Lamination film, manufacturing method of the lamination film, and manufacturing method of semiconductor device

Abstract

To provide a lamination film, a manufacturing method of the lamination film, and a manufacturing method of a semiconductor device, capable of suppressing the generation of a peeling failure of a functional film.SOLUTION: A lamination film 1 comprises: a long-length protection film 2; an adhesive layer 3 provided to one surface 2a of the protection film 2; a sticking layer 6 that is overlapped with the adhesive layer 3; and a sticking film 4 that is constructed by a base material film 7 overlapped with the sticking layer 6. The sticking film 4 includes an extension region P contacted to the one surface 2a of the protection film 2 so as to be extended to the side outer than an edge of the adhesive layer 3. In the extension region P, a tape piece 8 overlapped with the base material film 7 is provided to a region corresponded to an extension direction of at least the protection film 2.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a laminated film, a method for manufacturing a laminated film, and a method for manufacturing a semiconductor device. [Background technology]

[0002] The manufacturing process of a semiconductor device includes a dicing process for separating a semiconductor wafer into individual chips, and a die bonding process for bonding the separated chips to a lead frame, a package substrate, or the like. For example, in a semiconductor device such as a NAND-type flash memory package, semiconductor chips may be laminated and bonded to each other in the die bonding process. In such a manufacturing process of semiconductor chips, the introduction of a laminate film that can be used both to fix the semiconductor wafer in the dicing process and to bond the semiconductor chip in the die bonding process is being promoted. Some laminate films are functional films, such as die attach films and dicing films, that have been precut in consideration of the process of attaching them to the semiconductor wafer and ring frame during dicing (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-156753 A Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, with the increase in capacity of semiconductor memories or their development into mobile applications, there has been a demand for thinner semiconductor chips, and there has also been a growing demand for thinner laminated films used in the manufacture of semiconductor chips. When making the laminated film thinner, the cost of the laminated film can be reduced by making the base film constituting the functional film thinner, and the pick-up properties of the semiconductor chips separated by dicing can be improved. However, if the base film becomes thinner, there is a risk that the functional film will not peel properly from the protective film in the above-mentioned attachment process.

[0005] The present disclosure has been made to solve the above-mentioned problems, and aims to provide a laminated film that can suppress the occurrence of peeling problems of a functional film, a method for manufacturing a laminated film, and a method for manufacturing a semiconductor device. [Means for solving the problem]

[0006] A laminated film according to one aspect of the present disclosure comprises a long protective film, an adhesive layer provided on one side of the protective film, and an adhesive film constituted by a pressure-sensitive adhesive layer overlying the adhesive layer and a base film overlying the adhesive layer, wherein the adhesive film has a protruding region that protrudes outward beyond the edge of the adhesive layer and contacts one side of the protective film, and in the protruding region, at least in an area corresponding to the extension direction of the protective film, a piece of tape is provided that overlaps the base film.

[0007] In this laminated film, a tape piece is provided in the protruding region of the adhesive film so as to overlap the base film in the extending direction of the protective film. By providing the tape piece, even if the base film is thin, the thickness of the base film can be compensated for by the tape piece. Since the rigidity of the base film is increased in the portion where the tape piece is provided, when the protective film is folded back over the adhesive layer and the adhesive film using a peeling plate, the adhesive layer and the adhesive film are likely to warp from the protective film starting from the tape piece. Therefore, the occurrence of peeling failure of the adhesive layer and the adhesive film, which are functional films, can be suppressed.

[0008] The tape piece may have a wide shape with the extension direction as a minor axis and the width direction perpendicular to the extension direction as a major axis in a plan view of the base film. With this configuration, when the protective film is folded back onto the adhesive layer and the pressure-sensitive adhesive film using the peeling plate, the tape piece serving as the starting point for folding back is wider in the width direction, so that the adhesive layer and the pressure-sensitive adhesive film are more likely to warp from the protective film. Therefore, the occurrence of peeling failure of the adhesive layer and the pressure-sensitive adhesive film, which are functional films, can be effectively suppressed.

[0009] The edge of the tape piece that is on the outside in the extending direction as viewed from the center of the base film may coincide with the edge of the base film. In this case, the rigidity of the portion including the edge of the base film is compensated for by the tape piece, so that the warping of the adhesive layer and the pressure-sensitive adhesive film from the protective film can be more reliably generated.

[0010] The edge of the tape piece that is on the outer side in the extending direction as viewed from the center of the base film may be located on the inner side of the edge of the base film, in which case it is possible to prevent the tape piece from remaining on the ring frame when the adhesive layer and the adhesive film are peeled off from the ring frame after dicing and picking up the individual chips.

[0011] In the tape piece, the edge that is on the outside in the extending direction as viewed from the center of the base film may be located outside the edge of the base film. In this case, warping of the adhesive layer and the pressure-sensitive adhesive film from the protective film can be more reliably caused.

[0012] A method for manufacturing a laminated film according to one aspect of the present disclosure includes a lamination step of laminating an adhesive film having an adhesive layer and a base film overlapping the adhesive layer onto a long protective film having an adhesive layer on one side thereof; a cutting step of pre-cutting the adhesive film in a predetermined pattern to form an overhanging region in the adhesive film that extends outward beyond the edge of the adhesive layer and contacts one side of the protective film; and a fixing step of fixing a piece of tape that overlaps the base film in the overhanging region, at least in an area that corresponds to the extension direction of the protective film.

[0013] In this method for manufacturing a laminated film, a piece of tape is provided in the protruding region of the adhesive film so as to overlap the base film in the extending direction of the protective film. By providing the piece of tape, even if the base film is thin, the thickness of the base film can be compensated for by the piece of tape. Since the rigidity of the base film is increased in the portion where the piece of tape is provided, when the protective film is folded back over the adhesive layer and the adhesive film using a peeling plate, the adhesive layer and the adhesive film are likely to warp from the protective film starting from the piece of tape. Therefore, the occurrence of peeling failure of the adhesive layer and the adhesive film, which are functional films, can be suppressed.

