Manufacturing apparatus of electronic component and manufacturing method of electronic component

Abstract

To provide a manufacturing apparatus of an electronic component, capable of reducing a lamination time.SOLUTION: A manufacturing apparatus (100) of an electronic component, comprises: a crimp head (130) having a crimp surface for transferring a ceramic green sheet (20); and a plurality of lamination tables (110a, 110b, 110c, 110d, and 110e) that laminate the ceramic green sheet (20) transferred. In the manufacturing apparatus (100), a lamination area (L) where the ceramic green sheet (20) is laminated onto the lamination table (110) is included. In the lamination area (L), the plurality of lamination tables (110a and 110b) are closely arranged.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an apparatus for manufacturing electronic components and a method for manufacturing electronic components. [Background technology]

[0002] A method is known for mass-producing small electronic components at once by stacking ceramic green sheets, which are made by forming unsintered ceramic material into sheets, pressurizing them, and then sintering and dividing them into individual pieces.

[0003] As a method for manufacturing such electronic components, for example, Patent Document 1 discloses a method in which a green sheet is transported while the ceramic sheet is held by a holding means, and the middle portion of the green sheet is folded along the edge of a blade member, thereby peeling the ceramic green sheet from the carrier film and stacking it on a lamination stage. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2011-91309 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the method described in Patent Document 1, ceramic sheets are sequentially laminated on a single lamination stage using a lamination head, so there is room for shortening the lamination time per lamination unit. Furthermore, in order to laminate ceramic green sheets using the method described in Patent Document 1, it is necessary to arrange all of the ceramic green sheets constituting the laminate in advance on a holding means in the order of lamination. However, it is rare for two or more layers of ceramic green sheets with the same pattern to be laminated in succession. Therefore, it is necessary to arrange ceramic green sheets with different patterns side by side on a holding means, but such ceramic green sheets are not suitable for mass production, and there is also a problem that it is difficult to reduce the time and cost required for production.

[0006] The present invention has been made to solve the above-mentioned problems, and has an object to provide an electronic component manufacturing apparatus capable of shortening the stacking time. [Means for solving the problem]

[0007] The electronic component manufacturing apparatus of the present invention is an electronic component manufacturing apparatus comprising a crimping head having a crimping surface for transporting ceramic green sheets, and a plurality of stacking tables for stacking the transported ceramic green sheets, characterized in that it has a stacking area for stacking the ceramic green sheets on the stacking tables, and within the stacking area, the plurality of stacking tables are arranged in close proximity to each other. Effect of the Invention

[0008] According to the present invention, it is possible to provide an apparatus for manufacturing electronic components that can shorten the stacking time. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing a schematic diagram of an example of an electronic component manufacturing apparatus according to the present invention. [Diagram 2] FIG. 2 is an enlarged side view of the vicinity of the laminated area. [Diagram 3] FIG. 3 is a cross-sectional view taken along line AA' in FIG. [Figure 4] FIG. 4 is a cross-sectional view that illustrates a schematic diagram of another example of the stacking table. [Diagram 5] FIG. 5 is a diagram showing an example of a method for cutting the ceramic green sheet. [Figure 6] FIG. 6 is a cross-sectional view that illustrates a schematic diagram of another example of the compression bonding head. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The electronic component manufacturing apparatus of the present invention will be described below. However, the present invention is not limited to the following configuration, and can be modified as appropriate within the scope of the present invention. Note that the present invention also includes a combination of two or more of the individual preferable configurations of the present invention described below.

[0011] In this specification, terms indicating the relationship between elements (e.g., "opposite," "orthogonal," etc.) and terms indicating the shape of an element (e.g., "rectangular prism") are not intended to be used in a strict sense, but are intended to include a substantially equal range, for example, a difference of a few percent.

[0012] The drawings shown below are schematic diagrams, and the dimensions, aspect ratios, and other scales may differ from those of the actual products.

