unit, the driving mechanism causes the first interval to be set and each of the plurality of substrates to be accommodated in the first groove, and when the rotation mechanism rotates the plurality of substrates into a horizontal position, the driving mechanism causes the second interval to be set and each of the plurality of substrates to be clamped in the second groove, and when the second transport unit receives the plurality of substrates from the inversion chuck, it is preferable that the driving mechanism causes the first interval to be set and each of the plurality of substrates to be abutted and supported by the first groove (claim 2).

[0011] When the inversion chuck receives the substrates from the first transport unit, the drive mechanism causes the substrates to be spaced apart by a first distance and accommodated in the first groove. When the rotation mechanism rotates the substrates to a horizontal position, the drive mechanism causes the substrates to be spaced apart by a second distance and clamped in the second groove. Therefore, when changing the position, the substrates are restricted from moving in the thickness direction. As a result, the substrates can be stably held and the position can be changed stably. When the second transport unit receives the substrates from the inversion chuck, the drive mechanism causes the substrates to be spaced apart by a first distance and support the lower surfaces of the substrates in contact with the first groove. Therefore, when the substrates are transferred, the substrates are allowed to move in the thickness direction. As a result, the second transport unit can easily pick up and transfer each of the substrates. The position change unit can clamp or loosely hold the substrates simply by moving the inversion chuck horizontally with the drive mechanism.

[0012] Furthermore, in the present invention, it is preferable that the second groove has a top where the end faces of the multiple substrates are located and a rear-side inclined surface that widens from the top toward the center of the multiple substrates, and the first groove has an opening toward the center of the multiple substrates and a front-side inclined surface that widens from the rear-side inclined surface toward the opening (Claim 3).

[0013] The inversion chuck is formed with two grooves, a first groove and a second groove. The second groove holds the edge of the substrate at its top and supports the underside of the substrate with its rear inclined surface. This allows the substrate to be stably clamped. The first groove, which continues from the second groove, abuts and supports the underside of the substrate with its front inclined surface that widens toward the opening. This allows a sufficient gap to be formed on the upper surface of the substrate.

[0014] In the present invention, it is preferable that the rear inclined surface and the front inclined surface have inclined surfaces at positions facing the front and rear surfaces of the plurality of substrates (claim 4).

[0015] In a substrate processing apparatus, a lot consisting of a plurality of substrates with their surfaces facing each other (so-called face to face) may be processed. When processing such a lot, a plurality of substrates with their surfaces facing a predetermined direction may be held by an inversion chuck and inverted, or a plurality of substrates with their surfaces facing the opposite direction to the predetermined direction may be held by an inversion chuck and inverted in the opposite direction to the substrates with their surfaces facing the predetermined direction. Thereafter, the bottom surface of the substrate slides along the rear inclined surface and is supported in contact with the front inclined surface. Therefore, regardless of the direction of the plurality of substrates with their surfaces facing in any direction, they can be reliably moved from the rear inclined surface to the front inclined surface and supported in contact with the front inclined surface.

[0016] In the present invention, it is preferable that the front side inclined surface has a gentler inclination than the rear side inclined surface (claim 5).

[0017] When the inversion chuck is moved from the second interval to the first interval, the substrate is moved from the rear inclined surface to the front inclined surface. At that time, the impact applied to the bottom surface of the substrate can be reduced, so that the generation of particles when the substrate is moved from the second interval to the first interval can be suppressed.

[0018] In addition, in the present invention, it is preferable that the posture conversion unit further includes an alignment bar that is movable between a restricting position that restricts horizontal movement of the multiple substrates and a allowing position that allows horizontal movement of the multiple substrates while the multiple substrates are held in a horizontal posture by the inversion chuck, and that the alignment bar is moved to the restricting position before the inversion chuck is expanded from the second spacing to the first spacing (Claim 6).

[0019] The alignment bar is moved to the regulating position before the inversion chuck is expanded from the second interval to the first interval. Therefore, it is possible to prevent the multiple substrates from shifting in the horizontal direction when the inversion chuck moves. As a result, the substrates can be reliably transferred by the second transport unit.

[0020] In addition, in the present invention, it is preferable that, in a planar view, the alignment bar is provided on the side where the second transport section receives the multiple substrates and on the side opposite the receiving side across the multiple substrates (Claim 7).

[0021] The horizontal position of the substrate on the side where the second transport unit advances and retreats can be regulated. Therefore, the front and rear positions of the substrate can be regulated when viewed from the second transport unit. As a result, the substrate can be reliably delivered when the second transport unit delivers the substrate.

[0022] In addition, in the present invention, after the spacing is expanded from the second spacing to the first spacing, when the second transport unit receives the multiple substrates from the inversion chuck, it is preferable that the alignment bar on the receiving side among the alignment bars is moved to the allowable position (Claim 8).

[0023] The substrate is transferred by the second transport unit after the alignment bar on the receiving side of the alignment bars is moved to the allowable position, which allows the second transport unit to smoothly transfer the substrate.

[0024] In the present invention, it is preferable that the alignment bar has a plurality of grooves formed therein corresponding to the positions of the end faces of the plurality of substrates (claim 9).

[0025] When the inversion chuck is moved from the second interval to the first interval, the substrates move downward from the rear inclined surface to the front inclined surface, and large horizontal movement at that time is restricted, and generation of particles due to rubbing of the edge surfaces of the substrates can be suppressed.

[0026] In addition, in the present invention, it is preferable that the apparatus further includes a lifting mechanism for raising and lowering the inversion chuck, and when the second transport unit receives the plurality of substrates from the inversion chuck, the lifting mechanism lowers the inversion chuck (Claim 10).

[0027] The substrate can be transferred to the second transfer unit by lowering the inversion chuck using the lifting mechanism without lifting or lowering the second transfer unit, thus simplifying the configuration of the second transfer unit.

[0028] Furthermore, in the present invention, when the first transport unit transfers the multiple substrates to the inversion chuck, it is preferable that the lifting mechanism lowers the inversion chuck, which has the first interval, from a receiving height near the upper edges of the multiple substrates transported by the first transport unit to a clamping height near the side edges of the multiple substrates (Claim 11).