[0014] A method for manufacturing a semiconductor device according to one aspect of the present disclosure includes a transporting step of transporting the laminated film toward a semiconductor wafer and a ring frame, a peeling step of folding the protective film back over the adhesive layer and the adhesive film using a peeling plate to peel the adhesive layer and the adhesive film from the protective film, and an attachment step of attaching the adhesive layer and the adhesive film to the semiconductor wafer and the ring frame.

[0015] In this method for manufacturing a semiconductor device, a tape piece is provided on the base film in a projecting region of the adhesive film of the laminated film used for attaching to the semiconductor wafer and the ring frame, so as to correspond to the extending direction of the protective film. By providing the tape piece, even if the base film is thin, the thickness of the base film can be compensated for by the tape piece. Since the rigidity of the base film is increased in the portion where the tape piece is provided, when the protective film is folded back over the adhesive layer and the adhesive film using a peeling plate, the adhesive layer and the adhesive film are likely to warp from the protective film, starting from the tape piece. Therefore, the occurrence of peeling failure of the adhesive layer and the adhesive film, which are functional films, can be suppressed.

[0016] In the peeling step, air may be supplied to the folded back position of the protective film relative to the adhesive layer and the pressure-sensitive adhesive film to assist peeling. Supplying air makes it easier for the adhesive layer and the pressure-sensitive adhesive film to warp from the protective film, and can more reliably suppress the occurrence of peeling defects of the adhesive layer and the pressure-sensitive adhesive film, which are functional films.

[0017] A method for manufacturing a laminated film according to one aspect of the present disclosure includes preparing a laminated film comprising a long protective film, an adhesive layer provided on one side of the protective film, and an adhesive film composed of a pressure-sensitive adhesive layer overlying the adhesive layer and a base film overlying the adhesive layer, the laminated film having an overhanging region where the adhesive film overhangs beyond the edge of the adhesive layer and contacts one side of the protective film, and providing a piece of tape in the overhanging region that overlaps the base film in at least an area corresponding to the extension direction of the protective film.

[0018] In this method for manufacturing a laminated film, a piece of tape is provided in the protruding region of the adhesive film so as to overlap the base film in the extending direction of the protective film. By providing the piece of tape, even if the base film is thin, the thickness of the base film can be compensated for by the piece of tape. Since the rigidity of the base film is increased in the portion where the piece of tape is provided, when the protective film is folded back over the adhesive layer and the adhesive film using a peeling plate, the adhesive layer and the adhesive film are likely to warp from the protective film starting from the piece of tape. Therefore, the occurrence of peeling failure of the adhesive layer and the adhesive film, which are functional films, can be suppressed.

[0019] A method for manufacturing a semiconductor device according to one aspect of the present disclosure includes preparing a laminated film having a long protective film, an adhesive layer provided on one side of the protective film, and an adhesive film composed of an adhesive layer overlapping the adhesive layer and a base film overlapping the adhesive layer, the laminated film having an overhanging region where the adhesive film extends outward beyond the edge of the adhesive layer and contacts one side of the protective film, providing a piece of tape overlapping the base film in at least an area of ​​the overhanging region corresponding to the extending direction of the protective film, transporting the laminated film with the piece of tape toward a semiconductor wafer and a ring frame, folding the protective film back over the adhesive layer and adhesive film using a peeling plate, thereby peeling the adhesive layer and adhesive film from the protective film, and attaching the adhesive layer and adhesive film peeled from the protective film to the semiconductor wafer and ring frame.

[0020] In this method for manufacturing a semiconductor device, a tape piece is provided on the base film in a projecting region of the adhesive film of the laminated film used for attaching to the semiconductor wafer and the ring frame, so as to correspond to the extending direction of the protective film. By providing the tape piece, even if the base film is thin, the thickness of the base film can be compensated for by the tape piece. Since the rigidity of the base film is increased in the portion where the tape piece is provided, when the protective film is folded back over the adhesive layer and the adhesive film using a peeling plate, the adhesive layer and the adhesive film are likely to warp from the protective film, starting from the tape piece. Therefore, the occurrence of peeling failure of the adhesive layer and the adhesive film, which are functional films, can be suppressed.

[0021] Air may be supplied to assist peeling at the folded-back position of the protective film relative to the adhesive layer and the pressure-sensitive adhesive film. Supplying air makes it easier for the adhesive layer and the pressure-sensitive adhesive film to warp from the protective film, and more reliably prevents peeling failure of the functional films, the adhesive layer and the pressure-sensitive adhesive film. Effect of the Invention

[0022] According to the present disclosure, the occurrence of peeling failure of a functional film can be suppressed. [Brief description of the drawings]

[0023] [Figure 1] FIG. 1 is a plan view of a laminated film according to an embodiment of the present disclosure. [Diagram 2] 2 is a cross-sectional view taken along line II-II in FIG. [Diagram 3] 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] 2(a) to 2(c) are enlarged plan views of a main portion of the laminated film shown in FIG. [Diagram 5] FIG. 2 is a diagram showing a process for producing a laminated film according to an embodiment of the present disclosure, where (a) is a cross-sectional view showing a lamination process, and (b) is a cross-sectional view showing a cutting process. [Figure 6] 1 is a schematic diagram showing a configuration of a bonding device applied in a manufacturing method of a semiconductor device according to an embodiment of the present disclosure. [Figure 7] FIG. 11 is a diagram showing the results of a first evaluation test regarding the shape of a tape piece. [Figure 8] FIG. 11 is a diagram showing the results of a second evaluation test regarding the shape of the tape piece. [Figure 9] FIG. 13 is a diagram showing the results of an evaluation test regarding the thickness of a tape piece. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] Hereinafter, preferred embodiments of a laminate film, a method for manufacturing a laminate film, and a method for manufacturing a semiconductor device according to one aspect of the present disclosure will be described in detail with reference to the drawings.

