Touch structure and manufacturing method thereof, display panel and display device

Abstract

The touch structure includes at least one touch function layer group and at least one protective pad layer, where the at least one touch function layer group includes an organic layer and a conductive layer stacked in sequence. The at least one protective pad layer is provided in one-to-one correspondence with the at least one touch function layer group, and the protective pad layer is located between the conductive layer and the organic layer of the corresponding touch function layer group. An orthogonal projection of the protective pad layer on the organic layer at least partially overlaps with an orthogonal projection of the conductive layer on the organic layer.

Description

Technical Field

[0001] (Cross - reference to related applications) This application claims priority based on a Chinese patent application with application number 202110929096.X filed on August 13, 2021 as the basic application, and all of its disclosure content is incorporated herein by reference.

[0002] This disclosure relates to the field of display technologies, and in particular, to a touch structure, a manufacturing method thereof, a display panel, and a display device.

Background Art

[0003] With the development of the display technology field, organic light - emitting diode (OLED) display panels have gradually become one of the mainstream products in the display technology field.

[0004] Currently, for OLED display panels equipped with large - sized touch displays, the touch performance and bending performance of the touch displays have received more attention.

Summary of the Invention

Means for Solving the Problems

[0005] In one aspect, a touch structure is provided. The touch structure includes at least one touch functional layer group and at least one protection pad layer. Here, the at least one touch functional layer group includes an organic layer and a conductive layer stacked in sequence. The at least one protection pad layer is provided in a one - to - one correspondence with the at least one touch functional layer group, and the protection pad layer is located between the conductive layer and the organic layer of the corresponding touch functional layer group. The orthographic projection of the protection pad layer on the organic layer at least partially overlaps with the orthographic projection of the conductive layer on the organic layer.

[0006] In some embodiments, at least one touch functional layer group includes a first touch functional layer group and a second touch functional layer group. The first touch functional layer group includes a first organic layer and a first conductive layer stacked in sequence. The second touch functional layer group is provided on a side of the first conductive layer away from the first organic layer, and the second touch functional layer group includes a second organic layer and a second conductive layer stacked in sequence.

[0007] Here, at least one protection pad layer is provided corresponding to the first conductive layer and / or the second conductive layer. The orthographic projection of the protection pad layer on the first organic layer at least partially overlaps with the orthographic projection of the corresponding conductive layer on the first organic layer.

[0008] In some embodiments, the orthographic projection of the protection pad layer on the first organic layer substantially overlaps with the orthographic projection of the corresponding conductive layer on the first organic layer. Or, the orthographic projection of the protection pad layer on the first organic layer is a closed figure, and the orthographic projection of the conductive layer corresponding to the protection pad layer on the first organic layer is located within the range of the closed figure.

[0009] In some embodiments, the touch structure includes a touch area and a binding area located on one side of the touch area. The orthographic projection of the protection pad layer on the first organic layer is shifted from the binding area.

[0010] In some embodiments, the at least one protection pad layer includes a first protection pad layer and / or a second protection pad layer. The first protection pad layer is provided corresponding to the first conductive layer and is located between the first conductive layer and the first organic layer. The second protection pad layer is provided corresponding to the second conductive layer and is located between the second conductive layer and the second organic layer.

[0011] In some embodiments, among the first conductive layer and the second conductive layer, the thickness of the conductive layer corresponding to which the protection pad layer is provided is 0.3 μm or more.

[0012] In some embodiments, a protection pad layer is correspondingly provided on one of the first conductive layer and the second conductive layer, and the thickness of the conductive layer on which the protection pad layer is correspondingly provided is greater than the thickness of the other conductive layer.

[0013] In some embodiments, a protection pad layer is correspondingly provided on one of the first conductive layer and the second conductive layer, and the other of the first conductive layer and the second conductive layer has a thickness of less than 0.3 μm.

[0014] In some embodiments, the touch structure includes a touch area, the touch structure includes a plurality of touch units provided in the touch area, and the plurality of touch units includes a plurality of first touch units and a plurality of second touch units. Each first touch unit extends along a first direction, and the plurality of first touch units are arranged side by side along a second direction. Each second touch unit extends along the second direction, and the plurality of second touch units are arranged side by side along the first direction.

[0015] The first touch unit includes a plurality of first touch electrodes and a plurality of first connection parts, and two adjacent first touch electrodes are electrically connected through the first connection part. The second touch unit includes a plurality of second touch electrodes and a plurality of second connection parts, and two adjacent second touch electrodes are electrically connected through the second connection part. Here, the plurality of first touch electrodes, the plurality of second touch electrodes and the plurality of first connection parts are provided on one of the first conductive layer and the second conductive layer, and the plurality of second connection parts are provided on the other of the first conductive layer and the second conductive layer.

[0016] Alternatively, the plurality of first touch electrodes, the plurality of second touch electrodes and the plurality of second connection parts are provided on one of the first conductive layer and the second conductive layer, and the plurality of first connection parts are provided on the other of the first conductive layer and the second conductive layer.

[0017] In some embodiments, the plurality of first touch electrodes, the plurality of second touch electrodes, and the plurality of first connection portions are provided on the same conductive layer, and a protection pad layer is correspondingly provided on the conductive layer where the plurality of second connection portions are located.

[0018] Alternatively, the plurality of first touch electrodes, the plurality of second touch electrodes, and the plurality of second connection portions are provided on the same conductive layer, and a protection pad layer is correspondingly provided on the conductive layer where the plurality of first connection portions are located.

[0019] In some embodiments, the touch structure further includes a plurality of auxiliary electrodes. The plurality of first touch electrodes and the plurality of second touch electrodes are provided on one of the first conductive layer and the second conductive layer, and the plurality of auxiliary electrodes are provided on the other of the first conductive layer and the second conductive layer. The orthographic projection of each auxiliary electrode on the first organic layer at least partially overlaps with the orthographic projection of a first touch electrode or a second touch electrode on the first organic layer, and the auxiliary electrode is electrically connected to the first touch electrode or the second touch electrode through a via of the second organic layer.

[0020] In some embodiments, the surface of the protection pad layer close to the corresponding conductive layer has a plurality of recesses, and the surface of the conductive layer away from the corresponding protection pad layer has a plurality of recesses.

[0021] In some embodiments, the material of the protection pad layer includes an inorganic material.

[0022] In some embodiments, the thickness of the protection pad layer is smaller than the thickness of the organic layer of the corresponding touch functional layer group.

[0023] In another aspect, a display panel is provided. The display panel includes a display substrate and the touch structure according to any of the above embodiments, and the touch structure is provided on the light-emitting side of the display substrate.

[0024] In some embodiments, the display substrate includes a package layer, and the touch structure is provided directly on the package layer.

[0025] In another aspect, a display device is provided. The display device includes the display substrate described in any of the above embodiments.

[0026] In yet another aspect, a method for manufacturing a touch structure is provided. The touch structure includes at least one touch function layer group, and each touch function layer group includes an organic layer and a conductive layer stacked in sequence. The manufacturing method includes the following steps.

[0027] Steps of forming the organic layer and the conductive layer in sequence. Here, before forming the conductive layer, the manufacturing method further includes a step of forming a protection pad layer on the organic layer, and an orthographic projection of the protection pad layer on the organic layer at least partially overlaps an orthographic projection of the conductive layer on the organic layer.

[0028] In some embodiments, at least one touch function layer group includes a first touch function layer group and a second touch function layer group. The first touch function layer group includes a first organic layer and a first conductive layer stacked in sequence, and the second touch function layer group includes a second organic layer and a second conductive layer stacked in sequence. The manufacturing method includes the following steps.

[0029] Steps of forming the first organic layer, the first conductive layer, the second organic layer, and the second conductive layer in sequence. Here, before forming the first conductive layer, the manufacturing method further includes a step of forming a first protection pad layer on the first organic layer, and an orthographic projection of the first protection pad layer on the first organic layer at least partially overlaps an orthographic projection of the first conductive layer on the first organic layer.

[0030] And / or, before forming the second conductive layer, the manufacturing method further includes a step of forming the second protective pad layer on one side of the second organic layer away from the first organic layer, and an orthographic projection of the second protective pad layer on the first organic layer at least partially overlaps with an orthographic projection of the second conductive layer on the first organic layer.

[0031] In some embodiments, the step of forming the first protective pad layer on the first organic layer includes the following steps.

[0032] A step of forming a first protective film on the first organic layer.

[0033] A step of forming the first conductive layer on one side of the first protective film away from the first organic layer.

[0034] A step of patterning the first protective film using the first conductive layer as a mask to obtain the first protective pad layer.

[0035] Alternatively, the touch structure includes a touch area and a binding area located on one side of the touch area. The step of forming the first protective pad layer on the first organic layer includes the following steps.

[0036] A step of forming a first protective film on the first organic layer.

[0037] A step of removing a part of the first protective film located in the binding area to obtain the first protective pad layer.

[0038] In some embodiments, the step of forming the second protective pad layer on one side of the second organic layer away from the first organic layer includes the following steps.

[0039] A step of forming a second protective film on one side of the second organic layer away from the first organic layer.

[0040] Forming the second conductive layer on one side of the second protective film away from the first organic layer.

[0041] Using the second conductive layer as a mask to pattern the second protective film to obtain the second protective pad layer.

[0042] Alternatively, the touch structure includes a touch area and a binding area located on one side of the touch area. The step of forming the second protective pad layer on one side of the second organic layer away from the first organic layer includes the following steps.

[0043] Forming a second protective film on one side of the second organic layer away from the first organic layer.

[0044] Removing a part of the second protective film located in the binding area to obtain the second protective pad layer.

Brief Description of the Drawings

[0045] Hereinafter, to more clearly explain the technical solutions according to the embodiments of the present disclosure, the drawings used in some embodiments of the present disclosure will be briefly described. However, it is obvious that the drawings in the following description are only a part of some embodiments of the present disclosure. Those skilled in the art can also obtain other drawings based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams and do not limit the actual dimensions of the products according to the embodiments of the present disclosure, the actual flow of the method, the actual timing of the signals, etc.

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DETAILED DESCRIPTION OF THE INVENTION

[0046] Hereinafter, with reference to the drawings, the technical solutions according to some embodiments of the present disclosure will be clearly and completely described. Of course, the embodiments described herein are only a part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments that can be easily conceived by those skilled in the art shall be included within the protection scope of the present disclosure.

