Method of cooling assembly, and assembly

Abstract

To provide: an improved method of cooling an assembly; and the assembly.SOLUTION: A method of cooling an assembly including at least one heat-generating electronic device and at least one peripheral heat-generating device that are encapsulated within a container includes: cooling the at least one peripheral heat-generating device with a first cooling medium; cooling the at least one heat-generating electronic device with a cold plate having an internal fluid circuit configured to receive a second cooling medium, and cooling the first cooling medium via the heat sink.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] Exemplary embodiments relate to techniques of thermal management, and more particularly, to thermal management of servers in data centers. [Background technology]

[0002] A "data center" refers to the physical location of one or more servers. Data centers and the servers housed therein typically consume a significant amount of power. Existing servers are designed to be cooled, at least in part, by airflow. Such servers typically include one or more printed circuit boards having a number of operable heat-generating devices attached thereto. The printed circuit boards are typically housed in an enclosure having air vents configured to direct outside air from the data center into, through, and out of the enclosure. The air absorbs heat dissipated by the components and mixes with the surrounding air after being exhausted from the enclosure. Air conditioners are then used to cool the heated air in the data center and recirculate it to repeat the cooling process.

[0003] More powerful server components typically consume more power, but the amount of heat that traditional cooling systems can remove from the server is limited in part by the degree of air conditioning available from the data center. Therefore, there is a need to cool high-performance server components more effectively. Summary of the Invention [Problem to be solved by the invention]

[0004] SUMMARY OF THE DISCLOSURE The object of the invention is therefore to improve cooling of the type mentioned at the outset, so that the above-mentioned disadvantages are reduced. [Means for solving the problem]

[0005] According to an embodiment, a method of cooling an assembly including at least one heat-generating electronic device and at least one peripheral heat-generating device enclosed within a container includes cooling the at least one peripheral heat-generating device with a first cooling medium, cooling the at least one heat-generating electronic device with a cold plate having an internal fluid circuit configured to receive a second cooling medium, and cooling the first cooling medium via a heat sink.

[0006] In addition to or as an alternative to one or more of the features described herein, further embodiments may include circulating a first cooling medium within the vessel.

[0007] In addition to or in place of one or more of the features described herein, further embodiments may include the first cooling medium being cooled via a heat sink at a location upstream from the at least one peripheral heat generating device relative to a direction of flow of the first cooling medium.

[0008] In addition to or as an alternative to one or more of the features described herein, further embodiments may include cooling at least one heat-generating electronic device with the first medium.

[0009] In addition to or in the alternative to one or more of the features described herein, further embodiments may include cooling at least one heat-generating electronic device with a cold plate having an internal fluid circuit further comprising transferring heat from the at least one heat-generating electronic device to a body of the cold plate and transferring heat from the body of the cold plate to a second cooling medium in the fluid circuit.

[0010] In addition to or as an alternative to one or more of the features described herein, further embodiments may include at least one heat-generating electronic device mounted directly to a surface of the cold plate.

[0011] In addition to or as an alternative to one or more of the features described herein, further embodiments may include at least one heat-generating electronic device mounted directly to the printed circuit board and a cold plate thermally coupled to the printed circuit board.

[0012] In addition to or in the alternative to one or more of the features described herein, further embodiments may include that cooling at least one heat-generating electronic device with a cold plate having an internal fluid circuit further includes positioning a portion of the fluid circuit in an overlapping arrangement with the at least one heat-generating electronic device.

[0013] In addition to or as an alternative to one or more of the features described herein, further embodiments may include where cooling the first cooling medium via the heat sink further includes conducting heat from the first cooling medium to a body of the cold plate and transferring heat from the body of the cold plate to a second cooling medium.

[0014] In addition to or as an alternative to one or more of the features described herein, further embodiments may include that the first cooling medium is a dielectric fluid.

[0015] In addition to or as an alternative to one or more of the features described herein, further embodiments may include that the second cooling medium is a refrigerant.

[0016] According to an embodiment, an assembly includes a fluid-tight enclosure, at least one heat-generating electronic device disposed within the enclosure, at least one peripheral heat-generating device disposed within the enclosure, and a first cooling medium disposed within the enclosure. The at least one heat-generating electronic device and the at least one peripheral heat-generating device are encapsulated by the first cooling medium. A cold plate is thermally coupled to the at least one heat-generating electronic device. The cold plate has an internal fluid circuit configured to receive a second cooling medium.