[0025] Fig. 1 is a plan view of a laminated film according to an embodiment of the present disclosure. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1. As shown in Figs. 1 and 2, the laminated film 1 is a long film used for fixing a semiconductor wafer in a dicing process and bonding a semiconductor chip to a lead frame in a die bonding process in a manufacturing process of a semiconductor device such as a NAND flash memory. The laminated film 1 is generally stored in a rolled state, and when used, the required amount is unwound from the roll.

[0026] As shown in Fig. 1 and Fig. 2, the laminated film 1 is composed of a long protective film 2, an adhesive layer 3, and a pressure-sensitive adhesive film 4. The adhesive layer 3 and the adhesive film 4 correspond to the functional films of the laminated film 1. The adhesive layer 3 and the adhesive film 4 are arranged at regular intervals on one surface 2a of the protective film 2 along the extending direction D of the protective film 2. The adhesive layer 3 has a circular shape in a planar view according to the planar shape of the semiconductor wafer W (see Fig. 6) to which it is to be attached. The adhesive layer 3 has a thickness of, for example, 3 µm to 100 µm.

[0027] The adhesive film 4 has a two-layer structure made up of an adhesive layer 6 and a base film 7. The adhesive film 4 is disposed so that the adhesive layer 6 faces the protective film 2. The adhesive layer 6 has a thickness of, for example, 3 μm to 400 μm. The base film 7 has a thickness of, for example, 30 μm to 150 μm.

[0028] The adhesive film 4 has a label portion 11 that covers the adhesive layer 3, and protective portions 12, 12 that are spaced apart from the label portion 11 and arranged at both ends in the width direction B of one surface 2a of the protective film 2. In a plan view, the label portion 11 has a circular shape with a diameter slightly larger than that of the adhesive layer 3. The label portion 11 is a functional portion that is attached to the semiconductor wafer W and the ring frame R (see FIG. 6). The label portion 11 is laminated on the adhesive layer 3 so as to be concentric with the adhesive layer 3.

[0029] The edge of the label portion 11 forms a protruding region P that protrudes outward beyond the adhesive layer 3. In the protruding region P, the adhesive layer 6 of the adhesive film 4 is in contact with one surface 2a of the protective film 2 without the adhesive layer 3 in between. The outer edge of the protruding region P is the portion that is attached to a ring frame R (see FIG. 6) described below. In the protruding region P, markings may be printed on the base film 7, for example, for product identification or for determining tension during lamination. The markings may be formed by, for example, a screen printing method, a stamp method, an inkjet method, or the like.

[0030] In the protruding region P, at least in a region corresponding to the extending direction D of the protective film 2, a tape piece 8 overlapping the base film 7 is provided as shown in Figures 1 and 3. The tape piece 8 is configured to include, for example, a base layer and an adhesive layer. The thickness of the tape piece 8 is appropriately set according to the thickness of the base film 7, and is, for example, 10 µm to 50 µm.

[0031] The region corresponding to the extending direction D of the protective film 2 is a region of the base film 7 including the tip E in the extending direction D. The tip E is a position where the center line L of the base film 7 in the width direction intersects with the edge 7a of the base film 7 in a plan view of the base film 7, and exists on one side and the other side of the extending direction D of the base film 7. In the example of FIG. 1 and FIG. 3, in each of the multiple label parts 11, the tape piece 8 is provided only at the tip E on one side of the extending direction D of the base film 7, but the tape piece 8 may be provided at both the tip E on one side of the extending direction D of the base film 7 and the tip E on the other side of the extending direction D of the base film 7. The tape piece 8 is attached to the surface of the base film 7 opposite the adhesive layer 6 so as to include the tip E and to be symmetrical in the width direction with respect to the center line L in the width direction of the base film 7.

[0032] In this embodiment, the tape piece 8 has a wide shape in plan view of the base film 7 with the extension direction D as its minor axis and the width direction B perpendicular to the extension direction D as its major axis. As more specific planar shapes of the tape piece 8, three modes shown in Figs. 4(a) to 4(c) are exemplified here.

[0033] The tape piece 8A shown in FIG. 4(a) is substantially rectangular having a pair of short sides 8Aa, 8Ab along the extending direction D and a pair of long sides 8Ac, 8Ad along the width direction. Of the pair of short sides 8Aa, 8Ab and the pair of long sides 8Ac, 8Ad, the long side 8Ac on the outer side as viewed from the center of the base film 7 is straight. On the other hand, of the pair of long sides 8Ac, 8Ad, the long side 8Ad on the outer side as viewed from the center of the base film 7 is in the shape of a circular arc that is gently curved convexly with the same curvature as the circular base film 7 in a plan view. In the tape piece 8A, the long side 8Ad, i.e., the edge on the outer side in the extending direction D as viewed from the center of the base film 7, is in a state of being aligned with the edge 7a of the base film 7.

[0034] The tape piece 8B shown in FIG. 4(b) has a rectangular shape having a pair of short sides 8Ba, 8Bb along the extending direction D and a pair of long sides 8Bc, 8Bd along the width direction. In the tape piece 8B, the long side 8Bd, i.e., the edge that is on the outer side in the extending direction D when viewed from the center of the base film 7, is located inside the edge 7a of the base film 7. In the example of FIG. 4(b), two corners of the tape piece 8B on the long side 8Bd side coincide with the edge 7a of the base film 7. The tape piece 8B may be located more inside than the edge 7a of the base film 7, and the two corners of the tape piece 8B on the long side 8Bd side may be separated from the edge 7a of the base film 7.