[0047] Unless otherwise indicated in the context, in this specification and the claims, the term "comprise" and its other forms, such as the third-person singular form "comprises" and the present participle form "comprising", should be construed in an open, inclusive sense, that is, "including but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example", or "some examples", etc. are intended to indicate that a specific feature, structure, material, or characteristic related to this embodiment or example is included in at least one embodiment or example of the present disclosure. The above general expressions of the terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be included in any one or more embodiments or examples in any suitable manner.

[0048] Hereinafter, the terms "first" and "second" are used only for the purpose of description, and are not understood to explicitly or implicitly indicate relative importance or implicitly indicate the number of technical features shown. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the embodiments of the present disclosure, unless otherwise specified, "a plurality" means two or more.

[0049] When describing some embodiments, the terms "electrically connected" and its derivatives may be used. For example, when describing some embodiments, the term "electrically connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other.

[0050] "A and / or B" includes three combinations: only A, only B, and the combination of A and B.

[0051] Also, the use of "based on" means that a process, step, calculation, or other operation based on one or more described conditions or values may actually be based on additional conditions or may exceed the described values, and thus is open and inclusive.

[0052] This specification to As used herein, "substantially" includes the described value and the average value within an acceptable deviation range of a specific value, where the acceptable deviation range is determined considering the errors associated with the measurements being considered by those skilled in the art and the measurements of specific quantities (i.e., the limitations of the measurement system).

[0053] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views, which are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Thus, variations in shape with respect to the drawings, for example due to manufacturing techniques and / or tolerances, can be assumed. Accordingly, exemplary embodiments are not limited to the shapes of the regions shown herein and should be construed to include shape deviations resulting from manufacturing and the like. For example, an etching region shown as rectangular typically has curved features. Thus, the regions shown in the drawings are essentially exemplary and their shapes are not intended to represent the actual shape of the regions of the device nor to limit the scope of the exemplary embodiments.

[0054] In some embodiments of the present disclosure, a display device is provided. As shown in FIG. 1, the display device 1 may be an electroluminescence display device. This electroluminescence display device may be an OLED display device, for example, an Active Matrix Organic Light-Emitting Diode (abbreviated as AMOLED) display device.

[0055] The above display device 1 may be any device that displays regardless of whether it is moving (e.g., video) or stationary (e.g., still image), and regardless of text or image. More specifically, this embodiment is expected to be implemented in or associated with a plurality of electronic devices. The plurality of electrical devices include, for example (but not limited to), mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, video cameras, game consoles, wristwatches, clocks, calculators, television monitors, flat panel displays, computer monitors, car displays (e.g., speed / distance meter displays, etc.), navigators, cockpit controllers and / or displays, camera view displays (e.g., rear view camera displays in vehicles), electrophotography, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of an image of a single gemstone), etc.

[0056] As shown in FIGS. 2 and 3, the display device 1 includes a display panel 2 and has an Active Area (abbreviated as AA) AA for displaying an image. The display panel 2 includes a display substrate 3 and a touch structure 4, and the touch structure 4 is provided on the light-emitting side E of the display substrate 3.

[0057] Here, as shown in FIG. 3, the display substrate 3 includes a base 10, a plurality of driving circuits provided on the base 10, and a plurality of light-emitting elements L. Based on this, the display substrate 3 includes a plurality of sub-pixels, and each sub-pixel includes one pixel driving circuit and one light-emitting element L, and this pixel driving circuit is electrically connected to this light-emitting element L.

[0058] Exemplarily, the base 10 may have a multilayer structure. For example, as shown in FIG. 3, the base 10 may include a first polyimide layer, a buffer layer, and a second polyimide layer laminated in sequence. As another example, the base 10 may include a first polyimide layer, a first buffer layer, a second polyimide layer, and a second buffer layer laminated in sequence.

[0059] As shown in FIG. 3, the display substrate 3 further includes an active layer 104, a first gate insulating layer 105, a first gate conductive layer 106, a second gate insulating layer 107, a second gate conductive layer 108, an interlayer dielectric layer 109, and a source-drain conductive layer 110 laminated in sequence on the base 10.

[0060] Here, the first gate insulating layer 105 insulates the active layer 104 and the first gate conductive layer 106, the second gate insulating layer 107 insulates the first gate conductive layer 106 and the second gate conductive layer 108, and the interlayer dielectric layer 109 insulates the second gate conductive layer 108 and the source-drain conductive layer 110.

[0061] As shown in FIG. 3, each pixel driving circuit includes a plurality of thin film transistors TFTs and at least one capacitor C1, and one thin film transistor TFT and one capacitor C1 are shown in FIG. 3.

[0062] The thin film transistor TFT includes the active layer 104 a part of and the first gate insulating layer 105 a part of and a gate 106A provided in the first gate conductive layer 106, and the second gate insulating layer 107 a part of and the interlayer dielectric layer 109 a part ofand a source 110A and a drain 110B provided in the source-drain conductive layer 110 may also be included.

[0063] Exemplarily, the active layer 104 may be provided on the base 10. The first gate insulating layer 105 covers the base 10 and the active layer 104. The gate 106A is provided on one side of the first gate insulating layer 105 away from the base 10. The second gate insulating layer 107 covers the gate 106A and the first gate insulating layer 105. The interlayer dielectric layer 109 covers the second gate insulating layer 107. The source 110A and the drain 110B are provided on one side of the interlayer dielectric layer 109 away from the base 10. The source 110A and the drain 110B can be electrically connected to the active layer 104 through vias penetrating through three of the interlayer dielectric layer 109, the second gate insulating layer 107, and the first gate insulating layer 105, respectively.

[0064] It is understood that the gate 106A is provided on one side of the active layer 104 away from the base 10. That is, the gate 106A is located above the active layer 104. This thin-film transistor TFT is a top-gate type thin-film transistor. In some other embodiments, the gate 106A may be provided on one side of the active layer 104 close to the base 10. That is, the gate 106A is located below the active layer 104. This thin-film transistor TFT is a bottom-gate type thin-film transistor.

[0065] The capacitor C1 includes a first electrode plate 106B provided on the first gate conductive layer 106 and a second electrode plate 108A provided on the second gate conductive layer 108. The first electrode plate 106B is provided in the same layer as the gate 106A, and the second electrode plate 108A is provided between the second gate insulating layer 107 and the interlayer dielectric layer 109 and is provided opposite to the first electrode plate 106B.

[0066] As shown in FIG. 3, the display substrate 3 includes a passivation layer 111 and a planarization layer 112 that are sequentially stacked on one side away from the base 10 of the source-drain conductive layer 110. The passivation layer 111 and the planarization layer 112 cover the source 110A and the drain 110B and serve to protect the source 110A and the drain 110B.

[0067] In addition, the plurality of film layers where the pixel driving circuits are located further include gate lines, data lines, VDD lines, VSS lines, and the like. Each pixel driving circuit is electrically connected to a gate line, a data line, and a VDD line in order to output a driving signal to the light-emitting element L. Here, the VDD line may be a plurality of lines extending along the second direction Y in the display area AA, the VSS line may be provided to surround the display area AA in the peripheral area, and the light-emitting element L is electrically connected to the VSS line.

[0068] Here, the second direction Y coincides with the column direction of the plurality of sub-pixels provided in an array on the display substrate 3.

[0069] The plurality of film layers where the driving circuits are located further include a gate driving circuit and clock signal lines, STV lines, VGH lines, VGL lines, and the like that are electrically connected to the gate driving circuit.

[0070] As shown in FIG. 3, the display substrate 3 further includes a first electrode 113 provided on one side away from the base 10 of the planarization layer 112. The first electrode 113 is electrically connected to the source 110A through a via that penetrates the planarization layer 112 and the passivation layer 111.

[0071] As shown in FIG. 3, the display substrate 3 further includes a pixel definition layer 114 provided on one side away from the base 10 of the planarization layer 112. The pixel definition layer 114 has a plurality of openings, each opening exposes at least a part of the first electrode 113, and each opening is located within one sub-pixel.

[0072] As shown in FIG. 3, the light-emitting element L includes a first electrode 113, a light-emitting functional layer EL, and a second electrode 116.

[0073] Here, the light-emitting functional layer EL is located within the opening of the pixel definition layer 114 and is formed on the first electrode 113. This light-emitting functional layer EL may contain a low-molecular organic material or a high-molecular organic material, and may be a fluorescent light-emitting material or a phosphorescent light-emitting material capable of emitting red light, green light, blue light, or white light. Further, according to different actual needs, in different examples, the light-emitting functional layer EL may include one or more layers among an electron transport layer (abbreviated as ETL), an electron injection layer (abbreviated as EIL), a hole transport layer (abbreviated as HTL), and a hole injection layer (abbreviated as HIL).

[0074] The second electrode 116 covers the light-emitting functional layer EL. Note that the second electrodes 116 of the light-emitting elements L in each sub-pixel are connected to each other to form a planar electrode that covers the entire layer, and functions as a common electrode for each light-emitting element L.

[0075] Exemplarily, the first electrode 113 may be an anode, and the second electrode 116 may be a cathode. yes 。

[0076] The first electrode 113 of the light-emitting element L is electrically connected to the pixel driving circuit and receives a driving signal from the pixel driving circuit. The end of the second electrode 116 extends to the peripheral region and is electrically connected to the VSS line, receives the VSS signal from the VSS line, forms an electric field between the first electrode 113 and the second electrode 116, and excites the light-emitting functional layer EL to emit light.

[0077] As shown in FIG. 3, the display substrate 3 further includes a support portion 115 provided on one side away from the base 10 of the pixel definition layer 114. This support portion 115 can play a role in supporting and protecting the underlying film layer.

[0078] As shown in FIG. 3, the display substrate 3 further includes a package layer 117 provided on one side away from the base 10 of the second electrode 116. The package layer 117 may include a first inorganic package sub-layer 1171, an organic package sub-layer 1172, and a second inorganic package sub-layer 1173 that are sequentially stacked. The package layer 117 is used to package the display substrate 3 to prevent corrosion of the light-emitting element L due to the intrusion of water and oxygen.

[0079] As shown in FIG. 3, the technology of directly installing the touch structure 4 on the package layer 117 of the display substrate 3 includes FSLOC (Flexible Single-Layer On Cell) technology and FMLOC (Flexible Multi-Layer On Cell) technology.

