Additive manufacturing system, method of forming an additive manufacturing system, and method of forming a composite structure

Abstract

Various embodiments may provide an additive manufacturing system for forming a composite structure. The system may include a first pool containing an activating solution for forming a first printed portion of the workpiece, the activating solution including a solvent, an activating seed soluble in the solvent, and a photocurable resin. The system may also include a second pool containing an additional photocurable resin for forming a second printed portion of the workpiece, and a light source configured to provide light. The system may further include a mask configured to be positioned such that the light provided by the light source is irradiated through the mask onto the workpiece, and a third pool containing a cleaning solution or mixture for cleaning the workpiece. The first printed portion including the activating seed may be configured to form a metal layer by an electroless deposition process, thereby forming a composite structure.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001]

[0001] This application claims the benefit of priority to Singapore Patent Application No. 10202103820, filed on April 14, 2021, the contents of which are incorporated by reference in their entirety for all purposes. [Technical field]

[0002]

[0002] Various aspects of the present disclosure relate to additive manufacturing systems. Various aspects of the present disclosure relate to methods of forming additive manufacturing systems. Various aspects of the present disclosure may provide methods of forming composite structures according to various embodiments.

[0003]

[0003] The formation of specific metal patterns on three-dimensional (3D) plastic parts has attracted significant research interest due to potential applications in 3D smart electronics, electrical communication technology, micro / nano sensors, microelectromechanical systems (MEMS), and even quantum science. In contrast to traditional two-dimensional (2D) printed circuit boards (PCBs), 3D metal-plastic composite functional devices have more complex and elaborate structures with higher design freedom and higher integration. Selective construction of metallization layouts in specific areas of the 3D substrate can enable the fabrication of interconnected devices with various complex geometric shapes. These 3D metal-plastic structures significantly reduce the size requirements compared to standard planar printed electronics, thus enabling further miniaturization of functional devices. Still, it is difficult to build interconnected metal patterns on the surface of more complex 3D parts using conventional microfabrication techniques such as lithography, deposition, etching, and peeling. Because the fabrication of 3D metal-plastic components requires laser direct structuring (LDS), the fabrication of such parts can be expensive and include long manufacturing cycles, high complexity, and low design flexibility.

[0004] The combination of computer-aided design (CAD) and three-dimensional printing (3DP) allows the fabrication of a wide range of complex shapes by a layer-by-layer manufacturing process. Despite the greater design flexibility and superior processing power of 3DP, the technology has not reached its full potential in terms of forming 3D metal-plastic structures due to the limited materials that can be utilized. To address this issue, researchers have focused on combining 3DP with metallization techniques to create conductive structures. Some studies have attempted to replace 3D metal-plastic structures used in fields such as electronics with various conductive materials, including metal nanoparticles, graphene, multi-walled carbon nanotubes, and carbon black. These substances are often used as conductive fillers to obtain modified materials applicable to 3DP. Although several types of microstructured circuits have been successfully fabricated using this technique, these fillers are usually expensive and the modified materials tend to show reduced printing accuracy and performance after molding. Furthermore, the complex preparation process associated with this technology tends to result in slow method development. In contrast, most studies have investigated the metallization of 3D printed parts by electroplating (EP), electroless plating (ELP), vacuum deposition (VE) and sputtering. In this way, complex 3D printed structures with surfaces with metallic properties have been obtained. Among these methods, ELP is the most cost-effective technique for the deposition of metals onto non-metallic structures. ELP is based on simple wet chemical processing and allows the deposition of a uniform metal coating on the surface of the part without the application of an external potential. However, although many researchers have used 3DP and ELP to fabricate microstructures with specific functions, most of these parts do not meet the complex topological requirements of 3D metal-plastic parts that are intended to act as non-conductive or conductive substrates. For this reason, the multi-material 3DP (MM3DP) technique has been proposed as a means to achieve pattern-selective ELP. With the use of MM3DP, materials with special functions can be applied anywhere on the part to form interconnected 3D patterns that can be used to launch the ELP process.An activation / sensitization pretreatment is necessary before ELP can be performed, and this necessity has been exploited to achieve patterned plating. The simplest approach to this process is to roughen specific areas on the material surface by creating microstructures. This technique exploits the change in the capacity of the roughened surface to adsorb an activation / sensitization palladium (Pd) catalyst that induces the subsequent ELP reaction. However, although selective metallization can be achieved in this way, the resulting precision and resolution are still not satisfactory. As a result, some researchers have developed a method for the generation of structures with opposite charges, called activated Pd. 2+ and Ag + Materials have been prepared that have electrode properties that allow for more precise adsorption of the seeds. This method improves plating accuracy to some extent, although the electrode area may react with ions in the processing solution when ELP is performed. In contrast to these indirect activation routes, other methods use Pd 2+ and Ag + Activation seeds, including ions such as ZnO, are added directly to the material to fabricate metal-plastic composite structures. Unfortunately, problems associated with activator dispersion in the material limit the application of this technique to only a few 3DP processes. Furthermore, the quality of the resulting coating is insufficient, as is the adhesion of the plated metal to the substrate material. Thus, challenges remain regarding the fabrication of metallized parts with complex structures combined with high precision and performance. Overview

[0005]

[0005] Various embodiments may provide an additive manufacturing system for forming a composite structure. The system may include a first pool containing or configured to contain an activating solution or mixture for forming a first printed portion of the workpiece, the activating solution or mixture including a solvent, an activating seed soluble in the solvent, and a photocurable resin. The system may also include a second pool containing or configured to contain an additional photocurable resin for forming a second printed portion of the workpiece. The system may further include a light source configured to provide light. The system may further include a mask configured to be positioned such that the light provided by the light source is irradiated through the mask onto the workpiece. The system may also include a third pool containing or configured to contain a cleaning solution or mixture for cleaning the workpiece. The first printed portion including the activating seed may be configured to form a metal layer by an electroless deposition process, thereby forming the composite structure.

[0006]

[0006] Various embodiments may provide a method of forming an additive manufacturing system for forming a composite structure. The method may include providing a first pool containing or configured to contain an activating solution or mixture for forming a first printed portion of the workpiece, the activating solution or mixture including a solvent, an activating seed soluble in the solvent, and a photocurable resin. The method may also include providing a second pool containing or configured to contain an additional photocurable resin for forming a second printed portion of the workpiece. The method may further include providing a light source configured to provide light. The method may further include providing or positioning a mask such that the light provided by the light source is irradiated through the mask onto the workpiece. The method may also include providing a third pool containing or configured to contain a cleaning solution or mixture for cleaning the workpiece. The first printed portion including the activating seed is configured to form a metal layer by an electroless deposition process, thereby forming the composite structure.

[0007]

[0007] Various embodiments may provide a method of forming a composite structure. The method may include depositing an activation solution or mixture including a solvent, an activation seed soluble in the solvent, and a photocurable resin to form a first printed portion of the workpiece. The method may also include depositing additional photocurable resin to form a second printed portion of the workpiece. The method may further include irradiating the workpiece with light provided by the light source through a mask. The method may also include dispensing a cleaning solution or mixture for cleaning the workpiece. The method may further include forming a metal layer on the first printed portion by an electroless plating process due to the activation seed included in the first printed portion, thereby forming the composite structure.

[0008]