[0029] When the lifting mechanism lowers the inversion chuck at the first interval from the receiving height to the clamping height, multiple substrates can be delivered to the inversion chuck. Therefore, multiple substrates can be delivered with simple control. Effect of the Invention

[0030] According to the substrate processing apparatus of the present invention, a plurality of substrates processed in a batch processing section are transported by a first transport section to a posture changing section, and then converted from a vertical posture to a horizontal posture by the posture changing section. The plurality of substrates converted to a horizontal posture are transferred one by one by a second transport section, and then processed in a single-wafer processing section. When changing the posture of the plurality of substrates, the posture changing section holds the plurality of substrates in a state in which the gap above the upper surfaces of the plurality of substrates is narrow. Therefore, the plurality of substrates can be stably held, and the posture can be stably changed. When transferring the plurality of substrates in a horizontal posture, the posture changing section holds the plurality of substrates in a state in which the gap above the upper surfaces of the plurality of substrates is wide. Therefore, the second transport section can easily transfer each of the plurality of substrates. [Brief description of the drawings]

[0031] [Figure 1] 1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment; [Diagram 2] 2 is a cross-sectional view taken along the line AA in FIG. 1. [Diagram 3]FIG. 2 is a plan view showing the configuration of a 25-plate chuck and a reversing chuck. [Figure 4] FIG. 2 is a front view showing a state in which the inversion chuck is at a first interval. [Diagram 5] FIG. 13 is a front view showing a state in which the inversion chuck is at a second interval. [Figure 6] FIG. 2 is a cross-sectional view of the inversion chuck when the inversion chuck is at a first interval. [Figure 7] FIG. 11 is a cross-sectional view of the inversion chuck when the inversion chuck is at a second interval. [Figure 8] FIG. 13 is a front view showing the configuration of the attitude changing unit and showing a state in which the substrate is held in a vertical attitude. [Figure 9] FIG. 13 is a front view showing the configuration of the attitude changing unit and showing a state in which the substrate is held in a horizontal attitude. [Figure 10] FIG. [Figure 11] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 12] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 13] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 14] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 15] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 16] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 17] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 18] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 19] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 20] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 21] 5A to 5C are vertical cross-sectional views showing the operation of an inversion chuck. [Figure 22] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Diagram 23]13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 24] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Diagram 25] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 26] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 27] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 28] 13A to 13C are diagrams illustrating an attitude changing operation of the substrate. [Figure 29] 13A and 13B are diagrams illustrating a modified example of the inversion chuck, showing a state during transfer. [Diagram 30] FIG. 13 is a diagram showing a modified example of the inversion chuck, illustrating a state during posture change. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0033] Fig. 1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment of the present invention, and Fig. 2 is a cross-sectional view taken along line AA in Fig. 1.

[0034] <1. Overall composition>

[0035] The substrate processing apparatus 1 processes substrates W. For example, the substrate processing apparatus 1 performs chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing apparatus 1 employs a processing method (a so-called hybrid method) that combines the batch type and single-wafer type. The batch type processes multiple substrates W collectively in a vertical position. The single-wafer type processes a single substrate W in a horizontal position.

[0036] The substrate processing apparatus 1 includes a batch processing apparatus 3 and a single wafer processing apparatus 5. In this embodiment, the single wafer processing apparatus 5 is disposed adjacent to the batch processing apparatus 3. The batch processing apparatus 3 and the single wafer processing apparatus 5 are disposed apart from each other. The batch processing apparatus 3 and the single wafer processing apparatus 5 are connected by a bridge section 7.

[0037] <2. Batch processing equipment>

[0038] The batch processing apparatus 3 collectively processes a plurality of substrates W. The batch processing apparatus 3 includes a carry-in block 9, a stocker block 11, a transfer block 13, a position changing block 15, and a processing block 17.

[0039] For convenience, in this specification, the direction in which the loading block 9, the stocker block 11, the transfer block 13, and the processing block 17 are lined up is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the stocker block 11 toward the loading block 9 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." In each figure, for reference, front, back, right, left, top, and bottom are indicated as appropriate.

[0040] <3. Carry-in block>

[0041] The carry-in block 9 includes a loading section 19. The loading section 19 is disposed in front X of the batch processing apparatus 3. The carrier C stores a plurality of (e.g., 25) substrates W in a horizontal position, stacked at regular intervals in the vertical direction Z. The carrier C has a plurality of grooves (not shown) formed therein, which separate the surfaces of the substrates W from each other and accommodate the substrates W one by one. An example of the carrier C is a front opening unify pod (FOUP). The FOUP is a sealed container. The carrier C may be an open container, and any type of carrier is acceptable. The loading section 19 includes, for example, two mounting tables 21 on which the carriers C are placed. The two mounting tables 21 are disposed, for example, along the width direction Y. The loading section 19 is also called a load port.

[0042] <4. Stocker block>

[0043] The stocker block 11 is disposed adjacent to the rear X of the carry-in block 9. The stocker block 11 includes a transport storage unit ACB. The transport storage unit ACB includes a transport mechanism 23 and a shelf 25.

[0044] The transport mechanism 23 transports the carrier C. The transport storage unit ACB includes a plurality of shelves 25. Some of the shelves 25 are simply temporarily placed on the carrier C, and others are placed on the carrier C for transfer to and from the first transport mechanism HTR. The transport storage unit ACB takes in the carrier C storing the unprocessed substrate W from the input unit 19 and places it on the shelf 25. The transport storage unit ACB transports and places the carrier C on the transfer shelf 25 according to a schedule that defines the order of processing. The transport storage unit ACB transports and places the emptied carrier C placed on the transfer shelf 25 on the shelf 25. The transport storage unit ACB unloads the empty carrier C placed on the shelf 25 to the placement table 21 according to the availability of the placement table 21. The empty carrier C is transported to the single-wafer processing unit 5. In the empty carrier C transported to the single-wafer processing section 5, for example, a substrate W that was stored in this carrier C before processing and has completed processing is stored in the single-wafer processing section 5.

[0045] <5. Transfer block>

[0046] The transfer block 13 is disposed adjacent to the rear X of the stocker block 11. The transfer block 13 includes a transfer mechanism CTC. The transfer mechanism CTC includes a first transport mechanism HTR, a conversion mechanism HVC, a pusher PH, and a second transport mechanism WTR.

[0047] A first transport mechanism HTR is disposed on the right side Y of the rear X of the transport storage unit ACB. The first transport mechanism HTR transports a plurality of substrates W in a batch. In other words, the first transport mechanism HTR is equipped with a plurality of hands (not shown). One hand supports one substrate W. The first transport mechanism HTR can also transport only one substrate W. The first transport mechanism HTR takes out a plurality of substrates W (e.g., 25 substrates) in a batch from a carrier C placed on a delivery shelf 25 in the transport storage unit ACB, and transports them in a horizontal position to the conversion mechanism HVC. At this time, the conversion mechanism HVC converts the position of the substrates W from a horizontal position to a vertical position.

[0048] A conversion mechanism HVC and a pusher PH are arranged in this order to the left Y of the first transport mechanism HTR. The conversion mechanism HVC delivers multiple substrates W to the pusher PH. After receiving the multiple substrates W from the conversion mechanism HVC, the pusher PH moves in the width direction Y to the second transport mechanism WTR. At that time, the conversion mechanism HVC and the pusher PH assemble or disassemble a batch lot. The pusher PH delivers the multiple substrates W to the second transport mechanism WTR.

