Heater assembly with process gap control for batch processing chamber

Abstract

To provide a heater assembly and a method for controlling a gap between a substrate support and a gas distribution assembly.SOLUTION: There is provided a heater assembly in which a heater 230 has a support surface and a bottom surface. A heater standoff 234 has a top end 235 in contact with the bottom surface of the heater. A shield shaft 250 has a top end 252, a bottom end 258, an inside surface 257 surrounding an open interior region, and an outside surface 255. The heater standoff is located within the open interior region, and the top end of the heater standoff extends above the top end of the shield shaft. A shield plate 240 includes a top surface, a bottom surface and an outer peripheral edge 281, and further includes an opening 271 extending from the top surface to the bottom surface in an inner portion. The heater standoff is disposed to be spaced a distance from the top surface 270 of the shield plate. The top surface of the shield plate has a groove 278 with an inner face 279 and an outer face 280 extending around a peripheral portion of the shield plate. The outer face of the shield plate is spaced a distance from the outer peripheral edge 281 of the shield plate.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001]

[0001] Embodiments of the present disclosure relate generally to a heater assembly for a batch processing chamber, and more particularly to a heater assembly including an integral thermal isolation shield. [Background technology]

[0002] In some chamber designs for atomic layer deposition (ALD) or chemical vapor deposition (CVD) processing, precursors and gases are simultaneously delivered to the surface of a large substrate support or multiple substrate supports through multiple gas distribution plates. The gas distribution plates are spaced from the substrate surface or vice versa, forming one or more operating gaps. Such chambers can be highly sensitive to the consistency and uniformity of the gaps between different processing stations when the chamber is used. The approximately 1 mm gaps in some multi-station deposition systems make the processes performed at the different stations very sensitive to small gap deviations.

[0003]

[0003] Many processing systems and processing tools operate with very tight space requirements. For example, multi-substrate ALD chambers can process with 0.8-1.5 mm separation between the substrate surface and the gas distribution system. These small spaces minimize chemical consumption by reducing the processing area, minimize ALD cycle times and purge times, and maximize throughput.

[0004]

[0004] Large volume batch processing chambers often suffer from variations in the alignment of the heater assembly relative to the processing stations, resulting in deviations in the processing gap and processing area between the heater assembly and the processing stations. The deviations in the processing gap and processing area affect the process repeatability and heater thermal uniformity. Conventional processing chamber leveling systems and methods use complex and expensive systems for measuring and aligning the heater. These motorized systems can fail due to normal wear and tear of parts, resulting in chamber downtime for repairs and preventative maintenance.

[0005]

[0005] Therefore, there is a need in the art for an apparatus and method for controlling the gap between the substrate support and the gas distribution assembly(ies). Summary of the Invention

[0006]

[0006] One or more embodiments of the present disclosure relate to a heater assembly including a heater, a heater standoff, a shield shaft, and a shield plate. The heater has a support surface and a bottom surface that define a thickness. The heater standoff has a top end in contact with the bottom surface of the heater. The shield shaft has top and bottom ends, an inner surface surrounding an open interior region, and an outer surface. The heater standoff is located within the open interior region, and the top end of the heater standoff extends above the top end of the shield shaft. The shield plate has a top surface, a bottom surface, and a peripheral edge. The shield plate further includes an opening extending from the top surface to the bottom surface within the shield plate. The heater standoff extends through the opening in the shield plate and the bottom surface of the heater and is disposed a distance away from the top surface of the shield plate. The top surface of the shield plate has a groove having an inner surface and an outer surface that extends around the outer periphery of the shield plate. The outer surface of the shield plate is a distance away from the outer peripheral edge of the shield plate.

[0007]

[0007] An additional embodiment of the present disclosure relates to a substrate support having a central base, a heater assembly, and a top plate. A plurality of arms extend therefrom, each arm having an inner end and an outer end in contact with the central base. A heater assembly is connected to the outer end of each arm and includes a heater, a heater standoff, a shield shaft, and a shield plate. The heater has a support surface defining a thickness and a bottom surface. The heater standoff has a top end in contact with the bottom surface of the heater. The shield shaft has top and bottom ends, an inner surface surrounding an open interior region, and an outer surface. The heater standoff is located within the open interior region, the top end of the heater standoff extending above the top end of the shield shaft. The shield plate has a top surface, a bottom surface, and a peripheral edge. The shield plate further includes an opening extending internally from the top surface to the bottom surface. The heater standoff extends through the opening in the shield plate and the bottom surface of the heater and is positioned a distance away from the top surface of the shield plate. The top surface of the shield plate has a groove having an inner surface and an outer surface that extends around the periphery of the shield plate. The outer surface of the shield plate is spaced a distance from the peripheral edge of the shield plate. The top plate has a top surface and a bottom surface that define a thickness of the top plate and has an opening through the thickness to allow a heater to pass through the opening, and the bottom surface of the top plate is in contact with a fluid seal in the groove in the top surface of the shield plate.

[0008]

[0008] In order that the above-mentioned features of the present disclosure may be understood in detail, a more particular description of the present disclosure briefly summarized above can be made by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only typical embodiments of the present disclosure and therefore should not be considered as limiting its scope. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a cross-sectional isometric view of a processing chamber in accordance with one or more embodiments of the present disclosure. [Diagram 2]

[0010] FIG. 1 illustrates a cross-sectional view of a processing chamber in accordance with one or more embodiments of the present disclosure. [Diagram 3]

[0011] FIG. 2 illustrates a bottom perspective view of a support assembly according to one or more embodiments of the present disclosure. [Figure 4]

[0012] FIG. 1 illustrates a top perspective view of a support assembly according to one or more embodiments of the present disclosure. [Diagram 5]

[0013] FIG. 1 illustrates a top perspective view of a support assembly according to one or more embodiments of the present disclosure. [Figure 6A]

[0014] 1 shows a schematic cross-sectional view of a support assembly according to one or more embodiments of the present disclosure. [Figure 6B]

[0015] 1 shows a schematic cross-sectional view of a support assembly according to one or more embodiments of the present disclosure. [Figure 7]

[0016] FIG. 1 illustrates a front perspective view of a heater assembly according to one or more embodiments of the present disclosure. [Figure 8]