[0017] In addition to or as an alternative to one or more of the features described herein, further embodiments may include at least one heat-generating electronic device being mounted directly to the cold plate.

[0018] In addition to or as an alternative to one or more of the features described herein, further embodiments may include a printed circuit board, with at least one heat-generating electronic device mounted directly to the printed circuit board and with the cold plate thermally coupled to the printed circuit board.

[0019] In addition to or as an alternative to one or more of the features described herein, further embodiments may include a movement mechanism for moving the first cooling medium within the vessel.

[0020] In addition to or as an alternative to one or more of the features described herein, further embodiments may include at least a portion of the internal fluid circuit being positioned in an overlapping arrangement with the at least one heat-generating electronic device.

[0021] In addition to or as an alternative to one or more of the features described herein, further embodiments may include that the internal fluid circuit of the cold plate includes a single continuous path.

[0022] In addition to or as an alternative to one or more of the features described herein, further embodiments may include that the internal fluid circuit of the cold plate includes a first manifold, a second manifold, and at least one fluid passage connecting the first and second manifolds.

[0023] In addition to or as an alternative to one or more of the features described herein, further embodiments may include that the first cooling medium is a dielectric fluid.

[0024] The following description should not be considered limiting in any way.With reference to the accompanying drawings, like elements are numbered alike, and in which:FIG. [Brief description of the drawings]

[0025] [Figure 1] FIG. 1 is a front view of a data center rack with multiple servers mounted therein. [Figure 2A] FIG. 1 is a perspective view of a server according to an embodiment. [Figure 2B] FIG. 2 is a cross-sectional side view of a server according to an embodiment. [Diagram 3] FIG. 1 is a cross-sectional view of an assembly including a server having an integrated cooling system according to an embodiment. [Figure 4] 2 is a cross-sectional view of an internal fluid circuit of a heat sink according to an embodiment. [Diagram 5] 4 is a cross-sectional view of another internal fluid circuit of a heat sink according to an embodiment. [Figure 6] 4 is a cross-sectional view of a data center including a plurality of the assemblies of FIG. 3 according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] A detailed description of one or more embodiments of the disclosed apparatus and methods is presented herein, by way of example and not limitation, with reference to the figures.

[0027] Referring now to FIG. 1, an example data center 20 is illustrated. As shown, the data center 20 includes a cabinet 22 having at least one, and in some embodiments, a plurality of slots (not shown) formed therein. One or more server rack subassemblies (also referred to herein as servers 30) may be permanently or removably mountable within the cabinet 22 (such as within one or more slots formed therein). The plurality of slots, and therefore the at least one server 30 accommodated therein, may have a generally vertical orientation (as shown) or, alternatively, a horizontal orientation. In some embodiments, the data center 20 may include a combination of both horizontally and vertically oriented slots. Additionally, while only a single cabinet 22 is illustrated in the figures, it should be understood that the data center 20 may include several cabinets 22. In embodiments including multiple cabinets 22, the multiple cabinets 22 may be located in the same location within a building, or alternatively, one or more of the cabinets 22 may be located in different locations within a single building or multiple buildings.

[0028] 2, an example of a server 30 that can be accommodated within a slot of the cabinet 22 is illustrated. As shown, the server 30 may include a frame or chassis 32 with at least one printed circuit board 34 mounted to the frame. While only a single printed circuit board 34 is illustrated, it should be understood that in some embodiments, multiple printed circuit boards may be mounted to the chassis 32. The chassis 32 is designed to be insertable, e.g., slidably insertable, into the slots of the server rack and to allow connection to power cables, data cables, and / or other connecting cables provided to or by the cabinet 22.