[0049] The transfer mechanism CTC combines, for example, a plurality of substrates W constituting one lot taken out from one carrier C with a plurality of substrates W constituting another lot taken out from another carrier C into one batch lot. This is the assembly of the batch lot. A batch lot is composed of twice as many substrates W as one lot. In the batch lot, each substrate W of one lot is arranged so as to be adjacent to each substrate W of the other lot. In other words, each substrate W of one lot is arranged in an odd-numbered position, and each substrate W of the other lot is arranged in an even-numbered position. Usually, the interval between the substrates W taken out from the carrier C is the same as that of the carrier C. This is called a full pitch. In one batch lot, for example, the interval between the substrates W is half of the full pitch. This is called a half pitch. As described above, a batch lot is combined with another lot, but there are two types of combination methods: front surface matching (also called face to face) and front and back surface matching (also called back to face). The combination method of the lots is determined by the operation of the pusher PH. In addition, details of this operation will be omitted in order to facilitate understanding of the present invention. In the following description, a plurality of substrates W will be referred to as a lot, but when a description specific to a batch lot is required, a plurality of substrates W will be referred to as a batch lot.

[0050] The second transport mechanism WTR is disposed to the left Y of the transfer mechanism CTC. The second transport mechanism WTR is configured to be movable between the transfer block 13 and the processing block 17. The second transport mechanism WTR is configured to be movable in the front-rear direction X. The second transport mechanism WTR includes a pair of hands 27 that transport a lot. The pair of hands 27 includes, for example, a rotation shaft oriented in the width direction Y. The pair of hands 27 swings around this rotation shaft. The pair of hands 27 clamps the side end faces of the substrates W constituting the lot, which are located in the front-rear direction X. The second transport mechanism WTR transfers the substrates W constituting the lot between the transfer mechanism CTC. The second transport mechanism WTR transfers the unprocessed substrates W constituting the lot to the processing block 17. The second transport mechanism WTR transfers the substrates W processed in the processing block 17 between the posture conversion block 15.

[0051] Here, processing block 17 will be described prior to posture transformation block 15.

[0052] <6. Processing block>

[0053] The processing block 17 includes, for example, a batch processing unit BPU. For example, the batch processing unit BPU includes six processing units. Specifically, the batch processing unit BPU includes a first batch processing unit BPU1, a second batch processing unit BPU2, a third batch processing unit BPU3, a fourth batch processing unit BPU4, a fifth batch processing unit BPU5, and a sixth batch processing unit BPU6. The number of batch processing units BPU is not limited to six. That is, the number of batch processing units BPU may be less than six, or may be seven or more.

[0054] The first batch processing unit BPU1 to the sixth batch processing unit BPU6 are arranged in a row in the front-rear direction X. Each of the first batch processing unit BPU1 to the sixth batch processing unit BPU6 includes a processing tank BB and a lifter LF. The processing tank BB stores a processing liquid. The processing liquid is pure water or a chemical liquid. The chemical liquid is, for example, an organic solvent or an etching liquid. The organic solvent is, for example, IPA (isopropyl alcohol). The etching liquid is, for example, a phosphoric acid solution.

[0055] The lifter LF moves up and down between a processing position inside the processing tank BB and a transfer position above the liquid level in the processing tank BB. The lifter LF transfers a plurality of substrates W between the second transport mechanism WTR and the transfer position. The first batch processing unit BPU1 to the sixth batch processing unit BPU6 are associated with each other, for example, in pairs. Specifically, the first batch processing unit BPU1 and the second batch processing unit BPU2 form one pair, the third batch processing unit BPU3 and the fourth batch processing unit BPU4 form one pair, and the fifth batch processing unit BPU5 and the second batch processing unit BPU6 form one pair. Each pair is assigned to perform, for example, a chemical liquid processing and a cleaning processing. The first batch processing unit BPU1 to the sixth batch processing unit BPU6 can process, for example, up to 50 substrates W at once. In other words, the first batch processing unit BPU1 to the sixth batch processing unit BPU6 can simultaneously process, for example, a maximum of one batch lot.

[0056] Each processing tank BB is supplied with processing liquid from below. The processing liquid is discharged over the upper edge of each processing tank BB. Each processing tank BB immerses multiple substrates W placed on a lifter LF in the processing liquid. Each lifter LF abuts and holds the lower edge of the substrate W. Each lifter LF transfers multiple substrates W between the second transport mechanism WTR and the processing tank BB.

[0057] <7. Posture change block>

[0058] 2, the posture changing block 15 includes a 25-chuck TFC, a standby tank 31, and a posture changing tank 33. In the drawings referring to the standby tank 31 and the posture changing tank 33, the liquid levels are omitted so that each component can be easily seen.

[0059] The standby tank 31 includes a processing tank BB0 and a lifter LF0. The processing tank BB0 has the same configuration as the processing tank BB included in the first batch processing unit BPU1 to the sixth batch processing unit BPU6 described above. The lifter LF0 moves up and down between a standby position inside the processing tank BB0 and a transfer position above the liquid level in the processing tank BB0. The standby tank BB0 stores a processing liquid. The processing liquid is, for example, pure water. At the standby position, the substrate W placed on the lifter LF0 is entirely submerged in the processing liquid.

[0060] Here, reference is made to Fig. 3. Fig. 3 is a plan view showing the configuration of the 25-blade chuck and the reversal chuck.

[0061] The 25-plate chuck TFC moves horizontally only in the width direction Y as a whole. The 25-plate chuck TFC does not move up and down in the vertical direction Z. The 25-plate chuck TFC does not move horizontally in the front-rear direction X. However, the 25-plate chuck TFC opens and closes the hand 35 between the holding position PC and the passing position PT. At the holding position PC, the 25-plate chuck TFC holds multiple substrates W. At the passing position PT, the 25-plate chuck TFC does not hold multiple substrates W. In other words, the passing position PT allows the lifter LF0 holding multiple substrates W to move between the transfer position and the standby position. The 25-plate chuck TFC moves, for example, in the width direction Y to three positions: a first transfer position P1, a second transfer position P2, and a third transfer position P3.

[0062] The 25-substrate chuck TFC includes a locking portion 37. The locking portion 37 is provided inside the hand 35. The locking portions 37 are formed in the width direction Y at intervals of the above-mentioned full pitch. The first transfer position P1 and the second transfer position P2 differ in position in the width direction Y by a distance corresponding to the half pitch. The third transfer position P3 is a position where a plurality of substrates W are transferred to the posture change tank 33. The 25-substrate chuck TFC receives only one lot from the lifter LF0 at the first transfer position P1. Specifically, of the two lots constituting the batch lot, it receives only the plurality of substrates W that are odd numbers constituting the first lot. The 25-substrate chuck TFC receives only the other lot from the lifter LF0 at the second transfer position P2. Specifically, of the two lots constituting the batch lot, it receives only the plurality of substrates W that are even numbers constituting the next lot.

[0063] Here, in addition to Fig. 2 and Fig. 3, Fig. 4 to Fig. 7 will be further referred to. Fig. 4 is a front view in a state where the inversion chuck is at a first interval. Fig. 5 is a front view in a state where the inversion chuck is at a second interval. Fig. 6 is a cross-sectional view in a state where the inversion chuck is at the first interval. Fig. 7 is a cross-sectional view in a state where the inversion chuck is at the second interval.

[0064] As shown in FIG. 2, the position changing tank 33 includes a dipping tank DB and a position changing section 41.

