Manufacturing method of touch sensor and touch sensor

Abstract

To provide a touch sensor capable of preventing disconnection of peripheral wiring and a manufacturing method of the touch sensor.SOLUTION: A manufacturing method of a touch sensor comprises, in order: a step of preparing a board including a detecting region and a peripheral region; the step of forming a metal layer in the peripheral region; the step of patterning a photosensitive resist in the metal layer by a photolithography method, and forming a detection electrode connection terminal, an external connection terminal and peripheral wiring which connects the detection electrode connection terminal and the external connection terminal by performing wet etching to the metal layer; the step of forming a layer to be plated which is formed in the detecting region, stretches so as to cover at least a part of each of the detection electrode connection terminals, and includes a pattern configured by a plurality of thin-lines; and the step of forming a touch detection electrode electrically connected to the detection electrode connection terminal by a wet plating method, on the layer to be plated.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a touch sensor for detecting a touch operation, and a manufacturing method thereof. [Background technology]

[0002] Conventionally, in various electronic devices including portable information devices such as tablet computers and smartphones, touch sensors are used to detect so-called touch operations, in which a finger, a stylus pen, or the like is brought into contact with or close to a screen. Such touch sensors usually have a touch detection electrode formed on a detection area of ​​a substrate and detecting a touch operation, an external connection terminal formed on a peripheral area of ​​the substrate located around the detection area and used to electrically connect the touch sensor to an external device, and a peripheral wiring electrically connecting the touch detection electrode and the external connection terminal and formed on the peripheral area.

[0003] Here, when manufacturing a touch sensor, generally, the touch sensing electrodes, external connection terminals, and peripheral wiring are often formed simultaneously on a substrate to facilitate manufacturing. At this time, a so-called plating method may be used, for example as disclosed in Patent Document 1. In this case, the touch sensing electrodes, external connection terminals, and peripheral wiring can be formed by forming a plated layer having a pattern corresponding to the touch sensing electrodes, external connection terminals, and peripheral wiring on the substrate, and then immersing the substrate in a plating solution to deposit metal on the plated layer. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2013-051391 A Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, in recent years, in order to narrow the peripheral region, it is required to narrow the line width of the peripheral wiring and the distance between adjacent peripheral wirings. However, when trying to form peripheral wiring having a narrow line width and distance between wirings on a substrate simultaneously with touch sensing electrodes and external connection terminals by a plating method as disclosed in Patent Document 1, air bubbles generated during plating or impurities mixed in for some reason may be located on the plated layer corresponding to the peripheral wiring, causing the peripheral wiring finally formed to be in a disconnected state.

[0006] The present invention has been made to solve such problems, and has an object to provide a touch sensor and a manufacturing method thereof that can prevent disconnection of peripheral wiring. [Means for solving the problem]

[0007] The above object can be achieved by the following configuration. [1] preparing a substrate including a detection region and a peripheral region disposed around the detection region; forming a metal layer on a peripheral region of a substrate; forming a pattern of a photosensitive resist on a surface of the metal layer by photolithography and wet etching the metal layer to form a plurality of detection electrode connection terminals, a plurality of external connection terminals, and a plurality of peripheral wirings connecting the plurality of detection electrode connection terminals and the plurality of external connection terminals to each other; forming a plating layer including a pattern formed of a plurality of thin lines, the plating layer being formed in a detection region of the substrate and extending so as to cover at least a portion of each of the plurality of detection electrode connection terminals; and forming, on the plating layer, a plurality of touch sensing electrodes electrically connected to the plurality of sensing electrode connection terminals by a wet plating method. A method for manufacturing a touch sensor. [2] The method further includes a step of forming a first protective layer covering at least the peripheral wirings between the step of forming the plurality of detection electrode connection terminals, the plurality of external connection terminals, and the plurality of peripheral wirings and the step of forming a plated layer. A method for manufacturing the touch sensor described in [1]. [3] The method further includes forming a second protective layer covering the touch sensing electrode. A method for manufacturing the touch sensor described in [2]. [4] The composition of the first protective layer and the composition of the second protective layer are different from each other. A method for manufacturing the touch sensor described in [3]. [5] The plating layer is formed by photolithography. A method for manufacturing a touch sensor according to any one of [1] to [4]. [6] A substrate including a detection region and a peripheral region disposed around the detection region; A plurality of detection electrode connection terminals arranged in a peripheral region of the substrate; A plurality of external connection terminals arranged in a peripheral region of the substrate; peripheral wiring arranged in a peripheral region of the substrate and connecting the plurality of detection electrode connection terminals and the plurality of external connection terminals to each other; a plating layer including a pattern formed of a plurality of thin wires, the plating layer being formed in a detection region of the substrate and extending so as to cover at least a portion of each of the plurality of detection electrode connection terminals; The touch sensing electrode includes at least a part of each of the plurality of sensing electrode connection terminals and a plurality of touch sensing electrodes disposed on the plating layer and electrically connected to the plurality of sensing electrode connection terminals. Touch sensor. [7] The distance between adjacent peripheral wiring is 15.00 μm or less. The touch sensor described in [6]. [8] The layer to be plated contains an organic substance as a main component and contains a palladium catalyst. The touch sensor according to [6] or [7]. Effect of the Invention

[0008] According to this invention, a manufacturing method for a touch sensor sequentially includes the steps of preparing a substrate including a detection region and a peripheral region arranged around the detection region, forming a metal layer in the peripheral region of the substrate, patterning a photosensitive resist on the surface of the metal layer by photolithography and wet etching the metal layer to form a detection electrode connecting terminal, a plurality of external connecting terminals, and a plurality of peripheral wirings connecting the plurality of detection electrode connecting terminals and the plurality of external connecting terminals to each other, forming a plated layer including a pattern composed of a plurality of thin wires formed in the detection region of the substrate and extending so as to cover at least a portion of each of the plurality of detection electrode connecting terminals, and forming a plurality of touch detection electrodes electrically connected to the plurality of detection electrode connecting terminals by a wet plating method on the plated layer, thereby preventing breakage of the peripheral wiring. [Brief description of the drawings]