[0013] [Electronic component manufacturing equipment] The electronic component manufacturing apparatus of the present invention is an electronic component manufacturing apparatus comprising a crimping head having a crimping surface for transporting ceramic green sheets, and a plurality of stacking tables for stacking the transported ceramic green sheets, characterized in that it has a stacking area for stacking the ceramic green sheets on the stacking tables, and within the stacking area, the plurality of stacking tables are arranged in close proximity to each other.

[0014] FIG. 1 is a diagram showing a schematic diagram of an example of an electronic component manufacturing apparatus according to the present invention. An electronic device manufacturing apparatus 100 shown in FIG. 1 includes a plurality of lamination tables 110a, 110b, 110c, 110d, and 110e for laminating ceramic green sheets.

[0015] All of the multiple stacking tables 110a, 110b, 110c, 110d, and 110e are arranged to move along a circular (racetrack-shaped) conveying rail 120, and move clockwise (in the direction of the arrow shown on the conveying rail 120 in Figure 1) on a circular conveying path that includes the stacking area L and the removal area E.

[0016] The shape of the transport rail 120 does not necessarily have to be a circular ring. For example, the end and start ends may be connected to form a circular shape, or the end and start ends may be disconnected.

[0017] 1, stacking tables 110a and 110b are arranged in stacking area L. Furthermore, stacking table 110c is arranged in removal area E. Furthermore, stacking tables 110d and 110e are arranged in areas other than stacking area L and removal area E.

[0018] However, since each of the stacking tables 110a, 110b, 110c, 110d, and 110e is transported along the transport rail 120, the area in which each of the stacking tables is arranged is not limited to the area shown in FIG. 1, but changes sequentially.

[0019] Each stacking table can move smoothly along the transport rails without bearings. The method of moving each stacking table along the transport rail will be described later.

[0020] Next, the laminated area L will be described. In the lamination area L, the ceramic green sheets are laminated on a lamination table.

[0021] The ceramic green sheets may be laminated directly on the lamination table, or may be laminated on a flat jig placed on the lamination table.

[0022] In electronic component manufacturing apparatus 100 shown in FIG. 1, within stacking area L, stacking table 110a and stacking table 110b are disposed adjacent to each other.

[0023] When multiple stacking tables are "close to each other" in the stacking area, it means that the shortest distance between the stacking tables is 10 mm or less (including zero). "Close to each other" also includes "contacting each other." Therefore, it is preferable that two stacking tables that are placed close to each other in the stacking area are in contact with each other.

[0024] Ceramic green sheets (not shown) are laminated on lamination tables 110a and 110b in the lamination area L. The assembly of ceramic green sheets laminated on the lamination tables is also called a laminate.

[0025] The number of ceramic green sheets stacked on the stacking table while the stacking table passes through the stacking area L is not particularly limited, and one ceramic green sheet may be stacked, or multiple ceramic green sheets may be stacked.

[0026] It is not necessary to stack the ceramic green sheets in order on a plurality of adjacent stacking tables. For example, when a first lamination table and a second lamination table are arranged adjacent to each other within a lamination area, an operation may be performed in which 10 ceramic green sheets are laminated on the first lamination table and then 10 ceramic green sheets are laminated on the second lamination table, or the process of laminating one ceramic green sheet on the first table and then laminating one ceramic green sheet on the second lamination table may be repeated 10 times in a row.

[0027] In the lamination area, the ceramic green sheets are transported by a pressure bonding head and laminated on a lamination table. An example of this process will be described with reference to FIG.

[0028] FIG. 2 is an enlarged cross-sectional view of the vicinity of the lamination area in the electronic component manufacturing apparatus shown in FIG. The process shown in FIG. 2 is an example of a process in which the ceramic green sheet 20 is peeled off from the raw material sheet 30 by the pressure bonding head 130 in the lamination area L, and laminated on the lamination table 110a.

[0029] In the stacking area L, a plurality of stacking tables 110a, 110b are arranged and transported in a fixed direction. The lamination tables 110a and 110b are flat, and therefore the upper surfaces of the lamination tables 110a and 110b (the surfaces on which the ceramic green sheets 20 are laminated) are flat.