[0029] The chassis 32 may include a plurality of walls 36, 38, 40 oriented at an angle relative to the printed circuit board 34 and extending around all or at least a portion of the perimeter of the printed circuit board 34. In one embodiment best shown in FIG. 2B, the chassis 32 further includes at least one planar, generally flat panel connected to one or more of the perimeter walls 36, 38, 40 of the chassis 32. At least one planar panel 42 may be disposed on either a first side or a second side of the printed circuit board 34. When the server 30 is horizontally oriented as shown, such planar panel 42 may be disposed vertically below the printed circuit board 34, above the printed circuit board 34, or in some embodiments, the planar panel 42 may be disposed both above and below the printed circuit board. In one embodiment, the chassis 32 in combination with the planar panel 42 forms an airtight container that encloses the server 30. However, embodiments in which a separate jacket or container is positioned around the server 30 to form an airtight assembly are also contemplated herein.

[0030] At least one heat-generating electronic device 50 may be attached to or electrically connected to the printed circuit board 34. Examples of heat-generating electronic device 50 include, without limitation, a processor, e.g., a central processing unit and / or a graphics processing unit, a memory, a hard drive, and a power supply module. In one embodiment, one or more fans 52 are attached to the printed circuit board 34 and operable to move a flow of fluid, such as air, over the heat-generating electronic device 50. In the illustrated non-limiting embodiment, the at least one fan 52 is disposed near a first end 54 of the printed circuit board 34, such that when the server 30 is installed in the cabinet 22, the at least one fan 52 is positioned closer to the front of the cabinet 22 than the heat-generating electronic device 50. However, embodiments in which the one or more fans 52 are disposed in another suitable location, e.g., near a second end 56 of the printed circuit board 34 or a second end 56 of the chassis 32 associated with the rear of the cabinet 22, are also within the scope of the present disclosure.

[0031] In one embodiment, the fluid moved by the at least one fan 52 is configured to make a single pass over the heat-generating electronic device. For example, cool air may be drawn into the fan 52 from a location adjacent the front of the chassis 32, and hot air may be exhausted at the rear of the chassis 32 after removing heat from the heat-generating electronic device 50. In other embodiments, the fluid may be configured to circulate continuously through the server 30, for example, when the chassis 32 includes at least one planar panel 42. For example, as best shown in FIG. 2B, the fan 52 may push a flow of fluid across the heat-generating electronic device 50 disposed on the first surface 58 of the printed circuit board 34. Upon reaching the second end 56 of the printed circuit board 34, the fluid may turn through one or more openings to make a second pass along the second opposite side 60 of the printed circuit board 34. Upon reaching the first end 54 of the printed circuit board 34, the fluid may turn again and be drawn back into the inlet of the at least one fan 52.

[0032] 3, an example assembly 100, such as, for example, a server 30, having an integrated cooling system is illustrated. Similar to the server 30 illustrated in FIGS. 2A and 2B, in the illustrated non-limiting embodiment, the assembly 100 includes a server 30 having a chassis 32 with at least one printed circuit board 34 mounted thereon and at least one heat-generating electronic device 50 mounted or electrically connected to the printed circuit board 34. In the illustrated non-limiting embodiment, the server 30 includes four heat-generating electronic devices 50. However, it should be understood that embodiments in which the server 30 includes one, two, three, or more than four heat-generating electronic devices 50 are also within the scope of the present disclosure.

[0033] The assembly 100 further includes a sealed container 102, and the server 30 may be entirely enclosed or wrapped within an interior 104 of the sealed container 102. The sealed container 102 may be formed from the chassis 32 and the plurality of flat panels 42, as previously described, or may be a separate container positionable around the server 30. In one embodiment, the container 102 is hermetically sealed to prevent any fluid flow out of the interior 104 of the container 102. The interior 104 of the container 102 may be filled with a first cooling medium C1 such that the heat-generating electronic devices 50 are immersed or encapsulated within the first cooling medium C1. When the first cooling medium C1 contacts one or more heat-generating electronic devices 50, the first cooling medium C1 is configured to absorb heat, thereby removing heat from the more heat-generating electronic devices 50. In one embodiment, the first cooling medium C1 is a dielectric fluid. The first cooling medium C1 may comprise a single dielectric fluid or, alternatively, may comprise a mixture of two or more dielectric fluids having different boiling points.

[0034] The density of the dielectric fluid is configured to change with the temperature of the dielectric fluid. Thus, the resulting change in density as the dielectric fluid absorbs heat may cause natural circulation of the dielectric fluid within the vessel 102. However, in other embodiments, a fluid movement mechanism, such as, for example, a pump or circulator, may be positioned within the interior 104 of the vessel 102 in fluid communication with the first cooling medium C1.

