Method of manufacturing light-emitting device

Abstract

To enhance the precision of the height of a light-emitting device.SOLUTION: A method of manufacturing a light-emitting device according to an embodiment of the present disclosure includes: a first stage of preparing a base body which has a bottom part having a mount surface and a frame part enclosing the mount surface in top view, and mounting a light-emitting element on the mount surface; a second stage of fixing a wavelength conversion member which has a light guide-out surface on its top surface to the base body at a position above the light-emitting element and apart from the light-emitting element; and a third stage of polishing a reverse surface of the base body located on the opposite side of the mount surface after the second stage.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a method for manufacturing a light emitting device. [Background technology]

[0002] Patent Document 1 discloses a method for manufacturing a light emitting device in which a substrate on which a nitride semiconductor light emitting element is formed is bonded to a wavelength conversion member such as a phosphor optical element, and then the back surface of the substrate is polished. In this method for manufacturing a light emitting device, the back surface of the substrate is polished and then a back electrode is formed. Therefore, the position of the upper surface of the wavelength conversion member changes depending on the thickness of the back electrode. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2013 / 021518 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure aims to improve the height accuracy of a light emitting device. [Means for solving the problem]

[0005] A manufacturing method for a light emitting device according to one embodiment of the present disclosure includes a first step of preparing a base having a bottom portion with a mounting surface and a frame portion surrounding the mounting surface in a top view, and mounting a light emitting element on the mounting surface, a second step of fixing a wavelength conversion member having a light extraction surface on its upper surface to the base at a position above the light emitting element and spaced apart from the light emitting element, and a third step of polishing the lower surface of the base located on the opposite side to the mounting surface after the second step. Effect of the Invention

[0006] According to an embodiment of the present disclosure, the height precision of a light emitting device can be improved. [Brief description of the drawings]

[0007] [Figure 1] 1 is a perspective view showing a configuration example of a light emitting device according to an embodiment; [Diagram 2] 2 is a cross-sectional view of the light emitting device taken along line II-II in FIG. [Diagram 3] 5 is a cross-sectional view illustrating a first step of the method for manufacturing the light emitting device according to the embodiment. FIG. [Figure 4] 5 is a cross-sectional view illustrating a second step of the method for manufacturing the light emitting device according to the embodiment. FIG. [Diagram 5] 10 is a cross-sectional view illustrating a fifth step of the method for manufacturing the light emitting device according to the embodiment. FIG. [Figure 6] 5 is a cross-sectional view illustrating a third step of the method for manufacturing the light emitting device according to the embodiment. FIG. [Figure 7] 10 is a cross-sectional view illustrating a fourth step of the method for manufacturing the light emitting device according to the embodiment. FIG. [Figure 8] 1 is a perspective view illustrating a configuration example of a light source module according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, the mode for carrying out the invention will be described with reference to the drawings. In the following description, terms indicating specific directions or positions (for example, "upper", "lower", and other terms including these terms) will be used as necessary. However, the use of these terms is for the purpose of facilitating understanding of the invention with reference to the drawings, and the meaning of these terms does not excessively limit the technical scope of the present invention. For example, when "upper surface" is described, it does not mean that the invention must always be used facing upward. Also, parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts or members.

[0009] In addition, in this disclosure, polygons such as triangles and quadrangles are referred to as polygons, including shapes in which the corners of the polygons have been processed by rounding, chamfering, removing corners, rounding, etc. In addition, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle parts of the sides are similarly referred to as polygons. In other words, shapes in which partial processing has been applied while leaving the polygon as the base are included in the interpretation of "polygon" described in this disclosure.

[0010] The same applies not only to polygons, but also to terms expressing specific shapes such as trapezoids, circles, and irregularities. The same also applies to terms relating to the sides that form the shape. In other words, even if the corners or middle part of a side have been processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no partial processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0011] Furthermore, the embodiments shown below are illustrative of a light-emitting device for embodying the technical idea of ​​the present invention, and do not limit the present invention to the following. Furthermore, unless otherwise specified, the dimensions, materials, shapes, and relative arrangements of the components described below are intended to be merely illustrative, and are not intended to limit the scope of the present invention. Furthermore, the contents described in one embodiment are applicable to other embodiments and modified examples. Furthermore, the sizes and positional relationships of the components shown in the drawings may be exaggerated in order to clarify the explanation. Furthermore, in order to avoid the drawings becoming overly complicated, a schematic diagram in which some components are omitted may be used. Furthermore, an end view showing only the cut surface may be used as a cross-sectional view.

[0012] In each drawing, for reference, an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other are shown. The direction parallel to the X-axis is called the X-direction. In addition, in the X-direction, the direction in which the arrow points is called the +X-direction, and the opposite direction of the +X-direction is called the -X-direction. In the Y-direction, the direction in which the arrow points is called the +Y-direction, and the opposite direction of the +Y-direction is called the -Y-direction. In the Z-direction, the direction in which the arrow points is called the +Z-direction, and the opposite direction of the +Z-direction is called the -Z-direction. However, these do not limit the orientation of the light-emitting device when it is used, and the orientation of the light-emitting device is arbitrary.

[0013] In addition, in this specification or claims, when there are multiple elements of a certain type and each element is to be expressed with a distinction, the elements may be distinguished by adding "first," "second," etc. to the beginning of the element. In addition, the objects to be distinguished may differ between this specification and the claims. Therefore, even if the claims describe an element with the same notation as this specification, the object identified by this element may not match between this specification and the claims.

[0014] For example, in this specification, there are elements distinguished by the notation "first", "second", and "third", and when the elements to which "first" and "third" are attached in this specification are described in the scope of a patent claim, or when the element to which "first" is attached and the element to which no specific ordinal number is attached are described in the scope of a patent claim, the elements may be distinguished by the notation "first" and "second" in the scope of a patent claim from the viewpoint of readability. In this case, the elements to which "first" and "second" are attached in the scope of a patent claim refer to the elements to which "first" and "third" are attached in this specification, or the elements to which no specific ordinal number is attached, respectively. Note that the application of this rule is not limited to elements, and it can be applied rationally and flexibly to other objects as well.