[0008] The present invention will be better understood with reference to the detailed description, taken in conjunction with the non-limiting examples and the accompanying drawings, in which: [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 illustrates an overall view of an additive manufacturing system for forming a composite structure, according to various embodiments. [Diagram 2] 1 illustrates an overall view of a method for forming an additive manufacturing system for forming a composite structure. [Diagram 3] 1 illustrates an overall view of a method for forming a composite structure according to various embodiments. [Figure 4] FIG. 1 is a schematic diagram illustrating a multi-material digital light processing three-dimensional printing (MM-DLP3DP) process according to various embodiments. [Diagram 5] 1 illustrates (a) a multi-material digital light processing three-dimensional printing (MM-DLP3DP) apparatus according to various embodiments, and (b) numerical processing of a multi-material model where slicing data is obtained by treating different material topologies within the same part as units with separate slicing according to various embodiments. [Figure 6]1A-1C are schematic diagrams illustrating an arbitrarily complex multi-material model and a printing process for printing the model, according to various embodiments. [Figure 7] 1A shows a plot of absorbance as a function of wavelength (in nanometers or nm) illustrating the ultraviolet spectrum of a rigid photocurable resin before and after modification with palladium (Pd2+) ions according to various embodiments, and (b) a plot of absorbance as a function of wavelength (in nanometers or nm) illustrating the ultraviolet spectrum of a flexible photocurable resin before and after modification with palladium (Pd2+) ions according to various embodiments. [Figure 8] 14 illustrates (a) three microstructured metallized surfaces, each having a thickness of 200 μm, namely a circle with a radius of 200 μm, a regular hexagon with an inner circle radius of 200 μm, and a circular groove with a groove width of 400 μm, using processes according to various embodiments; (b) a skeletonized ball structure with a circular base covered with Ni metal using processes according to various embodiments; (c) an Eiffel Tower with a microstructure in which selected portions are uniformly covered with nickel (Ni) plating using processes according to various embodiments; (d) a five-sided structure with complex nickel (Ni) metal distribution and multi-material nesting between and within layers using processes according to various embodiments; (e) a dome structure with arc-shaped metal distribution using processes according to various embodiments; and (f) construction and metallization of small structures in a resin. (g) a double-layered 3D hollow nested part, i.e., a large sphere (radius 15 mm) with a triangular hollow hole encases a small sphere (radius 8 mm) with a regular hexagonal hollow hole, on which nickel (Ni) has been selectively deposited using a process according to various embodiments; (h) a flexible carbon nanotube structure with selective three-dimensional (3D) metallization using a process according to various embodiments that shows no fracture after deformation; and (i) a wearable structure formed by a process according to various embodiments with nickel (Ni) plating that remains tightly bonded to a flexible substrate after complex shape and deformation. [Figure 9]1 illustrates (a) a light emitting diode (LED) stereo circuit having a complex nickel (Ni) metal wire topology using processes according to various embodiments; (b) a dual layer three dimensional (3D) circuit structure having a complex three dimensional (3D) copper wire structure using processes according to various embodiments, which is difficult to fabricate using conventional processes; and (c) a plot of impedance (in ohms or Ω) as a function of frequency (in hertz or Hz) showing the impedance of nickel (Ni) and copper (Cu) coatings formed using processes according to various embodiments. [Figure 10] (a) Nickel (Ni) plated structures with widths of 1 mm, 500 μm, and 100 μm, and widths of 50 μm and 40 μm formed by processes according to various embodiments, and (b) circuit board components with widths of 1 mm incorporating 500 μm copper wires formed by processes according to various embodiments. FIG. 10(a) shows images of Ni wires with widths of 1 mm, 500 μm, 100 μm, 50 μm, and 40 μm. High magnification microscopy shows that Ni is precisely distributed on these active precursor wires, thus demonstrating the exceptional resolution and selective metal deposition effectiveness of the printing method. The Cu plating on the circuit board shown in FIG. 10(b) shows that various embodiments can provide a manufacturing resolution of at least 40 μm, sufficient to meet the processing requirements of most electronic products. [Figure 11]1 shows (a) a standard flat nickel (Ni) plating according to various embodiments, (b), (c) scanning electron microscope (SEM) images of the area shown in (a) at different magnifications according to various embodiments, (d) nickel (Ni) plating on the surface of a circular microstructure according to various embodiments, (e), (f) scanning electron microscope (SEM) images of the area shown in (d) at different magnifications according to various embodiments, (g) nickel (Ni) plating on the surface of annular groove microstructure according to various embodiments, (h), (i) scanning electron microscope (SEM) images of the area shown in (g) at different magnifications according to various embodiments, (j) nickel (Ni) plating on the surface of a regular hexagonal microstructure according to various embodiments, (k)-(l) scanning electron microscope (SEM) images of the area shown in (j) at different magnifications according to various embodiments, (m) a flexible sample having nickel (Ni) plating, and (n)-(o) scanning electron microscope (SEM) images of the area shown in (m) at different magnifications according to various embodiments. [Figure 12] 1A-1D show cross-sectional transmission electron microscopy (TEM) images showing resin, bond and nickel layers of a composite structure according to various embodiments (a), (b) energy dispersive X-ray spectroscopy (EDS) images showing iron distribution according to various embodiments (c) energy dispersive X-ray spectroscopy (EDS) images showing palladium distribution according to various embodiments (d) energy dispersive X-ray spectroscopy (EDS) images showing nickel distribution according to various embodiments. [Figure 13]1 shows (a) a schematic diagram of a three-dimensional (3D) printed integrated strain gauge according to various embodiments on a measured object; (b) images of strain gauges according to various embodiments and schematic diagrams of strain gauge measurements according to various embodiments; (c) images showing the bending deformation of the gauge under stress according to various embodiments; (d) plots of voltage (in volts or V) as a function of load (in grams or g) showing voltage measurement characteristics of strain gauges according to various embodiments; (e) plots of strain as a function of load (in grams or g) showing strain characteristics of strain gauges according to various embodiments calculated from experimental data; and (f) plots of deformation (in millimeters or mm) as a function of load (in grams or g) showing experimental deformation data of strain gauges according to various embodiments. [Figure 14] 1A-1D show (a) a schematic illustrating the operating principle of a three-dimensional (3D) printed piezoelectric sensor according to various embodiments; (b) images showing a piezoelectric sensor according to various embodiments being bent at bend angles of 30°, 60°, 90°, and 120°; (c) plots of voltage (in volts or V) as a function of time (in seconds or s) illustrating voltage waveforms generated by a piezoelectric sensor according to various embodiments at 30°, 60°, 90°, and 120°; and (d) plots of voltage (in volts or V) as a function of deformation (in nanometers or nm) illustrating the voltage generated by a piezoelectric sensor in tension as a function of deformation according to various embodiments. [Figure 15] 1A-1D show (a) a schematic diagram illustrating a measurement system including three-dimensional (3D) electrocardiogram (ECG) electrodes formed in accordance with various embodiments; (b) images illustrating device components of a system including electrodes formed in accordance with various embodiments; (c) plots illustrating five electrocardiogram (ECG) signals measured by electrodes formed in accordance with various embodiments based on random measurements of a stationary subject; and (d) plots illustrating electrocardiogram (ECG) signals measured by electrodes formed in accordance with various embodiments based on measurements while the subject was swinging his arms, clicking a computer mouse, and writing. Detailed Description

[0010]

[0009] The following detailed description refers to the accompanying drawings which show, by way of example, specific details and embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. Other embodiments may be utilized and structural and logical changes may be made without departing from the scope of the present invention. Various embodiments are not necessarily mutually exclusive, as some embodiments may be combined with one or more other embodiments to form new embodiments.

[0011]

[0010] An embodiment described in the context of one of the present methods or additive manufacturing systems is equally valid for the other methods or additive manufacturing systems, and similarly, an embodiment described in the context of the method is equally valid for the system, and vice versa.

[0012]

[0011] Features described in the context of one embodiment may be applicable to the same or similar features of other embodiments. Features described in the context of one embodiment may be applicable to other embodiments even if they are not explicitly described in these other embodiments. Furthermore, additions and / or combinations and / or alternatives to features described in the context of one embodiment may be applicable to the same or similar features of the other embodiments.

[0013]

[0012] In the context of the various embodiments, the articles "a," "an," and "the" used in reference to a feature or element include a reference to one or more than one feature or element.

[0014]

[0013] In the context of various embodiments, the term "about" or "approximately" applied to a numerical value encompasses the exact value and a reasonable variance.

[0015] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0016] Various embodiments may relate to a simple means of fabricating metal-plastic functional devices with complex geometries based on a multi-material digital light processing 3DP (MM-DLP3DP) process. This technique may enable the fabrication of microstructures that contain active precursors and substrate materials with specific 3D spatial distributions that can selectively activate ELP. The active precursors are Pd 2+ They can be prepared by adding saturated aqueous solutions of ions to water-washable photocurable resins (either rigid or flexible). Subsequently, complex microstructures with specific topological distributions of material properties (including combinations of standard resins and active precursors) can be fabricated using a MM-DLP3DP machine equipped with multiple workstations. After a simple washing process, the materials are directly plated and metallized with 3D patterns using ELP. Pd 2+ The ions could be uniformly dispersed throughout the active precursor, and the photoinitiator generated free radicals by irradiating the treated resin with patterned UV light. These radicals reacted with the monomer and the Pd 2+ The ions can initiate a double bond crosslinking reaction between the low molecular weight polymers that produce a rigid, hardened structure embedded in the material. In the plating bath, the Pd exposed on the surface of the material 2+ The ions could be reduced to Pd by NaH2PO2 and act as catalytic nuclei after forming Pd particles, which then induced the target metal deposition. This method could produce a bonding layer in which the deposited metal is microscopically embedded in the plastic layer. This technique could simplify the manufacturing process and reduce costs while providing the ability to produce a variety of complex 3D structures with specialized metal patterns.

[0017]

[0016] Figure 1 shows an overall view of an additive manufacturing system according to various embodiments for forming a composite structure. The system may include a first pool 102 that includes or is configured to include an active solution or mixture for forming a first printed portion of the workpiece, the active solution or mixture including a solvent, an activation seed soluble in the solvent, and a photocurable resin. The system may also include a second pool 104 that includes or is configured to include an additional photocurable resin for forming a second printed portion of the workpiece. The system may further include a light source 106 configured to provide light. The system may further include a mask 108 configured to be positioned such that the light provided by the light source 106 is irradiated onto the workpiece through the mask. The system may also include a third pool 110 that includes or is configured to include a cleaning solution or mixture for cleaning the workpiece. The first printed portion including the activation seed may be configured to form a metal layer by an electroless deposition process, thereby forming a composite structure.

