Ultrasonic imaging device

Abstract

To provide an ultrasonic imaging device having a plurality of probes for which the restrictions on the probe to attached was improved.SOLUTION: An ultrasonic imaging device that irradiates a multilayered semiconductor object with an ultrasonic wave to acquire a reflection wave and visualizes the layered interface of the object, comprises a controller, a first three-axis scanner 10 and a second three-axis scanner 20 arranged on a stage 35, a first probe 15 held in a first probe holder 14 attached to the first three-axis scanner 10 and irradiating the object with an ultrasonic wave by a first irradiation method, and a second probe 25 held in a second probe holder 24 attached to the second three-axis scanner 20 and irradiating the object with an ultrasonic wave by a second irradiation method. The ultrasonic imaging device irradiates the object with ultrasonic wave with either the first probe 15 or the second probe 25.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an ultrasound imaging device. [Background technology]

[0002] An ultrasonic imaging device irradiates ultrasonic waves from a probe onto an object to be inspected (a specimen), receives the reflected waves, and images the interface of the object. Non-Patent Document 1 proposes an ultrasonic imaging device having a twin probe that is equipped with both a single probe using a single scan method for high-definition measurement and an array probe using an electronic scan method for high-speed measurement. This makes it possible to eliminate the need for probe replacement, improving work efficiency. [Prior art documents] [Non-patent literature]

[0003] [Non-Patent Document 1] Ultrasonic imaging device FineSAT Hybrid, [online], May 22, 2023, Internet<URL:1687936011170_0.html> Summary of the Invention [Problem to be solved by the invention]

[0004] The technology disclosed in Non-Patent Document 1 has been widely used, but since a single probe and an array probe are attached to one three-axis scanner at the same time, there is a restriction that an array probe with a large mass cannot be attached due to the load-bearing capacity of the three-axis scanner. Therefore, there is a problem that it is not possible to meet the needs to have multiple probes and to scan an object at higher speed with an array probe.

[0005] SUMMARY OF THE PRESENT INVETION The present invention has been made in consideration of the above-mentioned problems, and an object of the present invention is to provide an ultrasonic imaging apparatus having a plurality of probes which overcomes the limitations on the probes that can be attached. [Means for solving the problem]

[0006] In order to achieve the above object, the ultrasonic imaging device of the present invention is an ultrasonic imaging device that irradiates ultrasonic waves to an object of semiconductors stacked in multiple layers, acquires the reflected waves, and images the stacking interface of the object, and is characterized in that it includes a control device, a first three-axis scanner and a second three-axis scanner arranged on a stage, a first probe attached to a first probe holder, held by the first probe holder, and irradiating the object with the ultrasonic waves by a first irradiation method, and a second probe attached to a second three-axis scanner, held by the second probe holder, and irradiating the object with the ultrasonic waves by a second irradiation method, and is characterized in that the ultrasonic waves are irradiated to the object by either the first probe or the second probe. Other aspects of the present invention will be described in the embodiments described later. Effect of the Invention

[0007] According to the present invention, it is possible to provide an ultrasonic imaging apparatus having a plurality of probes, which overcomes the limitations on the probes that can be attached. [Brief description of the drawings]

[0008] [Figure 1] 1 is a diagram showing the configuration of an ultrasonic imaging device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a diagram illustrating details of a scanning unit according to the present embodiment. [Diagram 3] FIG. 2 is a diagram showing an example of a combination of a first three-axis scanner and a second three-axis scanner. [Figure 4] 13 is a flowchart illustrating an example of a scanning process of an ultrasonic imaging device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment for carrying out the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a diagram showing the configuration of an ultrasonic imaging device 100 according to this embodiment. The ultrasonic imaging device 100 includes a control device 50, a scanning unit 30 (mechanical unit), and ultrasonic probes (a first probe 15 and a second probe 25 (see FIG. 2)). The ultrasonic imaging device 100 irradiates ultrasonic waves to irradiation points set at predetermined intervals within an inspection range of an object via a probe, acquires reflected waves, extracts interface echoes showing waveforms of the bonded interface to be inspected from the reflected waves, performs a process for generating pixelated information from the signal intensity of the interface echo for all irradiation points or specific irradiation points, and generates an image of the bonded interface based on the generated pixelated information for the irradiation points to find defects.

[0010] The control device 50 has a processing unit 51 that controls the scanning position of the ultrasonic probe and controls the transmission and reception of ultrasonic waves, an image generation unit 52 that acquires reflected waves from the first probe 15 and the second probe 25 and generates an ultrasonic image, and an input / output unit 53.

