Droplet ejection head

Abstract

To enhance rigidity of a droplet discharge head.SOLUTION: A droplet ejection head according to the present disclosure includes a head body, a driver IC, a flexible substrate, a heat dissipation plate, and a pressing member. The head body has a plurality of ejection holes through which droplets are ejected. The driver IC controls driving of the head body. The flexible substrate has the driver IC mounted thereon and is electrically connected to the head body. The heat dissipation plate dissipates heat that has been generated by the driver IC. The pressing member presses the driver IC to the heat dissipation plate. The heat dissipation plate and the pressing member are fixed in the center portion of the head body in a longitudinal direction thereof.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present disclosure relates to a droplet ejection head. [Background technology]

[0002] Conventionally, as a printing head, for example, a liquid ejection head that performs various printing by ejecting liquid onto a recording medium is known. Patent Document 1 discloses a liquid ejection head in which a driver IC is mounted on a flexible substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2020 / 250873 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that can increase the rigidity of a droplet ejection head.

[0005] A droplet ejection head according to one aspect of the present disclosure includes a head body, a driver IC, a flexible substrate, a heat sink, and a pressing member. The head body has a plurality of ejection holes from which droplets are ejected. The driver IC controls the driving of the head body. The flexible substrate has the driver IC mounted thereon and is electrically connected to the head body. The heat sink dissipates heat generated by the driver IC. The pressing member presses the driver IC against the heat sink. The heat sink and the pressing member are fixed at the center of the head body in the longitudinal direction. Effect of the Invention

[0006] According to the present disclosure, the rigidity of the droplet ejection head can be increased. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic side view of a printer according to the first embodiment. [Diagram 2] FIG. 2 is a schematic plan view of the printer according to the first embodiment. [Diagram 3] FIG. 3 is an exploded perspective view showing a schematic configuration of the droplet ejection head according to the first embodiment. [Figure 4] FIG. 4 is a perspective view for explaining the flexible substrate and the structure around the flexible substrate according to the first embodiment. [Diagram 5] FIG. 5 is a diagram for explaining the overall configuration of the flexible substrate according to the first embodiment. [Figure 6] FIG. 6 is a perspective view for explaining the structure of the pressing member according to the first embodiment. [Figure 7] FIG. 7 is a schematic front view showing an example of the configuration of a droplet ejection head. [Figure 8] FIG. 8 is a schematic front view showing an example of the configuration of a droplet ejection head. [Figure 9] FIG. 9 is a schematic side view showing an example of the configuration of a droplet ejection head. [Figure 10] FIG. 10 is a diagram showing a configuration of a flexible substrate according to Modification 1 of the first embodiment. [Figure 11] FIG. 11 is a schematic front view showing an example of the configuration of a droplet ejection head according to Modification 2 of the first embodiment. [Figure 12] FIG. 12 is a schematic front view showing an example of the configuration of a droplet ejection head according to Modification 2 of the first embodiment. [Figure 13] FIG. 13 is an exploded perspective view showing a schematic configuration of a droplet ejection head according to the second embodiment. [Figure 14] FIG. 14 is a schematic perspective view showing the configurations of the wiring board, the first support member, and the second support member according to the second embodiment. [Figure 15] FIG. 15 is a schematic perspective view showing the configuration of a pressing member according to the second embodiment. [Figure 16] FIG. 16 is a cross-sectional view taken along line XV-XV in FIG. [Figure 17] FIG. 17 is a schematic cross-sectional view showing the configuration of one end of a droplet ejection head according to a modified example of the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, a form for carrying out a droplet ejection head according to the present disclosure (hereinafter, referred to as an "embodiment") will be described in detail with reference to the drawings. Note that the present disclosure is not limited to this embodiment. Furthermore, each embodiment can be appropriately combined within a range that does not cause a contradiction in the processing content. Furthermore, the same parts in each of the following embodiments are given the same reference numerals, and duplicated explanations will be omitted.

[0009] In addition, in the embodiments described below, expressions such as "constant", "orthogonal", "vertical" and "parallel" may be used, but these expressions do not necessarily mean "constant", "orthogonal", "vertical" and "parallel" strictly. In other words, each of the above expressions allows for deviations due to, for example, manufacturing accuracy or installation accuracy.

[0010] Conventionally, as a printing head, for example, a liquid ejection head that performs various printing by ejecting liquid onto a recording medium is known. Patent Document 1 discloses a liquid ejection head in which a driver IC is mounted on a flexible substrate. Patent Document 1 also discloses a technology for enhancing the heat dissipation of the driver IC by pressing the driver IC against a heat sink using a pressing member to bring the driver IC into close contact with the heat sink.

[0011] However, in the technology described in Patent Document 1, the pressing member and the heat sink are fixed only at both longitudinal ends of the head body, so that the entire liquid ejection head, and particularly the longitudinal central portion of the droplet ejection head, is weaker against external and internal pressure than the longitudinal ends of the droplet ejection head.

[0012] Therefore, a technology for increasing the rigidity of the droplet ejection head is desired.

[0013] (First embodiment) <Printer configuration> First, an overview of a printer 1, which is an example of a recording device according to the first embodiment, will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a schematic side view of the printer 1 according to the first embodiment, and Fig. 2 is a schematic plan view of the printer 1. The printer 1 according to the first embodiment is, for example, a color inkjet printer.

[0014] As shown in FIG. 1, the printer 1 includes a paper feed roller 2, a guide roller 3, an applicator 4, a head case 5, a plurality of conveying rollers 6, a plurality of frames 7, a plurality of droplet ejection heads 8, a conveying roller 9, a dryer 10, a conveying roller 11, a sensor unit 12, and a recovery roller 13.

[0015] Furthermore, the printer 1 has a control unit 14 that controls the paper feed roller 2, guide roller 3, coater 4, head case 5, multiple conveying rollers 6, multiple frames 7, multiple droplet ejection heads 8, conveying roller 9, dryer 10, conveying roller 11, sensor unit 12 and recovery roller 13.

[0016] The printer 1 records images or characters on the printing paper P by causing droplets to land on the printing paper P. The printing paper P is an example of a recording medium. Before use, the printing paper P is wound around a paper feed roller 2. The printer 1 transports the printing paper P from the paper feed roller 2 through a guide roller 3 and a coater 4 into the inside of a head case 5.

[0017] The coater 4 applies the coating agent evenly to the printing paper P. This allows the printing paper P to be surface-treated, thereby improving the printing quality of the printer 1.

[0018] The head case 5 houses a plurality of transport rollers 6, a plurality of frames 7, and a plurality of droplet ejection heads 8. Inside the head case 5, a space is formed that is isolated from the outside, except for a portion that is connected to the outside, such as a portion where the printing paper P enters and exits.

[0019] At least one of control factors such as temperature, humidity, and air pressure of the internal space of the head case 5 is controlled by the control unit 14 as necessary. The transport rollers 6 transport the printing paper P inside the head case 5 to the vicinity of the droplet ejection heads 8.

