Thermal Management for Patient Monitors

Abstract

A thermal enclosure for a computer having a processor and a display is disclosed and may include an inner case. The thermal enclosure may further include a heat sink attached to the inner case and thermally connected to the processor. The heat sink may have an outer heat dissipation channel. The thermal enclosure may also include an outer housing at least partially encasing the inner case. The outer housing may have a rear housing portion and a front housing portion. The rear housing portion, the front housing portion, and the outer heat dissipation channel may define a heat dissipation opening that may have an overall width W and a depth dimension D, and the outer heat dissipation channel may be recessed into the heat dissipation opening, and W and D may be adapted to prevent a human finger from contacting the outer heat dissipation channel.

Description

[Technical field]

[0001] The present disclosure relates generally to patient monitors and, more particularly, to structures and methods for dissipating heat generated by electronic components of patient monitors. (Related Applications)

[0002] This application claims priority to U.S. patent application Ser. No. 63 / 132,136, filed December 30, 2020, the contents of which are incorporated by reference herein for all purposes, including priority, as if set forth verbatim herein. [Background technology]

[0003] The availability of patient physiological data is a critical component of patient care. Portable, handheld patient monitors are useful tools for collecting such data because they can move with the patient (thus continuing to collect physiological data) as the patient moves through the healthcare system. For example, first responders can begin using patient monitors in the field, and the monitors can remain with the patient as they are moved from the field to the ambulance, to the emergency room, to the operating room, and then to the patient's room.

[0004] As portable patient monitors continue to develop and improve, there has been a desire to increase the storage and computing power of such devices. Such improvements have resulted in high heat loads, creating a need to improve heat dissipation. This is challenged by the relatively small size of portable patient monitors, the need to protect hospital patients and staff from exposure to hot surfaces, and the hygiene and cleaning requirements of equipment in a medical environment. Furthermore, due to the hygiene requirements of a hospital environment, the use of cooling fans is discouraged, in favor of thermal designs that rely on natural air convection. This requirement creates a unique challenge of cooling the electronics while maintaining the safety of patients, clinicians, and staff. Thus, there is a need for a portable patient monitor that can dissipate greater amounts of heat while meeting these competing requirements. Summary of the Invention

[0005] In one embodiment, a thermal enclosure for a computer having a processor and a display is disclosed and may include an inner case formed of a metallic material. The processor may be disposed within the inner case. The thermal enclosure may further include a heat sink attached to the inner case and thermally connected to the processor. The heat sink may have an outer heat dissipation channel. The thermal enclosure may also include an outer housing at least partially encasing the inner case, the outer housing formed of a polymeric material. The outer housing may have a rear housing portion and a front housing portion. The rear housing portion, the front housing portion, and the outer heat dissipation channel define a heat dissipation opening that may have an overall width W and a depth dimension D, and the outer heat dissipation channel may be recessed into the heat dissipation opening. W and D may be adapted to prevent a human finger from contacting the outer heat dissipation channel.

[0006] In another embodiment, a patient monitoring device is disclosed and may include an outer housing, which may have a rear housing portion and a front housing portion, and an inner case disposed at least partially within the rear housing portion of the outer housing and surrounded by the front housing portion. The inner case may include a plurality of auxiliary ports adapted to receive cables from a plurality of physiological sensors. The patient monitoring device may further include a processor disposed within the inner case and a heat sink disposed between the front housing portion of the outer housing and the inner case. The heat sink may include an outer heat dissipation channel around an outer periphery of the heat sink, and the heat dissipation channel may be in direct contact with ambient air to dissipate heat from the processor within the inner case.

[0007] In yet another embodiment, a patient monitor assembly is disclosed, which may include a patient monitoring device. The patient monitoring device may include an outer housing having a rear housing portion and a front housing portion, and an inner case disposed at least partially within the rear housing portion of the outer housing and surrounded by the front housing portion. The inner case may include a plurality of auxiliary ports adapted to receive cables from a plurality of physiological sensors. Additionally, the patient monitoring device may include a heat sink that may be disposed between the front housing portion of the outer housing and the inner case. The heat sink may include an exterior heat dissipation channel. The patient monitor assembly may also include a support bracket that may be adapted to receive the patient monitoring device and engage the heat sink to facilitate removal of heat from the patient monitoring device. [Brief description of the drawings]

[0008] In the drawings, like reference numbers generally indicate identical, functionally similar, and / or structurally similar elements.

[0009] [Figure 1] FIG. 1 is a perspective view of a portable patient monitor according to one embodiment. [Diagram 2]FIG. 2 is an exploded view of a portable patient monitor according to one embodiment. [Diagram 3] FIG. 3 is a cross-sectional view of the portable patient monitor of FIG. 1 taken along line 3-3 in accordance with one embodiment. [Figure 4] FIG. 4 is a detailed view of the portion of box 4 of FIG. 3 of a portable patient monitor according to one embodiment. [Diagram 5] FIG. 5 is a detailed view of the area indicated by box 5 in FIG. 1 of a portable patient monitor according to one embodiment. [Figure 6] FIG. 6 is a top view of a portable patient monitor assembly according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The following disclosure is presented to provide an illustration of the general principles of the present invention and is not intended to limit in any way the inventive concepts contained herein. Moreover, certain features described in this section can be used in combination with other described features, in each of the numerous possible permutations and combinations contained herein.