[0080] Among them, the FSLOC technology can be based on the operating principle of self-capacitance (or voltage) detection, and generally uses a single-layer metal layer to form touch electrodes. When a finger touches the display device, the finger takes away the charge of the touch unit, and the touch IC realizes the touch function of the display device by detecting the change in the self-capacitance value (or voltage value) of the touch electrode to identify the touch position of the finger.

[0081] The FMLOC technology can be based on the operating principle of mutual capacitance detection. The touch structure 4 generally uses two-layer metal layers to form touch driving electrodes (TX) and touch sensing electrodes (RX). When a finger touches the display device, the finger takes away the charge of the touch driving electrode or the touch sensing electrode, and the touch IC realizes the touch function of the display device by detecting the change in the mutual capacitance value between the touch driving electrode and the touch sensing electrode to recognize the touch position of the finger.

[0082] In some embodiments of the present disclosure, a touch structure 4 is provided. As shown in FIGS. 4A and 4B, from the perspective of the film layer structure of the touch structure 4, the touch structure 4 includes at least one touch function layer group 40. The at least one touch function layer group 40 includes an organic layer 43 and a conductive layer 44 that are sequentially stacked.

[0083] Exemplarily, as shown in FIG. 4A, the touch structure 4 includes two touch functional layer groups 40. Each touch functional layer group 40 includes an organic layer 43 and a conductive layer 44 stacked in sequence. That is, the touch structure 4 includes two conductive layers 44. In this case, the display panel 2 having this touch structure 4 adopts the FMLOC technology.

[0084] Exemplarily, as shown in FIG. 4B, the touch structure 4 includes one touch functional layer group 40. This touch functional layer group 40 includes an organic layer 43 and a conductive layer 44 stacked in sequence. That is, the touch structure 4 includes one conductive layer 44. In this case, the display panel 2 having this touch structure 4 adopts the FSLOC technology.

[0085] As shown in FIGS. 4A and 4B, the touch structure 4 further includes at least one protective pad layer 205. At least one protective pad layer 205 is provided in a one-to-one correspondence with at least one touch functional layer group 40. The protective pad layer 205 is located between the conductive layer 44 and the organic layer 43 of the corresponding touch functional layer group 40. The orthographic projection of the protective pad layer 205 on the organic layer 43 at least partially overlaps with the orthographic projection of the conductive layer 44 on the organic layer 43.

[0086] In related technologies, the touch functional layer group of the touch structure often adopts an inorganic layer and a conductive layer stacked in sequence. As a result of the inventors' intensive research of the present disclosure, in a display panel having several large-sized displays, the voltage signal transmitted by the electrode (for example, the second electrode 116 shown in FIG. 3) in the display substrate close to the touch structure interferes with the voltage signal transmitted by the conductive layer in the touch structure, thereby affecting the touch performance of the touch structure. In addition, since the inorganic layer is an inorganic material layer, its bending performance is poor. As a result, the bending performance of the display panel formed by the display substrate and the touch structure is poor, which is disadvantageous for the manufacture of a display panel having a curved screen.

[0087] Compared with related technologies, in the above-described embodiments of the present disclosure, the touch structure 4 includes at least one touch function layer group 40. Each touch function layer group 40 includes an organic layer 43 and a conductive layer 44 stacked in sequence. Since the resistivity of the organic material is greater than that of the inorganic material, by using the organic layer 43 instead of the inorganic layer, the interference of the voltage signal transmitted from the electrode close to the touch structure 4 in the display substrate 3 to the voltage signal transmitted from the conductive layer 44 in the touch function layer group 40 of the touch structure 4 can be reduced, thereby improving the touch performance of the touch structure 4.

[0088] In addition, the organic layer 43 is an organic material layer, and the bending performance of the organic material layer is superior to that of the inorganic material layer, so that the bending performance of the display panel 2 formed by the display substrate 3 and the touch structure 4 can be improved, which is advantageous for the manufacture of the display panel 2 having a curved screen.

[0089] In addition, in the process of manufacturing the conductive layer 44, the conductive layer 44 is patterned by a dry etching process. The etching gas used in the dry etching process contains chlorine gas. Chlorine ions are likely to adsorb on the organic layer 43 and generate an acid when contacting water, and the acid corrodes the conductive layer 44 (see FIG. 28, the conductive layer 44 is a metal lattice structure, and among the lattice lines of the metal lattice, the portion located within the circle is corroded). Therefore, by providing the protection pad layer 205 between the conductive layer 44 and the organic layer 43 of the touch function layer group 40, the orthographic projection of the protection pad layer 205 on the organic layer 43 at least partially overlaps with the orthographic projection of the conductive layer 44 on the organic layer 43, and the contact area between the conductive layer 44 and the underlying organic layer 43 can be reduced. Thus, in the process of etching the conductive layer 44, the phenomenon that the conductive layer 44 is corroded by the acid on the organic layer 43 can be improved (see FIG. 26, the conductive layer 44 is a metal lattice structure, and no obvious corrosion phenomenon occurs on the lattice lines of the metal lattice).

[0090] Hereinafter, in the embodiments of the present disclosure, an example in which the FMLOC technology is adopted for the display panel 2 will be given for specific description.

[0091] In some embodiments, as shown in FIGS. 2 and 3, the touch structure 4 includes a touch area TA. Along the thickness direction Z of the display substrate 3, the touch area TA substantially coincides with the display area AA.

[0092] The touch structure 4 includes a plurality of touch units T provided in the touch area TA. The plurality of touch units T includes a plurality of first touch units T1 and a plurality of second touch units T2. Each first touch unit T1 extends along the first direction X, and the plurality of first touch units T1 are arranged side by side along the second direction Y. Each second touch unit T2 extends along the second direction Y, and the plurality of second touch units T2 are arranged side by side along the first direction X. The plurality of first touch units T1 and the plurality of second touch units T2 are insulated from each other.

[0093] The first touch unit T1 includes a plurality of first touch electrodes (touch sensing electrodes) T11 and a plurality of first connection parts T12. Two adjacent first touch electrodes T11 are electrically connected through the first connection part T12. The second touch unit T2 includes a plurality of second touch electrodes (touch driving electrodes) T21 and a plurality of second connection parts T22. Two adjacent second touch electrodes T21 are electrically connected through the second connection part T22. The touch IC realizes the touch function of the display device by detecting the change in the mutual capacitance value between the first touch electrode T11 and the second touch electrode T21 to recognize the finger touch operation.

[0094] Here, the first direction X coincides with the row direction of a plurality of sub-pixels provided in an array on the display substrate 3.

[0095] As shown in FIG. 4A, the touch function layer group 40 of the touch structure 4 includes a first touch function layer group 41 and a second touch function layer group 42. The first touch function layer group 41 includes a first organic layer 201 and a first conductive layer 202 stacked in sequence. The second touch function layer group 42 is provided on one side of the first conductive layer 202 away from the first organic layer 201, and the touch function layer group 42 includes a second organic layer 203 and a second conductive layer 204 stacked in sequence.

[0096] The touch structure 4 further includes at least one protection pad layer 205. The protection pad layer 205 is provided corresponding to the first conductive layer 202 and / or the second conductive layer 204, so that the protection pad layer 205 is located between the conductive layer 44 and the organic layer 43 of the corresponding touch function layer group 40.

[0097] It should be noted that the protection pad layer 205 is provided in a one-to-one correspondence with the touch function layer group 40, and the protection pad layer 205 is also provided corresponding to the conductive layer 44 and the organic layer 43 of this touch function layer group 40.

[0098] For example, the protection pad layer 205 is provided corresponding to the first touch function layer group 41, and the protection pad layer 205 is also provided corresponding to the first conductive layer 202 and the first organic layer 201 of the first touch function layer group 41.

[0099] As another example, the protection pad layer 205 is provided corresponding to the second touch function layer group 42, and the protection pad layer 205 is also provided corresponding to the second conductive layer 204 and the second organic layer 203 of the second touch function layer group 42.

[0100] Exemplarily, as shown in FIG. 4A, at least one protection pad layer 205 includes a first protection pad layer 2051. The first protection pad layer 2051 is provided corresponding to the first conductive layer 202 of the first touch function layer group 41, and the first protection pad layer 2051 is located between the first conductive layer 202 and the first organic layer 201.

[0101] Exemplarily, as shown in FIG. 8, at least one protection pad layer 205 includes a second protection pad layer 2052. The second protection pad layer 2052 is provided corresponding to the second conductive layer 204, and the second protection pad layer 2052 is located between the second conductive layer 204 and the second organic layer 203.

[0102] Exemplarily, as shown in FIG. 11, the touch structure 4 includes a first protective pad layer 2051 and a second protective pad layer 2052. The first protective pad layer 2051 is provided corresponding to the first conductive layer 202, and the first protective pad layer 2051 is located between the first conductive layer 202 and the first organic layer 201. The second protective pad layer 2052 is provided corresponding to the second conductive layer 204, and the second protective pad layer 2052 is located between the second conductive layer 204 and the second organic layer 203.

[0103] As shown in FIG. 4A, the orthographic projection of the protective pad layer 205 on the first organic layer 201 at least partially overlaps with the orthographic projection of the corresponding conductive layer 44 on the first organic layer 201.

[0104] Exemplarily, as shown in FIG. 4A, the orthographic projection of the first protective pad layer 2051 on the first organic layer 201 at least partially overlaps with the orthographic projection of the first conductive layer 202 on the first organic layer 201.

[0105] In related technologies, many touch structures adopt those in which a first inorganic layer, a first conductive layer, a second inorganic layer, and a second conductive layer are laminated in sequence. As a result of the inventors' intensive study of the present disclosure, in a display panel having several large-sized displays, the voltage signal transmitted by an electrode (for example, the second electrode 116 shown in FIG. 3) in the display substrate close to the touch structure interferes with the voltage signals transmitted by the first conductive layer and the second conductive layer in the touch structure, thereby affecting the touch performance of the touch structure. In addition, since both the first inorganic layer and the second inorganic layer are inorganic material layers, their bending performance is poor. As a result, the bending performance of the display panel formed by the display substrate and the touch structure is poor, which is disadvantageous for the manufacture of a display panel having a curved screen.