[0009] [Figure 1] 1 is a partial cross-sectional view of a touch sensor according to an embodiment; [Diagram 2] FIG. 2 is a plan view of a touch sensor according to the embodiment. [Diagram 3] 2 is an enlarged plan view showing a part of a touch sensing electrode according to the embodiment. FIG. [Figure 4] 2 is an enlarged plan view showing a part of a plurality of peripheral wirings according to an embodiment; FIG. [Diagram 5] 3 is an enlarged cross-sectional view showing a portion of a first conductive layer in the embodiment. FIG. [Figure 6] 4 is a flowchart showing a method for manufacturing a touch sensor according to an embodiment. [Figure 7] 2 is a plan view of a substrate on which detection electrode connection terminals, peripheral wiring, and external connection terminals are formed. FIG. [Figure 8] 4 is an enlarged cross-sectional view showing a portion of a substrate on which detection electrode connection terminals, peripheral wiring, and external connection terminals are formed. FIG. [Figure 9] 2 is an enlarged cross-sectional view showing a portion of a substrate on which a layer to be plated is formed. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a conductive member for a touch panel and a touch panel according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings. In the following, the notation "~" indicating a numerical range includes the numerical values ​​written on both sides. For example, "s is a number between t1 and t2" means that the range of s includes the numerical values ​​t1 and t2, which is expressed in mathematical notation as t1≦s≦t2. Unless otherwise specified, angles including "perpendicular" and "parallel" include a generally acceptable error range in the technical field. "Transparent" means that the light transmittance is at least 40% or more in the visible light wavelength range of 400 nm to 800 nm, preferably 75% or more, more preferably 80% or more, and even more preferably 90% or more. The light transmittance is measured according to "Plastics--Determination of total light transmittance and total light reflectance" as specified in JIS K 7375:2008.

[0011] Embodiment FIG. 1 shows a configuration of a touch sensor according to an embodiment of the present invention. The touch sensor includes a substrate 1 having a first surface 1A and a second surface 1B that form a front and a back surface of the substrate, a first conductive layer 2 disposed on the first surface 1A of the substrate 1, and a second conductive layer 3 disposed on the second surface 1B of the substrate 1. The substrate 1 has insulating properties, and the first conductive layer 2 and the second conductive layer 3 are electrically insulated from each other. The substrate 1 has flexibility, and the touch sensor has flexibility equivalent to that of the substrate 1. The substrate 1 is made of a transparent material.

[0012] The touch sensor can be used as a touch panel display device (not shown) by adhering a cover member (not shown) to the surface on the first conductive layer 2 side and a display module (not shown) to the surface on the second conductive layer 3 side. At this time, a user's finger, stylus pen, or the like in contact with or close to the cover member is detected, and a touch operation by the user is detected.

[0013] A plan view of the touch sensor is shown in Fig. 2. The substrate 1 has a detection region R1 and a peripheral region R2 disposed around the detection region R1.

[0014] The first conductive layer 2 has a plurality of touch sensing electrodes 11 for detecting touch operations, which are formed in the detection region R1 and extend along a defined Y direction and are arranged along an X direction perpendicular to the Y direction, a plurality of sensing electrode connection terminals 12 formed in the peripheral region R2 and formed at one end of the plurality of touch sensing electrodes 11, a plurality of external connection terminals 14 formed in the peripheral region R2 and used for electrically connecting to an external device not shown, and a plurality of peripheral wirings 13 formed in the peripheral region R2 and electrically connecting the plurality of sensing electrode connection terminals 12 and the plurality of external connection terminals 14 to each other. As will be described later, the first conductive layer 2 in the detection region R1 has a plated layer covered with the plurality of touch sensing electrodes 11.

[0015] The second conductive layer 3 has a plurality of touch sensing electrodes 21 for detecting a touch operation formed in the detection region R1, extending along the X direction and arranged along the Y direction, a plurality of sensing electrode connection terminals 22 formed in the peripheral region R2 and formed at one end of the plurality of touch sensing electrodes 21, a plurality of external connection terminals 24 formed in the peripheral region R2 and used for electrically connecting to an external device not shown, and a plurality of peripheral wirings 23 formed in the peripheral region R2 and electrically connecting the plurality of sensing electrode connection terminals 22 and the plurality of external connection terminals 24 to each other. As will be described later, the second conductive layer 3 in the detection region R1 has a plated layer covered with the plurality of touch sensing electrodes 21.

[0016] As will be described in detail later, the plurality of detection electrode connection terminals 12, the plurality of peripheral wirings 13, and the plurality of external connection terminals 14 can be formed, for example, by forming a metal layer on the first surface 1A of the substrate 1 in the peripheral region R2, forming a pattern of a photosensitive resist on the metal layer by so-called photolithography, and performing so-called wet etching on the metal layer. In addition, the plurality of touch detection electrodes 11 can be formed, for example, after forming the plurality of detection electrode connection terminals 12, the plurality of peripheral wirings 13, and the plurality of external connection terminals 14, by forming a plated layer on the first surface 1A of the substrate 1 in the detection region R1, and depositing a metal on the plated layer by using a so-called wet plating method.

[0017] In addition, the multiple touch detection electrodes 21, the multiple detection electrode connection terminals 22, the multiple peripheral wirings 23, and the multiple external connection terminals 24 can also be formed on the second surface 1B side of the substrate 1 in a similar manner to the multiple touch detection electrodes 11, the multiple detection electrode connection terminals 12, the multiple peripheral wirings 13, and the multiple external connection terminals 14.

[0018] 3, the touch sensing electrode 11 in the first conductive layer 2 is configured of a plurality of thin metal wires M forming a mesh shape. In order to suppress the occurrence of so-called moire when an observer visually recognizes the touch sensing electrode 11 arranged on a display module (not shown), the average value of the line width W1 of the plurality of thin metal wires M is preferably 0.50 μm to 3.00 μm, and more preferably within a range of 1.00 μm to 2.00 μm.