[0020] The frame 7 is a rectangular flat plate, and is positioned adjacent to and above the print paper P transported by the transport rollers 6. As shown in Fig. 2, the frame 7 is positioned so that its longitudinal direction is perpendicular to the transport direction of the print paper P. Inside the head case 5, multiple (for example, four) frames 7 are positioned along the transport direction of the print paper P.

[0021] In the following description, the transport direction of the printing paper P is also referred to as the "sub-scanning direction," and the direction perpendicular to the sub-scanning direction and parallel to the printing paper P is also referred to as the "main scanning direction."

[0022] A liquid, such as ink, is supplied from a liquid tank (not shown) to the droplet discharge head 8. The droplet discharge head 8 discharges droplets supplied from the liquid tank.

[0023] The control unit 14 controls the droplet ejection head 8 based on data such as images or characters, and ejects droplets toward the printing paper P. The distance between the droplet ejection head 8 and the printing paper P is, for example, about 0.5 to 20 mm.

[0024] The droplet ejection head 8 is fixed to the frame 7. The droplet ejection head 8 is fixed to the frame 7, for example, at both ends in the longitudinal direction. The droplet ejection head 8 is positioned so that the longitudinal direction is perpendicular to the transport direction of the printing paper P.

[0025] That is, the printer 1 according to the first embodiment is a so-called line printer in which the droplet ejection head 8 is fixed inside the printer 1. Note that the printer 1 according to the first embodiment is not limited to a line printer, and may be a so-called serial printer.

[0026] This serial printer is a printer that alternates between recording by moving a droplet ejection head 8 back and forth in a direction that intersects the transport direction of the printing paper P, for example in a direction that is approximately perpendicular, and transporting the printing paper P.

[0027] As shown in Fig. 2, multiple (for example, five) droplet ejection heads 8 are fixed to one frame 7. Fig. 2 shows an example in which three droplet ejection heads 8 are positioned in the front and two in the rear in the transport direction of the print paper P, and the droplet ejection heads 8 are positioned in the transport direction of the print paper P such that the centers of the droplet ejection heads 8 do not overlap.

[0028] A head group 8A is made up of a plurality of droplet ejection heads 8 positioned on one frame 7. The four head groups 8A are positioned along the transport direction of the print paper P. Ink of the same color is supplied to droplet ejection heads 8 belonging to the same head group 8A. This allows the printer 1 to print with four colors of ink using the four head groups 8A.

[0029] The colors of ink ejected from each head group 8A are, for example, magenta (M), yellow (Y), cyan (C), and black (K). The control unit 14 controls each head group 8A to eject ink of multiple colors onto the printing paper P, thereby printing a color image on the printing paper P.

[0030] In order to treat the surface of the printing paper P, a coating agent may be ejected onto the printing paper P from the droplet ejection head 8.

[0031] Furthermore, the number of droplet ejection heads 8 included in one head group 8A, or the number of head groups 8A mounted on the printer 1, can be changed as appropriate depending on the object to be printed or the printing conditions. For example, if the color printed on the printing paper P is a single color and printing is performed in an area that can be printed with one droplet ejection head 8, the number of droplet ejection heads 8 mounted on the printer 1 may be one.

[0032] The print paper P that has been printed inside the head case 5 is transported to the outside of the head case 5 by transport rollers 9 and passes through the inside of the dryer 10. The dryer 10 dries the print paper P that has been printed. The print paper P that has been dried in the dryer 10 is transported by transport rollers 11 and collected by collection rollers 13.

[0033] In the printer 1, by drying the printing paper P with the dryer 10, it is possible to prevent the printing paper P that is wound up in an overlapping state from sticking to each other on the recovery roller 13 and to prevent the wet liquid from rubbing against each other.

[0034] The sensor unit 12 is composed of a position sensor, a speed sensor, a temperature sensor, etc. The control unit 14 can determine the state of each part of the printer 1 based on information from the sensor unit 12 and control each part of the printer 1.

[0035] In the printer 1 described so far, printing paper P is used as the printing target (i.e., recording medium), but the printing target in the printer 1 is not limited to printing paper P, and the printing target may also be a roll of cloth or the like.

[0036] The printer 1 may also be configured to transport the print paper P on a transport belt instead of directly transporting the print paper P. By using a transport belt, the printer 1 can print on sheets of paper, cut pieces of cloth, wood, tiles, and the like.

[0037] The printer 1 may also print wiring patterns for electronic devices by discharging droplets containing conductive particles from the droplet discharging head 8. The printer 1 may also prepare chemicals by discharging a predetermined amount of liquid chemicals or droplets containing chemicals from the droplet discharging head 8 toward a reaction vessel or the like.

[0038] The printer 1 may also include a cleaning unit that cleans the droplet ejection head 8. The cleaning unit cleans the droplet ejection head 8 by, for example, a wiping process or a capping process.

[0039] The wiping process is a process of removing liquid adhering to the droplet ejection head 8 by wiping the surface of the area from which droplets are ejected with a flexible wiper, for example.

[0040] The capping process is carried out, for example, as follows: First, a cap is placed over the surface of the portion from which the droplets are discharged (this is called capping). This forms a nearly sealed space between the surface of the portion from which the droplets are discharged and the cap.

[0041] Next, droplets are repeatedly discharged into this sealed space, which makes it possible to remove liquid with a higher viscosity than the standard state or foreign matter that has been clogged in the discharge holes (nozzles) that discharge the droplets.

[0042] <Configuration of droplet ejection head> Next, the configuration of the droplet ejection head 8 according to the first embodiment will be described with reference to Fig. 3. Fig. 3 is an exploded perspective view showing a schematic configuration of the droplet ejection head 8 according to the first embodiment.

[0043] The droplet ejection head 8 includes a head body 20, a wiring section 30, a head cover 40, and two heat sinks 45. The head body 20 includes a flow path member 21, a piezoelectric actuator substrate (not shown), and a reservoir 23.

[0044] In the following description, for convenience, the direction in which the head body 20 is provided in the droplet ejection head 8 may be referred to as "downward," and the direction in which the head cover 40 is provided relative to the head body 20 may be referred to as "upward."

[0045] The flow path member 21 of the head body 20 has a substantially flat plate shape and has a first surface (not shown) which is one main surface, and a second surface (not shown) located on the opposite side of the first surface. The first surface has an opening (not shown), and liquid is supplied from a reservoir 23 to the inside of the flow path member 21 through the opening.

[0046] The second surface has a plurality of ejection holes (not shown) that eject liquid onto the print paper P. The flow path member 21 has therein a flow path that allows liquid to flow from the first surface to the second surface.

[0047] The piezoelectric actuator substrate is located on a first surface of the flow path member 21. The piezoelectric actuator substrate has a plurality of displacement elements (not shown). A flexible substrate 31 of the wiring section 30 is electrically connected to the piezoelectric actuator substrate.