[0065] First, the main parts will be described. In the posture changing tank 33, the postures of a plurality of substrates W are changed collectively in the immersion tank DB by the inversion chuck 43. Specifically, the inversion chuck 43 changes the posture of the plurality of substrates W from a vertical posture to a horizontal posture. The inversion chuck 43 changes the posture of, for example, half of the substrates W constituting a batch lot. The inversion chuck 43 changes the posture of, for example, 25 substrates W. The inversion chucks 43 are disposed opposite each other in the radial direction of the substrates W and hold the peripheral portions of the substrates W. The immersion tank DB stores a processing liquid. The processing liquid is, for example, pure water.

[0066] 4 and 5, the inversion chuck 43 includes a pair of chuck members 45. The length of the chuck members 45 in the vertical direction Z when receiving or holding the vertically oriented substrate W is shorter than the radius of the substrate W. As shown in Fig. 3, the length of the chuck members 45 in the width direction Y when receiving or holding the vertically oriented substrate W is slightly longer than the length of the substrates W in the alignment direction in a lot.

[0067] 4 to 6, each chuck member 45 has a groove portion 47 on the opposing surface. As shown in Fig. 4 and Fig. 5, the groove portion 47 has an arc-like shape when viewed from the width direction Y in a vertical position for receiving and holding the vertically oriented substrate W. The arc-like shape of the groove portion 47 follows the outer edge of the substrate W.

[0068] 6, the groove portion 47 has a first groove SL1 and a second groove SL2. The first groove SL1 allows the multiple substrates W to move in the thickness direction. The second groove SL2 is formed outward of the first groove SL1 in the radial direction of the multiple substrates W and clamps the multiple substrates W in the radial direction while restricting the multiple substrates W from moving in the thickness direction.

[0069] The second groove SL2 has an apex 49 where the edge faces of the multiple substrates W are located, and a rear inclined surface 51 that widens from the apex 49 toward the center of the multiple substrates W. The apex 49 is formed at the portion where the two rear inclined surfaces 51 are narrowest. The apex 49 has a size capable of accommodating the edge faces of the substrates W. The rear inclined surface 51 is formed at a position facing the front and back surfaces of the substrates W.

[0070] The first groove SL1 has an opening 53 at the center of the multiple substrates W. The first groove SL1 has a front side inclined surface 55 that widens from the back side inclined surface 51 toward the opening 53. The front side inclined surface 55 is formed at a position facing the front and back surfaces of the substrate W. The dimension of the opening 53 in the width direction Y is, for example, several times larger than the thickness of the substrate W.

[0071] The front side inclined surface 55 is formed to have a gentler slope than the rear side inclined surface 51. In other words, the rear side inclined surface 51 is formed to have a steeper slope toward the apex 49 than the front side inclined surface 55.

[0072] The pair of chuck members 45 move in the front-rear direction X over a first distance WD1 and a second distance WD2. The pair of chuck members 45 can change the distance between the opposing grooves 47. The first distance WD1 is a distance for transferring substrates between the 25-plate chuck TFC and the bridging portion 7. The second distance WD2 is narrower in the front-rear direction X than the first distance WD1 and is a distance for clamping multiple substrates W.

[0073] Here, the attitude changing unit 41 will be described with reference to Fig. 8 to Fig. 10. Fig. 8 is a front view showing the configuration of the attitude changing unit and showing a state in which the substrate is held in a vertical attitude. Fig. 9 is a front view showing the configuration of the attitude changing unit and showing a state in which the substrate is held in a horizontal attitude. Fig. 10 is a plan view of the attitude changing unit.

[0074] The attitude changing unit 41 includes a lifting mechanism 61, a driving mechanism 63, a rotating mechanism 65, and an alignment mechanism 67. The lifting mechanism 61 lifts and lowers the inverting chuck 43. The driving mechanism 63 opens and closes the inverting chuck 43. The rotating mechanism 65 rotates the inverting chuck 43.

[0075] The lifting mechanism 61 is disposed outside the immersion tank DB. The lifting mechanism 61 includes, for example, an actuator 61a and a support 61b. The actuator 61a drives the support 61b to move up and down. The actuator 61a lifts and lowers the inversion chuck 43 together with the support 61b. The lifting mechanism 61 uses the actuator 61a to raise and lower the inversion chuck 43 among a receiving height HP1, a clamping height HP2, a locking height HP3, and a immersion height HP4. The receiving height HP1 is a height for receiving the substrate W in a vertical position into the inversion chuck 43. The clamping height HP2 is a height for clamping the substrate W in a vertical position by the inversion chuck 43. The locking height HP3 is a height for locking the substrate W in a vertical position clamped by the inversion chuck 43. The immersion height HP4 is a height at which the substrate W in a vertical position held by the inversion chuck 43 is immersed in the processing liquid in the immersion tank DB.

[0076] The driving mechanism 63 is disposed across the edge of the immersion tank DB. The driving mechanism 63 includes, for example, an actuator 63a and a connecting member 63b. The actuator 63a is disposed on the upper surface of the support 61b. The driving direction of the actuator 63a is oriented in the front-rear direction X. The actuator 63a drives the connecting member 63b in the front-rear direction X. The connecting member 63b is connected to a rotation mechanism 65 described later. The driving mechanism 63 moves the reversing chuck 43 together with the rotation mechanism 65 in the front-rear direction X. The driving mechanism 63 moves the chuck members 45 of the reversing chuck 43 in directions opposite to each other. The driving mechanism 63 adjusts the distance between the chuck members 45 in the front-rear direction X to a first distance WD1 and a second distance WD2.

[0077] The rotation mechanism 65 is disposed inside the immersion tank DB in a plan view. The rotation mechanism 65 includes, for example, a suspension arm 65a and a motor 65b. The suspension arm 65a extends in the front-rear direction X from the upper surface of the support 61b, and extends downward in the vertical direction Z along the inner wall of the immersion tank DB. The suspension arm 65a moves in the front-rear direction X by the drive mechanism 63. The suspension arm 65a has a lower portion immersed in the processing liquid stored in the immersion tank DB. The motor 65b has a rotation shaft connected to the inversion chuck 43. The motor 65b rotates the inversion chuck 43 around the axis AX1. The rotation mechanism 65 can rotate the inversion chuck 43 in either the counterclockwise or clockwise direction around the axis AX1 by the motor 65b.

[0078] The alignment mechanism 67 includes, for example, four actuators 67a, four arms 67b, and four alignment bars 67c. The actuator 67a is built into the arm 65a. The actuator 67a has a rotation axis facing upward in the vertical direction Z. The arm 67b is disposed in a horizontal plane in the front-rear direction X and the width direction Y. The base end of the arm 67b is connected to the rotation axis of the actuator 67a. The top end of the alignment bar 67c is connected to the tip of the arm 67b. The base end of the arm 67b is rotated around the axis AX2 by the actuator 67a. As shown in FIG. 10, the alignment bar 67c is disposed on the 25-blade chuck TFC side and the bridge section 7 side.

