Substrate component, circuit board, and method for manufacturing circuit board

Abstract

To provide a circuit board capable of adjusting electrical functions while suppressing an increase in manufacturing costs.SOLUTION: A substrate component 100 includes a base material 1 having a first surface 1A, a first pad 2 and a second pad 3 arranged on the first surface at a distance from each other, a first land 4 and a second land 5 arranged on the first surface at a distance from each other, and a protective film 6 arranged on the first surface and exposing at least a part of the upper surface of each of the first pad and the second pad. The protective film has an intermediate portion 60 that separates the first land and the second land in a plan view. The upper surface and side surface of each of the first land and the second land, and the peripheral regions of the first surface that are located around each of the first land and the second land in a plan view each have an exposed portion that is exposed from the protective film.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a substrate component, a circuit board, and a method for manufacturing a circuit board. [Background technology]

[0002] Conventionally, circuit boards capable of adjusting electrical functions are known. The printed circuit board described in JP 2007-194240 A (Patent Document 1) includes a first land and a second land to which electrodes of a chip component can be soldered, and when a chip component is not mounted, a solder flow (flow soldering) is performed to automatically short-circuit the first land and the second land. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-194240 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned conventional printed circuit board, automatic soldering by flow soldering is performed in the manufacturing method. Therefore, in order to realize a structure in which the first land and the second land are electrically short-circuited by solder, a process of mounting other electronic components on the board is required in addition to the flow soldering process for the first land and the second land. For example, a process of mounting other surface mount components on the board before the flow soldering process for the first land and the second land, or a process of mounting other surface mount components after the flow soldering process for the first land and the second land is required. In the former case, it is necessary to perform the flow soldering process using a pallet jig that prevents the mounted components from falling. As a result, it is difficult to suppress an increase in manufacturing costs with conventional printed circuit boards.

[0005] A primary object of the present disclosure is to provide a circuit board that is capable of adjusting electrical functions while suppressing increases in manufacturing costs. Specifically, a primary object of the present disclosure is to provide board components that can be assembled onto the circuit board as described above, a circuit board that can be assembled from the board components, and a method for manufacturing the circuit board. [Means for solving the problem]

[0006] The substrate component according to the present disclosure includes a base material having a first surface, a first pad and a second pad spaced apart from each other on the first surface, a first land and a second land spaced apart from each other on the first surface, and a protective film arranged on the first surface and exposing at least a portion of the upper surface of each of the first pad and the second pad. The protective film has an intermediate portion that separates the first land and the second land in a plan view. The upper surface and side surface of each of the first land and the second land, and peripheral regions of the first surface that are located around each of the first land and the second land in a plan view each have an exposed portion that is exposed from the protective film. Effect of the Invention

[0007] According to the present disclosure, the step of melting and solidifying the heat-fusible conductive material applied to each of the first and second lands is performed with electronic components disposed on the first and second pads, so that the electronic components can restrict the flow of the melted heat-fusible conductive material and guide the melted heat-fusible conductive material to the exposed portion of the first surface. As a result, in the circuit board according to the present disclosure manufactured through the above steps, a solder bridge is not formed between the first and second lands, and electronic components can be mounted on the first and second pads.

[0008] On the other hand, by performing the process of melting and solidifying the heat-fusible conductive material applied to each of the first and second lands in a state where no electronic components are placed on the first and second pads, the molten heat-fusible conductive material can form a solder bridge that spans the middle part of the protective film and electrically connects the first and second lands, and as a result, the first and second lands of the circuit board according to the present disclosure manufactured through the above process can be electrically connected via the solder bridge.

[0009] That is, according to the present disclosure, the electrical function of the circuit board can be adjusted depending only on whether the step of forming the conductive member by melting and solidifying the heat-fusible conductive member applied to each of the first pad, the second pad, the first land, and the second land is performed in a state in which the electronic components are placed on the first pad and the second pad. Therefore, according to the present disclosure, it is possible to provide a circuit board that can adjust the electrical function while suppressing an increase in manufacturing costs. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a partially enlarged plan view for explaining a first substrate component according to the first embodiment. [Diagram 2] 2 is a partially enlarged cross-sectional view taken along line II-II in FIG. [Diagram 3] 4 is a partially enlarged plan view for explaining a second substrate component according to the first embodiment. FIG. [Figure 4] FIG. 4 is a partially enlarged cross-sectional view taken along line IV-IV in FIG. [Diagram 5] 10 is a partially enlarged plan view for explaining a third substrate component according to the first embodiment. FIG. [Figure 6] 6 is a partially enlarged cross-sectional view taken along line VI-VI in FIG. 5. [Figure 7] FIG. 11 is a partially enlarged plan view for explaining a fourth substrate component according to the first embodiment. [Figure 8] 8 is a partially enlarged cross-sectional view taken along line VIII-VIII in FIG. 7. [Figure 9]FIG. 2 is a partially enlarged plan view for explaining a first circuit board according to the first embodiment. [Figure 10] 10 is a partially enlarged cross-sectional view taken along line XX in FIG. 9. [Figure 11] 4 is a partially enlarged plan view for explaining a second circuit board according to the first embodiment. FIG. [Figure 12] 12 is a partially enlarged cross-sectional view taken along line XII-XII in FIG. 11. [Figure 13] 5 is a flowchart showing an example of a method for manufacturing the circuit board according to the first embodiment. [Figure 14] 5 is a flowchart showing a more specific example of the method for manufacturing the circuit board according to the first embodiment. [Figure 15] FIG. 11 is a partially enlarged plan view for explaining a first substrate component according to a second embodiment. [Figure 16] FIG. 11 is a partially enlarged plan view for explaining a first substrate component according to a third embodiment. [Figure 17] FIG. 11 is a partially enlarged plan view for explaining a second substrate component according to the third embodiment. [Figure 18] FIG. 11 is a partially enlarged plan view for explaining a second substrate component according to the third embodiment. [Figure 19] FIG. 13 is a partially enlarged plan view for explaining a second substrate component according to the fourth embodiment. [Figure 20] FIG. 20 is a partially enlarged cross-sectional view taken along line XX-XX in FIG. 19. [Figure 21] 13 is a partially enlarged cross-sectional view for explaining a first circuit board according to a fourth embodiment. FIG. [Figure 22] 13 is a partially enlarged cross-sectional view for explaining a second circuit board according to embodiment 4. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment will be described with reference to the drawings. In the following, the same or corresponding parts are denoted by the same reference characters, and overlapping descriptions will not be repeated.

[0012] Embodiment 1 The board component according to the first embodiment is a component that is prepared or formed by the method for manufacturing a circuit board according to the first embodiment, and is a component that can be finally assembled onto the circuit board according to the first embodiment.

[0013] The board components according to the first embodiment are classified according to their constituent parts into a first board component 100 shown in Figures 1 and 2, a second board component 101 shown in Figures 3 and 4, a third board component 102 shown in Figures 5 and 6, and a fourth board component 103 shown in Figures 9 and 10. The second board component 101, the third board component 102, and the fourth board component 103 all have the configuration of the first board component 100. The third board component 102 has the configuration of the second board component 101.

[0014] Depending on their electrical functions, the circuit boards of embodiment 1 are divided into a first circuit board 104 shown in Figures 9 and 10, a second circuit board 105 shown in Figures 11 and 12, and a third circuit board having a configuration similar to that of first board component 100.

[0015] The first board component 100 is a common component prepared or formed in the manufacturing methods of the first circuit board 104, the second circuit board 105, and the third circuit board. The second board component 101 and the third board component 102 are common components prepared or formed in the manufacturing methods of the first circuit board 104 and the second circuit board 105.

[0016] The configurations of first substrate component 100, second substrate component 101, third substrate component 102, first circuit board 104, second circuit board 105, and third circuit board will be described below.

[0017] <Configuration of First Substrate Component 100> A first substrate component 100 according to the first embodiment shown in FIGS. 1 and 2 includes a base material 1, a first pad 2, a second pad 3, a first land 4, a second land 5, and a protective film 6.