[0048] A reservoir 23 is positioned on the piezoelectric actuator substrate. The reservoir 23 has openings 23a at both ends in the main scanning direction, which is perpendicular to the sub-scanning direction, which is the transport direction of the print paper P, and parallel to the print paper P. That is, the reservoir 23 has two openings 23a. The reservoir 23 has a flow path therein, and liquid is supplied from the outside through the openings 23a. The reservoir 23 supplies liquid to the flow path member 21. The reservoir 23 also stores the liquid supplied to the flow path member 21.

[0049] When printing, liquid may be supplied from one opening 23a and the other opening 23a may be closed. Also, liquid may be supplied from both openings 23a. When initially introducing liquid into the droplet discharge head 8, if liquid is supplied from one opening 23a and collected from the other opening 23a, air and storage liquid in the flow path inside the reservoir 23 can be easily removed from the flow path, making it easier to introduce liquid into the droplet discharge head 8.

[0050] Also, during printing, liquid may be supplied from one opening 23a and collected from the other opening 23a. In this way, air bubbles are less likely to accumulate in the flow path inside the reservoir 23. Furthermore, by supplying liquid adjusted to a constant temperature, the temperature of the droplet discharge head 8 can be stabilized. The collected liquid may be passed through a filter or the like and then supplied again to the droplet discharge head 8. In other words, the liquid may be circulated. The supply and collection of liquid to the droplet discharge head 8, or the circulation of the liquid, may be controlled by the control unit 14.

[0051] Furthermore, liquid may be supplied from the reservoir 23 to the flow path member 21, and liquid may be recovered from the flow path member 21 to the reservoir 23. Furthermore, liquid may be supplied to and recovered from the flow path facing the nozzle (ejection hole) in the flow path member 21, so that liquid is less likely to accumulate in the nozzle and its periphery. In such an embodiment, liquid is supplied from the outside to the droplet ejection head 8 as a whole, a portion of the liquid is ejected from the ejection hole, and the liquid that is not ejected is recovered to the outside.

[0052] The wiring section 30 has a flexible substrate 31, a wiring substrate 32, a plurality of driver ICs 33, a pressing member 34, and an elastic member 35 (see FIG. 9). The flexible substrate 31 transmits a predetermined signal sent from the outside to the head body 20. As shown in FIG. 3, the droplet ejection head 8 according to the first embodiment has two flexible substrates 31.

[0053] One end of the flexible substrate 31 is electrically connected to the piezoelectric actuator substrate of the head body 20. The other end of the flexible substrate 31 is pulled upward through the slit portion 23b of the reservoir 23 and is electrically connected to the wiring substrate 32. This allows the piezoelectric actuator substrate of the head body 20 to be electrically connected to the outside. Details of the flexible substrate 31 will be described later.

[0054] The wiring board 32 is located above the head body 20. The wiring board 32 distributes signals to a plurality of driver ICs 33.

[0055] The multiple driver ICs 33 are located on one main surface of the flexible substrate 31. As shown in Fig. 3, in the droplet ejection head 8 according to the first embodiment, two driver ICs 33 are provided on each flexible substrate 31. Note that the number of driver ICs 33 provided on each flexible substrate 31 is not limited to two.

[0056] The driver IC 33 drives the piezoelectric actuator substrate of the head main body 20 based on a drive signal sent from the control unit 14 (see FIG. 1).

[0057] The pressing member 34 is, for example, a leaf spring having a substantially U-shape in cross section. The pressing member 34 is located between the two flexible substrates 31 drawn out from the slit portion 23b, and presses the driver IC 33 on the flexible substrate 31 toward the heat sink 45. This brings the driver IC into close contact with the heat sink 45, so that heat generated when the driver IC 33 is driven can be efficiently dissipated to the heat sink 45. The pressing member 34 will be described in detail later.

[0058] The elastic member 35 (see FIG. 9) is provided so as to contact side wall portions 34a, 34b (see FIG. 6) of the pressing member 34. By providing such elastic member 35, it is possible to reduce the possibility that the pressing member 34 will damage the flexible substrate 31 when the pressing member 34 presses the driver IC 33.

[0059] The elastic member 35 is made of, for example, a foam double-sided tape. Also, by using, for example, a non-silicon heat conductive sheet as the elastic member 35, it is possible to improve the heat dissipation of the driver IC 33. It is not necessary to provide the elastic member 35.

[0060] The head cover 40 is attached to the head body 20, and is disposed so as to cover the wiring portion 30 located on the head body 20, such as the flexible substrate 31 drawn out from the slit portion 23b, the wiring substrate 32, the pressing member 34, etc. This enables the head cover 40 to seal the wiring portion 30. The head cover 40 is made of, for example, resin or metal.

[0061] The head cover 40 has a box shape that is elongated in the main scanning direction, and has a first opening 40a and a second opening 40b on two side surfaces that face each other in the sub-scanning direction. The head cover 40 also has a third opening 40c on the bottom surface and a fourth opening 40d on the top surface.

[0062] The two heat sinks 45 are attached to the head cover 40. One of the two heat sinks 45 is disposed so as to cover the first opening 40a, and the other is disposed so as to cover the second opening 40b.

[0063] The heat sink 45 is, for example, a plate-like member that is long in the main scanning direction and is made of a metal or alloy with high heat dissipation properties. The heat sink 45 is provided in contact with the driver IC 33 and dissipates heat generated by the driver IC 33.

[0064] Each of the two heat sinks 45 has a plurality of through holes 46 that accommodate fixing members 50 (see FIG. 8). The two heat sinks 45 are fixed to the head cover 40 by fixing members 50 (see FIG. 8). The head cover 40 to which the heat sinks 45 are attached has a box shape in which the first opening 40a and the second opening 40b are closed and the third opening 40c and the fourth opening 40d are open.

[0065] The third opening 40c is located so as to face the reservoir 23. The flexible substrate 31 and the pressing member 34 are inserted into the third opening 40c.

[0066] The fourth opening 40d is provided for inserting a connector (not shown) provided on the wiring board 32. If the space between the connector and the fourth opening 40d is sealed with resin or the like, it becomes difficult for liquid or dust to enter the inside of the head cover 40.

[0067] Furthermore, the head cover 40 may have a heat insulating portion (not shown) between the heat sink 45 and the head body 20. By providing the head cover 40 with a heat insulating portion, heat generated in the driver IC 33 is less likely to be transmitted to the head body 20 via the heat sink 45.

[0068] Note that FIG. 3 shows an example of the configuration of the droplet ejection head 8, and the droplet ejection head 8 may further include members other than those shown in FIG.

[0069] <Details of flexible circuit board> Next, details of the flexible substrate 31 according to the first embodiment will be described with reference to Fig. 4 and Fig. 5. Fig. 4 is a perspective view for explaining the structure of the flexible substrate 31 and the periphery of the flexible substrate 31 according to the first embodiment. Note that Fig. 4 omits illustration of various elements on the wiring substrate 32.

[0070] The flexible substrate 31 has a shape that gradually tapers into two branches as it goes upward. In other words, the flexible substrate 31 has two protruding portions 31p that protrude upward. A lower portion 31u of the flexible substrate 31 is electrically connected to the head body 20 (see FIG. 3).

