Manufacturing method for chuck table and chuck table

Abstract

To provide a chuck table configured so that when a height gauge is contacted with a holding surface of the chuck table, the heigh gauge can be suppressed from jumping up, so as to stabilize a measured value.SOLUTION: A manufacturing method for a chuck table which holds a tabular object comprises: a table body preparing step of preparing a columnar table body formed in a porous shape containing metal and a semiconductor or oxides thereof, as primary components; a step-forming step of forming steps on the whole circumference of an outer peripheral edge of one bottom surface of the table body, by processing the outer peripheral edge; a sealing step of sealing at least portions of a side surface of the table body and of the other bottom surface thereof with seal materials; and a fixing step of fixing, to the steps, annular members formed in a non-porous shape containing the metal and the semiconductor included in the table body or metal or a semiconductor constituting the oxide, as primary components.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a chuck table and a chuck table. [Background technology]

[0002] A plate-like object such as a wafer is held on a chuck table when being processed or analyzed. A known chuck table is described in, for example, Patent Document 1. Patent Document 1 describes a processing device (grinding device) equipped with a chuck table that holds a plate-like wafer (workpiece).

[0003] The chuck table includes a porous plate (porous material) with an adsorption surface (holding surface) for adsorbing a wafer, and a frame to which the porous material is fixed except for the adsorption surface. The frame is provided with a plurality of wafer suction holes that transmit a suction force (negative pressure) to the adsorption surface of the porous plate. By connecting a suction source to the wafer suction holes, the negative pressure generated from the suction source acts on the adsorption surface of the porous plate through the wafer suction holes, and the wafer placed on the adsorption surface of the chuck table is sucked to the adsorption surface and held thereon.

[0004] The grinding unit of the grinding device has a wheel mount fixed to the tip of a spindle that serves as a rotation axis, and a grinding wheel equipped with a grinding stone for grinding a plate-like object is attached to the wheel mount. The plate-like object is ground by rotating the chuck table that holds the plate-like object and by bringing the lower surface (grinding surface) of the grinding stone into contact with the plate-like object while rotating the grinding wheel.

[0005] When grinding a plate-like object with a grinding device, in order to improve the flatness of the plate-like object after grinding, a self-grinding process is performed in which the surface of the chuck table is ground with a grinding wheel. As a chuck table suitable for this self-grinding process, for example, the one described in Patent Document 2 is known. In the chuck table of Patent Document 2, the entire table is made of a porous material having a hardness similar to that of the plate-like object, so that the self-grinding process can be performed with a grinding wheel that grinds the plate-like object. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent Publication No. 2022-178178 [Patent Document 2] Patent Publication No. 2021-109258 Summary of the Invention [Problem to be solved by the invention]

[0007] Incidentally, there are cases where the thickness of a plate-like object held on a chuck table is measured by a height gauge. For example, in a grinding device, in order to measure the thickness of a plate-like object during grinding, a first height gauge is brought into contact with the holding surface (upper surface) of the rotating chuck table, and the height of the holding surface of the chuck table is measured by the first height gauge. Also, a second height gauge is brought into contact with the surface (upper surface) of the plate-like object, and the height of the plate-like object is measured by the second height gauge. Then, the thickness of the plate-like object during grinding is calculated by subtracting the measurement value of the first height gauge from the measurement value of the second height gauge.

[0008] However, since the surface of the porous material that constitutes the holding surface of the chuck table has an uneven structure, when a height gauge is brought into contact with the rotating chuck table, the unevenness of the surface of the porous material causes the height gauge to jump up, resulting in an unstable measurement value of the height gauge.

[0009] Therefore, an object of the present invention is to provide a chuck table that can suppress the jumping of a height gauge when the height gauge is brought into contact with the holding surface of the chuck table, and stabilize the measurement value. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a method for manufacturing a chuck table for holding a plate-like object, comprising the steps of: The present invention provides a method for manufacturing a chuck table, comprising: a table body preparation step of preparing a cylindrical table body that is porous and primarily composed of a metal, a semiconductor or an oxide of these; a step formation step of processing the outer peripheral edge of one of the bottom surfaces of the table body to form a step around the entire circumference of the outer peripheral edge; a sealing step of sealing at least a portion of the side surface and the other bottom surface of the table body with a sealing material; and a fixing step of fixing to the step an annular member that is non-porous and primarily composed of the metal, semiconductor or metal or semiconductor that constitutes the oxide contained in the porous material.