[0019] 4, the peripheral wiring 13 in the first conductive layer 2 has a line width W2. The multiple peripheral wirings 13 are arranged with a line-to-line distance L2 between them at their closest locations. In order to narrow the peripheral region R2 while ensuring the conductivity of the peripheral wirings 13, the line width W2 and the line-to-line distance L2 of the peripheral wirings 13 are preferably, for example, 1.00 μm or more and 30.00 μm or less, and more preferably 5.00 μm or more and 15.00 μm or less.

[0020] FIG. 5 shows a cross-sectional view of the touch sensor showing the boundary between the detection region R1 and the peripheral region R2 of the substrate 1. The detection electrode connection terminal 12 of the first conductive layer 2 is formed on the first surface 1A of the substrate 1 in the peripheral region R2. A plated layer 31 is formed on the first surface 1A of the substrate 1 in the detection region R1. The plated layer 31 is a layer in which metal constituting the plurality of touch detection electrodes 11 is precipitated by a wet plating method, and contains a catalyst such as a palladium (Pd) catalyst that promotes the precipitation of metal. The plated layer 31 extends toward the peripheral region R2 so as to cover at least a part of the detection electrode connection terminal 12. In addition, the plated layer 31 has the same shape pattern as the plurality of touch detection electrodes 11, and is composed of a plurality of thin lines. The plurality of touch detection electrodes 11 are formed on the plated layer 31 by a wet plating method.

[0021] The touch sensing electrode 11 is formed by a wet plating method, and is formed so as to cover the side portion 31A of the plated layer 31. As a result, the portion of the touch sensing electrode 11 formed on the side portion 31A of the plated layer 31 comes into contact with the sensing electrode connection terminal 12, and the touch sensing electrode 11 and the sensing electrode connection terminal 12 are reliably electrically connected to each other, and are not affected by a step at the boundary between the sensing region R1 and the peripheral region R2 in the first conductive layer 2, which occurs when the touch sensing electrode 11 and the sensing electrode connection terminal 12 are formed separately.

[0022] Although not shown in Fig. 5, the peripheral wiring 13 and the external connection terminal 14 are formed on the first surface 1A of the substrate 1 in the peripheral region R2, similarly to the detection electrode connection terminal 12. In Fig. 5, the second conductive layer 3 is omitted for the sake of simplicity, but the second conductive layer 3 also has a layer structure in which the touch detection electrode 21 is formed on the plated layer 31, similarly to the first conductive layer 2, and the detection electrode connection terminal 22, the plated layer 31, and the touch detection electrode 21 are laminated in this order from the second surface 1B of the substrate 1 at the edge of the peripheral region R2 facing the detection region R1.

[0023] Here, the touch sensor may also have a first protective layer (not shown) that covers at least the multiple peripheral wirings 13 and 23. For example, when forming a plated layer 31 containing a catalyst as a composition, or when applying a catalyst to the surface of the plated layer 31 after its formation, the first protective layer can prevent a short circuit from occurring due to metal deposition between the multiple peripheral wirings 13 and the multiple peripheral wirings 23 caused by the catalyst adhering between the multiple peripheral wirings 13 and the multiple peripheral wirings 23.

[0024] The touch sensor may also have a second protective layer (not shown) that covers the plurality of touch sensing electrodes 11 and 21 to mechanically protect the plurality of touch sensing electrodes 11 and 21.

[0025] The first protective layer is preferably made of, for example, a material that prevents liquid from penetrating in order to prevent a catalyst from adhering to the peripheral wirings 13 and 23. The second protective layer is preferably made of a transparent material that mechanically protects the touch sensing electrodes 11 and 21 when, for example, the touch panel is used in a state in which it is disposed on a display module (not shown). In this way, the compositions of the first protective layer and the second protective layer can be made different from each other according to the purpose of the first protective layer and the second protective layer.

[0026] Next, a method for manufacturing a touch sensor according to an embodiment of the present invention will be described with reference to the flowchart of FIG.

[0027] First, in step S1, a substrate 1 is prepared. In this substrate 1, a detection region R1 and a peripheral region R2 are defined.

[0028] In step S2, a metal layer is formed on the first surface 1A and the second surface 1B in the peripheral region R2 of the substrate 1 prepared in step S1. At this time, the metal layer can be formed by a so-called dry plating method such as a so-called vacuum deposition method or a so-called sputtering method.

[0029] In step S3, the metal layer formed in step S2 is processed to form a plurality of detection electrode connection terminals 12, a plurality of peripheral wirings 13 and a plurality of external connection terminals 14 on the first surface 1A of the substrate 1 in the peripheral region R2, and a plurality of detection electrode connection terminals 22, a plurality of peripheral wirings 23 and a plurality of external connection terminals 24 on the second surface 1B of the substrate 1 in the peripheral region R2.

[0030] In this process, a photosensitive resist liquid is first applied onto the metal layer formed on the first surface 1A of the substrate 1, and the applied photosensitive resist is heated for a predetermined time to dry. A photomask having an exposure pattern corresponding to the plurality of detection electrode connection terminals 12, the plurality of peripheral wirings 13, and the plurality of external connection terminals 14 is placed in close proximity to or in contact with the dried photosensitive resist, and in this state, ultraviolet light is irradiated onto the photosensitive resist through the photomask. Thereafter, the substrate 1 is immersed in a developer corresponding to the photosensitive resist, whereby the photosensitive resist is patterned into a shape corresponding to the plurality of detection electrode connection terminals 12, the plurality of peripheral wirings 13, and the plurality of external connection terminals 14.

[0031] With the photosensitive resist patterned in this manner disposed on the metal layer, the substrate 1 is immersed in an etching solution to wet-etch the metal layer, and the photosensitive resist is removed using a resist remover to form a plurality of detection electrode connection terminals 12, a plurality of peripheral wirings 13, and a plurality of external connection terminals 14 as shown in Fig. 7. At this stage, as shown in Fig. 8, near the boundary between the detection region R1 and the peripheral region R2, the detection electrode connection terminals 12 are disposed on the first surface 1A of the substrate 1 in the peripheral region R2, but nothing is formed in the detection region R1.