[0018] 1 and 2 are partial enlarged views showing only a portion of the first substrate component 100. The first substrate component 100 has an area that is not shown.

[0019] 1 and 2, the substrate 1 has a first surface 1A. The first surface 1A extends along a first direction DR1 and a second direction DR2. The second direction DR2 is perpendicular to the first direction DR1. The material constituting the substrate 1 has electrical insulation properties.

[0020] As shown in Fig. 1 and Fig. 2, the first pad 2 and the second pad 3 are arranged on the first surface 1A with a gap between them. The first pad 2 and the second pad 3 are arranged in the first direction DR1 with a gap between them. An electronic component 9, which will be described later, can be mounted on the first pad 2 and the second pad 3. The material constituting each of the first pad 2 and the second pad 3 is conductive. Each of the first pad 2 and the second pad 3 may be electrically connected to a wiring member (not shown).

[0021] 1 and 2, the first land 4 and the second land 5 are arranged on the first surface 1A with a gap between them. The first land 4 is arranged between the first pad 2 and the second pad 3. The second land 5 is arranged between the first land 4 and the second pad 3. The material constituting each of the first land 4 and the second land 5 is conductive.

[0022] Each of the first land 4 and the second land 5 includes a first portion 41, 51 and a second portion 42, 52. The first portions 41, 51 of the first land 4 and the second land 5 are arranged at a distance from each other in the first direction DR1 so as to sandwich an intermediate portion 60 of a protective film 6 described later. The second portions 42, 52 of the first land 4 and the second land 5 protrude from the first portions 41, 51 in the first direction DR1. The second portion 42 protrudes from the first portion 41 toward the second pad 3 side in the first direction DR1. The second portion 52 protrudes from the first portion 51 toward the first pad 2 side in the first direction DR1. In the second direction DR2, the first portion 41 of the first land 4 is arranged to face the second portion 52 of the second land 5 with the intermediate portion 60 in between. The second portion 42 of the first land 4 is arranged to face the first portion 51 of the second land 5 with the intermediate portion 60 in between.

[0023] The first land 4 is electrically connected to, for example, the first pad 2. The first land 4 further has a third portion 43 that electrically connects, for example, the first portion 41 and the first pad 2. The second land 5 is electrically connected to, for example, the second pad 3. The second land 5 further has a third portion 53 that electrically connects, for example, the first portion 51 and the second pad 3.

[0024] 1 and 2, the protective film 6 is disposed on the first surface 1A. The protective film 6 is provided so as to expose at least a part of the upper surface of each of the first pad 2, the second pad 3, the first land 4, and the second land 5. The material constituting the protective film 6 has electrical insulation properties. The protective film 6 may be a resist.

[0025] The protective film 6 has an intermediate portion 60 that separates the first land 4 and the second land 5 in a plan view. The intermediate portion 60 is formed so as to cover the mutually opposing side surfaces of the first land 4 and the second land 5, and partial regions of the upper surfaces of the first land 4 and the second land 5 that are close to the side surfaces.

[0026] The intermediate portion 60 has, for example, a portion sandwiched between the first portion 41 of the first land 4 and the first portion 51 of the second land 5 in the first direction DR1, a portion sandwiched between the second portion 42 of the first land 4 and the first portion 51 of the second land 5 in the second direction DR2, and a portion sandwiched between the first portion 41 of the first land 4 and the second portion 52 of the second land 5 in the second direction DR2.

[0027] In the protective film 6, for example, an opening 61 exposing a part of the upper surface of the first pad 2, an opening 62 exposing a part of the upper surface of the second pad 3, an opening 63 exposing a part of the upper surface of the first land 4, and an opening 64 exposing a part of the upper surface of the second land 5 are formed. In a plan view, the intermediate portion 60 is disposed between the opening 63 and the opening 64 so as to separate them.

[0028] The opening 61 is connected to, for example, the opening 63. The opening 62 is connected to, for example, the opening 64. In the protective film 6, for example, an opening formed by the opening 61 and the opening 63 being connected to each other, and an opening formed by the opening 62 and the opening 64 being connected to each other are formed. Note that the opening 61 and the opening 63 may be separated from each other. The opening 62 and the opening 64 may be separated from each other. The opening 63 may be connected to the opening 64. In this case, the opening 61, the opening 62, the opening 63, and the opening 64 may be connected to each other.

[0029] The top surface and side surfaces of each of the first land 4 and the second land 5 have exposed portions that are exposed from the protective film 6. Furthermore, each of the peripheral regions of the first surface 1A that are located around the exposed portions of the side surfaces of each of the first land 4 and the second land 5 in a plan view has an exposed portion that is exposed from the protective film 6.

[0030] 1, openings 61, 62, 63, and 64 of the protective film 6 and the first pad 2, the second pad 3, the first land 4, and the second land 5 that are exposed from the protective film 6 are indicated by solid lines. In FIG 1, the first pad 2, the second pad 3, the first land 4, and the second land 5 that are covered by the protective film 6 are indicated by dashed lines.

[0031] The peripheral region of the first surface 1A located around the first land 4 in a planar view has a first peripheral region 1A1 located between the first pad 2 and the first portion 41 of the first land 4, and a second peripheral region 1A2 located around the second portion 42 of the first land 4.

[0032] The peripheral region of the first surface 1A located around the second land 5 in a planar view has a third peripheral region 1A3 located between the second pad 3 and the first portion 51 of the second land 5, and a fourth peripheral region 1A4 located around the second portion 52 of the second land 5.

[0033] The first peripheral region 1A1 is separated from the fourth peripheral region 1A4 by an intermediate portion 60. The second peripheral region 1A2 is separated from the third peripheral region 1A3 by an intermediate portion 60. The first peripheral region 1A1 may be continuous with the fourth peripheral region 1A4. The second peripheral region 1A2 may be continuous with the third peripheral region 1A3.

[0034] 2, the thickness of the protective film 6 is greater than the thickness of each of the first pad 2, the second pad 3, the first land 4, and the second land 5. The middle portion 60 of the protective film 6 protrudes upward beyond the upper surfaces of the first land 4 and the second land 5. Preferably, the upper surface of the middle portion 60 of the protective film 6 is provided so as to come into contact with the lower surface of the body portion 93 of the electronic component 9 in the second circuit board 105 described below.

[0035] <Configuration of second substrate component 101> Unless otherwise specified, the second substrate component 101 according to the first embodiment shown in Fig. 3 and Fig. 4 has the same configuration as the first substrate component 100 according to the first embodiment described above. Therefore, the same components as those of the first substrate component 100 described above are given the same reference numerals and will not be described repeatedly. Note that Fig. 3 and Fig. 4 are partial enlarged views showing only a part of the second substrate component 101, and the second substrate component 101 has an area not shown.

[0036] 3 and 4, the second board component 101 is an assembly of the first board component 100 and the first solder mask 7A disposed on the first surface 1A of the first board component 100. In other words, the second board component 101 includes the first board component 100 and the first solder mask 7A disposed on the first surface 1A. The first solder mask 7A is a mask used when applying the thermally fusible conductive material. In a plan view, the first solder mask 7A has an opening formed therein that exposes a part of the exposed portion exposed from the protective film 6 and a part of the upper surface of the protective film 6.

[0037] The first solder mask 7A has a first opening 71, a second opening 72, and a third opening 73 formed therein. The first opening 71 exposes at least a portion of the first pad 2. The second opening 72 exposes at least a portion of the second pad 3. The third opening 73 exposes at least the exposed portions of the first land 4 and the second land 5, and the intermediate portion 60 of the protective film 6. The first opening 71, the second opening 72, and the third opening 73 are arranged at intervals from one another.