[0079] The alignment bar 67c extends in the vertical direction Z. As shown in FIG. 9, the alignment bar 67c has a length along all sides of the substrates W held by the inversion chuck 43 when the inversion chuck 43 is in a long state in the vertical direction Z. The alignment bar 67c preferably has grooves 67d formed at positions facing the end faces of the substrates W. Each alignment bar 67c is operated individually by each actuator 67a. The alignment bar 67c is driven between a restricting position AP1 and an allowable position AP2. The restricting position AP1 restricts the substrates W in the horizontal position from moving in a horizontal plane including the front-rear direction X and the width direction Y. The allowable position AP2 allows the substrates W in the horizontal position to move in a horizontal plane including the front-rear direction X and the width direction Y.

[0080] Now, returning to Figures 1 and 2.

[0081] <8. Bridging Section>

[0082] The bridge unit 7 connects the batch processing apparatus 3 and the single wafer processing apparatus 5. The bridge unit 7 is in communication only with the batch processing apparatus 3 and the single wafer processing apparatus 5. The bridge unit 7 includes a bridge robot BR. The bridge robot BR is configured to be movable only in the width direction Y. The bridge robot BR does not rise and fall in the vertical direction Z. The bridge robot BR includes a hand 71. The hand 71 is configured to be rotatable within a horizontal plane including the front-rear direction X and the width direction Y. The hand 71 is configured to be extendable and retractable in the horizontal direction. The bridge robot BR moves the hand 71 forward and backward to receive a single substrate in a horizontal position from the position changing block 15. The bridge robot BR delivers the single substrate in a horizontal position to the single wafer processing apparatus 5.

[0083] <9. Single-wafer processing equipment>

[0084] The single wafer processing apparatus 5 includes an unloading block 81, an indexer block 83, and a processing block 85.

[0085] <10. Carry-out block>

[0086] The unloading block 81 includes an unloading section 87. The unloading section 87 is disposed at the front X of the single wafer processing apparatus 5. The carrier C is placed on the unloading section 87. The unloading block 81 includes, for example, four unloading sections 87. The four unloading sections 87 are disposed along the width direction Y. The unloading sections 87 are also called load ports.

[0087] <11. Indexer Block>

[0088] The indexer block 83 includes an indexer robot IR. The indexer robot IR includes, for example, an articulated arm 89 and a hand 91. The indexer robot IR does not move in the width direction Y and the front-rear direction X. The indexer robot IR bends the articulated arm 89 to move the hand 91. The indexer robot IR raises and lowers the hand 91 in the vertical direction Z. The indexer robot IR can access each cassette C placed on the four unloading units 87. The indexer robot IR transports one substrate W with the hand 91. The indexer robot IR transports one substrate W from the processing block 85 to the unloading unit 87.

[0089] <12. Processing block>

[0090] The processing block 85 includes four towers TW1 to TW4 and a center robot CR.

[0091] The tower TW1 is disposed behind the indexer block 83, at the X side. The tower TW1 is disposed adjacent to the indexer block 83. The tower TW1 includes processing chambers-MPCs stacked in the vertical direction Z. The tower TW1 includes, for example, three processing chambers-MPCs. The processing chambers-MPCs process the substrates W one by one. The processing chambers-PMCs in the vertical direction Z perform, for example, a drying process on the substrates W.

[0092] The tower TW2 is disposed behind the tower TW1 at the X side. The tower TW2 is disposed adjacent to the tower TW1. The tower TW2 has the same configuration as the tower TW1. That is, the tower TW2 includes three processing chambers-MPCs stacked in the vertical direction Z.

[0093] Tower TW3 is disposed to the left Y of tower TW2. Tower TW3 is disposed to the left Y of tower TW2, with the center robot CR in between. Tower TW3 has the same configuration as towers TW1 and TW2. That is, tower TW3 includes three processing chambers MPC stacked in the vertical direction Z.

[0094] Tower TW4 differs in part in configuration from towers TW1 to TW4. That is, tower TW4 is provided with processing chambers-MPC at the bottom and top in the vertical direction Z. Tower TW4 is provided with a transfer section 93 at the center in the vertical direction Z. A single substrate W is placed on the transfer section 93. The transfer section 93 is provided with lifting pins 93a. The lifting pins 93a are raised and lowered when receiving the substrate W from the bridge robot BR. A single substrate W is placed on the transfer section 93 from the bridge robot BR. The substrate W placed on the transfer section 93 is received by the center robot CR.

[0095] The center robot CR is configured to be movable in the forward / backward direction X. The center robot CR is equipped with a hand 95. The hand 95 moves up and down in the vertical direction Z. The hand 95 is configured to be rotatable within a plane including the forward / backward direction X and the width direction Y. The hand 95 is moved so as to be able to access the processing chambers-MPC and the delivery unit 93 of the towers TW1 to TW4. In other words, the center robot CR can freely move the hand 95 in the vertical direction Z, the forward / backward direction X, and the width direction Y. The center robot CR delivers the processed substrate W to the indexer robot 83.

[0096] <13. Operation Description>

[0097] An example of processing performed by the substrate processing apparatus 1 will be described with reference to FIGS.

[0098] First, a rough outline of the overall process flow will be described.

[0099] <14. Batch processing>

[0100] A carrier C containing a plurality of unprocessed substrates W is placed on the input section 19. The carrier C is carried into the stocker block 11 by the transport mechanism 23. Two sets of a plurality of substrates W are assembled into a batch lot by the first transport mechanism HTR and the transfer mechanism CTC. The plurality of substrates W constituting the batch lot are transported to the processing block 17 by the second transport mechanism WTR. In the processing block 17, for example, an etching process using phosphoric acid is performed in the second batch processing unit BPU2. Then, the plurality of substrates W constituting the batch lot are subjected to a pure water cleaning process in the first batch processing unit BPU1. Next, the plurality of substrates W constituting the batch lot are transported to the attitude changing block 15 by the second transport mechanism WTR. In the attitude changing block 15, only one of the batch lots is transported to the attitude changing tank 33. In the attitude changing tank 33, the plurality of substrates W in the vertical attitude in the liquid of only one of the batch lots are changed to a horizontal attitude. Thereafter, a plurality of substrates W constituting one of the batch lots are transported one by one in sequence to the single-wafer processing apparatus 5. Thereafter, the other lot of the batch lot is similarly subjected to posture change and then transported to the single-wafer processing apparatus 5.

[0101] <15. Single-wafer processing>

[0102] The single substrate W that has been converted to a horizontal position is transported to the single-wafer processing apparatus 5 by the bridge robot BR. Specifically, the single substrate W is placed on the transfer section 93. The single substrate W placed on the transfer section 93 is received by the center robot CR. The center robot CR carries the single substrate W, for example, into the processing chamber MPC of the tower TW1. In the processing chamber MPC, for example, a drying process is performed on the substrate W. Specifically, for example, pure water is supplied while rotating the substrate W. Then, IPA is supplied to the substrate W to replace the pure water in the substrate W with IPA. Then, the substrate W is rotated at high speed to dry it. Also, if necessary, it is preferable to perform a drying process using carbon dioxide, which is a supercritical fluid, in another processing chamber MPC. A finish drying process is performed on the substrate W by the drying process using the supercritical fluid. As a result, the substrate W is completely dried, but the collapse of the pattern formed on the substrate W is suppressed.