[0011] Preferably, the method further comprises a hole forming step of forming a hole in the table body into which a fastener for fixing the chuck table is inserted.

[0012] Preferably, after the fixing step, the method further includes a holding surface forming step of processing the one bottom surface of the table body and the one bottom surface side surface of the annular member to align the one bottom surface of the table body with the surface of the annular member to form a holding surface for holding the substrate.

[0013] Preferably, the main component of the table body and the main component of the annular member are made of the same material.

[0014] Preferably, the semiconductor is silicon and the metal is aluminum.

[0015] Preferably, the sealant is a glass fusing agent.

[0016] According to another aspect of the present invention, there is provided a chuck table for holding a plate-shaped object, comprising a table body that is porous and columnar and primarily composed of a metal, a semiconductor or an oxide of these, with a step provided around the entire outer edge of one of the bottom surfaces, an annular member fixed to the step, and a sealing material layer provided on at least a portion of the side surface and the bottom surface of the other of the table body, wherein the annular member is non-porous and primarily composed of the metal or semiconductor that constitutes the metal, semiconductor or oxide contained in the table body.

[0017] Preferably, the main component of the table body and the main component of the annular member are made of the same material.

[0018] Preferably, the semiconductor is silicon and the metal is aluminum.

[0019] Preferably, the sealing material layer contains elements that constitute a glass fusing agent. Effect of the Invention

[0020] The chuck table of the present invention comprises a cylindrical table body made porous, and an annular member made non-porous and fixed to a step provided around the entire outer periphery of one of the bottom surfaces of the table body by machining the outer periphery of the table body.

[0021] Therefore, the height of the holding surface of the chuck table can be appropriately measured by contacting the height gauge with the surface of the annular member, which suppresses the height gauge from jumping up due to contact with the chuck table and stabilizes the measured value of the height of the holding surface of the chuck table. [Brief description of the drawings]

[0022] [Figure 1] FIG. 1 is a perspective view showing a grinding device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a flow diagram showing a method for manufacturing the chuck table according to the embodiment. [Diagram 3] FIG. 3 is a perspective view of the table body of the embodiment. [Figure 4] FIG. 4 is a perspective view of the table body in which the first step is formed. [Diagram 5] FIG. 5 is a perspective view of a table body on which a first step and a second step are formed. [Figure 6] FIG. 6 is a perspective view of a table body in which a first step, a second step and a hole are formed. [Figure 7] FIG. 7 is a perspective view showing the upper surface of the table body and the sealing material layer. [Figure 8] FIG. 8 is a perspective view showing the lower surface of the table body and the sealing material layer. [Figure 9] FIG. 9 is a perspective view showing the table body and the annular member. [Figure 10] FIG. 10 is a perspective view showing the upper surface of the table body of the chuck table, etc. FIG. [Figure 11] FIG. 11 is a perspective view showing the underside of the table body of the chuck table, etc. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. First, a grinding device in which a chuck table of the present embodiment is used will be described. FIG. 1 is a perspective view showing a grinding device 2. Note that in FIG. 1, some of the elements constituting the grinding device 2 are expressed by functional blocks. Also, the X-axis (first axis), Y-axis (second axis), and Z-axis (third axis) used in the following description are perpendicular to each other.

[0024] 1, the grinding device 2 includes a base 4 that supports various elements that constitute the grinding device 2. An opening 4a that is long in a direction (front-rear direction) generally parallel to the X-axis is formed on the top surface of the base 4. A ball screw type X-axis moving mechanism 6 is disposed within the opening 4a. The X-axis moving mechanism 6 includes a motor and the like (not shown) that is connected to the ball screw, and a moving table (not shown), and moves the moving table back and forth along the X-axis.

[0025] The upper part of the moving table is covered by a table cover 8. In addition, accordion-shaped dust-proof and drip-proof covers 10 that can expand and contract in accordance with the movement of the moving table (table cover 8) are attached to the front and rear of the table cover 8. A chuck table 12 that is configured to hold a plate-like object (workpiece) 11 to be processed is disposed above the moving table in a manner that it is partially exposed from the table cover 8.