[0017] FIG. 1 illustrates a cross-sectional view of a heater assembly according to one or more embodiments of the present disclosure. [Figure 9]

[0018] FIG. 2 illustrates a detailed cross-sectional view of a heater assembly according to one or more embodiments of the present disclosure. [Figure 10]

[0019] FIG. 2 illustrates a detailed cross-sectional view of a heater assembly according to one or more embodiments of the present disclosure. [Figure 11]

[0020] FIG. 1 is a schematic cross-sectional view of a heater assembly according to one or more embodiments of the present disclosure. [Figure 12]

[0021] FIG. 1 shows a schematic cross-sectional view of a heater assembly according to one or more embodiments of the present disclosure. [Figure 13]

[0022] 1 shows a schematic diagram of a processing platform in accordance with one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010]

[0023] Before describing certain example embodiments of the present disclosure, it is to be understood that the present disclosure is not limited to the details of construction or process steps set forth in the following description. The present disclosure is capable of other embodiments and of being practiced or carried out in various ways.

[0011]

[0024] As used in this specification and the appended claims, the term "substrate" refers to a surface or a portion of a surface on which a process acts. It will be understood by those skilled in the art that a reference to a substrate can also refer to only a portion of a substrate, unless the context clearly indicates otherwise. Furthermore, a reference to deposition on a substrate can refer to both a bare substrate and a substrate having one or more films or features deposited or formed thereon.

[0012]

[0025] As used herein, "substrate" refers to any substrate or material surface formed on a substrate on which film processing is performed during a manufacturing process. For example, substrate surfaces on which processing can be performed include materials such as silicon, silicon oxide, strained silicon, silicon on insulator (SOI), carbon doped silicon oxide, amorphous silicon, doped silicon, germanium, gallium arsenide, glass, sapphire, and any other materials such as metals, metal nitrides, metal alloys, and other conductive materials, depending on the application. Substrates include, but are not limited to, semiconductor wafers. Substrates can be exposed to pretreatment processes to polish, etch, reduce, oxidize, hydroxylate, anneal, UV cure, e-beam cure, and / or bake the substrate surface. In addition to film processing directly on the surface of the substrate itself, in this disclosure, any of the disclosed film processing steps can be performed on an underlayer formed on the substrate, as disclosed in more detail below, and the term "substrate surface" is intended to include the underlayer as the context indicates. Thus, for example, when a film / layer or partial film / layer is deposited on a substrate surface, the exposed surface of the newly deposited film / layer becomes the substrate surface.

[0013]

[0026] As used herein and in the appended claims, the terms "precursor," "reactant," "reactive gas," and the like are used interchangeably to refer to any gas species capable of reacting with the substrate surface or with a film formed on the substrate surface.

[0014]

[0027] Some embodiments of the present disclosure advantageously provide a cost-effective solution using O-rings to level the heater for process gap control without complex motorized systems. Some embodiments provide a way to integrate the heater with thermal shields, heater leveling capabilities, and / or process region isolation for a single wafer in a multi-wafer processing chamber.

[0015]

[0028] Some embodiments of the present disclosure provide a heater assembly integrated into a heat shield assembly (also referred to as a heater shield assembly) to form a uniform cavity around the heater standoff. The heater shield assembly includes a shield plate and a shield shaft. The heater shield assembly further includes a fluid seal between the shield plate and the shield shaft and is configured to seal against leakage and maintain vacuum integrity. The heat shield of some embodiments enhances uniformity of temperature loss around the heater.

[0016]

[0029] The present disclosure provides a substrate support for use in a single substrate or multiple substrate (also called batch) processing chamber. Figures 1 and 2 show a processing chamber 100 according to one or more embodiments of the present disclosure. Figure 1 shows the processing chamber 100 shown as a cross-sectional isometric view according to one or more embodiments of the present disclosure. Figure 2 shows a cross-section of the processing chamber 100 according to one or more embodiments of the present disclosure. Figures 3-6 show a support assembly 200 according to one or more embodiments of the present disclosure.

[0017]

[0030] The processing chamber 100 includes a housing 102 having sidewalls 104 and a chamber floor 106. The housing 102 defines a processing region 109, also referred to as an interior region 109, along with a chamber lid 300.

[0018]

[0031] The illustrated processing station 110 includes three main components: a chamber lid 300 (also referred to as a lid), a pump / purge insert 330, and a gas injector 112. The processing chamber 100 further includes a plurality of processing stations 110. The processing stations 110 are disposed within an interior region 109 of the housing 102 and positioned in a circular arrangement about an axis of rotation 211 of the substrate support 200. Each processing station 110 includes a gas distribution plate 112 (also referred to as a gas injector) having a front surface 114. In some embodiments, the front surfaces 114 of each of the gas injectors 112 are substantially coplanar. The processing station 110 is defined as an area in which processing can be performed. For example, in some embodiments, the processing station 110 is defined as an area bounded by a support surface 231 of the substrate support 200 and a front surface 114 of the gas injector 112, as described below. In the illustrated embodiment, the heater 230 serves as a substrate support surface and forms part of the substrate support 200. Each of the heaters 230 includes a support surface 231 and a bottom surface 232 that defines a thickness of the heater 230. In some embodiments, the support surface 231 further includes provision for at least three lift pins extending therethrough.

[0019]

[0032] The processing station 110 can be configured to perform any suitable process and provide any suitable process conditions. The type of gas distribution plate 112 used depends, for example, on the type of process being performed and the type of showerhead or gas injector. For example, a processing station 110 configured to operate as an atomic layer deposition apparatus can have a showerhead or vortex type gas injector. On the other hand, a processing station 110 configured to operate as a plasma station can have one or more electrodes and / or ground plate configurations to generate plasma while flowing plasma gas toward the substrate. The embodiment shown in FIG. 2 has a different type of processing station 110 on the left side of the drawing (processing station 110a) than on the right side of the drawing (processing station 110b). Suitable processing stations 110 include, but are not limited to, thermal processing stations, microwave plasma, three-electrode CCP, ICP, parallel plate CCP, UV exposure, laser processing, pumping chamber, annealing station, and metrology station.