[0106] Compared with related technologies, in the above-described embodiments of the present disclosure, the touch structure 4 includes a first touch functional layer group 41 and a second touch functional layer group 42 stacked in order. That is, the touch structure 4 includes a first organic layer 201, a first conductive layer 202, a second organic layer 203, and a second conductive layer 204 stacked in order. Since the resistivity of the organic material is greater than that of the inorganic material, by using the first organic layer 201 instead of the first inorganic layer and the second organic layer 203 instead of the second inorganic layer, the voltage signal transmitted from the electrode close to the touch structure 4 in the display substrate 3 can be reduced. The interference to the voltage signals transmitted from the first conductive layer 202 and the second conductive layer 204 in the touch structure 4 can be reduced, thereby improving the touch performance of the touch structure 4.

[0107] In addition, both the first organic layer 201 and the second organic layer 203 are organic material layers, and the bending performance of the organic material layer is superior to that of the inorganic material layer, and the bending performance of the display panel 2 formed by the display substrate 3 and the touch structure 4 can be improved. Therefore, it is advantageous for the manufacture of the display panel 2 having a curved screen.

[0108] In addition, in the process of manufacturing the conductive layer 44 (the first conductive layer 202 and the second conductive layer 204), the conductive layer 44 is patterned by a dry etching process. The etching gas used in the dry etching process contains chlorine gas, and chlorine ions are likely to adsorb on the organic layer 43 and generate an acid when contacting water, and the acid corrodes the conductive layer 44 (see FIG. 28, the conductive layer 44 is a metal lattice structure, and among the lattice lines of the metal lattice, the portion located inside the circle is corroded). Therefore, by providing the protection pad layer 205 between the conductive layer 44 and the organic layer 43 of the touch functional layer group 40, the orthographic projection of the protection pad layer 205 on the first organic layer 201 is at least partially overlapped with the orthographic projection of the corresponding conductive layer 44 on the first organic layer 201, and the contact area between the conductive layer 44 and the underlying organic layer 43 can be reduced. Therefore, in the process of etching the conductive layer 44, the phenomenon that the conductive layer 44 is corroded by the acid on the organic layer 43 can be improved (see FIG. 26, the conductive layer 44 is a metal lattice structure, and no obvious corrosion phenomenon occurs on the lattice lines of the metal lattice).

[0109] In some embodiments, the materials of the first organic layer 201 and the second organic layer 203 include at least one of polymethyl methacrylate, organosilicon compound, polyimide, or epoxy resin.

[0110] In some embodiments, the thickness of the first organic layer 201 ranges from 1 μm to 4 μm. For example, the thickness is 1 μm, 2 μm, 2.5 μm, 3 μm, or 4 μm.

[0111] In some embodiments, the thickness of the second organic layer 203 ranges from 1 μm to 4 μm. For example, the thickness is 1 μm, 2 μm, 2.5 μm, 3 μm, or 4 μm.

[0112] In some embodiments, the material of the protection pad layer 205 includes an inorganic material. For example, the inorganic material may include silicon nitride.

[0113] It is understood that inorganic materials are less likely to adsorb chloride ions, and in the process of etching the conductive layer, the chloride ions adsorbed on the inorganic material layer are very few, and the concentration of the acid generated by contacting with water is very low. Therefore, by forming the protection pad layer 205 using an inorganic material, the corrosion phenomenon of the conductive layer can be reduced.

[0114] In some embodiments, the thickness of the protection pad layer 205 is smaller than the thickness of the organic layer 43 of the corresponding touch function layer group 40. By setting the protection pad layer 205 thinly, it is advantageous for simplifying the film formation process and patterning process of the protection pad layer 205.

[0115] Also, according to the above, the bending performance of the inorganic material layer is poor, and by setting the protection pad layer 205 thinly, the bending performance of the display panel 2 formed by the display substrate 3 and the touch structure 4 can be improved.

[0116] Exemplarily, as shown in FIG. 4A, the thickness of the first protection pad layer 2051 is smaller than the thickness of the first organic layer 201.

[0117] Exemplarily, as shown in FIG. 8, the thickness of the second protection pad layer 2052 is smaller than the thickness of the second organic layer 203.

[0118] In some embodiments, the thickness range of the protection pad layer 205 is 0.05 μm to 0.1 μm. For example, the thickness is 0.05 μm, 0.06 μm, 0.08 μm, 0.09 μm, or 0.1 μm.

[0119] In some embodiments, as shown in FIG. 20, the first conductive layer 202 and the second conductive layer 204 are a metal grid structure. Since the touch electrode of the metal grid structure has low resistance and high sensitivity, the touch sensitivity of the touch structure 4 can be improved. In addition, since the touch electrode of the metal grid structure has high mechanical strength, the weight of the touch structure 4 can be reduced.

[0120] In some embodiments, the first conductive layer 202 and the second conductive layer 204 may be a single-layer structure. In some other embodiments, the first conductive layer 202 and the second conductive layer 204 may be a laminated structure. For example, the first conductive layer 202 and the second conductive layer 204 may be metal layers of titanium, aluminum, and titanium laminated in sequence.

[0121] In some embodiments, as shown in FIG. 4A, At least the orthographic projection of the corresponding conductive layer 44 on the first organic layer 201 is the orthographic projection of the protection pad layer 205 on the first organic layer 201 located at .

[0122] In this way, the protection pad layer 205 can separate the conductive layer 44 and the organic layer 43 below it, so that in the process of etching the conductive layer 44, the phenomenon that the conductive layer 44 is corroded by the acid on the organic layer 43 can be avoided.

[0123] In some embodiments, as shown in FIGS. 4A and 8, the orthographic projection of the protection pad layer 205 on the first organic layer 201 substantially overlaps with the orthographic projection of the corresponding conductive layer 44 on the first organic layer 201.

[0124] Since the orthographic projection of the protection pad layer 205 on the first organic layer 201 substantially overlaps with the orthographic projection of the corresponding conductive layer 44 on the first organic layer 201, the contour of the protection pad layer 205 is substantially the same as the contour of the corresponding conductive layer 44, and it is understood that the protection pad layer 205 can exactly separate the corresponding conductive layer 44 and the organic layer 43 below this conductive layer 44. Therefore, in the process of etching the conductive layer 44, the problem that the conductive layer 44 is corroded by the acid on the organic layer 43 can be avoided.

[0125] Also, when the first conductive layer 202 and the second conductive layer 204 are in a metal grid structure, the contour of the protection pad layer 205 is substantially the same as the contour of the corresponding conductive layer 44, and as shown in FIG. 27, the shape of the protection pad layer 205 is also grid-shaped.

[0126] Exemplarily, as shown in FIG. 4A, the orthographic projection of the first protection pad layer 2051 on the first organic layer 201 substantially overlaps with the orthographic projection of the first conductive layer 202 on the first organic layer 201. In this case, FIG. 6 shows the arrangement of the first protection pad layer 2051 in the touch area TA.

[0127] Exemplarily, as shown in FIG. 8, the orthographic projection of the second protection pad layer 2052 on the first organic layer 201 substantially overlaps with the orthographic projection of the second conductive layer 204 on the first organic layer 201. In this case, FIG. 9 shows the arrangement of the second protection pad layer 2052 in the touch area TA.

[0128] In some embodiments, as shown in FIGS. 7 and 10, the orthographic projection of the protection pad layer 205 on the first organic layer 201 is a closed figure, and the orthographic projection of the conductive layer 44 corresponding to the protection pad layer 205 on the first organic layer 201 is located within the range of the closed figure.

[0129] Note that the "closed figure" refers to a figure in a closed state in that dimension, and means a closed figure composed of N (N is a positive integer) line segments or arcs. Therefore, the fact that the orthographic projection of the protection pad layer 205 on the first organic layer 201 is a closed figure means that the protection pad layer 205 is the entire film layer and there is no intaglio in the interior of the protection pad layer 205.

[0130] In the above-described embodiments of the present disclosure, the orthographic projection of the protection pad layer 205 on the first organic layer 201 is a closed figure, and the orthographic projection of the conductive layer 44 corresponding to the protection pad layer 205 on the first organic layer 201 is located within the range of the closed figure. Thus, the protection pad layer 205 can better separate the corresponding conductive layer 44 from the organic layer 43 below this conductive layer 44. Therefore, in the process of etching the conductive layer 44, the problem that the conductive layer 44 comes into contact with the organic layer 43 and is corroded by an acid can be avoided.

[0131] Exemplarily, the orthographic projection of the protection pad layer 205 on the first organic layer 201 substantially overlaps with the orthographic projection of the organic layer 43 corresponding to the protection pad layer 205 on the first organic layer 201. Thus, the protection pad layer 205 covers the organic layer 43 located below this conductive layer 44. Therefore, in the process of etching the conductive layer 44, the problem that the conductive layer 44 comes into contact with the organic layer 43 and is corroded by an acid can be avoided.

[0132] In some embodiments, as shown in FIG. 2, the touch structure 4 includes a binding region BD located on one side of the touch region TA. The orthographic projection of the protection pad layer 205 on the first organic layer 201 is shifted from the binding region BD.

[0133] It is understood that the display panel 2 is provided with a plurality of pins 5 located in the binding region BD, and is bound to a flexible printed circuit (abbreviation: FPC) via the plurality of pins 5 to receive a voltage signal from the flexible printed circuit. By shifting the orthographic projection of the protection pad layer 205 on the first organic layer 201 from the binding region BD, the protection pad layer 205 can expose the plurality of pins 5, whereby the plurality of pins 5 can be easily bound to the flexible printed circuit.

[0134] In some embodiments, as shown in FIG. 4A, a first protective pad layer 2051 is correspondingly provided on the first conductive layer 202, and no protective pad layer 205 is provided below the second conductive layer 204. The orthographic projection of the first protective pad layer 2051 on the first organic layer 201 substantially overlaps with the orthographic projection of the first conductive layer 202 on the first organic layer 201.

[0135] In some embodiments, as shown in FIG. 7, a first protective pad layer 2051 is correspondingly provided on the first conductive layer 202, and no protective pad layer 205 is provided below the second conductive layer 204. The orthographic projection of the first protective pad layer 2051 on the first organic layer 201 is a closed figure, the orthographic projection of the first conductive layer 202 on the first organic layer 201 is located within the range of the closed figure, and is shifted from the binding region BD.

[0136] In some embodiments, as shown in FIG. 8, no protective pad layer 205 is provided below the first conductive layer 202, and a second protective pad layer 2052 is correspondingly provided on the second conductive layer 204. The orthographic projection of the second protective pad layer 2052 on the first organic layer 201 substantially overlaps with the orthographic projection of the second conductive layer 204 on the first organic layer 201.