[0026] The plate-like object 11 is, for example, a wafer made of a semiconductor material such as silicon, and is configured in a disk shape having a roughly circular front surface (top surface) 11a and a roughly circular back surface (bottom surface) 11b opposite to the front surface 11a. The diameter (width of the front surface 11a or back surface 11b) of the plate-like object 11 is, for example, 200 mm or more and 300 mm or less, and the thickness is, for example, 0.7 mm or more and 1.8 mm or less.

[0027] The material, shape, diameter (width), thickness, etc. of the plate-like object 11 are not limited to this embodiment. For example, a substrate made of other semiconductors, ceramics, resin, metal, etc. may be used as the material of the plate-like object 11. In addition, a device such as an IC (Integrated Circuit) may be formed on the back surface 11b of the plate-like object 11.

[0028] The chuck table 12 is connected to a rotary drive source (not shown) such as a motor, and rotates about a rotation axis parallel to the Z axis or a rotation axis slightly tilted with respect to the Z axis. A part of the upper surface 12a of the chuck table 12 is made of a porous material, and a part of the upper surface 12a serves as a holding surface that holds the back surface 11b side of the plate-like object 11. In other words, the chuck table 12 has a holding surface on its upper part that holds the plate-like object 11.

[0029] The holding surface of the chuck table 12 is connected to a suction source (not shown) such as an ejector capable of generating negative pressure via a suction path (not shown) formed inside the chuck table 12. The back surface 11b of the plate-like object 11 carried into the chuck table 12 is sucked in by the negative pressure of the suction source acting on the holding surface. In this way, the chuck table 12 sucks in the back surface 11b of the plate-like object 11 with the holding surface, thereby holding the plate-like object 11 so that the front surface 11a of the plate-like object 11 is exposed.

[0030] When the moving table is moved back and forth along the X-axis by the above-mentioned X-axis moving mechanism 6, the chuck table 12 also moves back and forth along the X-axis. More specifically, the X-axis moving mechanism 6 moves the chuck table 12, for example, between a load-in / load-out area in front where the plate-like object 11 is loaded onto the chuck table 12 and a grinding area behind the load-in / load-out area.

[0031] A height gauge (height measuring device) 44 is provided near the chuck table 12 to measure the thickness of the plate-like object 11 held by the chuck table 12. For example, the height gauge 44 includes a first height gauge (first height measuring device) 46 that measures the height of the upper surface 12a of the chuck table 12, and a second height gauge (second height measuring device) 48 that measures the height of the upper surface of the plate-like object 11 held by the chuck table 12.

[0032] A columnar support structure 14 is provided behind the base 4 (i.e., behind the X-axis movement mechanism 6). A Z-axis movement mechanism 16 is disposed on the front side of the support structure 14. The Z-axis movement mechanism 16 includes a pair of guide rails 18 that are long in a direction (up-down direction) generally parallel to the Z axis, and a moving plate 20 is attached to the pair of guide rails 18 in a slidable manner.

[0033] A nut portion (not shown) constituting a ball screw is provided on the rear side of the moving plate 20, and a screw shaft 22 that is roughly parallel to the Z axis is rotatably connected to this nut portion. A motor 24 or the like is connected to one end of the screw shaft 22. By rotating the screw shaft 22 by the motor 24 or the like, the moving plate 20 moves up and down along the guide rail 18.

[0034] A support 26 is provided on the front surface of the moving plate 20. A grinding unit 28 capable of grinding the surface 11a of the plate-like object 11 held by the chuck table 12 is supported on this support 26. The grinding unit 28 includes a spindle housing 30 fixed to the support 26. A spindle 32 having a rotation axis parallel to the Z axis or a rotation axis slightly inclined with respect to the Z axis is accommodated in the spindle housing 30 in a manner that the spindle 32 can rotate about its axis.

[0035] The lower end of the spindle 32 is exposed from the lower end surface of the spindle housing 30, and a disk-shaped mount 34 is fixed to the lower end of the spindle 32. For example, the outer edge of the mount 34 is provided with a plurality of holes (not shown) that penetrate the mount 34 in the thickness direction, and a bolt 36 is inserted into each hole.

[0036] The grinding wheel 38 is fixed to the lower surface of the mount 34 by the above-mentioned bolts 36. That is, the grinding wheel 38 is attached to the spindle 32 via the mount 34, etc. The spindle housing 30 also contains a motor (not shown) etc. that is connected to the upper end side of the spindle 32. The grinding wheel 38 rotates together with the spindle 32 by the power of the motor etc.