[0020]

[0033] 3-6 illustrate a support assembly 200 according to one or more embodiments of the present disclosure. The support assembly 200 includes a rotatable central base 210. The rotatable central base 210 may have a symmetric or asymmetric shape and defines a rotation axis 211. The rotation axis 211 extends in a first direction, as seen in FIG. 6. The first direction may be referred to as a vertical direction or a direction along the z-axis. However, it should be understood that this use of the term "vertical" is not limited to a direction perpendicular to gravity.

[0021]

[0034] The support assembly 200 includes at least two support arms 220 connected to and extending from a central base 210. The support arms 220 have inner ends 221 and heater mounting bases 222. The inner ends 221 contact the central base 210 such that as the central base 210 rotates about the axis of rotation 211, the support arms 220 similarly rotate. The support arms 220 may be connected to the central base 210 at the inner ends 221 by fasteners (e.g., bolts) or by being integrally formed with the central base 210.

[0022]

[0035] In some embodiments, the support arms 220 extend perpendicular to the axis of rotation 211 such that, on the same support arm 220, one of the inner end 221 or the heater mounting base 222 is further from the axis of rotation 211 than the other of the inner end 221 and the heater mounting base 222. In some embodiments, the inner end 221 of the support arm 220 is closer to the axis of rotation 211 than the heater mounting base 222 of the same support arm 220.

[0023]

[0036] The number of support arms 220 in the support assembly 200 can vary. In some embodiments, there are at least two support arms 220, at least three support arms 220, at least four support arms 220, or at least five support arms 220. In some embodiments, there are three support arms 220. In some embodiments, there are four support arms 220. In some embodiments, there are five support arms 220. In some embodiments, there are six support arms 220.

[0024]

[0037] The support arms 220 may be symmetrically positioned about the central base 210. For example, in a support assembly 200 having four support arms 220, each of the support arms 220 are positioned at 90° intervals about the central base 210. In a support assembly 200 having three support arms 220, the support arms 220 are positioned at 120° intervals about the central base 210. Stated another way, in an embodiment having four support arms 220, the support arms are positioned to provide four-fold symmetry about the axis of rotation 211. In some embodiments, the support assembly 200 has n support arms 220, where the n support arms 220 are positioned to provide n-fold symmetry about the axis of rotation 211.

[0025]

[0038] The heater 230 is positioned on a heater mounting base 222 of the support arm 220. In some embodiments, each support arm 220 has a heater 230. The center of the heater 230 is positioned away from the axis of rotation 211 such that the heater 230 moves in a circular path when the central base 210 rotates.

[0026]

[0039] The heater 230 has a support surface 231 capable of supporting a substrate. In some embodiments, the support surfaces 231 of the heaters 230 are substantially coplanar. As used in this manner, "substantially coplanar" means that the plane formed by each support surface 231 is within ±5°, ±4°, ±3°, ±2°, or ±1° of the plane formed by the other support surfaces 231.

[0027]

[0040] In some embodiments, the heater 230 is positioned directly on the heater mounting base 222 of the support arm 220. In some embodiments, as shown in the drawings, the heater 230 is elevated above the heater mounting base 222 of the support arm 220 by a heater standoff 234. The heater standoff 234 has a substantially cylindrical body and may be of any size and length to increase the height of the heater 230.

[0028]

[0041] In some embodiments, channels 236 are formed in one or more of the central base 210, the support arms 220, and / or the heater standoffs 234. The channels 236 can be used to route electrical connections or to provide gas flow.

[0029]

[0042] The heater may be any suitable type of heater known to those skilled in the art, hi some embodiments, the heater is a resistive heater having one or more heating elements within a heater body.

[0030]

[0043] 4, the shield plate 240 is disk-shaped and is positioned around each heater 230. In the illustrated embodiment, the shield plate 240 is positioned below the heater 230 such that the top surface 241 of the shield plate 240 is below the support surface 231 of the heater.

[0031]

[0044] The heater 230 in some embodiments includes additional components. For example, the heater in some embodiments includes an electrostatic chuck. The electrostatic chuck can include various wires and electrodes to hold the substrate positioned on the support surface 231 in place while the heater moves. This allows the substrate to be chucked to the heater at the beginning of the process and remain in the same position on the same heater as it moves to different process areas. In some embodiments, the wires and electrodes are routed through a channel 236 in the support arm 220. The electrostatic chuck is configured as a chucking surface disposed within the heater 230.

[0032]

[0045] 5, the top plate 245 is a single component that encloses all of the heater 230 with at least one opening 242 that allows access to the support surface 231 of the heater 230. The top plate 245 has a top surface 246 and a bottom surface 249 that define a thickness of the top plate 245. The opening 242 can allow the heater 230 to pass through the top plate 245. In some embodiments, the top plate 245 is fixed such that the top plate 245 moves vertically and rotates with the heater 230.

[0033]

[0046] 6A, in some embodiments, the top plate 245 has a top surface 246 that forms a major plane 248 that is substantially parallel to a major plane 247 formed by the support surface 231 of the heater 230. In some embodiments, the top plate 245 has a top surface 246 that forms a major plane 248 that is a distance D above the major plane 247 of the support surface 231. In some embodiments, the distance D is substantially equal to the thickness of the substrate 390 being processed such that the support surface 231 is coplanar with the top surface 246 of the top plate 245, as shown in FIG. 6B. When used in this manner, the term "substantially coplanar" means that the major plane formed by the surface of the substrate 390 is within ±1 mm, ±0.5 mm, ±0.4 mm, ±0.3 mm, ±0.2 mm, or ±0.1 mm of being coplanar.

[0034]

[0047] FIG. 7 illustrates an isometric view of a portion of a support assembly 200 having a heater assembly 205 in accordance with one or more embodiments of the present disclosure. FIG. 8 illustrates a cross-sectional view of a portion of the support assembly 200 having the heater assembly 205 shown in FIG. 7 along line 8-8'. The shading in the figures is used to help distinguish different components and does not imply a particular material of construction. In some embodiments, the heater assembly 205 includes a heater 230, a heater standoff 234, and a shield consisting of a shield shaft 250 and a shield plate 240.

[0035]

[0048] The shield shaft 240 has an outer surface 255 and an inner surface 257 that surround each of the heater standoffs 234. The shield shaft 250 has a top end 252 and a bottom end 258 that define a length of the shield shaft 250. The shield shaft 250 in some embodiments has a shape that is concentric with the shape of the standoffs 234. In some embodiments, the shield shaft 250 has a substantially cylindrical body. As used in this manner, the term "substantially cylindrical" means that the shape gives the overall appearance of a cylinder, and includes an elongated oval.