[0137] In some embodiments, as shown in FIG. 10, no protective pad layer 205 is provided below the first conductive layer 202, and a second protective pad layer 2052 is correspondingly provided on the second conductive layer 204. The orthographic projection of the second protective pad layer 2052 on the first organic layer 201 is a closed figure, the orthographic projection of the second conductive layer 204 on the first organic layer 201 is located within the range of the closed figure, and is shifted from the binding region BD.

[0138] In some embodiments, as shown in FIG. 11, a first protective pad layer 2051 is correspondingly provided on the first conductive layer 202, and a second protective pad layer 2052 is correspondingly provided on the second conductive layer 204. The orthographic projection of the first protective pad layer 2051 on the first organic layer 201 substantially overlaps with the orthographic projection of the first conductive layer 202 on the first organic layer 201. The orthographic projection of the second protective pad layer 2052 on the first organic layer 201 substantially overlaps with the orthographic projection of the second conductive layer 204 on the first organic layer 201.

[0139] In some embodiments, as shown in FIG. 12, a first protection pad layer 2051 is correspondingly provided on the first conductive layer 202, and a second protection pad layer 2052 is correspondingly provided on the second conductive layer 204. The orthographic projection of the first protection pad layer 2051 on the first organic layer 201 substantially overlaps with the orthographic projection of the first conductive layer 202 on the first organic layer 201. The orthographic projection of the second protection pad layer 2052 on the first organic layer 201 is a closed figure, and the orthographic projection of the second conductive layer 204 on the first organic layer 201 is located within the range of the closed figure and is shifted from the binding region BD.

[0140] In some embodiments, as shown in FIG. 13, a first protection pad layer 2051 is correspondingly provided on the first conductive layer 202, and a second protection pad layer 2052 is correspondingly provided on the second conductive layer 204. The orthographic projection of the first protection pad layer 2051 on the first organic layer 201 is a closed figure, and the orthographic projection of the first conductive layer 202 on the first organic layer 201 is located within the range of the closed figure and is shifted from the binding region BD. The orthographic projection of the second protection pad layer 2052 on the first organic layer 201 substantially overlaps with the orthographic projection of the second conductive layer 204 on the first organic layer 201.

[0141] In some embodiments, as shown in FIG. 14, a first protection pad layer 2051 is correspondingly provided on the first conductive layer 202, and a second protection pad layer 2052 is correspondingly provided on the second conductive layer 204. The orthographic projection of the first protection pad layer 2051 on the first organic layer 201 is a closed figure, and the orthographic projection of the first conductive layer 202 on the first organic layer 201 is located within the range of the closed figure and is shifted from the binding region BD. The orthographic projection of the second protection pad layer 2052 on the first organic layer 201 is a closed figure, and the orthographic projection of the second conductive layer 204 on the first organic layer 201 is located within the range of the closed figure and is shifted from the binding region BD.

[0142] According to the above, in the process of manufacturing the conductive layer 44, the conductive layer 44 is patterned by a dry etching process, and the etching gas used in the dry etching process contains chlorine gas. Therefore, the thinner the thickness of the conductive layer 44, the shorter the etching time, the fewer the chlorine ions adsorbed on the organic layer 43, and the lower the concentration of the acid generated by contacting with water. Conversely, the thicker the conductive layer 44, the longer the etching time, the more the chlorine ions adsorbed on the organic layer 43, and the higher the concentration of the acid generated by contacting with water.

[0143] Based on this, in some embodiments, as shown in FIGS. 4A and 8, in the first conductive layer 202 and the second conductive layer 204, the conductive layer 44 provided with the corresponding protection pad layer 205 may be set to be thicker than the conductive layer 44 without the corresponding protection pad layer 205.

[0144] Exemplarily, the thickness of the conductive layer 44 provided with the corresponding protection pad layer 205 is 0.3 μm or more, and for example, the thickness may be 0.3 μm, 0.5 μm, 0.6 μm, 0.8 μm or 1.0 μm.

[0145] Since the protection pad layer 205 is provided between the conductive layer 44 and the organic layer 43, it is understood that the conductive layer 44 can be set to be thicker. In the process of etching the conductive layer 44, even if the organic layer 43 contacts water and a high-concentration acid is generated, the conductive layer 44 is not corroded.

[0146] Also, by setting the conductive layer 44 to be thicker, the resistance of the conductive layer 44 can be reduced, thereby reducing the voltage drop generated when the conductive layer 44 transmits a voltage signal, which is advantageous for improving the touch performance of the touch structure 4.

[0147] Exemplarily, as shown in FIG. 4A, the first conductive layer 202 is provided with a corresponding first protection pad layer 2051, and the first conductive layer 202 may be set to be thicker.

[0148] Exemplarily, as shown in FIG. 8, a second protective pad layer 2052 is provided corresponding to the second conductive layer 204, and the second conductive layer 204 may be set to be thick.

[0149] In some embodiments, as shown in FIGS. 4A and 8, a protective pad layer 205 is provided corresponding to one of the first conductive layer 202 and the second conductive layer 204, and the thickness of the conductive layer 44 where the protective pad layer 205 is provided corresponding thereto is The protection pad layer 205 is not provided correspondingly greater than the thickness of the other conductive layer 44.

[0150] It is understood that a protective pad layer 205 is provided corresponding to one of the first conductive layer 202 and the second conductive layer 204, and no protective pad layer 205 is provided corresponding to the other. According to the above, for the conductive layer 44 where the protective pad layer 205 is not provided, the conductive layer 44 where the protective pad layer 205 is provided corresponding thereto can be set to be thick. Conversely, for the conductive layer 44 where the protective pad layer 205 is provided corresponding thereto, the conductive layer 44 where the protective pad layer 205 is not provided is set to be thin, whereby the thickness of the conductive layer 44 where the protective pad layer 205 is provided corresponding thereto is greater than the thickness of the conductive layer 44 where the protective pad layer 205 is not provided.

[0151] In the above embodiments of the present disclosure, since the conductive layer 44 is set to be relatively thin, the time for etching the conductive layer 44 can be shortened, the chlorine ions adsorbed on the organic layer 43 can be reduced, and the concentration of the acid generated when the chlorine ions on the organic layer 43 come into contact with water can be reduced. In this case, the protective pad layer 205 may not be provided between the conductive layer 44 and the organic layer 43 below it, that is, the conductive layer 44 is in direct contact with the organic layer 43, and a slight corrosion phenomenon occurs in the conductive layer 44.

[0152] Exemplarily, as shown in FIG. 4A, a protective pad layer 205 is provided corresponding to the first conductive layer 202, no protective pad layer 205 is provided corresponding to the second conductive layer 204, and the thickness of the first conductive layer 202 is greater than the thickness of the second conductive layer 204.

[0153] Exemplarily, as shown in FIG. 8, a protection pad layer 205 is not provided corresponding to the first conductive layer 202, a protection pad layer 205 is provided corresponding to the second conductive layer 204, and the thickness of the second conductive layer 204 is greater than the thickness of the first conductive layer 202.

[0154] In some embodiments, as shown in FIGS. 4A and 8, a protection pad layer 205 is provided corresponding to one of the first conductive layer 202 and the second conductive layer 204, and a protection pad layer 205 is not provided corresponding to the other below. The conductive layer 44 where the protection pad layer 205 is not provided corresponding to the conductive layer 44 where the protection pad layer 205 is provided is set to be thin.

[0155] Exemplarily, the thickness of the conductive layer 44 where the protection pad layer 205 is not provided is less than 0.3 μm, and for example, the thickness may be 0.1 μm, 0.15 μm, 0.2 μm, 0.26 μm, or 0.28 μm.

[0156] In some embodiments, as shown in FIG. 5, the surface of the protection pad layer 205 close to the corresponding conductive layer 44 has a plurality of recesses S, and the surface of the conductive layer 44 away from the corresponding protection pad layer 205 has a plurality of recesses S.

[0157] In the process of manufacturing the protection pad layer 205, a Chemical Vapor Deposition (abbreviated CVD) process is adopted. That is, by using ions moving at high speed to collide with the target material, after the target material is deposited, the protection pad layer 205 is formed, and the surface of the protection pad layer 205 away from the first organic layer 201 is collided by ions moving at high speed, and a plurality of recesses S are formed. Therefore, since the conductive layer 44 is manufactured on the protection pad layer 205 and the conductive layer 44 is adhered to the surface of the protection pad layer 205 by the action of gravity, the surface of the conductive layer 44 away from the corresponding protection pad layer 205 has a plurality of recesses S.

[0158] In this way, since the surface of the conductive layer 44 has a plurality of recesses S away from the corresponding protective pad layer 205, the roughness of the surface of the conductive layer 44 increases, thereby reducing the reflection of external environmental light by the conductive layer 44 and reducing the influence on the display screen of the display panel 2.

[0159] Hereinafter, the arrangement of the plurality of touch units T in the first conductive layer 202 and the second conductive layer 204 will be described.

[0160] In some embodiments, as shown in FIGS. 2, 4A, 15, and 16, the plurality of first touch electrodes T11, the plurality of second touch electrodes T21, and the plurality of first connection portions T12 are provided on one of the first conductive layer 202 and the second conductive layer 204, and the plurality of second connection portions T22 are provided on the other of the first conductive layer 202 and the second conductive layer 204.

[0161] Here, two adjacent first touch electrodes T11 are directly electrically connected via the first connection portion T12. The second connection portion T22 is electrically connected to two adjacent second touch electrodes T21 via the via H of the second organic layer 203.

[0162] Exemplarily, as shown in FIGS. 2 and 4A, the plurality of first touch electrodes T11, the plurality of second touch electrodes T21, and the plurality of first connection portions T12 are provided on the second conductive layer 204, and the plurality of second connection portions T22 are provided on the first conductive layer 202.

[0163] Since the second conductive layer 204 is farther away from the display substrate 3 than the first conductive layer 202, by providing the plurality of first touch electrodes T11 and the plurality of second touch electrodes T21 on the second conductive layer 204, it can be understood that the interference of the voltage signal transmitted from the electrodes close to the touch structure 4 of the display substrate 3 with the voltage signals transmitted from the first touch electrodes T11 and the second touch electrodes T21 can be reduced.