[0011] All terms defined herein should be given the broadest possible interpretation, including any implied meaning dictated by a reading of the specification, as well as any words to which a person skilled in the art and / or a dictionary, treatise, or similar authority assigns a specific meaning. Furthermore, as used herein and in the claims appended hereto, it should be noted that the singular forms "a," "an," and "the" include plural referents unless otherwise indicated. Furthermore, the terms "comprising" and "including," as used herein, specify that certain features are present in the embodiment, but should not be construed to preclude the presence or addition of additional features, components, operations, and / or groups thereof.

[0012] The following disclosure is intended to be read in conjunction with the accompanying drawings, which are considered part of the entire written description of the invention. The drawings are not necessarily to scale, and certain features of the invention may be shown in exaggerated scale or somewhat schematic form for clarity and conciseness. In this specification, relative terms such as "horizontal," "vertical," "up," "down," "upper," "lower," and derivatives thereof (e.g., "horizontally," "downward," "upward," etc.) should be interpreted as referring to the orientation as then described or as shown in the drawings described. These relative terms are for convenience of description and are not usually intended to require a particular orientation. Terms including "inward" and "outward," "longitudinal" and "lateral," etc., should be interpreted relative to each other or to an axis of elongation or axis or center of rotation, as appropriate. Terms related to attachments, couplings, and the like, such as "connected" and "interconnected," unless expressly stated otherwise, refer to both a relationship in which structures are fixed or attached to one another directly or indirectly through intervening structures, as well as movable or rigid attachments or relationships, and include terms such as "directly" coupled, fixed, etc. (To be discussed later) The term "operably coupled" refers to such an attachment, coupling, or connection that enables the associated structures to operate as intended by that relationship.

[0013] 1, a portable patient monitor 100 is shown. In general, the patient monitor 100 may include a rear housing portion 102, an inner case 104, a heat sink 106, and a user interface module 108. The inner case 104 may fit into the rear housing portion 102. The heat sink 106 may abut the inner case 104. Additionally, the user interface module 108 may be located adjacent to the heat sink 106. The assembly of these components relative to one another will be described in more detail below.

[0014] FIG. 2 shows further details of the portable patient monitor 100. As shown, the rear housing portion 102 of the monitor 100 may include a backplate 110. An outer wall 112 may extend from the backplate 110. In particular, the outer wall 112 may extend from an outer periphery of the backplate 110 in a direction that may be forward and substantially perpendicular to the backplate 110. The outer wall 112 of the rear housing portion 102 may include a lower wall portion 114 that may extend in a direction that may be substantially perpendicular to the backplate 110. The outer wall 112 of the rear housing portion 102 may also include an upper wall portion 116 opposite and spaced apart from the lower wall portion 114. The upper wall portion 116 of the outer wall 112 of the rear housing portion 102 may extend in a direction away from the backplate 110 in a direction that may be substantially perpendicular to the backplate 110 and substantially parallel to the lower wall portion 114.

[0015] 2, the outer wall 112 of the rear housing portion 102 may also include a left side wall portion 118 that may extend between a lower wall portion 114 and an upper wall portion 116 of the outer wall 112 of the rear housing portion 102. The left side wall portion 118 may extend from the backplate 110 in a direction that may be substantially perpendicular to the backplate 110. The left side wall portion 118 may also be substantially perpendicular to the lower wall portion 114 and the upper wall portion 116. The outer wall 112 of the rear housing portion 102 may also include a right side wall portion 120 that may extend between the lower wall portion 114 and the upper wall portion 116 of the outer wall 112 of the rear housing portion 102 opposite and spaced apart from the left side wall portion 118. The right side wall portion 120 may extend from the backplate 110 in a direction that may be substantially perpendicular to the backplate 110. The right side wall portion 120 may also be substantially perpendicular to the lower wall portion 114 and the upper wall portion 116 .

[0016] FIG. 2 further illustrates that the backplate 110 of the rear housing portion 102 may be formed with a rear housing opening 122. The rear housing opening 122 may provide access to one or more optical sensors (not shown) on the rear of the inner case 104, one or more labels (not shown) on the rear of the inner case 104, or a combination thereof. The left side wall portion 118 of the outer wall 112 of the rear housing portion 102 may be formed with a left side housing opening 124. The left side housing opening 124 may provide access to one or more connector ports on the inner case 104, as described below. Additionally, the right side wall portion 120 of the outer wall 112 of the rear housing portion 102 may be formed with a right side housing opening 126. The right side housing opening 126 may provide access to a battery (not shown) in the inner case 104.

[0017] 2, the lower wall portion 114 of the outer wall 112 of the rear housing portion 102 may be formed with a lower interlocking recess 128. Additionally, the upper wall portion 116 of the outer wall 112 of the rear housing portion 102 may be formed with an upper interlocking recess 130. As described in more detail below, the interlocking recesses 128, 130 of the rear housing portion 102 may engage corresponding features formed in the inner case 104. The rear housing portion 102 may also include an interior 132 bounded by the outer wall 112 of the rear housing portion 102 and the backplate 110 of the rear housing portion 102.

[0018] In certain embodiments, the rear housing portion 102 may be manufactured from an insulating material. The insulating material may include an insulating polymeric material, such as an insulating plastic. For example, the insulating plastic may include acrylonitrile butadiene styrene (ABS) plastic, chlorinated polyvinyl chloride (CPVC) plastic, high density polyethylene (HDPE) plastic, high impact polystyrene (HIPS) plastic, low density polyethylene (LDPE) plastic, linear low density polyethylene (LLDPE) plastic, polyether ether ketone (PEEK) plastic, polyethylene terephthalate (PET) plastic, polymethyl methacrylate / acrylic (PMMA) plastic, polyoxymethylene (POM) plastic, polypropylene (PP) plastic, polycarbonate (PC), acrylonitrile butadiene styrene (ABS), polyethylene terephthalate (PET) and / or modifications (e.g., glycol modified), polycyclohexylene dimethylene terephthalate (PCT) and / or modifications (e.g., glycol modified), polyamide (PA), polybutylene terephthalate (PBT), polyphenolsulfone (PPSU), or combinations thereof.

