Connection structure and assembly

Abstract

The present invention relates to a connection structure and an assembly. The connection structure (16) includes: a pillar member (18) that extends in one direction from one end portion (E1) to the other end portion (E2) and is not inserted through the through-hole (12H1), the one end portion (E1) being mounted on the disposed object (14), and a threaded hole (18SH) being formed at the other end portion (E2); an enclosing member (20) that is provided on one surface (12A) of the printed circuit board (12), encloses the opening of the through-hole (12H1), and allows the other end portion (E2) of the pillar member (18) to be inserted therethrough; and a fixing member (22) that fixes the pillar member (18) relative to the printed circuit board (12) by screwing from the side of the other surface (12B) of the printed circuit board (12) opposite to the one surface (12A) into the threaded hole (18SH) of the pillar member (18) inserted into the enclosing member (20).

Description

Technical Field

[0001] The present invention relates to a connection structure and an assembly including the connection structure, the connection structure connecting a printed circuit board and an arrangement, the arrangement being disposed at a distance from one surface of the printed circuit board. Background Art

[0002] An electronic device module in which a second substrate is stacked on a first substrate in the thickness direction is disclosed in Japanese Patent Laid-Open No. 2001-168243. In this electronic device module, fixing pins are connected to the first substrate and the second substrate, and positioning pins penetrate the first substrate and the second substrate. Summary of the Invention

[0003] However, in the case of the electronic device module disclosed in Japanese Patent Laid-Open No. 2001-168243, the fixing pins and the positioning pins are provided separately. Therefore, the assembly area of the pins with respect to the first substrate and the second substrate increases, and the number of components of the pins increases, which may cause a problem of enlargement of the connection structure connecting the first substrate and the second substrate.

[0004] Accordingly, an object of the present invention is to provide a connection structure and an assembly capable of achieving miniaturization.

[0005] A first aspect of the present invention is a connection structure that connects a printed circuit board and an arrangement. A through hole is formed in the printed circuit board, the arrangement is disposed at a distance from one surface of the printed circuit board, and the connection structure includes:

[0006] A column member that extends in one direction from one end to the other end and is not inserted into the through hole, the one end being mounted on the arrangement, and a threaded hole being formed at the other end;

[0007] A surrounding member that is provided on one surface of the printed circuit board, surrounds an opening of the through hole, and is capable of receiving the other end of the column member; and

[0008] A fixing member that fixes the column member relative to the printed circuit board by screwing from the other surface side of the printed circuit board opposite to the one surface into the threaded hole of the column member inserted into the surrounding member.

[0009] A second aspect of the present invention is an assembly including: a plurality of the above-described connection structures, the printed circuit board, and the arrangement.

[0010] According to the form of the present invention, even if the strut members for positioning the configuration relative to the printed circuit board and the strut members for fixing the printed circuit board and the configuration are not separately provided, the configuration can be mounted at a specified position relative to the printed circuit board, thereby enabling miniaturization.

[0011] The following description of the embodiments described with reference to the accompanying drawings will easily clarify the above objects, features, and advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a schematic diagram showing the configuration of the assembly of the embodiment.

[0013] Figure 2 is Figure 1 an exploded perspective view of the assembly.

[0014] Figure 3 is a perspective view showing the strut member.

[0015] Figure 4A is a perspective view showing the surrounding member, Figure 4B is showing from Figure 4A a different viewpoint of the perspective view of the surrounding member.

[0016] Figure 5 is Figure 1 a sectional view taken along arrow V-V. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] Hereinafter, preferred embodiments of the present invention will be listed and described in detail while referring to the Figure 1 accompanying drawings.

[0018] 〔Embodiment〕

[0019] Use Figure 1 and Figure 2 to describe the assembly 10 of this embodiment. Figure 1 is a schematic diagram showing the configuration of the assembly 10 of the embodiment, Figure 2 is Figure 1 an exploded perspective view of the assembly 10. The assembly 10 includes a printed circuit board 12, a configuration 14, and a plurality of connection structures 16.

[0020] The printed circuit board 12 is a component having wirings formed on the substrate. A plurality of through holes 12H ( Figure 2 ) for assembling the configuration 14 to the printed circuit board 12 are formed in the printed circuit board 12. The plurality of through holes 12H include a plurality of first through holes 12H1 and a plurality of second through holes 12H2.

[0021] The configuration 14 is disposed at a distance from a surface 12A of the printed circuit board 12. The configuration 14 may be a plate-like member formed in a plate shape, or a housing containing electronic devices or the like. The plate-like member may be a substrate, a printed circuit board, or a printed wiring board. In addition, a printed wiring board is a component in which wirings are formed on a substrate and semiconductor elements are mounted. In the present embodiment, the configuration 14 is a substrate as exemplified in Figure 1 and Figure 2 .