[0036]

[0049] In some embodiments, the bottom end 258 of the shielded shaft 250 includes a bottom flange 267. The bottom flange 267 in some embodiments has a top surface 260 and a bottom surface 262 that define a thickness. In some embodiments, the bottom flange 267 extends outwardly from the outer surface 255. The bottom flange 267 in some embodiments provides space for fasteners or other components.

[0037]

[0050] In some embodiments, at least three apertures 259 extend through the thickness of the bottom end 258. In some embodiments, the apertures 259 extend through the thickness of the flange 267 that is part of the bottom end 258. In some embodiments, the at least three apertures 259 are spaced apart about the central axis 253 of the shielded shaft 250. In some embodiments, the at least three apertures 259 are equally spaced apart about the central axis 253. In some embodiments, there are three apertures 259 equally spaced apart about the central axis 253 such that the apertures 259 are positioned at 120 degree intervals as measured from the central axis 253. In some embodiments, at least four apertures extend through the thickness of the bottom end 258, and the at least four apertures are in a square planar configuration about the central axis of the shielded shaft 250, with each of the at least four apertures positioned at 90 degrees from one another.

[0038]

[0051] In some embodiments, a leveling fastener 261 is disposed within each of the at least three apertures 259. The leveling fastener 261 of some embodiments is used to level and secure the shield shaft 250 to the top surface 223 of the outer end 224 of the support arm 220. The leveling fastener 261 is configured to adjust the shield shaft 250 perpendicular to the normal top surface 223 of the heater mounting base 222. Stated differently, in some embodiments, the leveling fastener 261 is configured to allow adjustment of the shield shaft 250 such that the central axis 253 of the shield shaft is substantially perpendicular (±2°) to the top surface 223 of the heater mounting base 222.

[0039] In some embodiments where calibration of the shield shaft 250 relative to the outer end 224 of the support arm 220 is performed, as described in further detail below, one or more shims (not shown) of variable thickness are positioned around the leveling fastener 261. In some embodiments, the one or more shims are positioned between the outer end 224 of the support arm 220 and the bottom surface 262 of the shield shaft 250.

[0040]

[0053] The heater standoff 234 includes a top end 235 and a bottom end 237. The top end 235 of the heater standoff 234 is in contact with the bottom surface 232 of the heater 230. The bottom end 237 of the heater standoff 234 is in contact with a standoff mounting base 310. The standoff mounting base 310 of some embodiments is configured to secure the heater standoff 234 to the outer end 224 of the support arm 220. In some embodiments, the heater standoff 234 has an open interior channel 239 that allows for electrical connection 244 to one or more of the thermal elements 219 or electrodes 217 of the electrostatic chuck in the heater 230. Those skilled in the art are familiar with the construction of heaters and electrostatic chucks and will understand that the arrangement of thermal and electrical components in the heater 230 can be varied.

[0041]

[0054] In the illustrated embodiment, the top end 235 of the heater standoff 234 is above the top end 252 of the shield shaft 250. In some embodiments, the top end 252 of the shield shaft 250 extends above the top end 235 of the heater standoff 234. In some embodiments, the top end 252 of the shield shaft 250 extends to the top end 235 of the heater standoff 234.

[0042]

[0055] 8 and 9, the shield plate 240 has a top surface 270 and a bottom surface 272 that define a thickness. The shield plate 240 further includes an opening 271 that extends from the top surface 270 to the bottom surface 272. In some embodiments, the bottom surface 232 of the heater 230 is disposed a distance from the top surface 270 of the shield plate 240, as shown in the figures. In some embodiments, the distance between the bottom surface 232 of the heater 230 and the top surface 270 of the shield plate 240 is in the range of 0.01 mm to 50 mm, or in the range of 0.25 mm to 40 mm, or in the range of 0.5 mm to 30 mm, or in the range of 1 mm to 20 mm.

[0043]

[0056] The shield plate 240 has an inner portion 274, an outer portion 275, and a peripheral edge 281. In some embodiments, the outer portion 275 has a thickness greater than a thickness of the inner portion 274. In some embodiments, the bottom surface 272 of the shield plate 240 contacts the top end 252 of the shield shaft 250 and is secured with a fastener 256 that extends through at least three apertures 254 that extend through the top end 252. In some embodiments, the bottom surface 272 is welded to the top end 252 of the shield shaft 250. In some embodiments, the bottom surface 272 of the shield plate 240 has a greater thickness where the top end 252 contacts the bottom surface 272 of the shield plate 240. The greater thickness is to accommodate a fastener hole configured to receive the fastener 256.

[0044]

[0057] 9 shows a portion of the outer periphery of the heater 230, including the top plate 245 and the shield plate 240. In the illustrated embodiment, the shield plate 240 is positioned below one of the at least one openings 242 in the top plate 245. The top surface 270 of the shield plate 240 further includes a groove 278 that extends around a perimeter 276 of the shield plate 240, the groove having an inner surface 279 and an outer surface 280, the outer surface 280 being spaced a distance from a peripheral edge 281 of the shield plate 240.

[0045]

[0058] In each of the at least one opening 242, the bottom surface 249 of the top plate 245 contacts the outer periphery 276 of the top surface 270 of the shield plate 240. A first fluid seal 392 (also referred to as a "top fluid seal") is disposed in the ring-shaped groove 278 of the outer periphery edge 281 to maintain a low pressure condition within the processing station 110. The first fluid seal 392 is configured to compress the periphery of the shield plate 240 non-uniformly such that a non-uniform pressure is applied between the shield plate 240 and the top plate 245, while the first fluid seal 392 still maintains an ambient environmental condition within the processing station.

[0046]

[0059] In some embodiments, a ring-shaped shim 350 having a thickness is positioned between the top surface 241 of the shield plate 240 (underlying the support surface 231 of the heater 230) and the bottom surface 249 of the top plate 245. The ring-shaped shim 350 is configured to compress the first fluid seal 392 that is at least partially seated in the groove 278 of the shield plate 240. In some embodiments, the thickness of the ring-shaped shim 350 can be configured to accommodate the variable distance between the top surface 241 of the shield plate 240 and the bottom surface 249 of the top plate 245. In some embodiments, the ring-shaped shim 350 has a variable thickness around the circumference of the ring. In some embodiments, the ring-shaped shim 350 includes multiple individual pieces that are assembled into a ring shape.

