Processing device and method for processing work-piece

Abstract

To separate a work-piece from a holding table unit efficiently and stably.SOLUTION: A processing device comprises a retaining table unit that can suction and retain a work-piece, and a processing unit that processes the work-piece suctioned and retained by the retaining table unit. The retaining table unit has a communication passage leading to an upper surface, a suction source connected to the communication passage through a first electromagnetic opening / closing valve, and a fluid supply source connected to the communication passage through a second electromagnetic opening / closing valve. When the suctioning and retaining of the work-piece by the retaining table unit is released, the first electromagnetic opening / closing valve is closed, so that the suction source is disconnected from the communication passage, and the second electromagnetic opening / closing valve is opened and closed intermittently, so that fluid can be intermittently supplied from the fluid supply source to the work-piece through the communication passage and the upper surface.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to a processing apparatus having a holding table unit that suction-holds a workpiece and processes the workpiece with a processing unit, and a method for processing a workpiece. [Background technology]

[0002] In the manufacturing process of device chips used in electronic devices such as mobile phones and personal computers, first, multiple intersecting division lines (streets) are set on the surface of a wafer made of a material such as a semiconductor. Then, devices such as ICs (Integrated Circuits) and LSIs (Large-scale Integrations) are formed in each area defined by the division lines. After that, the wafer is divided along the division lines to form individual thin device chips.

[0003] There is also known a method of manufacturing device chips by dividing a package substrate formed by arranging multiple chips vertically and horizontally and sealing each chip with a sealing resin (see, for example, Patent Document 1). In this method, for example, while the package substrate is directly held by suction on a holding table unit, the package substrate is cut by a cutting blade for each chip, thereby manufacturing device chips.

[0004] On the upper surface (holding surface) of the holding table unit that directly holds the workpiece such as a package substrate by suction, entrance grooves (relief grooves) that allow the cutting blade to enter are formed in a lattice pattern at positions corresponding to the planned dividing lines of the package substrate. Then, in each of the multiple areas partitioned by the entrance grooves on the upper surface, a suction port is formed for suction-holding the manufactured device chip. The workpiece is singulated by the cutting blade while being sucked by the multiple suction ports, and each device chip continues to be sucked by the corresponding suction port thereafter. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2016-40808 A Summary of the Invention [Problem to be solved by the invention]

[0006] Thereafter, when the workpiece (device chip) is removed from the holding table unit, the suction of the device chip from the suction port is stopped. However, even if the suction holding by the holding table unit is released, the workpiece (device chip) and the holding table unit may still be in close contact. Therefore, it is considered to release the close contact between the device chip and the holding table unit by ejecting a fluid from the suction port.

[0007] In processing equipment, various types of processing fluids containing specific active ingredients are sometimes used instead of pure water, which is generally supplied as a processing fluid to the workpiece during processing, in order to improve processing efficiency and processing quality. Since some types of processing fluid have a higher viscosity than pure water, if the processing fluid adheres to the upper surface (holding surface), it can cause a problem that it becomes difficult to remove the processed workpiece (device chip) from the holding table unit after processing.

[0008] Even when a highly viscous machining fluid is not used, if the workpiece is strongly sucked and held by the holding table unit, the workpiece may stick to the upper surface (holding surface) and become difficult to remove from the holding table unit. In order to address these problems, it is conceivable to increase the injection amount and injection pressure to inject the fluid from the suction port. However, this consumes a large amount of fluid, which reduces the machining efficiency of the workpiece in the machining device.

[0009] Furthermore, if the fluid injection conditions exceed even slightly the strength required for removing the workpiece, the workpiece (device chip) may move significantly on the upper surface (holding surface) of the holding table unit or may fly off with force. In particular, there is variation in the adhesion of the workpiece (device chip) to the holding table unit in each area partitioned by the entrance grooves on the upper surface. Therefore, there may be no fluid injection conditions that can reliably release the adhesion of the workpiece (device chip) to the holding table unit while preventing the workpiece (device chip) from flying off in all areas.

[0010] The present invention has been made in consideration of such problems, and its object is to provide a processing apparatus and a method for processing a workpiece that can efficiently and stably separate a workpiece held by a holding table unit from the holding table unit. [Means for solving the problem]

[0011] According to one aspect of the present invention, there is provided a processing apparatus comprising a holding table unit capable of suction-holding a workpiece, and a processing unit for processing the workpiece held by the holding table unit, wherein the holding table unit has a communicating passage leading to an upper surface, a suction source connected to the communicating passage via a first electromagnetic on-off valve, and a fluid supply source connected to the communicating passage via a second electromagnetic on-off valve, and when the workpiece is held by suction by the holding table unit, the second electromagnetic on-off valve is closed and the first electromagnetic on-off valve is opened to connect the suction source to the communicating passage, so that negative pressure generated by the suction source can be applied to the workpiece placed on the holding table unit through the communicating passage and the upper surface, and when the suction-holding of the workpiece by the holding table unit is released, the first electromagnetic on-off valve is closed to isolate the suction source from the communicating passage, and the second electromagnetic on-off valve is intermittently opened and closed to intermittently supply fluid from the fluid supply source to the workpiece through the communicating passage and the upper surface.

[0012] Preferably, the apparatus further includes a storage mechanism having a storage section that stores the workpiece so as to restrict movement of the workpiece in a direction parallel to the upper surface and that can store the workpiece placed on the holding table unit, and when the suction hold of the workpiece by the holding table unit is released, the workpiece is stored in the storage section of the storage mechanism before the fluid is intermittently supplied to the workpiece.

[0013] More preferably, the apparatus further includes a moving unit for moving the storage mechanism, and the storage mechanism that stores the workpiece in the storage section can be moved by the moving unit, thereby enabling the workpiece to be removed from the holding table unit.

[0014] More preferably, the holding table unit is capable of suction-holding the workpiece placed on the holding table unit via a holding jig which has a through hole communicating vertically and is placed on its upper surface, the accommodating mechanism is capable of holding the holding jig, and when the suction-holding of the workpiece by the holding table unit is released, the fluid can be intermittently supplied to the holding jig from the fluid supply source through the communicating passage and the upper surface, and the workpiece can be transported together with the holding jig from the holding table unit while supported by the holding jig by moving the accommodating mechanism which holds the holding jig with the moving unit.

[0015] According to another aspect of the present invention, in a processing apparatus including a holding table unit capable of suction-holding a workpiece, and a processing unit that processes the workpiece held by the holding table unit, a processing method for processing the workpiece by the processing unit is provided, the method comprising the steps of: placing the workpiece on the holding table unit and suction-holding the workpiece by the holding table unit; after the holding step, processing the workpiece held by the holding table unit by the processing unit; after the processing step, a suction release step of releasing the suction hold of the workpiece by the holding table unit; and after the suction release step, a fluid supply step of intermittently supplying a fluid to the workpiece from the upper surface of the holding table unit.

[0016] Preferably, prior to the fluid supply step, the method further includes a accommodating step of accommodating the workpiece in a accommodating section of a accommodating mechanism which has a accommodating section for accommodating the workpiece in the accommodating section and restricts the workpiece from moving in a direction parallel to the top surface by accommodating the workpiece in the accommodating section.

[0017] More preferably, the method further comprises, after the fluid supplying step, a carrying-out step of carrying out the workpiece from the holding table unit by moving the accommodation mechanism that accommodates the workpiece in the accommodation portion.

[0018] More preferably, in the holding step, the workpiece is placed on the holding table unit via a holding jig which has a through hole communicating vertically and rests on the upper surface, and the holding table unit suction-holds the workpiece via the holding jig, and in the fluid supply step, the fluid is intermittently supplied to the holding jig together with the workpiece from the upper surface of the holding table unit, and after the accommodating step and before the unloading step, the holding jig is fixed to the accommodating mechanism, and in the unloading step, the workpiece is unloaded from the holding table unit together with the holding jig while supported by the holding jig by moving the accommodating mechanism. Effect of the Invention

[0019] In a processing apparatus and a method for processing a workpiece according to one aspect of the present invention, after the suction-holding of the workpiece held by the holding table unit is released, a fluid is supplied to the workpiece from the upper surface (holding surface) of the holding table unit. At this time, the supply of the fluid to the workpiece is not continuous, and the strength of the fluid supply is not constant. In other words, the fluid is supplied to the workpiece in an intermittent manner in which the supply and halt are repeated. In this case, the supply and halt of the fluid are switched on and off many times, and the state in which the workpiece is subjected to a force from the fluid and the state in which it is not subjected to the force are frequently repeated.

[0020] The repetition of these two states produces a gentle shock that is applied to the workpiece, and the contact between the upper surface of the holding table unit and the workpiece is gradually released. In this case, unlike when the fluid is continuously and strongly supplied to the workpiece, the fluid does not act violently on the workpiece whose contact has been released, and the workpiece is less likely to move or scatter. In addition, when the fluid is supplied to the workpiece intermittently, there are times when the supply of the fluid is stopped, and therefore less fluid is consumed than when the fluid is continuously supplied to the workpiece.