[0071] A tip end of the protruding portion 31p of the flexible substrate 31 is inserted as a connector insertion portion 31t into a connector 32a provided on the wiring substrate 32. By inserting the connector insertion portion 31t into the connector 32a, the flexible substrate 31 and the wiring substrate 32 can be electrically connected to each other.

[0072] A plurality of driver ICs 33 are mounted below the plurality of connector insertion portions 31t of the flexible substrate 31. A pressing member 34 is provided on the side of the flexible substrate 31 opposite to the side on which the driver ICs 33 are mounted. The pressing member 34 presses the driver ICs 33 from the inside toward the heat sink 45 (see FIG. 3). The mounting position of the driver ICs 33 is not limited to below the connector insertion portions 31t.

[0073] The flexible substrate 31 has a through hole 31a between two adjacent driver ICs 33. The through hole 31a will be described in detail later.

[0074] Fig. 5 is a diagram for explaining the overall configuration of the flexible substrate 31 according to the first embodiment. In Fig. 5, the position of the corresponding connector 32a is indicated by a dashed line.

[0075] 5, the flexible substrate 31 has a plurality of (two in FIG. 5) protruding portions 31p protruding in the same direction. The protruding portions 31p protrude in the insertion direction T of the connector insertion portion 31t.

[0076] Since flexible substrate 31 has flexibility and protruding portion 31p has a small width, flexible substrate 31 has a shape that allows connector insertion portion 31t to be easily inserted into connector 32a.

[0077] In the first embodiment, a through hole 31a is formed between two adjacent driver ICs 33 in the flexible substrate 31. The through hole 31a is formed, for example, in the center between the two adjacent driver ICs 33 so as to block the gap between the driver ICs 33. The through hole 31a is provided to allow a fixing member 50 (FIG. 8) that fixes the pressing member 34 and the heat sink 45 to pass through. This will be described later.

[0078] This makes it possible to extend the heat transfer path from one driver IC 33 to the other driver IC 33 on the flexible substrate 31. Therefore, according to the first embodiment, it is possible to reduce thermal interference between adjacent driver ICs 33.

[0079] Moreover, in the first embodiment, through hole 31a is closed within the plane of flexible substrate 31. In other words, the end of through hole 31a does not reach any side constituting flexible substrate 31. This makes it possible to increase the yield of flexible substrate 31 compared to a case in which flexible substrate 31 has slits 31s (see FIG. 10) as in a modified example described later.

[0080] In the first embodiment, the through hole 31a has a width W1 in a direction (up-down direction) perpendicular to the longitudinal direction of the head body 20, which is larger than a width W2 in the longitudinal direction (left-right direction). This allows play to be provided in the direction perpendicular to the longitudinal direction, making it easy to respond to deformation of the flexible substrate 31.

[0081] A gripping portion 31g protruding in the width direction of the protruding portion 31p may be provided on a side portion of the protruding portion 31p adjacent to the connector insertion portion 31t. In the example of Fig. 5, two gripping portions 31g are provided on one side portion.

[0082] In the first embodiment, by inserting the connector inserting portion 31t into the connector 32a while gripping the gripping portion 31g, the connector inserting portion 31t can be inserted into the connector 32a more easily.

[0083] <Details of pressing member> Next, details of the pressing member 34 according to the first embodiment will be described with reference to Fig. 6. Fig. 6 is a perspective view for explaining the structure of the pressing member 34 according to the first embodiment.

[0084] The pressing member 34 includes two side walls 34a, 34b and a bottom surface 34c. The side walls 34a, 34b are provided to face the flexible substrate 31 drawn out from the slit 31s. The two side walls 34a, 34b each have a through hole 36. A fixing member 50 (see FIG. 8) that fixes the pressing member 34 and the heat sink 45 is inserted into the through hole 36. The bottom surface 34c connects the lower ends of the two side walls 34a, 34b. The bottom surface 34c has through holes 37 at both ends in the longitudinal direction of the head body 20. A flow path member (not shown) is connected to the through hole 37.

[0085] Incidentally, in the droplet ejection head 8, the central portion in the longitudinal direction of the head body 20 has a structure that is weaker against external and internal pressure compared to both ends, for reasons such as the fact that there are fewer parts for fastening multiple members together.

[0086] Therefore, the heat sink 45 and the pressing member 34 of the droplet ejection head 8 according to the first embodiment are fixed to the center of the head main body 20 in the longitudinal direction.

[0087] Hereinafter, the details of the fixing points between the heat sink 45 and the pressing member 34 will be described with reference to Figs. 7 to 9. Figs. 7 and 8 are schematic front views showing an example of the configuration of the droplet discharge head 8. Fig. 9 is a schematic side view showing an example of the configuration of the droplet discharge head 8. Note that in Fig. 7, the illustration of the heat sink 45 and the fixing member 50 is omitted for ease of understanding. Fig. 9 also shows a side view of the droplet discharge head 8 near the center in the longitudinal direction.

[0088] In the first embodiment, both longitudinal ends of the droplet ejection head 8 (head body 20) refer to portions that are between 0% and 20% from both ends of the droplet ejection head 8 (head body 20), and the central portion of the droplet ejection head 8 (head body 20) refers to portions other than both ends of the droplet ejection head 8 (head body 20).

[0089] In the first embodiment, the heat sink 45 and the pressing member 34 are fixed at the center in the longitudinal direction of the head main body 20. This can improve the sealing performance inside the droplet ejection head 8. Specifically, the heat sink 45 and the head cover 40 are fixed at the center and both ends in the longitudinal direction by the fixing member 50. This can reduce floating of the head cover 40 and can further improve the sealing performance inside the droplet ejection head 8.

[0090] The fixing member 50 has a head. As the fixing member 50, for example, a screw, a bolt or the like may be used.

[0091] In the first embodiment, the heat sink 45 and the pressing member 34 are fixed to each other via the through hole 31a of the flexible substrate 31, as shown in FIG.

[0092] This allows the flexible board 31 to be fixed together with the heat sink 45 and the pressing member .

[0093] In the first embodiment, the heat sink 45 and the pressing member 34 are fixed by a fixing member 50 between two adjacent driver ICs 33. This allows heat to be dissipated to the heat sink 45 via the fixing member 50, and reduces thermal interference between the two adjacent driver ICs 33.

[0094] In the first embodiment, the heat sink 45 has a plurality of recesses 47 that accommodate the heads of the fixing members 50. This allows the amount of protrusion of the fixing members 50 to be reduced compared to when the recesses 47 are not provided, and allows the droplet ejection head 8 to be made smaller in size in the short side direction.

[0095] <Modification 1 of the First Embodiment> Modifications of the flexible substrate 31 according to the first embodiment will be described with reference to Fig. 10. Fig. 10 is a diagram showing the configuration of a flexible substrate 31 according to Modification 1 of the first embodiment. Note that in the following modifications, the same parts as those in the first embodiment are designated by the same reference symbols, and duplicated descriptions will be omitted.