[0047]

[0060] In some embodiments, a plenum 283 is formed between the ring-shaped shim 350 and the top plate 245. The plenum 283 can be any suitable shape and / or size, as would be understood by one of ordinary skill in the art. The plenum 283 in some embodiments is connected to a vacuum source (e.g., vacuum pump, foreline) to prevent process gases from escaping from the processing area within the processing station.

[0048]

[0061] In some embodiments, both the ring-shaped shim 350 and the first fluid seal 392 are configured to seal against gas leakage to or from the processing station and maintain the integrity of the vacuum within the processing station. In some embodiments, the first fluid seal 392 is configured to seal against vertical process gap variations of up to 1.5 mm, 1.25 mm, 1 mm, 0.75 mm, or 0.5 mm within the processing station 110. The vertical process gap is defined by the vertical distance between the support surface 231 and the front face 114 of each gas injector 112. In some embodiments, the shim 350 is provided with a larger thickness if the process gap is too small. In some embodiments, the shim 350 is provided with a thinner thickness if the process gap is too large. Similarly, the first fluid seal 392 can be oversized to compensate for a process gap that is too small. In some embodiments, the first fluid seal is configured to seal against leaks and maintain vacuum integrity within the chamber up to a vertical gap variation of 1 mm.

[0049]

[0062] The first fluid seal 392 can be any suitable compressible component known to one of ordinary skill in the art that is compatible with the process gases and process conditions. In some embodiments, the first fluid seal 392 is configured to have a maximum compression of 12% to 13%. In some embodiments, the first fluid seal 392 is configured to have a maximum compression in the range of 1% to 15%, or in the range of 5% to 14%, or in the range of 10% to 13% of the initial thickness of the first fluid seal 392.

[0050]

[0063] The first fluid seal 392 is configured to be compressed non-uniformly to account for planar variations in the support surface 231. Planar variations may occur due to motor runout or variations in mechanical tolerances of one or more of the heater standoff 234, shield shaft 250, standoff mounting base 310, support arm 220, shield plate 240, and top plate 245. In some embodiments, the first fluid seal is configured to accommodate vertical gap variations between the shield plate 240 and the top plate 245 of up to 0.5 mm.

[0051] 10 , in some embodiments, a standoff mounting base 310 is connected to the bottom end 237 of the heater standoff 234 and the bottom end 258 of the shield shaft 250. The standoff mounting base 310 is configured to secure the heater standoff 234 and the shield shaft 250 to the outer end 224 of the support arm 220. The standoff mounting base 310 has a top end 312 and a bottom end 314, where the top end 312 has a diameter larger than the diameter of the bottom end 314. A top surface 316 of the top end 312 is in contact with the bottom of the heater standoff 234.

[0052]

[0065] The bottom ends 314 of the standoff mounting bases 310 are configured to mate within the openings 225 in the top surfaces 223 of the support arms 220. In some embodiments, the bottom ends 314 extend a certain depth into the openings 225 of the support arms 220. In some embodiments, the bottom ends 314 are press-fit or an interference fit within the openings 225.

[0053]

[0066] In some embodiments, the bottom end 258 of the shield shaft 250 has an opening 251 that allows the lower portion 238 of the standoff mounting base 310 to pass therethrough.

[0054]

[0067] In some embodiments, the top end 312 of the standoff mounting base 310 further includes a plurality of stepped surfaces 315. In some embodiments, each of the plurality of stepped surfaces 315 has a diameter that decreases from a top surface 316 of the standoff mounting base 310 to a bottom surface 318 of the standoff mounting base 310. Each of the plurality of stepped surfaces 315 has a bottom surface 317 that contacts a corresponding step of the inner flange 264 of the shield shaft 250. In some embodiments, one or more of each of the bottom surfaces 318 of the plurality of stepped surfaces 315 further include a channel 313 for receiving a plurality of fluid seals 311. The plurality of fluid seals 311 are configured to maintain a low pressure ambient environment within the shield shaft 250 upon compression of the plurality of fluid seals 311 between the bottom surface 317 of each of the plurality of stepped surfaces 315 and a corresponding step of the inner flange 264 of the shield shaft 250. In some embodiments, the top surface 316 is partially recessed into the top end 312 of the standoff mounting base 310 .

[0055]

[0068] In embodiments having multiple processing stations 110, the support arm 220 includes an outer end 221 as previously described. In embodiments having a single processing station, the heater mounting base 222 includes a top surface 223 adjacent to the bottom surface 262 of the shield shaft 250. The top surface 223 of the heater mounting base 222 includes an opening 225 connected to a hollow interior region of the heater mounting base 222. The opening 225 extends partially through the top surface 223. The opening 225 is concentrically disposed on a central axis of the heater mounting base 222. The opening 225 is configured to allow passage of electrical cables, fluid channels, and gas channels through the hollow interior region of the heater mounting base 222, through the standoff mounting base 310, and into the open interior channels of the heater standoff 234. In some embodiments, the opening 225 is configured to receive the bottom 314 of the standoff mounting base 310.

[0056]

[0069] The top surface 223 further includes a ring-shaped groove 227 for receiving a second fluid seal 229 (also referred to as a “bottom fluid seal”) disposed about the opening 225. The second fluid seal 229 is in contact with a bottom surface 268 of the shield shaft 250. The second fluid seal 229 is configured to allow movement of the shield shaft 250 relative to the top surface 223 of the heater mounting base 222.

[0057]

[0070] The second fluid seal 229 is configured to allow at least one shim (not shown) to be positioned between the bottom surface 268 of the shielded shaft 250 and the top surface 223 of the heater mounting base 222. In some embodiments, the at least one shim is a ring-shaped shim positioned around the opening 225. In some embodiments, the at least one shim is positioned between fasteners that secure the bottom end 258 of the shielded shaft 250 to the top surface 223 of the support arm 220.

[0058]

[0071] In some embodiments, the first fluid seal 392 and the second fluid seal 229 are O-rings. In some embodiments, the first fluid seal 392 and the second fluid seal 229 are V-rings. In some embodiments, the first fluid seal 392 and the second fluid seal 229 are L-rings.