[0019] The insulating material may have a thermal conductivity coefficient k, (W / (mK)) of 0.100 or greater. Further, k may be 0.110 or greater, such as 0.130 or greater, 0.140 or greater, 0.160 or greater, 0.190 or greater, 0.200 or greater, 0.220 or greater, or 0.250 or greater. In another embodiment, k can be 0.500 or less, e.g., 0.450 or less, 0.370 or less, 0.350 or less, 0.320 or less, 0.310 or less, or 0.300 or less, hi another embodiment, k can be within a range between and including any of the minimum and maximum values ​​of k described herein.

[0020] 2 , the inner case 104 of the monitor 100 may include a backplate 140. An outer wall 142 may extend from the backplate 140. In particular, the outer wall 142 may extend from an outer periphery of the backplate 140 in a direction that may be forward and substantially perpendicular to the backplate 140. The outer wall 142 of the inner case 104 may include a lower wall portion 144 that may extend in a direction that may be substantially perpendicular to the backplate 140. The outer wall 142 of the inner case 104 may also include an upper wall portion 146 opposite and spaced apart from the lower wall portion 144. The upper wall portion 146 of the outer wall 142 of the inner case 104 may extend in a direction away from the backplate 140 in a direction that may be substantially perpendicular to the backplate 140 and substantially parallel to the lower wall portion 144.

[0021] 2, the outer wall 142 of the inner case 104 may also include a left side wall portion 148 that may extend between the lower wall portion 144 of the inner case 104 and the upper wall portion 146 of the outer wall 142. The left side wall portion 148 may extend from the backplate 140 in a direction that may be substantially perpendicular to the backplate 140. The left side wall portion 148 may also be substantially perpendicular to the lower wall portion 144 and the upper wall portion 146. The outer wall 142 of the inner case 104 may also include a right side wall portion 150 that may extend between the lower wall portion 144 and the upper wall portion 146 of the outer wall 142 of the inner case 104 opposite the left side wall portion 148 and spaced therefrom. The right side wall portion 150 may extend from the backplate 140 in a direction that may be substantially perpendicular to the backplate 140. The right side wall portion 150 may also be substantially perpendicular to the lower wall portion 144 and the upper wall portion 146 .

[0022] FIG. 2 further illustrates that the left side wall portion 148 of the outer wall 142 of the inner case 104 may be formed with several connector port openings 152. The connector port openings 152 provide access to various connector ports, described below, accessible through the rear housing portion 102 within the inner case 104 of the monitor 100. As further illustrated in FIG. 2, the lower wall portion 144 of the outer wall 142 of the inner case 104 may be formed with a lower mating recess 154. Additionally, the upper wall portion 146 of the outer wall 142 of the inner case 104 may be formed with an upper mating recess 156. When the monitor 100 is assembled as illustrated in FIG. 1, the mating recesses 128, 130 of the rear housing portion 102 may mate and engage with the mating recesses 154, 156 formed on the inner case 104. The monitor 100 may also include a processor, such as a central processing unit (CPU) 158 mounted or otherwise disposed on a printed circuit board (PCB) 160 within an interior 162 of the inner case 104 .

[0023] In certain embodiments, the inner case 104 may be made of a thermally conductive material. Additionally, the inner case 104 may be made of a thermally conductive metal. For example, the thermally conductive metal may include aluminum, copper, magnesium, zinc, tungsten, or a combination thereof. In another embodiment, the thermally conductive material may include an alloy of a thermally conductive metal. The alloy of a thermally conductive metal may include aluminum alloy 1050, aluminum alloy 6060, aluminum alloy 6061, aluminum alloy 6063, brass, bronze, or a combination thereof. It should be noted that the numbers associated with the different types of aluminum alloys (e.g., 1050, 6060, 6061, 6063) are names of materials known to those skilled in the art and are not reference numbers in the drawings.

[0024] The thermally conductive material may have a thermal conductivity coefficient, k, (W / (mK)) of 50 or greater. Additionally, k may be 100 or greater, such as 125 or greater, or 150 or greater. In other embodiments, k may be 450 or less, such as 400 or less, 350 or less, 300 or less, 250 or less, or 200 or less. In other embodiments, k may be within a range between and including any of the minimum and maximum values ​​of k described herein.

[0025] 2, the heat sink 106 of the monitor 100 may include a backplate 170. An outer wall 172 may extend from the backplate 170. In particular, the outer wall 172 may extend from the periphery of the backplate 170 in a direction that may be forward and substantially perpendicular to the backplate 170. The outer wall 172 of the heat sink 106 may include a lower wall portion 174 that may extend in a direction that may be substantially perpendicular to the backplate 170. The outer wall 172 of the heat sink 106 may also include an upper wall portion 176 opposite and spaced apart from the lower wall portion 174. The upper wall portion 176 of the outer wall 172 of the heat sink 106 may extend in a direction away from the backplate 170 in a direction that may be substantially perpendicular to the backplate 170 and substantially parallel to the lower wall portion 174.