[0030] The raw material sheet 30 is composed of a resin film 10 serving as a support, and a ceramic green sheet 20 disposed on the resin film 10 .

[0031] The raw material sheet 30 is unwound by an unwinding mechanism (not shown) and transported along the surface of a peeling stage 140 arranged in the stacking area L shown in FIG. 2 before being wound up by a winding mechanism (not shown).

[0032] The raw material sheet 30 is transported along the surface of the peeling stage 140 from the upper left to the lower right of the page, and then the transport direction is changed at the tip 140a of the peeling stage 140, and the raw material sheet 30 is transported from the right side to the left side of the page. At this time, the ceramic green sheet 20 is adsorbed by the pressure bonding head 130 and peeled off from the resin film 10 constituting the raw material sheet 30.

[0033] In the lamination area L, the ceramic green sheets 20 are laminated on the lamination table 110a in the following procedure. In the lamination area L, a peeling stage 140 is disposed. The raw material sheet 30 transported on the peeling stage 140 is first cut by the cutting means 150 . The raw material sheet 30 is a long sheet obtained by laminating a long resin film 10 having a predetermined width and a ceramic green sheet 20. The resin film 10 and the ceramic green sheet 20 are laminated in the order in which the resin film 10 is on the side that contacts the peeling stage 140, and the ceramic green sheet 20 is on the side that does not contact the peeling stage 140. The cutting means 150 extends in the above-mentioned width direction (front-rear direction of the paper) of the raw material sheet 30, and its length is longer than the length of the ceramic green sheet 20 in the width direction. Therefore, by inserting the cutting means 150 to a position deeper than the thickness of the ceramic green sheet 20, the ceramic green sheet 20 is completely cut in the width direction. Note that it is preferable that the cutting means 150 does not completely cut the resin film 10 in the thickness direction. Since the cut ceramic green sheet 20 is supported by the resin film 10, it is transported along the surface of the peeling stage 140 even after cutting.

[0034] Next, the cut ceramic green sheet 20 is adsorbed onto the bonding surface 130 a by the bonding head 130 .

[0035] The method of adsorbing the ceramic green sheet 20 by the bonding surface 130a of the bonding head 130 is not particularly limited, but an example of such a method is to provide multiple suction holes on the surface to be bonded, and suck air through the suction holes while the bonding surface is in close contact with the surface of the ceramic green sheet 20. When such a method is used, while the air is being suctioned, the bonding surface 130a of the compression head 130 adsorbs the ceramic green sheet 20. On the other hand, while the air suction is released, the ceramic green sheet 20 is not adsorbed. Therefore, the adhesion and detachment of the ceramic green sheet 20 can be controlled by the presence or absence of air suction.

[0036] The ceramic green sheet 20 is adsorbed by the above-mentioned bonding head 130, and the bonding head 130 is transported in the direction in which the ceramic green sheet 20 was originally supposed to move. The transport direction of the resin film 10 supporting the ceramic green sheet 20 adsorbed by the bonding head 130 is changed at the tip 140a of the peeling stage 140, so that the ceramic green sheet 20 adsorbed to the bonding surface 130a of the bonding head 130 is peeled off from the resin film 10 that constitutes the raw material sheet 30. In Figure 2, the resin film 10 is transported toward the left side of the paper, but the cut ceramic green sheet 20 is adsorbed to the compression bonding head 130 and transported toward the lower right side of the paper, so that the cut ceramic green sheet 20 is peeled off from the resin film 10.

[0037] Finally, the compression head 130 adsorbing the ceramic green sheet 20 is moved onto the lamination table 110a, and after the ceramic green sheet 20 comes into contact with the lamination table 110a, the adsorption of the compression head 130 is released and the compression head 130 is moved from above the lamination table 110a.

[0038] Through the above steps, the ceramic green sheet 20 can be peeled off from the surface of the raw material sheet 30 using the pressure bonding head 130, and stacked on the stacking table 110a.