[0015] <Present embodiment> As a premise for explaining a manufacturing method of a light emitting device according to this embodiment, a configuration example of a light emitting device 1 will be explained with reference to Fig. 1 and Fig. 2. Fig. 1 is a perspective view showing the configuration example of a light emitting device 1 according to this embodiment. Fig. 2 is a cross-sectional view of the light emitting device 1 taken along line II-II in Fig. 1.

[0016] The light emitting device 1 includes a base 10, a light emitting element 20, and a wavelength conversion member 90. The light emitting device 1 may also include a submount 30, a light reflecting member 40, a protective element 50, a temperature measuring element 60, a light transmissive member 80, and a light blocking member 100.

[0017] (Base 10) 1 and 2, the base 10 has a bottom portion 11 and a frame portion 12. The bottom portion 11 is located at the lower end (the end portion on the -Z direction side) of the base 10. The bottom portion 11 has an upper surface 111 (the surface on the +Z direction side) and a lower surface 112 (the surface on the -Z direction side), and has a flat plate-like outer shape.

[0018] In the bottom 11, the upper surface 111 is the surface located opposite to the lower surface 112. The lower surface 112 corresponds to the bottommost surface of the base 10 (the surface located furthest on the -Z direction side). In other words, other members such as a conductor pattern are not provided on the lower surface 112. The thickness of the bottom 11 corresponds to the distance in the Z direction between the upper surface 111 and the lower surface 112. Hereinafter, when "distance" is mentioned, it refers to the distance in the Z direction between two objects.

[0019] The upper surface 111 of the bottom 11 has an outer peripheral region 113 that is continuous with the lower end (the end on the -Z direction side) of the frame 12, and an inner region 114 that is provided inside the outer peripheral region 113. Here, the outer peripheral region 113 may be a conceptual region. For example, as shown in FIG. 2, in a case where the bottom 11 and the frame 12 are integrally formed of the same material, the outer peripheral region does not actually exist, but the outer peripheral region can be conceptually defined as shown by the two-dot chain line in FIG. 2, and this can be regarded as a conceptual region. The inner region 114 corresponds to a planar region on which components such as the submount 30, the light reflecting member 40, the protective element 50, and the temperature measuring element 60 are placed. Hereinafter, the inner region 114 is referred to as a "placement surface 114".

[0020] Frame 12 has an upper surface 121, one or more outer surfaces 122, and one or more inner surfaces 123. Upper surface 121 of frame 12 corresponds to the uppermost surface of base 10 (the surface located furthest in the +Z direction). In addition, outer surface 122 of frame 12 corresponds to the outer surface of base 10.

[0021] The frame 12 surrounds the placement surface 114 of the bottom 11 in a top view. Note that the term "top view" refers to viewing the object from the +Z direction side. The same applies hereinafter to "top view."

[0022] Furthermore, the frame 12 has, for example, two step portions 125a and 125b. Each of the step portions 125a and 125b corresponds to a portion having an upper surface (a surface on the +Z direction side) and a side surface extending downward (-Z direction side) from the upper surface. The step portion 125a is disposed on the bottom 11 side. The step portion 125b is continuous with the upper surface of the step portion 125a and is disposed above the step portion 125a (in the +Z direction). However, the number of step portions is not limited to this.

[0023] Each side surface of the steps 125a and 125b corresponds to a part of the inner side surface 123 of the frame portion 12. The lower end (the end on the -Z direction side) of the side surface of the step portion 125a intersects with the placement surface 114. On the other hand, the upper surface of the step portion 125b is continuous with the upper surface 121 of the inner side surface 123 of the frame portion 12 and intersects with a portion that is continuous with the upper surface 121 and extends downward from the upper surface 121.

[0024] An example of the material constituting the base 10 is ceramic. Examples of ceramic include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide. Note that the material constituting the base 10 is not limited to ceramic. The base 10 may contain other materials having insulating properties.

[0025] 1 and 2, a plurality of conductor patterns 15 are provided on the upper surface 121 of the frame portion 12. Another plurality of conductor patterns 17 are provided on the stepped portion 125b of the frame portion 12. A further plurality of conductor patterns 18 are provided on the mounting surface 114 of the bottom portion 11. A plurality of bonding patterns 16 are provided on the stepped portion 125a of the frame portion 12.

[0026] Each of the conductor patterns 15, 17, 18 and the bonding pattern 16 is made of a conductive material such as metal. Examples of the conductor patterns 15, 17, 18 and the bonding pattern 16 include a metal multilayer film in which a Ti film, a Pt film, and an Au film are laminated in this order from the -Z direction side, and a metal multilayer film in which a W film, a Ni film, and an Au film are laminated in this order from the -Z direction side. However, the number, types, and positions of the conductor patterns and bonding patterns provided on the frame portion 12 are not limited to these.

[0027] Each of the multiple conductor patterns 15 functions as a terminal electrically connected to an external power source. Some of the conductor patterns 15 are electrically connected to, for example, a conductor pattern 18 on the mounting surface 114 through via wiring provided inside the frame portion 12. Others of the conductor patterns 15 are electrically connected to a conductor pattern 17 on the stepped portion 125b through another via wiring 19 provided inside the frame portion 12. Hereinafter, the conductor patterns 15 are referred to as "external connection terminals 15."

[0028] (Light emitting element 20) The light emitting element 20 is a light source of the light emitting device 1. The light emitting element 20 of this embodiment is, for example, a semiconductor laser element including an n-type cladding layer, an active layer, and a p-type cladding layer, which are stacked in this order in the Z direction. However, the type of the light emitting element 20 is not limited to a semiconductor laser element. Other examples of the light emitting element 20 include a light emitting diode (LED) and an organic light emitting diode (OLED).