[0035] 4(c) is rectangular in shape having a pair of short sides 8Ca, 8Cb along the extension direction D and a pair of long sides 8Cc, 8Cd along the width direction, similar to the tape piece 8B. In the tape piece 8C, the long side 8Cd, i.e., the edge that is on the outer side in the extension direction D when viewed from the center of the base film 7, is positioned outside the edge 7a of the base film 7. There is no particular restriction on the overhanging length of the tape piece 8C from the edge 7a of the base film 7, but it is preferable that the overhanging length be such that the adhesive layer of the tape piece 8C in the overhanging portion does not adhere to the protective film 2.

[0036] Next, a method for manufacturing the laminated film 1 will be described. The method for manufacturing the laminated film 1 includes a laminating step, a cutting step, and a fixing step. In the laminating step, as shown in Fig. 5(a), an adhesive film 4 having an adhesive layer 6 and a base film 7 overlapping the adhesive layer 6 is laminated on a long protective film 2 having an adhesive layer 3 on one surface 2a side.

[0037] 5(b), in the cutting process, the adhesive film 4 is precut in a predetermined pattern using a blade or the like, and an overhanging region P is formed in the adhesive film 4, which overhangs outward beyond the edge of the adhesive layer 3 and contacts one surface 2a of the protective film 2. Here, a predetermined portion around the label portion 11 is removed from the protective film 2, and protective portions 12, 12 surrounding the label portion 11 are combined to form one surface 2a of the protective film 2.

[0038] In the fixing step, a piece of tape 8 overlapping the base film 7 is attached to at least an area of ​​the protruding region P that corresponds to the extending direction D of the protective film 2. In this embodiment, the tape piece 8 is attached only to an end E on one side of the base film 7 in the extending direction D of each of the multiple label portions 11. Also, in this embodiment, the fixing step is incorporated into the manufacturing process of the semiconductor device, which will be described later, and the tape piece 8 is attached to the base film 7 at a position before the position where the protective film is folded back over the adhesive layer and the adhesive film using a peeling plate 25 (see FIG. 7 ).

[0039] Next, a method for manufacturing a semiconductor device using the above-mentioned laminated film 1 will be described.

[0040] The method for manufacturing a semiconductor device according to this embodiment includes a transport step, a peeling step, and a bonding step. In the transport step, the laminated film 1 is transported toward the semiconductor wafer W and the ring frame R. In the peeling step, the protective film 2 is folded back toward the adhesive layer 3 and the pressure-sensitive adhesive film 4 using a peeling plate 25, and the adhesive layer 3 and the pressure-sensitive adhesive film 4 are peeled off from the protective film 2. In the bonding step, the adhesive layer 3 and the pressure-sensitive adhesive film 4 are bonded to the semiconductor wafer W and the ring frame R.

[0041] Each of the above steps is performed, for example, by using a bonding device 21 shown in Fig. 6. In the example of Fig. 7, the bonding device 21 includes a stage 22, a plurality of transport rollers 23, a detection unit 24, a peeling plate 25, an air supply unit 26, and a pressure roller 27. The bonding device 21 also has a tape piece bonding unit 30 that performs the fixing step in the manufacturing method of the laminated film 1.

[0042] The semiconductor wafer W and ring frame R to be attached are placed on the stage 22. The transport rollers 23 transport the laminated film 1 at a constant speed between a pay-out roller that pays out the laminated film 1 and a take-up roller that winds up the protective film 2 after the label portion 11 has been used. A predetermined tension is applied to the laminated film 1 during transport by the multiple transport rollers 23.

[0043] The detection unit 24 has, for example, a light-emitting unit that outputs detection light, and a light-receiving unit that receives the detection light that has been transmitted through or reflected by the laminate film 1. The detection unit 24 detects the leading edge of the label portion 11 of the conveyed laminate film 1, i.e., the leading edge E on one side (the leading edge in the conveying direction) in the extending direction D of the base film 7, based on the difference between the received light intensity of the detection light when transmitted through or reflected by the protective film 2 and the received light intensity of the detection light when transmitted through or reflected by the label portion 11. Information indicating the result of detecting the leading edge of the label portion 11 is used to control the operation of the air supply unit 26, the operation of the pressure roller 27, the operation of the tape piece application unit 30, and the like.

[0044] The tape piece application unit 30 applies the tape piece 8 to the laminated film 1. The tape piece application unit 30 has, for example, an arm that can move forward and backward relative to the transported laminated film 1, and a supply unit that supplies the tape piece 8 to the tip of the arm. When the tape piece application unit 30 receives information that the tip of the label portion 11 has been detected from the detection unit 24, it calculates the timing at which the tip of the label portion 11 will arrive at the position of the tape piece application unit 30 based on the timing of the tip detection, the transport speed of the laminated film 1, the distance from the tip detection position (the position of the detection unit 24) to the application position of the tape piece 8 (the position of the tape piece application unit 30), and the like. The tape piece application unit 30 advances the arm toward the laminated film 1 at the timing when the tip of the label portion 11 arrives at the position of the tape piece application unit 30, and applies and fixes the tape piece 8 so that it overlaps the base film 7.

[0045] The peeling plate 25 peels off the adhesive layer 3 and the pressure-sensitive adhesive film 4 from the protective film 2. The peeling plate 25 is disposed near the stage 22 in the transport path of the laminated film 1. Of the laminated film 1, only the protective film 2 is folded back along the tip shape of the peeling plate 25 and transported to the take-up roller by the transport roller 23. The adhesive layer 3 and the pressure-sensitive adhesive film 4 are not folded back by the peeling plate 25, and proceed toward the pressing roller 27 in a state of being slightly warped relative to the protective film 2 to be peeled off.