[0103] After the drying process is completed, the substrate W is transported to the unloading section 87 via the center robot CR and the indexer robot IR. The indexer robot IR stores the substrate W in a carrier C placed on the unloading section 87. Subsequent substrates W constituting the same lot to be processed are stored in the same carrier C.

[0104] <16. Posture conversion processing>

[0105] The above is a rough processing flow by the substrate processing apparatus 1, and next, the details of the posture change will be described. Here, reference will be made to Figs. 11 to 28. Figs. 11 to 20 and Figs. 22 to 28 are diagrams for explaining the posture change operation of the substrate. Fig. 21 is a vertical cross-sectional view showing the operation of the inversion chuck.

[0106] Please refer to Figure 11. After the batch processing, the plurality of substrates W constituting the batch lot are transferred to the lifter LF0 in the standby tank 31 by the second transport mechanism WTR. The lifter LF0 moves the plurality of substrates W constituting the batch lot to a standby position inside the standby tank 31. Since the plurality of substrates W constituting the batch lot wait in this state, drying can be prevented. In other words, the patterns formed on the substrates W after the batch processing can be prevented from collapsing. The alignment bar 67c is positioned at the permissible position.

[0107] Please refer to Figure 12. The 25-substrate chuck TFC is positioned at the first transfer position P1. The 25-substrate chuck TFC releases the hand 35. That is, the 25-substrate chuck TFC has the hand 35 at the passing position PT (see FIG. 3). The lifter LF0 is raised to the transfer position above the liquid level in the standby tank BB0. At this time, since the hand 35 of the 25-substrate chuck TFC is at the passing position PT, the multiple substrates W can pass between the 25-substrate chuck TFC and rise. At the same time, the inverted chuck 43 is raised to the receiving height HP1 by the posture changing unit 41 in the posture changing tank 33.

[0108] Please refer to Figure 13. The 25-substrate chuck TFC closes the hand 35. That is, the hand 35 of the 25-substrate chuck TFC is set to the holding position PC (see FIG. 3). In this state, the lifter LF0 is lowered to the waiting position. As a result, among the substrates W of the batch lot placed on the lifter LF0, only the substrates W of odd numbers constituting one lot are placed on the 25-substrate chuck TFC. Among the substrates W of the batch lot placed on the lifter LF0, the substrates W of even numbers constituting another lot are lowered together with the lifter LF0 into the waiting tank BB0. As a result, the hand 35 of the 25-substrate chuck TFC is set to the second transfer position PT2, and the even-numbered substrates W can be made to wait in a state prevented from drying until they are moved to the posture changing tank 33. Therefore, pattern collapse due to drying of the substrates W of the other lot can also be prevented.

[0109] Please refer to Figure 14. The 25-substrate chuck TFC advances the hand 35 to the right Y up to the third transfer position P3. At this time, since the inversion chuck 43 is located at the receiving height HP1, no interference with the substrate W occurs.

[0110] Please refer to Figure 15. The inverting chuck 43 has a first distance WD1 (see FIG. 4). In this state, the inverting chuck 43 is lowered toward the multiple substrates W placed on the 25-substrate chuck TFC. Specifically, the inverting chuck 43 is lowered to a clamping height HP2. At this time, the state of the inverting chuck 43 and the substrates W is as shown in FIG. 4 and FIG. 6. That is, the edge of the substrate W is merely located near the first groove SL1 of the inverting chuck 43, and is not in contact with the inverting chuck 43. In other words, the multiple substrates W are accommodated in the inverting chuck 43 without contacting it.

[0111] Please refer to Figure 16. The inverting chuck 43 is set to a second width WD2 (see FIG. 5). As a result, the substrate W accommodated in the inverting chuck 43 is clamped without contact. As a result, as shown in FIG. 7, the end face of the substrate W is clamped in the second groove SL2 of the inverting chuck 43. In other words, the end face of the substrate W is abutted and supported by the top 49 of the second groove SL21. Furthermore, the inverting chuck 43 is raised to a locking height HP3. As a result, of the end face of the substrate W clamped by the inverting chuck 43, the lower edge part located below the side abuts and is locked against the second groove SL2. Although not shown, the 25-sheet chuck TFC is moved to a second transfer position P2 with the inverting chuck 43 temporarily raised to the receiving height HP1. As a result, the 25-sheet chuck TFC is ready to receive a plurality of substrates W constituting another lot placed on the lifter LF0.

[0112] Please refer to Figure 17. The inversion chuck 43 is lowered to an immersion height HP4. As a result, the multiple substrates W held by the inversion chuck 43 are immersed in the processing liquid in the immersion tank DB. The multiple substrates W are entirely submerged under the processing liquid in the immersion tank DB. In the attitude changing block 15, the multiple substrates W constituting one lot are exposed from the liquid only for a short period of time until they are raised from the standby tank BB0 and immersed in the immersion tank DB.

[0113] Please refer to Figures 18 and 19. The inversion chuck 43 is rotated 90°. Specifically, in this example, it is rotated 90° clockwise. The direction of rotation can be determined depending on the direction in which the processing surface (front surface) of the substrate W is located. In other words, the direction of rotation can be determined so that the processing surface of the substrate W faces upward. As a result, the multiple substrates W are converted to a horizontal posture.

[0114] Please refer to Figure 20. The alignment bar 67c is moved to the regulating position by the alignment mechanism 67. As a result, the positions of the outer peripheries of the multiple substrates W are regulated by the alignment bar 67c, as shown in the partially enlarged view indicated by the two-dot chain line arrow in Fig. 20. Specifically, movement within a horizontal plane including the front-rear direction X and the width direction Y is regulated.

[0115] Please refer to Figure 21. The inverting chuck 43 is expanded to the first width WD1. As a result, the position of the end face of the substrate W moves from the second groove SL2 to the first groove SL1. Therefore, the interval US between the upper surface, which is the processing surface (front surface) of the substrate W, and the upper surface of the groove portion 47 becomes wider. At this time, the substrate W moves while sliding with its lower surface from the rear inclined surface 51 of the second groove SL2 to the front inclined surface 55 of the first groove SL1. The front inclined surface 55 of the first groove SL1 has a gentler inclination than the rear inclined surface 51 of the second groove SL2. Therefore, the impact applied to the lower surface of the substrate W can be reduced. Therefore, the generation of particles when the inverting chuck 43 is set to the first width WD1 can be suppressed. In addition, the substrate W is pulled in the moving direction of the inverting chuck 43 by friction. At this time, since the alignment bar 67c is in the restricting position, the horizontal position of the substrate W can be prevented from being shifted. Therefore, it is possible to prevent transfer errors by the bridge robot BR, which will be described later, and to reliably transfer the substrate W.

[0116] Furthermore, the alignment bar 67c has a groove 67d formed at a position corresponding to the edge face of the substrate W. This makes it possible to prevent particles from being generated due to the edge face of the substrate W rubbing against the alignment bar 67c when the substrate W moves downward.