[0011] The scanning unit 30 includes a first three-axis scanner 10 and a second three-axis scanner 20 on a stage 35. A first probe holder 14 is attached to the first three-axis scanner 10, and a second probe holder 24 is attached to the second three-axis scanner 20. The first three-axis scanner 10 is controlled via a first control unit 19, and the second three-axis scanner 20 is controlled via a second control unit 29.

[0012] Fig. 2 is a diagram showing details of the scanning unit 30 according to this embodiment. Fig. 2 shows a combination of the first three-axis scanner 10 and the second three-axis scanner 20 as viewed from above. In the scanning unit 30, a first X-axis drive shaft 11 and a second X-axis drive shaft 21 are arranged on a stage 35 so as to face each other at one end of the stage 35, and a first Y-axis drive shaft 12 and a second Y-axis drive shaft 22 are arranged so as to face each other at the other end.

[0013] The first X-axis drive shaft 11 is supported by a first Y-axis drive shaft 12 and a first Y-axis guide 13. Similarly, the second X-axis drive shaft 21 is supported by a second Y-axis drive shaft 22 and a second Y-axis guide 23. Details will be described later with reference to FIG.

[0014] A first probe holder 14 is placed on the first X-axis drive shaft 11, and a first Z-axis drive shaft 18 is connected to the first probe holder 14. A first probe 15 is fixedly disposed on the first Z-axis drive shaft 18 via a probe fixing part that can adjust its position in the Z-axis direction. The first probe 15 irradiates an object such as a semiconductor with ultrasonic waves by a first irradiation method.

[0015] A second probe holder 24 is placed on the second X-axis drive shaft 21, and a second Z-axis drive shaft 28 is connected to the second probe holder 24, and a second probe 25 is fixedly disposed on the second Z-axis drive shaft 28 via a probe fixing part that can adjust the position in the Z-axis direction. The second probe 25 irradiates an object such as a semiconductor with ultrasonic waves by a second irradiation method.

[0016] The first probe 15 operates within a range of a first XY plane defined by an operating range in the X-axis direction in which the first X-axis drive shaft 11 operates and an operating range in the Y-axis direction in which the first Y-axis drive shaft 12 operates, and having a first origin 17 as its origin.

[0017] The second probe 25 operates within a range of a second XY plane formed by an operating range in the X-axis direction in which the second X-axis drive shaft 21 operates and an operating range in the Y-axis direction in which the second Y-axis drive shaft 22 operates, and having a second origin 27 as its origin.

[0018] The first XY plane and the second XY plane have a common range (common scan range 37), which is the operable scan range when the first probe 15 or the second probe 25 is the operating probe in an operational state.

[0019] In the case of Fig. 2, the first triaxial scanner 10 (see Fig. 1) and the second triaxial scanner 20 (see Fig. 1) are arranged point-symmetrically in plan view with respect to the center of the common scan range 37. However, this is not necessarily limited to this.

[0020] When the control device 50 determines that the first probe 15 is an operating probe, it gives an operating command signal to the first X-axis drive shaft 11, the first Y-axis drive shaft 12, and the first Z-axis drive shaft 18 of the first three-axis scanner 10 via the first control unit 19, drives them the required amount, moves the first probe 15 to a target position, issues a command to the first probe 15 to emit ultrasound waves and irradiates them to the target object, and captures the reflected waves from the target received by the first probe 15 to generate an image of the ultrasound irradiated surface of the target.

[0021] In addition, when the control device 50 sets the second probe 25 as the operating probe, it gives an operation command signal to the second X-axis drive axis 21, the second Y-axis drive axis 22, and the second Z-axis drive axis 28 of the second three-axis scanner 20 via the second control unit 29, drives them by the required amount, moves the second probe 25 to the target position, issues a command to the second probe 25 to emit ultrasound waves and irradiate them to the target object, and captures the reflected waves from the target received by the second probe 25 to generate an image of the ultrasound irradiated surface of the target.

[0022] 3 is a diagram showing an example of a combination of a first three-axis scanner 10 and a second three-axis scanner 20. The first three-axis scanner 10 includes a first X-axis drive shaft 11, a first Y-axis drive shaft 12, a first Y-axis guide 13, and a first Z-axis drive shaft 18. The first X-axis drive shaft 11 can be moved in the Y-axis direction by the first Y-axis drive shaft 12 and the first Y-axis guide 13 via first X-axis supports 11a and 11b.

[0023] The second three-axis scanner 20 includes a second X-axis drive shaft 21, a second Y-axis drive shaft 22, a second Y-axis guide 23, and a second Z-axis drive shaft 28. The second X-axis drive shaft 21 can move in the Y-axis direction by the second Y-axis drive shaft 22 and the second Y-axis guide 23 via second X-axis supports 21a and 21b.