[0021] Therefore, according to one aspect of the present invention, a processing apparatus and a method for processing a workpiece are provided that can efficiently and stably separate a workpiece held by a holding table unit through suction from the holding table unit. [Brief description of the drawings]

[0022] [Figure 1] FIG. 2 is a perspective view showing a processing device. [Diagram 2] 1 is a perspective view showing a schematic view of a first surface (front surface) side of a workpiece. [Diagram 3] 3 is a perspective view showing a schematic view of a second surface (rear surface) of a workpiece. FIG. [Figure 4] FIG. 2 is a perspective view showing a schematic view of a part of an example of the configuration of a holding table unit. [Diagram 5] FIG. 2 is a cross-sectional view illustrating a schematic configuration example of a holding table unit. [Figure 6] 11 is a cross-sectional view showing a schematic view of a holding table unit and a workpiece in a holding step. FIG. [Figure 7] 4 is a cross-sectional view showing a schematic view of a holding table unit and a workpiece in a processing step. FIG. [Figure 8] 11 is a cross-sectional view showing a schematic view of the holding table unit and the workpiece in a first stage of the suction release step. FIG. [Figure 9] 13 is a cross-sectional view showing a schematic view of the holding table unit and the workpiece in a second stage of the suction release step. FIG. [Figure 10]FIG. 11 is a cross-sectional view illustrating a schematic view of a holding table unit and a workpiece in a fluid supplying step. [Figure 11] 10 is a cross-sectional view showing a schematic view of a state in which a workpiece is placed on a holding jig in order to place the workpiece on a holding table unit. FIG. [Figure 12] 11 is a cross-sectional view showing a schematic view of a holding table unit, a workpiece, and a storage mechanism in a storage step. FIG. [Figure 13] 13 is a cross-sectional view showing a schematic view of a holding table unit, a workpiece, and a containing mechanism in a fluid supplying step. FIG. [Figure 14] 13 is a cross-sectional view showing a schematic view of the holding table unit, the workpiece, and the accommodation mechanism in a carrying-out step. FIG. [Figure 15] 3 is a flowchart showing the flow of each step of a method for machining a workpiece. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. In the processing device and the method for processing a workpiece according to this embodiment, the workpiece is suction-held by a holding table unit and processed. First, the workpiece will be described. FIG. 2 is a perspective view showing the workpiece 11 seen from a predetermined direction, and is a perspective view typically showing the first surface 13a side of the workpiece 11. FIG. 3 is a perspective view showing the workpiece 11 seen from the opposite direction to FIG. 2, and is a perspective view typically showing the second surface 13b side of the workpiece 11.

[0024] The workpiece 11 is, for example, a package substrate obtained by sealing a plurality of devices with a resin. As shown in Fig. 2 and Fig. 3, the workpiece 11 includes a substrate 13 having a rectangular first surface (front surface) 13a and a rectangular second surface (back surface) 13b located on the opposite side to the first surface 13a. The substrate 13 is mainly made of a metal such as 42 alloy (an alloy of iron and nickel) or copper, and is divided into a plurality of device regions 15 (three device regions 15 in this embodiment) and a surplus region 17 surrounding each of the device regions 15.

[0025] Each device region 15 is further divided into a plurality of regions (16 regions in this embodiment) by a plurality of mutually intersecting division lines (streets) 19, and a plurality of stages 21 divided by the division lines 19 are exposed on the first surface 13a side of the substrate 13. Around each stage 21 (areas overlapping with the division lines 19), a plurality of metal layers (not shown) insulated from each other by, for example, resin or the like are arranged.

[0026] Devices (device chips) (not shown) such as ICs (Integrated Circuits), LEDs (Light Emitting Diodes), MEMS (Micro Electro Mechanical Systems), etc. are mounted on the second surface 13b side of each stage 21. The electrodes of each device and metal layers arranged around the stage 21 are connected by metal wires (not shown) or the like, and a part of each metal layer becomes an electrode of a chip (packaged device chip) obtained by dividing the workpiece 11.

[0027] A resin layer 23 that seals the above-mentioned devices, metal wires, etc. is provided on the second surface 13b side of the substrate 13. The resin layer 23 is formed to a predetermined thickness and protrudes from the second surface 13b of the substrate 13. The resin layer 23 covers the entire second surface 13b side of each device region 15.

[0028] In this embodiment, the workpiece 11 is a package substrate including the substrate 13, but there are no limitations on the shape, structure, size, material, etc. of the package substrate. In addition, the workpiece 11 is not limited to this. In the following, an example will be described in which the workpiece is a package substrate, but the workpiece processed by the processing device and processing method according to this embodiment is not limited to a package substrate.

[0029] Next, a processing device according to this embodiment will be described. Hereinafter, as an example of a processing device for processing the workpiece 11, a cutting device for cutting the workpiece 11 with a cutting blade will be described, but the processing device according to this embodiment is not limited to a cutting device. The processing device according to this embodiment may be a grinding device for grinding the workpiece 11 with a grinding wheel, a polishing device for polishing the workpiece 11 with a polishing pad, a laser processing device for laser processing the workpiece 11, or a cleaning device for cleaning the workpiece 11.

[0030] Fig. 1 is a perspective view showing a schematic diagram of a processing device (cutting device) 2 according to this embodiment. Some components of the processing device 2 are omitted in Fig. 1. In addition, the X-axis direction (front-rear direction, processing feed direction), the Y-axis direction (left-right direction, indexing feed direction), and the Z-axis direction (vertical direction, cutting feed direction) used in the following description are perpendicular to each other.

[0031] As shown in FIG. 1, the processing device 2 includes a base 4 that supports a plurality of components. An opening 4a that is long in the X-axis direction is formed on the top surface of the base 4. A ball screw type table movement mechanism (not shown) is disposed within this opening 4a. The table movement mechanism includes an X-axis movement table (not shown) and moves this X-axis movement table in the X-axis direction. The tops of the table movement mechanism and the X-axis movement table are covered with a table cover 8 and a bellows-shaped cover 10.

[0032] The processing device 2 includes a holding table unit 6 capable of suction-holding a workpiece 11. A portion of the configuration of the holding table unit 6 is supported on an X-axis moving table, and a further portion of the configuration is exposed upward from a table cover 8.

[0033] For example, a rectangular parallelepiped table base 12 is arranged in a manner that it is exposed upward from the table cover 8. The table base 12 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis that is approximately parallel to the Z-axis direction.

[0034] Moreover, the table base 12 moves in the X-axis direction together with the X-axis moving table by the above-mentioned table moving mechanism. A table body 14 for holding a plate-shaped workpiece 11 is attached to the upper part of the table base 12 in such a manner that it can be removed from the table base 12 as necessary. In other words, the table body 14 corresponding to the specifications of the workpiece 11 to be processed by the processing device 2 is placed on the table base 12. The table body 14 is a rectangular flat plate in a plan view, and its upper surface 14a serves as a holding surface for sucking and holding the workpiece 11.

[0035] 5 and other figures, a plurality of screw holes 12c are formed in the corners of the table base 12. Furthermore, the table body 14 is formed with through holes through which the screws 48 are passed in an arrangement corresponding to the arrangement of the screw holes 12c of the table base 12. With the table body 14 placed on the table base 12, the screws 48 are passed through the through holes of the table body 14 and then tightened into the screw holes 12c of the table base 12, whereby the table body 14 is fixed to the table base 12.

[0036] Fig. 4 is a perspective view that typically shows a part of a configuration example of the holding table unit 6, and Fig. 5 is a cross-sectional view that typically shows a configuration example of the holding table unit 6. In Fig. 5, some of the components are shown by figures such as blocks and lines.

[0037] On the upper surface 14a (upper surface, holding surface of the holding table unit 6) of the table body 14, protrusions 42 are formed that protrude upward in an arrangement corresponding to each chip (not shown) of the workpiece 11, and also access grooves 44 are formed in an arrangement corresponding to the planned dividing lines 19 of the workpiece 11. The upper ends of the access grooves 44 open to the upper surface 14a (upper surface, holding surface of the holding table unit 6) of the table body 14. The access grooves 44 divide the upper surface (holding surface) 14a into a plurality of regions that correspond to the arrangement of chips formed by dividing the workpiece 11.

[0038] The width of the entrance groove 44 is, for example, wider than the width of a cutting edge 38a (see FIG. 7) of the cutting blade 38 described later, and the depth of the entrance groove 44 is, for example, deeper than the maximum cutting depth of the cutting blade 38. Therefore, even if the cutting blade 38 is caused to cut deeply enough when cutting the workpiece 11 along the intended division line 19, the table body 14 and the cutting blade 38 will not come into contact with each other. In addition, the upper surface 14a of the table body 14 is lower than the upper surface of the protruding portion 42 around the protruding portion 42, so that even if the cutting blade 38 moves around the protruding portion 42, the table body 14 and the cutting blade 38 will not come into contact with each other.

[0039] In each region of the protruding portion 42 partitioned by the entrance grooves 44, suction ports 46 are formed which penetrate the table body 14 vertically and open to the top surface 14a. As shown in Fig. 5, a recess 12d is formed in the center of the top surface 12a side of the table base 12, with one end of a communication passage 50 opening, and when the table body 14 is placed on the top surface 12a of the table base 12, each suction port 46 is connected to the communication passage 50 via the recess 12d.