[0164] Further, the second conductive layer 204 is closer to the surface of the display panel 2 than the first conductive layer 202. By providing a plurality of first touch electrodes T11 and a plurality of second touch electrodes T21 on the second conductive layer 204, when a finger touches the surface of the display panel 2, it is advantageous for the finger to carry away the charges on the first touch electrodes T11 and the second touch electrodes T21, thereby being advantageous for improving the touch sensitivity of the touch structure 4.

[0165] Exemplarily, as shown in FIGS. 15 and 16, a plurality of first touch electrodes T11, a plurality of second touch electrodes T21, and a plurality of first connection portions T12 are provided on the first conductive layer 202, and a plurality of second connection portions T22 are provided on the second conductive layer 204.

[0166] In some embodiments, as shown in FIGS. 17 to 20, a plurality of first touch electrodes T11, a plurality of second touch electrodes T21, and a plurality of second connection portions T22 are provided on one of the first conductive layer 202 and the second conductive layer 204, and a plurality of first connection portions T12 are provided on the other of the first conductive layer 202 and the second conductive layer 204.

[0167] Here, the first connection portion T12 is electrically connected to two adjacent first touch electrodes T11 through the via H of the second organic layer 203. Two adjacent second touch electrodes T21 are directly electrically connected through the second connection portion T22.

[0168] Exemplarily, as shown in FIGS. 17 and 18, a plurality of first touch electrodes T11, a plurality of second touch electrodes T21, and a plurality of second connection portions T22 are provided on the first conductive layer 202, and a plurality of first connection portions T12 are provided on the second conductive layer 204.

[0169] Exemplarily, as shown in FIGS. 19 and 20, a plurality of first touch electrodes T11, a plurality of second touch electrodes T21, and a plurality of second connection portions T22 are provided on the second conductive layer 204, and a plurality of first connection portions T12 are provided on the first conductive layer 202.

[0170] In some embodiments, as shown in FIGS. 4A and 16, a plurality of first touch electrodes T11, a plurality of second touch electrodes T21, and a plurality of first connection portions T12 are provided on the same conductive layer 44, and a protection pad layer 205 is correspondingly provided on the conductive layer 44 where the plurality of second connection portions T22 are located.

[0171] It is understood that two adjacent first touch electrodes T11 are directly electrically connected through the first connection portion T12, and the second connection portion T22 is electrically connected to two adjacent second touch electrodes T21 through the via H of the second organic layer 203. That is, the second connection portion T22, as a bridge electrode, electrically connects two adjacent second touch electrodes T21 across the first connection portion T12.

[0172] By providing the protection pad layer 205 below the conductive layer 44 where the second connection portion T22 is located, according to the above, the thickness of the second connection portion T22 can be increased, and the resistance of the second connection portion T22 can be reduced, thereby reducing the voltage drop generated during the process of transmitting the voltage signal on the second connection portion T22, which is advantageous for improving the touch performance of the touch structure 4.

[0173] In some embodiments, as shown in FIGS. 18 and 20, a plurality of first touch electrodes T11, a plurality of second touch electrodes T21, and a plurality of second connection portions T22 are provided on the same conductive layer 44, and a protection pad layer 205 is correspondingly provided on the conductive layer 44 where the plurality of first connection portions T12 are located.

[0174] It is understood that the first connection portion T12 is electrically connected to two adjacent first touch electrodes T11 through the via H of the second organic layer 203. Two adjacent second touch electrodes T21 are directly electrically connected through the second connection portion T22. That is, the first connection portion T12, as a bridge electrode, electrically connects two adjacent first touch electrodes T11 across the second connection portion T22.

[0175] The principle of the foregoing embodiments is the same. By providing the protection pad layer 205 below the conductive layer 44 where the first connection portion T12 is located, the thickness of the first connection portion T12 can be increased, and the resistance of the first connection portion T12 can be reduced. Thereby, the voltage drop generated in the process of transmitting the voltage signal on the first connection portion T12 can be reduced, which is advantageous for improving the touch performance of the touch structure 4.

[0176] In some embodiments, as shown in FIGS. 21 and 22, the touch structure 4 further includes a plurality of auxiliary electrodes F. The plurality of first touch electrodes T11 and the plurality of second touch electrodes T21 are provided on one of the first conductive layer 202 and the second conductive layer 204, and the plurality of auxiliary electrodes F are provided on the other of the first conductive layer 202 and the second conductive layer 204. Here, the orthographic projection of each auxiliary electrode F on the first organic layer 201 at least partially overlaps with the orthographic projection of the first touch electrode T11 or the second touch electrode T21 on the first organic layer 201, that is, each auxiliary electrode F corresponds to one touch electrode, and the auxiliary electrode F is electrically connected to the corresponding touch electrode (the first touch electrode T11 or the second touch electrode T21) through the via H of the second organic layer 203.

[0177] In this way, by connecting the auxiliary electrode F in parallel with the first touch electrode T11 or the second touch electrode T21, the resistance of the first touch electrode T11 or the second touch electrode T21 can be reduced, and thereby, the voltage drop generated in the process of transmitting the voltage signal on the first touch electrode T11 or the second touch electrode T21 can be reduced, which is advantageous for improving the touch performance of the touch structure 4.

[0178] Exemplarily, as shown in FIG. 22, the plurality of first touch electrodes T11 and the plurality of second touch electrodes T21 are provided on the first conductive layer 202, and the plurality of auxiliary electrodes F are provided on the second conductive layer 204.

[0179] Exemplarily, the plurality of first touch electrodes T11 and the plurality of second touch electrodes T21 are provided on the second conductive layer 204, and the plurality of auxiliary electrodes F are provided on the first conductive layer 202.

[0180] In some embodiments, the first touch electrode T11 and the second touch electrode T21 are provided on the first conductive layer 202, the first connection portion T12 is provided on one of the first conductive layer 202 and the second conductive layer 204, and the second connection portion T22 is provided on the other of the first conductive layer 202 and the second conductive layer 204.

[0181] Exemplarily, as shown in FIGS. 23 and 24, the first connection portion T12 is provided on the first conductive layer 202, and the second connection portion T22 is provided on the second conductive layer 204.

[0182] Referring to FIGS. 23 and 24, the orthographic projection of the first connection portion T12 on the display substrate 3 overlaps the orthographic projection of the second connection portion T22 on the display substrate 3, and the region defined by the overlapping portion is the overlapping region B.

[0183] As shown in FIGS. 24 and 25, the second organic layer 203 includes a plurality of isolation portions 2030. One isolation portion 2030 is provided in each overlapping region B. At least the overlapping region B is The orthographic projection of the isolation portion 2030 on the display substrate 3 located at Both ends of the orthographic projection of the connection portion of the second conductive layer 204 on the display substrate 3 extend from the boundary line C of the orthographic projection of the isolation portion 2030 on the display substrate 3.

[0184] In the related art, since the first organic layer contains an organic material with poor high-temperature resistance, a low-temperature process (for example, an exposure and development process) is required to form an opening in the first organic layer. However, in this opening method, the resolution is low, and a phenomenon occurs where the first organic layer cannot be penetrated. As a result, the conductive pattern of the first conductive layer and the conductive pattern of the second conductive layer cannot be electrically connected through the via of the first organic layer, resulting in an open circuit. In addition, when using a low-temperature process to form an opening in the first organic layer, the uniformity of the critical dimensions (CD) of different openings is poor.

[0185] In the display panel 2 in the above-described embodiment of the present disclosure, the second organic layer 203 is patterned to form a plurality of isolation portions 2030. One isolation portion 2030 is provided in each overlapping region B, At least the overlapping region B is Orthographic projection of the isolation portion 2030 on the display substrate 3 located at . The first connection portion T12 and the second connection portion T22 are separated by the isolation portion 2030, and insulation between the first connection portion T12 and the second connection portion T22 in the overlapping region B is realized.

[0186] In addition, both ends of the orthographic projection of the connection portion of the second conductive layer 204 on the display substrate 3 extend from the boundary line C of the orthographic projection of the isolation portion 2030 on the display substrate 3. Therefore, both ends of this connection portion are in contact with the surfaces of two adjacent touch electrodes to form an electrical contact, ensuring a stable electrical connection between the touch electrode and the connection portion. Further, by using a low-temperature process to open holes in the second organic layer 203, the open holes cannot penetrate the second organic layer 203, avoiding the problem of an open circuit between the touch electrode and the connection portion.

[0187] In some embodiments, as shown in FIGS. 23 and 24, the first connection portion T12 is provided in the first conductive layer 202, the second connection portion T22 is provided in the second conductive layer 204, both ends of the first connection portion T12 are directly electrically connected to two adjacent first touch electrodes T11, and both ends of the second connection portion T22 are in contact with the surfaces of two adjacent second touch electrodes T21 to form an electrical contact.

[0188] Referring to FIG. 23, it can be understood that by integrally providing each first connection portion T12 with two adjacent first touch electrodes T11, the resistance of the connection site between the first connection portion T12 and the first touch electrode T11 can be reduced.

[0189] Referring to FIG. 24, both ends of the orthographic projection of the second connection portion T22 on the display substrate 3 extend from the boundary line C of the orthographic projection of the isolation portion 2030 on the display substrate 3, and the two second touch electrodes T21 adjacent to the second connection portion T22 are respectively placed on the surface of the second connection portion T22, ensuring a stable electrical connection between the second connection portion T22 and the second touch electrode T21. Further, by using a low-temperature process to open a hole in the second organic layer 203, the hole cannot penetrate the second organic layer 203, avoiding the problem of an open circuit between the second touch electrode T21 and the second connection portion T22.

[0190] In some embodiments, as shown in FIG. 4A, the touch structure 4 further includes a third organic layer 206. The third organic layer 206 is provided on one side of the second conductive layer 204 away from the first organic layer 201 and serves to protect the underlying film layers (e.g., the second conductive layer 204, the second organic layer 203, the first conductive layer 202, and the first organic layer 201).

[0191] [[ID=*8]]In some embodiments, the material of the third organic layer 206 may include at least one of polymethyl methacrylate, organosilicon compound, polyimide, or epoxy resin.

[0192] In some embodiments of the present disclosure, a method for manufacturing a touch structure is further provided. As shown in FIG. 29, the touch structure 4 includes at least one touch functional layer group 40. Each touch functional layer group 40 includes an organic layer 43 and a conductive layer 44 stacked in sequence.

[0193] The manufacturing method includes the step of sequentially forming the organic layer 43 and the conductive layer 44. Here, before forming the conductive layer 44, the manufacturing method further includes the step of forming a protective pad layer 205 on the organic layer 43. The orthographic projection of the protective pad layer 205 on the organic layer 43 at least partially overlaps with the orthographic projection of the conductive layer 44 on the organic layer 43.