[0035] In one embodiment, the assembly 100 includes a heat sink 110 disposed within the interior 104 of the container 102. In the illustrated non-limiting embodiment, the heat sink 110 is disposed centrally within the container 102. Embodiments in which the heat sink 110 is disposed elsewhere within the container 102 are also contemplated herein. As shown, the heat sink 110 may be directly attached to the printed circuit board 34. Thus, the heat sink 110 may be indirectly thermally coupled to one or more of the heat-generating electronic devices 50 via the printed circuit board 34. Alternatively, or in addition, one or more heat-generating electronic devices 50 that are not attached to the printed circuit board 34 may be directly attached to the surface 112 of the heat sink 110. Such heat-generating electronic devices 50 may be considered to be directly thermally coupled to the heat sink 110. A heat-generating electronic device 50 that is directly coupled to the heat sink 110 or indirectly coupled to the heat sink 110 via the printed circuit board 34 may be referred to herein as a selected heat-generating device. Similarly, a heat-generating electronic device 50 of the server 30 that is directly thermally coupled to the heat sink 110 or indirectly thermally coupled to the heat sink 110 via the printed circuit board 34 may be considered a “peripheral” heat-generating device 50 .

[0036] In one embodiment, the heat sink 110 is a cold plate having an internal fluid circuit 120 configured to receive and remove heat from a second cooling medium C2. It should be understood that the first and second cooling mediums C1, C2 described herein may be the same or, alternatively, may be separate or different media or fluids. Additionally, while only a single cold plate 110 is illustrated, it should be understood that embodiments including multiple cold plates fluidly coupled in parallel or series are also within the scope of the present disclosure.

[0037] An example of the internal fluid circuit 120 of the heat sink 110 is illustrated in the cross-sectional views shown in Figures 4 and 5. As shown, the fluid circuit 120 includes a fluid inlet 122 and a fluid outlet 124 formed in the body of the cold plate. The fluid inlet 122 and the fluid outlet 124 can be any shape, including, for example, a circle, an oval, a triangle, a square, a rectangle, or any simple polygon or part thereof in a depth dimension (e.g., in the zx plane of the accompanying figures). Also, in one embodiment, the fluid outlet 124 can have a much larger diameter compared to the fluid inlet 122, thereby helping to reduce the pressure drop for the second cooling medium C2 passing through the fluid outlet 124.

[0038] In one embodiment, best shown in Figure 4, the fluid circuit 120 includes a continuous flow path having a serpentine configuration extending between the fluid inlet 122 and the fluid outlet 124. However, in other embodiments, as shown in Figure 5, the fluid circuit 120 may include a first or inlet manifold 126, a second or outlet manifold 128, and at least one fluid passageway 130 connecting the first and second manifolds 126, 128. In one embodiment, the at least one fluid passageway 130 includes a plurality of fluid passageways 130.

[0039] In one embodiment, one or more fluid passages 130 of the fluid circuit 120 may be positioned to perform localized cooling in areas of the heat sink 110 having the greatest heat flux, for example, in areas of the heat sink 110 that are in direct alignment or overlapping arrangement with the heat-generating electronic device 50. Thus, at least one fluid passage 130 may be associated with at least one selected heat-generating electronic device 50. In an embodiment in which the heat sink 110 is associated with multiple selected heat-generating electronic devices 50, one or more fluid passages 130 may be associated with each of the selected heat-generating electronic modules and configured to remove heat therefrom. More specifically, at least one fluid passage 130 associated with each selected heat-generating electronic device 50 may be physically positioned within the cold plate 110 in an overlapping arrangement or in alignment with the selected heat-generating electronic device 50. In one embodiment, the total number of fluid passages 130 positioned within the localized area of ​​increased heat flux associated with each heat-generating electronic device 50 may vary based on the heat that needs to be removed from each heat-generating electronic device 50. As a result, as shown in FIG. 5, a different number of fluid passages 130 may be aligned with each heat-generating electronic device 50 associated with the heat sink 110.