[0040] The other end of the communication passage 50 is connected to a suction source 52 via a pressure gauge 56 and a first electromagnetic on-off valve 54. Therefore, when the workpiece 11 is placed on the upper surface 14a (upper surface, holding surface of the holding table unit 6) of the table body 14 placed on the upper surface 12a of the table base 12 and the first electromagnetic on-off valve 54 is opened, the negative pressure of the suction source 52 acts on the workpiece 11, and the workpiece 11 is sucked and held. Note that before opening the first electromagnetic on-off valve 54, the planned dividing line 19 of the workpiece 11 is aligned with the entrance groove 44.

[0041] Thus, the holding table unit 6 has a communication passage 50 leading to the upper surface 14a of the table body 14 (upper surface, holding surface of the holding table unit 6), and a suction source 52 connected to the communication passage 50 via a first electromagnetic opening / closing valve 54.

[0042] For example, the suction source 52 may be a pump or an ejector, or may be a facility of a factory or the like in which the processing device 2 is installed. The communication passage 50 connecting the suction source 52 and the table base 12 is composed of members such as a hose, a tube, and a pipe. The first electromagnetic on-off valve 54 provided in the communication passage 50 is, for example, a solenoid valve. The pressure gauge 56 is used to monitor the pressure inside the communication passage 50. However, the communication passage 50, the suction source 52, the first electromagnetic on-off valve 54, and the pressure gauge 56 are not limited to these.

[0043] After the processing of the workpiece 11 is completed, the first electromagnetic on-off valve 54 closes the communication passage 50 to separate the suction source 52 from the communication passage 50. This releases the workpiece 11 from the suction holding by the holding table unit 6, and the workpiece 11 becomes available for removal.

[0044] As shown in Fig. 1, a gate-shaped support structure 16 is disposed on the upper surface of the base 4 so as to straddle the opening 4a. A pair of machining unit moving mechanisms 18 is provided on the upper part of the front surface of the support structure 16. Each machining unit moving mechanism 18 commonly includes a pair of Y-axis guide rails 20 that are disposed on the front surface of the support structure 16 and are generally parallel to the Y-axis direction. A Y-axis moving plate 22 constituting each machining unit moving mechanism 18 is attached to the Y-axis guide rails 20 in a manner that allows it to slide along the Y-axis direction.

[0045] A nut (not shown) constituting a ball screw is provided on the back surface (rear surface) side of each Y-axis moving plate 22. A screw shaft 24 that is generally parallel to the Y-axis guide rail 20 is rotatably connected to this nut. A Y-axis pulse motor 26 is connected to one end of the screw shaft 24. When the screw shaft 24 is rotated by the Y-axis pulse motor 26, the Y-axis moving plate 22 moves in the Y-axis direction along the Y-axis guide rail 20.

[0046] A pair of Z-axis guide rails 28 that are generally parallel to the Z-axis direction are disposed on the surface (front surface) of the Y-axis moving plate 22. A Z-axis moving plate 30 is attached to the Z-axis guide rails 28 in such a manner that it can slide along the Z-axis direction. A nut (not shown) that constitutes a ball screw is provided on the back surface (rear surface) side of the Z-axis moving plate 30.

[0047] A screw shaft 32 that is generally parallel to the Z-axis guide rail 28 is rotatably connected to this nut. A Z-axis pulse motor 34 is connected to one end of the screw shaft 32. When the Z-axis pulse motor 34 rotates the screw shaft 32, the Z-axis moving plate 30 moves in the Z-axis direction along the Z-axis guide rail 28.

[0048] A processing unit (cutting unit) 36 that processes (cuts) the workpiece 11 suction-held by the holding table unit 6 is provided below the Z-axis moving plate 30. The processing unit 36 ​​includes, for example, a cylindrical spindle housing. A spindle 36a (see FIG. 7) that serves as a rotation axis generally parallel to the Y-axis direction is accommodated in the space inside the spindle housing.

[0049] A rotary drive source such as a motor is connected to the base end of the spindle 36a. The tip of the spindle 36a is exposed to the outside from the spindle housing, and a cutting blade 38 is attached to the tip of the spindle 36a via a blade mount. The cutting blade 38 has a cutting edge 38a formed by fixing abrasive grains such as diamond with a binder such as resin, and is formed in an annular shape with a pair of generally flat side surfaces.

[0050] 1, a camera (imaging unit) 40 is fixed to the lower part of the Z-axis moving plate 30. The camera 40 includes a two-dimensional optical sensor such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor that is sensitive to visible light, and an imaging lens, and is used to capture an image of the workpiece 11 held by the table body 14, etc.

[0051] When the Y-axis moving plate 22 of the machining unit moving mechanism 18 is moved in the Y-axis direction, both the machining unit 36 ​​and the camera 40 move in the Y-axis direction. When the Z-axis moving plate 30 of the machining unit moving mechanism 18 is moved in the Z-axis direction, both the machining unit 36 ​​and the camera 40 move in the Z-axis direction.

[0052] The components such as the table moving mechanism, the holding table unit 6, the processing unit moving mechanism 18, the processing unit 36, and the camera 40 are each connected to a controller (control unit) (not shown). The controller controls each of the above-mentioned components in accordance with a series of steps required for processing (cutting) the workpiece 11.

[0053] The controller (control unit) is composed of a computer including, for example, a processing device such as a CPU (Central Processing Unit), a main storage device such as a DRAM (Dynamic Random Access Memory), and an auxiliary storage device such as a hard disk drive or a flash memory. The functions of the control unit are realized by operating the processing device and the like in accordance with software stored in the auxiliary storage device. However, the functions of the control unit may be realized only by hardware.

[0054] When the workpiece 11 is processed by the processing device 2, the workpiece 11 is placed on the table body 14 and is suction-held by the holding table unit 6. Then, the workpiece 11 suction-held by the holding table unit 6 is processed by the processing unit 36.

[0055] When the workpiece 11 is machined by the machining unit 36, machining heat is generated due to friction between the cutting blade (tool) 38 and the workpiece 11. In addition, the workpiece 11 and the cutting edge 38a of the cutting blade 38 are worn away, generating machining chips. Therefore, in order to remove the machining heat and machining chips, machining fluid is supplied to the cutting blade (tool) 38 and the workpiece 11 during machining of the workpiece 11. The machining heat and machining chips are taken up in the machining fluid and removed.

[0056] However, the machining liquid may adhere to the upper surface (holding surface) of the holding table unit 6. If the machining liquid adheres to the upper surface (holding surface), the workpiece 11 (device chip) may stick to the upper surface (holding surface), which may cause a problem that the workpiece 11 may become difficult to remove from the holding table unit 6 after processing. Furthermore, if the workpiece 11 is strongly suction-held by the holding table unit 6, the workpiece 11 may stick to the upper surface (holding surface), which may cause a problem that the workpiece 11 may become difficult to remove from the holding table unit 6.

[0057] Therefore, it is conceivable to eject the fluid from the suction port 46 after stopping the suction and holding of the workpiece 11 through the suction port 46. However, in that case, the workpiece 11 (device chip) may move significantly on the upper surface (holding surface) of the holding table unit 6 or may scatter with force. In addition, if the fluid is ejected with a strong force, a large amount of the fluid is consumed, and the processing efficiency of the workpiece 11 in the processing device 2 decreases.

[0058] In particular, there is variation in the adhesion of the workpiece 11 (device chip) to the holding table unit 6 in each area partitioned by the entrance grooves 44 on the upper surface (holding surface, upper surface 14a of the table body 14) of the holding table unit 6. For this reason, there may be no fluid injection conditions that can reliably release the adhesion of the workpiece 11 (device chip) to the holding table unit 6 while preventing scattering, etc., in all areas.

[0059] Therefore, as described below, the processing apparatus 2 according to this embodiment is configured so that the workpiece 11 (device chip) suction-held by the holding table unit 6 can be efficiently and stably separated from the holding table unit 6. Below, the processing apparatus 2 will be described mainly with reference to the configuration that contributes to efficiently and stably separating the workpiece 11 (device chip) from the holding table unit 6.

[0060] As shown in Fig. 5 and other figures, the processing apparatus 2 according to this embodiment includes a fluid supply source 58 connected to the communication passage 50 via a second electromagnetic on-off valve 60. More specifically, the communication passage 50 includes a branch path leading to the fluid supply source 58, and the second electromagnetic on-off valve 60 is provided in the branch path of the communication passage 50. In other words, the holding table unit 6 has the fluid supply source 58 connected to the communication passage 50 via the second electromagnetic on-off valve 60. When the second electromagnetic on-off valve 60 is opened, fluid is supplied to the suction port 46 of the table body 14 through the communication passage 50, and the fluid is ejected from the suction port 46.

[0061] Here, the second electromagnetic on-off valve 60 is configured by a solenoid valve or the like, similar to the first electromagnetic on-off valve 54. Also, the fluid supply source 58 supplies a high-pressure gas such as air or nitrogen gas, or a liquid such as pure water, as a fluid to the suction port 46, and causes it to be ejected from the suction port 46 at a predetermined pressure. Note that the fluid supplied by the fluid supply source 58 is not limited to this, and the fluid supply source 58 may supply a mixed fluid of a high-pressure gas and a liquid.