[0096] As shown in Fig. 10, in the flexible substrate 31 according to the first modification of the first embodiment, a slit 31s is formed between two adjacent driver ICs 33. The slit 31s is formed to extend from the same side of the flexible substrate 31 as the side from which the protruding portion 31p protrudes (the upper side in Fig. 10) in the opposite direction to the protruding direction of the protruding portion 31p (downward in Fig. 10). One end of the slit 31s is connected to the through hole 31a.

[0097] As a result, when the connector insertion portion 31t is inserted into the connector 32a, not only the protrusion 31p but also the vicinity of the slit 31s can be easily deformed. Therefore, the flexible substrate 31 according to the first embodiment has a shape that allows the connector insertion portion 31t to be easily inserted into the connector 32a. Therefore, compared to a case where there is no slit 31s, the flexible substrate 31 can be easily moved freely, improving workability.

[0098] In the first modification of the first embodiment, the slit 31s may be formed in the center between the adjacent protrusions 31p. If the slit 31s is formed at an offset position between the adjacent protrusions 31p, the protrusions 31p closer to the slit 31s can easily deform to the vicinity of the slit 31s, while the protrusions 31p farther from the slit 31s cannot easily deform to the vicinity of the slit 31s.

[0099] However, in the first modification of the first embodiment, the slit 31s is formed in the center between the adjacent protrusions 31p, so that both protrusions 31p can be evenly deformed up to the vicinity of the slit 31s. Therefore, according to the first modification of the first embodiment, it is possible to easily insert each connector insertion portion 31t evenly.

[0100] <Modification 2 of the First Embodiment> Next, a modified example of the droplet ejection head 8 according to the first embodiment will be described with reference to Fig. 11 and Fig. 12. Fig. 11 and Fig. 12 are schematic front views showing a configuration example of the droplet ejection head 8 according to Modification 2 of the first embodiment. Note that in Fig. 11, illustration of the heat sink 45 and the fixing member 50 is omitted for ease of understanding.

[0101] The heat sink 45 and the pressing member 34 may be fixed at a plurality of points in the center in the longitudinal direction. For example, as shown in Fig. 11 and Fig. 12, the flexible substrate 31 may have three driver ICs 33. One of the three driver ICs 33 is located in the center in the longitudinal direction of the head body 20. In such a case, the pressing member 34 may have two through holes 36 in the center in the longitudinal direction.

[0102] The two through holes 36 are provided at positions sandwiching the driver IC 33 located at the center in the longitudinal direction of the head body 20 in a side view (FIG. 11) of the flexible substrate 31 seen from the short side direction of the head body 20. In other words, each through hole 36 is located between two adjacent driver ICs 33.

[0103] The heat sink 45 has two through holes 46 in the center in the longitudinal direction. The fixing member 50 fixes the pressing member 34 and the heat sink 45 via the through holes 31a. In this manner, the heat sink 45 and the pressing member 34 may be fixed at multiple points in the center in the longitudinal direction. This can further improve the sealing performance of the droplet discharge head 8.

[0104] 11, the above-described modified example 2 may be applied even when, for example, two driver ICs 33 are mounted on the flexible substrate 31. When two driver ICs 33 are mounted, a plurality of through holes 31a may be provided between two adjacent driver ICs 33, so that the pressing member 34 and the heat sink 45 can be fixed via the through holes 31a. Furthermore, the above-described modified example 2 may be applied even when the number of driver ICs 33 is four or more, without being limited to the example of FIG. 11.

[0105] Second embodiment Next, the droplet discharge head 8a according to the second embodiment will be described with reference to FIGS. 13 to 16. FIG. 13 is an exploded perspective view showing a schematic configuration of the droplet discharge head 8a according to the second embodiment. FIG. 14 is a schematic perspective view showing the configurations of the wiring board 32, the first support member 61, and the second support member 62 according to the second embodiment. FIG. 15 is a schematic perspective view showing the configuration of the pressing member 63 according to the second embodiment. FIG. 16 is a cross-sectional view taken along the line XV-XV in FIG. 13. In other words, FIG. 16 is a cross-sectional view of one end of the head main body 20 in the longitudinal direction. Note that, in order to facilitate understanding, the support member 60 is omitted in FIG. 13. Also, in the following second embodiment, the same parts as those in the first embodiment are denoted by the same symbols, and overlapping descriptions are omitted.

[0106] A droplet ejection head 8a shown in FIG. 13 differs from the droplet ejection head 8 according to the first embodiment shown in FIG. 3 mainly in the configurations of the head main body 20 and the wiring section 30.

[0107] The droplet ejection head 8a according to the second embodiment includes a head body 20a, a wiring section 30a, a head cover 40, and two heat sinks 45, similar to the droplet ejection head 8 according to the first embodiment shown in FIG.

[0108] The head body 20a includes a flow path member 21, a piezoelectric actuator substrate (not shown), a branch flow path member 51, and a reservoir 52.

[0109] The branch flow path member 51, which is a connecting flow path member, is located on the flow path member 21. The branch flow path member 51 has therein a branch flow path (not shown) which is a connecting flow path connected to the flow path of the flow path member 21. The branch flow path member 51 is made of a highly rigid material such as stainless steel.

[0110] The branch flow path member 51 may be a member having a box shape extending long in the main scanning direction (Y-axis direction) and having an open upper surface. By making the branch flow path member 51 box-shaped, the rigidity of the branch flow path member 51 can be increased compared to when the branch flow path member 51 is in a flat plate shape. This can reduce the amount of deflection of the nozzle surface of the flow path member 21 joined to the branch flow path member 51.

[0111] The reservoir 52 is located on the branch flow path member 51. The reservoir 52 has openings 52a at both ends in the main scanning direction (Y-axis direction). The reservoir 52 has an internal flow path, and liquid is supplied from the outside via the openings 52a. The reservoir 52 supplies liquid to the branch flow path member 51. The reservoir 52 also stores the liquid supplied to the branch flow path member 51.

[0112] The wiring section 30a includes a flexible substrate 31, a wiring substrate 32, a plurality of supporting members 60, a plurality of driver ICs 33, a pressing member 63, and an elastic member 35 (see FIG. 9).

[0113] 14, the multiple support members 60 support the wiring board 32. Specifically, the multiple support members 60 include a first support member 61 and a second support member 62.

[0114] The first support member 61 is located at one end of the wiring board 32 in the longitudinal direction of the head main body 20a. Specifically, the first support member 61 has a base 61b, a support portion 61a extending vertically from one longitudinal end of the base 61b, and a fixing portion 61c extending vertically from the other longitudinal end of the base 61b. The wiring board 32 is located so that its bottom surface is located on the base 61b and one main surface is in contact with the support portion 61a.

[0115] A through hole 61d is formed in the support portion 61a. The wiring board 32 has a through hole 32b penetrating both main surfaces at a position corresponding to the through hole 61d. Fixing members (not shown) such as bolts or screws are inserted into the through holes 61d and 32b and screwed together to fix the wiring board 32 and the first support member 61. A through hole 61e is formed in the base portion 61b. Details of the fixing portion 61c will be described later.