[0059]

[0072] Shield plate 240 and shield shaft 250 form a uniform heater shield assembly that forms a uniform gap that is sealed against leakage by first fluid seal 392 and second fluid seal 299 to maintain the integrity of the vacuum within the uniform gap. The heater shield assembly, also referred to as a thermal shield assembly, increases the uniformity of temperature loss around heater 230.

[0060]

[0073] 11 and 12, each of the support surfaces 231 of the heaters 230 is substantially coplanar with each of the other support surfaces 231 of the heaters 230. In some embodiments, the support surfaces 231 are at an angle Θ to the heater standoffs 234, and after calibration, the angle Θ is 90 degrees, thereby providing the support surfaces 231 with a horizontally level surface.

[0061]

[0074] 12, motor axial runout can cause the support surface 231 and heater standoff 234 to become improperly aligned such that the angle Θ is no longer substantially 90 degrees. Continuous cycling and torsional force scanning can also contribute to improper alignment, thus inducing wobble, variations in the internal volume within the processing chamber, or variations in the separation gap distance.

[0062]

[0075] In some embodiments, multiple displacement sensors are utilized to mechanically correct the improper alignment so that the support surface 231 is properly aligned with the top plate 245. In some embodiments, the mechanical correction includes, but is not limited to, shimming the connection points or flanges between the heater standoff 234 and the heater 230, shimming the connection points between the heater standoff 234 and the support arm 220, adjusting the fasteners at the top end 252 of the shield shaft 250, the bottom end 258 of the shield shaft 250. The calibration can further include placing a shim between the fasteners 256 at the top end 252 of the shield shaft 250, and placing a shim between the leveling fasteners 261 at the bottom end 258 of the shield shaft 250. The mechanical calibration can also include placing or adjusting the thickness of the ring-shaped shim 350 to accommodate vertical process gap deviations.

[0063]

[0076] In some embodiments, as described in more detail below, the runout and wobble caused by improper alignment of the heater standoffs 234 is calibrated, as shown in Figure 12. After the runout and wobble of the heater standoffs 234 are corrected and brought into proper alignment, the angle Θ is brought into proper alignment of substantially 90 degrees.

[0064]

[0077] In some embodiments, the plurality of displacement sensors are preferably laser displacement sensors, whereby a laser beam is directed at the support surface 231. The displacement sensors are configured to measure a distance from the sensors to a point on the support surface 231. In some embodiments, the displacement sensors are also configured to measure a distance between the sensors and a point on the top surface 246 of the top plate 245.

[0065]

[0078] In the described embodiments, the displacement sensor is part of at least a set of three sensors, each of which is configured to measure a distance from the sensor to a point on a surface, such that the three sensors measure distances to three points on said surface. In some embodiments, the set of three sensors are positioned equidistant from each other in an equilateral triangular configuration, the triangular configuration being in an xy plane with a central axis relative to the surface being calibrated for coplanarity.

[0066]

[0079] In the described embodiment, the displacement sensors are configured to measure the parallelism of the support surface 231 relative to a corresponding set of three sensors. The parallelism of said surface relative to a set of three sensors is calculated by the distance between each of the three sensors and a point on the surface, the distance being in the z-plane relative to the xy-plane of the triangular arrangement of sensors. In some embodiments, the displacement sensors are configured to measure the parallelism of the opposing support surface 231 relative to two corresponding sets of three sensors. In some embodiments, the displacement sensors are configured to measure the parallelism of the multiple support surfaces 231 relative to the displacement sensors. In some embodiments, the displacement sensors are configured to measure the parallelism of the top surface 246 of the top plate 245 relative to the corresponding set of three sensors.

[0067]

[0080] 14 illustrates a processing platform 400 according to one or more embodiments of the present disclosure. The embodiment illustrated in FIG. 4 is merely representative of one possible configuration and should not be construed as limiting the scope of the disclosure. For example, in some embodiments, the processing platform 400 has one or more of the processing chambers 100, buffer stations 420, and / or robot 430 configurations in a different number than in the illustrated embodiment.

[0068]

[0081] The exemplary processing platform 400 includes a central transfer station 410 having multiple sides 411, 412, 413, 414. The illustrated transfer station 410 has a first side 411, a second side 412, a third side 413, and a fourth side 414. Although four sides are shown, one skilled in the art will appreciate that there can be any suitable number of sides for the transfer station 410 depending, for example, on the overall configuration of the processing platform 400. In some embodiments, the transfer station 410 has three sides, four sides, five sides, six sides, seven sides, or eight sides.

[0069]

[0082] The transfer station 410 has a robot 430 positioned therein. The robot 430 may be any suitable robot capable of moving a substrate during processing. In some embodiments, the robot 430 has a first arm 431 and a second arm 432. The first arm 431 and the second arm 432 may move independently of the other arm. The first arm 431 and the second arm 432 may move in the xy plane and / or along the -axis. In some embodiments, the robot 430 includes a third arm (not shown) or a fourth arm (not shown). Each arm may move independently of the other arm.

[0070]

[0083] The illustrated embodiment includes six processing chambers 100, two connected to each of a second side 412, a third side 413, and a fourth side 414 of a central transfer station 410. Each of the processing chambers 100 can be configured to perform a different process.

[0071]

[0084] The processing platform 400 may also include one or more buffer stations 420 connected to a first side 411 of the central transfer station 410. The buffer stations 420 may perform the same or different functions. For example, the buffer stations may hold cassettes of substrates to be processed and returned to their original cassettes, or one of the buffer stations may hold unprocessed substrates that are moved to the other buffer station after processing. In some embodiments, one or more of the buffer stations are configured to pre-process, pre-heat, or clean substrates before and / or after processing.

[0072]

[0085] The processing platform 400 may also include one or more slit valves 418 between the central transfer station 410 and any of the processing chambers 100. The slit valves 418 can be opened and closed to isolate interior regions within the processing chambers 100 from the environment within the central transfer station 410. For example, if a processing chamber generates plasma during processing, it may be useful to close the slit valve for that process chamber to prevent stray plasma from damaging a robot in the transfer station.