[0037] An annular groove (not shown) is opened on the underside of the wheel base 40, and a plurality of grinding wheels 42, each of which has abrasive grains such as diamond dispersed in a binder such as vitrified or resinoid, are arranged in the circumferential direction of the wheel base 40 in this groove. In other words, the plurality of grinding wheels 42 are arranged on the underside of the wheel base 40. Each grinding wheel 42 is fixed to the wheel base 40 by an adhesive or the like. The size of the abrasive grains, the type of binder, and the like are appropriately set according to the quality required for the plate-like object 11 obtained by grinding, and the like.

[0038] A controller (control unit) 50 is connected to each element of the grinding device 2. This controller 50 is configured by a computer including, for example, a processing device 52 and a storage device 54, and controls the operation of each element of the grinding device 2 described above so that the plate-like object 11 is appropriately ground.

[0039] The processing device 52 is typically a CPU (Central Processing Unit) and performs various processes required to control the above-mentioned elements. The storage device 54 includes, for example, a main storage device such as a DRAM (Dynamic Random Access Memory) and an auxiliary storage device such as a hard disk drive or a flash memory. The functions of the controller 50 are realized, for example, by the processing device 52 operating in accordance with a program stored in the storage device 54.

[0040] An input device 56 is connected to the controller 50. The input device 56 is, for example, a touch screen, and is used to input commands from an operator to the controller 50. This touch screen also serves as a display device that displays information output from the controller 50. Note that a keyboard, a mouse, or the like may also be used as the input device 56.

[0041] A part of the storage device 54, which includes a non-transitory recording medium readable by a computer or the like, stores a program for causing the processing device 52 to execute a series of procedures required for grinding the plate-like object 11. The processing device 52 executes various procedures required for grinding the plate-like object 11 in accordance with this program.

[0042] Next, the chuck table of this embodiment and its manufacturing method will be described. Fig. 2 is a flow diagram showing the manufacturing method of the chuck table. As shown in Fig. 2, the manufacturing method of the chuck table of this embodiment includes a table body preparation step S1, a step forming step S2, a sealing step S3, and a fixing step S4.

[0043] In the table body preparation step S1, a columnar table body having a porous structure is prepared. FIG. 3 is a perspective view of the table body of this embodiment. As shown in FIG. 3, the table body 13 according to this embodiment is configured in a cylindrical shape having two substantially circular bottom surfaces (upper surface 13a and lower surface 13b). Here, "porous" means that the porosity is 10% or more and 70% or less. The porosity is calculated by analyzing the ratio of the table body to the porosity from an image of a specified area in an electron microscope photograph of the table body 13.

[0044] The diameter (width) a of the upper surface 13a and the lower surface 13b is, for example, 370 mm or more and 400 mm or less, typically 380 mm. The thickness b is, for example, 40 mm or more and 50 mm or less, typically 46 mm. The shape and size of the table body 13 are not limited to these. For example, the shape of the table body 13 may be a prismatic shape.

[0045] The main component of the table body 13 is a metal, a semiconductor, or an oxide thereof. For example, the metal is aluminum (Al), the semiconductor is silicon (Si), and the oxide is aluminum oxide (alumina, Al2O3) and silicon dioxide (silica, SiO2).

[0046] The porous table body 13 is obtained, for example, by mixing the above-mentioned main component particles (diameter: 50 μm or more and 1000 mm or less) with an inorganic binder (glass (silica), clay (aluminum silicate), etc.) or a resin-based binder (acrylic resin, silicone resin, etc.) in a predetermined ratio, pressurizing the mixture by press molding to form it into a predetermined shape, and then firing the mixture.

[0047] For example, when the main component of the table body 13 is Si, Si particles having a diameter of 100 μm or more and 500 μm or less are mixed with a binder such as silica in a predetermined ratio, pressurized by press molding, and sintered. For example, the sintering temperature is set to 600° C. or more and 1300° C. or less, and the sintering time is set to 12 hours or more and 40 hours or less. After sintering, the top surface 13a, bottom surface 13b, and side surface 13c of the table body 13 are ground to produce the table body 13 shown in FIG. 3. Note that the main component constituting the table body 13 and the manufacturing method and manufacturing conditions for the table body 13 are not limited to those mentioned above.

[0048] Next, a step forming step S2 is performed. In the step forming step S2, steps are formed in the table body 13. In this embodiment, a step (first step) for fixing the chuck table 12 and a step (second step) for fixing an annular member (FIG. 9) described later are formed in the table body 13.