[0117] Please refer to Figure 22. The inverting chuck 43 is raised. Specifically, the inverting chuck 43 is raised so that only the substrate W clamped in the uppermost groove portion 47 of the inverting chuck 43 is exposed from the liquid in the immersion tank DB. The height of the inverting chuck 43 is set to a height that allows the hand 71 of the bridge robot BR to enter a position slightly below the underside of the substrate W exposed from the liquid.

[0118] Please refer to Figure 23. The hand 71 of the bridge robot BR is advanced into the posture changing section 41. The hand 71 advances to a position slightly below and spaced apart from the lower surface of the substrate W.

[0119] Please refer to Figure 24. The inverting chuck 43 is moved downward. The moving distance is less than the sum of the above-mentioned interval US and the interval between the advanced hand 71 and the lower surface of the substrate W. The substrate W is transferred to the hand 71 by the movement of the inverting chuck 43.

[0120] Please refer to Figure 25. Before the bridge robot BR moves the hand 71 to the right Y, the alignment bar 67c located to the right Y is moved to the permissible position AP2.

[0121] Please refer to Figure 26. The bridge robot BR moves the hand 71 to the right Y and removes the uppermost substrate W from the inversion chuck 43. Since the alignment bar 67c located to the right Y has been moved to the permissible position AP2, the substrate W can be smoothly transferred.

[0122] Please refer to Figure 27. After the top substrate W is removed from the inversion chuck 43, the two alignment bars 67c on the right Y are moved to the regulating position. This makes it possible to prevent the horizontal position of the substrate W from shifting due to disturbances such as vibrations of the apparatus, which can adversely affect the next transport.

[0123] Please refer to Figure 28. The bridge robot BR rotates the hand 71 to position the substrate W to the right Y. Specifically, the hand 71 rotates to move the substrate W to the delivery section 93 side. Then, one substrate W is delivered to the delivery section 93.

[0124] By the operation of the posture changing block 15 described above, one substrate W is transported in a horizontal posture from the batch processing apparatus 3 to the single substrate processing apparatus 5.

[0125] The correspondence between the present invention and the above-mentioned embodiments is as follows.

[0126] The batch processing apparatus 3 corresponds to the "batch processing section" in the present invention. The single wafer processing apparatus 5 corresponds to the "single wafer processing section" in the present invention. The 25 wafer chuck TFC corresponds to the "first transfer section" in the present invention. The bridge robot BR corresponds to the "second transfer section" in the present invention.

[0127] According to this embodiment, the substrates W processed in the batch processing apparatus 3 are transported to the posture conversion unit 41 by the 25-substrate chuck TFC, and then converted from a vertical posture to a horizontal posture by the posture conversion unit 41. The substrates W converted to the horizontal posture are transferred one by one by the bridge robot BR, and then processed in the single-wafer processing apparatus 5. When converting the posture of the substrates W, the posture conversion unit 41 holds the substrates in a state where the gaps above the upper surfaces of the substrates W are narrow. Therefore, the substrates W can be stably held, and the posture can be stably changed. When transferring the substrates W in the horizontal posture, the posture conversion unit 41 holds the substrates W in a state where the gaps US above the processing surfaces of the substrates W are wide. Therefore, the bridge robot BR can easily transfer each of the substrates W.

[0128] Moreover, when the inversion chuck 43 receives the substrates W from the 25-substrate chuck TFC, the first interval WD1 is set by the driving mechanism 61, and each of the substrates W is accommodated in the first groove SL1. When the rotation mechanism 65 rotates the substrates W to a horizontal position, the second interval WD2 is set by the driving mechanism 63, and each of the substrates W is clamped in the second groove SL2. Therefore, when changing the position, the substrates W are restricted from moving in the thickness direction. As a result, the substrates W can be stably held, and the position can be changed stably. When the bridge robot BR receives the substrates W from the inversion chuck 43, the first interval WD1 is set by the driving mechanism 63, and the lower surfaces of the substrates W are abutted and supported in the first groove SL1. Therefore, when the substrates W are transferred, the substrates W are allowed to move in the thickness direction. As a result, the bridge robot BR can easily pick up and transfer each of the substrates W. The attitude changing part 41 can clamp or loosely hold the substrate W simply by moving the inversion chuck 43 in the horizontal direction using the drive mechanism 63.

[0129] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0130] (1) In the above-described embodiment, the inversion chuck 43 has the first groove SL1 and the second groove SL2 at the front and rear in the radial direction of the substrate W. However, the present invention is not limited to this configuration. For example, an inversion chuck 43A as shown in Figs. 29 and 30 may be used.

[0131] Fig. 29 shows a modified example of the inversion chuck, illustrating a state during transfer. Fig. 30 shows a modified example of the inversion chuck, illustrating a state during posture change.

[0132] The inversion chuck 43A includes a pair of chuck members 45A. The chuck member 45A includes, for example, one first groove piece 97 and two second groove pieces 99. The first groove piece 97 includes a first groove SL1. The second groove piece 99 includes a second groove SL2. The second groove pieces 99 are disposed on the first groove pieces 97 in the vertical direction Z. The second groove pieces 99 are provided on the chuck member 45A so as to be movable forward and backward in the front-rear direction X toward the center of the substrate W.

[0133] When the inversion chuck 43A is configured as described above, the second groove piece 99 is moved away from the substrate W when the substrate W is received (FIG. 29). When the attitude of the substrate W is changed, the second groove piece 99 is moved toward the center of the substrate W (FIG. 30). Such an inversion chuck 43A may be adopted. According to this configuration, the inversion chuck 43 described above has two inclinations on the rear side, whereas the first groove piece 97 and the second groove piece 99 only have grooves SL1, SL2 with one inclination. This has the advantage that the chuck member 45A can be easily processed. In addition, when substrates W of different thickness standards are handled, only the second groove piece 99 needs to be replaced, and the substrate W standards can be flexibly accommodated.

[0134] (2) In the above-described embodiment, the inversion chucks 43, 43A are provided with inclined surfaces on both sides of the substrate W. However, when a batch lot is a back-to-face type, it is sufficient to provide an inclined surface only in the direction corresponding to the bottom surface of the substrate W.

[0135] (3) In the above-described embodiment, the attitude changing unit 41 changes the attitude of a plurality of substrates W immersed in the immersion tank DB. However, the present invention is not limited to this embodiment. That is, the attitude changing unit 41 may change the attitude in a gas. In this case, the gas may be, for example, air or an inert gas.

[0136] (4) In the above embodiment, the alignment bar 67c has the groove 67d, but this configuration is not essential to the present invention. Also, the attitude changer 41 does not necessarily have to have the alignment bar 67c.

[0137] (5) In the embodiment described above, after the hand 71 of the bridge robot BR enters the inverting chuck 43, the receiving side alignment bar 67c is moved to the permissible position. However, the present invention is not limited to this timing for moving the alignment bar 67c to the permissible position. In other words, the alignment bar 67c may be moved to the permissible position when the hand 71 enters the inverting chuck 43. This makes it possible to prevent the hand 71 from interfering with the alignment bar 67c even if the positional accuracy in the front-rear direction X when the hand 71 enters the inverting chuck 43 is somewhat lowered. As a result, the control load can be reduced.