[0026] 2, the outer wall 172 of the heat sink 106 may also include a left side wall portion 178 that may extend between a lower wall portion 174 and an upper wall portion 176 of the outer wall 172 of the heat sink 106. The left side wall portion 178 may extend from the backplate 170 in a direction that may be substantially perpendicular to the backplate 170. The left side wall portion 178 may also be substantially perpendicular to the lower wall portion 174 and the upper wall portion 176. The outer wall 172 of the heat sink 106 may also include a right side wall portion 180 that may extend between the lower wall portion 174 and the upper wall portion 176 of the outer wall 172 of the heat sink 106 opposite and spaced apart from the left side wall portion 178. The right side wall portion 180 may extend from the backplate 170 in a direction that may be substantially perpendicular to the backplate 170. The right side wall portion 180 may also be substantially perpendicular to the lower wall portion 174 and the upper wall portion 176 .

[0027] 2 further illustrates that the backplate 170 of the heatsink 106 may include a number of openings 182 through which the user interface module 108 may be electrically connected to the CPU 158 and other electrical components within the interior 162 of the inner case 104. As shown, the heatsink 106 may also include a relatively shallow interior 184 bounded by the outer wall 172 of the heatsink 106 and the backplate 170 of the heatsink 106.

[0028] In certain embodiments, the heat sink 106 may be manufactured from a thermally conductive material. Additionally, the heat sink 106 may be manufactured from a thermally conductive metal. For example, the thermally conductive metal may include aluminum, copper, magnesium, zinc, tungsten, or a combination thereof. In another embodiment, the thermally conductive material may include an alloy of a thermally conductive material. The alloy of a thermally conductive metal may include aluminum alloy 1050, aluminum alloy 6060, aluminum alloy 6061, aluminum alloy 6063, brass, bronze, or a combination thereof. In certain embodiments, the heat sink 106 may be designed such that when the monitor 100 is assembled as described herein, the heat sink 106 may be as close as possible to the CPU to facilitate efficient heat transfer from the CPU to the heat sink 106 while avoiding potential thermal impedances.

[0029] In another particular embodiment, the thermally conductive material can have a thermal conductivity coefficient, k, (W / (mK)) of 50 or greater. Additionally, k can be 100 or greater, such as 125 or greater, or 150 or greater. In another embodiment, k can be 450 or less, such as 400 or less, 350 or less, 300 or less, 250 or less, or 200 or less. In another embodiment, k can be within a range between and including any of the minimum and maximum values ​​of k described herein.

[0030] 2, the user interface module 108 may include a front housing portion 190. A touch display screen 192 may be disposed within the front housing portion 190. When the monitor 100 is assembled as described herein, the front housing portion 190 and the rear housing portion 102 may comprise an outer housing that may be made of the same material as the rear housing portion 102 and the front housing portion 190.

[0031] In certain embodiments, the front housing portion 190 may be manufactured from an insulating material. The insulating material may include an insulating polymeric material, such as an insulating plastic. For example, the insulating plastic may include acrylonitrile butadiene styrene (ABS) plastic, chlorinated polyvinyl chloride (CPVC) plastic, high density polyethylene (HDPE) plastic, high impact polystyrene (HIPS) plastic, low density polyethylene (LDPE) plastic, linear low density polyethylene (LLDPE) plastic, polyether ether ketone (PEEK) plastic, polyethylene terephthalate (PET) plastic, polymethyl methacrylate / acrylic (PMMA) plastic, polyoxymethylene (POM) plastic, polypropylene (PP) plastic, or a combination thereof.

[0032] The insulating material may have a thermal conductivity coefficient k, (W / (mK)) of 0.100 or greater. Further, k may be 0.110 or greater, such as 0.130 or greater, 0.140 or greater, 0.160 or greater, 0.190 or greater, 0.200 or greater, 0.220 or greater, or 0.250 or greater. In another embodiment, k can be 0.500 or less, e.g., 0.450 or less, 0.370 or less, 0.350 or less, 0.320 or less, 0.310 or less, or 0.300 or less, hi another embodiment, k can be within a range between and including any of the minimum and maximum values ​​of k described herein.

[0033] With reference to FIG. 2, when the portable patient monitor 100 is assembled as shown in FIG. 1, the user interface module 108 may be partially fitted into the shallow interior 184 of the heat sink 106. The user interface module 108 may be held in place with one or more machine screws (not shown). Additionally, as shown in FIG. 2, the monitor 100 may include a thermal gap pad 200 (which is a form of thermal interface) between a heat spreader plate 202 (another form of thermal interface) and the heat sink 106. The heat spreader plate 202 may be fabricated from a thermally conductive material. Additionally, the heat spreader plate 202 may be fabricated from a thermally conductive metal that is different from the thermally conductive materials used for the other thermal interfaces shown. The heat spreader plate 202 functions to spread heat from the CPU 158 over a larger area as well as provide a protective cover for the CPU 158, and the thermal gap pad 200 provides a strong seal between the heat spreader 202 and the heat sink 106 to ensure optimal heat dissipation. A phase change material may be used to provide a thermal interface 204, which is preferably also provided between the CPU 158 and the heat spreading plate 202, to help stabilize the temperature of the CPU 158 and provide a strong thermal connection between the CPU 158 and the heat spreading plate 202. Examples of materials suitable for the phase change material to make the thermal interface 204 include salt-hydrates, n-alkanes, and non-paraffinic organics. The thermal interface 204 may also be made from other types of thermal interface materials (e.g., materials that are thermally conductive).

[0034] For example, the thermally conductive material may include aluminum, copper, magnesium, zinc, tungsten, or combinations thereof. In another embodiment, the thermally conductive material may include an alloy of thermally conductive metals. The alloy of thermally conductive metals may include aluminum alloy 1050, aluminum alloy 6060, aluminum alloy 6061, aluminum alloy 6063, brass, bronze, or combinations thereof.