[0194] Compared with related technologies, the manufacturing method of the present disclosure uses the organic layer 43 instead of the inorganic layer. Since the resistivity of the organic material is greater than that of the inorganic material, the voltage signal transmitted from the electrode close to the touch structure 4 in the display substrate 3 can reduce the interference with the voltage signal transmitted from the conductive layer 44 in the touch structure 4, thereby improving the touch performance of the touch structure 4.

[0195] In addition, the organic layer 43 is an organic material layer, and the bending performance of the organic material layer is superior to that of the inorganic material layer. The bending performance of the display panel 2 formed by the display substrate 3 and the touch structure 4 can be improved, which is advantageous for the manufacture of the display panel 2 having a curved screen.

[0196] In addition, in the process of manufacturing the conductive layer 44, the conductive layer 44 is patterned by a dry etching process. The etching gas used in the dry etching process contains chlorine gas. Chlorine ions are likely to adsorb on the organic layer 43 and generate an acid when contacting water, and the acid corrodes the conductive layer 44. Therefore, by providing the protective pad layer 205 between the conductive layer 44 and the organic layer 43, the orthographic projection of the protective pad layer 205 on the organic layer 43 at least partially overlaps with the orthographic projection of the conductive layer 44 on the organic layer 43, and the contact area between the conductive layer 44 and the organic layer 43 can be reduced. Therefore, in the process of etching the conductive layer 44, the phenomenon that the conductive layer 44 is corroded by the acid on the organic layer 43 can be improved.

[0197] In some embodiments, as shown in FIG. 30, at least one touch function layer group 40 includes a first touch function layer group 41 and a second touch function layer group 42. The first touch function layer group 41 includes a first organic layer 201 and a first conductive layer 202 stacked in sequence. The second touch function layer group 42 includes a second organic layer 203 and a second conductive layer 204 stacked in sequence.

[0198] The manufacturing method includes the steps of sequentially forming a first organic layer 201, a first conductive layer 202, a second organic layer 203, and a second conductive layer 204.

[0199] Here, before forming the first conductive layer 202, the manufacturing method further includes a step of forming a first protective pad layer 2051 on the first organic layer 201. The orthographic projection of the first protective pad layer 2051 on the first organic layer 201 at least partially overlaps with the orthographic projection of the first conductive layer 202 on the first organic layer 201.

[0200] Compared with the related art, in the above manufacturing method in the present disclosure, the first organic layer 201 is used instead of the first inorganic layer, and the second organic layer by using 203, since the resistivity of the organic material is greater than the resistivity of the inorganic material, the interference of the voltage signal transmitted from the electrode close to the touch structure 4 in the display substrate 3 to the voltage signals transmitted from the first conductive layer 202 and the second conductive layer 204 in the touch structure 4 can be reduced, thereby improving the touch performance of the touch structure 4.

[0201] Also, both the first organic layer 201 and the second organic layer 203 are organic material layers, and the bending performance of the organic material layer is superior to that of the inorganic material layer, so the bending performance of the display panel 2 formed by the display substrate 3 and the touch structure 4 can be improved, which is advantageous for the manufacture of the display panel 2 having a curved screen.

[0202] Also, in the process of manufacturing the first conductive layer 202, the first conductive layer 202 is patterned by a dry etching process. The etching gas used in the dry etching process includes chlorine gas, and chlorine ions are likely to adsorb on the first organic layer 201 and generate an acid when contacting water, and the acid corrodes the conductive layer 44. Therefore, by providing the first protective pad layer 2051 between the first conductive layer 202 and the first organic layer 201, the orthographic projection of the first protective pad layer 2051 on the first organic layer 201 at least partially overlaps with the orthographic projection of the first conductive layer 202 on the first organic layer 201, and the contact area between the first conductive layer 202 and the first organic layer 201 can be reduced. Thus, in the process of etching the first conductive layer 202, the phenomenon that the first conductive layer 202 is corroded by the acid on the first organic layer 201 can be improved.

[0203] In some embodiments, as shown in FIG. 31, the manufacturing method includes the step of sequentially forming a first organic layer 201, a first conductive layer 202, a second organic layer 203, and a second conductive layer 204.

[0204] Here, before forming the second conductive layer 204, the manufacturing method further includes the step of forming a second protection pad layer 2052 on one side of the second organic layer 203 away from the first organic layer 201. The orthographic projection of the second protection pad layer 2052 on the first organic layer 201 at least partially overlaps with the orthographic projection of the second conductive layer 204 on the first organic layer 201.

[0205] Compared with the related art, in the above manufacturing method in the present disclosure, the first organic layer 201 is used instead of the first inorganic layer, and the second organic layer by using 203, since the resistivity of the organic material is greater than that of the inorganic material, the interference of the voltage signal transmitted from the electrode close to the touch structure 4 in the display substrate 3 to the voltage signals transmitted from the first conductive layer 202 and the second conductive layer 204 in the touch structure 4 can be reduced, thereby improving the touch performance of the touch structure 4.

[0206] In addition, both the first organic layer 201 and the second organic layer 203 are organic material layers, and the bending performance of the organic material layer is superior to that of the inorganic material layer, so that the bending performance of the display panel 2 formed by the display substrate 3 and the touch structure 4 can be improved, which is advantageous for the manufacture of the display panel 2 having a curved screen.

[0207] In the process of manufacturing the second conductive layer 204, the second conductive layer 204 is patterned by a dry etching process. The etching gas used in the dry etching process contains chlorine gas. Chlorine ions are likely to adsorb on the second organic layer 203 and generate an acid when coming into contact with water, and the acid corrodes the conductive layer 44. Therefore, by providing the second protective pad layer 2052 between the second conductive layer 204 and the second organic layer 203, the orthographic projection of the second protective pad layer 2052 on the first organic layer 201 overlaps at least partially with the orthographic projection of the second conductive layer 202 on the first organic layer 201, and the contact area between the second conductive layer 204 and the second organic layer 203 can be reduced. Thus, in the process of etching the second conductive layer 204, the phenomenon that the second conductive layer 204 is corroded by the acid on the second organic layer 203 can be improved.

[0208] In some embodiments, as shown in FIG. 32, the manufacturing method includes the step of sequentially forming a first organic layer 201, a first conductive layer 202, a second organic layer 203, and a second conductive layer 204.

[0209] Here, before forming the first conductive layer 202, the manufacturing method further includes the step of forming a first protective pad layer 2051 on the first organic layer 201. The orthographic projection of the first protective pad layer 2051 on the first organic layer 201 overlaps at least partially with the orthographic projection of the first conductive layer 202 on the first organic layer 201.

[0210] Also, before forming the second conductive layer 204, the manufacturing method further includes the step of forming a second protective pad layer 2052 on one side of the second organic layer 203 away from the first organic layer 201. The orthographic projection of the second protective pad layer 2052 on the first organic layer 201 overlaps at least partially with the orthographic projection of the second conductive layer 204 on the first organic layer 201.

[0211] In some embodiments, the step of forming the first protective pad layer 2051 on the first organic layer 201 includes the following S11 - S13.

[0212] S11: As shown in FIG. 33, form a first protective film L1 on the first organic layer 201.

[0213] S12: As shown in FIG. 34, form a first conductive layer 202 on one side of the first protective film L1 away from the first organic layer 201.

[0214] S13: As shown in FIG. 35, using the first conductive layer 202 as a mask, pattern the first protective film L1 to obtain a first protective pad layer 2051.

[0215] In some embodiments, as shown in FIGS. 2 and 36, the touch structure 4 includes a touch area TA and a binding area BD located on one side of the touch area TA. The display substrate 3 includes a plurality of pins 5 located in the binding area BD. The step of forming the first protective pad layer 2051 on the first organic layer 201 includes the following S21 to S22.

[0216] S21: As shown in FIG. 37, form a first protective film L1 on the first organic layer 201.

[0217] S22: As shown in FIG. 38, remove a part of the first protective film L1 located in the binding area BD to obtain a first protective pad layer 2051.

[0218] Exemplarily, provide a photoresist layer on the surface of the first protective film L1 away from the first organic layer 201, use a mask to expose and develop a part of the photoresist layer located in the binding area BD, and remove a part of the photoresist layer located in the binding area BD. Using the remaining photoresist layer as a mask, etch a part of the first protective film L1 located in the binding area BD to obtain a first protective pad layer 2051.

[0219] Referring to FIG. 36, it can be seen that the touch structures 4 shown in FIGS. 37, 38, 42 to 45 are all partial cross-sectional views along the cross-section line G-G' of the display panel 2 in FIG. 36.

[0220] Also, as shown in FIGS. 37 and 38, the first protective film L1 directly covers a plurality of pins 5 located in the binding region BD of the display substrate 3, and using a patterning process, a part of the first protective film L1 located in the binding region BD is removed to expose a plurality of pins 5 of the display panel 2 located in the binding region BD, whereby the plurality of pins 5 can be easily bound to the flexible wiring board.

[0221] In some embodiments, the step of forming the second protective pad layer 2052 on one side of the second organic layer 203 away from the first organic layer 201 includes the following S31 to S33.

[0222] S31: As shown in FIG. 39, the step of forming a second protective film L2 on one side of the second organic layer 203 away from the first organic layer 201.

[0223] S32: As shown in FIG. 40, the step of forming a second conductive layer 204 on one side of the second protective film L2 away from the first organic layer 201.

[0224] S33 : As shown in FIG. 41, using the second conductive layer 204 as a mask, patterning the second protective film L2 to obtain the second protective pad layer 2052.

[0225] In some embodiments, of the second organic layer 203 the first organic layer 201 On one side away from it, a second protection pad layer 2052 the step of forming includes the following S41 to S42.

[0226] S41: As shown in FIG. 42, the step of forming a second protective film L2 on one side of the second organic layer 203 away from the first organic layer 201.

[0227] S42: As shown in FIG. 43, removing a part of the second protective film L2 located in the binding region BD to obtain the second protective pad layer 2052.

[0228] Exemplarily, a photoresist layer is provided on the surface of the second protective film L2 away from the first organic layer 201. Using a mask, a part of the photoresist layer located in the binding region BD is exposed and developed, and a part of the photoresist layer located in the binding region BD is removed. Using the remaining photoresist layer as a mask, a part of the second protective film L2 located in the binding region BD is etched to obtain the second protective pad layer 2052.