[0038] The third opening 73 exposes, for example, a part of each of the first peripheral region 1A1, the second peripheral region 1A2, the third peripheral region 1A3, and the fourth peripheral region 1A4 of the first surface 1A. Furthermore, the third opening 73 exposes, for example, a fifth peripheral region 6A1 located around the second peripheral region 1A2 and a sixth peripheral region 6A2 located around the fourth peripheral region 1A4 in a plan view on the upper surface of the protective film 6.

[0039] The first solder mask 7A is provided so as to overlap the remaining part of the exposed portion exposed from the protective film 6 in plan view.

[0040] 4, in a direction perpendicular to the first surface 1A, the remaining exposed portions of the first peripheral region 1A1, the second peripheral region 1A2, the third peripheral region 1A3, and the fourth peripheral region 1A4 of the first surface 1A are disposed at a distance from the first solder mask 7A. The space sandwiched between the remaining exposed portions of the first peripheral region 1A1, the second peripheral region 1A2, the third peripheral region 1A3, and the fourth peripheral region 1A4 of the first surface 1A and the first solder mask 7A communicates with the third opening 73.

[0041] The opening area of ​​the third opening 73 is larger than the total area of ​​the exposed portions of the upper surfaces of the first land 4 and the second land 5. The opening area of ​​the third opening 73 may be 1.5 to 3 times the total area of ​​the exposed portions of the upper surfaces of the first land 4 and the second land 5. The opening area of ​​the third opening 73 is smaller than, for example, the sum of the total area of ​​the exposed portions of the upper surfaces of the first land 4 and the second land 5 and the area of ​​the exposed portions of the peripheral region of the first surface 1A.

[0042] The material constituting first solder mask 7A is, for example, a metal. <Configuration of third board component 102> The third substrate component 102 according to the first embodiment shown in Figures 5 and 6 has the same configuration as the second substrate component 101 according to the first embodiment described above, unless otherwise specified. Therefore, the same components as those of the second substrate component 101 described above are given the same reference numerals, and the description will not be repeated. Note that Figures 5 and 6 are partial enlarged views showing only a part of the third substrate component 102, and the third substrate component 102 has an area not shown.

[0043] As shown in Figures 5 and 6, the third substrate component 102 further includes a first heat-fusible conductive material 81A applied within the first opening 71 of the first solder mask 7A, a second heat-fusible conductive material 82A applied within the second opening 72, and a third heat-fusible conductive material 83A applied within the third opening 73.

[0044] The third heat-fusible conductive material 83A is applied to the exposed portions of the upper surface of the first land 4, the exposed portions of the upper surface of the second land 5, the intermediate portion 60, the exposed portions of the first peripheral region 1A1, the second peripheral region 1A2, the third peripheral region 1A3, and the fourth peripheral region 1A4 of the first surface 1A, and the fifth peripheral region 6A1 and sixth peripheral region 6A2 of the upper surface of the protective film 6.

[0045] The material constituting each of the first heat-fusible conductive member 81A, the second heat-fusible conductive member 82A, and the third heat-fusible conductive member 83A may be any material having heat melting properties, for example, cream solder. The materials constituting each of the first heat-fusible conductive member 81A, the second heat-fusible conductive member 82A, and the third heat-fusible conductive member 83A are, for example, the same as each other.

[0046] Preferably, the material constituting the third heat-fusible conductive member 83A has low viscosity and poor wettability.

[0047] <Configuration of Fourth Board Component 103> Unless otherwise specified, the fourth substrate component 103 according to the first embodiment shown in Fig. 7 and Fig. 8 has the same configuration as the first substrate component 100 according to the first embodiment described above. Therefore, the same components as those of the first substrate component 100 described above are given the same reference numerals and will not be described repeatedly. Note that Fig. 7 and Fig. 8 are partial enlarged views showing only a portion of the fourth substrate component 103, and the fourth substrate component 103 has an area not shown.

[0048] As shown in Fig. 7 and Fig. 8, the fourth board component 103 further includes a second solder mask 7B disposed on the first surface 1A. The second solder mask 7B is a mask used when applying the thermally fusible conductive material. The second solder mask 7B is formed so as to cover the above-mentioned exposed portions of the first land 4 and the second land 5, and the above-mentioned exposed portions of the first surface 1A. In other words, the second solder mask 7B differs from the first solder mask 7A in that at least the third opening 73 is not formed, and openings are formed only in areas not shown in Figs. 7 and 8.

[0049] Second solder mask 7B does not have, for example, first opening 71 and second opening 72. Note that second solder mask 7B may have first opening 71 and second opening 72.

[0050] The material constituting second solder mask 7B is, for example, a metal. <Configuration of First Circuit Board 104> 9 and 10, unless otherwise specified, the first circuit board 104 has the same configuration as the first board component 100 according to the above-described embodiment 1. Therefore, the same components as those in the above-described first board component 100 are denoted by the same reference numerals, and the description thereof will not be repeated.

[0051] The first circuit board 104 includes a base material 1, a first pad 2, a second pad 3, a first land 4, a second land 5, a protective film 6, a first conductive member 81B, a second conductive member 82B, and a third conductive member 83B. The first conductive member 81B is formed by melting and solidifying the first heat-fusible conductive member 81A of the third substrate component 102. The second conductive member 82B is formed by melting and solidifying the second heat-fusible conductive member 82A of the third substrate component 102. The third conductive member 83B is formed by melting and solidifying the third heat-fusible conductive member 83A of the third substrate component 102.

[0052] 9 and 10, the third conductive member 83B is disposed at a distance from each of the first conductive member 81B and the second conductive member 82B. The third conductive member 83B is not connected to each of the first conductive member 81B and the second conductive member 82B.

[0053] 9 and 10, the third conductive member 83B is disposed so as to straddle the intermediate portion 60. The third conductive member 83B electrically connects the exposed portions of the upper surfaces of the first land 4 and the second land 5. In other words, the third conductive member 83B forms a jumper that electrically shorts between the first land 4 and the second land 5.

[0054] 10, the maximum thickness of the third conductive member 83B is thicker than the maximum thicknesses of the first conductive member 81B and the second conductive member 82B. The maximum thickness of the third conductive member 83B is, for example, 1.5 to 3 times the maximum thickness of the first conductive member 81B and the second conductive member 82B.

[0055] The distance between the first land 4 and the second land 5 in the first substrate component 100 may be set based on the dimension by which the molten third heat-fusible conductive member 83A can bulge onto the intermediate portion 60, taking into account the viscosity or wettability of the material constituting the third heat-fusible conductive member 83A.

[0056] 9 and 10 according to the first embodiment can be manufactured from the third substrate component 102. The first substrate component 104 can be manufactured by removing the first solder mask 7A from the third substrate component 102, and then melting and solidifying the first heat-fusible conductive member 81A, the second heat-fusible conductive member 82A, and the third heat-fusible conductive member 83A without placing the electronic component 9 on the first pad 2 and the second pad 3.

[0057] <Configuration of second circuit board 105> 11 and 12, unless otherwise specified, the second circuit board 105 has the same configuration as the first board component 100 according to the above-described embodiment 1. Therefore, the same components as those in the above-described first board component 100 are denoted by the same reference numerals, and the description thereof will not be repeated.

[0058] The second circuit board 105 includes a base material 1, a first pad 2, a second pad 3, a first land 4, a second land 5, a protective film 6, a first conductive member 81C, a second conductive member 82C, a conductive member 83C1, a conductive member 83C2, and an electronic component 9.

[0059] The first conductive member 81C is formed by melting and solidifying the first heat-fusible conductive member 81A of the third substrate component 102. The second conductive member 82C is formed by melting and solidifying the second heat-fusible conductive member 82A of the third substrate component 102. The conductive members 83C1 and 83C2 are formed by melting the third heat-fusible conductive member 83A of the third substrate component 102, separating them from each other, and then solidifying.