[0073]

[0086] The processing platform 400 may be connected to a factory interface 450 to allow substrates or cassettes of substrates to be loaded into the processing platform 400. A robot 455 in the factory interface 450 may be used to move the substrates or cassettes into and out of the buffer station. The substrates or cassettes may be moved within the processing platform 400 by a robot 430 in a central transfer station 410. In some embodiments, the factory interface 450 is a transfer station of another cluster tool (i.e., another multi-chamber processing platform).

[0074]

[0087] A controller 495 may be provided and coupled to control the operation of various components of the processing platform 400. The controller 495 may be a single controller that controls the entire processing platform 400, or multiple controllers that control individual portions of the processing platform 400. For example, the processing platform 400 of some embodiments includes separate controllers for one or more of the individual processing chambers 100, the central transfer station 410, the factory interface 450, and / or the robot 430.

[0075]

[0088] In some embodiments, the processing chamber 100 further includes a controller 495 connected to the plurality of substantially coplanar support surfaces 231 configured to control one or more of the first temperature or the second temperature. In one or more embodiments, the controller 495 controls a rate of movement of the substrate support 200 (FIG. 2).

[0076] In some embodiments, the controller 495 includes a central processing unit (CPU) 496, memory 497, and support circuits 498. The controller 495 can control the processing platform 400 directly or through computers (or controllers) associated with particular process chambers and / or support system components.

[0077]

[0090] The controller 495 may be one of any form of general-purpose computer processor that can be used in an industrial environment to control various chambers and sub-processors. The memory 497 or computer readable medium of the controller 495 may be one or more readily available memories such as random access memory (RAM), read only memory (ROM), floppy disks, hard disks, optical storage media (e.g., compact disks or digital video disks), flash drives, or other forms of local or remote digital storage. The memory 497 may hold a set of instructions operable by the processor (CPU 496) to control parameters and components of the processing platform 400.

[0078]

[0091] The support circuits 498 are coupled to the CPU 496 for supporting the processor in a conventional manner. These circuits include cache, power supplies, clock circuits, input / output circuits and subsystems, etc. One or more processes may be stored in the memory 498 as software routines that, when executed or invoked by the processor, cause the processor to control the operation of the processing platform 400 or individual processing chambers in the manner described herein. The software routines may also be stored and / or executed by a second CPU (not shown) located remotely from the hardware being controlled by the CPU 496.

[0079]

[0092] Some or all of the processes and methods of the present disclosure may also be implemented in hardware. Thus, the processes may be implemented in software and executed using a computer system in hardware, such as an application specific integrated circuit or other type of hardware implementation, or as a combination of software and hardware. The software routines, when executed by a processor, transform a general-purpose computer into a special-purpose computer (controller) that controls chamber operation to perform the processes.

[0080]

[0093] In some embodiments, the controller 495 has one or more configurations for executing individual processes or sub-processes to perform a method. The controller 495 can be connected and configured to operate intermediate components to perform the functions of a method. For example, the controller 495 can be connected to and configured to control one or more of gas valves, actuators, motors, slit valves, vacuum controls, or other components.

[0081]

[0094] A power supply 530 is connected to the electrodes 521, 522 to generate a voltage difference between the electrodes 521, 522. The power supply 530 connects to the electrodes 521, 522 via transmission lines 531, 532. The transmission lines 531, 532 are electrically separated by any suitable insulator to prevent short circuits or arcing.

[0082]

[0095] The power supply 530 of some embodiments provides a first voltage (also referred to as a potential) to the electrode 521 and a second voltage, different from the first voltage, to the electrode 522. In some embodiments, the power supply 530 is configured to provide high voltage direct current (DC) and low voltage alternating current (AC) components to the electrodes 521, 522.

[0083]

[0096] In one or more embodiments of the present disclosure, the power supply 530 includes or is connected to a capacitance sensor 535. In some embodiments, the capacitance sensor 535 is a separate sensor within the body 502 of the substrate support 500, as shown in Figure 2. In some embodiments, the capacitance sensor is part of the electronics of the power supply 530.

[0084]

[0097] In some embodiments, the controller 590 is connected to the at least one heating element 540 and configured to control power to the at least one heating element 540. In some embodiments, the controller 590 is connected to a temperature sensor (e.g., a pyrometer, thermocouple, etc.) to measure the temperature of the substrate or substrate support 500 and vary the power to the heating element 540 to maintain a predetermined temperature.

[0085]

[0098] In some embodiments, the controller 590 is connected to the displacement sensor and configured to determine at least the deviation of the vertical process gap. The controller 590 is further configured to determine the coplanarity of the support surface 231 and provide shimming values ​​for mechanical calibration. The controller 590 is further configured to measure one or more of the process gap between the substrate and the showerhead, the lift pin actuation surface, the flatness of the top surface, the runout of the heater standoff 234, the vacuum induced deflection of the heater standoff 234, and the parallelism of the heater relative to the showerhead.

[0086]

[0099] A method of calibrating a processing chamber 100 under vacuum is described according to one or more embodiments of the present disclosure. The method includes aligning a top surface of one or more support surfaces 231 disposed within the interior region 109 with a chamber lid 300 to establish a processing gap, where the one or more support surfaces 231 are connected to posts 190 extending through openings 120 in the chamber floor 106 and openings in a support plate 320 attached to a bottom surface 118 of the chamber floor 106, and deflecting the chamber floor 106 toward the interior region 109 while generating a vacuum environment within the interior region 109 and maintaining the processing gap. The processing gap is between 1 mm and 2 mm.

[0087]

[0100] 1, 2, 3A, and 3B, one or more embodiments of the present disclosure are directed to a processing chamber 100. The processing chamber includes a support plate 320 to mitigate the effects of deflection of the chamber floor 106 due to low pressure ambient environmental conditions within the interior region 109. Support columns 190 extend through the chamber floor 106 and the support plate 320, while a bellows assembly 340 separates the ambient environment outside of the interior region 109 from the vacuum or low pressure ambient environmental conditions within the interior region 109.