[0035] The thermally conductive material may have a thermal conductivity coefficient, k, (W / (mK)) of 50 or greater. Additionally, k may be 100 or greater, such as 125 or greater, or 150 or greater. In other embodiments, k may be 450 or less, such as 400 or less, 350 or less, 300 or less, 250 or less, or 200 or less. In other embodiments, k may be within a range between and including any of the minimum and maximum values ​​of k described herein.

[0036] As further shown in FIG. 2, the monitor 100 may include a thermal interface 204 that may be sandwiched between the heat spreading plate 202 and the CPU 158 in the inner case 104. The thermal interface 204 may be a phase change material or may be made of a silicon-based material with conductive particles embedded therein (e.g., Al, ceramic, or any type of conductive material). The heat sink 106 may be assembled to the inner case 104 such that the heat sink 106 partially fits into the interior 162 of the inner case 104. One or more machine screws (not shown) may be used to assemble the heat sink 106 to the inner case 104. The user interface module 108 may be electrically connected or coupled to one or more electrical elements in the inner case 104 through one or more openings 182 formed in the heat sink 106. It should be understood that when assembled as described herein, the combination or assembly of the inner case 104 and the heat sink 106 may be considered a thermal enclosure 210.

[0037] Further, the assembly of the user interface module 108, the heat sink 106, and the inner case 104 may be assembled with the rear housing portion 102 such that the inner case 104 of the monitor 100 fits into the interior 132 of the rear housing portion 102. Specifically, the inner case 104 fits into the interior 132 of the rear housing portion 102 such that the lower coupling recess 128 formed in the lower wall portion 114 of the outer wall 112 of the rear housing portion 102 fits into and engages with the lower coupling recess 154 formed in the lower wall portion 144 of the outer wall 142 of the inner case 104. Further, the upper coupling recess 130 formed in the upper wall portion 116 of the outer wall 112 of the rear housing portion 102 fits into and engages with the upper coupling recess 156 formed in the upper wall portion 146 of the outer wall 142 of the inner case. Inner case 104 may be held in place within rear housing portion 102 via one or more machine screws (not shown).

[0038] 3 and 4, further details of the assembled portable patient monitor 100 are shown. FIG. 4 is a detailed view of box 4 in FIG. 3. FIG. 4 shows that the front housing portion 190 may include a backplate 400. The front housing portion backplate 400 may include an inner wall 402 that may extend from a perimeter of the backplate 400. The inner wall 402 may extend from the backplate 400 in a direction that may be forward and substantially perpendicular to the backplate 400. As shown, a lateral flange 404 may extend from the inner wall 402 in a direction that may be outwardly directed relative to the inner wall 402 and substantially parallel to the backplate 400.

[0039] 4, the front housing portion 190 may include an outer wall 406 that may extend from around the lateral flanges 404. The outer wall 406 of the front housing portion 190 may include a first portion 408 that may be forward of the lateral flanges 404 and extend from the lateral flanges 404 in a direction that may be substantially perpendicular to the lateral flanges 404 and the backplate 400. The first portion 408 of the outer wall 406 of the front housing portion 190 may fit around and engage the touchscreen display 192 of the user interface module 108.

[0040] 4 also illustrates that the outer wall 406 of the front housing portion 190 may include a second portion 410 that may be rearward relative to the lateral flanges 404 and extend from the lateral flanges 404 in a direction that may be substantially perpendicular to the lateral flanges 404 and the backplate 400. A channel 412 may be established between the second portion 410 of the outer wall 406 of the front housing portion 190, the inner wall 402 of the front housing portion 190, and the lateral flanges 404 of the front housing portion 190. The channel 412 may surround and mate with and engage a portion of the outer wall 172 of the heat sink 106 while a portion of the front housing portion 190 mates with the interior 184 of the heat sink 106. Specifically, a distal end of the outer wall 172 of the heat sink 106 may mate with and engage the channel 412 formed in the front housing portion 190.

[0041] Continuing to refer to FIG. 4 , the outer wall 172 of the heat sink 106 may be formed with a heat dissipation channel 414 near a distal end of the outer wall 172 of the heat sink 106. As depicted in FIG. 5 , the heat dissipation channel 414 may extend around the entire periphery of the heat sink 106, for example, around the periphery of the outer wall 172 of the heat sink 106. In other words, the heat dissipation channel 414 may be formed in an outer surface of the outer wall 172 of the heat sink 106. Thus, the heat dissipation channel 414 may be continuous and formed in an outer surface of the bottom wall portion 174 of the outer wall 172 of the heat sink, an outer surface of the left side wall portion 178 of the outer wall 172 of the heat sink 106, an outer surface of the top wall portion 176 of the outer wall 172 of the heat sink 106, and an outer surface of the right side wall portion 180 of the outer wall 172 of the heat sink 106.

[0042] The heat dissipation channels 414 of the heat sink 106 may be sized and shaped to provide effective heat dissipation to the surrounding air. Additionally, the location of the heat dissipation channels 414 of the heat sink 106 relative to the inner case 104 and the front housing portion 190 may substantially prevent a user or patient from touching the heat sink 106, such as the heat dissipation channels 414 formed therein. In one aspect, as shown in FIG. 4, the heat dissipation channels 414 may have a concave shape when viewed in cross section. Additionally, the heat dissipation channels 414 may be smooth and easy to clean.