[0062] In the processing apparatus 2 according to this embodiment, when the suction hold of the workpiece 11 by the holding table unit 6 is released, first, the first electromagnetic on-off valve 54 is closed to separate the suction source 52 from the communication passage 50. At the same time, the second electromagnetic on-off valve 60 is opened to supply fluid from the fluid supply source 58 to the workpiece 11 through the communication passage 50 and the upper surface of the holding table unit 6 (the holding surface, the upper surface 14a of the table body 14).

[0063] Here, if the fluid is simply supplied to the workpiece 11 with a uniform intensity, the workpiece 11 will move or scatter if the fluid is sprayed onto the workpiece 11 with an intensity exceeding the jetting intensity required for peeling the workpiece 11 from the upper surface (holding surface) of the holding table unit 6. Conversely, if the fluid is sprayed onto the workpiece 11 with an intensity less than the jetting intensity required for peeling, the workpiece 11 cannot be peeled off from the upper surface (holding surface, upper surface 14a of the table body 14) of the holding table unit 6.

[0064] Therefore, in the processing apparatus 2 according to this embodiment, when the suction and holding of the workpiece 11 by the holding table unit 6 is released, the second electromagnetic on-off valve 60 is intermittently opened and closed to intermittently supply the fluid from the fluid supply source 58 to the workpiece 11. In other words, the supply of the fluid to the workpiece 11 is not continuous, and the strength of the fluid supply is not constant.

[0065] When the fluid is supplied to the workpiece 11 in an intermittent manner in which the supply is repeatedly stopped, the workpiece 11 frequently alternates between a state in which it receives a force from the fluid and a state in which it does not receive a force. When these two states are repeatedly switched, a gentle impact is applied to the workpiece 11, and the tight contact between the upper surface (holding surface, upper surface 14a of the table body 14) of the holding table unit 6 and the workpiece 11 is gradually released.

[0066] In this case, unlike the case where the fluid is continuously and strongly supplied to the workpiece 11, the fluid does not violently act on the workpiece 11 after the adhesion of the workpiece 11 is released, and the workpiece 11 is less likely to move or scatter.

[0067] Furthermore, when the fluid is intermittently supplied to the workpiece 11, there are times when the supply of the fluid is stopped, and therefore the amount of fluid consumed is less than when the fluid is continuously supplied to the workpiece 11. From another perspective, when the fluid is intermittently sprayed, not only the force that the fluid exerts on the workpiece 11 but also the impact caused by switching between supplying and stopping the fluid can be utilized, and therefore there is no need to increase the force that the fluid exerts on the workpiece 11 compared to when this impact is not utilized. As a result, the amount of fluid consumed can be reduced.

[0068] Here, the fluid ejection conditions will be described. For example, when the fluid supply source 58 supplies air, the air supply pressure is set in the range of 0.05 MPa to 0.50 MPa, and more preferably in the range of 0.08 MPa to 0.15 MPa. For example, the air supply pressure is preferably about 0.10 MPa. However, the air supply pressure is not limited to this.

[0069] Next, the operation of the second electromagnetic on-off valve 60 will be described. The second electromagnetic on-off valve 60 is opened for a predetermined time, and then closed for a predetermined time. Thereafter, it is opened for a predetermined time again, and closed in a predetermined state. In this way, the second electromagnetic on-off valve 60 repeatedly switches between the open and closed states.

[0070] From another perspective, the second electromagnetic on-off valve 60 is pulse-driven. That is, the second electromagnetic on-off valve 60 is driven periodically, with one cycle being from the time when the second electromagnetic on-off valve 60 opens to the time when the second electromagnetic on-off valve 60 closes and then opens again. Here, when the ratio of the time in the open state to the time of one cycle is defined as the duty ratio, the second electromagnetic on-off valve 60 is driven at a predetermined duty ratio.

[0071] More specifically, the drive cycle of the second electromagnetic on-off valve 60 is set in the range of 0.005 seconds to 1.000 seconds, and more preferably in the range of 0.010 seconds to 0.500 seconds. In particular, it is preferably set in the range of 0.050 seconds to 0.250 seconds. For example, the drive cycle of the second electromagnetic on-off valve 60 is set to about 0.200 seconds.

[0072] In other words, the frequency of the pulse drive of the second electromagnetic on-off valve 60 is preferably set in the range of 1 Hz to 200 Hz. The frequency of the pulse drive is more preferably set in the range of 2 Hz to 100 Hz. In particular, the frequency of the pulse drive is preferably set in the range of 4 Hz to 20 Hz. For example, the frequency of the pulse drive of the second electromagnetic on-off valve 60 is set to about 5 Hz.

[0073] If the frequency is less than 1 Hz, the impact on the workpiece 11 caused by switching between the open and closed states becomes too weak, and if the frequency is greater than 200 Hz, the force of the fluid acting on the workpiece 11 becomes too weak, and the supply pressure of the fluid from the fluid supply source 58 must be set high.

[0074] The duty ratio (proportion of the time during which the valve is open in one cycle) of the second electromagnetic valve 60 in pulse driving is preferably set to 40% to 60%, more preferably 45% to 55%. For example, the duty ratio of the second electromagnetic valve 60 in pulse driving is set to 50%.

[0075] For example, the second electromagnetic on-off valve 60 is driven at a frequency of 5 Hz and a duty ratio of 50%. In this case, the second electromagnetic on-off valve 60 is opened for 0.1 seconds, and then closed for 0.1 seconds, and these cycles are repeated. However, the driving conditions of the second electromagnetic on-off valve 60 are not limited to these.

[0076] In this way, when the machining apparatus 2 according to this embodiment releases the suction hold of the workpiece 11 by the holding table unit 6, it closes the first electromagnetic on-off valve 54 to separate the suction source 52 from the communication passage 50, and intermittently opens and closes the second electromagnetic on-off valve 60. This allows the fluid to be intermittently supplied from the fluid supply source 58 to the workpiece 11 through the communication passage 50 and the upper surface (upper surface 14a of the table body 14) of the holding table unit 6. As a result, a gentle impact is applied to the workpiece 11, and the workpiece 11 is gently peeled off from the holding table unit 6.

[0077] When the second electromagnetic on-off valve 60 and the fluid supply source 58 are incorporated in the holding table unit 6, the second electromagnetic on-off valve 60 is closed when the workpiece 11 is sucked and held by the holding table unit 6. At the same time, the first electromagnetic on-off valve 54 is opened to connect the suction source 52 to the communication passage 50, and the negative pressure generated by the suction source 52 is applied to the workpiece 11 placed on the upper surface of the holding table unit 6 through the communication passage 50 and the upper surface.

[0078] In the processing apparatus 2 according to this embodiment, when the suction and holding of the workpiece 11 by the holding table unit 6 is released, the first electromagnetic on-off valve 54 is closed to separate the suction source 52 from the communication passage 50, and the second electromagnetic on-off valve 60 is pulse-driven. At this time, the communication passage 50 may be opened to the atmosphere once before the pulse-driving of the second electromagnetic on-off valve 60 is started.

[0079] When the first electromagnetic on-off valve 54 is closed, negative pressure remains in the communication passage 50, and the pressure becomes low. If pulse driving of the second electromagnetic on-off valve 60 is started in this state, the negative pressure remaining in the communication passage 50 will disrupt the supply of fluid to the workpiece 11, and not only will the workpiece 11 not receive the desired impact, but unexpected forces will be applied to the workpiece 11, which may cause the workpiece 11 to fly apart. Furthermore, the negative pressure remaining in the communication passage 50 may cause loads or damage to the communication passage 50, the second electromagnetic on-off valve 60, the fluid supply source 58, etc.

[0080] Therefore, if the communication passage 50 is opened to the atmosphere once before starting the pulse drive of the second electromagnetic on-off valve 60, the negative pressure remaining in the communication passage 50 is eliminated, and a predetermined impact can be applied to the workpiece 11. Also, the second electromagnetic on-off valve 60 and the fluid supply source 58 are less likely to be damaged. Next, a configuration for opening the communication passage 50 to the atmosphere in the processing apparatus 2 according to this embodiment will be described.

[0081] As shown in Fig. 5 and other figures, the processing apparatus 2 according to this embodiment includes an open port 62 connected to the communication passage 50 via a third electromagnetic on-off valve 64. More specifically, the communication passage 50 includes a branch path leading to the open port 62, and the third electromagnetic on-off valve 64 is provided in this branch path of the communication passage 50. When the third electromagnetic on-off valve 64 is opened, air flows from the open port 62 into the communication passage 50, and the pressure in the communication passage 50 returns to atmospheric pressure. That is, the negative pressure remaining in the communication passage 50 is eliminated. Here, the third electromagnetic on-off valve 64 is configured by a solenoid valve or the like, similar to the first electromagnetic on-off valve 54.

[0082] For example, the third electromagnetic on-off valve 64 is opened after the first electromagnetic on-off valve 54 is closed. The third electromagnetic on-off valve 64 is closed before the second electromagnetic on-off valve 60 starts pulse driving. However, the timing at which the third electromagnetic on-off valve 64 operates is not limited to this.