[0116] The second support member 62 is located at the other end of the wiring board 32 in the longitudinal direction of the head main body 20a. Specifically, the second support member 62 has a base 62b, a support portion 62a extending vertically from one longitudinal end of the base 62b, and a fixing portion 62c extending vertically from the other longitudinal end of the base 62b. The wiring board 32 is located so that its bottom surface is located on the base 62b and one main surface is in contact with the support portion 62a.

[0117] A through hole 62d is formed in the support portion 62a. The wiring board 32 has a through hole 32b penetrating both main surfaces at a position corresponding to the through hole 61d. Fixing members (not shown) such as bolts or screws are inserted into the through holes 61d and 32b and screwed together to fix the wiring board 32 and the second support member 62. A through hole 62e is formed in the base portion 62b. Details of the fixing portion 62c will be described later.

[0118] As shown in FIG. 15, the pressing member 63 includes two side walls 63a and 63b, a bottom portion 63c, and two fixing portions 63d.

[0119] The two side walls 63a, 63b have a through hole 64 in the center in the longitudinal direction. The fixing member 50 (see FIG. 8) that fixes the pressing member 63 and the heat sink 45 is inserted into the through hole 64.

[0120] The bottom 63c connects the lower ends of the two side wall portions 63a and 63b. The bottom 63c has a plurality of through holes 65 at both ends in the longitudinal direction of the head body 20. The reservoir 52 has a through hole (not shown) at a position corresponding to the through hole 65. The branch flow path member 51 has a screw hole (not shown) at a position corresponding to the through hole 65. A fixing member (not shown) such as a bolt or a screw is inserted through the through hole 65 of the bottom 63c of the pressing member 63 and the through hole of the reservoir 52. The fixing member (not shown) is screwed into the screw hole of the branch flow path member 51. As a result, the pressing member 63 is fixed to the branch flow path member 51, which is a highly rigid material, via the reservoir 52.

[0121] Further, the bottom 63c has a through hole 66a formed at a position corresponding to the through hole 61e (see FIG. 14) in the base 61b of the first support member 61. A fixing member (not shown) such as a bolt or a screw is inserted through the through hole 66a and the through hole 61e. The fixing member (not shown) is screwed into a thread groove formed in the through hole 61e, for example. This fixes the first support member 61 to the pressing member 63. Similarly, the bottom 63c has a through hole 66b formed at a position corresponding to the through hole 62e in the base 62b of the second support member 62. A fixing member (not shown) such as a bolt or a screw is inserted through the through hole 66b and the through hole 62e. The fixing member (not shown) is screwed into a thread groove formed in the through hole 62e, for example. This fixes the second support member 62 to the pressing member 63. In this manner, the first support member 61 is fixed to the pressing member 63, and thereby fixed to the branch flow path member 51 made of a highly rigid material via the pressing member 63 and the reservoir 52.

[0122] The two fixing portions 63d are provided at both ends of one of the two side wall portions 63a, 63b (here, the side wall portion 63b). In other words, the two fixing portions 63d are provided at both ends of the pressing member 63 in the longitudinal direction of the head main body 20. The fixing portions 63d will be described in detail later.

[0123] As described above, the pressing member 63 and the multiple support members 60 according to the second embodiment are fixed to the branch flow path member 51 made of a highly rigid material. The heat sink 45 according to the second embodiment is fixed to the pressing member 63 and the multiple support members 60 at both longitudinal ends of the head body 20. In the droplet ejection head 8a having such a configuration, the head cover 40 is unlikely to fall over even when an external force is applied to the heat sink 45.

[0124] Hereinafter, details of the fixing points between the head cover 40, the pressing member 63, and the multiple support members 60 will be described with reference to Fig. 16. Fig. 16 shows the configuration of the fixing point at one end in the longitudinal direction of the droplet ejection head 8a, and omits the configuration of the fixing point at the other end, but the fixing point at the other end has the same configuration as the fixing point at one end.

[0125] First, a fixing location on one end side in the width direction of the droplet discharge head 8a, specifically on the negative side of the X-axis, will be described. A through hole 63e is formed in the fixing portion 63d of the pressing member 63. The head cover 40 has a through hole 41 located at a position corresponding to the through hole 63e. One of the two heat sinks 45 has a through hole 46 located at a position corresponding to the through hole 63e. The fixing member 80 is inserted through the through holes 63e, 41, and 46, and is screwed to fix the pressing member 63, the head cover 40, and the heat sink 45 at one end of the head body 20 in the longitudinal direction.

[0126] Next, the fixing location on the other end side in the width direction of the droplet discharge head 8a, specifically the X-axis positive side, will be described. A through hole 61f is formed in the fixing portion 61c of the first support member 61. The head cover 40 has a through hole 41 located at a position corresponding to the through hole 61f. The other of the two heat sinks 45 has a through hole 46 located at a position corresponding to the through hole 61f. A fixing member 80 is inserted through the through holes 61f, 41, and 46 and screwed together, whereby the first support member 61, the head cover 40, and the heat sink 45 are fixed at one end of the head body 20 in the longitudinal direction.

[0127] Similarly, at the other end of the head body 20 in the longitudinal direction, the pressing member 63 or the second support member 62, the head cover 40, and the heat sink 45 are fixed by a fixing member. In this way, the heat sink 45 and the head cover 40 according to the second embodiment are fixed to members (here, the pressing member 63, the first support member 61, and the second support member 62) directly or indirectly fixed to the branch flow path member 51 at both ends of the head body 20 in the longitudinal direction. This makes it possible to make the head cover 40 less likely to fall over even when an external force is applied to the droplet discharge head 8a. If the head cover 40 falls over, there is a risk that the resin seal between the head cover 40 and the reservoir 52 will come off. In contrast, according to the droplet discharge head 8 according to the second embodiment, the head cover 40 is less likely to fall over, and therefore the seal is less likely to be broken.

[0128] In the droplet ejection head 8a according to the second embodiment, similarly to the droplet ejection head 8 according to the first embodiment, the heat sink 45 and the pressing member 63 may be fixed at the center in the longitudinal direction of the head body 20. This can improve the sealing performance inside the droplet ejection head 8a.

[0129] The droplet ejection head 8a according to the second embodiment may further include two plate members 70 that join the heat sink 45 and the head body 20 together.

[0130] The plate member 70 is made of resin and joins the heat sink 45 and the head body 20. The plate member 70 is a member that extends long in the main scanning direction (Y-axis direction). The width of the plate member 70 in the longitudinal direction is approximately the same as the width of the heat sink 45 in the longitudinal direction. The thermal conductivity of the plate member 70 may be lower than the thermal conductivity of the heat sink 45. By providing the plate member 70, heat generated in the driver IC 33 is less likely to be transmitted to the head body 20 via the heat sink 45.

[0131] The plate member 70, the heat sink 45 and the head body 20 may be bonded together with a double-sided tape or adhesive.

[0132] As described above, the droplet discharge head 8a according to the second embodiment is fixed at both longitudinal ends of the head body 20 to a member directly or indirectly fixed to the branch flow path member 51 and the heat sink 45. This can increase the rigidity of the droplet discharge head 8a.