[0039] When the ceramic green sheet 20 is laminated on the lamination table 110a by the compression head 130, a slight force may be applied to the ceramic green sheet 20 to compress it onto the lamination table 110a.

[0040] A similar process can be performed for stacking table 110b.

[0041] The ceramic green sheet 20 may be pre-cut and then unwound by the unwinding mechanism, in which case the cutting means shown in FIG.

[0042] In the lamination area L, the lamination tables 110a, 110b are arranged close to each other. Therefore, the distance from the peeling area to each of the lamination tables 110a, 110b is short, and the time required for the pressure bonding head 40 to transport and laminate the ceramic green sheets 20 onto the lamination tables 110a, 110b is shortened.

[0043] In addition, within the stacking area L, three or more stacking tables may be arranged adjacent to each other. For example, when stacking table A, stacking table B, and stacking table C are arranged in a stacking area, if stacking table A and stacking table B are adjacent to each other and stacking table B and stacking table C are adjacent to each other, these three stacking tables A to C are considered to be adjacent to each other. Therefore, there are cases where stacking table A and stacking table C are not directly adjacent to each other.

[0044] In the lamination area L, it is preferable that the lamination table and the pressure bonding head are transported in the same direction, which is approximately parallel to the pressure bonding surface. In the lamination area L shown in FIG. 2, when the ceramic green sheet 20 adsorbed to the compression head 130 is laminated on the lamination table 110a or 110b, the compression surface 130a constituting the compression head 130 becomes approximately parallel to the upper surface (the surface on which the ceramic green sheet is laminated) of the lamination table 110a or 110b. At the moment when the ceramic green sheets are laminated, the conveying direction of the lamination tables 110a and 110b in the lamination area is from the left side to the right side of the paper. On the other hand, the conveying direction of the pressure bonding head 130 is from the left side to the right side of the paper, which is the same as the conveying direction of the lamination tables 110a and 110b. Furthermore, this direction can be said to be approximately parallel to the pressure bonding surface 130a.

[0045] The surface of the lamination table on which the ceramic green sheets are laminated is preferably flat, and therefore the shape of the lamination table may be a flat plate.

[0046] The crimping surface of the crimping head does not necessarily have to be flat, but may be curved, for example.

[0047] If necessary, a coating layer such as DLC (diamond-like carbon) may be formed on the bonding surface of the bonding head.

[0048] The number of compression heads arranged in the lamination area may be one or more.

[0049] A camera may be disposed in the lamination area. The camera is disposed, for example, near the bonding head and can read marks on the lamination table or the ceramic green sheets for alignment.

[0050] As a method for adsorbing the ceramic green sheet onto the surface of the compression head, in addition to the above-mentioned method of sucking air through the holes, there is also an electrical adsorption method.

[0051] A laminate in which a predetermined number of ceramic green sheets are laminated is removed from the lamination table in a removal area E.

[0052] The method for removing the laminate in the removal area E is not particularly limited, but may be, for example, a method in which the laminate is removed by a robot arm or the like.

[0053] In the removal area E, the stack may be removed together with the stacking table, or only the stack may be removed. Also, if a plate-shaped jig or the like is placed on the stacking table and the stack is stacked on the jig, the stack may be removed together with the jig.

[0054] It should be noted that the laminate formed by stacking the ceramic green sheets in the lamination area L is not necessarily removed in the removal area E. For example, a camera or the like may be installed in the removal area to identify markers or the like provided on the ceramic green sheets that constitute the laminate, and to determine whether or not to remove the laminate.

[0055] If it is determined that the stacking table does not need to be removed in the removal area, it is transported again along the transport rails to the outside of the removal area.

[0056] The laminate removed from the removal area is then compressed to form a mother block, which is then cut into small pieces, sintered, and external electrodes are formed to form an electronic component.