[0029] The light-emitting element 20 has an upper surface (surface on the +Z direction side), a lower surface (surface on the -Z direction side), and one or more side surfaces intersecting with each of the upper surface and the lower surface. The light-emitting element 20 of this embodiment has a rectangular parallelepiped outer shape. In this case, each of the upper surface, lower surface, and four side surfaces of the light-emitting element 20 has a rectangular outer shape. Furthermore, of the four side surfaces of the light-emitting element 20, the side surface facing the light reflecting member 40 corresponds to a light emission surface that emits light. However, the shape of the light-emitting element 20 is not limited to this. It should be noted that unless there is a specific mention that excludes a square, "rectangle" includes a square.

[0030] The light emitting element 20 is bonded to the upper surface of the submount 30 via a bonding layer provided on the submount 30. In addition, one end of a thin wire is bonded to the upper surface of the light emitting element 20. The other end of this wire is bonded to a conductor pattern 18 provided on the mounting surface 114. The conductor pattern 18 is electrically connected to the external connection terminal 15. As a result, the light emitting element 20 is electrically connected to the external connection terminal 15.

[0031] The light emitting element 20 can emit violet, blue, green or red light in the visible region, or infrared or ultraviolet light in the invisible region. The emission peak wavelength of the violet light is preferably in the range of 350 nm to 420 nm, more preferably in the range of 400 nm to 415 nm. The emission peak wavelength of the blue light is preferably in the range of more than 420 nm to 495 nm, more preferably in the range of 440 nm to 475 nm. The emission peak wavelength of the green light is preferably in the range of more than 495 nm to 570 nm, more preferably in the range of 510 nm to 550 nm. The light emitting element 20 that emits violet, blue and green light includes a laser diode containing a nitride semiconductor material. Examples of the nitride semiconductor material include GaN, InGaN and AlGaN. The emission peak wavelength of the red light is preferably in the range of 605 nm to 750 nm, more preferably in the range of 610 nm to 700 nm. Examples of laser diodes that emit a red laser beam include laser diodes that include InAlGaP-based, GaInP-based, GaAs-based, and AlGaAs-based semiconductor materials.

[0032] (Submount 30) The submount 30 has an upper surface (surface on the +Z direction side), a lower surface (surface on the -Z direction side), and one or more side surfaces intersecting with each of the upper and lower surfaces. The submount 30 of this embodiment has a rectangular parallelepiped outer shape. In this case, each of the upper surface, lower surface, and four side surfaces of the submount 30 has a rectangular outer shape. However, the shape of the submount 30 is not limited to this.

[0033] The submount 30 supports the light emitting element 20. The submount 30 is disposed on the mounting surface 114 of the base 10. Examples of materials constituting the submount 30 include ceramics such as silicon nitride, aluminum nitride, and silicon carbide. However, the materials constituting the submount 30 are not limited to these.

[0034] (Light reflecting member 40) The light reflecting member 40 includes a light reflecting surface 41, a lower surface, and one or more side surfaces intersecting with the light reflecting surface 41 and the lower surface. In this embodiment, the light reflecting surface 41, the lower surface, and one or more side surfaces each have a rectangular outer shape. The light reflecting surface 41 may be a flat surface or a curved surface.

[0035] The light reflecting member 40 is provided on the mounting surface 114 of the base 10. The light reflecting member 40 is disposed in the vicinity of the light emitting element 20. A light reflecting surface 41 of the light reflecting member 40 faces the light emitting surface of the light emitting element 20. The light reflecting surface 41 reflects the outgoing light emitted from the light emitting surface of the light emitting element 20 toward the wavelength conversion member 90.

[0036] Examples of materials constituting the light reflecting surface 41 include quartz, glass such as BK7 (borosilicate glass), metals such as Al and Ag, Si, and dielectric multilayer films such as Ta2O5 / SiO2, TiO2 / SiO2, and Nb2O5 / SiO2, etc. However, the materials constituting the light reflecting surface 41 are not limited to these.

[0037] (Protection element 50) The protective element 50 is an element for preventing, for example, an excessive current from flowing through the light emitting element 20 and causing the element to be destroyed. An example of the protective element 50 is a Zener diode. However, the protective element 50 is not limited to this. The protective element 50 is provided on the mounting surface 114 of the base 10. The protective element 50 is electrically connected to the light emitting element 20 via the conductor pattern 18.

[0038] (Temperature measuring element 60) The temperature measuring element 60 is, for example, an element for measuring the temperature around the light emitting element 20. An example of the temperature measuring element 60 is a thermistor. However, the temperature measuring element 60 is not limited to this. The temperature measuring element 60 is provided on the mounting surface 114 of the base 10.

[0039] (Translucent member 80) The light-transmitting member 80 has an upper surface (surface on the +Z direction side), a lower surface (surface on the -Z direction side), and one or more side surfaces intersecting with each of the upper surface and the lower surface. The light-transmitting member 80 of this embodiment has a rectangular parallelepiped outer shape. In this case, each of the upper surface, lower surface, and four side surfaces of the light-transmitting member 80 has a rectangular outer shape. However, the shape of the light-transmitting member 80 is not limited to a rectangular parallelepiped shape.

[0040] The light-transmitting member 80 has light-transmitting properties. Here, "light-transmitting properties" refers to a light transmittance of 80% or more. Examples of materials constituting the light-transmitting member 80 include sapphire, quartz, silicon carbide, and glass. Among these, sapphire is preferable because it has relatively high light-transmitting properties and strength, as well as high heat dissipation properties. The light-transmitting member 80 of this embodiment is made of sapphire. However, the material constituting the light-transmitting member 80 is not limited to this.