[0046] The air supply unit 26 supplies air 28 to assist the peeling. The air 28 is supplied toward a target position from, for example, one or more supply holes provided in an air supply pipe. The target position of the air 28 is set, for example, at a folding back position S of the protective film 2 relative to the adhesive layer 3 and the adhesive film 4. The target position of the air 28 may be set at a position forward of the folding back position S in the traveling direction of the adhesive layer 3 and the adhesive film 4 (toward the pressing roller 27).

[0047] The pressing roller 27 presses the adhesive layer 3 and the adhesive film 4 after the protective film 2 has been peeled off, toward the semiconductor wafer W and the ring frame R. This causes the adhesive film 4 to be attached to the ring frame R. In addition, the adhesive layer 3 is attached to the semiconductor wafer W positioned inside the ring frame R while being supported by the adhesive film 4.

[0048] As described above, in the laminated film 1, the tape pieces 8 are provided in the overhanging regions P of the adhesive film 4 so as to overlap the base film 7 in the extending direction D of the protective film 2. By providing the tape pieces 8, even if the base film 7 is thin, the thickness of the base film 7 can be compensated for by the tape pieces 8. Since the rigidity of the base film 7 is increased in the portions where the tape pieces 8 are provided, when the protective film 2 is folded back over the adhesive layer 3 and the adhesive film 4 using the peeling plate 25, the adhesive layer 3 and the adhesive film 4 are likely to warp from the protective film 2 starting from the tape pieces 8. Therefore, the occurrence of peeling defects of the adhesive layer 3 and the adhesive film 4, which are functional films, can be suppressed.

[0049] In this embodiment, the tape piece 8 has a wide shape in a plan view of the base film 7 with the extension direction D as the minor axis and the width direction B perpendicular to the extension direction D as the major axis. With this configuration, when the protective film 2 is folded back onto the adhesive layer 3 and the pressure-sensitive adhesive film 4 using the peeling plate 25, the tape piece 8 serving as the starting point for folding back spreads in the width direction, so that the adhesive layer 3 and the pressure-sensitive adhesive film 4 are more likely to warp from the protective film 2. Therefore, the occurrence of poor peeling of the adhesive layer 3 and the pressure-sensitive adhesive film 4, which are functional films, can be effectively suppressed.

[0050] In the tape piece 8A, the edge (long side 8Ad) on the outside in the extension direction D when viewed from the center of the base film 7 coincides with the edge 7a of the base film 7 (see FIG. 4(a)). When the tape piece 8A is used, the rigidity of the portion including the edge 7a of the base film 7 is compensated for by the tape piece 8A, so that the warping of the adhesive layer 3 and the adhesive film 4 from the protective film 2 can be more reliably generated.

[0051] In the tape piece 8B, the edge (long side 8Bd) that is on the outer side in the extension direction D when viewed from the center of the base film 7 is located inside the edge 7a of the base film 7 (see FIG. 4(b)). When the tape piece 8B is used, it is possible to prevent the tape piece 8B from remaining on the ring frame R when the adhesive layer 6 and the adhesive film 4 are peeled off from the ring frame R after dicing and picking up the individual chips.

[0052] In the tape piece 8C, the edge (long side 8Cd) that is on the outer side in the extending direction D when viewed from the center of the base film 7 is positioned outside the edge 7a of the base film 7. When the tape piece 8C is used, the warping of the adhesive layer 3 and the adhesive film 4 from the protective film 2 can be more reliably generated.

[0053] In the laminated film manufacturing method according to this embodiment, the above-mentioned functions and effects are achieved in the manufactured laminated film 1. In addition, in the semiconductor device manufacturing method according to this embodiment, the above-mentioned functions and effects are achieved by using the above-mentioned laminated film 1. In this embodiment, in the peeling step, air 28 is supplied to the folding position S of the protective film 2 relative to the adhesive layer 3 and the pressure-sensitive adhesive film 4 to assist peeling. The supply of air 28 makes the adhesive layer 3 and the pressure-sensitive adhesive film 4 more likely to warp from the protective film 2, and peeling defects of the adhesive layer 3 and the pressure-sensitive adhesive film 4, which are functional films, can be more reliably suppressed.

[0054] The manufacturing method of the laminated film of the present disclosure does not necessarily have to include the lamination step and the cutting step described above, and may be an embodiment in which a tape piece 8 is provided on a laminated film prepared in advance. That is, the manufacturing method of the laminated film of the present disclosure may be a method in which a laminated film 1 is prepared that includes a long protective film 2, an adhesive layer 3 provided on one surface 2a of the protective film 2, an adhesive film 4 composed of an adhesive layer 6 overlapping the adhesive layer 3 and a base film 7 overlapping the adhesive layer 6, and has an overhanging region P in which the adhesive film 4 overhangs outward beyond the edge of the adhesive layer 3 and contacts one surface 2a of the protective film 2, and a tape piece 8 that overlaps the base film 7 is provided in at least a region of the overhanging region P that corresponds to the extending direction D of the protective film 2.

[0055] In this case, the manufacturing method for a semiconductor device may be similar to the embodiment shown in Figure 6, in which the laminated film 1 having the tape piece 8 provided thereon is transported toward the semiconductor wafer W and ring frame R, and the protective film 2 is folded back over the adhesive layer 3 and the adhesive film 4 using a peeling plate 25 to peel the adhesive layer 3 and the adhesive film 4 from the protective film 2, and the adhesive layer 3 and the adhesive film 4 peeled off from the protective film 2 are attached to the semiconductor wafer W and the ring frame R.

[0056] [Example] Hereinafter, examples of the present disclosure will be described.