[0057] Next, a method for moving the stacking table along the transport rails will be described. FIG. 3 is a cross-sectional view taken along line AA' in FIG. 3, stacking table 110a is disposed on transport rail 120 via mover 160. By moving mover 160 with linear motor 170, stacking table 110a connected to mover 160 can be operated independently. In addition, the stacking table 110a may be subjected to a downward pressing force by the above-mentioned pressure bonding head. In order to prevent the stacking table 110a from being deformed at that time, a support member 180 may be disposed below the stacking table 110a.

[0058] Fig. 4 is a cross-sectional view showing a schematic diagram of another example of the stacking table, in which the stacking table is suspended to the side and below the transport rail. 4 is connected to the transport rail 120 via a mover 161 having a crank-shaped cross section. Therefore, the stacking table 110f is disposed at a position to the side and below the transport rail 120, rather than on the transport rail 120.

[0059] By moving the mover 161 with the linear motor 170, the stacking table 110f connected to the mover 161 can be transported independently of the other stacking tables. In addition, the stacking table 110f may be subjected to a downward pressing force by the aforementioned crimping head, and in order to prevent the stacking table 110f from being deformed at that time, a support member 180 may be arranged below the stacking table 110f.

[0060] 4 has a crank shape, and therefore when the mover 161, stacked table 110f, and support member 180 are regarded as a single rigid body, the center of gravity does not overlap with the linear motor 170 and the transport rail 120. Therefore, when the mover, stacked table, and support are regarded as a single rigid body, the shape of the mover may be changed so that the center of gravity overlaps with the linear motor and the rail. For example, the shape of the mover may be such that it spans both sides of the rail in the width direction, with the stacking table and support disposed on one side, and a weight disposed on the other side so that the center of gravity of the whole overlaps with the linear motor and rail. If the center of gravity of the mover, stacking table, support member, and weight viewed as a single rigid body overlaps with the linear motor and rail, stability during transportation of the stacking table can be improved.

[0061] In the electronic component manufacturing apparatus of the present invention, the timing for cutting the ceramic green sheet is not limited to the timing shown in FIG. For example, after preparing the raw material sheet, the ceramic green sheet may be cut into a predetermined shape before being unwound by the unwinding mechanism. In this case, the ceramic green sheet unwound by the unwinding mechanism is cut in advance. In this case, the process of cutting the ceramic green sheet 20 constituting the raw material sheet 30 on the peeling stage 140 as shown in FIG. 2 is not required. That is, in the above case, the electronic device manufacturing apparatus of the present invention does not need to be equipped with a cutting means for cutting the ceramic green sheet into a specific shape.

[0062] The method for cutting the ceramic green sheet is not limited to the cutting method shown in FIG. FIG. 5 is a diagram showing an example of a method for cutting the ceramic green sheet. In FIG. 2, the ceramic green sheet 20 is cut by one cutting means 150 whose widthwise length is longer than the width of the ceramic green sheet. However, for example, as shown in FIG. 5, two or more cutting means 151 may be combined to cut the ceramic green sheet 20 into a predetermined shape. In this case, similarly to the case shown in FIG. 2, it is preferable that the resin film 10 is not completely cut by the cutting means 150. Also, although FIG. 5 discloses a method of cutting the ceramic green sheet 20 using two cutting means, the number of cutting means is not particularly limited, and the ceramic green sheet may be cut by pressing a cutting blade having an overall rectangular shape (e.g., a Thomson blade) against the ceramic green sheet, or by rotating a disc-shaped blade while pressing it against the ceramic green sheet. Furthermore, although the cutting means 151 shown in FIG. 5 is a single-edged cutting means, the cutting means may be a double-edged cutting means.

[0063] The method for cutting the ceramic green sheet is not limited to the above-mentioned method using a cutting blade, and may be, for example, a method using a laser or the like.

[0064] The shape of the crimping head is not limited to a flat plate shape, but may be, for example, a cylindrical shape. When the bonding head is cylindrical, the ceramic green sheet can be adsorbed to the side surface of the bonding head (the side surface of the cylinder). Furthermore, by rotating the bonding head, the ceramic green sheet adsorbed to the side surface of the bonding head can be transported.