[0018] In other words, the additive manufacturing system may include a first pool 102, a second pool 104, and a third pool 110 for storing the active solution or mixture, the additional photocurable resin, and the cleaning solution or mixture, respectively. The additive manufacturing system may also include a light source 106 and a mask 108.

[0019]

[0018] For the avoidance of doubt, FIG. 1 is intended to illustrate an additive manufacturing system having certain features according to various embodiments, and is not intended to limit the placement, size, shape, orientation, etc. of the features.

[0020] In various embodiments, the activating seed can be a catalyst or a catalyst precursor. The catalyst precursor can include metal ions, such as palladium ions or silver ions. The catalyst can include a metal, such as palladium metal or silver metal.

[0021] In various embodiments, the photocurable resin and the further photocurable resin may be made of the same material. In various other embodiments, the photocurable resin and the further photocurable resin may be made of different materials.

[0022] Generally speaking, the light can be any light capable of curing the photocurable resin and the further photocurable resin. The light source 106 may be selected based on the ability of the light emitted by the light source 106 to cure the resin. In various embodiments, the light can be ultraviolet light or visible light. However, in various other embodiments, the light can be any other light capable of curing the photocurable resin and the further photocurable resin.

[0023]

[0022] The mask 108 may be any suitable mask. The mask 108 may be configured to pass light to illuminate certain portions of the first printed portion and / or the second printed portion while blocking the light from illuminating other portions, thereby forming a masking pattern. For example, the mask 108 may be a liquid crystal display (LCD) mask.

[0024]

[0023] In various embodiments, the additive manufacturing system may also include a controller electrically connected to the first pool 102, the second pool 104, the third pool 110, the light source 106, and the mask 108.

[0025]

[0024] Various embodiments may relate to printing using a multi-material nested topology. In various embodiments, the controller may be configured to control the first pool 102 to deposit an active solution or mixture at a predetermined location on the substrate or underlayer to form a first printed portion. The controller may be configured to control the mask 108 to generate a first masking pattern or to position or arrange the mask 108 having the first masking pattern. The controller may be further configured to control the light source 106 to irradiate the first printed portion with light through the first masking pattern, thereby curing at least one slice of the first printed portion. The controller may be further configured to control the third pool 110 to dispense a cleaning solution or mixture for cleaning the first printed portion and removing residual uncured slices of the first printed portion. The controller may also be configured to control the second pool 104 to deposit additional photocurable resin at another predetermined location on the substrate or underlayer to form a second printed portion. The controller may also be configured to control the mask 108 to generate a second masking pattern or to position or place an additional mask having a second masking pattern. The controller may also be configured to control the light source 106 to irradiate the second printed portion with light through the second masking pattern, thereby curing at least one slice of the second printed portion. The controller may further be configured to control the third pool 110 to dispense a cleaning solution or mixture for cleaning the second printed portion and removing residual uncured slices of the second printed portion.

[0026]

[0025] Various embodiments may relate to printing using an inter-layer multi-material stacking topology. In various embodiments, the controller may be configured to control the first pool 102 to deposit an active solution or mixture on the substrate or underlayer to form a first printed part. The controller may be configured to control the mask 108 to generate a first masking pattern or to position or arrange a mask having a first masking pattern. The controller may be further configured to control the light source 106 to irradiate the first printed part with light through the first masking pattern, thereby curing at least one slice of the first printed part, the cured slice of the first printed part forming a first layer. The controller may be further configured to control the third pool 110 to dispense a cleaning solution or mixture for cleaning the first printed part and removing residual uncured slices of the first printed part. The controller may also be configured to control the second pool 104 to deposit additional photocurable resin on the cured slice of the first printed part to form a second printed part. The controller may also be configured to control the mask 108 to generate a second masking pattern or to position or place an additional mask having a second masking pattern. The controller may further be configured to control the light source 106 to irradiate the second printed portion with light through the second masking pattern, thereby curing at least one slice of the second printed portion, the cured slice of the second printed portion forming a second layer on the first layer. The controller may also be further configured to control the third pool 110 to dispense a cleaning solution or mixture for cleaning the first printed portion and the second printed portion, and to remove residual uncured slices of the second printed portion.

[0027] In various embodiments, the additive manufacturing system may also include one or more additional pools containing a cleaning solution or mixture for cleaning the workpiece. The cleaning solution or mixture may be a liquid including water, alcohol, and / or acid. The cleaning solution or mixture may include, for example, ethanol, acetone, and sulfuric acid. The cleaning solution or mixture may be configured to clean the substrate and / or the printed part. Furthermore, the cleaning solution or mixture may be further configured to remove uncured resin. In various embodiments, the first pool 102, the second pool 104, the third pool 110, and the one or more additional pools may each be a container or tank.

[0028] In various embodiments, the additive manufacturing system may include a printer including a first pool 102, a second pool 104, and a third pool 110. The printer may also include one or more additional pools that contain or are configured to contain a cleaning solution or mixture. The printer may also include a light source 106, a mask 108, and / or a controller. The printer may also be referred to as a multi-material digital light processing three-dimensional printing (MM-DLP3DP) device.

[0029]

[0028] In various embodiments, the additive manufacturing system may include a plating bath for forming a metal layer by an electroless plating process. The plating bath may be a stand-alone component or may be included in a fourth pool of the printer. In other words, the plating bath may be integrated with the printer or may be separate from the 3D printer.

[0030] In various embodiments, the metal layer may include a metal or a metal alloy. For example, the metal layer may include nickel metal, copper metal, gold metal, cobalt metal, silver metal, platinum metal, or an alloy including any combination thereof.

[0031] In various embodiments, a metal layer may be formed on or over the first printed portion. In various embodiments, a bonding layer may be formed between the metal layer and the first printed portion. The bonding layer may be formed by interaction or diffusion between a metal or metal alloy of the metal layer and an active solution or mixture contained in a material contained in the first printed portion. In various embodiments, the composite structure may be a strain gauge, a piezoelectric sensor, or an electrocardiogram (ECG) electrode.

[0032]

[0031] Figure 2 shows an overall view of a method of forming an additive manufacturing system for forming a composite structure. The method may include, at 202, providing a first pool that includes or is configured to include an activating solution or mixture for forming a first printed portion of the workpiece, the activating solution or mixture including a solvent, an activating seed soluble in the solvent, and a photocurable resin. The method may also include, at 204, providing a second pool that includes or is configured to include an additional photocurable resin for forming a second printed portion of the workpiece. The method may further include, at 206, providing a light source configured to provide light. The method may further include, at 208, providing or positioning a mask such that the light provided by the light source is irradiated through the mask onto the workpiece. The method may also include, at 210, providing a third pool that includes or is configured to include a cleaning solution or mixture for cleaning the workpiece. The first printed portion including the activating seed is configured to form a metal layer by an electroless deposition process, thereby forming a composite structure.

[0033] In other words, the method may include providing a first pool, a second pool, and a third pool, as well as a mask and a light source.

[0034]

[0033] For the avoidance of doubt, Figure 2 is not intended to limit the order of the various steps. For example, step 202 may be performed before, during, or after step 204.

[0035] In various embodiments, the method may include providing or forming a controller in electrical communication with the first pool, the second pool, the third pool, the light source, and the mask. The method may include electrically connecting the controller to the first pool, the second pool, the third pool, the light source, and the mask.

[0036] In various embodiments, the method may also include providing one or more additional pools containing a cleaning solution or mixture for cleaning the workpiece.

[0037]

[0036] The first pool, the second pool, and the third pool may be part of a printer. The printer may also include a light source, a mask, and / or a controller. The printer may also include one or more additional pools containing a cleaning solution or mixture.

[0038]

[0037] In various embodiments, the method may further include providing a plating bath for forming the metal layer by an electroless plating process. The plating bath may be a stand-alone component or may be included in a fourth pool of the printer. In other words, the plating bath may be integrated with the printer or may be separate from the printer.

[0039]

[0038] Figure 3 shows an overall view of a method for forming a composite structure according to various embodiments. The method may include, at 302, depositing an activation solution or mixture to form a first printed portion of the workpiece, the activation solution including a solvent, an activation seed soluble in the solvent, and a photocurable resin. The method may also include, at 304, depositing an additional photocurable resin to form a second printed portion of the workpiece. The method may further include, at 306, irradiating the workpiece with light provided by a light source through a mask. The method may also include, at 308, dispensing a cleaning solution or mixture for cleaning the workpiece. The method may further include, at 310, forming a metal layer on the first printed portion by an electroless plating process due to the activation seed included in the first printed portion, thereby forming a composite structure.

[0040]

[0039] For the avoidance of doubt, Figure 3 is not intended to limit the order of the various steps. For example, step 302 may occur before, during, or after step 304.

[0041] In various embodiments, the activating seed can be a catalyst or a catalyst precursor.