[0229] As shown in FIGS. 42 and 43, the second protective film L2 directly covers a plurality of pins 5 located in the binding region BD of the display substrate 3. Using a patterning process, a part of the second protective film L2 located in the binding region BD is removed to expose a plurality of pins 5 of the display panel 2 located in the binding region BD, so that the plurality of pins 5 can be easily bound to the flexible wiring board.

[0230] In some other embodiments, as shown in FIG. 44, a first protective film L1, a second organic layer 203, and a second protective film L2 are sequentially formed on the first organic layer 201.

[0231] As shown in FIG. 45, using the same patterning process, a part of the first protective film L1 and the second protective film L2 located in the binding region BD are respectively removed to obtain the first protective pad layer 2051 and the second protective pad layer 2052.

[0232] Exemplarily, a photoresist layer is provided on the surface of the second protective film L2 away from the first organic layer 201. Using a mask, a part of the photoresist layer located in the binding region BD is exposed and developed, and a part of the photoresist layer located in the binding region BD is removed. Using the remaining photoresist layer as a mask, a part of the first protective film L1 and the second protective film L2 located in the binding region BD are etched to obtain the first protective pad layer 2051 and the second protective pad layer 2052.

[0233] As shown in FIGS. 44 and 45, the first protective film L1 and the second protective film L2 directly cover a plurality of pins 5 of the display substrate 3 located in the binding region BD, and using the same patterning process, a part of the first protective film L1 and the second protective film L2 located in the binding region BD is removed to expose a plurality of pins 5 of the display panel 2 located in the binding region BD, whereby the plurality of pins 5 can be easily bound to the flexible wiring board.

[0234] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and all changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present disclosure are included within the technical scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be based on the scope described in the claims.

Claims

1. At least one touch function layer group including an organic layer and a conductive layer laminated in sequence; At least one protective pad layer provided in one-to-one correspondence with the at least one touch function layer group, wherein the protective pad layer among the at least one protective pad layer is located between the conductive layer and the organic layer of the corresponding touch function layer group, and the orthographic projection of the protective pad layer on the organic layer of the corresponding touch function layer group at least partially overlaps with the orthographic projection of the conductive layer on the organic layer of the corresponding touch function layer group; at least one protective pad layer; Comprising Touch structure.

2. The at least one touch function layer group is A first touch function layer group including a first organic layer and a first conductive layer laminated in sequence; A second touch function layer group provided on one side of the first conductive layer away from the first organic layer and including a second organic layer and a second conductive layer laminated in sequence; Including The at least one protective pad layer is provided corresponding to the first conductive layer and / or the second conductive layer, and the orthographic projection of the protective pad layer on the first organic layer at least partially overlaps with the orthographic projection of the corresponding conductive layer on the first organic layer. The touch structure according to claim 1.

3. The orthographic projection of the protective pad layer on the first organic layer substantially overlaps with the orthographic projection of the corresponding conductive layer on the first organic layer, Or The orthographic projection of the protective pad layer on the first organic layer is a closed figure, and the orthographic projection of the corresponding conductive layer on the first organic layer is located within the range of the closed figure, Or The orthographic projection of the protective pad layer on the first organic layer substantially overlaps with the orthographic projection of the corresponding conductive layer on the first organic layer. The touch structure includes a touch area and a binding area located on one side of the touch area. The orthographic projection of the protective pad layer on the first organic layer is shifted from the binding area. Or The orthographic projection of the protective pad layer on the first organic layer is a closed figure, and the orthographic projection of the corresponding conductive layer on the first organic layer is located within the range of the closed figure. The touch structure includes a touch area and a binding area located on one side of the touch area. The orthographic projection of the protective pad layer on the first organic layer is shifted from the binding area. The touch structure according to claim 2.

4. The at least one protective pad layer includes a first protective pad layer and / or a second protective pad layer. The first protective pad layer is provided corresponding to the first conductive layer and is located between the first conductive layer and the first organic layer. The second protective pad layer is provided corresponding to the second conductive layer and is located between the second conductive layer and the second organic layer. The touch structure according to claim 2 or claim 3.

5. Among the first conductive layer and the second conductive layer, the thickness of the conductive layer provided with the corresponding protective pad layer is 0.3 μm or more. The touch structure according to claim 2 or claim 3.

6. A protective pad layer is provided corresponding to one of the first conductive layer and the second conductive layer, and the thickness of the conductive layer provided with the corresponding protective pad layer is greater than the thickness of the other of the first conductive layer and the second conductive layer. Or A protective pad layer is provided corresponding to one of the first conductive layer and the second conductive layer, and the thickness of the conductive layer provided with the corresponding protective pad layer is greater than the thickness of the other of the first conductive layer and the second conductive layer. Among the first conductive layer and the second conductive layer, the thickness of the conductive layer without the corresponding protective pad layer is less than 0.3 μm. The touch structure according to claim 5.

7. The touch structure includes a touch area. The touch structure further includes A plurality of touch units provided in the touch area and including a plurality of first touch units and a plurality of second touch units. Each first touch unit extends along a first direction, and the plurality of first touch units are arranged side by side along a second direction. The first direction and the second direction intersect. Each second touch unit extends along the second direction, and the plurality of second touch units include a plurality of touch units arranged side by side along the first direction. The first touch unit includes a plurality of first touch electrodes and a plurality of first connection parts. Two adjacent first touch electrodes are electrically connected through the first connection part. The second touch unit includes a plurality of second touch electrodes and a plurality of second connection parts. Two adjacent second touch electrodes are electrically connected through the second connection part. The plurality of first touch electrodes, the plurality of second touch electrodes, and the plurality of first connection portions are provided on one of the first conductive layer and the second conductive layer, and the plurality of second connection portions are provided on the other of the first conductive layer and the second conductive layer, or The plurality of first touch electrodes, the plurality of second touch electrodes, and the plurality of second connection portions are provided on one of the first conductive layer and the second conductive layer, and the plurality of first connection portions are provided on the other of the first conductive layer and the second conductive layer. The touch structure according to claim 2 or claim 3.

8. The plurality of first touch electrodes, the plurality of second touch electrodes, and the plurality of first connection portions are provided on the same conductive layer, and a protection pad layer is correspondingly provided on the conductive layer where the plurality of second connection portions are located, or The plurality of first touch electrodes, the plurality of second touch electrodes, and the plurality of second connection portions are provided on the same conductive layer, and a protection pad layer is correspondingly provided on the conductive layer where the plurality of first connection portions are located. And / or The touch structure is The plurality of first touch electrodes and the plurality of second touch electrodes are provided on one of the first conductive layer and the second conductive layer, and the touch structure further includes a plurality of auxiliary electrodes provided on the other of the first conductive layer and the second conductive layer. The orthographic projection of each auxiliary electrode on the first organic layer at least partially overlaps with the orthographic projection of the first touch electrode of the plurality of first touch electrodes or the second touch electrode of the plurality of second touch electrodes on the first organic layer, and the auxiliary electrode is electrically connected to the first touch electrode or the second touch electrode through a via in the second organic layer. The touch structure according to claim 7.

9. The surface of the protection pad layer close to the corresponding conductive layer has a plurality of recesses, and the surface of the conductive layer away from the corresponding protection pad layer has a plurality of recesses. And / or The material of the protection pad layer includes an inorganic material. And / or The thickness of the protection pad layer is smaller than the thickness of the organic layer of the corresponding touch function layer group. The touch structure according to any one of claims 1 to 3.

10. A display substrate, The touch structure according to any one of claims 1 to 3 provided on the light-emitting side of the display substrate, comprising a display panel.

11. The display substrate includes a package layer, and the touch structure is provided directly on the package layer. The display panel according to claim 10.

12. Including the display panel according to claim 10, A display device.

13. A method for manufacturing a touch structure, the touch structure including at least one touch functional layer group, each touch functional layer group including an organic layer and a conductive layer stacked in sequence, the manufacturing method including: Including the step of sequentially forming the organic layer and the conductive layer, Before forming the conductive layer, the manufacturing method further includes the step of forming a protective pad layer on the organic layer, and an orthographic projection of the protective pad layer on the organic layer at least partially overlaps an orthographic projection of the conductive layer on the organic layer. A method for manufacturing a touch structure.

14. At least one touch functional layer group includes a first touch functional layer group and a second touch functional layer group. The first touch functional layer group includes a first organic layer and a first conductive layer stacked in sequence, and the second touch functional layer group includes a second organic layer and a second conductive layer stacked in sequence. The manufacturing method includes: Including the step of sequentially forming the first organic layer, the first conductive layer, the second organic layer, and the second conductive layer, Before forming the first conductive layer, the manufacturing method further includes the step of forming a first protective pad layer on the first organic layer, and an orthographic projection of the first protective pad layer on the first organic layer at least partially overlaps an orthographic projection of the first conductive layer on the first organic layer, and / or Before forming the second conductive layer, the manufacturing method further includes the step of forming a second protective pad layer on one side of the second organic layer away from the first organic layer, and an orthographic projection of the second protective pad layer on the first organic layer at least partially overlaps an orthographic projection of the second conductive layer on the first organic layer. The method for manufacturing a touch structure according to claim 13.

15. The step of forming a first protective pad layer on the first organic layer includes: The step of forming a first protective film on the first organic layer, The step of forming the first conductive layer on one side of the first protective film away from the first organic layer, Using the first conductive layer as a mask to pattern the first protective film to obtain the first protective pad layer, or The touch structure includes a touch area and a binding area located on one side of the touch area. The step of forming the first protection pad layer on the first organic layer is as follows: forming a first protection film on the first organic layer; removing a part of the first protection film located in the binding area to obtain the first protection pad layer, and and / or The step of forming a second protection pad layer on one side of the second organic layer away from the first organic layer is as follows: forming a second protection film on one side of the second organic layer away from the first organic layer; forming the second conductive layer on one side of the second protection film away from the first organic layer; using the second conductive layer as a mask to pattern the second protection film to obtain the second protection pad layer, or The touch structure includes a touch area and a binding area located on one side of the touch area. The step of forming a second protection pad layer on one side of the second organic layer away from the first organic layer is as follows: forming a second protection film on one side of the second organic layer away from the first organic layer; removing a part of the second protection film located in the binding area to obtain the second protection pad layer, and A method for manufacturing the touch structure according to claim 14.

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