[0060] The electronic component 9 has a first electrode 91, a second electrode 92, and a body 93 extending between the first electrode 91 and the second electrode 92. The first electrode 91 is electrically connected to the first pad 2 via a first conductive member 81C. The second electrode 92 is electrically connected to the second pad 3 via a second conductive member 82C. In a plan view, the body 93 is disposed so as to overlap at least a portion of each of the first land 4 and the second land 5, and the intermediate portion 60 of the protective film 6. The surface of the body 93 has electrical insulation properties. Preferably, the upper surface of the intermediate portion 60 of the protective film 6 is in contact with the lower surface of the body 93 of the electronic component 9.

[0061] The electronic component 9 may be any electronic component. For example, the electronic component 9 may be a capacitor component, an inductor component, a resistor component, or a diode component. The electronic component 9 may be a three-terminal electronic component. The electronic component 9 may be, for example, a transistor component, a regulator IC component, or the like.

[0062] 11 and 12, the conductive member 83C1 is disposed with a gap between it and the conductive member 83C2. The conductive member 83C1 is separated from the conductive member 83C2 by the intermediate portion 60 of the protective film 6. In the second circuit board 105, a jumper for electrically shorting the first land 4 and the second land 5 is not formed. No conductive member is formed on the intermediate portion 60 of the protective film 6.

[0063] The conductive member 83C1 contacts the exposed portions of the upper surface and side surfaces of the first land 4, and the first peripheral region 1A1 and the second peripheral region 1A2 included in the exposed portions of the first surface 1A. The conductive member 83C2 contacts the exposed portions of the upper surface and side surfaces of the second land 5, and the third peripheral region 1A3 and the fourth peripheral region 1A4 included in the exposed portions of the first surface 1A.

[0064] The conductive member 83C1 is, for example, connected and integrated with the first conductive member 81C. The conductive member 83C2 is, for example, connected and integrated with the second conductive member 82C. Note that the conductive member 83C1 may be separate from the first conductive member 81C. The conductive member 83C2 may be separate from the second conductive member 82C.

[0065] 11 and 12 according to the first embodiment can also be manufactured from the third substrate component 102, similar to the first substrate component 104. The second substrate component 105 can be manufactured by removing the first solder mask 7A from the third substrate component 102, arranging the electronic components 9 on the first pads 2 and the second pads 3, and then melting and solidifying the first heat-fusible conductive member 81A, the second heat-fusible conductive member 82A, and the third heat-fusible conductive member 83A.

[0066] <Configuration of the third circuit board> Unless otherwise specified, the third circuit board has the same configuration as the first substrate component 100 according to the above-described embodiment 1. Therefore, the same components as those in the above-described first substrate component 100 are given the same reference numerals and will not be described repeatedly.

[0067] The first pad 2, second pad 3, first land 4, and second land 5 of the third circuit board have basically the same configuration as those of the first board component 100 shown in Figures 1 and 2. In the third circuit board, no electronic components are mounted on the first pad 2 and second pad 3, and the first land 4 and second land 5 are electrically insulated from each other.

[0068] The third circuit board according to the first embodiment can be manufactured from the fourth substrate component 103. The third circuit board can be manufactured by applying a heat-fusible conductive material to the openings of the second solder mask 7B formed in an area of ​​the fourth substrate component 103 that is not shown in Figures 7 and 8, removing the second solder mask 7B, and then melting and solidifying the heat-fusible conductive material.

[0069] Note that first circuit board 104, second circuit board 105, and third circuit board may be formed as regions having different electrical functions on one circuit board. For example, a first region of one circuit board may have the configuration of first circuit board 104, and a second region different from the first region of the one circuit board may have the configuration of second circuit board 105. Also, a third region different from the first and second regions of the one circuit board may have the configuration of a third circuit board.

[0070] <Method of Manufacturing the First Circuit Board 104, the Second Circuit Board 105, and the Third Circuit Board> 13 and 14, a method for manufacturing the first circuit board 104, the second circuit board 105, and the third circuit board will be described. Each of the first circuit board 104, the second circuit board 105, and the third circuit board can be manufactured by the manufacturing method shown in FIG.

[0071] As shown in FIG. 13, the manufacturing method for each circuit board includes a step (SP1) of preparing a first board component 100, a step (SP2) of selecting a circuit board to be manufactured, a step (SP3) of placing a solder mask on the first board component 100 based on the selection result in step (SP2), and a step (SP4) of forming a conductive member using the solder mask placed in step (SP3).

[0072] Specifically, each of the first circuit board 104, the second circuit board 105, and the third circuit board can be manufactured from the first board component 100 according to the flow shown in FIG.

[0073] First, a circuit board to be manufactured in step (SP2) is selected. Depending on the selection result of step (SP2), the next step is determined to be a step (SP31) of arranging a first solder mask 7A or a step (SP32) of arranging a second solder mask 7B. Specifically, when the first circuit board 104 or the second circuit board 105 is selected, the first solder mask 7A is arranged. As a result, the second board component 101 is formed from the first board component 100. On the other hand, when the third circuit board is selected, the second solder mask 7B is arranged. As a result, the fourth board component 103 is formed from the first board component 100.

[0074] Secondly, the thermally fusible conductive material is applied using the first solder mask 7A or the second solder mask 7B arranged in step (SP31). As a result, the third board component 102 is formed from the second board component 101. The thermally fusible conductive material applied using the first solder mask 7A has the first thermally fusible conductive material 81A, the second thermally fusible conductive material 82A, and the third thermally fusible conductive material 83A. The thermally fusible conductive material applied using the second solder mask 7B does not have the first thermally fusible conductive material 81A, the second thermally fusible conductive material 82A, and the third thermally fusible conductive material 83A. The first solder mask 7A and the second solder mask 7B are removed after the thermally fusible conductive material is applied and before the next step is performed.

[0075] Thirdly, depending on the selection result of step (SP2), it is determined whether or not the electronic component 9 is placed on the third heat-fusible conductive member 83A in the next step. When the first circuit board 104 is selected in step (SP2), the electronic component 9 is not placed on each of the first heat-fusible conductive member 81A, the second heat-fusible conductive member 82A, and the third heat-fusible conductive member 83A, but each of the first heat-fusible conductive member 81A, the second heat-fusible conductive member 82A, and the third heat-fusible conductive member 83A is melted and solidified (step (SP43)). At this time, the melted third heat-fusible conductive member 83A is collected on the upper surfaces of the first land 4 and the second land 5 due to its surface tension, and the height of the third heat-fusible conductive member 83A becomes higher than the height of each of the first heat-fusible conductive member 81A and the second heat-fusible conductive member 82A. The third thermally meltable conductive member 83A, which has an increased height, bulges in a direction along the upper surface due to its own weight, and forms a bridge (for example, a solder bridge) that spans the middle portion 60.

[0076] On the other hand, when the second circuit board 105 is selected in the step (SP2), the electronic component 9 is placed on each of the first heat-fusible conductive member 81A, the second heat-fusible conductive member 82A, and the third heat-fusible conductive member 83A (step (SP42)). Then, each of the first heat-fusible conductive member 81A, the second heat-fusible conductive member 82A, and the third heat-fusible conductive member 83A is melted and solidified (step (SP43)). At this time, the flow of the molten third heat-fusible conductive member 83A is restricted by the middle portion 60 of the protective film 6 and the body portion 93 of the electronic component 9. As a result, the molten third heat-fusible conductive member 83A spreads along the exposed portions of the upper and side surfaces of each of the first land 4 and the second land 5 to wet and spread to each of the first peripheral region 1A1, the second peripheral region 1A2, the third peripheral region 1A3, and the fourth peripheral region 1A4 of the first surface 1A. As a result, the molten third heat-fusible conductive member 83A is divided into a conductive member 83C1 located on one side of the intermediate portion 60 and a conductive member 83C2 located on the other side of the intermediate portion 60.

[0077] In addition, when the first circuit board 104 is selected in the step (SP2), the above step (SP43) may be performed after an electronic component is placed on the thermally fusible conductive material in an area not shown. That is, a manufacturing method for manufacturing the first circuit board 104 may be performed on a first area of ​​one board component, and a manufacturing method for manufacturing the second circuit board 105 may be performed on a second area different from the first area of ​​the one board component.