[0065] For example, a raw material sheet in which a ceramic green sheet cut to a predetermined shape is placed on a resin film is brought close so that the surface of the ceramic green sheet faces the side of a compression head, and at the moment that the surface of the ceramic green sheet comes into contact with the side of the compression head, the ceramic green sheet is adsorbed by the compression surface of the suction head, thereby allowing the ceramic green sheet to be peeled off from the raw material sheet.

[0066] After the ceramic green sheet is adsorbed to the side surface of the compression head by the above method, by continuing to rotate the compression head, the ceramic green sheet can be adsorbed and transported along the side surface of the compression head.

[0067] Furthermore, the lamination table is moved so that the ceramic green sheet adsorbed to the side of the compression head comes into contact with the lamination table, and at the moment when the ceramic green sheet adsorbed to the side of the compression head comes into contact with the lamination table, the adsorption of the compression head is released, thereby moving the ceramic green sheet adsorbed to the surface of the compression head to the surface of the lamination table.

[0068] In other words, by using a cylindrical compression head, the transport path of the adsorbed ceramic green sheet is limited to a path along the side of the compression head when it is rotated, but the rotational movement of the compression head enables the ceramic green sheet to be peeled off and laminated continuously. Therefore, by using a cylindrical compression head, the time required for laminating the ceramic green sheets can be reduced. At this time, it is preferable that the lamination table and the pressure bonding head are transported in the same direction on a plane substantially parallel to the pressure bonding surface.

[0069] FIG. 6 is a cross-sectional view that typically shows an example of laminating ceramic green sheets using another example of the compression bonding head. FIG. 6 is also an example of a lamination area in which a cylindrical compression head is arranged. In the lamination area shown in FIG. 6, the pressure bonding head 135 rotates counterclockwise, and the lamination tables 110a, 110b are transported in one direction from the left to the right of the drawing so as to contact the lower end 135b of the pressure bonding head. In the cylindrical crimping head 135, the side surface of the cylinder serves as the crimping surface 135a.

[0070] However, since the point that actually comes into contact with the ceramic green sheet 20 is the lower end 135b of the bonding head 135, the direction of the bonding surface is considered as the direction of the bonding surface 135a at the lower end 135b of the bonding surface 135a.

[0071] At the moment when the bonding surface 135a at the lower end 135b of the bonding head 135 comes into contact with the stacking table 110a or 110b, the adsorption of the bonding head 135 is released, and the ceramic green sheet 20 that was adsorbed to the bonding surface 135a of the bonding head 135 is stacked on the stacking table 110a or 110b.

[0072] As shown in FIG. 6, by rotating the cylindrical compression head 135 and adjusting the positional relationship between the compression head 135 and the stacking tables 110a, 110b and the transport paths of the stacking tables 110a, 110b so that the stacking tables 110a, 110b and the compression head 135 are transported in the same direction in a plane approximately parallel to the compression surface 135a, the ceramic green sheet held on the compression surface of the compression head can be stacked on the stacking table using the cylindrical compression head.

[0073] At this time, it is preferable that the conveying speed of the compression head and the conveying speed of the lamination table are the same. In other words, it is preferable that the movement of the compression surface of the compression head and the movement of the lamination table are synchronized at the moment when the ceramic green sheets are laminated on the lamination table.

[0074] When the pressure bonding head and the lamination table come into contact with each other, the ceramic green sheet moved onto the lamination table may be pressure bonded by applying a downward force to the pressure bonding head or an upward force to the lamination table. By pressure bonding the ceramic green sheet, it is possible to prevent displacement.

[0075] The ceramic green sheet is formed by coating a slurry containing ceramic particles made of, for example, Ba and Ti, as well as a binder, a dispersant, and the like, on a resin film and drying the slurry.

[0076] The coating method is not particularly limited, and various coating methods such as gravure coating and die coating can be used.

[0077] The thickness of the ceramic green sheet is not particularly limited, but is about 0.2 μm or more and 3.0 μm or less.