[0042] In various embodiments, the photocurable resin and the further photocurable resin may be made of the same material. In various other embodiments, the photocurable resin and the further photocurable resin may be made of different materials.

[0043] In various embodiments, the light can be any light capable of curing the photocurable resin and the further photocurable resin, such as ultraviolet light or visible light.

[0044] In various embodiments, the mask may be any suitable mask, such as a liquid crystal display (LCD) mask.

[0045]

[0044] Various embodiments may relate to printing using a multi-material nested topology. In various embodiments, an active solution or mixture may be deposited at a predetermined location on a substrate or underlayer to form a first printed portion. The method may include using a mask to generate a first masking pattern or placing or positioning a mask having a first masking pattern. Light may be irradiated through the first masking pattern onto the first printed portion, thereby curing at least one slice of the first printed portion. A cleaning solution or mixture may be dispensed to clean the first printed portion and remove residual uncured slices of the first printed portion. Additional photocurable resin may be deposited at another predetermined location on the substrate or underlayer to form a second printed portion. The method may include using a mask to generate a second masking pattern or placing or positioning a further mask having a second masking pattern. Light may be irradiated through the second masking pattern onto the second printed portion, thereby curing at least one slice of the second printed portion. A cleaning solution or mixture may be dispensed to clean the second printed portion and remove any residual uncured slices of the second printed portion.

[0046]

[0045] Various embodiments may relate to printing using an interlayer multi-material stacking topology. In various embodiments, an active solution or mixture may be deposited on a substrate or underlayer to form a first printed portion. The method may include using a mask to generate a first masking pattern or placing or positioning a mask having a first masking pattern. Light may be irradiated onto the first printed portion through the first masking pattern, thereby curing at least one slice of the first printed portion, the cured slice of the first printed portion forming a first layer. A cleaning solution or mixture may be dispensed to clean the first printed portion and remove residual uncured slices of the first printed portion. Additional photocurable resin may be deposited on the cured slice of the first printed portion to form a second printed portion. The method may also include using a mask to generate a second masking pattern or placing or positioning an additional mask having a second masking pattern. Light can be applied to the second printed portion through a second masking pattern, thereby curing at least one slice of the second printed portion, the cured slice of the second printed portion forming a second layer on the first layer. A cleaning solution or mixture can be dispensed to clean the first printed portion and the second printed portion and remove any residual uncured slice of the second printed portion.

[0047] In various embodiments, the cleaning solution or mixture may include water, an alcohol and an acid.

[0048] In various embodiments, the electroless plating process may be carried out by immersing the workpiece in a plating bath.

[0049] In various embodiments, the metal layer may include a metal or a metal alloy.

[0050] In various embodiments, a metal layer may be formed on or over the first printed portion. In various embodiments, a bonding layer may be formed between the metal layer and the first printed portion. The bonding layer may be formed by interaction or diffusion between a metal or metal alloy of the metal layer and an active solution or mixture contained in a material contained in the first printed portion.

[0051] Preparation of active precursors

[0052] As mentioned above, the techniques described herein can enable the indirect fabrication of metal-plastic composite structures by selective three-dimensional (3D) deposition of active precursors that subsequently promote electroless plating (ELP) reactions. By adding activated seeds to standard photocurable resins, precursors that exhibit high catalytic activity and positive stability were obtained.

[0053]

[0052] Photocurable resins can be modified by incorporating nanopowders, usually with certain desired properties, as fillers, together with dispersants that ensure uniform distribution of these fillers. However, modified resins prepared in this way have been found to be less stable, as the fillers are prone to settling out and the material ends up being non-uniform. Furthermore, the dispersants required for different fillers may be incompatible and may degrade the physical properties of the original substrate material. To alleviate these problems, various embodiments can take advantage of the ability of certain water-washable photocurable resins to form homogeneous mixtures with aqueous solutions at low concentrations (less than 10%). By adding an aqueous solution containing activating seeds directly to the resin, a stable activated precursor can be obtained that is well mixed after thorough stirring.

[0054] Palladium (Pd 2+ ) ions can provide excellent catalytic activity during ELP and are often used as activation seeds. Various embodiments described herein use chloride (Cl) ions by using an activation solution containing PdCl2 powder and NH4Cl. - ) ions in an aqueous solution containing Pd 2+The activation method may be based on the solubility of metal ions such as ions. The activated precursor can be obtained by uniformly mixing the activation solution with various resins. This method may be simple and versatile, and may be applicable to most polyurethane-based resins.

[0055] Crystalline NH4Cl was purchased from FUJIFILM Wako Pure Chemical Industries, Ltd., PdCl2 nanopowder (purity 99.0%) was obtained from Kanto Chemical Co., Ltd., White rigid (washable, 405 nm, ASIN: JP206000BK510), green transparent rigid (405 nm, ASIN: B07CQF6QNM), acrylic (405 nm, model: PMMA-like, ASIN: B07SKCNMZX), dark gray flexible (405 nm, model: SK01F, ASIN: B08T929XVW) and light gray flexible light-cured resins (405 nm, model: SK02F, ASIN: B08T929RXB) were obtained from Nova Robot Technology Co., Ltd., Elegoo Co., Ltd., eSun Co., Ltd., Siraya Tech Co.,Ltd. and Nippon SK Honpo Business Division, respectively. These resins are designated as resins #1 to #5. Each activated precursor was prepared at room temperature (20°C) by dissolving 3.7 g of NH4Cl in 10 ml of deionized water, to which 50 mg of PdCl2 was added and dissolved with stirring. This resulted in 10 ml of saturated activated solution. The solution was left to stand for a while, after which a 5 ml portion of the upper clear part of the solution was removed. A 45 ml quantity of one of the light-cured resins was then transferred to a vessel equipped with a magnetic stirrer rotating at 1000 revolutions per minute (rpm) and 5 ml of the activated solution was added dropwise. After this addition, the mixture was stirred at 1200 rpm for an additional 30 minutes to obtain 50 ml of activated precursor solution.

[0056]

[0055] Fabrication of multi-material nested complex structures using MM-DLP3DP

[0057]

[0056] Compared with direct-write 3DP (DW3DP) and fused deposition modeling 3DP (FDM3DP), DLP3DP can enable surface molding with higher resolution, resulting in parts with smoother surfaces, higher molding accuracy and fill rate.

[0058] 4 is a schematic diagram illustrating a multi-material digital light processing three-dimensional printing (MM-DLP3DP) process according to various embodiments, during which 3DP of a standard resin (which serves as a substrate) and an active solution containing active precursors can form a part with a desired 3D topology.

[0059] After washing and drying, the surface with exposed active precursors can exhibit catalytic activity. During the subsequent ELP process, the catalytic ions (e.g., Pd 2+ ) ions can facilitate the deposition of metal particles from solution, allowing selective deposition to occur to form desired metal patterns.

[0060]

[0059] Figure 5 illustrates (a) a multi-material digital light processing three-dimensional printing (MM-DLP3DP) apparatus according to various embodiments, and (b) numerical processing of a multi-material model in which slicing data is obtained by treating different material topologies within the same part as units with separate slicing according to various embodiments.

[0061] To enable the production of multi-material 3D printed parts containing both standard resins and active precursors, a MM-DLP3DP device can be developed that incorporates three stations or pools, as shown in FIG. 5(a). The apparatus can include a printer platform. The printing platform can select from three pools (called material pool A, material pool B, and a wash pool), and the printing platform can move in both the x- and y-directions to switch between different pools to form the workpiece. By dipping into the different pools, the initial layers of the workpiece can be formed adhered to the printing platform or suspended from the printing platform. Material pools A, B, and the wash pool hold standard light-curable resin, active precursor, and wash solution or mixture, respectively. The partially formed workpiece can be held or suspended by the printing platform using adhesion, and the remaining layers of the workpiece can be formed by successively switching and dipping into the various pools.

[0062]

[0061] The right diagram of Fig. 5(a) summarizes the structural features of the printer. To ensure sufficient forming accuracy and resolution, a 2K black and white liquid crystal display (LCD) mask can be used to provide transmissive graphics masking. Ultraviolet (UV) light at 405 nm was passed through the mask to form a light field associated with a specific slice pattern, thus enabling layered curing and forming of the part. The LCD mask may be capable of moving in the x and y directions together along the printer's z axis.

[0063]

[0062] The entire 3D printed workpiece can be moved as one piece, thus enabling material switching and ensuring that different material topologies in the same part have precise intervening relationships. Although there is currently no mature multi-material slicing software program that allows labeling of material properties in relation to a specific complex topology, obtaining digital model data of the multi-material part can be an important first step. In various embodiments, this problem can be addressed by using a modeling-assembly-disassembly-slicing method to assist in the numerical processing of the multi-material model (FIG. 5(b)). In this process, topologies with the same physical properties can be created as a single unit and then converted to a standard template library (STL) format. The slicing software can assemble units with different properties according to the desired topological relationships, and then slice these parts separately to obtain their respective slice data. If the different parts have a defined positional relationship in the part coordinate system, the slice data of the different materials can incorporate the required topological relationships. Various embodiments can use control software specially developed for slice data processing, setting print parameters, and controlling the MM-DLP3DP system. The fabrication of multi-material parts with 3D active precursors may be possible by performing a series of cycles of applying material A, followed by washing, followed by applying material B.