[0024] A combination of the first three-axis scanner 10 and the second three-axis scanner 20 is shown in configuration example 38. In configuration example 38, it can be seen that two sets of three-axis scanners can be combined without interfering with each other in their range of motion.

[0025] Fig. 4 is a flow chart showing an example of the scan process S60 of the ultrasonic imaging device 100. The selection of the first probe 15 and the second probe 25 will be described in detail with reference to Fig. 4. When the operator turns on the power of the ultrasonic imaging device 100, the control device 50 gives a standby command signal to the first triaxial scanner 10 and the second triaxial scanner 20 to make the first probe holder 14 (including the first probe 15; the same applies below) and the second probe holder 24 (including the second probe 25; the same applies below) wait at the first standby position 16 and the second standby position 26, respectively.

[0026] (Process S61) When an operator gives a first probe selection signal to the ultrasonic imaging device 100, the control device 50 gives an operation command signal to the first three-axis scanner 10 to set the first probe holder 14 to the first origin 17. After that, the operator scans the object with the first probe 15.

[0027] Specifically, the control device 50 receives a first probe selection signal, operates the first three-axis scanner 10, sets the array probe as the working probe at the first origin 17, and then scans the entire surface of the target with the array probe. When a defect or the like is confirmed, the X and Y coordinates are stored as the return position.

[0028] (Process S62) When the operator applies a second probe selection signal to the ultrasound imaging device, the control device 50 applies a standby command signal to the first three-axis scanner 10 to move the first probe holder 14 to the first standby position 16 and hold it there, and applies a return command signal to the second three-axis scanner 20 to set the second probe holder 24 to a predetermined return position.

[0029] Specifically, the control device 50 receives a second probe selection signal, provides a standby command signal to the first three-axis scanner 10 to cause the array type probe to wait in a standby position as a standby probe, operates the second three-axis scanner 20 to set the single type probe to a return position as a working probe, and then generates a high-definition image using the single type probe.

[0030] (Process S63) When a plurality of return positions are stored, the second three-axis scanner 20 is operated to set the single probe as the working probe at the return position, and then a high-definition image is generated by the single probe.

[0031] The first probe holder 14 and the second probe holder 24 may move in the opposite direction. That is, when the operator gives a second probe selection signal to the ultrasonic imaging device 100, the control device 50 gives an operation command signal to the second three-axis scanner 20 to set the second probe holder 24 to the second origin 27. After that, the operator scans the object with the second probe. When the operator gives a first probe selection signal to the ultrasonic imaging device 100, the control device 50 gives a standby command signal to the second three-axis scanner 20 to move the second probe holder 24 to the second standby position 26 to make it wait, and gives a return command signal to the first three-axis scanner 10 to set the first probe holder 14 to a predetermined return position.

[0032] In addition, the first standby position 16 is set at a predetermined position on the first X-axis drive shaft 11 or the first Y-axis drive shaft 12, and the second standby position 26 is set at a predetermined position on the second X-axis drive shaft 21 or the second Y-axis drive shaft 22.

[0033] This ensures that when either the first probe 15 or the second probe 25 is in operation, the other probe will not come into contact with it, i.e., the axes are set outside the common scan range 37.

[0034] As an actual use example, an array type probe having a plurality of transducers and irradiating an object with ultrasonic waves in an array manner as a first irradiation method is selected as the first probe 15, and a single type probe having a single transducer and irradiating an object with a single ultrasonic wave as a second irradiation method is selected as the second probe 25. Note that the first probe 15 and the second probe 25 may have the reversed configuration.

[0035] Compared to a single-type probe, an array-type probe has a faster scanning speed by electronically scanning the number of transducers in the Y-axis direction. Compared to an array-type probe, a single-type probe can use a higher frequency, making it possible to generate higher-resolution images.

[0036] The scanning process will now be described. An operator applies a first probe selection signal to the ultrasonic imaging device, and the ultrasonic imaging device 100 applies an operation command signal to the first three-axis scanner 10 to select the array type probe as the operating probe and quickly scans the entire surface of the object. During this process, if the presence of a defect or the like is confirmed in the object, the position is set as the return position and the X-coordinate and Y-coordinate are stored in the memory unit in the control device.

[0037] Next, the operator applies a second probe selection signal to the ultrasonic imaging device. The ultrasonic imaging device 100 applies a standby command signal to the first three-axis scanner 10 to set the array probe as the standby probe, and moves it to the first standby position 16 to wait. The ultrasonic imaging device 100 applies an operation command signal to the second three-axis scanner 20 to select the single probe as the operating probe, sets it to the return position, scans the object, and generates a high-definition image of the defect.