[0083] For example, the third electromagnetic on-off valve 64 may be opened before the first electromagnetic on-off valve 54 is closed, that is, the first electromagnetic on-off valve 54 may be closed after the third electromagnetic on-off valve 64 is opened. In this case, the negative pressure from the suction source 52 is supplied to the communication passage 50 while the negative pressure is released from the opening 62, and then the supply of negative pressure to the communication passage 50 is stopped. Therefore, the pressure change in the communication passage 50 becomes gradual, and the load on the communication passage 50 and the like is reduced.

[0084] Next, a method for processing the workpiece 11 in the processing apparatus 2 according to this embodiment including the holding table unit 6 configured as described above will be described. The following description also explains the method for using the processing apparatus 2 (operational mode). Fig. 15 is a flow chart showing the flow of each step of the method for processing the workpiece 11 in the processing apparatus 2.

[0085] In the method for processing a workpiece in the processing apparatus 2, first, a holding step S10 is performed in which the workpiece 11 is placed on the holding table unit 6 and the holding table unit 6 holds the workpiece 11 by suction. FIG. 6 is a cross-sectional view that shows a schematic view of the holding table unit 6 and the workpiece 11 (substrate 13) in the holding step S10. For ease of explanation, the workpiece 11 is shown in a simplified manner in FIG. 6, and only the substrate 13 is shown. The same applies to FIG. 7 and subsequent figures.

[0086] In the holding step S10, first, the workpiece 11 is transported onto the holding table unit 6. At this time, for example, the first surface (front surface) 13a of the substrate 13 faces upward, and the second surface (back surface) 13b faces the holding surface (upper surface, upper surface 14a of the table body 14) of the holding table unit 6. Then, the position of the workpiece 11 is adjusted so that the planned dividing line 19 of the workpiece 11 and the entrance groove 44 of the upper surface 14a of the table body 14 overlap with each other.

[0087] Then, the workpiece 11 is placed on the holding surface (upper surface) of the holding table unit 6, and the first electromagnetic on-off valve 54 is opened to connect the communication passage 50 and the suction source 52. This causes the negative pressure generated by the suction source 52 to act on the workpiece 11 through the communication passage 50, the recess 12d formed in the upper surface 12a of the table base 12, and the suction port 46 of the table body 14. Then, the workpiece 11 is sucked and held by the holding table unit 6. In the holding step S10, the second electromagnetic on-off valve 60 and the third electromagnetic on-off valve 64 are closed.

[0088] In the method for processing a workpiece in the processing device 2, a processing step S20 is performed. After the holding step S10, a processing step S20 is performed in which the workpiece 11 held by the holding table unit 6 is processed by the processing unit 36. Fig. 7 is a cross-sectional view that typically shows the holding table unit 6 and the workpiece 11 (substrate 13) in the processing step S20. Fig. 7 includes a side view that typically shows a part of the configuration of the processing unit 36.

[0089] For example, if the processing device 2 is a cutting device equipped with an annular cutting blade 38 as a processing tool, in processing step S20, the processing device 2 cuts the workpiece 11 with the cutting blade 38. However, the processing device 2 is not limited to a cutting device, and the processing tool is not limited to the cutting blade 38. Below, processing step S20 will be described in detail using an example in which the processing device 2 is a cutting device.

[0090] In the processing step S20, first, the upper surface of the workpiece 11 (the first surface 13a of the substrate 13) is imaged by the camera 40 (see FIG. 1) to detect the positions of the multiple planned division lines 19. Then, the relative positions of the table base 12 and the processing unit 36 ​​are adjusted so that the cutting edge 38a of the cutting blade 38 is positioned on an extension line of one of the planned division lines 19. In addition, the table base 12 is rotated around the Z axis to align the planned division line 19 with the processing feed direction (X-axis direction) of the processing device 2. In this manner, alignment is performed.

[0091] Next, a motor (not shown) provided in the processing unit 36 ​​is operated to start rotating the spindle 36a, and the processing unit 36 ​​is lowered to position the cutting blade 38 at a predetermined height. At this time, the cutting blade 38 rotates at a rotation speed of about 30,000 revolutions per minute. In order to cut and reliably divide the workpiece 11, the height position of the lower end of the cutting blade 38a must be lower than the lower surface of the workpiece 11. In other words, the lower end of the cutting blade 38a is lower than the upper end of the protruding portion 42 on the upper surface of the table body 14 on which the workpiece 11 is placed.

[0092] Thereafter, the table base 12 and the table body 14 of the holding table unit 6 are moved along the processing feed direction (X-axis direction). That is, processing feed is started. Then, the rotating cutting edge 38a of the cutting blade 38 cuts into the workpiece 11, and the workpiece 11 is cut along the intended division line 19.

[0093] At this time, the lower end of the cutting edge 38a of the cutting blade 38 enters the entrance groove 44, so that the cutting edge 38a does not come into contact with the table body 14. The width and depth of the entrance groove 44 are determined so that the cutting edge 38a does not come into contact with the table body 14 at this time.

[0094] After cutting the workpiece 11 along one planned dividing line 19, the workpiece 11 is similarly cut along another planned dividing line 19 aligned in the same direction. Then, after cutting the workpiece 11 along all the planned dividing lines 19 aligned in one direction, the table base 12 and the table body 14 are rotated to align the planned dividing lines 19 along other directions of the workpiece 11 with the processing feed direction. Then, the workpiece 11 is cut along all the planned dividing lines 19. This completes the processing of the workpiece 11.

[0095] When the workpiece 11 is cut along the intended division lines 19, cutting grooves 27 (see FIG. 8, etc.) are formed in the workpiece 11 along the intended division lines, and the workpiece 11 is divided into individual chips (device chips) 25 (see FIG. 8, etc.). Each chip 25 thus manufactured is continuously sucked and held by the holding table unit 6 through suction ports 46 provided in each area partitioned by entrance grooves 44 on the upper surface 14a of the table body 14.

[0096] In addition, in order to remove processing heat and processing debris generated while the workpiece 11 is being cut (machined), a processing fluid composed of pure water or the like is continuously supplied to the cutting blade 38 and the workpiece 11 while the workpiece 11 is being cut.

[0097] In recent years, various types of machining fluids containing specific active ingredients are sometimes used instead of pure water in order to improve machining efficiency and quality. Some types of machining fluids have a higher viscosity than pure water, so when the workpiece 11 is carried out of the holding table unit 6, the machining fluid may adhere to the upper surface (holding surface, upper surface 14a of the table body 14) of the holding table unit 6.

[0098] In this case, after processing a new workpiece 11, it becomes difficult to remove the workpiece 11 (device chip) from the holding table unit 6. Even in such a case, the following procedure is carried out to efficiently and stably separate the workpiece 11 (device chip) held by the holding table unit 6 from the holding table unit 6.

[0099] In the method for processing the workpiece in the processing apparatus 2, after the processing step S20, a suction release step S30 is performed in which the suction hold of the workpiece 11 by the holding table unit 6 is released. In the suction release step S30, the negative pressure acting on the workpiece 11 from the suction source 52 through the communication passage 50 is cut off, and the suction hold of the workpiece 11 by the holding table unit 6 is released.

[0100] In the suction release step S30, the suction source 52 may be separated from the communication passage 50 by simply switching the first electromagnetic on-off valve 54 to a closed state. In this case, however, the communication passage 50 is sealed and the negative pressure does not escape, resulting in a low pressure state in the communication passage 50. If a fluid supply step S50 (described later) is performed in this state to start supplying fluid to the communication passage 50, a sudden change in pressure occurs in the communication passage 50. At this time, unnecessary loads may be applied to the fluid supply source 58, the communication passage 50, the workpiece 11, etc., causing problems.

[0101] Therefore, in the suction release step S30, the first electromagnetic on-off valve 54 may be switched to a closed state to separate the suction source 52 from the communication passage 50, and the third electromagnetic on-off valve 64 may be switched to an open state to open the communication passage 50 to the atmosphere through the release port 62. Figure 8 is a cross-sectional view that shows a schematic view of the holding table unit 6 and the workpiece 11 (substrate 13) in the first stage of the suction release step S30.

[0102] When the third electromagnetic on-off valve 64 is switched to an open state, air flows into the communication passage 50 from the opening 62, and the pressure inside the communication passage 50 rises until it reaches atmospheric pressure. Note that the opening 62 does not need to be connected to the atmosphere, and a supply source of a gas such as air or nitrogen gas to be flowed into the communication passage 50 may be connected to the opening 62.

[0103] Here, the first electromagnetic on-off valve 54 may be switched to the closed state after the third electromagnetic on-off valve 64 is switched to the open state. In this case, after the third electromagnetic on-off valve 64 is switched to the open state and before the first electromagnetic on-off valve 54 is switched to the closed state, the suction source 52 sucks the communication passage 50 and air flows into the communication passage 50 from the open port 62 at the same time.

[0104] At this time, the pressure inside the communication passage 50 is higher than when only the first electromagnetic on-off valve 54 is open, and is lower than when only the third electromagnetic on-off valve 64 is open. That is, the pressure inside the communication passage 50 in the suction release step S30 changes gradually and gradually, and the load on the communication passage 50, the workpiece 11 (chip 25), etc. is reduced.