[0078] The distance between the first land 4 and the second land 5 in the first board component 100 is set according to the viscosity or wettability of the material constituting the third heat-fusible conductive material 83A so that the melted third heat-fusible conductive material 83A forms a bridge spanning the intermediate portion 60 in the above step (SP43) when the second circuit board 105 is selected.

[0079] Also, when a third circuit board is selected in step (SP2), the electronic components 9 are not placed on the first pads 2 and the second pads 3, and the heat-fusible conductive material applied to an area not shown is melted and solidified (step (SP43)).

[0080] In this way, the first circuit board 104, the second circuit board 105, and the third circuit board can be manufactured by the above-mentioned manufacturing method from the common first board component 100. Furthermore, in the above-mentioned manufacturing method, the step of applying the heat-fusible conductive material (SP41) and the step of melting and solidifying the heat-fusible conductive material (SP43) can be performed in a manner equivalent to a conventional reflow soldering process, regardless of whether the first circuit board 104, the second circuit board 105, or the third circuit board is to be manufactured.

[0081] In particular, the manufacturing method of first circuit board 104 differs from the manufacturing method of second circuit board 105 only in that the step (SP42) of arranging electronic component 9 on the heat-fusible conductive material is performed after the step (SP41) of applying the heat-fusible conductive material and before the step (SP43) of melting and solidifying the heat-fusible conductive material. In other words, it is possible to switch between first circuit board 104 and second circuit board 105 simply by whether or not to perform step (SP42).

[0082] <Action and effect> In the first substrate component 100 according to the first embodiment, the top and side surfaces of each of the first and second lands 4 and 5, and the peripheral regions of the first surface 1A that are located around each of the first and second lands 4 and 5 in a plan view each have exposed portions that are exposed from the protective film 6. When the third thermally fusible conductive material 83A applied to the first and second lands 4 and 5 melts with an electronic component 9 disposed thereon, these exposed portions provide regions where the molten third thermally fusible conductive material 83A can be pushed out and spread over the electronic component 9. In this case, a second circuit substrate 105 in which no solder bridge is formed between the first and second lands 4 and 5 can be manufactured.

[0083] On the other hand, when the third heat-fusible conductive material 83A applied on the first land 4 and the second land 5 melts without an electronic component 9 being placed thereon, the molten third heat-fusible conductive material 83A swells over the first land 4 and the second land 5 due to its surface tension and does not wet and spread over the exposed portions. In this case, a first circuit board 104 in which a solder bridge is formed between the first land 4 and the second land 5 can be manufactured.

[0084] In this way, the first substrate component 100 can be processed into the second substrate component 101 and then into the third substrate component 102, thereby becoming a component for manufacturing each of the first circuit board 104 and the second circuit board 105, which have different electrical functions.

[0085] Furthermore, the manufacturing method of the first circuit board 104 using the first board component 100 according to the first embodiment differs from the manufacturing method of the second circuit board 105 using the first board component 100 only in that a step of arranging the electronic components 9 on the third heat-fusible conductive member 83A is performed before the step of melting the third heat-fusible conductive member 83A. Furthermore, the manufacturing method of the second circuit board 105 using the first board component 100 according to the first embodiment does not require a pallet jig for holding the electronic components. As a result, by manufacturing the first circuit board 104 or the second circuit board 105 having different electrical functions using the first board component 100, it is possible to suppress an increase in the manufacturing costs of the first circuit board 104 and the second circuit board 105.

[0086] Furthermore, the first board component 100 can be processed into a fourth board component 103 having a second solder mask 7B that covers the exposed portion, thereby becoming a component for manufacturing a third circuit board having an electrical function different from that of the first circuit board 104 and the second circuit board 105. The second solder mask 7B can be prepared by simply masking the third opening 73 of the first solder mask 7A. Therefore, by manufacturing the third circuit board using the first board component 100, it is possible to suppress an increase in the manufacturing cost of the third circuit board.

[0087] Furthermore, in the conventional printed circuit board described above, in order to realize a structure in which the first land and the second land are not electrically connected, a pallet jig is required to prevent solder from adhering to the first land and the second land. In this case, the restrictions of the pallet jig limit the chip components that can be mounted and also impose many restrictions on component placement.

[0088] In contrast, a pallet jig is not required in the manufacturing method of the third circuit board using the first board component 100. As a result, by manufacturing the third circuit board using the first board component 100, it is possible to suppress an increase in the manufacturing cost of the third circuit board.

[0089] In the first substrate component 100, the total area of ​​the first peripheral region 1A1, the second peripheral region 1A2, the third peripheral region 1A3, and the fourth peripheral region 1A4 on the first surface 1A is larger than the total area of ​​the exposed portions of the upper surfaces of the first land 4 and the second land 5. In this way, when the third thermally fusible conductive material 83A applied on the first land 4 and the second land 5 melts with the electronic component 9 disposed thereon, the melted third thermally fusible conductive material 83A can be sufficiently wetted and spread over the peripheral regions. As a result, in the second circuit board 105 manufactured from the first substrate component 100, it is possible to more reliably prevent a solder bridge from being formed across the intermediate portion 60 of the protective film 6.

[0090] In the first substrate component 100, the intermediate portion 60 of the protective film 6 preferably protrudes upward from the upper surface of each of the first land 4 and the second land 5. In this way, when the third thermally fusible conductive material 83A applied to the first land 4 and the second land 5 melts with the electronic component 9 placed thereon, the melted third thermally fusible conductive material 83A is less likely to straddle the intermediate portion 60. As a result, in the second circuit board 105 manufactured from the first substrate component 100, it is possible to more reliably prevent a solder bridge from being formed so as to straddle the intermediate portion 60 of the protective film 6.

[0091] In the first substrate component 100, a first peripheral region 1A1 located around the first land 4 extends between the first pad 2 and the first land 4. A third peripheral region 1A3 located around the second land 5 extends between the second pad 3 and the second land 5. In this way, when the third thermally fusible conductive material 83A applied on the first land 4 and the second land 5 melts with the electronic component 9 placed thereon, the molten third thermally fusible conductive material 83A wets and spreads around the first pad 2 or the second pad 3, and can contribute to bonding between the first electrode 91 of the electronic component 9 and the first pad 2 and between the second electrode 92 and the second pad 3.

[0092] In the first board component 100, in a plan view, each of the first land 4 and the second land 5 has first portions 41, 51 spaced apart from each other in the first direction DR1 to sandwich an intermediate portion 60 therebetween, and second portions 42, 52 protruding from the first portions 41, 51 in the first direction DR1. In the second direction DR2, the first portion 41 of the first land 4 faces the second portion 52 of the second land 5 with the intermediate portion 60 in between, and the second portion 42 of the first land 4 faces the first portion 51 of the second land 5 with the intermediate portion 60 in between. The third thermally fusible conductive member 83A melted on the upper surfaces of each of the first land 4 and the second land 5 bulges in a direction along the upper surfaces. Therefore, if the first land 4 and the second land 5 are arranged opposite each other in each of the first direction DR1 and the second direction DR2 in the first substrate component 100, a solder bridge can be more reliably formed between the upper surfaces of the first land 4 and the second land 5 in the first circuit board 104 manufactured using the first substrate component 100, compared to when the first land 4 and the second land 5 are arranged opposite each other in only one direction.

[0093] In the second board component 101, the first solder mask 7A is formed with a first opening 71 exposing at least a part of the first pad 2, a second opening 72 exposing at least a part of the second pad 3, and a third opening 73 exposing at least the exposed parts of the first land 4 and the second land 5 and the intermediate part 60 of the protective film 6. The opening area of ​​the third opening 73 is larger than the total area of ​​the exposed parts of the upper surfaces of the first land 4 and the second land 5. In this way, when the third thermally fusible conductive material 83A applied in the third opening 73 melts in a state where no electronic component 9 is placed thereon, the melted third thermally fusible conductive material 83 gathers on the upper surfaces of the first land 4 and the second land 5 due to its surface tension, and the height of the melted third thermally fusible conductive material 83A becomes sufficiently higher than the height of the intermediate part 60. As a result, the melted third thermally fusible conductive material 83A can completely cover the intermediate part 60. Therefore, in the first circuit board 104 manufactured from the first board component 100 via the second board component 101, a solder bridge electrically connecting the upper surfaces of the first land 4 and the second land 5 can be more reliably formed.