[0049] Fig. 4 is a perspective view of the table body 13 on which the first step 15 is formed. Before the steps are formed on the table body 13, the entire surface of the table body 13 (upper surface 13a, lower surface 13b and side surface 13c) is ground. Next, as shown in Fig. 4, the first step 15 is formed by grinding around the entire outer periphery of the upper surface 13a side of the table body 13. By forming the first step 15 on the table body 13, the table body 13 is processed into a structure in which a cylinder B having a diameter d smaller than the diameter c is stacked on top of a cylinder A having a diameter c.

[0050] For example, the diameter c is 350 mm or more and 380 mm or less, and typically 366 mm. The diameter d is 305 mm or more and 320 mm or less, and typically 310 mm. The depth e of the first step 15 from the top surface 13a of the table body 13 is, for example, 15 mm or more and 30 mm or less, and typically 20 mm. The diameter c, diameter d, and depth e are not limited to the values ​​in the above-mentioned ranges.

[0051] Fig. 5 is a perspective view of the table body 13 on which the first step 15 and the second step 17 are formed. As shown in Fig. 5, after the first step 15 is formed on the table body 13, the second step 17 is formed. The second step 17 is formed by grinding the entire circumference of the outer periphery on the upper surface 13a side of the table body 13, that is, the entire circumference on the upper surface side of the cylinder B. By forming the second step 17 on the table body 13, the table body 13 is processed into a structure in which a cylinder C having a diameter f smaller than the diameter d is stacked on top of a cylinder B' having a diameter d.

[0052] For example, the diameter f is 295 mm or more and 300 mm or less, and typically 297 mm. The depth g of the second step 17 from the upper surface 13a of the table body 13 is, for example, 5 mm or more and 15 mm or less, and typically 9 mm. The diameter f and the depth g are not limited to the values ​​in the above-mentioned ranges.

[0053] Thereafter, holes are formed that penetrate the column A of the table body 13. Fig. 6 is a perspective view of the table body 13 in which the first step 15, the second step 17, and the holes 19 are formed. The holes 19 are formed by cutting or the like from the upper surface 15a of the first step 15 of the table body 13 toward the lower surface 13b of the table body 13 so as to penetrate the column A of the table body 13 from top to bottom. In this embodiment, twelve holes 19 are formed at approximately equal intervals along the outer periphery of the table body 13.

[0054] The holes 19 provided in the first step 15 are holes (mounting holes) into which fasteners (screws or the like) for fixing the chuck table 12 are inserted. For example, a cylindrical table base (not shown) provided on a moving table of the grinding device 2 is provided with holes in a number and arrangement corresponding to the holes 19 formed in the table body 13. The chuck table 12 is fixed to the table base by fastening screws through the holes 19 provided in the table body 13 into the holes in the table base.

[0055] It is to be noted that the hole 19 does not have to be provided in the first step 15. For example, the first step 15 may not be provided in the table body 13, and the hole 19 may be formed along the outer periphery of the second step 17 of the table body 13, from the upper surface 13a to the lower surface 13b of the second step 17 so as to penetrate the table body 13.

[0056] Next, a sealing step S3 is performed. In the sealing step S3, the side surface 13c of the table body 13 and a part of the lower surface 13b are sealed with a sealant. Fig. 7 is a perspective view showing the upper surface 13a side of the table body 13 and the sealant layer 21, and Fig. 8 is a perspective view showing the lower surface 13b side of the table body 13 and the sealant layer 21.

[0057] As shown in Figures 7 and 8, in this embodiment, the sealant layer 21 is provided on the entire side surface 13c of the table body 13. As shown in Figure 7, the sealant layer 21 is also provided on the surfaces of the first step 15 and the second step 17. Furthermore, as shown in Figure 8, the sealant layer 21 is also provided on the entire outer periphery of the lower surface 13b of the table body 13. Then, as shown in Figures 7 and 8, the sealant layer 21 is also provided on a portion including the hole 19. In this way, the sealant layer 21 seals the portion excluding the portion that becomes the holding surface for holding the plate-like object 11 and the portion for applying negative pressure to the chuck table 12.