[0041] Conductive patterns 81 and 82 are provided in the outer circumferential region of the upper surface of the light-transmitting member 80. As shown in Fig. 2, the conductor pattern 81 is electrically connected to a conductor pattern 17 (the conductor pattern 17 on the -X direction side) provided on the upper surface of the stepped portion 125b through a wiring 71. In addition, the conductor pattern 82 is electrically connected to another conductor pattern 17 (the conductor pattern 17 on the +X direction side) provided on the upper surface of the stepped portion 125b through a wiring 72.

[0042] Bonding patterns 83 and 84 are provided in the peripheral region of the lower surface of the light-transmitting member 80. The bonding pattern 83 is bonded to the bonding pattern 16 (bonding pattern 16 on the -X direction side) provided on the upper surface of the step portion 125a via an adhesive such as Au-Sn. The bonding pattern 84 is bonded to the bonding pattern 16 (bonding pattern 16 on the +X direction side) provided on the upper surface of the step portion 125a via an adhesive such as Au-Sn.

[0043] The light-transmitting member 80 is fixed to the upper surface of the step portion 125a located below (in the -Z direction) the upper surface 121 of the frame portion 12. As a result, the light-transmitting member 80 is formed inside the frame portion 12, and hermetically seals the recessed space in which the light-emitting element 20, the submount 30, the light reflecting member 40, the protective element 50, the temperature measuring element 60, and the like are arranged.

[0044] The light-transmitting member 80 may further have an optical thin film for controlling reflection and transmission of light. The light-transmitting member 80 of the present embodiment has, as the optical thin films, for example, an antireflection film 85 and a distributed Bragg reflector (DBR) 86. As shown in FIG. 2, the antireflection film 85 is provided on the lower surface of the light-transmitting member 80. Moreover, the DBR 86 is provided on the upper surface of the light-transmitting member 80. However, the type, number, position, etc. of the optical thin films are not limited to these.

[0045] The upper surface of the light-transmitting member 80 and a lower surface 912 of a wavelength converting portion 91 of the wavelength converting member 90 described later are not in contact with each other, and a space is provided between them. The distance between the upper surface of the light-transmitting member 80 and the lower surface 912 of the wavelength converting portion 91 of the wavelength converting member 90 is equal to or greater than the thickness of the DBR 86.

[0046] (wavelength conversion member 90) The wavelength conversion member 90 has an upper surface (surface on the +Z direction side), a lower surface (surface on the -Z direction side), and one or more side surfaces intersecting with each of the upper surface and the lower surface. The wavelength conversion member 90 of this embodiment has a rectangular parallelepiped outer shape. However, the shape of the wavelength conversion member 90 is not limited to this.

[0047] The wavelength conversion member 90 is disposed on the light-transmitting member 80. The wavelength conversion member 90 has a light-transmitting wavelength converting portion 91 and an enclosing portion 92. The wavelength conversion portion 91 and the enclosing portion 92 are physically integrated. That is, the inner surface of the enclosing portion 92 contacts the side surface of the wavelength conversion portion 91. The outer surface of the enclosing portion 92 corresponds to the side surface of the wavelength conversion member 90.

[0048] The wavelength converting section 91 has an upper surface 911 (surface on the +Z direction side), a lower surface 912 (surface on the -Z direction side), and one or more side surfaces intersecting with each of the upper surface 911 and the lower surface 912. The wavelength converting section 91 of this embodiment has a rectangular parallelepiped outer shape. The thickness of the wavelength converting section 91 corresponds to the distance between the upper surface 911 and the lower surface 912. However, the shape of the wavelength converting section 91 is not limited to this.

[0049] The wavelength conversion unit 91 converts at least a part of the incident light into light of a different wavelength band. In this embodiment, the light emitted from the light emitting element 20 reaches the lower surface 912 of the wavelength conversion unit 91. In detail, the light emitted from the light emitting element 20 is reflected by the light reflecting surface 41 of the light reflecting member 40, and then reaches the light-transmitting member 80. Furthermore, the light that has reached the light-transmitting member 80 passes through the light-transmitting member 80 and reaches the lower surface 912 of the wavelength conversion unit 91. Furthermore, the light that has reached the lower surface 912 of the wavelength conversion unit 91 enters the inside of the wavelength conversion unit 91 and is converted into light of a different wavelength band.

[0050] The light emitted from the light emitting element 20 is, for example, blue light having a peak wavelength in a range of 430 nm to 480 nm. At least a part of the blue light is converted by the wavelength conversion unit 91 into, for example, yellow light. The yellow light converted by the wavelength conversion unit 91 is emitted from the upper surface 911 of the wavelength conversion unit 91. Another part of the blue light passes through the wavelength conversion unit 91 and is also emitted from the upper surface 911 of the wavelength conversion unit 91. That is, the blue light and the yellow light respectively emitted from the upper surface 911 of the wavelength conversion unit 91 are mixed. As a result, white light is extracted from the upper surface 911 of the wavelength conversion unit 91. The upper surface 911 of the wavelength conversion unit 91 is hereinafter referred to as the "light extraction surface 911."

[0051] 2, the light extraction surface 911 of the wavelength conversion section 91 is located above (in the +Z direction) the upper surface 121 of the frame section 12 of the base 10. That is, the light extraction surface 911 of the wavelength conversion section 91 corresponds to the uppermost surface of the light emitting device 1. The light extraction surface 911 of the wavelength conversion section 91 constitutes a part of the upper surface of the wavelength conversion member 90. Therefore, the upper surface of the wavelength conversion member 90 also corresponds to the uppermost surface of the light emitting device 1.

[0052] Examples of materials constituting wavelength conversion unit 91 include ceramics containing phosphors, glass containing phosphors, and phosphor crystals. However, the materials constituting wavelength conversion unit 91 are not limited to these, so long as they are materials capable of converting at least a portion of light incident on wavelength conversion unit 91 into light in a different wavelength band.