[0094] In the first board component 100, the second board component 101, and the third board component 102, the distance between the exposed portions of the upper surfaces of the first land 4 and the second land 5 in plan view is set so that when the third heat-meltable conductive material 83A applied in the third opening 73 melts without an electronic component 9 being placed thereon, the melted third heat-meltable conductive material 83A simultaneously comes into contact with the exposed portions of the upper surfaces of the first land 4 and the second land 5. As described above, when the material constituting the third heat-meltable conductive material 83A is a material with low viscosity and wettability, the melted third heat-meltable conductive material 83A expands more due to its surface tension, so that the distance between the exposed portions of the upper surfaces of the first land 4 and the second land 5 in plan view can be set wide. As a result, the dimensional accuracy of the distance can be relaxed, and the risk of the first land 4 and the second land 5 being electrically short-circuited via the conductive material can be reduced when the second circuit board 105 is manufactured from the first board component 100.

[0095] The first circuit board 104 includes a first board component 100 and a third conductive member 83B electrically connecting between the exposed portions of the upper surfaces of the first lands 4 and the second lands 5. No electronic component 9 is mounted on the first pads 2 and the second pads 3 of the first circuit board 104.

[0096] The second circuit board 105 includes a first board component 100, an electronic component 9, a first conductive member 81C electrically connecting the first pad 2 and the first electrode 91, a second conductive member 82C electrically connecting the second pad 3 and the second electrode 92, a conductive member 83C1 disposed between the first land 4 and the body 93, and a conductive member 83C2 disposed between the second land 5 and the body 93. The conductive member 83C1 is disposed with a middle portion spaced apart from the conductive member 83C2.

[0097] The third circuit board includes a first board component 100 and a conductive member disposed on pads other than the first pad 2 and the second pad 3. The first pad 2, the second pad 3, the first land 4, and the second land 5 are each electrically insulated from one another.

[0098] The first circuit board 104, the second circuit board 105, and the third circuit board have different electrical functions. Each of the first circuit board 104, the second circuit board 105, and the third circuit board includes the first board component 100 as a component, and can be manufactured by performing the above-mentioned manufacturing method on the first board component 100.

[0099] According to the first embodiment, even when the first circuit board 104, the second circuit board 105, and the third circuit board are mass-produced, the first board component 100 can be used as a common component, and it is also possible to switch the circuit board to be ultimately manufactured for each lot in the manufacturing method or for each board within a lot.

[0100] According to the first embodiment, when evaluating an electronic component whose circuit setting is not yet determined during development of a circuit board, a structure in which pads on which the electronic component is mounted are electrically connected can be easily prototyped as the first circuit board 104, a structure on which the electronic component is mounted can be the second circuit board 105, and a structure in which pads on which the electronic component is mounted are electrically insulated can be easily prototyped as the third circuit board. Furthermore, according to the first embodiment, after the circuit setting is determined by the prototype evaluation, the design of the prototype circuit board can be directly applied to mass production. Therefore, according to the first embodiment, it is possible to suppress an increase in economic costs and an increase in environmental load in the process from development to mass production.

[0101] Embodiment 2 A first substrate component 110 according to embodiment 2 will be described with reference to Fig. 15. Unless otherwise specified, the first substrate component 110 according to embodiment 2 has the same configuration and effect as the first substrate component 100 according to embodiment 1 described above. Therefore, the same configuration as the first substrate component 100 described above is given the same reference numerals, and description thereof will not be repeated.

[0102] 15, in the first substrate component 110, the first land 4 is not electrically connected to the first pad 2. Similarly, the second land 5 is not electrically connected to the second pad 3. In other words, the first land 4 and the second land 5 are included in a circuit different from the circuit including the first pad 2 and the second pad 3.

[0103] According to such a first substrate component 110, it is possible to switch the circuits that are electrically connected between a first circuit board manufactured using the first substrate component 110 and a second circuit board manufactured using the first substrate component 110.

[0104] The first board component 110 is suitable as a component for manufacturing a circuit board used in, for example, a DC voltage conversion circuit. For example, in a DC voltage conversion circuit, a circuit board corresponding to a use condition where a predetermined voltage is supplied from an external power supply device may be used that does not have a regulator IC component mounted thereon and has a voltage monitoring circuit formed thereon that indicates that the voltage has entered a normal range. As such a circuit board, a first circuit board manufactured using the first board component 110 is suitable. On the other hand, as a circuit board corresponding to a use condition where a voltage other than the predetermined voltage is supplied, a circuit board that has a regulator IC component mounted thereon and the voltage monitoring circuit disconnected may be used. As such a circuit board, a second circuit board manufactured using the first board component 110 is suitable. In other words, when the first circuit board or the second circuit board is manufactured using the first board component 110, it is possible to simultaneously switch whether or not a regulator IC is mounted as an electronic component and whether or not a voltage monitoring circuit is formed. The first board component 110 is particularly useful as a common component that can be used to manufacture two circuit boards with different circuit specifications.

[0105] The second, third, or fourth substrate component according to embodiment 2 can be formed by processing first substrate component 110 according to embodiment 2 in the same manner as embodiment 1. Each of the first circuit board, second circuit board, and third circuit board according to embodiment 2 can be manufactured using first substrate component 110 according to embodiment 2.

[0106] Embodiment 3 16 to 18, a first substrate component 120 and second substrate components 121A and 121B according to embodiment 3 will be described. Unless otherwise specified, the first substrate component 120 and second substrate components 121A and 121B according to embodiment 3 have the same configurations and effects as the first substrate component 100 and second substrate component 101 according to embodiment 1 described above. Therefore, the same reference numerals are used to designate the same configurations as the first substrate component 100 and second substrate component 101 described above, and description thereof will not be repeated.

[0107] 16, in the first substrate component 120, the first land 4 and the second land 5 are not disposed between the first pad 2 and the second pad 3. The first surface 1A of the substrate 1 does not have an exposed portion that is exposed from the protective film 6.

[0108] 17 and 18, there are two types of second substrate components 121A and 121B in the embodiment 3. Each of the second substrate components 121A and 121B includes a first substrate component 120 and a third solder mask 7C or a fourth solder mask 7D.

[0109] 17, the second substrate component 121A has a third solder mask 7C. At least a third opening 73 is formed in the third solder mask 7C of the second substrate component 121. The third solder mask 7C of the second substrate component 121 may have a first opening 71 and a second opening 72 formed therein, similar to the first solder mask 7A of the second substrate component 101.

[0110] The second substrate component 121A shown in FIG. 17 is a component for manufacturing a first circuit substrate on which no electronic components are mounted and in which the first land 4 and the second land 5 are electrically connected via the third conductive member 83C.

[0111] 18, the second board component 121B has a fourth solder mask 7D that is different from the third solder mask 7C. In the fourth solder mask 7D, only the first opening 71 and the second opening 72 are formed, and the third opening 73 is not formed.

[0112] A second board component 121B shown in FIG. 18 is a component for manufacturing a second circuit board on which an electronic component is mounted and in which first lands 4 and second lands 5 are electrically insulated.

[0113] In the third embodiment, since electronic components are not placed on the upper surfaces of the first lands 4 and the second lands 5, the shape of the third heat-fusible conductive material 83A melted on the upper surfaces of the first lands 4 and the second lands 5 does not change depending on the presence or absence of electronic components. Therefore, in the third embodiment, unlike the first embodiment, it is not possible to change the circuit board to be finally manufactured simply by whether or not electronic components are placed on the third heat-fusible conductive material 83A.