[0078] An internal electrode pattern may be printed on the surface of the ceramic green sheet as required. The ceramic green sheet on which the internal electrode pattern is printed is also called an internal electrode sheet.

[0079] The internal electrode patterns can be formed by printing an internal electrode paste, which is a mixture of metal particles, a binder, an organic solvent, and a dispersant, on the ceramic green sheets.

[0080] The printing method is not particularly limited, and various printing methods such as screen printing and gravure printing can be used.

[0081] The thickness of the internal electrode pattern is not particularly limited, but is about 0.1 μm or more and 1.0 μm or less.

[0082] The ceramic green sheet may be handled in a state where it is laminated on a resin film serving as a support (raw material sheet) and wound up in a roll.

[0083] In this case, the film is unwound by the unwinding mechanism, cut into a predetermined shape in the peeling area or in the vicinity of the peeling area, peeled off from the surface of the resin film by the pressure bonding head, and laminated on the lamination table.

[0084] [Electronic component manufacturing method] The method for producing an electronic component of the present invention is characterized in that ceramic green sheets are laminated using the electronic component production apparatus of the present invention.

[0085] By using the electronic component manufacturing apparatus of the present invention, the time required for laminating ceramic green sheets can be shortened. Therefore, the method for manufacturing an electronic component of the present invention can reduce the time required to manufacture the electronic component.

[0086] This specification describes the following:

[0087] The present disclosure (1) provides a pressing head having a pressing surface for conveying a ceramic green sheet; and a plurality of stacking tables for stacking the conveyed ceramic green sheets, A lamination area for laminating ceramic green sheets on the lamination table, The electronic component manufacturing apparatus is characterized in that a plurality of the stacking tables are arranged in close proximity within the stacking area.

[0088] The present disclosure (2) is the electronic component manufacturing apparatus according to the present disclosure (1), in which a plurality of the stacking tables are arranged in contact with each other within the stacking area.

[0089] The present disclosure (3) is the electronic component manufacturing apparatus according to the present disclosure (1) or (2), wherein the plurality of stacking tables are arranged on a circular transport path that includes the stacking area.

[0090] The present disclosure (4) is an electronic component manufacturing apparatus in any combination with any of the present disclosures (1) to (3), in which, within the stacking area, the stacking table and the crimping head are transported in the same direction in a plane approximately parallel to the crimping surface.

[0091] The present disclosure (5) is a method for producing an electronic component, comprising stacking ceramic green sheets using the electronic component production apparatus according to any one of the present disclosures (1) to (4). [Explanation of symbols]

[0092] 10 Resin film 20 Ceramic green sheet 30 Raw Material Sheet 100 Electronic component manufacturing equipment 110a, 110b, 110c, 110d, 110e, 110f stacking table 120 Transport rail 130, 135 Crimping head 130a, 135a Crimping surface of crimping head 135b Lower end of crimping head 140 Peeling Stage 140a Tip 150, 151 Cutting means 160, 161 Mover 170 Linear Motor 180 Support material E. Removal area L Stacking Area

Claims

1. a bonding head having a bonding surface for conveying a ceramic green sheet; and a plurality of stacking tables for stacking the conveyed ceramic green sheets, A lamination area for laminating ceramic green sheets on the lamination table, An electronic component manufacturing apparatus, characterized in that a plurality of the stacking tables are arranged in close proximity within the stacking area.

2. The electronic component manufacturing apparatus according to claim 1 , wherein a plurality of the stacking tables are arranged adjacent to each other in the stacking area.

3. 3. The electronic component manufacturing apparatus according to claim 1, wherein the stacking tables are arranged on a circular transport path including the stacking area.

4. The electronic component manufacturing apparatus according to claim 3 , wherein within the stacking area, the stacking table and the pressure bonding head are transported in the same direction on a plane substantially parallel to the pressure bonding surface.

5. 2. A method for manufacturing an electronic component, comprising stacking ceramic green sheets using the electronic component manufacturing apparatus according to claim 1.

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