[0040] During operation of the server 30 of the assembly 100, the heat-generating electronic devices 50 are cooled by two different types of cooling. The first type of cooling involves directly cooling one or more peripheral heat-generating devices 50 using a first cooling medium C1 within the interior 104 of the container 102. The first cooling medium C1 is disposed in direct contact with one or more surfaces of at least one peripheral heat-generating device 50. Thus, as the first cooling medium C1 circulates or moves through the interior 104, heat is transferred from the peripheral heat-generating devices to the first cooling medium C1. In some embodiments, the first cooling medium C1 may also be configured to contact one or more surfaces of one or more selected heat-generating electronic devices 50, such that the first cooling medium C1 is configured to cool the selected heat-generating electronic devices 50.

[0041] A second type of cooling of the assembly 100 involves removing heat from at least one selected heat-generating electronic device 50 by the heat sink 110. As previously mentioned, the selected heat-generating device may include one or more of the heat-generating electronic devices 50 mounted on the printed circuit board 34 and / or one or more heat-generating electronic devices 50 mounted directly on the heat sink 110. During operation, at least a portion of the heat generated by the at least one selected heat-generating electronic device 50 is transferred to the body of the heat sink 110, such as, for example, via conduction. At the same time, a second cooling medium C2, such as, for example, a refrigerant, is provided to the fluid inlet 122 of the fluid circuit 120. The second cooling medium C2 provided to the fluid circuit 120 may be a liquid or, alternatively, may be a two-phase mixture, most often of liquid and vapor. As the second cooling medium C2 passes through the fluid circuit 120, at least a portion of the heat transferred from the at least one selected heat-generating electronic device 50 to the heat sink is transferred from the body of the heat sink 110 to the second cooling medium C2. As the heat is transferred to the second cooling medium C2, the temperature of the second cooling medium C2 in the fluid circuit increases. Thus, the temperature of the second cooling medium C2 at the fluid outlet 124 is higher than the temperature of the second cooling medium C2 at the fluid inlet 122. Furthermore, in some embodiments, this heat transfer may cause at least a portion of the second cooling medium C2 in the fluid circuit 120 to evaporate.

[0042] Additionally, the heat sink and the second cooling medium C2 may be used to adjust the condition of the first cooling medium C1 by removing heat therefrom, such that the temperature of the first cooling medium C1 is suitable for removing heat from one or more peripheral heat-generating devices and / or one or more heat-generating electronic devices thermally coupled to the heat sink 110. Thus, the first cooling medium C1 may be cooled by the heat sink 110 at a location upstream from the one or more peripheral heat-generating devices relative to a direction of flow of the first cooling medium C1 in the container 102. The first cooling medium C1 in the interior 104 of the container 102 is configured to contact one or more surfaces of the heat sink 110. As a result of this contact, at least a portion of the heat absorbed by the first cooling medium C1 from the peripheral heat-generating devices 50 may be transferred to the heat sink 110, thereby cooling the first cooling medium C1. This heat is removed from the body of the heat sink 110 in combination with heat transferred to the body from at least one selected heat-generating electronic device 50 via the flow of the second cooling medium C2 in the fluid circuit 120.

[0043] The heated secondary coolant C2 output from fluid outlet 124 of fluid circuit 120 may be sent to one or more downstream loads, illustrated generally at 130. Heat removed by the secondary coolant fluid C1 from the primary coolant C1 of at least one selected heat-generating electronic device 50 may be rejected to another fluid at one or more loads 140. For example, in one embodiment, the downstream load is a building hot water heater or an air conditioning system.

[0044] In one embodiment, best shown in FIG. 6, multiple assemblies 100 may be arranged in a cabinet 22 or other data center. In such an embodiment, the secondary cooling medium C2 may be provided to each of the multiple assemblies 100 in series or in parallel. In an embodiment in which the assemblies 100 are arranged in parallel, the inlet manifold 142 may be fluidly coupled to the fluid inlets 122 of each fluid circuit 120, and the outlet manifold 144 may be fluidly coupled to the fluid outlets 124 of each fluid circuit 120. In such an embodiment, the heated second cooling medium C2 collected in the outlet manifold 144 from each of the assemblies 100 is mixed and then delivered to one or more downstream loads 140.

[0045] The assembly 100 with integrated cooling system illustrated and described herein provides an easily scalable solution for cooling heat generating components. Such a cooling solution can improve the sustainability and efficiency of the heat generating components by preventing heat from being absorbed from the heat generating components to downstream heating applications. Additionally, the air conditioning load for cooling areas including data centers is reduced.