[0058] The sealing material layer 21 is formed, for example, by applying a glass fusing agent to the table body 13. The glass fusing agent is a frit-like or paste-like material in which low-melting-point glass (glass with a glass transition point of 600° C. or less) is dispersed in an organic binder or the like. The composition of the low-melting-point glass is not particularly limited, but it is preferable that the low-melting-point glass has a melting point lower than that of the main component of the table body 13. Moreover, from the viewpoint of reducing the environmental load and preventing the intrusion of metal impurities into the wafer, it is preferable that the low-melting-point glass does not contain lead.

[0059] The sealing material layer 21 is formed by applying a glass fusing agent to the table body 13 and heating it. For example, the heating conditions are set to 450° C. to 650° C. in an electric furnace and the heating time is set to 30 minutes to 3 hours.

[0060] The thickness of the sealing material layer 21 is, for example, 100 μm or more and 1000 μm or less. The sealing material layer 21 contains elements constituting a glass fusing agent which is a raw material of the sealing material layer 21. The elements constituting the sealing material layer 21 can be detected by, for example, inductively coupled plasma mass spectrometry (ICP-MS).

[0061] Next, a fixing step S4 is performed. In the fixing step S4, the annular member is fixed to the second step 17 of the table body 13. FIG. 9 is a perspective view showing the table body 13 and the annular member 23. As shown in FIG. 9, a non-porous annular member 23 to be fixed to the second step 17 is prepared. The outer diameter h of the annular member 23 is, for example, substantially the same as the diameter d of the cylinder B (FIG. 4), and the inner diameter i of the annular member 23 is substantially the same as the diameter f of the cylinder C (FIG. 5). In addition, the thickness j of the annular member 23 is, for example, substantially the same as the depth g of the second step 17. Here, "non-porous" means a state in which the porosity is 1% or less and is substantially impermeable to water and air.

[0062] The annular member 23 can be produced, for example, by hollowing out the center of a disk-shaped substrate having the same thickness as the thickness j of the annular member 23 and a diameter larger than the outer diameter h of the annular member 23. The annular member 23 can also be produced by cutting out a plurality of members constituting the annular member 23 from a substrate having the same thickness as the thickness j of the annular member 23 and joining their side surfaces. Note that the method of producing the annular member 23 is not limited to these. The annular member 23 may be produced at any stage before the fixing step S4.

[0063] The annular member 23 is non-porous and mainly composed of a metal or semiconductor contained in the table body 13, or a metal or semiconductor constituting an oxide contained in the table body 13. For example, when the main component of the table body 13 is Si or SiO2 (an oxide of Si), the main component of the annular member 23 is Si.

[0064] The above-mentioned annular member 23 is placed on the second step 17 of the table body 13, and then heated to fix the annular member 23 to the second step 17. That is, the annular member 23 and the second step 17 of the table body 13 are bonded together by the sealing material layer 21 being melted by heating, and are solidified and fixed by cooling. Note that when the annular member 23 is fixed to the second step 17 of the table body 13, a sealing material may be applied again to the surfaces (inner surface and bottom surface) of the annular member 23 that come into contact with the second step 17 of the table body 13.

[0065] After the above-mentioned fixing step S4, a self-grinding may be performed to align the upper surface of the annular member 23 and the upper surface 13a of the table body 13 by grinding them with the grinding unit 28. In this case, if the plate-like object 11 is a Si wafer and the main component of the annular member 23 and the table body 13 is Si, the main components of the plate-like object 11, the annular member 23, and the table body 13 are all made of the same material. That is, since the hardness of the plate-like object 11, the hardness of the annular member 23, and the hardness of the table body 13 are close to each other, the upper surface of the annular member 23 and the upper surface 13a of the table body 13 can be ground without replacing the grinding wheel 38 for grinding the plate-like object 11.

[0066] Fig. 10 is a perspective view showing an upper surface 13a etc. of the table body 13 of the chuck table 12, and Fig. 11 is a perspective view showing a lower surface 13b etc. of the table body 13 of the chuck table 12. As shown in Fig. 10, in the chuck table 12, the upper surface 13a of the table body 13 constitutes the upper surface (holding surface) 12a of the chuck table 12.

[0067] 11, a sealing material layer 21 is provided on a portion of the outer periphery of the underside 13b of the table body 13 of the chuck table 12, and the table body 13 is exposed in the remaining portion of the underside 13b. A suction source is connected to this exposed portion, and negative pressure of the suction source is transmitted from the underside 13b of the table body 13 to the upper side 13a of the table body 13.