[0057] [Preparation of adhesive film] In a 2000mL flask equipped with a three-one motor, a stirring blade, and a nitrogen inlet tube, 635 parts by mass of ethyl acetate (solvent), 395 parts by mass of 2-ethylhexyl acrylate, 100 parts by mass of 2-hydroxyethyl acrylate, 5 parts by mass of methacrylic acid, and 0.08 parts by mass of azobisisobutyronitrile were placed, and the contents were stirred until sufficiently homogenous. Then, bubbling was performed for 60 minutes at a flow rate of 500mL / min to degas the dissolved oxygen in the system. After degassing, the contents were heated to 78°C over 1 hour, and polymerized for 6 hours after the temperature increase. Next, the reaction solution was transferred to a 2000mL pressure kettle equipped with a three-one motor, a stirring blade, and a nitrogen inlet tube, and heated at 120°C and 0.28MPa for 4.5 hours, and then cooled to room temperature.

[0058] Next, 490 parts by mass of ethyl acetate was added and stirred, 0.10 parts by mass of dioctyltin dilaurate was added as a urethanization catalyst, and then 105.3 parts by mass of 2-methacryloyloxyethyl isocyanate (Karenz MOI (trade name) manufactured by Resonac Co., Ltd.) was added, and the mixture was reacted at 70°C for 6 hours, and then cooled to room temperature. Next, ethyl acetate was further added to adjust the non-volatile content in the acrylic resin solution to 35% by mass, and a solution containing an acrylic resin having a functional group capable of chain polymerization was obtained.

[0059] To 100 parts by mass (solid content) of the obtained solution containing the acrylic resin, 1.0 part by mass of 1-hydroxycyclohexyl phenyl ketone (manufactured by IGM RESINS BV, Omnirad184, "Omnirad" is a registered trademark) as a photopolymerization initiator, 0.2 parts by mass of photopolymerization initiator (B-2) phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide (manufactured by IGM RESINS BV, Omnirad819, "Omnirad" is a registered trademark), and 2.0 parts by mass (solid content) of Coronate L manufactured by Nippon Polyurethane Industry Co., Ltd. were added to prepare a varnish of an ultraviolet-curing adhesive.

[0060] A polyethylene terephthalate film (width 500 mm, length 500 mm) with one surface treated for release was prepared as a base film. A varnish of an ultraviolet-curable adhesive was applied to the release-treated surface of the base film using an applicator, and then dried at 80° C. for 3 minutes. This resulted in an adhesive film consisting of the base film and a 5 μm-thick adhesive layer formed on one surface of the base film.

[0061] Furthermore, a polyolefin film (width 500 mm, length 500 mm, thickness 30 μm) with one surface subjected to corona treatment was prepared as a cover film. The corona-treated surface was attached to the adhesive layer of the above-mentioned adhesive film at room temperature. The adhesive layer was transferred to the cover film by pressing it with a rubber roll. After that, the film was left at room temperature for 3 days to obtain an adhesive film with a cover film.

[0062] [Creating adhesive layer] The following components were mixed to prepare a varnish for forming an adhesive layer. First, cyclohexanone (solvent) was added to the mixture containing the following components, which was then stirred and mixed, and then further kneaded for 90 minutes using a bead mill. Epoxy resin (YDCN-700-10 (product name), manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., cresol novolac type epoxy resin, epoxy equivalent: 210, molecular weight: 1200, softening point: 80°C): 11.0 parts by mass Epoxy resin (EXA-830CRP (product name), manufactured by DIC Corporation, bisphenol F type epoxy resin, epoxy equivalent: 160, molecular weight: 1800, softening point: 85°C): 13.0 parts by mass Phenolic resin (Mirex XLC-LL (product name), manufactured by Mitsui Chemicals, Inc., phenolic resin, hydroxyl equivalent: 175, water absorption rate: 1.8%, heat weight loss rate at 350°C: 4%): 18.7 parts by mass Silane coupling agent (NUC A-189 (product name) manufactured by NUC Corporation, γ-mercaptopropyltrimethoxysilane): 0.1 part by mass Silane coupling agent (NUC A-1160 (product name), manufactured by Nippon Unicar Co., Ltd., γ-ureidopropyltriethoxysilane): 0.2 parts by mass Filler (SC2050-HLG (product name), manufactured by Admatechs Co., Ltd., silica, average particle size 0.500 μm): 39 parts by mass

[0063] The following components were further added to the mixture obtained as described above, and the mixture was subjected to stirring and mixing and vacuum deaeration to obtain a varnish for forming an adhesive layer. Epoxy group-containing acrylic copolymer (HTR-860P-3 (product name), manufactured by Nagase ChemteX Corporation, weight average molecular weight: 800,000): 16 parts by mass Curing accelerator (Curesol 2PZ-CN (trade name), manufactured by Shikoku Chemical Industry Co., Ltd., 1-cyanoethyl-2-phenylimidazole, "Curesol" is a registered trademark) 0.1 parts by mass

[0064] In addition, a polyethylene terephthalate film (thickness 38 μm) with one surface treated for release was prepared as a protective film. A varnish for forming an adhesive layer was applied to the release-treated surface of the protective film using an applicator, and then heated and dried at 140° C. for 5 minutes. As a result, a die bonding film consisting of the protective film and a 25 μm-thick adhesive layer (B-stage state) formed on one surface of the protective film was obtained.

[0065] [Making tape pieces] The adhesive film with the protective film was cut to a predetermined size. After peeling off the protective film, the tape pieces were attached to the outer edges of the adhesive film in the extension direction as viewed from the center of the film, so that the tape pieces were aligned to the outer edges in the extension direction as viewed from the center of the film, thereby preparing samples for the first evaluation test and the second evaluation test.

[0066] [Making laminated film] The adhesive film from which the cover film had been peeled off was laminated onto the adhesive layer on the protective film, and the adhesive layer, adhesive layer, and base film were precut into a predetermined pattern and the excess portions were peeled off. Then, in the protruding region of the adhesive film, a piece of tape was attached to the region corresponding to the extending direction of the protective film so as to overlap the base film, thereby obtaining a laminated film.