[0043] 4, the heat dissipation channel 414 can have a radius of curvature R. R can be 1.00 millimeters (mm) or greater. In another embodiment, R can be 1.25 mm or greater, e.g., 1.50 mm or greater, 1.75 mm or greater, or 2.00 mm or greater. Further, R can be 3.50 mm or less, e.g., 3.25 mm or less, 3.00 mm or less, 2.75 mm or less, 2.50 mm or less, or 2.25 mm or less. In yet another embodiment, R can be within a range between and including any of the minimum and maximum values ​​of R described herein.

[0044] In certain aspects, the heat dissipation channel 414, the rear housing portion 102, and the front housing portion 190 can establish a heat dissipation opening 416. As shown in FIG. 4, the heat dissipation opening 416 can have an overall width W. W can be measured from a side of the second portion 410 of the exterior 406 of the front housing portion 190 to a side of the outer wall 112 of the rear housing portion 102. W can be 3.00 mm or greater. In other aspects, W can be 3.25 mm or greater, e.g., 3.50 mm or greater, 3.75 mm or greater, or 4.00 mm or greater. Additionally, W can be 6.00 mm or less, e.g., 5.75 mm or less, 5.50 mm or less, 5.25 mm or less, 5.00 mm or less, 4.75 mm or less, 4.50 mm or less, or 4.25 mm or less. In yet another embodiment, W can be within a range between and including any of the minimum and maximum values ​​for W listed herein.

[0045] In another embodiment, the heat dissipation opening 416 can have a depth dimension D, where D is measured from the outer periphery of the outer wall 406 of the front housing portion 190 to the bottom of the heat dissipation channel 414, as shown in FIG. 4. D can be 2.50 mm or greater. In another embodiment, D can be 2.75 mm or greater, e.g., 3.00 mm or greater, 3.25 mm or greater, or 3.50 mm or greater. Further, D can be 6.00 mm or less, e.g., 5.75 mm or less, 5.50 mm or less, 5.25 mm or less, 5.00 mm or less, 4.75 mm or less, 4.50 mm or less, 4.25 mm or less, 4.00 mm or less, or 3.75 mm or less. In yet another embodiment, D can be within a range between and including any of the minimum and maximum values ​​of D described herein.

[0046] In yet another embodiment, the upper edge of the heat dissipation channel 414 is set back from the outer periphery of the outer wall 112 of the rear housing portion 102 by a gap G. G may be measured from the outer periphery of the outer wall 406 of the front housing portion 190 to the upper edge of the heat dissipation channel 414 as seen in FIG. 4. G may be 1.50 mm or greater. In another embodiment, G may be 1.75 mm or greater, e.g., 2.00 mm or greater, 2.25 mm or greater, or 2.50 mm or greater. Further, G can be 5.00 mm or less, e.g., 4.75 mm or less, 4.50 mm or less, 4.25 mm or less, 4.00 mm or less, 3.75 mm or less, 3.50 mm or less, 3.25 mm or less, 3.00 mm or less, or 2.75 mm or less. In yet other embodiments, G can be within a range between and including any of the minimum and maximum values ​​for G listed herein.

[0047] In certain aspects, the arrangement of the inner case 104 and the heat sink 106, for example, fastening the inner case 104 to the heat sink 106 to create the thermal enclosure 210, may provide the necessary force to establish a conductive path from the CPU 158 to the heat sink 106. For example, heat generated by the CPU 158 may be transferred with low impedance through the thermal interface 204 and the heat spreading plate 202 to the heat sink 106. The heat flux travels through the heat sink 106 to the heat dissipation channels 414. The heat dissipation channels 414 may be exposed to the ambient air and may be in direct contact with the ambient air, thus radiating and dissipating the heat flux to the ambient air through the exposed heat dissipation channels 414 and the heat dissipation openings 416. The heated bulk air within the thermal enclosure 210 may be indirectly conducted into the inner case 104, which may equilibrate the temperature on the surface of the inner case 104 and substantially eliminate any hot spots on the surface of the inner case 104. Any elevated temperature of the inner case 104 may be isolated from user or patient contact by the insulating layer of plastic provided by the outer cover 102 .

[0048]

[0023] Referring now to Figure 6, a portable patient monitor assembly 600 is shown. As shown, the monitor assembly 600 may include a support bracket 602 and a portable patient monitor, such as the portable patient monitor 100 shown and described herein. Figure 6 shows that the support bracket 602 may include an upper support structure 604 and a lower support structure 606. As shown, the support structures 604, 606 may be sized and shaped to fit into heat dissipation openings 416 formed on the monitor 100 and engage with heat dissipation channels 414 of the heat sink 106. The support structures 604, 606 of the support bracket 602 may engage with the heat dissipation channels 414 to facilitate removal of heat from within the monitor 100.

[0049] The support bracket 602 may be fabricated from a thermally conductive material. Additionally, the support bracket 602 may be fabricated from a thermally conductive metal. For example, the thermally conductive metal may include aluminum, copper, magnesium, zinc, tungsten, or a combination thereof. In another embodiment, the thermally conductive material may include an alloy of a thermally conductive metal. The thermally conductive metal alloy may include aluminum alloy 1050, aluminum alloy 6060, aluminum alloy 6061, aluminum alloy 6063, brass, bronze, or a combination thereof.

[0050] The thermally conductive material may have a thermal conductivity coefficient k (W / (mK)) of 50 or greater. Additionally, k may be 100 or greater, such as 125 or greater, or 150 or greater. In other embodiments, k may be 450 or less, such as 400 or less, 350 or less, 300 or less, 250 or less, or 200 or less. In other embodiments, k may be within a range between and including any of the minimum and maximum values ​​of k listed herein.