[0032] As the photosensitive resist used in step S3, a so-called negative photosensitive resist can be used, or a so-called positive photosensitive resist can also be used. As the etching solution used in the wet etching, any solution can be used as long as it dissolves the metal layer.

[0033] In addition, the multiple detection electrode connection terminals 22, the multiple peripheral wirings 23 and the multiple external connection terminals 24 can be formed on the second surface 1B of the substrate 1 in a similar manner to the multiple detection electrode connection terminals 12, the multiple peripheral wirings 13 and the multiple external connection terminals 14.

[0034] In step S4, a plated layer 31 having a shape pattern corresponding to the multiple touch sensing electrodes 11 and extending to cover at least a portion of each of the multiple sensing electrode connecting terminals 12 is formed on the first surface 1A of the substrate 1 in the detection region R1, and a plated layer 31 having a shape pattern corresponding to the multiple touch sensing electrodes 21 and extending to cover at least a portion of each of the multiple sensing electrode connecting terminals 22 is formed on the second surface 1B of the substrate 1 in the detection region R1.

[0035] In this case, a liquid composition made of a photosensitive resin material is applied onto the first surface 1A of the substrate 1 in the detection region R1 and onto the plurality of detection electrode connection terminals 12, and the applied liquid composition is heated and dried for a predetermined time to form a plated layer precursor layer. A photomask having an exposure pattern corresponding to the plurality of touch detection electrodes 11 is placed so as to be in contact with the plated layer precursor layer, and in this state, ultraviolet light is irradiated onto the plated layer precursor layer through the photomask. Thereafter, the substrate 1 is washed to form a plated layer 31 having a shape pattern corresponding to the plurality of touch detection electrodes 11.

[0036] The plated layer 31 also contains a catalyst such as a Pd catalyst for promoting deposition of metal by a wet plating method. Examples of methods for applying a catalyst to the plated layer 31 include a method of mixing the catalyst into the plated layer precursor layer, a method of laminating a layer containing the catalyst on the surface of the plated layer precursor layer, and a method of patterning the plated layer precursor layer and then treating it with a treatment liquid containing the catalyst.

[0037] The plated layer 31 containing the catalyst formed in this manner is formed on the first surface 1A of the substrate 1 in the detection region R1 and extends toward the peripheral region R2 so as to cover at least a portion of the detection electrode connecting terminal 12, as shown in FIG.

[0038] The plated layer 31 on the second surface 1B side of the substrate 1 can be formed on the second surface 1B of the substrate 1 in the same manner as the plated layer 31 on the first surface 1A side of the substrate 1.

[0039] In step S5, a plurality of touch detection electrodes 11 electrically connected to a plurality of detection electrode connection terminals 12 and a plurality of touch detection electrodes 21 electrically connected to a plurality of detection electrode connection terminals 22 are formed by a wet plating method on the plated layer 31 on the first surface 1A side and the second surface 1B side of the substrate 1 formed in step S4.

[0040] 5, the touch sensing electrode 11 formed in this manner is formed so as to cover the side portion 31A of the plated layer 31. Therefore, the portion of the touch sensing electrode 11 formed on the side portion 31A of the plated layer 31 contacts the sensing electrode connection terminal 12, and the touch sensing electrode 11 and the sensing electrode connection terminal 12 are reliably electrically connected to each other. Although not shown, the touch sensing electrode 21 formed on the second surface 1B side of the substrate 1 is also electrically connected to the sensing electrode connection terminal 22 in the same manner as the touch sensing electrode 11 formed on the first surface 1A side.

[0041] When step S5 is completed, the manufacture of the touch sensor according to the embodiment of the present invention is completed.

[0042] Here, in general, when manufacturing a touch sensor, for example, a plurality of touch detection electrodes 11, a plurality of detection electrode connection terminals 12, a plurality of peripheral wirings 13, and a plurality of external connection terminals 14 are often formed together in order to facilitate manufacturing. In this case, for example, when a wet plating method is used, air bubbles generated during plating or impurities mixed in for some reason are disposed at any position of the plurality of peripheral wirings 13, so that any of the plurality of peripheral wirings 13 may be formed in a disconnected state, or plating unevenness may occur in the touch detection electrodes 11. In addition, for example, when a method of wet etching a metal layer is used, it is difficult to thin the touch detection electrodes 11, and any of the plurality of thin metal wires M constituting the plurality of touch detection electrodes 11 may be mechanically disconnected when, for example, a patterned photosensitive resist disposed on the metal layer is removed by ultrasonic cleaning.

[0043] In the manufacturing method of the touch sensor of the present invention, the multiple detection electrode connection terminals 12, the multiple peripheral wirings 13 and the multiple external connection terminals 14 are formed by a method of etching a metal layer, and then the multiple touch detection electrodes 11 are formed by a wet plating method, so that breakage of the multiple peripheral wirings 13 and the multiple thin metal wires M that constitute the multiple touch detection electrodes 11 can be prevented during the manufacturing process.

[0044] Although it has been described that the metal layer can be formed by a dry plating method in step S2, the metal layer can also be formed by a wet plating method. In this case, for example, a plated layer is formed on the first surface 1A and the second surface 1B of the substrate 1 in the peripheral region R2, and the substrate 1 is immersed in a plating solution to form a metal layer on the plated layer. The metal layer thus formed is wet-etched in step S3, whereby a plurality of detection electrode connection terminals 12, a plurality of peripheral wirings 13, and a plurality of external connection terminals 14 are formed on the first surface 1A side of the substrate 1, and a plurality of detection electrode connection terminals 22, a plurality of peripheral wirings 23, and a plurality of external connection terminals 24 are formed on the second surface 1B side.