[0067] [Conditions for peeling and pasting processes] The peeling and bonding processes were carried out using a bonding device conforming to the configuration shown in Figure 6. Air was supplied to assist in peeling the protective film. Air was supplied to the folded position of the protective film relative to the adhesive layer and the adhesive film from supply holes with a diameter of about 1 mm arranged at intervals of about 40 mm. The distance between the supply holes and the folded position was about 200 mm. A fully automatic wafer mounter (Disco Corporation DFM-2800) was used for the bonding process. The bonding temperature was set to 70°C, and the bonding speed was set to 10 mm / s, and the adhesive layer was bonded to the 12-inch wafer.

[0068] [Evaluation test for tape piece shape] Regarding the shape of the tape piece, a first evaluation test and a second evaluation test were conducted. In these evaluation tests, the total number of samples for each condition was 5 sheets, and a sample without a tape piece was used as a comparative example. In each sample, the thickness of the base film was 38 μm, and the thickness of the tape piece was 35 μm. In the first evaluation test, the shape of the tape piece of each sample was rectangular, the vertical dimension was constant at 10 mm, and the number of successful peeling of the adhesive layer and the adhesive film from the protective film was counted when the horizontal dimension was changed. In the second evaluation test, the shape of the tape piece of each sample was rectangular, the horizontal dimension was constant at 30 mm, and the number of successful peeling of the adhesive layer and the adhesive film from the protective film was counted when the vertical dimension was changed.

[0069] FIG. 7 is a diagram showing the results of the first evaluation test. As shown in FIG. 7, when the vertical dimension was constant at 10 μm, the number of successful peeling in the comparative example was 0 out of 5, whereas the number of successful peeling in the horizontal dimensions of 30 mm, 40 mm, and 50 mm was 5 out of 5. Also, FIG. 8 is a diagram showing the results of the second evaluation test. As shown in FIG. 8, when the horizontal dimension was constant at 30 μm, the number of successful peeling in the comparative example was 0 out of 5, whereas the number of successful peeling in the vertical dimensions of 7.5 mm, 10.0 mm, 12.5 mm, and 15.0 mm was 5 out of 5. From these results, it was confirmed that the configuration in which the tape piece is provided has an effect of suppressing poor peeling of the adhesive layer and the adhesive film from the protective film.

[0070] [Tape thickness evaluation test] In this evaluation test, the total number of samples was five, and a sample without tape pieces was used as a comparative example. The length and width of the tape pieces in each sample were 10 mm and 30 mm, respectively. The peeling evaluation was rated on a three-level scale, A to C, with "A" being 5 out of 5 samples with successful peeling, "B" being 1 to 4 out of 5 samples with successful peeling, and "C" being 0 samples with successful peeling.

[0071] FIG. 9 shows the evaluation test results. Samples No. 1 to No. 4 are the results for comparative examples in which no tape pieces are provided. In the results for the comparative examples, Samples No. 1 to No. 3, which have base film thicknesses greater than 40 μm, were evaluated as "A," while Sample No. 4, which has a base film thickness less than 40 μm, was evaluated as "C." This confirmed that a thinner base film causes poor peeling of the adhesive layer and pressure-sensitive adhesive film from the protective film during the attachment process.

[0072] Samples No. 5 to No. 8 are results for examples in which tape pieces were provided. In Samples No. 5 to No. 8, tape pieces were provided on a 38 μm thick base film, making the total thickness greater than 40 μm in all cases. These samples were evaluated as "A" or "B," and it was confirmed that even when the base film is thin, supplementing the thickness of the base film with tape pieces can have an effect of suppressing poor peeling of the adhesive layer and pressure-sensitive adhesive film from the protective film.

[0073] The gist of the present disclosure is as follows: [1] to

[11] . [1] A laminated film comprising: a long protective film; an adhesive layer provided on one side of the protective film; an adhesive film composed of a pressure-sensitive adhesive layer overlapping the adhesive layer and a base film overlapping the adhesive layer; the adhesive film has a protruding region that protrudes outward beyond the edge of the adhesive layer and contacts one side of the protective film; and in the protruding region, at least in a region corresponding to the extension direction of the protective film, a piece of tape that overlaps the base film is provided. [2] The laminated film described in [1], wherein the tape piece has a wide shape with the extension direction as a minor axis and the width direction perpendicular to the extension direction as a major axis when viewed in a plane of the base film. [3] The laminated film according to [1] or [2], wherein the edge of the tape piece that is on the outside in the extension direction when viewed from the center of the base film coincides with the edge of the base film. [4] The laminated film according to [1] or [2], wherein the edge of the tape piece that is on the outer side in the extension direction when viewed from the center of the base film is located on the inner side than the edge of the base film. [5] The laminated film described in [1] or [2], wherein the edge of the tape piece that is on the outer side in the extension direction when viewed from the center of the base film is located outer than the edge of the base film. [6] A method for manufacturing a laminated film, comprising: a lamination step of laminating an adhesive film having an adhesive layer and a base film overlapping the adhesive layer onto a long protective film having an adhesive layer on one side; a cutting step of pre-cutting the adhesive film in a predetermined pattern to form an overhanging region in the adhesive film that overhangs beyond the edge of the adhesive layer and contacts one side of the protective film; and a fixing step of fixing a piece of tape that overlaps the base film in at least an area of ​​the overhanging region that corresponds to the extension direction of the protective film. [7] A method for manufacturing a semiconductor device, comprising: a transporting step of transporting a laminated film described in any one of [1] to [5] toward a semiconductor wafer and a ring frame; a peeling step of folding back the protective film over the adhesive layer and the pressure-sensitive adhesive film using a peeling plate, thereby peeling off the adhesive layer and the pressure-sensitive adhesive film from the protective film; and an attachment step of attaching the adhesive layer and the pressure-sensitive adhesive film to the semiconductor wafer and the ring frame. [8] The method for manufacturing a semiconductor device according to [7], wherein in the peeling step, air is supplied to the folded-back position of the protective film relative to the adhesive layer and the pressure-sensitive adhesive film to assist peeling. [9] A method for manufacturing a laminated film comprising: a long protective film; an adhesive layer provided on one side of the protective film; an adhesive film composed of a pressure-sensitive adhesive layer overlying the adhesive layer; and a base film overlying the adhesive layer; the laminated film having a protruding region in which the adhesive film protrudes outward beyond the edge of the adhesive layer and contacts one side of the protective film; and a piece of tape overlapping the base film is provided in the protruding region, at least in an area corresponding to the extension direction of the protective film.