[0022] A plurality of connection structures 16 connect the printed circuit board 12 and the configuration 14 respectively. The plurality of connection structures 16 maintain the positional relationship between the printed circuit board 12 and the configuration 14, and the configuration 14 is disposed to overlap with a surface 12A of the printed circuit board 12 at a distance. In the present embodiment, the plurality of connection structures 16 maintain a positional relationship in which the printed circuit board 12 and the configuration 14 (substrate) are substantially parallel.

[0023] Each of the plurality of connection structures 16 includes a column member 18, an enclosing member 20 ( Figure 2 ), and a fixing member 22. Since the column member 18, the enclosing member 20, and the fixing member 22 included in each of the plurality of connection structures 16 have the same configuration, one column member 18, enclosing member 20, and fixing member 22 will be described below.

[0024] The column member 18 is disposed between the printed circuit board 12 and the configuration 14. Figure 3 is a perspective view showing the column member 18. The column member 18 is a rod-shaped member extending in one direction from one end portion E1 to the other end portion E2. The column member 18 may be formed in the same shape from one end portion E1 to the other end portion E2, or a part from one end portion E1 to the other end portion E2 may be formed in a different shape from other parts. In the present embodiment, one end portion E1 of the column member 18 is formed in a cylindrical shape, and the portion of the column member 18 other than one end portion E1 is formed in a regular hexagonal prism. In addition, one end portion E1 of the column member 18 is thinner than the portion of the column member 18 other than one end portion E1.

[0025] The column member 18 is not inserted into a first through hole 12H1 ( Figure 2 ) formed in the printed circuit board 12. In other words, the column member 18 has a diameter larger than the opening diameter of the first through hole 12H1 of the printed circuit board 12 and is formed thicker than the first through hole 12H1 of the printed circuit board 12.

[0026] One end portion E1 of the column member 18 is mounted on the configuration 14. For example, one end portion E1 of the column member 18 is embedded or welded to a hole 14H ( Figure 2 ) formed in the configuration 14 (substrate), and thus is mounted at a specified position on the configuration 14.

[0027] A threaded hole 18SH is formed at the other end portion E2 of the support member 18. The threaded hole 18SH extends from the end face F of the other end portion E2 toward the one end portion E1 side along the extending direction of the support member 18. In the present embodiment, the end face F of the other end portion E2 is a substantially flat plane along the direction orthogonal to the extending direction of the support member 18. In addition, the end face F of the other end portion E2 may also be a curved surface.

[0028] The surrounding member 20 is provided on one surface 12A of the printed circuit board 12. Figure 4A and Figure 4B is a perspective view showing the surrounding member 20. The surrounding member 20 has: a base plate 24 having a through hole 24H larger than the first through hole 12H1 ( Figure 2 ) formed in the printed circuit board 12; and a surrounding portion 26 surrounding the opening of the through hole 24H on one surface side of the base plate 24. The through hole 24H has a size capable of inserting at least the other end portion E2 ( Figure 3 ) of the support member 18.

[0029] One or more cuts may be provided in the surrounding portion 26 along the thickness direction of the base plate 24. That is, the surrounding portion 26 also includes a case where it does not surround the entire periphery of the opening of the through hole 24H. In addition, it is preferable that the portion of the surrounding portion 26 that does not surround the through hole 24H is smaller than the portion of the surrounding portion 26 that surrounds the through hole 24H.

[0030] The surrounding member 20 can be attached to and detached from the printed circuit board 12, and is provided on one surface 12A of the printed circuit board 12 by being assembled to the printed circuit board 12. Thus, compared with the case where the surrounding member 20 is integrally formed with the printed circuit board 12, the position of the surrounding member 20 can be changed without changing the settings of the injection molding device or the like of the substrate for forming the printed circuit board 12. As a result, design changes become easier.

[0031] In the present embodiment, the surrounding member 20 is assembled to the printed circuit board 12 by a buckle 28 provided on the surface of the base plate 24 opposite to the surface side where the surrounding portion 26 is provided. In the present embodiment, the number of buckles 28 is two, but it may be one or three or more. At least one buckle 28 has a claw at its tip for hooking on the other surface 12B of the printed circuit board 12 opposite to the one surface 12A. The claw protruding toward the other surface 12B side through the second through hole 12H2 formed in the printed circuit board 12 hooks on the other surface 12B of the printed circuit board 12, so that at least one buckle 28 assembles the surrounding member 20 to the printed circuit board 12.

[0032] The surrounding member 20 surrounds the opening of the first through-hole 12H1 formed in the printed circuit board 12 in a state of being assembled to the printed circuit board 12, and the other end portion E2 of the support member 18 can be inserted therein. Thus, compared with the case where there is no surrounding member 20, the position of the support member 18 relative to the first through-hole 12H1 formed in the printed circuit board 12 can be accurately determined.