[0038] In this example of the scanning method, the return position at which the second probe 25 is set as the operating probe when switching the operating probe from the first probe 15 to the second probe 25 is set to the position immediately before the first probe 15 waits as a standby probe, but the return position may also be set as follows.

[0039] When the first probe 15 is the working probe, the second origin 27 of the second XY plane is set, and when the second probe 25 is the working probe, the first origin 17 of the first XY plane or the center position of the object is set. These may be set according to the operating conditions when inspecting the object in a test operation prior to actual operation of the ultrasonic imaging device.

[0040] Moreover, the Z-axis direction of the first probe holder 14 and the second probe holder 24 is determined according to the inspection conditions in a test operation so that the probe tips do not come into contact with the target object.

[0041] As described above, the ultrasonic imaging device 100 of this embodiment has the following features. (1) An ultrasonic imaging device 100 for irradiating an ultrasonic wave to an object of semiconductors stacked in multiple layers, acquiring the reflected waves, and imaging the stacking interface of the object, comprising a control device 50, a first triaxial scanner 10 and a second triaxial scanner 20 arranged on a stage 35, a first probe 15 attached to a first triaxial scanner 10 and held by the first probe holder 14 to irradiate ultrasonic waves to the object by a first irradiation method, and a second probe 25 attached to a second triaxial scanner 20 and held by the second probe holder 24 to irradiate ultrasonic waves to the object by a second irradiation method, and irradiating ultrasonic waves to the object by either the first probe 15 or the second probe 25. This makes it possible to provide an ultrasonic imaging device having multiple probes that alleviates the restrictions on the probes to be attached.

[0042] (2) In the ultrasonic imaging device 100 of (1) above, when the ultrasonic imaging device 100 is powered on, the control device 50 issues a standby command signal to the first three-axis scanner 10 and the second three-axis scanner 20 to cause the first probe holder 14 and the second probe holder 24 to wait at the first standby position 16 and the second standby position 26, respectively; when the control device 50 receives a first probe selection signal, it issues an operation command signal to the first three-axis scanner 10 to set the first probe holder 14 at the first origin 17 to scan the object; when the control device 50 receives a second probe selection signal, it issues a standby command signal to the first three-axis scanner 10 to move the first probe holder 14 to the first standby position 16 to cause it to wait; and when the control device 50 receives an operation command signal to the second three-axis scanner 20 to set the second probe holder 24 to a predetermined return position.

[0043] (3) The ultrasonic imaging device 100 of (2) above is provided with a first X-axis drive shaft 11 and a first Y-axis drive shaft 12 for driving a first three-axis scanner 10, and a second X-axis drive shaft 21 and a second Y-axis drive shaft 22 for driving a second three-axis scanner 20, on a stage 35. A first XY plane is formed by the X-axis direction range in which the first X-axis drive shaft 11 operates and the Y-axis direction range in which the first Y-axis drive shaft 12 operates, and a second XY plane is formed by the X-axis direction range in which the second X-axis drive shaft 21 operates and the Y-axis direction range in which the second Y-axis drive shaft 22 operates, forming a scan range (common scan range 37) which is a common range in which the movable probes move.

[0044] (4) In the ultrasonic imaging device 100 of (3), the first X-axis drive shaft 11 and the second X-axis drive shaft 21 are arranged to face each other at one end of the stage 35, and the first Y-axis drive shaft 12 and the second Y-axis drive shaft 22 are arranged to face each other at the other end of the stage 35. The control device 50 sets the first standby position 16 to a predetermined position on the first X-axis drive shaft 11 or the first Y-axis drive shaft 12 outside the vicinity of the scan range, and sets the second standby position 26 to a predetermined position on the second X-axis drive shaft 21 or the second Y-axis drive shaft 22 outside the vicinity of the scan range.

[0045] (5) In the ultrasonic imaging device 100 of (3) above, in a test operation prior to actual operation of the ultrasonic imaging device 100, the return position is set based on the operating conditions of the ultrasonic imaging device 100 to a position just before the operating probe is switched to a standby probe and the operating probe waits at the standby position, or to the center position of the object, or to the second origin 27 of the second XY plane when the first probe 15 is the operating probe, or to the first origin 17 of the first XY plane when the second probe 25 is the operating probe.

[0046] (6) In the ultrasonic imaging device 100 of (1) above, when the first probe 15 is an array type probe having a plurality of transducers, the second probe 25 is a single type probe having a single transducer, and when the first probe 15 is a single type probe, the second probe 25 is an array type probe. This makes it possible to quickly select between the array type probe and the single type probe without the need for an operator of the ultrasonic imaging device 100 to replace the probe. As a result, the array type probe can be used to image defects in the multilayer semiconductor, and the array type probe can be put into a standby state without the need for replacement work, and the single type probe can be operated to obtain detailed images.