[0053] Examples of phosphors include cerium-activated yttrium aluminum garnet (YAG), cerium-activated lutetium aluminum garnet (LAG), nitrogen-containing calcium aluminosilicate (CaO-Al2O3-SiO2) activated with europium and / or chromium, silicate ((Sr,Ba)2SiO4) activated with europium, α-sialon phosphor, β-sialon phosphor, etc. Among them, it is preferable to use YAG phosphor, which is a phosphor with good heat resistance.

[0054] The surrounding portion 92 has a through hole in the center of the rectangular parallelepiped flat plate. The wavelength converting portion 91 is disposed in the through hole region. The shape of the through hole in the surrounding portion 92 may be changed as appropriate according to the shape of the wavelength converting portion 91.

[0055] Examples of materials constituting the surrounding portion 92 include ceramics, metals, and composites of ceramics and metals. The surrounding portion 92 is preferably made of a material with high thermal conductivity that can dissipate heat generated in the wavelength conversion portion 91. The surrounding portion 92 is also preferably made of a material with high reflectance. An example of a material with high thermal conductivity and high reflectance is alumina (Al2O3). However, the materials constituting the surrounding portion 92 are not limited to this.

[0056] Conductive patterns 921, 922 are provided on the lower surface of the surrounding portion 92. The conductor patterns 921, 922 are respectively bonded to the conductor patterns 81, 82 provided on the upper surface of the light-transmitting member 80 via an adhesive such as Au-Sn. In this way, the wavelength conversion member 90 is fixed to the upper surface of the light-transmitting member 80. At this time, the thickness of the adhesive bonding the lower surface of the surrounding portion 92 and the upper surface of the light-transmitting member 80 is adjusted so that the lower surface 912 of the wavelength conversion member 91 does not come into contact with the upper surface of the light-transmitting member 80.

[0057] (Light blocking member 100) The light-shielding member 100 is made of a material having light-shielding properties. Here, light-shielding properties refer to the property of not transmitting light. Examples of the property of not transmitting light include the property of blocking light, the property of absorbing light, and the property of reflecting light.

[0058] Examples of materials constituting the light shielding member 100 include resins such as epoxy resin, silicone resin, acrylate resin, urethane resin, phenol resin, and BT resin. The light shielding member 100 also includes a filler having at least one of the functions of a light diffusing material and a light absorbing material. Examples of the filler include dark color pigments such as carbon black.

[0059] The light shielding member 100 is disposed so as to fill, for example, a gap between the inner surface 123 of the frame portion 12 and the light-transmitting member 80, or a gap between the inner surface 123 of the frame portion 12 and the wavelength conversion member 90. By providing the light shielding member 100, for example, stray light that does not reach the wavelength conversion member 90 out of the light reflected by the light reflecting member 40 can be blocked. Furthermore, by providing the light shielding member 100, for example, conductive wires such as the wirings 71 and 72 can be protected.

[0060] (Method of Manufacturing Light-Emitting Device 1) Next, a method for manufacturing the light emitting device 1 according to this embodiment will be described. The method for manufacturing the light emitting device 1 according to this embodiment includes a first step of preparing a base 10 and mounting the light emitting element 20 on the mounting surface 114 of the base 10, a second step of fixing a wavelength conversion member 90 to the base 10, and a third step of polishing the lower surface 112 of the base 10. The method for manufacturing the light emitting device 1 according to this embodiment preferably further includes a fourth step of polishing the upper surface of the wavelength conversion member 90. Furthermore, the method for manufacturing the light emitting device 1 according to this embodiment preferably further includes a fifth step of providing a light blocking member 100.

[0061] Each step of the method for manufacturing the light emitting device 1 according to this embodiment will be described in detail below with reference to Figs. 3 to 7. Fig. 3 is a cross-sectional view for explaining the first step. Fig. 4 is a cross-sectional view for explaining the second step. Fig. 5 is a cross-sectional view for explaining the fifth step. Fig. 6 is a cross-sectional view for explaining the third step. Fig. 7 is a cross-sectional view for explaining the fourth step.

[0062] The first step will be described with reference to FIG. 3. As shown in FIG. 3, a base 10 having a bottom 11 having a mounting surface 114 and a frame 12 is prepared. The frame 12 surrounds the mounting surface 114 when viewed from above. An external connection terminal 15 is provided on an upper surface 121 of the frame 12. A conductor pattern 18 is provided on the mounting surface 114 of the bottom 11. On the other hand, no other members such as an external connection terminal are provided on the lower surface 112 of the bottom 11. That is, the entire area of ​​the lower surface 112 is exposed. Therefore, by polishing the lower surface 112, the distance from the lowermost surface (lower surface 112) to the uppermost surface (light extraction surface 911 of the wavelength conversion unit 91) of the light emitting device 1 can be easily and precisely adjusted.

[0063] After preparing the base 10, a light-emitting element 20 such as a semiconductor laser element is mounted on the mounting surface 114 of the bottom 11. More specifically, first, a submount 30 is provided on the conductor pattern 18. Then, the light-emitting element 20 is bonded to the upper surface of the submount 30 via, for example, a bonding layer. Through each of these steps, the light-emitting element 20 is mounted on the mounting surface 114.

[0064] Here, "placing the light-emitting element 20 on the mounting surface 114" includes not only directly placing the light-emitting element 20 on the mounting surface 114 without any other components, but also indirectly placing the light-emitting element 20 on the mounting surface 114 via other components such as a submount 30.

[0065] In conjunction with the process of mounting the light emitting element 20 on the mounting surface 114, other components such as the light reflecting member 40, the protective element 50, and the temperature measuring element 60 are also mounted on the mounting surface 114. Each of the light reflecting member 40, the protective element 50, and the temperature measuring element 60 may be mounted on the mounting surface 114 via the conductive pattern 18. The order in which the light emitting element 20, the submount 30, the light reflecting member 40, the protective element 50, and the temperature measuring element 60 are mounted on the mounting surface 14 is not limited.