[0051] 6 also shows that the inner case 104 of the monitor 100 may include a power port 610, one or more auxiliary connector ports 612, a first set of patient monitoring ports 614, and a second set of patient monitoring ports 616. One or more wires or cables may be connected to the monitor 100 via the ports 610, 612, 614, 616 to enable the monitor 100 to receive power and receive, integrate, and display patient information and data from one or more physiological sensors. The patient information, or physiological information received from the physiological sensors, may include electrocardiogram (ECG) data, respiration rate, non-invasive blood pressure (NIBP), invasive blood pressure (IBP) (systolic, diastolic, and mean), temperature, pulse oximetry (SpO2), mixed venous oxygenation (SvO2), cardiac output, end-tidal carbon dioxide (ETCO2), intracranial pressure, airway gas concentrations, or combinations thereof. The ports 610, 612, 614, 616 may be accessible through a left housing opening 124 formed in the left side wall portion 118 of the outer wall 112 of the rear housing portion 102. The support bracket 602 may further include a window or opening through which the user interface 192 of the monitor 100 is viewed while the monitor 100 is engaged with the support bracket.

[0052] All examples and conditional expressions described herein are intended for educational purposes to help the reader understand the principles of the present invention and concepts provided by the inventor to further develop the present technical field. Therefore, they should be interpreted as not being limited to such specifically described examples and conditions. Moreover, all statements herein that describe the principles, aspects, and embodiments of the present invention, as well as specific examples thereof, are intended to encompass both their structural and functional equivalents. Moreover, such equivalents are intended to include both currently known equivalents as well as equivalents developed in the future, i.e., any elements developed that perform the same function, regardless of structure.

[0053] It will be understood that the embodiments described herein are merely exemplary, and that those skilled in the art may make many changes and modifications without departing from the spirit and scope of the present invention, and all such changes and modifications are intended to be included within the scope of the present invention, as defined by the following claims.

Claims

1. 1. A thermal enclosure for a computer having a processor and a display, comprising: The thermal enclosure includes: an inner case formed of a metallic material, the processor being disposed within the inner case; a heat sink attached to the inner case and thermally connected to the processor, the heat sink having an outer heat dissipation channel; an outer housing at least partially encasing the inner case, the outer housing being formed from a polymeric material, the outer housing including a rear housing portion and a front housing portion; a thermal enclosure, wherein the rear housing portion, the front housing portion, and the outer heat dissipation channel define a heat dissipation opening having an overall width W and a depth dimension D, the outer heat dissipation channel being recessed into the heat dissipation opening, W and D being adapted to prevent contact with the outer heat dissipation channel by a human finger.

2. a thermal interface adjacent to the processor; and a heat spreader plate adjacent to the thermal interface. The thermal enclosure of claim 1 , wherein the thermal interface and the heat spreading plate thermally connect the processor to the heat sink.

3. The thermal enclosure of claim 1 or 2, wherein the heat sink comprises a backplate and an outer wall extending from the backplate, the outer heat dissipation channel being formed in the outer wall.

4. The thermal enclosure of claim 3 , wherein the outer heat dissipation channel extends along the entire outer wall.

5. The thermal enclosure of claim 1 , wherein the outer heat dissipation channels are rounded.

6. The thermal enclosure of claim 5 , wherein the outer heat dissipation channel is concave.

7. The thermal enclosure of claim 1 , wherein W is 3.00 mm or more.

8. The thermal enclosure of claim 7 , wherein W is 6.00 mm or less.

9. The thermal enclosure according to claim 1 , wherein D is 2.50 mm or more.

10. The thermal enclosure of claim 9 , wherein D is 6.00 mm or less.

11. 1. A patient monitoring device comprising: an outer housing having a rear housing portion and a front housing portion; an inner case disposed at least partially within the rear housing portion of the outer housing and surrounded by the front housing portion, the inner case including a plurality of ports adapted to receive cables from a plurality of physiological sensors; a processor disposed within the inner case, the processor adapted to interpret signals received from the plurality of physiological sensors; a heat sink disposed between the front housing portion of the outer housing and the inner case, the heat sink including an outer heat dissipation channel around an outer periphery of the heat sink, the heat dissipation channel being in direct contact with ambient air for dissipating heat from the processor within the inner case; A patient monitoring device comprising:

12. 12. The patient monitoring device of claim 11, wherein the rear housing portion, the front housing portion, and the outer heat dissipation channel define a heat dissipation opening, the heat dissipation opening being sized and shaped to prevent contact with a human finger with the outer heat dissipation channel.

13. 13. The patient monitoring device of claim 12, wherein the heat dissipation opening has an overall width W, where W is 6.00 mm or less.

14. The patient monitoring device of claim 13 , wherein the heat dissipation opening has a depth dimension D, D being 2.50 mm or greater.

15. 15. The patient monitoring device of claim 11, wherein the heat dissipation channel defines a radius of curvature R that is greater than or equal to 1.00 millimeters (mm).

16. 16. The patient monitoring device of claim 15, wherein R is 3.50 mm or less.

17. 17. A patient monitoring device according to any one of claims 11 to 16, wherein an upper edge of the heat dissipation channel is recessed from an outer surface of the outer housing by a gap G that is 1.50 mm or greater.

18. 18. The patient monitoring device of claim 17, wherein G is less than or equal to 5.00 mm.

19. 19. A patient monitoring device as claimed in any one of claims 11 to 18, wherein the front housing portion includes an outer wall having a channel formed therein, and a distal end of the heat sink fits into the channel in the front housing portion.

20. 20. The patient monitoring device of claim 19, wherein the outer heat dissipation channel of the heat sink is adjacent the distal end of the heat sink.