[0033] The fixing member 22 fixes the support member 18 relative to the printed circuit board 12. The fixing member 22 fixes the support member 18 relative to the printed circuit board 12 by screwing from the other surface 12B side of the printed circuit board 12 opposite to the one surface 12A into the threaded hole 18SH of the support member 18 inserted into the interior of the surrounding member 20.

[0034] Figure 5 Yes Figure 1 is a cross-sectional view taken along the arrow V-V. The surrounding member 20 (surrounding portion 26) has an inclined surface 26F that is inclined so as to become higher as it is farther from the opening of the first through-hole 12H1 formed in the printed circuit board 12 in the direction along the one surface 12A of the printed circuit board 12. In other words, the inner wall of the annular surrounding portion 26 is inclined in a direction that forms an acute angle with the one surface 12A of the printed circuit board 12.

[0035] Thus, when the other end portion E2 of the support member 18 is inserted into the surrounding member 20, the support member 18 can be guided by the inclined surface 26F in such a manner that the threaded hole 18SH formed in the other end portion E2 of the support member 18 is disposed at the opening of the first through-hole 12H1. Therefore, the position of the support member 18 relative to the first through-hole 12H1 formed in the printed circuit board 12 can be accurately determined.

[0036] The other end portion E2 of the support member 18 inserted into the surrounding member 20 does not contact the base plate 24 of the surrounding member 20, but contacts the one surface 12A of the printed circuit board 12. Thus, the height from the one surface 12A of the printed circuit board 12 to the configured object 14 can be made to coincide with the length of the support member 18, and the tolerance can be reduced.

[0037] Next, a method of assembling the assembly 10 will be briefly described. The assembling method includes a mounting process, an assembling process, an inserting process, and a fixing process.

[0038] The installation process is a process of installing one end portion E1 of the support member 18 on the configuration 14. The assembly process is a process of assembling the surrounding member 20 on one surface 12A of the printed circuit board 12. The insertion process is a process of inserting the other end portion E2 of the support member 18, whose one end portion E1 is installed on the configuration 14, into the inside of the surrounding member 20 assembled on one surface 12A of the printed circuit board 12. The fixing process is a process of fixing the support member 18 relative to the printed circuit board 12 by screwing the fixing member 22 from the other surface 12B side of the printed circuit board 12, which is opposite to the one surface 12A, into the threaded hole 18SH of the support member 18 inserted into the inside of the surrounding member 20.

[0039] The order of the installation process and the assembly process can be arbitrary. The insertion process is performed after the installation process and the assembly process, and the fixing process is performed after the insertion process, thereby obtaining the assembly 10.

[0040] As described above, in the assembly 10 of the present embodiment, the surrounding member 20 determines the position of the support member 18 relative to the first through hole 12H1 of the printed circuit board 12, and the support member 18 disposed at the determined position can be fixed to the printed circuit board 12.

[0041] Thus, even if the positioning support member for the configuration 14 relative to the printed circuit board 12 and the fixing support member for fixing the printed circuit board 12 and the configuration 14 are not separately provided, the configuration 14 can be installed at a specified position relative to the printed circuit board 12. Therefore, miniaturization can be achieved.

[0042] 〔Modification Example〕

[0043] The above-described embodiment can be modified as follows.

[0044] In the above-described embodiment, the surrounding member 20 is assembled on one surface 12A of the printed circuit board 12. However, the surrounding member 20 can also be integrally formed with the printed circuit board 12. In addition, as described above, in order to facilitate design changes, it is preferable to assemble the surrounding member 20 on the printed circuit board 12 as in the above-described embodiment.

[0045] The buckle 28 in the above-described embodiment may not be provided. In the case where the buckle 28 is not provided, the surrounding member 20 is assembled on the printed circuit board 12 by an adhesive material or the like that joins the base plate 24 and the printed circuit board 12. Even in this way, the configuration 14 can be installed at a specified position relative to the printed circuit board 12 in the same manner as in the above-described embodiment. In addition, in order to reduce the number of components (adhesive material), it is preferable to assemble the surrounding member 20 on the printed circuit board 12 by the buckle 28 as in the above-described embodiment.

[0046] It is also possible to provide a protrusion as follows, and a threaded hole 18SH is formed in the protrusion. The protrusion protrudes outward from a part of the end face F of the other end portion E2 of the column member 18 in the above-described embodiment along the extending direction of the column member 18, and can be inserted through the first through-hole 12H1 formed in the printed circuit board 12. In such a case, when the column member 18 is inserted into the surrounding member 20, the other end portion E2 of the column member 18 is inserted through the first through-hole 12H1 formed in the printed circuit board 12, so that the accuracy of determining the position of the column member 18 relative to the first through-hole 12H1 can be easily improved.