[0133] Here, an example has been described in which the members fixed to the heat sink 45 at both ends of the head body 20 in the longitudinal direction are the pressing member 63 and the supporting member 60. However, such members need only be members fixed directly or indirectly to at least the branch flow path member 51, and are not necessarily required to be the pressing member 63 and the supporting member 60. For example, the member fixed to the heat sink 45 at both ends of the head body 20 in the longitudinal direction may be only the pressing member 63. In this case, the fixing portion 63d may be provided on both of the two side wall portions 63a, 63b (see FIG. 15) of the pressing member 63. Also, the member fixed to the heat sink 45 at both ends of the head body 20 in the longitudinal direction may be only the supporting member 60, or may be another member.

[0134] <Modification of the second embodiment> A modified example of the droplet ejection head 8a according to the second embodiment will be described with reference to Fig. 17. Fig. 17 is a schematic cross-sectional view showing the configuration of one end of the droplet ejection head 8a according to the modified example of the second embodiment. Note that in the following modified example, the same parts as those in the second embodiment are designated by the same reference symbols, and duplicated explanations will be omitted.

[0135] The fixing member for fixing the heat sink 45 to the pressing member 63 and the fixing member for fixing the heat sink 45 to the supporting member 60 may be fastened to the same member.

[0136] Specifically, as shown in FIG. 17, the first support member 61 may have a tubular portion 67 having a screw groove formed on its inner circumferential surface. The tubular portion 67 is, for example, cylindrical. For example, the tubular portion 67 may be inserted into a notch 61g provided in the support portion 61a of the first support member 61. The tubular portion 67 may be formed integrally with the first support member 61. A first male screw 90 is inserted into one of the through holes 46 of the two heat sinks 45, the through hole 41 of the head cover 40, and the through hole 63e of the fixing portion 63d of the pressing member 63. The first male screw 90 is screwed into the tubular portion 67. As a result, one of the two heat sinks 45, the head cover 40, and the pressing member 63 are fixed at one end of the head body 20 in the longitudinal direction.

[0137] Similarly, a second male screw 91 is inserted through the through hole 46 of the other of the two heat sinks 45, the through hole 41 of the head cover 40, and the through hole 61e of the fixing portion 61c of the first support member 61. The second male screw 91 is screwed into the cylindrical portion 67, whereby the other of the two heat sinks 45, the head cover 40, and the first support member 61 are fixed at one end of the head body 20 in the longitudinal direction.

[0138] Similarly, at the other longitudinal end of the head body 20, the second support member 62 may have a cylindrical portion (not shown) with a threaded groove formed on its inner surface, and a first male screw (not shown) for fixing one of the two heat sink plates 45 and the pressing member 63, and a second male screw (not shown) for fixing the other of the two heat sink plates 45 and the second support member 62 may be fastened to the same cylindrical portion.

[0139] In this manner, in the droplet ejection head 8a according to the second embodiment, the first male screw 90 and the second male screw 91 are fastened to the same cylindrical portion 67, so that the rigidity of the droplet ejection head 8a can be further increased.

[0140] In one embodiment, (1) a droplet ejection head (for example, a droplet ejection head 8) has a head body (for example, a head body 20), a driver IC (for example, a driver IC 33), a flexible substrate (for example, a flexible substrate 31), a heat sink (for example, a heat sink 45), and a pressing member (for example, a pressing member 34). The head body has a plurality of ejection holes from which droplets are ejected. The driver IC controls the driving of the head body. The flexible substrate has a driver IC mounted thereon and is electrically connected to the head body. The heat sink dissipates heat generated by the driver IC. The pressing member presses the driver IC against the heat sink. The heat sink and the pressing member are fixed at the center of the head body in the longitudinal direction.

[0141] (2) The droplet ejection head described in (1) above may further include a head cover (head cover 40 as one example) attached to the head body, and the heat sink and the head cover may be fixed at both ends in the longitudinal direction.

[0142] (3) In the droplet ejection head described in (1) or (2) above, the flexible substrate may have a plurality of driver ICs mounted thereon, and the heat sink and the pressing member may be fixed between two adjacent driver ICs.

[0143] (4) In the droplet ejection head described in any one of (1) to (3) above, the flexible substrate may have a through hole (for example, through hole 31a), and the heat sink and the pressing member may be fixed via the through hole.

[0144] (5) In the droplet ejection head described in (4) above, the flexible substrate may have a slit (for example, slit 31s) whose one end is connected to the through hole.

[0145] (6) In the droplet ejection head described in (4) above, the through-hole may be closed within the plane of the flexible substrate.

[0146] (7) In the droplet ejection head according to any one of (4) to (6) above, the through-hole may have a width in a direction perpendicular to the longitudinal direction that is larger than the width in the longitudinal direction.

[0147] (8) In the droplet ejection head according to any one of (4) to (7) above, the flexible substrate may have a plurality of driver ICs mounted thereon, and the through hole may be provided between adjacent driver ICs.

[0148] (9) The droplet ejection head described in any one of (1) to (8) above further has a head cover attached to the head body, and the heat sink and the head cover are fixed by a fixing member having a head (for example, fixing member 50), and the heat sink may have a recess (for example, recess 47) to accommodate the head.

[0149] (10) In the droplet ejection head according to any one of (1) to (9) above, the heat sink and the pressing member may be fixed by a fixing member having a head, and the heat sink may have a recess for accommodating the head.

[0150] (11) In the droplet ejection head described in any one of (1) to (10) above, the head body may have a flow path member having a plurality of ejection holes, and a branch flow path member (e.g., branch flow path member 51) located above the flow path member and having a branch flow path connected to the flow path member, and may have a fixing part (e.g., fixing parts 61c, 62c, 63d) fixed directly or indirectly to the branch flow path member, and the heat sink and the fixing part may be fixed at both longitudinal ends of the head body.

[0151] (12) In the droplet ejection head described in (11) above, the fixing parts may be provided at both ends of the pressing member in the longitudinal direction of the head body.

[0152] (13) The droplet ejection head described in (11) above has a wiring board (for example, wiring board 32) electrically connected to the flexible substrate, and a plurality of support members (for example, support member 60) that support the wiring board, the plurality of support members including a first support member (for example, first support member 61) that supports one end of the wiring board in the longitudinal direction of the head body, and a second support member (for example, second support member 62) that supports the other end of the wiring board in the longitudinal direction of the head body, and the fixing portion may be provided on the first support member and the second support member.

[0153] (14) The droplet ejection head described in (13) above has two heat sinks located at both ends in the width direction of the head body, at least two first male screws (for example, first male screw 90) inserted into one of the two heat sinks, and at least two second male screws (for example, second male screw 91) inserted into the other of the two heat sinks, and the first support member and the second support member have a cylindrical portion (for example, cylindrical portion 67) that is open at both ends in the width direction of the head body and has a threaded groove formed on its inner surface, and the first male screw and the second male screw may be fastened to the same cylindrical portion.

[0154] (15) The droplet ejection head according to any one of (11) to (14) above may further include a resin plate member (eg, plate member 70) that bonds the heat sink and the head body.