[0105] Alternatively, the first electromagnetic on-off valve 54 may be switched to the closed state before the third electromagnetic on-off valve 64 is switched to the open state. In this case, the first electromagnetic on-off valve 54 and the third electromagnetic on-off valve 64 are not simultaneously in the open state, so that the suction source 52 does not directly suck in the air flowing into the communication passage 50 from the open port 62. Therefore, an excessive load is not applied to the suction source 52.

[0106] In any case, in the suction release step S30, the first electromagnetic on-off valve 54 is switched to a closed state, and the third electromagnetic on-off valve 64 is switched to an open state. Fig. 9 is a cross-sectional view showing a schematic view of the holding table unit 6 and the workpiece 11 (substrate 13) in the second stage of the suction release step S30. After the pressure inside the communication passage 50 is increased to atmospheric pressure, the third electromagnetic on-off valve 64 is switched back to a closed state in preparation for the fluid supply step S50 to be performed thereafter.

[0107] In the method for processing the workpiece in the processing apparatus 2, after the suction release step S30, a fluid supply step S50 is performed in which a fluid is intermittently supplied to the workpiece 11 (chip 25) from the upper surface (holding surface, upper surface 14a of the table body 14) of the holding table unit 6. Fig. 10 is a cross-sectional view that shows a schematic view of the holding table unit 6 and the workpiece 11 (substrate 13) in the fluid supply step S50.

[0108] In the fluid supply step S50, the second electromagnetic on-off valve 60 is intermittently opened and closed. The second electromagnetic on-off valve 60 is opened for a predetermined time, and then closed for a predetermined time. Thereafter, the second electromagnetic on-off valve 60 is opened for a predetermined time, and then closed in a predetermined state. In this manner, the second electromagnetic on-off valve 60 is repeatedly opened and closed. The operation of intermittently opening and closing the second electromagnetic on-off valve 60 is as described above in detail.

[0109] When the fluid is supplied to the workpiece 11 in an intermittent manner in which supply and stop are repeated by intermittently opening and closing the second electromagnetic on-off valve 60, the workpiece 11 frequently alternates between a state in which it receives force from the fluid and a state in which it does not receive force. When these two states are repeatedly switched, a gentle impact is applied to the workpiece 11, and the tight contact between the upper surface of the holding table unit 6 (holding surface, upper surface 14a of the table body 14) and the workpiece 11 is gradually released.

[0110] In this case, unlike when the fluid is continuously supplied to the workpiece 11 with great strength, the fluid does not act violently on the workpiece 11 after the adhesion of the workpiece 11 is released, and the workpiece 11 is less likely to move or scatter. Also, since there is no need to squirt a large amount of fluid with great strength onto the workpiece 11, the amount of fluid consumed can be reduced. As described above, according to the method for processing the workpiece in the processing device 2, the workpiece held by suction in the holding table unit can be efficiently and stably separated from the holding table unit.

[0111] When the fluid supplying step S50 is performed, the processed workpiece 11 (chips 25) can be easily separated and carried out from the holding table unit 6. In the method for processing a workpiece in the processing apparatus 2, after the fluid supplying step S50 is performed, a carrying-out step S60 of carrying out the workpiece 11 (chips 25) from the holding table unit 6 may be performed.

[0112] In the unloading step S60, for example, the individual chips 25 produced by dividing the workpiece 11 are sequentially unloaded one by one from the holding table unit 6. Alternatively, a plurality of chips 25 may be unloaded from the holding table unit 6 collectively.

[0113] In the method for processing the workpiece in the processing device 2, the movement of the workpiece 11 (chips 25) is suppressed when the suction holding by the holding table unit 6 is released, and the arrangement of each chip 25 is not disturbed. In other words, each chip 25 does not move to an unexpected position on the upper surface (holding surface) of the holding table unit 6. Therefore, the workpiece 11 (chips 25) can be unloaded from the holding table unit 6 by performing a predetermined unloading operation without checking the position of each chip 25.

[0114] Up to this point, the processing device 2 according to this embodiment has been described taking as an example a case in which a package substrate, which is the workpiece 11, is placed on the table body 14 of the holding table unit 6, divided to form individual chips 25, and then carried out from the upper surface 14a of the table body 14. However, the workpiece 11 is not limited to a package substrate, and the workpiece 11 to be processed does not have to be supported by the table body 14. Next, a modified example of the processing device according to this embodiment will be described.

[0115] 11, 12, 13, and 14 are schematic cross-sectional views showing a part of a holding table unit 66 of a processing apparatus according to a modified example. The processing apparatus according to the modified example described below differs from the above-described processing apparatus 2 mainly in that the configuration of the holding table unit 66 is different and that a storage mechanism 72 capable of storing a workpiece is provided, but there may be other differences.

[0116] In the following description of the processing device according to the modified example, the description of the unchanged elements will be omitted. Unless otherwise specified, the description of the processing device 2 described above can be referred to as appropriate. Furthermore, in the processing device according to the modified example, the unchanged elements will be given the same reference numerals as those of the respective elements in the processing device 2 described above.

[0117] In the processing device according to the modified example, a plurality of small workpieces 31 as shown in Fig. 11 are processed simultaneously. Each workpiece 31 may be handled, for example, by being fixed to a support substrate (not shown) having a planar shape of the same size as the workpiece 31. For convenience of explanation, the substrate is omitted in each drawing.

[0118] The holding table unit 66 of the processing apparatus according to the modified example includes a communication passage 50, a first electromagnetic on-off valve 54, a pressure gauge 56, a suction source 52, a second electromagnetic on-off valve 60, and a fluid supply source 58, similar to the holding table unit 6 of the processing apparatus 2 described above. Furthermore, the holding table unit 66 may include a third electromagnetic on-off valve 64 and an opening 62.

[0119] 11, the holding table unit 66 includes a table base 68 configured in the same manner as the above-described table base 12. The communication passage 50 is connected to the lower surface 68b of the table base 68, and a recess that functions as a fluid flow passage 68d is formed in the center of the upper surface 68a. The table base 68 is formed with a through hole that penetrates from the upper surface 68a to the lower surface 68b, and the concave flow passage 68d of the table base 68 is connected to the communication passage 50 through this through hole.

[0120] A holding jig 70 is detachably placed on the table base 68. The holding jig 70 is a plate-like member having the same shape and size as the table base 68, and is a member made of a material such as a metal material or a hard resin. The holding jig 70 can be placed on the table base 68, and can transport a plurality of workpieces 31 by placing the plurality of workpieces 31 on it and moving it.

[0121] The holding jig 70 has a plurality of through holes 70c that communicate vertically. Each area where the through holes 70c are provided is an area where the workpiece 31 is placed. The upper surface 70a of the holding jig 70 may be provided with a structure such as a recess that defines the area where the workpiece 31 is to be placed.

[0122] A plurality of workpieces 31 are placed on an upper surface 70a of the holding jig 70. Then, the holding jig 70 on which the plurality of workpieces 31 are placed is placed on the table base 68. At this time, a lower surface 70b of the holding jig 70 faces an upper surface 68a of the table base 68.

[0123] When the holding jig 70 is placed on the table base 68, a through hole 70c penetrating from the upper surface 70a to the lower surface 70b of the holding jig 70 is connected to a concave flow path 68d formed in the upper surface 68a of the table base 68. At the same time, the flow path 68d is brought into a state in which the fluid cannot enter or exit through any route other than the communication path 50 and the through hole 70c of the holding jig 70.

[0124] In this state, when the first electromagnetic valve 54 is switched to the open state, negative pressure is applied to each workpiece 31 from the suction source 52 through the communicating passage 50, the flow path 68d of the table base 68, and the through hole 70c of the holding jig 70, and each workpiece 31 is held by suction on the holding table unit 66.

[0125] In other words, the holding table unit 66 can suction-hold the workpiece 31 placed on the holding table unit 66 via the holding jig 70, which has through holes 70c communicating vertically and is placed on its upper surface (upper surface 68a of the table base 68). Each workpiece 31 held by suction on the holding table unit 66 is machined by the machining unit 36 ​​(see FIG. 1, etc.).

[0126] Thereafter, the first electromagnetic on-off valve 54 is switched to a closed state to release the suction holding of the workpiece 31 by the holding table unit 66, and the holding jig 70 is removed from the holding table unit 66, thereby removing the workpiece 31.

[0127] 12 and other figures, the processing device according to the modified example includes a storage mechanism 72 that stores the workpiece 31 and prevents the workpiece 31 from falling off or moving, as a transport mechanism for transporting the holding jig 70 on which the workpiece 31 is placed, and a moving unit (not shown) that moves the storage mechanism 72. The moving unit is realized by, for example, a ball screw type mechanism similar to the processing unit moving mechanism 18.

[0128] The accommodating mechanism 72 is a plate-like member having on its underside a plurality of accommodating sections 74 each capable of accommodating a workpiece 31. The planar shape of the accommodating mechanism 72 is of the same size and shape as the planar shape of the holding jig 70, in other words, a shape corresponding to that of the holding jig 70.