[0047] 〔Technical solution〕

[0048] As technical solutions that can be grasped from the above-described embodiment and modification, they are described below as the first technical solution and the second technical solution.

[0049] (First technical solution)

[0050] The first technical solution is a connection structure 16 that connects the printed circuit board 12 and the configured object 14. A through-hole 12H1 is formed in the printed circuit board 12, and the configured object 14 is disposed at a distance from one surface 12A of the printed circuit board 12. The connection structure 16 includes: a column member 18 that extends in one direction from one end portion E1 to the other end portion E2 and is not inserted through the through-hole 12H1. The one end portion E1 is mounted on the configured object 14, and a threaded hole 18SH is formed in the other end portion E2; a surrounding member 20 that is disposed on one surface 12A of the printed circuit board 12, surrounds the opening of the through-hole 12H1, and can receive the insertion of the other end portion E2 of the column member 18; and a fixing member 22 that fixes the column member 18 relative to the printed circuit board 12 by screwing from the other surface 12B side of the printed circuit board 12 opposite to the one surface 12A into the threaded hole 18SH of the column member 18 inserted into the surrounding member 20.

[0051] Accordingly, even if a positioning column member for the configured object 14 relative to the printed circuit board 12 and a fixing column member for fixing the printed circuit board 12 and the configured object 14 are not separately provided, the configured object 14 can be mounted at a specified position relative to the printed circuit board 12, thereby enabling miniaturization.

[0052] The surrounding member 20 may also have an inclined surface 26F that is inclined so as to become higher as it is farther from the opening of the through hole 12H1 in the direction along one surface 12A of the printed circuit board 12. Thus, when the other end portion E2 of the support member 18 is inserted into the surrounding member 20, the support member 18 can be guided by the inclined surface 26F in such a manner that the threaded hole 18SH formed in the other end portion E2 of the support member 18 is disposed at the opening of the through hole 12H1. Therefore, the position of the support member 18 relative to the through hole 12H1 formed in the printed circuit board 12 can be accurately determined.

[0053] The surrounding member 20 may also be configured to be detachable from the printed circuit board 12 and is provided on one surface 12A of the printed circuit board 12 by being assembled to the printed circuit board 12. Thus, compared with the case where the surrounding member 20 is integrally formed with the printed circuit board 12, the position of the surrounding member 20 can be changed without changing the settings of an injection molding apparatus or the like that forms the substrate of the printed circuit board 12. As a result, design changes become easier.

[0054] The other end portion E2 of the support member 18 inserted into the surrounding member 20 may also contact one surface 12A of the printed circuit board 12. Thus, the height from one surface 12A of the printed circuit board 12 to the arrangement 14 can be made to coincide with the length of the support member 18, thereby reducing the tolerance.

[0055] (Second Technical Solution)

[0056] The second technical solution is an assembly 10 that includes a plurality of the above-described connection structures 16, a printed circuit board 12, and an arrangement 14.

[0057] Since the above-described connection structure 16 is included, similarly to the first technical solution, the arrangement 14 can be mounted at a specified position relative to the printed circuit board 12 without separately providing a positioning support member and a fixing support member, thereby enabling miniaturization.

[0058] The surrounding members 20 of the plurality of connection structures 16 may each have the same shape. Thus, compared with the case where the surrounding members 20 of the plurality of connection structures 16 each have a different shape, the number of components can be reduced.

Claims

1. A connection structure that connects a printed circuit board and an arrangement. A through hole is formed in the printed circuit board, and the arrangement is disposed at a distance from one surface of the printed circuit board. The connection structure is characterized by comprising: A strut member that extends in one direction from one end to the other end and is not inserted through the through hole. The one end is mounted on the arrangement, and a threaded hole is formed at the other end; A surrounding member that is provided on one surface of the printed circuit board, surrounds the opening of the through hole, and is capable of receiving the other end of the strut member; and A fixing member that fixes the strut member relative to the printed circuit board by screwing from the other surface side of the printed circuit board opposite to the one surface into the threaded hole of the strut member inserted into the surrounding member, The surrounding member does not contact the arrangement.

2. The connection structure according to claim 1, wherein The surrounding member has an inclined surface that is inclined so as to become higher as it is farther from the opening of the through hole in the direction along one surface of the printed circuit board.

3. The connection structure according to claim 1, wherein The surrounding member is detachable from the printed circuit board and is disposed on one surface of the printed circuit board by being assembled to the printed circuit board.

4. The connection structure according to claim 1, wherein The other end of the strut member inserted into the surrounding member contacts one surface of the printed circuit board.

5. An assembly, characterized in that It comprises a plurality of connection structures according to any one of claims 1 to 4, And comprises the printed circuit board and the arrangement.

6. The assembly according to claim 5, wherein The surrounding members of the plurality of connection structures are of the same shape.

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