21. 1. A patient monitor assembly comprising: an outer housing having a rear housing portion and a front housing portion; an inner case disposed at least partially within the rear housing portion of the outer housing and surrounded by the front housing portion, the inner case including a plurality of ports adapted to receive cables from a plurality of physiological sensors; a heat sink disposed between the front housing portion of the outer housing and the inner case, the heat sink including an outer heat dissipation channel; A patient monitor assembly comprising: a support bracket adapted to receive a patient monitoring device and facilitate removal of heat from the patient monitoring device.

22. 22. The assembly of claim 21, wherein the support bracket includes at least one support structure sized and shaped to fit and engage with the outer heat dissipation channel of the heat sink.

23. 23. The thermal enclosure, device or assembly of claim 1, wherein the outer housing comprises a thermal insulating material.

24. 24. The thermal enclosure, device, or assembly of claim 23, wherein the insulating material comprises an insulating plastic.

25. 25. The thermal enclosure, device, or assembly of claim 24, wherein the insulating plastic may comprise acrylonitrile butadiene styrene (ABS) plastic, chlorinated polyvinyl chloride (CPVC) plastic, high density polyethylene (HDPE) plastic, high impact polystyrene (HIPS) plastic, low density polyethylene (LDPE) plastic, linear low density polyethylene (LLDPE) plastic, polyetheretherketone (PEEK) plastic, polyethylene terephthalate (PET) plastic, polymethyl methacrylate / acrylic (PMMA) plastic, polyoxymethylene (POM) plastic, polypropylene (PP) plastic, or combinations thereof.

26. 26. The thermal enclosure, device or assembly of any one of claims 23 to 25, wherein the insulating material has a thermal conductivity coefficient k (W / (mK)) that is 0.100 or greater.

27. 27. The thermal enclosure, device, or assembly of claim 26, wherein k is less than or equal to 0.

500.

28. 28. The thermal enclosure, device or assembly of any one of claims 1 to 27, wherein the inner case, the heat sink, or a combination thereof comprises a thermally conductive material.

29. 30. The thermal enclosure, device, or assembly of claim 28, wherein the thermally conductive material comprises a thermally conductive metal.

30. 30. The thermal enclosure, device or assembly of claim 29, wherein the thermally conductive metal comprises aluminum, copper, magnesium, zinc, tungsten, or combinations thereof.

31. 30. The thermal enclosure, device or assembly of claim 28, wherein the thermally conductive material comprises an alloy of thermally conductive metals.

32. 32. The thermal enclosure, device, or assembly of claim 31 , wherein the alloy of thermally conductive metal comprises aluminum alloy 1050, aluminum alloy 6060, aluminum alloy 6061, aluminum alloy 6063, brass, bronze, or combinations thereof.

33. 33. The thermal enclosure, device or assembly of any one of claims 28 to 32, wherein the thermally conductive material has a thermal conductivity coefficient k (W / (mK)) that is 50 or greater.

34. 34. The thermal enclosure, device or assembly of claim 33, wherein k is 450 or less.

35. 1. An apparatus comprising: a user interface module comprising a user interface housing containing at least a portion of a display, the user interface housing having a rear user interface end; a computer comprising a processor and a memory, said computer being electrically connected to said user interface module, said computer being adapted to display information on said display; a thermal enclosure having a heat sink attached to a rear enclosure, the computer being disposed within the rear enclosure, the heat sink being disposed between the rear enclosure and the user interface module, the heat sink being thermally connected to the processor, the heat sink having an outer heat sink wall extending around at least a portion of a perimeter of the heat sink; a cover at least partially enclosing the rear housing, the cover having a front cover end; the outer heat sink wall is disposed between and recessed beneath the front cover edge and the rear user interface edge, the outer heat sink wall, the front cover edge, and the rear user interface edge defining a heat sink channel exposed to ambient air surrounding the device; An apparatus, wherein the thermal enclosure is formed of a material having a higher thermal conductivity than the cover and the user interface enclosure.

36. a plurality of sensor ports, each of the plurality of sensor ports being coupled to a physiological sensor and capable of receiving a signal from the physiological sensor indicative of a physiological parameter of the patient; 36. The apparatus of claim 35, wherein the computer is electrically connected to the plurality of sensor ports and adapted to receive the signals, store data representative of the received signals, and display information representative of the received signals on the display.

37. 37. The apparatus of claim 35 or 36, wherein the outer heat sink wall is adapted to prevent human fingers from contacting the outer heat sink wall.

38. 38. Apparatus according to any one of claims 35 to 37, wherein the outer heat sink wall is the only portion of the heat sink exposed to the surrounding air.

39. 39. The apparatus of any one of claims 35 to 38, wherein the covers are each formed from a material having a thermal conductivity coefficient k(W / (mK)) of less than 0.

5.

40. 40. The apparatus of claim 35, wherein the thermal enclosures are formed from materials each having a thermal conductivity coefficient k(W / (mK)) greater than 50.

41. 41. Apparatus according to any one of claims 35 to 40, wherein the outer heat sink wall has a width of 6.0 mm or less.

42. 42. Apparatus according to any one of claims 35 to 41, wherein the outer heat sink wall has a maximum depth of 2.5mm or greater.

43. 43. Apparatus according to any one of claims 35 to 42, wherein the outer heat sink wall is concave.

44. 44. The apparatus of claim 43, wherein the outer heat sink wall has a radius of curvature in the range of 1.0 mm to 3.5 mm.

45. 45. The apparatus of any one of claims 35 to 44, further comprising a thermal gap pad and a thermal spreader disposed between the processor and the heat sink.

Images