[0066] Next, the second step will be described with reference to Fig. 4. As shown in Fig. 4, the wavelength conversion member 90 is fixed to the base 10 with the light extraction surface 911 of the wavelength conversion section 91 facing upward (towards the +Z direction). The wavelength conversion member 90 fixed to the base 10 is located above the light emitting element 20 and is separated from the light emitting element 20.

[0067] More specifically, the lower surface of the light-transmitting member 80 bonded to the wavelength conversion member 90 is bonded to, for example, the upper surface of the step portion 125a in the frame portion 12. In the illustrated example, the bonding patterns 83 and 84 provided in the outer peripheral region of the lower surface of the light-transmitting member 80 and the bonding pattern 16 provided on the upper surface of the step portion 125a are bonded via an adhesive such as Au-Sn. The bonding region between the lower surface of the light-transmitting member 80 and the upper surface of the step portion 125a does not overlap the light extraction surface 911 of the wavelength conversion unit 91 in a top view. As a result, the bonding region between the lower surface of the light-transmitting member 80 and the upper surface of the step portion 125a is not formed directly below the light extraction surface 911 of the wavelength conversion unit 91, and as a result, more light can be taken in by the wavelength conversion unit 91.

[0068] The wavelength conversion member 90 is fixed to the step portion 125a of the frame portion 12 via the light-transmitting member 80. At this time, the position of the upper surface of the wavelength conversion member 90 (the light extraction surface 911 of the wavelength conversion member 91) is higher than the upper surface 121 of the frame portion 12.

[0069] Here, "fixing the wavelength conversion member 90 to the base 10" includes not only directly fixing the wavelength conversion member 90 to the base 10 without any other member between the wavelength conversion member 90 and the base 10, but also indirectly fixing the wavelength conversion member 90 to the base 10 via another member such as the light-transmitting member 80.

[0070] Next, in the case where a light blocking member 100 is provided in the light emitting device 1, a fifth step is performed after the second step. The fifth step will be described with reference to Fig. 5. As shown in Fig. 5, the light blocking member 100 is provided in the gap between the frame 12 and the light-transmitting member 80, and in the gap between the frame 12 and the wavelength conversion member 90.

[0071] As a method for providing the light blocking member 100, for example, a method of filling the gap between the frame 12 and the light-transmitting member 80 and the gap between the frame 12 and the wavelength conversion member 90 with a thermosetting resin containing a dark-colored filler such as carbon black, and then subjecting the filled resin to a heat treatment to harden the resin, can be given. However, the method for providing the light blocking member 100 is not limited to this. The fifth step may be performed after the third step, which will be described later.

[0072] Next, the third step will be described with reference to Fig. 6. As shown in Fig. 6, the lower surface 112 of the base 10 to which the light-transmitting member 80 and the wavelength conversion member 90 are assembled is polished. As a method of polishing the lower surface 112, there can be mentioned a method of polishing the lower surface 112 using a polishing device including a holder for holding the base 10 to which the light-transmitting member 80 and the wavelength conversion member 90 are assembled, and a polishing disk for polishing the lower surface 112 of the base 10.

[0073] The polishing apparatus preferably further includes a measuring unit that measures the distance between the lower surface 112 and the light extraction surface 911, and a control unit that controls the position of the polishing plate so as to polish the lower surface 112 by a polishing amount ΔH1 based on the measurement result. After measuring the distance between the lower surface 112 and the light extraction surface 911, the polishing operator may input the polishing amount ΔH1 based on the measurement result to the polishing apparatus, which then polishes the lower surface 112. However, in order to shorten the work time and improve the work efficiency, it is preferable to perform the measurement of the distance between the lower surface 112 and the light extraction surface 911 and the control of the polishing plate based on the measurement result in a series by the operation of the polishing apparatus.

[0074] By polishing the lower surface 112 of the base 10, the thickness of the bottom 11 changes. This adjusts the distance between the lower surface 112 and the light extraction surface 911 to a desired value. As a result, the accuracy of the height of the light emitting device 1 can be improved. That is, it is possible to reduce errors from the design value caused by manufacturing errors in the distance between the lower surface 112 and the light extraction surface 911 (the height dimension of the light emitting device 1), dimensional errors of each member, and the like. Since the lower surface 112 is polished after all of the components that affect the height dimension of the light emitting device 1 are assembled, there is no risk of the height of the light emitting device 1 changing after the height dimension of the light emitting device 1 is adjusted.

[0075] Furthermore, the error from the design value of the height position (position in the Z direction) of the light extraction surface 911 is reduced. Therefore, in an optical device including the light emitting device 1, the actual positional relationship between the light extraction surface 911 and other optical members such as lenses can be adjusted to correspond to the designed positional relationship.

[0076] Furthermore, by polishing the lower surface 112, the entire surface of the lower surface 112 can be made uniformly flat. This makes it possible to increase the contact area between the lower surface 112 and the heat dissipation member when the light emitting device 1 is placed on the heat dissipation member such as an Al (aluminum) plate. As a result, it is possible to improve the dissipation of heat generated by the light emitting element 20, etc.

[0077] Next, the fourth step will be described with reference to FIG. 7. As shown in FIG. 7, the upper surface of wavelength conversion member 90, including light extraction surface 911, is polished. When polishing the upper surface of wavelength conversion member 90, a polishing device similar to the polishing device used to polish lower surface 112 of base 10 may be used. That is, it is preferable to polish the upper surface of wavelength conversion member 90 by a polishing device so that the polishing amount ΔH2 of wavelength conversion member 90 becomes a desired value. When the fourth step is performed, the total polishing amount is the sum of the polishing amount ΔH1 in the third step and the polishing amount ΔH2 in the fourth step, and therefore, the polishing amount ΔH1 is adjusted to a polishing amount that takes into account the polishing amount ΔH2.