[0045] In addition, the manufacturing process of the touch sensor may include a step of forming a first protective layer (not shown) that covers at least the multiple peripheral wirings 13 and 23 between step S3 of forming the multiple detection electrode connection terminals 12 and 22, the multiple peripheral wirings 13 and 23, and the multiple external connection terminals 14 and 24, and step S4 of forming the plated layer 31.

[0046] Furthermore, the manufacturing process of the touch sensor may include a step of forming a second protective layer (not shown) that covers the plurality of touch sensing electrodes 11 and 21 after step S5 of forming the plurality of touch sensing electrodes 11 and 21.

[0047] Each component constituting the touch sensor of the embodiment will be described below. <Substrate> The type of substrate 1 is not particularly limited as long as it is a member capable of supporting the first conductive layer 2 and the second conductive layer 3. Examples of the substrate 1 include plastic substrates, glass substrates, and metal substrates, with plastic substrates being preferred. A flexible base material is preferable for the substrate 1 because of its excellent bendability. Examples of the flexible base material include the above-mentioned plastic base materials. The thickness of the substrate 1 is not particularly limited, and is often 25 μm to 500 μm.

[0048] Materials constituting the substrate 1 are preferably resins having a melting point of about 290° C. or less, such as polyethylene terephthalate (PET), polycycloolefin, polycarbonate, acrylic film, polyethylene naphthalate, polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, and triacetyl cellulose, and more preferably PET, polycycloolefin, or polycarbonate. Of these, PET is particularly preferable because of its excellent adhesion to the first conductive layer 2 and the second conductive layer 3. The total light transmittance of the substrate 1 is preferably 85% to 100%. The total light transmittance is measured according to "Plastics - Determination of total light transmittance and total light reflectance" defined in JIS (Japanese Industrial Standards) K 7375:2008.

[0049] One preferred embodiment of the substrate 1 is a treated substrate that has been subjected to at least one treatment selected from the group consisting of atmospheric plasma treatment, corona discharge treatment, and ultraviolet irradiation treatment. By carrying out the above-mentioned treatment, hydrophilic groups such as OH groups are introduced into the surface of the treated substrate 1, improving the adhesion between the substrate 1 and the first conductive layer 2 and between the substrate 1 and the second conductive layer 3. Among the above-mentioned treatments, atmospheric plasma treatment is preferred in that it further improves the adhesion between the substrate 1 and the first conductive layer 2 and between the substrate 1 and the second conductive layer 3.

[0050] <Undercoat layer> In order to improve the adhesion between the substrate 1 and the first conductive layer 2 and between the substrate 1 and the second conductive layer 3, an undercoat layer can be disposed between the substrate 1 and the first conductive layer 2 and between the substrate 1 and the second conductive layer 3. This undercoat layer contains a polymer, and the adhesion between the substrate 1 and the first conductive layer 2 and between the substrate 1 and the second conductive layer 3 is further improved.

[0051] The method for forming the undercoat layer is not particularly limited, but examples include a method in which a composition for forming an undercoat layer containing a polymer is applied onto the substrate 1 and, if necessary, a stretching treatment is carried out. In addition, gelatin, acrylic resin, urethane resin, acrylic-styrene-based latex containing inorganic or polymeric fine particles, etc. may be used as the composition for forming an undercoat layer containing a polymer.

[0052] If necessary, the touch sensor may have a refractive index adjustment layer between the substrate 1 and the first conductive layer 2 and between the substrate 1 and the second conductive layer 3, in addition to the undercoat layer described above. As the refractive index adjustment layer, for example, an organic layer to which particles of a metal oxide such as zirconium oxide that adjusts the refractive index are added can be used.

[0053] <Touch detection electrodes, detection electrode connection terminals, peripheral wiring, external connection terminals> The touch detection electrodes 11 and 21, the detection electrode connection terminals 12 and 22, the peripheral wirings 13 and 23, and the external connection terminals 14 and 24 can be formed of a metal or an alloy, for example, silver, copper, gold, aluminum, nickel, chromium, molybdenum, or tungsten. The touch detection electrodes 11 and 21, the detection electrode connection terminals 12 and 22, the peripheral wirings 13 and 23, and the external connection terminals 14 and 24 preferably contain copper, but may contain metals other than copper, for example, gold, silver, etc. The detection electrode connection terminals 12 and 22, the peripheral wirings 13 and 23, and the external connection terminals 14 and 24 may have a laminated structure of a metal and a metal compound, and in this case, a metal thin wire having a laminated structure such as copper / copper oxide or copper / copper sulfide can be used.

[0054] <Layer to be plated> The plateable layer 31 is mainly composed of an organic material. The term "mainly composed of an organic material" means that the content of the organic material in the plateable layer 31 is more than 50 mass%, preferably 80 mass% or more, and more preferably 90 mass% or more, relative to the total mass of the plateable layer 31. There is no particular upper limit, and it may be 100 mass%.

[0055] The plated layer 31 is preferably a layer having a functional group (hereinafter also referred to as "interactive group") that interacts with the plating catalyst or its precursor. The interactive group is intended to be a functional group that can interact with the plating catalyst or its precursor that is applied to the plated layer 31, and examples of the interactive group include a functional group that can form an electrostatic interaction with the plating catalyst or its precursor, as well as a nitrogen-containing functional group, a sulfur-containing functional group, and an oxygen-containing functional group that can form a coordination with the plating catalyst or its precursor. As the interactive group, ionic polar groups such as a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, and a boronic acid group, or a cyano group are preferred, since they have high polarity and high adsorption ability to the plating catalyst or its precursor, and the like, and a carboxylic acid group or a cyano group is more preferred. The plated layer 31 usually contains a compound having the above-mentioned interactive group. As the compound, a polymer is preferred. That is, the plated layer 31 preferably contains a polymer containing a repeating unit having an interactive group.