[0047] The present invention is not limited to the above-described embodiment, but includes various modified examples. The above-described embodiment has been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to those including all of the configurations described. It is also possible to add, delete, or replace part of the configuration of each embodiment with other configurations. [Explanation of symbols]

[0048] 10 First 3-axis scanner 11 1st X-axis drive shaft 12 1st Y-axis drive shaft 13 First Y-axis guide 14 First probe holder 15 First Probe 16 First standby position 17 The First Origin 18 1st Z-axis drive shaft 19 First control section 20 Second 3-axis scanner 21 Second X-axis drive shaft 22 Second Y-axis drive shaft 23 Second Y-axis guide 24 Second Probe Holder 25 Second Probe 26 Second standby position 27 The Second Origin 28 Second Z-axis drive shaft 29 Second control section 30 Scanning section 35 Stages 37 Common Scan Areas 50 Control device 51 Processing section 52 Image Generation Unit 53 Input / output section 100 Ultrasound imaging device

Claims

1. 1. An ultrasonic imaging device for irradiating an ultrasonic wave onto a multi-layered semiconductor object, acquiring the reflected wave, and imaging a layer interface of the object, comprising: A control device; a first three-axis scanner and a second three-axis scanner disposed on a stage; a first probe holder attached to the first three-axis scanner, and a first probe held by the first probe holder to irradiate the object with the ultrasonic waves by a first irradiation method; a second probe holder is attached to the second three-axis scanner, and a second probe is held by the second probe holder and irradiates the object with the ultrasonic waves by a second irradiation method; 2. An ultrasonic imaging apparatus comprising: a first probe and a second probe for irradiating the object with ultrasonic waves;

2. 2. The ultrasonic imaging device according to claim 1, The control device includes: when the power supply of the ultrasonic imaging device is turned on, a standby command signal is given to the first triaxial scanner and the second triaxial scanner, and the first probe holder and the second probe holder are caused to wait at a first standby position and a second standby position, respectively; upon receiving a first probe selection signal, providing an operation command signal to the first three-axis scanner to set the first probe holder to a first origin and scan the object; When the second probe selection signal is received, a standby command signal is given to the first three-axis scanner to move the first probe holder to the first standby position and make the first probe holder wait there, and a run command signal is given to the second three-axis scanner to set the second probe holder to a predetermined return position.

1. An ultrasonic imaging device comprising:

3. 3. The ultrasonic imaging device according to claim 2, On the stage, a first X-axis drive shaft and a first Y-axis drive shaft for driving the first three-axis scanner; a second X-axis drive shaft and a second Y-axis drive shaft for driving the second three-axis scanner; A first XY plane formed by the range in the X-axis direction in which the first X-axis drive shaft operates and the range in the Y-axis direction in which the first Y-axis drive shaft operates, and a second XY plane formed by the range in the X-axis direction in which the second X-axis drive shaft operates and the range in the Y-axis direction in which the second Y-axis drive shaft operates form a scan range, which is a common range in which the movable probe moves.

1. An ultrasonic imaging device comprising:

4. 4. The ultrasonic imaging device according to claim 3, the first X-axis drive shaft and the second X-axis drive shaft are disposed to face each other at one end of the stage, the first Y-axis drive shaft and the second Y-axis drive shaft are disposed to face each other at the other end of the stage, The control device includes: The first standby position is set at a predetermined position on the first X-axis drive axis or the first Y-axis drive axis near and outside the scanning range; The second standby position is set to a predetermined position on the second X-axis drive axis or the second Y-axis drive axis outside the vicinity of the scan range.

1. An ultrasonic imaging device comprising:

5. 4. The ultrasonic imaging device according to claim 3, In a test operation prior to actual operation of the ultrasonic imaging device, the return position is set based on an operating condition of the ultrasonic imaging device, The working probe is switched to a standby probe, and the working probe is placed in a position immediately before waiting at the standby position. Or, at the center position of the object, or to a second origin of the second XY plane when the first probe is the working probe, and to a first origin of the first XY plane when the second probe is the working probe; It is set 1. An ultrasonic imaging device comprising:

6. 2. The ultrasonic imaging device according to claim 1, when the first probe is an array type probe having a plurality of transducers, the second probe is a single type probe having a single transducer, When the first probe is the single type probe, the second probe is the array type probe.

1. An ultrasonic imaging device comprising:

Images