[0155] (16) A droplet ejection head includes a head body having a flow path member having a plurality of ejection holes through which droplets are ejected, and a branch flow path member located above the flow path member and having branch flow paths connected to the flow path member, a driver IC for controlling the driving of the head body, a flexible substrate on which the driver IC is mounted and which is electrically connected to the head body, a heat sink for dissipating heat generated by the driver IC, and a fixed portion fixed directly or indirectly to the branch flow path member, and the heat sink and the fixed portion may be fixed at both longitudinal ends of the head body.

[0156] (17) The droplet ejection head according to (16) above may have a pressing member that presses the driver IC against the heat sink, and the fixing portions may be provided at both ends of the pressing member in the longitudinal direction of the head body.

[0157] (18) The droplet ejection head described in (16) above has a wiring board electrically connected to the flexible substrate, and a plurality of support members supporting the wiring board, the plurality of support members including a first support member supporting one end of the wiring board in the longitudinal direction of the head body, and a second support member supporting the other end of the wiring board in the longitudinal direction of the head body, and the fixing portion may be provided on the first support member and the second support member.

[0158] (19) The droplet ejection head described in (18) above has two heat sinks located at both ends in the width direction of the head body, at least two first male screws inserted into one of the two heat sinks, and at least two second male screws inserted into the other of the two heat sinks, and the first support member and the second support member have a cylindrical portion with both ends in the width direction of the head body that are open and with a threaded groove formed on the inner surface, and the first male screw and the second male screw may be fastened to the same cylindrical portion.

[0159] (20) The droplet ejection head according to any one of (16) to (19) above may further include a resin plate member that bonds the heat sink and the head body.

[0160] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. Indeed, the above-described embodiments may be embodied in various forms. In addition, the above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0161] 1. Printer 2 Feed roller 3 Guide roller 4 Coating machine 5 Head Case 6 Transport roller 7 Frame 8 Droplet ejection head 14 Control section 20 Head body 21 Flow path components 30 Wiring section 31 Flexible PCB 31a Through hole 32 Wiring board 32a Connector 33 Driver IC 34 Pressing member 40 Head Cover 45 Heat sink 46 Through hole 47 Recess 50 Fixing member

Claims

1. A head body having a plurality of ejection holes through which droplets are ejected; A driver IC for controlling the driving of the head body; a flexible substrate on which the driver IC is mounted and which is electrically connected to the head body; a heat sink for dissipating heat generated by the driver IC; a pressing member for pressing the driver IC against the heat sink; having The heat sink and the pressing member are fixed to a center portion of the head body in a longitudinal direction of the head body.

2. A head cover attached to the head body and The droplet ejection head according to claim 1 , wherein the heat sink and the head cover are fixed to each other at both ends in the longitudinal direction.

3. the flexible substrate is provided with a plurality of the driver ICs; The droplet ejection head according to claim 1 , wherein the heat sink and the pressing member are fixed between two adjacent ones of the driver ICs.

4. The flexible substrate has a through hole, The droplet ejection head according to claim 1 , wherein the heat sink and the pressing member are fixed to each other via the through hole.

5. The droplet ejection head according to claim 4 , wherein the flexible substrate has a slit, one end of which is connected to the through hole.

6. The droplet ejection head according to claim 4 , wherein the through-hole is closed within a plane of the flexible substrate.

7. The droplet ejection head according to claim 4 , wherein the through-hole has a width in a direction perpendicular to the longitudinal direction that is larger than the width in the longitudinal direction.

8. the flexible substrate is provided with a plurality of the driver ICs; The droplet ejection head according to claim 4 , wherein the through hole is provided between adjacent ones of the driver ICs.

9. A head cover attached to the head body and the heat sink and the head cover are fixed to each other by a fixing member having a head portion, The droplet ejection head according to claim 1 , wherein the heat sink has a recess for accommodating the head portion.

10. the heat sink and the pressing member are fixed by a fixing member having a head, The droplet ejection head according to claim 1 , wherein the heat sink has a recess for accommodating the head portion.

11. The head body includes: a flow path member having a plurality of the discharge holes; a branch flow path member located above the flow path member and having a branch flow path connected to the flow path member; having A fixing portion is fixed directly or indirectly to the branch flow path member, The droplet ejection head according to claim 1 , wherein the heat sink and the fixed portion are fixed to both ends of the head body in the longitudinal direction.

12. The droplet ejection head according to claim 11 , wherein the fixing portions are provided at both ends of the pressing member in the longitudinal direction of the head main body.

13. a wiring board electrically connected to the flexible board; A plurality of support members for supporting the wiring board; having The plurality of support members include a first support member that supports one end of the wiring board in a longitudinal direction of the head body; a second support member that supports the other end of the wiring board in the longitudinal direction of the head main body; Including, The droplet ejection head according to claim 11 , wherein the fixing portion is provided on the first support member and the second support member.

14. Two heat sinks are located at both ends of the head body in the width direction; At least two first male screws that are inserted into one of the two heat sinks; At least two second male screws are inserted into the other of the two heat sinks; having the first support member and the second support member each have a cylindrical portion that is open at both ends in a width direction of the head body and has a screw groove formed on an inner circumferential surface, The droplet ejection head according to claim 13 , wherein the first male screw and the second male screw are fastened to the same cylindrical portion.

15. 15. The droplet ejection head according to claim 11, further comprising a resin plate member that bonds the heat sink and the head body.

16. a head body including a flow path member having a plurality of ejection holes through which droplets are ejected, and a branch flow path member located above the flow path member and having a branch flow path connected to the flow path member; A driver IC for controlling the driving of the head body; a flexible substrate on which the driver IC is mounted and which is electrically connected to the head body; a heat sink for dissipating heat generated by the driver IC; a fixing portion fixed directly or indirectly to the branch flow path member; having The heat sink and the fixed portion are fixed to both ends of the head body in the longitudinal direction.

17. A pressing member for pressing the driver IC against the heat sink having The droplet ejection head according to claim 16 , wherein the fixing portions are provided at both ends of the pressing member in the longitudinal direction of the head main body.

18. a wiring board electrically connected to the flexible board; A plurality of support members for supporting the wiring board; having The plurality of support members include a first support member that supports one end of the wiring board in a longitudinal direction of the head body; a second support member that supports the other end of the wiring board in the longitudinal direction of the head main body; Including, The droplet ejection head according to claim 16 , wherein the fixing portion is provided on the first support member and the second support member.

19. Two heat sinks are located at both ends of the head body in the width direction; At least two first male screws that are inserted into one of the two heat sinks; At least two second male screws are inserted into the other of the two heat sinks; having the first support member and the second support member each have a cylindrical portion that is open at both ends in a width direction of the head body and has a screw groove formed on an inner circumferential surface, The droplet ejection head according to claim 18 , wherein the first male screw and the second male screw are fastened to the same cylindrical portion.

20. 20. The droplet ejection head according to claim 16, further comprising a resin plate member that bonds the heat sink and the head body.

Images