[0078] By polishing the upper surface of wavelength conversion member 90, the thickness of wavelength conversion member 90 is changed. This allows the distance between light extraction surface 911 and lower surface 112 to be adjusted to a desired value. As a result, the accuracy of the height of light emitting device 1 can be improved. However, the method of polishing the upper surface of wavelength conversion member 90 is not limited to this.

[0079] When polishing the upper surface of the wavelength conversion member 90, a device for measuring optical characteristics of light extracted from the light extraction surface 911 may be used in combination. Here, an example of the device for measuring optical characteristics is a device including a light receiving unit that receives the light extracted from the light extraction surface 911, and a chromaticity measuring unit that measures the chromaticity of the light extracted from the light extraction surface 911 based on a light receiving signal from the light receiving unit. The chromaticity may be specified based on, for example, a chromaticity diagram (CIE1931). However, in the fourth step, the upper surface of the wavelength conversion member 90 may be polished while measuring optical characteristics other than the chromaticity of the light extracted from the light extraction surface 911.

[0080] Here, as a case where the chromaticity of the light extracted from the light extraction surface 911 changes, for example, variation in the thickness of the wavelength conversion portion 91 among the multiple wavelength conversion members 90 manufactured is assumed. When the thickness of the wavelength conversion portion 91 is relatively thin, the optical path length in the Z direction in the wavelength conversion portion 91 is short. Therefore, compared to a wavelength conversion portion 91 having a relatively large thickness, the proportion of the light that is not converted by the wavelength conversion portion 91 and is output to the outside of the wavelength conversion portion 91 increases among the incident light that is incident on the wavelength conversion portion 91. In this case, the light extracted from the light extraction surface 911 has a relatively blue hue. In contrast, when the thickness of the wavelength conversion portion 91 is relatively thick, the optical path length in the Z direction in the wavelength conversion portion 91 is long. Therefore, compared to a wavelength conversion portion 91 having a relatively small thickness, the proportion of the light that is converted to yellow light by the wavelength conversion portion 91 increases among the incident light that is incident on the wavelength conversion portion 91. In this case, the light extracted from the light extraction surface 911 has a relatively yellow hue.

[0081] That is, the chromaticity of the light extracted from light extraction surface 911 can change depending on the thickness of wavelength conversion member 91. Therefore, by polishing the upper surface of wavelength conversion member 90 and adjusting the thickness of wavelength conversion member 90, it is possible to adjust the chromaticity of the light extracted from light extraction surface 911. By polishing light extraction surface 911 while measuring the chromaticity of the light extracted from light extraction surface 911, it is possible to cause light emitting device 1 to emit light having a desired chromaticity.

[0082] The third step may be performed after the fourth step. In this case, first, the optical characteristics of the light emitted from the light emitting element 20 and passed through the wavelength conversion member 90 are measured, and the amount of polishing ΔH2 of the upper surface (light extraction surface 911) of the wavelength conversion member 90 is adjusted based on the measurement results. Next, the distance from the lower surface 112 of the base 10 to the light extraction surface 911 is measured, and the amount of polishing ΔH1 of the lower surface 112 of the base 10 is adjusted based on the measurement results.

[0083] The light emitting device 1 is manufactured through the above steps. However, the method for manufacturing the light emitting device 1 may include steps other than the steps shown in FIGS.

[0084] <Application Examples> The light emitting device 1 according to this embodiment is applied to, for example, a light source of a headlamp. More specifically, a light source module including the light emitting device 1 is mounted inside the headlamp. With reference to Fig. 8, a configuration example of a light source module 1A including the light emitting device 1 according to this embodiment will be described. Fig. 8 is a perspective view showing the configuration example of the light source module 1A.

[0085] As shown in FIG. 8, the light source module 1A includes a light emitting device 1, a heat dissipation member 110, a holder 120, and a terminal .

[0086] The heat dissipation member 110 dissipates heat generated in the light emitting device 1 to the outside. The heat dissipation member 110 has an upper surface (surface on the +Z direction side), a lower surface (surface on the -Z direction side), and one or more side surfaces intersecting with each of the upper surface and the lower surface. The heat dissipation member 110 of this embodiment has a flat plate-like outer shape. The heat dissipation member 110 may also have other heat dissipation structures such as heat dissipation fins. However, the shape of the heat dissipation member 110 is not limited to this.

[0087] The lower surface of the light emitting device 1 (the lower surface 112 described with reference to FIG. 2 etc.) is joined to the upper surface of the heat dissipation member 110. In addition, between the light emitting device 1 and the heat dissipation member 110, another heat dissipation member may be interposed.

[0088] An example of the material constituting the heat dissipation member 110 is a metal such as Al, however, the material constituting the heat dissipation member 110 is not limited to this.

[0089] The holder 120 holds the light emitting device 1. The holder 120 of this embodiment has, for example, a frame portion 128 surrounding the light emitting device 1, and a storage area 129 for the light emitting device 1 formed inside the frame portion 128. The light emitting device 1 is fitted into the storage area 129 of the holder 120. At this time, the light extraction surface 911 of the wavelength conversion member 90 is exposed facing upward (in the +Z direction). However, the structure of the holder 120 is not limited to this.

[0090] The terminal 130 is connected to, for example, a wire extending from a power supply of the projector. The terminal 130 is also physically integrated with the holder 120, and is connected to internal wiring passing through the frame portion 128 of the holder 120. The internal wiring of the holder 120 is electrically connected to the external connection terminal 15 of the light emitting device 1 by a spring terminal or the like. As a result, the light emitting device 1 is electrically connected to the power supply of the projector through the terminal 130 and the internal wiring of the holder 120.