[10] A method for manufacturing a semiconductor device, comprising: preparing a laminated film having a long protective film, an adhesive layer provided on one side of the protective film, and an adhesive film composed of an adhesive layer overlapping the adhesive layer and a base film overlapping the adhesive layer, the laminated film having an overhanging region where the adhesive film overhangs outward from the edge of the adhesive layer and contacts one side of the protective film, providing a piece of tape overlaying the base film in at least an area of ​​the overhanging region corresponding to an extension direction of the protective film, transporting the laminated film with the piece of tape provided toward a semiconductor wafer and a ring frame, folding back the protective film over the adhesive layer and adhesive film using a peeling plate, thereby peeling the adhesive layer and the adhesive film from the protective film, and attaching the adhesive layer and the adhesive film peeled off from the protective film to the semiconductor wafer and the ring frame.

[11] The method for manufacturing a semiconductor device according to

[10] , further comprising the step of supplying air to assist peeling at a folded position of the protective film relative to the adhesive layer and the pressure-sensitive adhesive film. [Explanation of symbols]

[0074] 1...laminated film, 2...protective film, 2a...one side, 3...adhesive layer, 4...adhesive film, 6...adhesive layer, 7...base film, 7a...edge, 8 (8A to 8C)...tape piece, 8Ad, 8Bd, 8Cd...long side (outer edge in extension direction), 25...peeling plate, 28...air, P...projection area, D...extension direction, S...fold-back position, R...ring frame, W...semiconductor wafer.

Claims

1. A long protective film, An adhesive layer provided on one surface of the protective film; An adhesive film including an adhesive layer overlapping the adhesive layer and a base film overlapping the adhesive layer; The adhesive film has a protruding region that protrudes outward beyond an edge of the adhesive layer and contacts one surface of the protective film, A laminated film, wherein a piece of tape overlapping the base film is provided in at least a region of the protruding region that corresponds to the extending direction of the protective film.

2. The laminated film according to claim 1 , wherein the tape piece has a wide shape with a minor axis in the extending direction and a major axis in a width direction perpendicular to the extending direction when the base film is viewed in a plan view.

3. 2. The laminated film according to claim 1, wherein an edge of the tape piece that is on the outer side in the extending direction as viewed from the center of the base film coincides with an edge of the base film.

4. 2. The laminated film according to claim 1, wherein the edge of the tape piece that is on the outer side in the extending direction when viewed from the center of the base film is located on the inner side of the edge of the base film.

5. 2. The laminated film according to claim 1, wherein an edge of the tape piece that is on the outer side in the extending direction as viewed from the center of the base film is positioned on the outer side of an edge of the base film.

6. A lamination step of laminating an adhesive film having an adhesive layer and a base film overlapping the adhesive layer onto a long protective film having an adhesive layer on one side; A cutting process in which the adhesive film is pre-cut in a predetermined pattern to form an overhanging region in the adhesive film that overhangs the edge of the adhesive layer and contacts one surface of the protective film; A method for manufacturing a laminated film, comprising a fixing step of fixing a piece of tape overlapping the base film in at least an area of ​​the protruding region corresponding to the extending direction of the protective film.

7. A conveying step of conveying the laminated film according to any one of claims 1 to 5 toward a semiconductor wafer and a ring frame; a peeling step of folding back the protective film against the adhesive layer and the pressure-sensitive adhesive film using a peeling plate to peel off the adhesive layer and the pressure-sensitive adhesive film from the protective film; and a bonding step of bonding the adhesive layer and the pressure-sensitive adhesive film to the semiconductor wafer and the ring frame.

8. The method for manufacturing a semiconductor device according to claim 7 , wherein in the peeling step, air for assisting peeling is supplied to a folded-back position of the protective film relative to the adhesive layer and the pressure-sensitive adhesive film.

9. A laminated film is provided which includes a long protective film, an adhesive layer provided on one side of the protective film, an adhesive layer overlapping the adhesive layer, and an adhesive film including a base film overlapping the adhesive layer, the adhesive film having an overhanging region that overhangs beyond an edge of the adhesive layer and contacts one side of the protective film; A method for manufacturing a laminated film, comprising providing a piece of tape overlapping the base film in at least a region of the protruding region that corresponds to the extending direction of the protective film.

10. A laminated film is provided which includes a long protective film, an adhesive layer provided on one side of the protective film, an adhesive layer overlapping the adhesive layer, and an adhesive film including a base film overlapping the adhesive layer, the adhesive film having an overhanging region that overhangs beyond an edge of the adhesive layer and contacts one side of the protective film; a tape piece overlapping the base film is provided in at least a region of the protruding region corresponding to an extending direction of the protective film; The laminated film having the tape piece provided thereon is transported toward a semiconductor wafer and a ring frame; The adhesive layer and the adhesive film are peeled off from the protective film by folding the protective film back over the adhesive layer and the adhesive film using a peeling plate; The adhesive layer and the pressure-sensitive adhesive film peeled off from the protective film are attached to the semiconductor wafer and the ring frame.

11. The method for manufacturing a semiconductor device according to claim 10 , further comprising the step of supplying air to assist peeling at a folded-back position of the protective film relative to the adhesive layer and the pressure-sensitive adhesive film.

Images