[0064] FIG. 6 is a schematic diagram showing an arbitrary complex multi-material model and a printing process for printing the model according to various embodiments. As shown in FIG. 6, each multi-material part with an arbitrary complex structure can be analyzed in terms of different material topologies, regardless of its structural characteristics. This analysis can include both inter-layer multi-material stacking topologies and multi-material nesting topologies. In the former case, various materials can be nested between layers, thus eliminating the need for the printer to perform cleaning and material switching processes on each slice. However, when processing the latter topology, the printer had to cycle through printing material A, printing material B, and cleaning processes for each slice. Since all materials used in the parts have the above-mentioned topological characteristics, various embodiments can enable the fabrication of various complex parts, but it should be noted that the fabrication of certain components requires the assistance of support structures. A multi-material model of an arbitrary complex structure can be divided into inter-layer multi-material stacking topologies and multi-material nesting topologies according to the desired distribution of material topologies.

[0065] Selective 3D Metallization Using ELP

[0066] During processing, the printed part may be firmly attached to the printing platform, which may leave a small amount of metal residue at the base of the part after removal, since the platform is made of metal. This residue may promote nickel (Ni) deposition, thus reducing the accuracy of subsequent selective ELP and disrupting the metal distribution pattern. Furthermore, the uncured resin remaining on the surface of the part may cause the Pd 2+ions and thus affect the catalytic activity of the active precursor during plating. For these reasons, it was essential to clean the parts after 3DP. In various embodiments, the cleaning solution can consist of 40% ethanol (analytical pure), 50% acetone (analytical pure) and 10% dilute sulfuric acid (40% by weight) by volume. The alcohol and acetone in this mixture can dissolve the uncured resin on the part surface (both the standard resin substrate and the active precursor), while the sulfuric acid can remove the residual metal powder adhered to the bottom of the part.

[0067] Unlike the ELP processes used in other studies, various embodiments may not require roughening or sensitization of the cleaned finished parts. As a result, the cleaned and dried parts can be directly immersed in the plating bath.

[0068] The Ni plating bath used in this process may have the main components summarized in Table 1. [Table 1]

[0069] The plating bath may have a pH of 9 and may be maintained at 70° C. Within each printed multi-material part, the active precursor (Pd 2+ The Pd ions are uniformly distributed on the resin substrate in a specific 3D topology. When the part is immersed in the bath, the exposed Pd 2+ The ions can first be reduced to Pd monomers that act as catalytically active metal nuclei to initiate the ELP reaction at specific microscopic regions and thus achieve the targeted Ni metal deposition.

[0070]

[0069] The reaction can be explained by the following equations (1) to (4).

number

number

number

number

[0071] The reactions shown in equations (1)-(4) may involve a mechanism whereby reactive precursors catalyze the directional deposition of Ni metal. In this process, hypophosphite may be oxidized in solution to produce hydrogen atoms that are adsorbed on the surface of the substrate. Immediately after, these hydrogen atoms may reduce Ni ions in solution. Once the hydrogen atoms are adsorbed on the substrate surface, the reduced Ni may spontaneously deposit on the same surface to form a coating after 5-10 minutes. Furthermore, Pd 2+ Since the ions are embedded on the surface of the active precursor part of the part, there may be no overflow or uneven deposition of the plating layer due to the migration of the catalyst during the ELP process. Since no time-consuming pretreatment of the part surface is required, the original surface morphology can be maintained, and therefore a more accurate plating pattern can be obtained.

[0072]

[0071] Properties of reactive precursors in combination with commercially available photocurable resins

[0073] After modification, resin #1 changed from its original white color to a pale yellow color. This uniform distribution of coloration is due to the presence of Pd 2+ The results showed that the ions were uniformly distributed throughout the material. Similarly, the #5 resin changed color from gray to yellowish gray. After standing for 3 days, none of the materials showed any precipitation, indicating the high stability of these precursors.

[0074] FIG. 7 shows (a) a graph of the palladium (Pd 2+ FIG. 1 is a plot of absorption as a function of wavelength (in nanometers or nm) showing the ultraviolet spectra of a rigid photocurable resin before and after modification with palladium (Pd) ions, according to various embodiments; and2+ 1 shows a plot of absorption as a function of wavelength (in nanometers or nm) showing the ultraviolet spectra of a flexible photocurable resin before and after modification with .alpha.-(CH 2 ) ions.

[0075] FIG. 7(a) shows the UV absorption spectra obtained from the #1 resin before and after modification. Both spectra are essentially identical, with a peak absorbance at approximately 405 nm. These results indicate that Pd 2+ It can be demonstrated that the addition of the solution does not change the basic properties of the resin, especially the molding properties, and does not reduce the photosensitivity of the original resin. Similar results were obtained from the analysis of #4 resin before and after modification, as shown in Figure 7(b).

[0076]

[0075] Complex 3D metal-plastic composite structures

[0077]

[0076] Circuit boards are traditionally made from flat modules or combinations of multiple flat modules such that the processing surface is a 2D plane or a combination of such planes. These structures are relatively simple, so the manufacturing process is not complicated but the applications are limited. The demand for more structurally complex parts with regular cylindrical or free-form processing surfaces requires improved manufacturing capabilities. To illustrate the manufacturing capabilities of our new approach, metal-plastic composite parts with representative structures were fabricated and then processed by ELP. Compared to multi-material 3DP using multiple nozzles, the technique presented here can provide higher resolution and therefore enable the construction of microstructured surfaces with specialized functions. This can be important because metallized microstructured surfaces have numerous potential applications.

[0078] FIG. 8 illustrates (a) three microstructured metallized surfaces, each having a thickness of 200 μm, namely, a circle with a radius of 200 μm, a regular hexagon with an inner circle radius of 200 μm, and a circular groove with a groove width of 400 μm, using processes according to various embodiments; (b) a skeletonized ball structure with a circular base covered with Ni metal using processes according to various embodiments; (c) an Eiffel Tower having a microstructure in which selected portions are uniformly covered with nickel (Ni) plating using processes according to various embodiments; (d) a five-sided structure with complex nickel (Ni) metal distribution and multi-material nesting between and within layers using processes according to various embodiments; (e) a dome structure with arc-shaped metal distribution using processes according to various embodiments; (f) construction of small structures in resin and 8 shows a U-shaped tube with a 1 mm thick internal metal mesh, each with a regular hexagon with an inner diameter of 500 μm, using a process according to various embodiments, (g) a double-layered 3D hollow nesting part, i.e., a large sphere (15 mm radius) with a triangular hollow hole enveloping a small sphere (8 mm radius) with a regular hexagonal hollow hole, with nickel (Ni) selectively deposited using a process according to various embodiments, (h) a flexible carbon nanotube structure with selective three-dimensional (3D) metallization using a process according to various embodiments, showing no fracture after deformation, and (i) a wearable structure with complex shape and nickel (Ni) plating formed by a process according to various embodiments that remains firmly bonded to a flexible substrate after deformation. Fine-sized hollow or complex non-uniform structures such as those shown in FIG. 8 can be as small as 400 μm, confirming the precision manufacturing possible utilizing this method.

[0079]

[0078] Figure 8(a) shows three different surface structures constructed on a circular substrate. These include a circular microstructure with a radius of 200 μm, a regular hexagonal microstructure with an inner circle radius of 200 μm, and a circumferential groove microstructure with a groove width of 400 μm. After printing and cleaning, these microstructures could be clearly seen under a high-magnification microscope. After plating, metallic Ni uniformly covered the microstructure surface, resulting in a 3D profile consistent with the active precursor.

[0080]

[0079] Figure 8(b) shows that using this process, a metal skeletal ball structure with a circular base was also fabricated. This microstructure may be randomly interconnected, and after plating, the skeleton may be covered with Ni metal. The structure was uniformly plated inside and outside, and had a metallic luster with no under- or voids.

[0081]

[0080] Figure 8(c) shows a 3D printed Eiffel Tower model with the tip and middle sections made of active precursor material and the rest made of standard resin. After plating, Ni metal was precisely deposited on both the tip and middle surfaces of the tower. The original hollow microstructure remained intact, and the interior and exterior of the central hollow structure of the tower were covered with Ni metal with metallic luster. The fabrication of these multi-material nested parts may demonstrate the capabilities of the MM-DLP3DP described herein.

[0082]

[0081] Furthermore, Figure 8(d) shows a multi-material five-sided part with a specific metal topology distributed on the four sides. The structure is highly complex, with the metal parts and the resin substrate nested within each other such that both inter-layer and intra-layer nesting exists. Despite this complexity, clear boundaries are evident between these parts of the part, confirming that precise selective metallization was achieved. There was uniform plating distribution and no Ni plating run-off or contamination.