[0056] Moreover, the plated layer 31 preferably contains a plating catalyst or a precursor thereof. As the plating catalyst or a precursor thereof, an electroless plating catalyst or a precursor thereof is preferable. The electroless plating catalyst is not particularly limited as long as it becomes an active nucleus during electroless plating, and examples thereof include metals having catalytic ability for autocatalytic reduction reaction (metals known to be electroless plateable with a lower ionization tendency than Ni). Specific examples thereof include Pd, Ag, Cu, Pt, Au, and Co.

[0057] The method for producing the plated layer 31 is not particularly limited, and examples thereof include a method in which a plated layer precursor layer is formed from a plated layer forming composition applied onto the substrate 1, the plated layer precursor layer is subjected to exposure treatment and development treatment to form the plated layer 31 having a shape pattern corresponding to the touch sensing electrode 11, and a plating catalyst or its precursor is further applied to the obtained plated layer 31.

[0058] The composition for forming a plateable layer contains the following compound X or composition Y. Compound X: a compound having an interacting group and a polymerizable group Composition Y: A composition containing a compound having an interactive group and a compound having a polymerizable group Compound X is a compound having an interactive group and a polymerizable group. The definition of the interactive group is as described above. Compound X may have two or more types of interactive groups.

[0059] The polymerizable group is a functional group capable of forming a chemical bond by the application of energy, and examples thereof include a radically polymerizable group and a cationic polymerizable group. Among them, the radically polymerizable group is preferable from the viewpoint of superior reactivity. As the radically polymerizable group, a methacryloyloxy group, an acryloyloxy group, or a styryl group is more preferable. The compound X may have two or more kinds of polymerizable groups. The number of polymerizable groups that the compound X has is not particularly limited, and may be one or two or more.

[0060] The compound X may be a low molecular weight compound or a high molecular weight compound. A low molecular weight compound refers to a compound having a molecular weight of less than 1000, and a high molecular weight compound refers to a compound having a molecular weight of 1000 or more. When the compound X is a polymer, the weight average molecular weight of the polymer is not particularly limited, and is preferably 1000 to 700000, more preferably 2000 to 200000, in terms of better handling such as solubility. The synthesis method of such a polymer having a polymerizable group and an interacting group is not particularly limited, and a known synthesis method (see paragraphs

[0097] to

[0125] of JP 2009-280905 A) is used.

[0061] The composition Y is a composition containing a compound having an interactive group and a compound having a polymerizable group. That is, the composition Y contains two kinds of compounds, a compound having an interactive group and a compound having a polymerizable group. The definitions of the interactive group and the polymerizable group are as described above. The compound having an interactive group may be a low molecular weight compound or a high molecular weight compound. The compound having an interactive group may contain a polymerizable group. A suitable form of the compound having an interactive group is a polymer (e.g., polyacrylic acid) containing a repeating unit having an interactive group.

[0062] A suitable form of the polymer containing a repeating unit having an interactive group is polymer Z having a repeating unit derived from a conjugated diene compound and a repeating unit derived from an unsaturated carboxylic acid or a derivative thereof, in that the plated layer 31 can be easily formed with a small amount of applied energy (for example, exposure dose). The conjugated diene compound is not particularly limited as long as it is a compound having a molecular structure having two carbon-carbon double bonds separated by one single bond.

[0063] The repeating unit derived from the conjugated diene compound is preferably a repeating unit derived from a compound having a butadiene skeleton. Examples of the compound having a butadiene skeleton (monomer having a butadiene structure) include 1,3-butadiene, isoprene, 2-ethyl-1,3-butadiene, 2-n-propyl-1,3-butadiene, 2,3-dimethyl-1,3-butadiene, 1-phenyl-1,3-butadiene, 1-α-naphthyl-1,3-butadiene, 1-β-naphthyl-1,3-butadiene, 2-chloro-1,3-butadiene, 1-bromo-1,3-butadiene, 1-chlorobutadiene, 2-fluoro-1,3-butadiene, 2,3-dichloro-1,3-butadiene, 1,1,2-trichloro-1,3-butadiene, and 2-cyano-1,3-butadiene. The content of the repeating unit derived from the conjugated diene compound in the polymer Z is preferably 25 to 75 mol % based on all repeating units. The content of the repeating unit derived from the unsaturated carboxylic acid or a derivative thereof in the polymer Z is preferably 25 to 75 mol % based on all repeating units.

[0064] The compound having a polymerizable group is a so-called monomer, and a polyfunctional monomer having two or more polymerizable groups is preferable in that the hardness of the plated layer 31 to be formed is superior. Specifically, the polyfunctional monomer is preferably a monomer having 2 to 6 polymerizable groups. From the viewpoint of the mobility of molecules during the crosslinking reaction that affects the reactivity, the molecular weight of the polyfunctional monomer used is preferably 150 to 1000, and more preferably 200 to 800.

[0065] The composition for forming a plateable layer may contain components other than the above-mentioned components. For example, the composition for forming a plateable layer may contain a polymerization initiator. The type of polymerization initiator is not particularly limited, and examples thereof include known polymerization initiators (preferably photopolymerization initiators). The composition for forming a plateable layer may contain a solvent. The type of solvent is not particularly limited, and examples thereof include water and organic solvents. Examples of the organic solvent include known organic solvents (for example, alcohol-based solvents, ester-based solvents, ketone-based solvents, halogen-based solvents, and hydrocarbon-based solvents). EXAMPLES

[0066] Example 1 The present invention will be described in more detail below with reference to examples. The materials, amounts, ratios, processing contents and processing procedures shown in the following examples can be appropriately changed without departing from the gist of the present invention, and the scope of the present invention should not be interpreted as being limited by the following examples.

[0067] (Preparation of the substrate) An optical PET film (Cosmoshine A4360, manufactured by Toyobo Co., Ltd.) having a thickness of 75 μm was prepared as a substrate 1.

[0068] (Formation of metal layer) On the first surface 1A of the prepared optical PET film, a 0.05 μm thick nickel layer was formed by sputtering as an underlayer for improving adhesion with metal, and then a 0.5 μm thick copper layer was vapor-deposited as a metal layer.