[0091] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0092] In addition to the above-described embodiment, the following supplementary notes are further disclosed. (Appendix 1) A first step of preparing a base having a bottom portion with a mounting surface and a frame portion surrounding the mounting surface in a top view, and mounting a light emitting element on the mounting surface; a second step of fixing a wavelength conversion member having a light extraction surface on an upper surface thereof to the base at a position above the light emitting element and spaced apart from the light emitting element; a third step of polishing a lower surface of the base body located on an opposite side to the mounting surface after the second step; A method for manufacturing a light emitting device, comprising: (Appendix 2) The method for manufacturing a light emitting device described in Appendix 1, wherein in the first step, a base is prepared, the top surface of the frame having an external connection terminal and the bottom surface of the base having no external connection terminal. (Appendix 3) In the second step, the wavelength conversion member is disposed so that the upper surface of the wavelength conversion member is positioned higher than the upper surface of the frame portion. A method for manufacturing the light emitting device according to claim 1 or 2. (Appendix 4) The frame portion has a step portion, 4. The method for manufacturing a light emitting device according to claim 1, wherein in the second step, the wavelength conversion member is joined to an upper surface of the step portion located below the upper surface of the frame portion. (Appendix 5) a fourth step of polishing the upper surface of the wavelength conversion member, 5. The method for manufacturing a light emitting device according to claim 1, wherein the light extraction surface of the wavelength conversion member is a surface that has been polished in the fourth step. (Appendix 6) In the fourth step, optical characteristics of the light emitted from the light emitting element and passed through the wavelength conversion member are measured, and an amount of polishing of the upper surface of the wavelength conversion member is adjusted based on the measurement result. A method for manufacturing the light emitting device described in Appendix 5. (Appendix 7) In the third step, a distance from the lower surface of the base to the light extraction surface is measured, and an amount of polishing of the lower surface of the base is adjusted based on the measurement result. A method for manufacturing a light emitting device according to any one of claims 1 to 6. (Appendix 8) In the fourth step, optical characteristics of light emitted from the light emitting element and passed through the wavelength conversion member are measured, and an amount of polishing of the upper surface of the wavelength conversion member is adjusted based on the measurement result; In the third step, after the fourth step, a distance from the lower surface of the base to the light extraction surface is measured, and an amount of polishing of the lower surface of the base is adjusted based on the measurement result. A method for manufacturing the light emitting device described in Appendix 5. (Appendix 9) In the second step, the wavelength conversion member bonded to the upper surface of the light-transmitting member is fixed by bonding the light-transmitting member to the base body; 9. The method for manufacturing a light emitting device according to any one of claims 1 to 8, wherein the wavelength conversion member is joined to the light-transmitting member in an area that does not include a region directly below the light extraction surface. [Industrial Applicability]

[0093] The light emitting device according to the present disclosure is applicable to light sources such as projectors, in-vehicle headlights, lighting, head-mounted displays, and backlights for other displays. [Explanation of symbols]

[0094] 1 Light emitting device 10 Base 11 Bottom 111 Top surface 112 Bottom surface 114 Placement surface 12 Frame section 121 Top surface 122 External surface 123 Inner surface 125a, 125b Step 15 External connection terminal 20 Light emitting element 30 Submount 40 Light reflecting member 41 Light reflective surface 50 Protection element 60 Temperature measuring element 71,72 Wiring 80 Translucent material 90 Wavelength conversion material 91 Wavelength conversion section 911 Light extraction surface 912 Bottom surface 92 Encirclement 100 Light shielding member 1A Light Source Module 110 Heat dissipation material 120 Holder 130 Terminal

Claims

1. A first step of preparing a base having a bottom portion with a mounting surface and a frame portion surrounding the mounting surface in a top view, and mounting a light-emitting element on the mounting surface; a second step of fixing a wavelength conversion member having a light extraction surface on an upper surface thereof to the base at a position above the light emitting element and spaced apart from the light emitting element; a third step of polishing a lower surface of the base body located on an opposite side to the mounting surface after the second step; A method for manufacturing a light emitting device, comprising:

2. 2 . The method for manufacturing a light emitting device according to claim 1 , wherein in the first step, the base is prepared such that an external connection terminal is provided on the upper surface of the frame and no external connection terminal is provided on the lower surface of the base.

3. In the second step, the wavelength conversion member is disposed so that the upper surface of the wavelength conversion member is positioned higher than the upper surface of the frame portion. A method for manufacturing a light emitting device according to claim 1 or 2.

4. The frame portion has a step portion, The method for manufacturing a light emitting device according to claim 3 , wherein in the second step, the wavelength conversion member is bonded to an upper surface of the step portion located below the upper surface of the frame portion.

5. a fourth step of polishing the upper surface of the wavelength conversion member, The method for manufacturing a light emitting device according to claim 1 , wherein the light extraction surface of the wavelength conversion member is a surface that has been polished in the fourth step.

6. In the fourth step, optical characteristics of the light emitted from the light emitting element and passed through the wavelength conversion member are measured, and an amount of polishing of the upper surface of the wavelength conversion member is adjusted based on the measurement result. A method for manufacturing the light emitting device according to claim 5 .

7. In the third step, a distance from the lower surface of the base to the light extraction surface is measured, and an amount of polishing of the lower surface of the base is adjusted based on the measurement result. A method for manufacturing a light emitting device according to claim 1 or 2.

8. In the fourth step, optical characteristics of light emitted from the light emitting element and passed through the wavelength conversion member are measured, and an amount of polishing of the upper surface of the wavelength conversion member is adjusted based on the measurement result. In the third step, after the fourth step, a distance from the lower surface of the base to the light extraction surface is measured, and an amount of polishing of the lower surface of the base is adjusted based on a measurement result. A method for manufacturing the light emitting device according to claim 5 .

9. In the second step, the wavelength conversion member bonded to the upper surface of the light-transmitting member is fixed by bonding the light-transmitting member to the base body; The method for manufacturing a light emitting device according to claim 1 , wherein the wavelength conversion member is joined to the light transmitting member in an area not including a portion directly below the light extraction surface.

Images