[0129] The storage section 74 of the storage mechanism 72 is a concave space formed on the underside of the storage mechanism 72, and stores the workpiece 31 so as to restrict the workpiece 31 from moving in a direction parallel to the upper surface of the holding table unit 66 (upper surface 68a of the table base 68).

[0130] The depth of the accommodating section 74 (the distance from the lower surface of the accommodating mechanism 72 to the bottom of the accommodating section 74) is set to be equal to or greater than the thickness of the workpiece 31. When the workpiece 31 is fixed to a supporting substrate, the depth of each accommodating section 74 is set to be equal to or greater than the total thickness of the workpiece 31 and the supporting substrate. The planar shape of the accommodating section 74 corresponds to the shape of the workpiece 31 and is larger than the workpiece 31. The arrangement of the accommodating sections 74 in the accommodating mechanism 72 corresponds to the arrangement of the workpiece 31 in the holding jig 70.

[0131] The accommodating section 74 of the accommodating mechanism 72 is not limited to this. For example, one accommodating section 74 of the accommodating mechanism 72 may be able to accommodate two or more workpieces 31 among the multiple workpieces 31 placed on the holding jig 70. In this case, the shape of the accommodating section 74 is determined so that the two or more workpieces 31 to be accommodated can be accommodated in a state in which they are arranged in a predetermined area on the upper surface 70a of the holding jig 70.

[0132] Furthermore, the accommodating mechanism 72 may include only one accommodating section 74, and all of the workpieces 31 arranged on the upper surface 70a of the holding jig 70 may be accommodated in one accommodating section 74. Below, the explanation will be continued taking as an example a case in which the accommodating mechanism 72 includes accommodating sections 74 in the same number as the number of workpieces 31 supported by the holding jig 70, and each accommodating section 74 accommodates a corresponding one of the workpieces 31.

[0133] After the position of the storage mechanism 72 is adjusted so that each storage section 74 overlaps with the corresponding workpiece 31, the storage mechanism 72 descends toward the holding table unit 66 and comes into contact with the holding jig 70, thereby storing the workpiece 31 placed on the holding table unit 66 via the holding jig 70.

[0134] The storage mechanism 72 also includes a plurality of suction paths 76 in an area outside each storage section 74. Each suction path 76 penetrates the storage mechanism 72 from the top to the bottom. A suction source (not shown) is connected to each suction path 76 on the top side of the storage mechanism 72. When the storage mechanism 72 is placed on the holding jig 70 placed on the holding table unit 66, each suction path 76 on the bottom side of the storage mechanism 72 is blocked by the top surface 70a of the storage mechanism 72.

[0135] Then, when the accommodation mechanism 72 is placed on the holding jig 70 and a suction source connected to the suction path 76 is operated, the holding jig 70 is sucked through the suction path 76. That is, the holding jig 70 is held by suction by the accommodation mechanism 72. That is, the accommodation mechanism 72 is capable of holding the holding jig 70. Then, the processing device moves the accommodation mechanism 72 holding the holding jig 70 by the movement unit, whereby the workpiece 31 can be carried out together with the holding jig 70 from the holding table unit 66 while being supported by the holding jig 70.

[0136] After the holding jig 70 supporting the multiple workpieces 31 is carried out from the holding table unit 66, each of the workpieces 31 is carried out from the holding jig 70. However, there are cases where the workpieces 31 and the holding jig 70 are tightly adhered to each other due to suction holding, and the tight adhesion between the two may continue even after the suction holding of the workpieces 31 by the holding table unit 66 is released.

[0137] Furthermore, the machining fluid used in the cutting device may adhere to the upper surface 70a of the holding jig 70, which may cause the workpiece 31 to stick to the holding jig 70. In such cases, even if the holding jig 70 is carried out of the processing device, the workpiece 31 cannot be easily peeled off from the holding jig 70.

[0138] Therefore, the processing apparatus according to the modified example intermittently supplies fluid to the workpiece 31 when the suction hold of the workpiece 31 by the holding table unit 66 is released. That is, when the suction hold of the workpiece 31 by the holding table unit 66 is released, fluid is intermittently supplied from the fluid supply source 58 to the holding jig 70 through the communicating passage 50 and the upper surface of the holding table unit 66 (upper surface 68a of the table base 68). Then, the fluid is supplied to the workpiece 31 through the holding jig 70.

[0139] More specifically, after the first electromagnetic on-off valve 54 is closed to isolate the suction source 52 from the communication passage 50, the second electromagnetic on-off valve 60 is intermittently opened and closed to intermittently supply fluid from the fluid supply source 58 through the holding jig 70 to the workpiece 31. As a result, an impact caused by switching between starting and stopping the supply of fluid is applied to the workpiece 31, and the tight contact between the holding jig 70 and the workpiece 31 is gradually released.

[0140] In addition, if the processing apparatus is equipped with a storage mechanism 72, when the suction holding of the workpiece 31 by the holding table unit 66 is released, it is preferable to store the workpiece 31 in the storage section 74 of the storage mechanism 72 before intermittently supplying fluid to the workpiece 31.

[0141] When the workpiece 31 is accommodated in the accommodation portion 74, the movement of the workpiece 31 is restricted by the accommodation portion 74. In the method of intermittently supplying a fluid to the workpiece 31, the movement of the workpiece 31 is suppressed, but when the workpiece 31 is accommodated in the accommodation portion 74, the movement of the workpiece 31 is more strongly suppressed after the close contact with the holding jig 70 is released.

[0142] Next, a method for processing a workpiece according to a modified example in which the workpiece 31 is processed by the processing device according to the modified example will be described, and then a method for using the processing device will be described. Note that a description of steps that are performed in the same manner as in the method for processing a workpiece in which the workpiece 11 is processed by the processing device 2 will be omitted. In other words, the description of each step described above can be referred to as appropriate.

[0143] In the workpiece processing method according to the modified example, a holding step S10 is also performed in which the workpiece 31 is placed on the holding table unit 66 and is suction-held by the holding table unit 66. Fig. 11 is a cross-sectional view showing a schematic state in which the workpiece 31 is placed on a holding jig 70 in order to place it on the holding table unit 66.

[0144] In the holding step S10, for example, a plurality of workpieces 31 are placed on a holding jig 70, and the holding jig 70 is placed on the upper surface 68a of the table base 68 of the holding table unit 66. As a result, the workpieces 31 are placed on the holding table unit 66 via the holding jig 70. Thereafter, the first electromagnetic on-off valve 54 is switched to an open state, and the workpieces 31 are sucked and held by the holding table unit 66 via the holding jig 70.

[0145] After the holding step S10, a processing step S20 is performed in which the workpiece 31 held by the holding table unit 66 is processed by the processing unit 36 ​​(see Figs. 1, 7, etc.). After the processing step S20, a suction release step S30 is performed in which the suction hold of the workpiece 31 by the holding table unit 66 is released. In the suction release step S30, the third electromagnetic on-off valve 64 may be switched to an open state to open the communication passage 50 to the atmosphere through the release port 62 before or after the first electromagnetic on-off valve 54 is switched to the closed state.

[0146] After the suction release step S30, a fluid supply step S50 is performed in which a fluid is intermittently supplied to the workpiece 31 from the upper surface of the holding table unit 66. In a workpiece processing method according to a modified example, a storage step S40 may be performed after the processing step S20 and before the fluid supply step S50. Fig. 12 is a cross-sectional view showing a schematic view of the holding table unit 66, the workpiece 31, and the storage mechanism 72 in the storage step S40.

[0147] In the accommodating step S40, an accommodating mechanism 72 is moved, which has an accommodating section 74 for accommodating the workpiece 31 and restricts the workpiece 31 from moving in a direction parallel to the upper surface of the holding table unit 66 by accommodating the workpiece 31 in the accommodating section 74. Then, the accommodating mechanism 72 is moved above the holding table unit 66 and is lowered to accommodate the workpiece 31 in the accommodating section 74 of the accommodating mechanism 72. This restricts movement of the workpiece 31 on the upper surface 70a of the holding jig 70 in the subsequent steps.

[0148] Next, a fluid supplying step S50 is performed in which a fluid is intermittently supplied to the workpiece 31 from the upper surface (upper surface 68a of the table base 68) of the holding table unit 66. Fig. 13 is a cross-sectional view that typically shows the holding table unit 66, the workpiece 31, and the accommodation mechanism 72 in the fluid supplying step S50.

[0149] In the fluid supply step S50, the second electromagnetic on-off valve 60 is intermittently opened and closed to intermittently supply the fluid to the workpiece 31 through the communication passage 50 and the upper surface (upper surface 68a of the table base 68) of the holding table unit 66. At this time, the fluid is intermittently supplied to the holding jig 70 together with the workpiece 31 from the upper surface of the holding table unit 66. Therefore, even if the upper surface 68a of the table base 68 and the lower surface 70b of the holding jig 70 stick to each other or are strongly in contact with each other, a gentle impact is applied to the holding jig 70, and the contact is released.

[0150] Then, after the fluid supply step S50, a carry-out step S60 may be further performed in which the accommodating mechanism 72 that accommodates the workpiece 31 is moved to the accommodating section 74 to carry out the workpiece 31 from the holding table unit 66. For example, each accommodating section 74 of the accommodating mechanism 72 may be provided with a holding mechanism that holds the accommodated workpiece 31. When the accommodating mechanism 72 is holding each workpiece 31, the moving unit is operated to operate the accommodating mechanism 72, whereby the workpiece 31 can be transported from the holding table unit 66.