[0083] FIG. 8(e) shows a dome structure with six curved metal bands evenly distributed around its surface, and FIG. 8(f) shows a U-tube part with an internal hexagonal mesh made of Ni. The U-tube part with the internal mesh structure shown in FIG. 8(f) is particularly difficult to fabricate by most other manufacturing techniques. This highly complex part could not be fabricated by conventional methods using laser etching or 3DP, but could be obtained based on slicing and material switching that allows the deposition of active precursors inside the U-tube. During the ELP process, a plating solution could be flowed over the tubular part to form a mesh in the cavity by deposition of Ni. The right side of this figure shows the intricate structure of the metal mesh after removal from the part. The mesh had a thickness of 1 mm and contained hexagonal holes, each with an internal diameter of 500 μm.

[0084]

[0083] Furthermore, Fig. 8(g) shows a double-layered 3D hollow part in which a large sphere (15 mm radius) with a triangular hollow hole is wrapped around a small sphere (8 mm radius) with a regular hexagonal hollow hole. In this part, selective Ni deposition of the inner small sphere can be successfully achieved as the plating solution enters through the holes of the outer large sphere. The enlarged image (right side of Fig. 8(g)) shows the metallic luster of the inner sphere, indicating a good Ni coating. These two parts demonstrate the possibility of producing articles with complex internal metallic structures, thus broadening the potential applications of this technology.

[0085]

[0084] Flexible 3D electronics can also be fabricated using various embodiments. The present surface molding 3DP process maintains the success rate of fabricating flexible parts since it does not require a support to obtain the desired flexible structure. Figure 8(h) shows a flexible carbon nanotube structure whose central portion was selectively applied using ELP. High resolution images show the bonding between metal and resin in this article. The metal plating is clearly uniformly distributed and the boundaries between different materials are well defined, indicating the effective formation of flexible metal-plastic composite structures using this method. After being subjected to stress, the Ni metal plating remained intact and did not break. Figure 8(i) shows a flexible wearable hoop-shaped structure. The enlargement shows the precise deposition of the metal plating on the surface of the knotted part. The article was found to be highly flexible and the metal structure did not break upon bending deformation. In addition to the above parts, various 3D volumetric circuits were designed and fabricated to replace traditional PCB circuits, thus showing the potential of the process described herein for applications in the field of 3D micro-nanoelectronics.

[0086]

[0085] FIG. 9 illustrates plots of impedance (in ohms or Ω) as a function of frequency (in hertz or Hz) showing (a) a light emitting diode (LED) stereo circuit having a complex nickel (Ni) metal wire topology using processes according to various embodiments, (b) a dual layer three dimensional (3D) circuit structure having a complex three dimensional (3D) copper wire structure using processes according to various embodiments, which is difficult to fabricate using conventional processes, and (c) the impedance of nickel (Ni) and copper (Cu) coatings formed using processes according to various embodiments.

[0087]

[0086] FIG. 9(a) is a diagram and photo image of a light-emitting diode (LED) circuit with an irregular 3D structure. The circuit board model in the figure shows that the board has an irregular surface profile and the wires have a complex 3D alignment. After printing, soldering, and powering up at 3.3V, the LED was found to function at a normal level of brightness. This result confirmed that the metal wire structure distributed on the board was suitably conductive. FIG. 9(b) shows a double-layer 3D circuit with a through-hole structure in which the conductor width is 800 μm. The through-hole has a diameter of 500 μm, and the inner wall was covered with copper (Cu) metal connecting the inner and outer layers of the circuit. The circuit has a complex 3D wire distribution, which reduced the size of the device and increased the electronic transmission efficiency compared to standard circuits. These improvements can be expected to increase the degree of integration in 3D electronic devices and may have many practical applications. FIG. 9(c) shows a plot summarizing the impedance characteristics of the Cu and Ni plating obtained using the process described herein, and it can be seen that the obtained 3D metal wires exhibited electrical conductivity that meets the requirements for use in electronic devices.

[0088]

[0087] Sample parts with very small components were also designed and fabricated to examine the precision and resolution achievable by selective metallization. Figure 10 shows (a) nickel (Ni) plated structures with widths of 1 mm, 500 μm, and 100 μm, and widths of 50 μm and 40 μm, formed by processes according to various embodiments, and (b) a circuit board part with a width of 1 mm incorporating 500 μm copper wires, formed by processes according to various embodiments. Figure 10(a) shows images of Ni wires with widths of 1 mm, 500 μm, 100 μm, 50 μm, and 40 μm. High magnification microscopy shows that Ni is precisely distributed on these active precursor wires, thus demonstrating the exceptional resolution and selective metal deposition effectiveness of the printing method. The Cu plating on the circuit board shown in Figure 10(b) shows that various embodiments can provide a manufacturing resolution of at least 40 μm, sufficient to meet the processing requirements of most electronic products.

[0089] Microscopic characterization of 3D selective metal topologies

[0090] The effectiveness of the ELP induced by the active precursor and the quality of the resulting plating were evaluated by fabricating samples with dimensions of 20 mm (length) x 10 mm (width) x 5 mm (height). These specimens had flat, circular, regular hexagonal, and annular grooved micro-nano structures with metal coating.

[0091] FIG. 11 shows (a) standard flat nickel (Ni) plating according to various embodiments; (b), (c) scanning electron microscope (SEM) images of the area shown in (a) at different magnifications according to various embodiments; (d) nickel (Ni) plating on the surface of a circular microstructure according to various embodiments; (e), (f) scanning electron microscope (SEM) images of the area shown in (d) at different magnifications according to various embodiments; (g) nickel (Ni) plating on the surface of annular groove microstructure according to various embodiments; (h), (i) Scanning electron microscope (SEM) images of the area indicated in (g) at different magnifications according to various embodiments; (j) nickel (Ni) plating on the surface of the regular hexagonal microstructure according to various embodiments; (k)-(l) Scanning electron microscope (SEM) images of the area indicated in (j) at different magnifications according to various embodiments; (m) a flexible sample having nickel (Ni) plating; and (n)-(o) Scanning electron microscope (SEM) images of the area indicated in (m) at different magnifications according to various embodiments.

[0092] 11(a)-(c) show the microscopic characterization results of the planar sample after the 5 min plating process. The sample is uniformly covered with Ni, and a metallic luster can be observed in the low magnification optical microscope image (right side of FIG. 11(a)). The SEM image acquired with a 100 μm scale bar shows the surface profile of the Ni layer, which is flat in most places, consistent with the planar profile of the active precursor. High local Pd 2+Some small protrusions are evident due to the accumulation of Ni metal caused by the concentration. Higher magnification shows that the Ni metal particles are packed closely together, with a more uniform distribution of crystals and fewer discontinuities. Figure 11(d)-(f) show images of the specimen obtained after plating a circular surface of 200 μm radius and 200 μm depth for 6 min.

[0093]

[0092] Figure 11(g)-(i) show the plating on the surface of an annular groove with a width of 200 μm and a depth of 200 μm, and Figure 11(j)-(l) show images of a plated hexagonal microstructure with an inner radius of 200 μm and a depth of 200 μm. All three sections show complete and uniform plating with metallic luster. The SEM image of the 100 μm scale bar shows that the Ni metal particles all grew uniformly along the surface profile. The plating did not obscure the original surface structure due to uneven thickness, again showing the uniformity of the plating. The SEM image of the 500 nm scale bar clearly shows the morphology and distribution of the Ni metal particles. The distribution of Ni crystals on the surface of these microstructured samples was more irregular than on the planar specimens, but still closely packed. In the active precursor region, Pd 2+ Although Pd ions were embedded in the cured resin, the bonding interactions between the molecules in the flexible resins were not as strong in these resins compared to the rigid resins after curing. Therefore, the Pd 2+The ions precipitated more readily during plating such that shorter plating times were required. Figure 11(m)-(o) show the results of 3 min Ni plating of flexible active precursor specimens. The resulting metallized microstructure not only enhanced the functionality of the part but also strengthened the bond between the plating and the substrate. Tape tests showed that the Ni metal on the microstructured surface exhibited higher bond strength compared to the metal on the flat surface as a result of the higher roughness associated with the microstructure. Compared to the rigid sample, the flexible sample showed more consistent plating with higher integrity and 100 μm scale bar SEM observations showed that the flexible sample had a much rougher surface. This phenomenon was attributed to corrosion of the flexible surface by the acidic components of the plating solution. Corrosion was also evident in the 500 nm scale bar SEM images, which show a significant increase in the number of Ni metal particles in the same area with a continuous dense cluster of crystals. This suggests that more Pd 2+ This is because the ions are exposed.