[0114] On the other hand, it is possible to switch the circuit board that is finally manufactured by simply placing the third solder mask 7C or the fourth solder mask 7D.

[0115] Therefore, for the same reasons as in the first embodiment, in the third embodiment as well, it is possible to suppress an increase in the manufacturing costs of the first circuit board, the second circuit board, and the third circuit board.

[0116] Embodiment 4 A second substrate component 131 according to embodiment 4 will be described with reference to Fig. 19. Unless otherwise specified, second substrate component 131 according to embodiment 4 has the same configuration and effect as second substrate component 121 according to embodiment 3 described above. Therefore, the same configuration as second substrate component 121 described above is denoted by the same reference numerals, and description thereof will not be repeated.

[0117] As shown in FIG. 19, in the second substrate component 121, the first land 4 and the second land 5 are not disposed between the first pad 2 and the second pad 3. The first surface 1A of the substrate 1 does not have an exposed portion exposed from the protective film 6. The opening area of ​​the third opening 73 is equal to the area of ​​the above-mentioned exposed portion of the upper surface of each of the first land 4 and the second land 5. In other words, the opening area of ​​the third opening 73 is set so that when the third thermally fusible conductive material 83A applied in the third opening 73 melts, the melted third thermally fusible conductive material 83A does not form a bridge that electrically connects the first land 4 and the second land 5 across the intermediate portion 60.

[0118] The second substrate component 121 has a portion that is arranged between the first pad 2 and the second pad 3 in the first direction DR1, and further includes a third land 10 that is spaced apart from each of the first land 4 and the second land 5 in the second direction DR2.

[0119] In the second substrate component 121, the first pad 2, the second pad 3, the first land 4, and the second land 5 are not electrically connected to one another.

[0120] In the protective film 6, a protective film opening 65 is formed through which at least a part of the upper surface of the third land 10 is exposed.

[0121] The third solder mask 7C is formed with a first opening 71, a second opening 72, a third opening 73, and a fourth opening 74 overlapping with the protective film opening 65 in a plan view. At least a portion of each of the protective film opening 65 and the fourth opening 74 is arranged to overlap with the electronic component 9 in a plan view. At least a portion of the fourth opening 74 is arranged to protrude closer to the third opening 73 than the electronic component 9 in a plan view.

[0122] The opening area of ​​the fourth opening 74 is larger than the opening area of ​​the protective film opening 65. Preferably, the opening area of ​​the fourth opening 74 is 1.5 times or more and 3 times or less than the opening area of ​​the protective film opening 65. In a plan view, the distance between the fourth opening 74 and the third opening 73 is shorter than the distance between the protective film opening 65 and the third opening 73. The distance between the fourth opening 74 and the third opening 73 is shorter than the distance between the fourth opening 74 and the first opening 71. The distance between the fourth opening 74 and the third opening 73 is shorter than the distance between the fourth opening 74 and the second opening 72.

[0123] 20 is formed by applying a heat-fusible conductive member into each opening of the third solder mask 7C of the second substrate component 121. The third substrate component 132 has a fourth heat-fusible conductive member 84 applied into the fourth opening 74. The fourth heat-fusible conductive member 84 is disposed on the upper surface of the third land 10.

[0124] In the fourth embodiment, second substrate component 121 can be a component for manufacturing a fourth circuit board 135 (see FIG. 21) in which electronic components 9 are mounted on first pads 2 and second pads 3, and a conductive member electrically connects first land 4 and second land 5. Second substrate component 121 can also be a component for manufacturing a third circuit board 136 (see FIG. 22) in which electronic components 9 are not mounted on first pads 2 and second pads 3, and first land 4 is electrically insulated from second land 5.

[0125] Specifically, when the fourth heat-meltable conductive member 84A applied on the third land 10 melts with the electronic component 9 placed thereon, the fourth heat-meltable conductive member 84A spreads in the second direction DR2 and comes into contact with the third heat-meltable conductive member 83A on the upper surfaces of the first land 4 and the second land 5, and merges with it. As a result, as shown in FIG. 21, a fourth circuit board 135 can be manufactured in which the electronic component 9 is mounted on the first pad 2 and the second pad 3, and the fourth conductive member 84C electrically connects the first land 4 and the second land 5. The distance between the fourth opening 74 and the third opening 73 is shorter than the distance between the fourth opening 74 and the first opening 71 and the distance between the fourth opening 74 and the second opening 72. Therefore, the fourth heat-meltable conductive member 84A does not come into contact with the first heat-meltable conductive member on the upper surface of the first pad 2 and the second heat-meltable conductive member on the upper surface of the second pad 3.

[0126] On the other hand, when the fourth heat-fusible conductive material 84A applied on the third land 10 melts without the electronic component 9 being placed thereon, the fourth heat-fusible conductive material 84A does not spread in the second direction DR2 and does not come into contact with the third heat-fusible conductive material 83A on the upper surfaces of the first land 4 and the second land 5. As described above, the opening area of ​​the third opening 73 is set so that when the third heat-fusible conductive material 83A applied in the third opening 73 melts, the molten third heat-fusible conductive material 83A does not form a bridge that electrically connects the first land 4 and the second land 5 across the intermediate portion 60. Therefore, the molten third heat-fusible conductive material 83A alone cannot electrically connect the first land 4 and the second land 5 across the intermediate portion 60. As a result, as shown in FIG. 22, a third circuit board 136 can be manufactured in which electronic components 9 are not mounted on the first pads 2 and the second pads 3, and the first lands 4 are electrically insulated from the second lands 5.

[0127] As described above, in the first embodiment, the first land 4 is electrically insulated from the second land 5 when the electronic component 9 is mounted, and the first land 4 is electrically short-circuited to the second land 5 when the electronic component 9 is not mounted. In contrast, according to the fourth embodiment, the first land 4 and the second land 5 are electrically short-circuited when the electronic component 9 is mounted, and the first land 4 is electrically insulated from the second land 5 when the electronic component 9 is not mounted. In this way, according to the fourth embodiment, it is possible to switch the circuit board to be manufactured based on whether or not the electronic component 9 is mounted, while also enabling switching that is reversed from that of the first embodiment.

[0128] The board components according to the first to fourth embodiments may be combined with each other in one board component. For example, the second board component 121 according to the fourth embodiment may be combined with the second board component 101 according to the first embodiment. That is, a first region of one board component may have a configuration similar to that of the second board component 101 according to the first embodiment, and a second region different from the first region of the one board component may have a configuration similar to that of the second board component 131 according to the fourth embodiment. In this way, by arbitrarily combining the first to fourth embodiments, the degree of freedom in switching the circuit can be significantly increased.

[0129] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0130] 1 substrate, 1A first surface, 1A1 first peripheral region, 1A2 second peripheral region, 1A3 third peripheral region, 1A4 fourth peripheral region, 2 first pad, 3 second pad, 4 first land, 5 second land, 6 protective film, 6A1 fifth peripheral region, 6A2 sixth peripheral region, 7A first solder mask, 7B second solder mask, 7C third solder mask, 7D fourth solder mask, 9 electronic component, 10 third land, 41, 51 first portion, 42, 52 second portion, 43, 53 third portion, 60 middle portion, 61, 62, 63, 64 opening portion, 65 protective film opening, 71 first opening, 72 second opening, 73 third opening, 74 fourth opening, 81A first thermally fusible conductive member, 81B, 81C first conductive member, 82A Second heat-fusible conductive member, 82B, 82C second conductive member, 83, 83A third heat-fusible conductive member, 83B, 83C third conductive member, 83C1, 83C2 conductive member, 84A fourth heat-fusible conductive member, 84C fourth conductive member, 91 first electrode, 92 second electrode, 93 body, 100, 110, 120 first board component, 101, 121, 121A, 121B, 131 second board component, 102, 132 third board component, 103 fourth board component, 104 first circuit board, 105 second circuit board, 135 fourth circuit board, 136 third circuit board.