[0046] The term "about" is intended to include the degree of error associated with measurement of the particular quantity with the equipment available at the time of filing.

[0047] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly indicates otherwise. It will be further understood that the terms "comprise" and / or "comprising", as used herein, specify the presence of stated features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0048] Although the present disclosure has been described with reference to an exemplary embodiment or embodiments, it will be apparent to those skilled in the art that various changes may be made in the elements thereof and equivalents may be substituted without departing from the scope of the disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the disclosure without departing from the essential scope of the disclosure. Therefore, it is not intended that the disclosure be limited to the particular embodiment disclosed as the best mode contemplated for carrying out the disclosure, but rather that the disclosure will include all embodiments falling within the scope of the appended claims.

Claims

1. 1. A method of cooling an assembly including at least one heat-generating electronic device and at least one peripheral heat-generating device enclosed within an enclosure, comprising: cooling the at least one peripheral heat generating device with a first cooling medium; cooling the at least one heat-generating electronic device with a cold plate having an internal fluid circuit configured to receive a second cooling medium; and cooling the first cooling medium through the heat sink.

2. The method of claim 1 , further comprising circulating the first cooling medium within the vessel.

3. The method of claim 2 , wherein the first cooling medium is cooled through the heat sink at a location upstream from the at least one peripheral heat generating device relative to a direction of flow of the first cooling medium.

4. The method of any of claims 1 to 3, further comprising cooling said at least one heat-generating electronic device with said first cooling medium.

5. Cooling the at least one heat-generating electronic device with the cold plate having the internal fluid circuit includes: transferring heat from the at least one heat-generating electronic device to a body of the cold plate; The method of any of claims 1 to 4, further comprising transferring heat from the body of the cold plate to the second cooling medium in the fluid circuit.

6. The method of claim 5 , wherein the at least one heat-generating electronic device is attached directly to a surface of the cold plate.

7. 7. The method of claim 5 or claim 6, wherein the at least one heat-generating electronic device is mounted directly to a printed circuit board and the cold plate is thermally coupled to the printed circuit board.

8. 8. The method of claim 1, wherein cooling the at least one heat-generating electronic device with the cold plate having the internal fluid circuit further comprises positioning a portion of the fluid circuit in an overlapping arrangement with the at least one heat-generating electronic device.

9. Cooling the first cooling medium through the heat sink includes: conducting heat from the first cooling medium to a body of the cold plate; The method of any of claims 1 to 8, further comprising transferring heat from the body of the cold plate to the second cooling medium.

10. The method according to any of the preceding claims, wherein the first cooling medium is a dielectric fluid.

11. The method according to any one of claims 1 to 10, wherein the second cooling medium is a refrigerant.

12. 1. An assembly comprising: A fluid-tight container; at least one heat-generating electronic device disposed within the enclosure; at least one peripheral heat generating device disposed within the container; a first cooling medium disposed within the enclosure, the at least one heat-generating electronic device and the at least one peripheral heat-generating device being encapsulated by the first cooling medium; a cold plate thermally coupled to the at least one heat-generating electronic device, the cold plate having an internal fluid circuit configured to receive a second cooling medium.

13. The assembly of claim 12 , wherein the at least one heat-generating electronic device is directly attached to the cold plate.

14. 13. The assembly of claim 12, further comprising a printed circuit board, said at least one heat-generating electronic device being directly mounted to said printed circuit board, and said cold plate being thermally coupled to said printed circuit board.

15. The assembly of any of claims 12 to 14, further comprising a movement mechanism for moving the first cooling medium within the vessel.

16. An assembly according to any of claims 12 to 15, wherein at least a portion of the internal fluid circuit is positioned in an overlapping arrangement with the at least one heat-generating electronic device.

17. An assembly according to any one of claims 12 to 16, wherein the internal fluid circuit of the cold plate comprises a single continuous path.

18. 17. The assembly of claim 12, wherein the internal fluid circuit of the cold plate includes a first manifold, a second manifold, and at least one fluid passage connecting the first and second manifolds.

19. An assembly according to any one of claims 12 to 18, wherein the first cooling medium is a dielectric fluid.

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