[0094]

[0093] Various embodiments may include incorporating catalytic seeds into the standard resin, which allows for obtaining a metal layer with higher confinement and bond strength. The Ni-plated samples were processed using a focused ion beam to obtain cross-sections that allow for better inspection of the microstructure at the metal-resin joint. Analysis by transmission electron microscopy (TEM) and energy dispersive X-ray spectroscopy (EDS) was then performed. Figure 12 shows (a) cross-sectional transmission electron microscopy (TEM) images showing the resin layer, the bond layer and the nickel layer of the composite structure according to various embodiments, (b) energy dispersive X-ray spectroscopy (EDS) images showing the distribution of iron according to various embodiments, (c) energy dispersive X-ray spectroscopy (EDS) images showing the distribution of palladium according to various embodiments, and (d) energy dispersive X-ray spectroscopy (EDS) images showing the distribution of nickel according to various embodiments.

[0095] FIG. 12(a) shows a TEM image taken at the interface between the resin and Ni metal layers. A cross section shows the Ni metal layer, the bonding layer and the resin layer after plating. FIG. 12(b) shows the distribution of carbon along the cross section including the resin interface. There was more carbon in the resin layer and significantly less in the intermediate layer, such that the division between the two phases of the resin layer and the intermediate layer is highly consistent with the image shown in FIG. 12(a). This result supports the existence of a bonding layer. During the ELP process, sodium hypophosphite in the plating solution dissolves the Pd deposited on the surface. 2+ The Pd in ​​the intermediate layer catalyzed the deposition of Ni so that Ni metal migrated into the resin to produce an intermediate layer of Ni embedded in the material. This effect improved the adhesion of the Ni plating.

[0096]

[0095] 3D printing metal-plastic composite parts for electronic devices

[0097] Various embodiments may relate to combining non-metallic materials having different functionalities with specific metallic patterns to create metal-plastic composite parts.

[0098]

[0097] 3D printed strain gauge

[0099] Metal-based resistive strain gauges work on the principle of the resistive strain effect. Specifically, when a Cu wire is subjected to stress, its resistance changes proportionally to the degree of stretching or compression. In conventional strain gauges, a resistive measurement grid is usually laminated between a carrier and a cover film, and this foil strain gauge is bonded to the component to be evaluated using an adhesive. The strain of the component is transferred to the measurement grid through the two intermediate layers. As a rule, the measurement grid should be placed as close as possible to the component surface to avoid force transmission losses. In such devices, variations in the bond thickness are reflected in the degree of force transmission, which means that the response of the strain gauge can change.

[0100]

[0099] Various embodiments may relate to printing strain gauges on the object to be measured. Various embodiments may allow for printing strain gauges inside complex parts. This not only ensures consistent mechanical deformation between the strain gauge and the measured object, but also allows for the design and manufacture of specific strain gauges that match the actual 3D shape of the object. FIG. 13 shows (a) a schematic of a three-dimensional (3D) printed integrated strain gauge on a measured object according to various embodiments, (b) an image of a strain gauge according to various embodiments and a schematic of a measurement of the strain gauge according to various embodiments, (c) an image showing the bending deformation of the gauge under stress according to various embodiments, (d) a plot of voltage (in volts or V) as a function of load (in grams or g) showing the voltage measurement characteristics of the strain gauge according to various embodiments, (e) a plot of strain as a function of load (in grams or g) showing the strain characteristics of the strain gauge according to various embodiments calculated from experimental data, and (f) a plot of deformation (in millimeters or mm) as a function of load (in grams or g) showing the experimental deformation data of the strain gauge according to various embodiments.

[0101]

[0100] FIG. 13(a) shows a strain gauge according to various embodiments integrated with a measured object. The whole part is a rectangular parallelepiped with an opening, and the strain gauge is inside the base. The electrical signal generated when the internal strain gauge is deformed is extracted through the holes in the device. FIG. 13(b) is an image showing the structure of the internal strain gauge. 3D printing and copper (Cu) plating processes can be used to form metal electrodes with a pitch and width of 500 μm. When the strain gauge is bent and deformed when the object being tested is subjected to a force, the total length of the through electrodes changes, so its resistance fluctuated. By measuring the change in voltage, the strain, and therefore the amount of deformation, could be calculated. FIG. 13(c) provides a photographic image of the strain gauge after it has been deformed. Due to the use of an acrylic UV resin, the strain gauge was highly flexible and did not break when bent. FIG. 13(d) plots the voltage generated by the strain gauge as a function of load, obtained using a star circuit. FIG. 13(e)-(f) summarize the calculated strain and deformation values, respectively. When the load is 10 g, the strain value of the sensor obtained by the experiment is 0.003. This data is basically consistent with the results of the simulation calculation (top left corner of Figure 13(e)), which verifies the effectiveness of the sensor. Therefore, this device can be used to carry out strain measurements when compensating for variations in temperature and material properties.

[0102]

[0101] 3D printed piezoelectric sensor

[0103]

[0102] Various embodiments can allow metal wires to be constructed on the surface of various functional materials. In various embodiments, the polymer polyvinylidene fluoride-trifluoroethylene (PVDF-TrFE) can be added to the elastic photocurable resin to produce a material with piezoelectric properties, which can also be used as an active precursor. FIG. 14 shows (a) a schematic diagram illustrating the working principle of a three-dimensional (3D) printed piezoelectric sensor according to various embodiments, (b) images showing a piezoelectric sensor according to various embodiments bent at bending angles of 30°, 60°, 90°, and 120°, (c) plots of voltage (in volts or V) as a function of time (in seconds or s) showing the voltage waveforms generated by a piezoelectric sensor according to various embodiments at 30°, 60°, 90°, and 120°, and (d) plots of voltage (in volts or V) as a function of deformation (in nanometers or nm) showing the voltage generated by a piezoelectric sensor in tension as a function of deformation according to various embodiments. The 3D printed piezoelectric sensor includes a thin-film substrate made of a piezoelectric material and an interdigital electrode. When this kind of sensor is subjected to an external force along its sensitivity axis, charges of opposite polarity are generated on two adjacent electrodes corresponding to the charge source (i.e., electrostatic generator). The piezoelectric effect allows the device to sense deformation and can therefore be used to measure deformation, strain, angular change, and other variables. Figure 14(b) provides a photographic image showing the device being bent at various angles, and the resulting voltage values ​​are shown in the oscilloscope trace in Figure 14(c). Figure 14(d) shows a plot showing the piezoelectric effect of the sensor in a stretched state. As the amount of deformation increased (i.e., the length of the central axis of the top surface increased), the voltage generated by the piezoelectric effect also increased. This voltage was directly correlated to a specific variable and could provide accurate measurements with the support of additional filtering and amplification circuitry. Using this principle, accurate measurements of specific physical quantities can be achieved. Compared to conventional piezoelectric sensors, piezoelectric sensors made by 3DP may require a less complex manufacturing process that can be integrated with the manufacturing process of the object being inspected to enable a wider range of applications.

[0104]

[0103] Wearable 3D printed flexible ECG electrodes

[0105]

[0104] Electrocardiogram (ECG) can provide information about the electrical activity of the heart and is widely used in the diagnosis and analysis of many diseases. Typically, a complete ECG measurement system is mainly composed of electrodes, digital processing circuits, and a data analysis terminal. Of these, electrodes may be the key components that affect the quality of the electrical signal received from the heart. Various embodiments may relate to the formation of wearable flexible 3D printed ECG electrodes.

[0106]

[0105] FIG. 15 shows (a) a schematic diagram illustrating a measurement system including three-dimensional (3D) electrocardiogram (ECG) electrodes formed in accordance with various embodiments, (b) an image showing device components of a system including electrodes formed in accordance with various embodiments, (c) a plot showing five electrocardiogram (ECG) signals measured by electrodes formed in accordance with various embodiments based on random measurements of a stationary subject, and (d) a plot showing electrocardiogram (ECG) signals measured by electrodes formed in accordance with various embodiments based on measurements while the subject was swinging his arms, clicking a computer mouse, and writing.

[0107]

[0106] The measurement system shown in Fig. 15(a) can use a dual-lead measurement method in which the host ECG electrode and the secondary ECG electrode can be worn on the right and left wrists of the subject, respectively. The electrodes can acquire ECG signals and transmit the acquired signals to a computer via a Bluetooth module attached to the host ECG, which can process and display the signals. Fig. 15(b) shows an image of a 3D printed strap-like wearable device with specially patterned metal electrodes, a circuit for connecting with a portable battery, and a Bluetooth module. This configuration eliminated the measurement errors and inconveniences caused by wires, making it easier to measure ECG signals while the subject is moving. Fig. 15(c) shows plots of five different ECG signals obtained with the proposed ECG electrodes when the subject is in a resting state. The five plots essentially overlapped, and the waveforms reflected the expected ECG waveforms of a normal human heart. Fig. 15(d) shows measurement signals obtained with the ECG electrodes while writing, waving the arms, and clicking a computer mouse. Compared to conventional ECG, the electrodes can provide an easier measurement process along with efficient output of the obtained data.