[0151] Alternatively, the holding jig 70 may be fixed to the accommodation mechanism 72 after the accommodation step S40 and before the carry-out step S60. For example, the holding jig 70 is fixed to the accommodation mechanism 72 by sucking the holding jig 70 through the suction path 76 of the accommodation mechanism 72. In this case, in the carry-out step S60, the accommodation mechanism 72 is moved, so that the workpiece 31 can be carried out together with the holding jig 70 from the holding table unit 66 while being supported by the holding jig 70.

[0152] Fig. 14 is a cross-sectional view showing the holding table unit 66, the workpiece 31, and the accommodation mechanism 72 in the carrying-out step S60. As shown in Fig. 14, the processed workpiece 31 is transported while being placed on the holding jig 70. Then, the accommodation mechanism 72 is moved to a predetermined destination, the suction holding of the holding jig 70 is released, and the accommodation mechanism 72 and the holding jig 70 are separated, leaving the workpiece 31 on the holding jig 70.

[0153] Since the fluid supplying step S50 is performed before the carrying-out step S60, the tight contact between the holding jig 70 and the workpiece 31 is released. Therefore, the workpiece 31 can be easily carried out from the holding jig 70.

[0154] As described above, in the processing apparatus and the method for processing a workpiece according to this embodiment, after the suction-holding of the workpiece 11, 31 held by the holding table unit 6, 66 is released, a fluid is supplied to the workpiece 11, 31 from the upper surface of the holding table unit 6, 66. At this time, the fluid is supplied to the workpiece 11, 31 in an intermittent manner in which the supply is repeatedly started and stopped. In this case, the supply of the fluid is repeatedly switched on and off, and this causes a gentle impact on the workpiece 11, 31.

[0155] Therefore, the close contact between the upper surface of the holding table unit 6, 66 and the workpiece 11, 31 is gradually released. In this case, the workpiece 11, 31 is less likely to move or scatter. Also, when the fluid is intermittently supplied to the workpiece 11, 31, there are times when the supply of the fluid is stopped, so the amount of fluid consumed is less than when the fluid is continuously supplied to the workpiece 11, 31. Therefore, the workpiece 11, 31 can be efficiently and stably separated from the holding table unit.

[0156] The present invention is not limited to the above embodiment, and can be modified in various ways. For example, in the above embodiment, the processing apparatus includes the storage mechanism 72, and the storage unit 74 of the storage mechanism 72 suppresses the movement of the workpiece 31 in a direction parallel to the upper surface of the holding table unit 66. In particular, the movement of the workpiece 31 is suppressed depending on the shape and size of the workpiece 31. However, one aspect of the present invention is not limited to this.

[0157] For example, the accommodation mechanism 72 may include a cushioning material that directly contacts the workpiece 31 accommodated in the accommodation section 74 to suppress movement of the workpiece 31. For example, a sponge-like cushioning material made of a soft resin material may be provided on the ceiling of the accommodation section 74. Then, when the workpiece 31 is accommodated in the accommodation section 74, the lower surface of the cushioning material may come into contact with the upper surface of the workpiece 31.

[0158] In this case, when the suction holding by the holding table unit 66 is released and fluid is intermittently supplied to the workpiece 31, even if the workpiece 31 tries to move slightly due to a gentle impact given to the workpiece 31, the movement is more strongly suppressed by the cushioning material. Also, since the impact given to the workpiece 31 is absorbed by the cushioning material, when the workpiece 31 is stored in the storage section 74 of the storage mechanism 72 and transported, damage to the workpiece 31 due to an unexpected impact given to the storage mechanism 72, etc. is suppressed.

[0159] Note that there may be variation in the height of the workpiece 31. However, the cushioning material is deformable in response to the variation in the height of the workpiece 31, and can contact the workpiece 31 with just the right amount of force. Therefore, regardless of the variation in the height of the workpiece 31, the movement of the workpiece 31 can be sufficiently suppressed and damage to the workpiece 31 can be prevented.

[0160] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0161] 11 Workpiece 13 Substrate 13a 1st page 13b Side 2 15 Device Area 17 Surplus Area 19 Division line 21 Stage 23 Resin layer 25 chips 27 Cutting groove 2 Processing equipment 4 Foundation 4a opening 6,66 Holding table unit 8. Table Cover 10 Bellows cover 12 Table Base 12a Top side 12c screw hole 12d Recess 14 Table body 14a Top side 16 Support structure 18 Processing unit movement mechanism 20 Y-axis guide rail 22 Y-axis moving plate 24 Screw shaft 26 Y-axis stepper motor 28 Z-axis guide rail 30 Z-axis moving plate 31 Workpiece 32 Screw shaft 34 Z-axis stepper motor 36 Processing Unit 36a Spindle 38 Cutting Blade 38a cutting blade 40 Camera 42 Protrusion 44 Entry groove 46 Suction port 48 Screw 50 communication path 52 Suction source 54 First solenoid valve 56 Pressure Gauge 58 Fluid supply source 60 Second solenoid valve 62 Open mouth 64 Third solenoid valve 68 Table Base 68a Top 68b Bottom surface 68d Flow path 70 Holding fixture 70a top side 70b Bottom side 70c through hole 72 Containment Mechanism 74 Storage unit 76 Suction path

Claims

1. A processing apparatus including a holding table unit capable of suction-holding a workpiece, and a processing unit for processing the workpiece held by the holding table unit, the holding table unit has a communication passage leading to an upper surface, a suction source connected to the communication passage via a first electromagnetic on-off valve, and a fluid supply source connected to the communication passage via a second electromagnetic on-off valve; when the workpiece is suction-held by the holding table unit, the second electromagnetic on-off valve is closed and the first electromagnetic on-off valve is opened to communicate the suction source with the communication passage, so that a negative pressure generated by the suction source can be applied to the workpiece placed on the holding table unit through the communication passage and the upper surface, When the suction hold of the workpiece by the holding table unit is released, the first electromagnetic on-off valve is closed to isolate the suction source from the communicating passage, and the second electromagnetic on-off valve is intermittently opened and closed to intermittently supply fluid from the fluid supply source to the workpiece through the communicating passage and the top surface.

2. a housing mechanism for housing the workpiece so as to restrict the workpiece from moving in a direction parallel to the upper surface and capable of housing the workpiece placed on the holding table unit; The processing apparatus according to claim 1, characterized in that when the suction holding of the workpiece by the holding table unit is released, the workpiece is stored in the storage portion of the storage mechanism before the fluid is intermittently supplied to the workpiece.

3. The processing apparatus according to claim 2, further comprising a moving unit for moving the storage mechanism, and the workpiece can be removed from the holding table unit by moving the storage mechanism that stores the workpiece in the storage section with the moving unit.

4. the holding table unit has a through hole communicating vertically, and is capable of suction-holding the workpiece placed on the holding table unit via a holding jig placed on the upper surface of the holding table unit, The accommodation mechanism is capable of holding the holding jig, When the suction and holding of the workpiece by the holding table unit is released, the fluid can be intermittently supplied from the fluid supply source to the holding jig through the communication passage and the upper surface, The processing apparatus according to claim 3, characterized in that the workpiece can be transported out of the holding table unit together with the holding jig while supported by the holding jig by moving the storage mechanism which holds the holding jig with the moving unit.

5. A method for processing a workpiece in a processing apparatus including a holding table unit capable of suction-holding a workpiece and a processing unit that processes the workpiece held by the holding table unit, the method comprising the steps of: a holding step of placing the workpiece on the holding table unit and holding the workpiece by suction with the holding table unit; a processing step of processing the workpiece held by the holding table unit using the processing unit after the holding step; a suction release step of releasing the suction hold of the workpiece by the holding table unit after the processing step; a fluid supplying step of intermittently supplying a fluid to the workpiece from an upper surface of the holding table unit after the suction releasing step; A method for processing a workpiece, comprising:

6. The method for processing a workpiece as described in claim 5, further comprising, prior to the fluid supply step, a accommodating step of accommodating the workpiece in a accommodating section of a accommodating mechanism which has a accommodating section for accommodating the workpiece and which restricts the workpiece from moving in a direction parallel to the top surface by accommodating the workpiece in the accommodating section.

7. The method for processing a workpiece as described in claim 6, further comprising, after the fluid supply step, a transport step of transporting the workpiece from the holding table unit by moving the accommodation mechanism that accommodates the workpiece in the accommodation section.

8. In the holding step, the workpiece is placed on the holding table unit via a holding jig having a through hole communicating vertically and placed on the upper surface, and the workpiece is suction-held by the holding table unit via the holding jig; In the fluid supplying step, the fluid is intermittently supplied to the holding jig together with the workpiece from the upper surface of the holding table unit; After the accommodating step and before the carrying-out step, the holding jig is fixed to the accommodating mechanism; The method for processing a workpiece according to claim 7, characterized in that in the unloading step, the workpiece is unloaded from the holding table unit together with the holding jig while being supported by the holding jig by moving the storage mechanism.

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