[0069] (Formation of multiple detection electrode connection terminals, multiple peripheral wiring, and multiple external connection terminals) A positive photosensitive resist was applied to the metal layer by roll coating to a thickness of about 2.00 μm, and dried at 110° C. for 2 minutes. Then, a photomask having an exposure pattern corresponding to the plurality of detection electrode connection terminals 12, the plurality of peripheral wirings 13, and the plurality of external connection terminals 14 was superposed, exposed to light by a high-pressure mercury lamp, and developed using an alkaline solution to form a photosensitive resist pattern corresponding to the plurality of detection electrode connection terminals 12, the plurality of peripheral wirings 13, and the plurality of external connection terminals 14. Next, the metal layer was etched with a ferric chloride (FeCl3) solution, and then washed with pure water. Finally, the photosensitive resist was peeled off to obtain the plurality of detection electrode connection terminals 12, the plurality of peripheral wirings 13, and the plurality of external connection terminals 14.

[0070] (Formation of the first protective layer) An ultraviolet-curable ink (UVF-10T (KAI) manufactured by Asahi Chemical Laboratory Co., Ltd.) was applied by screen printing onto the multiple peripheral wirings 13. Next, ultraviolet rays of 800 mJ / cm 2 were irradiated from a high-pressure mercury lamp onto the applied ultraviolet-curable ink. 2 The resin was irradiated with light and cured at 400 V for forming a first protective layer having a thickness of about 6.00 μm for protecting the peripheral wirings 13.

[0071] (Preparation of composition for forming plated layer) The following components were mixed to obtain a plating composition. Isopropanol 38 parts by weight Polybutadiene maleic acid (butadiene-maleic acid alternating copolymer, butadiene-derived repeating unit: maleic acid-derived repeating unit = 1:1 (molar ratio), manufactured by Polysciences Co., Ltd.) 4 parts by mass FAM-201 (bifunctional acrylamide, Fujifilm) 1 part by mass IRGACURE-OXE02 (oxime ester polymerization initiator, manufactured by BASF) 0.05 parts by mass

[0072] (Formation of plating layer) The above-mentioned plating layer forming composition was applied to the first surface 1A side of the substrate 1 with a bar to a thickness of about 0.30 μm to form a plating layer precursor layer. Next, after drying at 120° C. for 1 minute, a polypropylene protective film having a thickness of 12.00 μm was immediately attached to the surface of the plating layer precursor layer.

[0073] A photomask having an exposure pattern corresponding to the plurality of touch sensing electrodes 11 is placed on the plating layer precursor layer to which the protective film is attached, and ultraviolet rays of 30 mJ / cm are applied from a high-pressure mercury lamp. 2 Next, the protective film was peeled off from the surface of the plating layer precursor layer, and the layer was shower-washed with a 1 mass % aqueous sodium carbonate solution and subjected to alkaline development, thereby obtaining a plating layer 31 having a geometric pattern corresponding to the plurality of mesh-like touch sensing electrodes 11.

[0074] (Formation of touch sensing electrodes) Omni-Shield 1573 Activator (manufactured by Rohm and Haas Electronic Materials), which is a Pd catalyst imparting solution, was diluted to 3.6% by volume with pure water, and the pH was adjusted to 4 with 0.1 N hydrochloric acid. The substrate 1 on which the plating layer 31 was formed was immersed in the solution at a temperature of 45°C for 5 minutes, and then washed twice with pure water. Next, the substrate 1 was immersed in a 0.8% by volume aqueous solution of the reducing agent Circuposit PB Oxide Converter 60C (manufactured by Rohm and Haas Electronic Materials) at a temperature of 30°C for 5 minutes, and then washed twice with pure water to perform a Pd catalyst treatment. Next, the substrate 1 that had been subjected to the Pd catalyst treatment was immersed in an electroless plating solution containing 12 volume % of M agent, 6 volume % of A agent, and 10 volume % of B agent of CIRCUPOSIT 4500 (manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at a temperature of 40° C. for 50 minutes, and then washed with pure water to cover the plated layer 31 and form a plurality of touch sensing electrodes 11 electrically connected to a plurality of sensing electrode connection terminals 12.

[0075] In this manner, the touch sensor of Example 1 was obtained. The touch sensor of Example 1 had 50 touch detection electrodes 11 each having an electrode width of 2 mm along the X direction and an electrode length of 100 mm along the Y direction, 50 detection electrode connection terminals 12 connected to the 50 touch detection electrodes 11, 50 peripheral wirings 13 connected to the 50 detection electrode connection terminals 12, and 50 external connection terminals 14 connected to the 50 peripheral wirings 13.

[0076] Moreover, the line width W1 of the multiple thin metal wires M constituting the touch sensing electrode 11 was 1.50 μm, and the line width W2 and the inter-wire distance L2 of the multiple peripheral wires 13 were both 15.00 μm.

[0077] The line width W1 of the multiple thin metal wires M was calculated by measuring the line width W1 at multiple random locations while observing the multiple thin metal wires M with an optical microscope, and taking the arithmetic average of the measured values. The line width W2 of the multiple peripheral wirings 13 was also calculated in the same manner as the line width W1 of the multiple thin metal wires M. The inter-wire distance L2 of the multiple peripheral wirings 13 was calculated by measuring the inter-wire distance L2 at the location where the pair of peripheral wirings 13 was closest to each other for all combinations of adjacent pairs of peripheral wirings 13, and taking the arithmetic average of the measured values.

[0078] Example 2 The touch sensor of Example 2 was manufactured in the same manner as in Example 1, except that the average values ​​of the line width W2 and the inter-wire distance L2 of the multiple peripheral wires 13 were each set to 30.00 μm.

[0079] Comparative Example 1 The touch sensor of Comparative Example 1 was manufactured in the same manner as in Example 1, except that the multiple touch detection electrodes 11, the multiple detection electrode connecting terminals 12, the multiple peripheral wirings 13, and the multiple external connecting terminals 14 were formed together by a wet plating method using methods similar to those used in the steps of preparing a composition for forming a plated layer, forming a plated layer 31, and forming a touch detection electrode 11.