[0138] (6) In the above-described embodiment, when the multiple substrates W are received by the inverting chuck 43, the inverting chuck 43 is lowered from the receiving height HP1 to the clamping height HP2. However, the present invention is not limited to such a clamping method. For example, the multiple substrates W may be received in a state in which the chuck members 45 of the inverting chuck 43 are spread apart, and then the distance between the chuck members 45 may be narrowed to clamp the multiple substrates W.

[0139] (7) In the above-described embodiment, the inversion chuck 43 is lowered when the bridge robot BR receives the substrate W. However, the present invention is not limited to this embodiment. In other words, the inversion chuck 43 may not be lowered, and the hand 71 of the bridge robot BR may be raised to receive the substrate W. This can simplify the control of the posture conversion unit 41.

[0140] (8) In the above embodiment, the substrate processing apparatus 1 is configured such that the batch processing apparatus 3 and the single wafer processing apparatus 5 are connected by the bridge 7. However, the present invention can also be applied to a single substrate processing apparatus 1 having the batch processing apparatus 3 and the single wafer processing apparatus 5 in the same housing. [Explanation of symbols]

[0141] 1 ... Substrate processing equipment W … Substrate 3 … Batch processing equipment 5 … Single wafer processing equipment 7 … Bridging Section 7 9 ... Loading block 11 ... Stocker block 13 ... Transfer block 15 ... Posture change block 17 ... Processing block 19 … Input section C...Career BPU: Batch processing unit BB: Treatment tank LF: Lifter TFC…25-piece zipper 31 … Standby tank 33 ... Posture change tank BB0: Treatment tank LF0 ... Lifter DB … Immersion tank 41 ... Posture conversion section 43 … Reversible chuck WD1: First interval WD2: Second interval 45 ... Chuck member 47 ... Groove SL1: First groove SL2: Second groove 49 … Top 51 … Back slope 53…Aperture 55 … Front inclined surface 61 ... Lifting mechanism 63 ... Drive mechanism 65 ... Rotation mechanism 67 ... Alignment mechanism 67c ... Alignment bar 67d … Groove HP1 … Acceptance height HP2 … Clamping height BR... Bridge robot 81 ... Exit block 83 ... Indexer block 85 ... Processing block 87 ... Unloading section IR... Indexer robot TW1~TW4 … Tower CR: Center robot 93 … Delivery department US … Interval

Claims

1. In a substrate processing apparatus for processing a substrate, a batch processing unit for processing a plurality of substrates in a vertical position at the same time; a single-wafer processing section for processing a single substrate in a horizontal position; a posture changing unit that changes the posture of the plurality of substrates that have been processed in the batch processing unit from a vertical posture to a horizontal posture; a first transfer unit that transfers the plurality of substrates that have been processed in the batch processing unit to the posture changing unit; a second transport unit that transports the plurality of substrates that have been horizontally positioned by the position conversion unit to the single-wafer processing unit; Equipped with The posture conversion unit is A substrate processing apparatus characterized in that, when changing the posture of the multiple substrates, the multiple substrates are held with a narrow gap above their upper surfaces, and, when transferring the multiple substrates after placing them in a horizontal posture, the multiple substrates are held with a wide gap above their upper surfaces.

2. 2. The substrate processing apparatus according to claim 1, The posture conversion unit is an inversion chuck disposed opposite to the substrates in a radial direction and configured to clamp peripheral portions of the substrates; a drive mechanism that moves the inversion chuck in a horizontal direction across at least two locations: a first gap in which the plurality of substrates are transferred between the first transport unit and the second transport unit, and a second gap that is narrower than the first gap and in which the plurality of substrates are sandwiched; a rotation mechanism that rotates the inversion chuck in a surface direction of the plurality of substrates; Equipped with the inversion chuck includes a first groove that allows the plurality of substrates to move in a thickness direction, and a second groove that is formed outward of the plurality of substrates from the first groove and clamps the plurality of substrates in a radial direction while restricting the plurality of substrates from moving in the thickness direction, When the inversion chuck receives the plurality of substrates from the first transport unit, the driving mechanism causes the plurality of substrates to be accommodated in the first groove at the first interval; when the plurality of substrates are rotated into a horizontal position by the rotation mechanism, the plurality of substrates are sandwiched between the second grooves by the drive mechanism while being spaced apart from each other by the second intervals; A substrate processing apparatus characterized in that, when the second transport section receives the plurality of substrates from the inversion chuck, the drive mechanism sets the substrates at the first interval and abuts and supports the undersides of the plurality of substrates in the first grooves.

3. 3. The substrate processing apparatus according to claim 2, The second groove is a top portion where end faces of the plurality of substrates are located; a rear inclined surface that widens from the top toward the center of the plurality of substrates; Equipped with The first groove is a front inclined surface that widens from the rear inclined surface toward the opening, the front inclined surface having a center opening for each of the plurality of substrates;

4. 4. The substrate processing apparatus according to claim 3, The substrate processing apparatus according to claim 1, wherein the rear inclined surface and the front inclined surface have inclined surfaces at positions facing the front and rear surfaces of the plurality of substrates.

5. 4. The substrate processing apparatus according to claim 3, The substrate processing apparatus according to claim 1, wherein the front inclined surface has a gentler inclination than the rear inclined surface.

6. 6. The substrate processing apparatus according to claim 1, the posture conversion unit further includes an alignment bar that is movable between a restricting position that restricts horizontal movement of the plurality of substrates and an allowing position that allows horizontal movement of the plurality of substrates when the plurality of substrates are held in a horizontal posture by the inversion chuck; the alignment bar is moved to the regulating position before the inversion chuck is expanded from the second interval to the first interval.

7. 7. The substrate processing apparatus according to claim 6, A substrate processing apparatus characterized in that, in a planar view, the alignment bar is provided on the side where the second transport unit receives the multiple substrates and on the opposite side to the receiving side across the multiple substrates.

8. 8. The substrate processing apparatus according to claim 7, A substrate processing apparatus characterized in that, after the gap is expanded from the second gap to the first gap, when the second transport unit receives the plurality of substrates from the inversion chuck, the alignment bar on the receiving side among the alignment bars is moved to the allowable position.

9. 7. The substrate processing apparatus according to claim 6, 4. The substrate processing apparatus according to claim 3, wherein the alignment bar has a plurality of grooves formed therein corresponding to the positions of the end faces of the plurality of substrates.

10. 6. The substrate processing apparatus according to claim 1, The reversal chuck further includes a lifting mechanism for lifting and lowering the reversal chuck. The substrate processing apparatus, wherein when the second transport unit receives the plurality of substrates from the inversion chuck, the inversion chuck is lowered by the lifting mechanism.

11. 11. The substrate processing apparatus according to claim 10, The substrate processing apparatus is characterized in that, when the first transport unit transfers the multiple substrates to the inversion chuck, the lifting mechanism lowers the inversion chuck, which has the first interval, from an acceptance height near the upper edges of the multiple substrates transported by the first transport unit to a clamping height near the side edges of the multiple substrates.

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