Claims

1. a substrate having a first surface; a first pad and a second pad spaced apart from each other on the first surface; a first land and a second land spaced apart from each other on the first surface; a protective film disposed on the first surface and exposing at least a portion of an upper surface of each of the first pad and the second pad; the protective film has an intermediate portion separating the first land and the second land in a plan view, A substrate component, wherein an upper surface and a side surface of each of the first lands and the second lands, and a peripheral region of the first surface located around each of the first lands and the second lands in a planar view, each have an exposed portion exposed from the protective film.

2. The substrate part according to claim 1 , wherein an area of ​​the exposed portion of the peripheral region of the first surface is greater than a total area of ​​the exposed portions of the upper surfaces of the first lands and the second lands.

3. The substrate component according to claim 1 , wherein the intermediate portion protrudes upward from the upper surface of each of the first land and the second land.

4. In a direction along the first surface, the first land is disposed between the first pad and the second pad, and the second land is disposed between the first land and the second pad, 2. The substrate component of claim 1, wherein, in a plan view, the exposed portion of the peripheral region of the first surface has a first exposed portion extending between the first pad and the first land, and a second exposed portion extending between the second pad and the second land.

5. In a plan view, each of the first land and the second land has a first portion that is spaced apart from each other in a first direction along the first surface so as to sandwich the intermediate portion therebetween, and a second portion that protrudes from the first portion in the first direction, 2. The circuit board component according to claim 1, wherein, in a second direction along the first surface and perpendicular to the first direction, the first portion of the first land is disposed opposite the second portion of the second land with the intermediate portion therebetween, and the second portion of the first land is disposed opposite the first portion of the second land with the intermediate portion therebetween.

6. the first land is electrically connected to the first pad, The substrate component according to claim 1 , wherein the second land is electrically connected to the second pad.

7. The substrate component according to claim 1 , wherein the first pad, the second pad, the first land, and the second land are not electrically connected to each other.

8. a first solder mask disposed on the first surface; the first solder mask is formed with a first opening exposing at least a portion of the first pad, a second opening exposing at least a portion of the second pad, and a third opening exposing the exposed portions of the first land and the second land and the intermediate portion of the protective film; The substrate component according to claim 1 , wherein an opening area of ​​the third opening is greater than a total area of ​​the exposed portions of the upper surfaces of the first and second lands.

9. a first heat-fusible conductive member disposed in the first opening, a second heat-fusible conductive member disposed in the second opening, and a third heat-fusible conductive member disposed in the third opening; The substrate component of claim 8, wherein the distance between the exposed portions of the upper surfaces of the first land and the second land in a planar view is set so that the molten third heat-fusible conductive member can simultaneously contact the exposed portions of the upper surfaces of the first land and the second land.

10. A substrate component according to any one of claims 1 to 7; a first conductive member disposed on the first pad; a second conductive member disposed on the second pad; a third conductive member disposed on the first land, the second land, and the intermediate portion, electrically connecting the exposed portions of the upper surfaces of the first land and the second land, The circuit board, wherein no electronic components are mounted on the first pads and the second pads.

11. A substrate component according to any one of claims 1 to 7, In a plan view, the first land is disposed between the first pad and the second pad, and the second land is disposed between the first land and the second pad, an electronic component having a first electrode, a second electrode, and a body portion extending between the first electrode and the second electrode; a first conductive member electrically connecting the first pad and the first electrode; a second conductive member electrically connecting the second pad and the second electrode; a fourth conductive member disposed between the first land and the body portion; a fifth conductive member disposed between the second land and the body portion, the intermediate portion is in contact with the trunk portion, The fourth conductive member is disposed at a distance from the fifth conductive member by the intermediate portion.

12. A substrate component according to any one of claims 1 to 7; a conductive member disposed on a pad other than the first pad and the second pad of the substrate component, A circuit board, wherein the first pad, the second pad, the first land, and the second land are electrically insulated from each other.

13. a substrate having a first surface; a first pad and a second pad spaced apart from each other on the first surface; a first land and a second land spaced apart from each other on the first surface; a protective film disposed on the first surface and exposing at least a portion of an upper surface of each of the first pad and the second pad; the protective film has an intermediate portion separating the first land and the second land in a plan view, an upper surface of each of the first land and the second land has an exposed portion exposed from the protective film; a third solder mask having a third opening formed therein, the third opening exposing at least the exposed portions of the first lands and the second lands and the intermediate portion of the protective film; A fourth solder mask having a first opening exposing at least a portion of the first pad and a second opening exposing at least a portion of the second pad; or The substrate component further includes a fifth solder mask formed to cover the exposed portions of the first and second lands and the intermediate portion of the protective film.

14. the first pad and the second pad are spaced apart from each other in a first direction along the first surface, a third land having a portion disposed between the first pad and the second pad in the first direction, the third land being disposed at a distance from each of the first land and the second land in a second direction along the first surface and perpendicular to the first direction; a protective film opening is formed in the protective film to expose at least a portion of an upper surface of the third land; the third solder mask further includes the first opening, the second opening, and a fourth opening overlapping the protective film opening in a plan view; an opening area of ​​the fourth opening is larger than an opening area of ​​the protective film opening, The board component according to claim 13 , wherein in a plan view, a distance between the fourth opening and the third opening is shorter than a distance between the protective film opening and the third opening.

15. A substrate having a first surface; a first pad and a second pad spaced apart from each other on the first surface; a first land and a second land spaced apart from each other on the first surface; a protective film disposed on the first surface and exposing at least a portion of an upper surface of each of the first pad and the second pad; the protective film has an intermediate portion separating the first land and the second land in a plan view, an upper surface of each of the first land and the second land has an exposed portion exposed from the protective film; the first pad and the second pad are spaced apart from each other in a first direction along the first surface, a third land having a portion disposed between the first pad and the second pad in the first direction, the third land being disposed at a distance from each of the first land and the second land in a second direction along the first surface and perpendicular to the first direction; a protective film opening is formed in the protective film to expose at least a portion of an upper surface of the third land; an electronic component having a first electrode disposed on the first pad, a second electrode disposed on the second pad, and a body portion extending between the first electrode and the second electrode and disposed on the third land; a first conductive member electrically connecting the first pad and the first electrode; a second conductive member electrically connecting the second pad and the second electrode; a third conductive member disposed on the first land, the second land, the intermediate portion, and the third land, and electrically connecting between the exposed portions of the top surfaces of the first land and the second land.

16. A method for manufacturing a circuit board from a substrate component, comprising the steps of: providing the substrate component; The substrate component is a substrate having a first surface; a first pad and a second pad spaced apart from each other on the first surface; a first land and a second land arranged on the first surface between the first pad and the second pad and spaced apart from each other; a protective film disposed on the first surface and exposing at least a portion of an upper surface of each of the first pad and the second pad; the protective film has an intermediate portion separating the first land and the second land in a plan view, an upper surface and a side surface of each of the first lands and the second lands, and a peripheral region of the first surface that is located around each of the first lands and the second lands in a plan view, each of the first lands and the second lands has an exposed portion that is exposed from the protective film; selecting, as the circuit board to be manufactured, one from a group of a first circuit board on which an electronic component having a first electrode, a second electrode, and a body extending between the first electrode and the second electrode is not mounted on the first pad and the second pad, and on which a conductive member electrically connecting the first land and the second land is mounted, a second circuit board on which the electronic component is mounted, and a third circuit board on which the electronic component is not mounted and the conductive member is not mounted; placing a solder mask on the substrate component in response to the selection; applying a thermally fusible conductive material onto the substrate component using the solder mask; melting and solidifying the thermally fusible conductive member; A method for manufacturing a circuit board, wherein the process of melting and solidifying the heat-fusible conductive member is switched between a process of melting and solidifying the heat-fusible conductive member with the electronic component placed on the heat-fusible conductive member, and a process of melting and solidifying the heat-fusible conductive member with the electronic component not placed on the heat-fusible conductive member, depending on the result of the selection.

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