[0080] Comparative Example 2 The touch sensor of Example 2 was manufactured in the same manner as Comparative Example 1, except that the average values ​​of the line width W2 and the inter-wire distance L2 of the multiple peripheral wires 13 were each set to 30.00 μm.

[0081] For the thus manufactured touch sensors of Examples 1 and 2 and Comparative Examples 1 and 2, an evaluation for disconnection of the peripheral wiring was carried out as described below. (Evaluation of peripheral wiring breaks) The electrical resistance between the detection electrode connection terminal 12 and the external connection terminal 14 of each peripheral wiring 13 was measured, and touch sensors with one or more locations showing an electrical resistance value of 1 kΩ or more were determined to be defective. 100 identical touch sensors were manufactured, and the defect occurrence rate was calculated by dividing the number of defective products by 100, which is the total number of touch sensors, and was evaluated according to the following criteria. A rating of A indicates that the defect occurrence rate was low and breaks in multiple peripheral wirings 13 were sufficiently prevented, while ratings of B and C both indicate that the defect occurrence rate has practical problems. A: The defective product rate is less than 2%. B: The defective product rate is more than 2% and less than 5%. C: The defective product rate is over 5%.

[0082] Table 1 shows the evaluation results for Examples 1 and 2 and Comparative Examples 1 and 2. In the “Formation timing” column of Table 1, “formed separately” indicates that the multiple touch detection electrodes 11 were formed after the multiple detection electrode connection terminals 12, the multiple peripheral wirings 13, and the multiple external connection terminals 14 were formed, and “formed simultaneously” indicates that these were formed simultaneously.

[0083] [Table 1]

[0084] As shown in Table 1, the touch sensors of Examples 1 and 2 were both rated A for disconnection of the peripheral wiring 13, which indicates that disconnection of the multiple peripheral wirings 13 can be sufficiently prevented. In Examples 1 and 2, the metal layer is patterned by photolithography and then wet-etched to form the multiple peripheral wirings 13, which is believed to enable stable formation of undisconnected peripheral wirings 13.

[0085] On the other hand, the peripheral wiring 13 of the touch sensor of Comparative Example 1 was evaluated as having a break in its wiring, and the peripheral wiring 13 of the touch sensor of Comparative Example 2 was evaluated as having a break in its wiring. In the touch sensors of Comparative Examples 1 and 2, the peripheral wirings 13 are formed by a wet plating method, and therefore, it is considered that the peripheral wirings 13 are often formed in a broken state, for example, due to air bubbles or impurities generated during the plating process being disposed in the plated layer 31 corresponding to the peripheral wirings 13. In particular, in the touch sensor of Comparative Example 1, the peripheral wiring 13 has a narrow line width W2 of 15.00 μm, and therefore, it is considered that the peripheral wiring 13 is more likely to break than the touch sensor of Comparative Example 2, in which the peripheral wiring 13 has a line width W2 of 30.00 μm.

[0086] The present invention is basically configured as described above. Although the touch sensor of the present invention has been described in detail above, the present invention is not limited to the above-mentioned embodiment, and various improvements or modifications may be made without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0087] 1 substrate, 1A first surface, 1B second surface, 2 first conductive layer, 3 second conductive layer, 11, 21 touch detection electrode, 12, 22 detection electrode connection terminal, 13, 23 peripheral wiring, 14, 24 external connection terminal, 31 plated layer, 31A side portion, L2 distance between wirings, M thin metal wire, R1 detection area, R2 peripheral area, W1, W2 line width.

Claims

1. providing a substrate including a sensing region and a peripheral region disposed around the sensing region; forming a metal layer on the peripheral region of the substrate; forming a pattern of a photosensitive resist on a surface of the metal layer by photolithography, and performing wet etching on the metal layer to form a plurality of detection electrode connection terminals, a plurality of external connection terminals, and a plurality of peripheral wirings connecting the plurality of detection electrode connection terminals and the plurality of external connection terminals to each other; forming a plating layer including a pattern formed of a plurality of thin wires, the plating layer being formed in the detection region of the substrate and extending so as to cover at least a portion of each of the plurality of detection electrode connection terminals; and forming a plurality of touch sensing electrodes electrically connected to the plurality of sensing electrode connection terminals on the plating layer by a wet plating method. A method for manufacturing a touch sensor.

2. The method further includes a step of forming a first protective layer covering at least the peripheral wirings between the step of forming the plurality of detection electrode connection terminals, the plurality of external connection terminals, and the plurality of peripheral wirings and the step of forming the plated layer. The method for manufacturing the touch sensor according to claim 1 .

3. forming a second protective layer covering the plurality of touch sensing electrodes. The method for manufacturing the touch sensor according to claim 2 .

4. The composition of the first protective layer and the composition of the second protective layer are different from each other. The method for manufacturing the touch sensor according to claim 3 .

5. The plating layer is formed by a photolithography method. The method for manufacturing the touch sensor according to claim 1 .

6. A substrate including a detection region and a peripheral region disposed around the detection region; a plurality of detection electrode connection terminals disposed in the peripheral region of the substrate; A plurality of external connection terminals arranged in the peripheral region of the substrate; peripheral wiring arranged in the peripheral region of the substrate and connecting the plurality of detection electrode connection terminals and the plurality of external connection terminals to each other; a plating layer including a pattern formed of a plurality of thin wires, the plating layer being formed in the detection region of the substrate and extending so as to cover at least a portion of each of the plurality of detection electrode connection terminals; a touch sensing electrode disposed on at least a portion of each of the plurality of sensing electrode connection terminals and the plating layer and electrically connected to the plurality of sensing electrode connection terminals; Touch sensor.

7. The distance between adjacent peripheral wirings is 15 μm or less. The touch sensor according to claim 6.

8. The layer to be plated contains an organic substance as a main component and a palladium catalyst. The touch sensor according to claim 6 . 。

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