[0068] In the above-described chuck table 12, the height of the surface of the chuck table 12 is measured by bringing the first height gauge 46 into contact with the annular member 23. Since the upper surface of the annular member 23 does not have an uneven structure like the upper surface 13a of the table body 13 made of a porous material, the height gauge does not jump up during measurement, and a stable measurement value can be obtained.

[0069] The annular member 23 also serves to reinforce the table body 13. The annular member 23 can reduce the weight of the chuck table 12 compared to a conventional frame body that supports a porous plate. In addition, in the chuck table 12 of the present embodiment, the upper surface 13a of the table body 13 and a part of the lower surface 13b of the table body 13 are exposed, and therefore, compared to a conventional chuck table provided with a frame body that supports a porous plate, heat dissipation is improved.

[0070] The present invention is not limited to the above-described embodiment, and may be modified in various ways. For example, in the above-described embodiment, the chuck table 12 included in the grinding device 2 is described, but the chuck table 12 of this embodiment may also be applied to a cutting device or an analysis device.

[0071] In addition, the structures, methods, and the like according to the above-described embodiments and modified examples may be modified and implemented without departing from the scope of the present invention. [Explanation of symbols]

[0072] 11: Plate-shaped object 11a: Surface 11b: Back side 13: Table body 13a:Top surface 13b: Bottom surface 13c: Side 15: First step 15a:Top surface 17: Second step 19: Hole 21: Sealing material layer 23: Circular member 2: Grinding equipment 4: Base 4a: Opening 6:X-axis movement mechanism 8: Table cover 10: Dust-proof and water-resistant cover 12: Chuck table 12a:Top surface 14:Support structure 16:Z-axis movement mechanism 18: Guide rail 20: Moving plate 22: Screw shaft 24: Motor 26: Support 28: Grinding unit 30: Spindle housing 32: Spindle 34: Mount 36: Bolt 38: Grinding wheel 40: Wheel base 42: Grinding wheel 44: Height gauge 46: First height gauge 48: Second height gauge 50: Controller (control unit) 52: Processing equipment 54: Storage device 56: Input device

Claims

1. A method for manufacturing a chuck table for holding a plate-like object, comprising the steps of: a table body preparation step of preparing a columnar table body mainly composed of a metal, a semiconductor, or an oxide thereof and having a porous structure; a step forming step of processing an outer peripheral edge of one bottom surface of the table body to form a step around the entire outer peripheral edge; a sealing step of sealing at least a portion of the side surface and the other bottom surface of the table body with a sealing material; A method for manufacturing a chuck table, comprising: a fixing step of fixing a ring-shaped member which is non-porous and mainly composed of the metal or semiconductor which constitutes the metal, semiconductor or oxide contained in the table body, to the step.

2. 2. The method for manufacturing a chuck table according to claim 1, further comprising a hole forming step of forming holes in the table body into which fasteners for fixing the chuck table are inserted.

3. 2. The method for manufacturing a chuck table as described in claim 1, further comprising a holding surface forming step of processing the one bottom surface of the table body and the one bottom side surface of the annular member after the fixing step, thereby aligning the one bottom surface of the table body with the surface of the annular member to form a holding surface that holds the substrate.

4. 4. The method for manufacturing a chuck table according to claim 1, wherein the main component of the table body and the main component of the annular member are made of the same material.

5. 4. The method for manufacturing a chuck table according to claim 1, wherein the semiconductor is silicon and the metal is aluminum.

6. 4. The method for manufacturing a chuck table according to claim 1, wherein the sealing material is a glass fusion agent.

7. A chuck table for holding a plate-like object, a table body that is porous and columnar and mainly made of a metal, a semiconductor, or an oxide thereof, and has a step provided along the entire outer periphery on one bottom side; An annular member fixed to the step; a sealing material layer provided on at least a part of the side surface and the other bottom surface of the table body; The annular member is a chuck table that is non-porous and mainly composed of the metal or semiconductor that constitutes the metal, semiconductor or oxide contained in the table body.

8. 8. The chuck table according to claim 7, wherein the main component of the table body and the main component of the annular member are made of the same material.

9. 8. The chuck table of claim 7, wherein said semiconductor is silicon and said metal is aluminum.

10. 10. The chuck table according to claim 7, wherein the sealing material layer contains an element that constitutes a glass fusing agent.

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