[0088]

[0101] References throughout this specification to "one embodiment," "a particular embodiment," "one or more embodiments," or "an embodiment" mean that a particular feature, structure, material, or characteristic described in connection with an embodiment is included in at least one embodiment of the present disclosure. Thus, the appearances of phrases such as "in one or more embodiments," "a particular embodiment," "in an embodiment," or "in an embodiment" in various places throughout this specification do not necessarily refer to the same embodiment of the present disclosure. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

[0089]

[0102] Although the disclosure herein has been described with reference to specific embodiments, those skilled in the art will recognize that the described embodiments are merely illustrative of the principles and applications of the disclosure. It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed method and apparatus without departing from the spirit and scope of the disclosure. Thus, the disclosure may include modifications and variations that come within the scope of the appended claims and their equivalents.

Claims

1. 1. A heater assembly comprising: a heater including a support surface and a bottom surface defining a thickness; a heater standoff having a top end and a bottom end, the top end contacting the bottom surface of the heater; a shielded shaft having a top end and a bottom end, an inner surface and an outer surface surrounding an open interior region, the heater standoff being located within the open interior region, the top end of the heater standoff extending above the top end of the shielded shaft; a shield plate having a top surface, a bottom surface and a peripheral edge, the shield plate having an opening therein extending from the top surface to the bottom surface, the heater standoff extending through the opening in the shield plate, the bottom surface of the heater being spaced a distance from the top surface of the shield plate, the top surface of the shield plate having a groove having an inner surface and an outer surface extending around a periphery of the shield plate, the outer surface being spaced a distance from the peripheral edge of the shield plate; A heater assembly having:

2. 2. The heater assembly of claim 1, wherein the shield shaft includes a top flange extending outwardly from the outer surface, the shield shaft being connected to the shield plate with a fastener extending through the top flange.

3. The heater assembly of claim 1 , further comprising a standoff mounting base connected to the bottom end of the standoff.

4. The heater assembly of claim 3 , wherein the standoff mounting base is connected to the bottom end of the shield shaft.

5. The heater assembly of claim 4 , wherein the bottom end of the shielded shaft has an opening to allow a lower portion of the standoff mounting base to pass therethrough.

6. The heater assembly of claim 5 , further comprising a heater mounting base having a top surface, said bottom surface of said shield shaft being positioned adjacent said top surface of said heater mounting base.

7. The heater assembly of claim 6 , wherein the top surface of the heater mounting base includes an opening connected to a hollow interior region of the heater mounting base.

8. 8. The heater assembly of claim 7, wherein the lower portion of the standoff mounting base extends at least partially into the opening in the top surface of the heater mounting base such that electrical connections can pass through the hollow interior region of the heater mounting base, through the standoff mounting base, and into an open interior channel of the heater standoff.

9. 7. The heater assembly of claim 6, wherein a fluid seal is disposed in a circular groove in the top surface of the heater mounting base, the fluid seal permitting movement of the shield shaft relative to a normal to the top surface of the heater mounting base.

10. The heater assembly of claim 9 , wherein the bottom surface of the shielded shaft includes a bottom flange extending outwardly from the outer surface.

11. 11. The heater assembly of claim 10, further comprising a plurality of leveling fasteners extending through a bottom flange of the shield shaft and into the heater mounting base, the leveling fasteners configured to adjust the shield shaft relative to a normal to the top surface of the heater mounting base.

12. 2. The heater assembly of claim 1, further comprising a top plate having a top surface and a bottom surface defining a thickness of the top plate, the top plate having an opening through the thickness to allow the heater to pass therethrough, the bottom surface of the top plate in contact with a fluid seal in the groove in the top surface of the shield plate.

13. 13. The heater assembly of claim 12, further comprising a ring shim having a top surface and a bottom surface that define a thickness of the ring shim, the ring shim being positioned around the heater between the top surface of the shield plate and the bottom surface of the top plate.

14. 14. The heater assembly of claim 13, wherein the fluid seal is configured to seal against the atmosphere and maintain vacuum integrity with a vertical gap variation between the top surface of the shield plate and the bottom surface of the plate of up to 1 mm.

15. The heater assembly of claim 14 , wherein the fluid seal is configured to be non-uniformly compressed.

16. The heater assembly of claim 14 , wherein the fluid seal is configured to accommodate a vertical gap variation between the sealing platform and the sealing plate of up to 0.5 mm.

17. The heater assembly of claim 14, wherein the fluid seal is configured to have a minimum compression of 2% to 3% at a 0.5 mm gap between the sealing platform and the sealing plate.

18. The heater assembly of claim 14, wherein the fluid seal is configured to have a maximum compression of 12% to 13%.

19. A heat shield integral to the heater assembly, comprising: a shielded shaft having top and bottom ends, inner and outer surfaces surrounding an open interior region, the open interior region configured to surround a heater standoff; a shield plate having a top surface, a bottom surface and a peripheral edge, the shield plate having an opening therein extending from the top surface to the bottom surface, the heater standoff extending through the opening in the shield plate, the bottom surface of the heater being spaced a distance from the top surface of the shield plate, the top surface of the shield plate having a groove extending around a periphery of the shield plate, the groove having an inner surface and an outer surface, the outer surface being spaced a distance from the peripheral edge of the shield plate; a first fluid seal disposed within the groove of the shield plate for maintaining a low pressure condition within the processing station; a second fluid seal disposed between the bottom surface of the shield shaft and a top surface of a support arm; a heat shield integral to the heater assembly including:

20. A substrate support comprising: a central base having a plurality of arms extending therefrom, each arm having an inner end and an outer end in contact with the central base; a heater assembly connected to the outer end of each arm, a heater including a support surface and a bottom surface defining a thickness; a heater standoff having a top end and a bottom end, the top end contacting the bottom surface of the heater; a shielded shaft having a top end and a bottom end, an inner surface and an outer surface surrounding an open interior region, the heater standoff being located within the open interior region, the top end of the heater standoff extending above the top end of the shielded shaft; and a shield plate having a top surface, a bottom surface and a peripheral edge, the shield plate having an opening therein extending from the top surface to the bottom surface, the heater standoff extending through the opening in the shield plate, the bottom surface of the heater being spaced a distance from the top surface of the shield plate, the top surface of the shield plate having a groove having an inner surface and an outer surface extending around a periphery of the shield plate, the outer surface being spaced a distance from the peripheral edge of the shield plate; the heater assembly having a top plate having a top surface and a bottom surface defining a thickness of the top plate, the top plate having an opening through the thickness to allow passage of the heater, the bottom surface of the top plate being in contact with the fluid seal; A substrate support comprising:

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