[0108]

[0107] Various embodiments may relate to an approach to construct precise metal patterns on or within 3D plastic parts with any complex shape, along with potential applications. By modifying standard resins, active precursors that could accelerate the ELP process can be prepared. Various embodiments may relate to a MM-DLP3DP apparatus to enable the fabrication of micro-nano 3D metal-plastic component structures. The method according to various embodiments has been used to fabricate various parts as a demonstration of the manufacturing capabilities. These parts were mainly multi-material and included nested layers containing microporous structures and small hollow structures with a minimum size of 40 μm. To demonstrate the manufacturing capabilities of the proposed technology, a 3D circuit with a double-sided structure connected by through-holes was fabricated. Furthermore, to demonstrate the superiority of this technology, a series of sensors operating on different principles (3D printed strain gauges, 3D printed piezoelectric sensors, and wearable 3D printed flexible ECG electrodes) were fabricated. Compared to conventional processes, various embodiments enable integrated manufacturing of sensors and objects, thus avoiding measurement errors and complex processes caused by assembly. As more specialized photocurable resins (such as acrylonitrile-butadiene-styrene, acrylic and silicone materials) become available, it may be possible to fabricate 3D structures with unique properties. Furthermore, various metals (including Ni, Co, Cu, Au, Ag and Pt) can potentially be deposited in targeted patterns by active precursor-induced plating. This process can enable 3D nesting of various composites and therefore has promising applications especially in microelectromechanical systems (MEMS), sensors and robots, wearable devices, and 3D precision electronics.

[0109]

[0108] Although the present invention has been particularly shown and described with reference to certain embodiments, it should be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the present invention is therefore indicated by the appended claims, and it is therefore intended to embrace all changes that come within the meaning and range of equivalence of the claims.

Claims

1. a first pool containing an activation solution for forming a first printed portion of a workpiece, the activation solution including a solvent, an activation seed soluble in the solvent, and a photocurable resin; a second pool containing additional photocurable resin for forming a second printed portion of the workpiece; a light source configured to provide light; a mask positioned such that the light provided by the light source is incident on the workpiece through the mask; a third pool containing a cleaning solution for cleaning the work piece; Equipped with the first printed portion including the activated seed is configured to form a metal layer by an electroless deposition process, thereby forming a composite structure; Additive manufacturing systems for forming composite structures.

2. the activation seed is a catalyst or a catalyst precursor; 10. The additive manufacturing system of claim 1 .

3. the activating seed is palladium metal, silver metal, palladium ions or silver ions; 10. The additive manufacturing system of claim 1 .

4. the photocurable resin and the further photocurable resin are made of the same material; 10. The additive manufacturing system of claim 1 .

5. the photocurable resin and the further photocurable resin are made of different materials; 10. The additive manufacturing system of claim 1 .

6. The light is ultraviolet light or visible light.

10. The additive manufacturing system of claim 1 .

7. the mask is a liquid crystal display (LCD) mask; 10. The additive manufacturing system of claim 1 .

8. a controller electrically connected to the first pool, the second pool, the third pool, the light source, and the mask; 13. The additive manufacturing system of claim 1, further comprising:

9. the controller is configured to control the first pool to deposit the active solution at a predetermined location on a substrate or an underlayer to form the first printed portion; the controller is configured to control the mask to generate a first masking pattern; the controller is further configured to control the light source to irradiate the first printed portion with the light through the first mask pattern, thereby curing at least one slice of the first printed portion; the controller is further configured to control the third pool to dispense the cleaning solution for cleaning the first printed portion and removing residual uncured slices of the first printed portion; the controller is also configured to control the second pool to deposit the additional photocurable resin at another predetermined location on the substrate or underlayer to form the second printed portion; the controller is also configured to control the mask to generate a second masking pattern; the controller is also configured to control the light source to irradiate the second printed portion with the light through the second mask pattern, thereby curing at least one slice of the second printed portion; the controller is further configured to control the third pool to dispense the cleaning solution for cleaning the second printed portion and removing residual uncured slices of the second printed portion.

9. The additive manufacturing system of claim 8.

10. the controller is configured to control the first pool to deposit the active solution onto a substrate or underlayer to form the first printed portion; the controller is configured to control the mask to generate a first masking pattern; the controller is further configured to control the light source to irradiate the first printed portion with the light through the first mask pattern, thereby curing at least one slice of the first printed portion, the cured slice of the first printed portion forming a first layer; the controller is further configured to control the third pool to dispense the cleaning solution for cleaning the first printed portion and removing residual uncured slices of the first printed portion; the controller is also configured to control the second pool to deposit the additional photocurable resin onto the cured slice of the first printed portion to form the second printed portion; the controller is also configured to control the mask to generate a second masking pattern; the controller is further configured to control the light source to irradiate the second printed portion with the light through the second mask pattern, thereby curing at least one slice of the second printed portion, the cured slice of the second printed portion forming a second layer on the first layer; the controller is also configured to control the third pool to dispense the cleaning solution for cleaning the first printed portion and the second printed portion and to remove residual uncured slices of the second printed portion.

9. The additive manufacturing system of claim 8.

11. one or more additional pools containing the cleaning solution for cleaning the workpieces.

13. The additive manufacturing system of claim 1, further comprising:

12. The cleaning solution is a liquid.

10. The additive manufacturing system of claim 1 .

13. The cleaning solution comprises water, alcohol, and acid.

10. The additive manufacturing system of claim 1 .

14. A plating bath for forming the metal layer by the electroless plating process 13. The additive manufacturing system of claim 1, further comprising:

15. the plating bath is a stand-alone component or a fourth pool of a printer comprising the first pool, the second pool and the third pool; 15. The additive manufacturing system of claim 14.

16. the metal layer comprises a metal or a metal alloy; 10. The additive manufacturing system of claim 1 .

17. the metal layer comprises nickel metal, copper metal, gold metal, or an alloy comprising any combination thereof; 10. The additive manufacturing system of claim 1 .

18. providing a first pool containing an activation solution for forming a first printed portion of a workpiece, the first pool containing a solvent, an activation seed soluble in the solvent, and a photocurable resin; providing a second pool containing additional photocurable resin for forming a second printed portion of the workpiece; providing a light source configured to provide light; providing a mask positioned such that the light provided by the light source is incident through the mask onto the workpiece; providing a third pool containing a cleaning solution for cleaning the work piece; Including, the first printed portion including the activated seed is configured to form a metal layer by an electroless deposition process, thereby forming a composite structure; A method for forming an additive manufacturing system for forming a composite structure.

19. depositing an activation solution comprising a solvent, an activation seed soluble in the solvent, and a photocurable resin to form a first printed portion of the workpiece; depositing additional photocurable resin to form a second printed portion of the workpiece; illuminating the workpiece with light provided by a light source through a mask; dispensing a cleaning solution to clean the workpiece; forming a metal layer on the first printed part by an electroless plating process due to the activation seeds contained in the first printed part, thereby forming a composite structure; A method for forming a composite structure comprising:

20. The activation seed is a catalyst or a catalyst precursor.

20. The method of claim 19.

21. the photocurable resin and the further photocurable resin are made of the same material; 20. The method of claim 19.

22. the photocurable resin and the further photocurable resin are made of different materials; 20. The method of claim 19.

23. The light is ultraviolet light or visible light.

20. The method of claim 19.

24. the mask is a liquid crystal display (LCD) mask; 20. The method of claim 19.

25. the active solution is deposited at a predetermined location on a substrate or underlayer to form the first printed portion; The method includes generating a first masking pattern using the mask; the light is irradiated onto the first printed portion through the first mask pattern, thereby curing at least one slice of the first printed portion; the cleaning solution is dispensed to clean the first printed portion and remove residual uncured slices of the first printed portion; the further photocurable resin is deposited on another predetermined location of the substrate or underlayer to form the second printed portion; the method including generating a second masking pattern using the mask; the light is irradiated onto the second printed portion through the second mask pattern, thereby curing at least one slice of the second printed portion; the cleaning solution is dispensed to clean the second printed portion and remove any residual uncured slices of the second printed portion; 20. The method of claim 19.

26. The active solution is deposited on a substrate or underlayer to form the first printed portion; The method includes generating a first masking pattern using the mask; the light is irradiated onto the first printed portion through the first mask pattern, thereby curing at least one slice of the first printed portion, the cured slice of the first printed portion forming a first layer; the cleaning solution is dispensed to clean the first printed portion and remove residual uncured slices of the first printed portion; the additional photocurable resin is deposited onto the cured slice of the first printed portion to form the second printed portion; the method including generating a second masking pattern using the mask; the light is irradiated onto the second printed portion through the second mask pattern, thereby curing at least one slice of the second printed portion, the cured slice of the second printed portion forming a second layer on the first layer; the cleaning solution is dispensed to clean the first printed portion and the second printed portion and to remove residual uncured slices of the second printed portion; 20. The method of claim 19.

27. The cleaning solution comprises water, alcohol, and acid.

20. The method of claim 19.

28. and wherein the electroless plating process is carried out by immersing the workpiece in a plating bath.

20. The method of claim 19.

29. the metal layer comprises a metal or a metal alloy; 20. The method of claim 19.

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