Liquid jet head and liquid jet device

Abstract

To reduce the number of components of a liquid jet head.SOLUTION: A liquid jet head 10 includes a first head chip 70-1 having a first nozzle plate 74-1 having a plurality of first nozzles N1-1 for jetting a liquid and a first flow channel communicating with at least the one first nozzle N1-1, a second head chip 70-2 having a second nozzle plate 74-2 having a plurality of second nozzles N2-1 for jetting a liquid and a second flow channel communicating with at least one second nozzle N2-2, and a fixation plate 29 having a first surface Ha constituting an outer surface of the liquid jet head 10 and a second surface Hb which is a surface opposite to the first surface Ha and where the first head chip 70-1 and the second head chip 70-2 are fixed, wherein the second surface Hb of the fixation plate 29 defines a part of the first flow channel and a part of the second flow channel.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a liquid ejection head and a liquid ejection apparatus. [Background technology]

[0002] Patent document 1 discloses a liquid ejection head including a plurality of head chips, a holder for accommodating the plurality of head chips, and a fixing plate to which the plurality of head chips are fixed in an aligned state. The head chip according to Patent Document 1 includes a nozzle plate having a plurality of nozzles for ejecting liquid, a flow path substrate on which the nozzle plate is laminated and which defines a portion of a liquid flow path communicating with the plurality of nozzles, a sealing plate which is fixed to the flow path substrate so as to close an opening formed in the flow path substrate and thereby defines a portion of the liquid flow path, and a support body which is disposed on the opposite side of the sealing plate to the flow path substrate. The head chip and the fixing plate are fixed by fixing the support body to the fixing plate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-89310 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the conventional liquid jet head, it has been desired to reduce the number of parts that constitute the liquid jet head. [Means for solving the problem]

[0005] A liquid jet head according to one embodiment of the present invention is a liquid jet head comprising: a first head chip having a first nozzle plate having a plurality of first nozzles for ejecting liquid and a first flow path communicating with at least one of the first nozzles; a second head chip having a second nozzle plate having a plurality of second nozzles for ejecting liquid and a second flow path communicating with at least one of the second nozzles; and a fixed plate having a first surface that constitutes an outer surface of the liquid jet head and a second surface opposite to the first surface to which the first head chip and the second head chip are fixed, wherein the second surface of the fixed plate defines a portion of the first flow path and a portion of the second flow path.

[0006] A liquid ejection apparatus according to one aspect of the present invention includes the liquid ejection head described above, and a liquid storage unit that stores liquid to be supplied to the liquid ejection head. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a partial configuration diagram of a liquid ejecting apparatus according to a first embodiment. [Diagram 2] FIG. 1 is an external perspective view of a liquid jet head 10. [Diagram 3] FIG. 2 is an exploded perspective view of the liquid jet head 10. [Figure 4] FIG. 4 is a plan view of the fixed plate 29 and the nozzle plate 74 in the XY plane. [Diagram 5] FIG. 4 is a schematic diagram showing examples of each flow path. [Figure 6] FIG. 3 is a cross-sectional view of the head chip 70-1. [Figure 7] FIG. 3 is a cross-sectional view of the head chip 70-1. [Figure 8] FIG. 4 is a plan view of a flow path forming substrate 71 as viewed in the Z-axis direction. [Figure 9] FIG. 4 is an enlarged view of the vicinity of the nozzle N1-1 and the nozzle N1-2. [Figure 10] FIG. 4 is an enlarged view of the vicinity of the nozzle N1-1 and the nozzle N1-2. [Figure 11] FIG. 4 is an enlarged view of the vicinity of the nozzle N1-1 and the nozzle N1-2. [Figure 12] FIG. 4 is an enlarged view of the vicinity of the nozzle N1-1 and the nozzle N1-2. [Figure 13] FIG. 4 is a cross-sectional view of the head chip 70-1A. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, the embodiments for carrying out the present invention will be described with reference to the drawings. However, in each drawing, the dimensions and scale of each part are appropriately different from the actual ones. In addition, since the embodiments described below are preferred specific examples of the present invention, various technically preferable limitations are attached, but the scope of the present invention is not limited to these embodiments unless otherwise specified in the following description to the effect that the present invention is limited.

[0009] 1: First embodiment A liquid ejecting apparatus 100 according to this embodiment will be described below with reference to FIGS.

[0010] 1-1: Overview of the liquid ejection device 100 Fig. 1 is a partial configuration diagram of a liquid ejection device 100 according to a first embodiment of the present invention. The liquid ejection device 100 according to the first embodiment is an inkjet printing device that ejects ink, which is an example of a liquid, onto a medium 11 such as printing paper. The liquid ejection device 100 shown in Fig. 1 includes a control device 12, a transport mechanism 14, a carriage 18, and a liquid ejection head 10. The control device 12 comprehensively controls each element of the liquid ejection device 100.

[0011] The transport mechanism 14 transports the medium 11 in the +Y direction, which is the sub-scanning direction, under the control of the control device 12. The carriage 18 reciprocates in the X-axis direction, which is the main scanning direction, under the control of the control device 12. The liquid ejection head 10 ejects ink onto the medium 11 in parallel with the transport of the medium 11 and the reciprocation of the carriage 18, thereby forming a desired image on the surface of the medium 11. Note that, hereinafter, a direction perpendicular to the XY plane, which is a direction parallel to the surface of the medium 11, is referred to as the Z-axis direction. The direction in which ink is ejected by the liquid ejection head 10 corresponds to the +Z direction.

[0012] The carriage 18 is provided with a liquid storage section 182 that stores a plurality of liquid containers C1 to C4 that separately store a plurality of types of ink. The ink is a liquid that contains coloring materials such as pigments and dyes, and is a total of four colors of liquid, for example, cyan (C), magenta (M), yellow (Y), and black (K). It is also possible to include a resin material in the ink. The liquid containers C1 to C4 of this embodiment store cyan (C), magenta (M), yellow (Y), and black (K) inks, respectively. The liquid ejection head 10 is attached below the liquid storage section 182 of the carriage 18. It is to be noted that the configuration and number of the liquid containers C1 to C4 are not limited to those illustrated.

[0013] The liquid jet head 10 includes a plurality of head chips 70. Each head chip 70 includes one nozzle plate 74 and is a flow path structure including a flow path member in which a flow path is formed inside. In this embodiment, a case where four head chips 70-1 to 70-4 are arranged along the X-axis direction is illustrated. The liquid containers C1 to C4 and the head chips 70-1 to 70-4 correspond one-to-one to each other. Two nozzle rows L are arranged on each of the head chips 70. That is, one nozzle plate 74 has two nozzle rows L arranged side by side in the X-axis direction. Each nozzle row L is a collection of a plurality of nozzles N linearly arranged along the Y-axis direction. The number and arrangement of the head chips 70 and the nozzle rows L are not limited to those illustrated. The liquid jet head 10 includes a flow path through which the ink flows and a filter (not shown) that filters the ink flowing through the flow path. Each head chip 70 in this embodiment has a common structure. The plurality of head chips 70 having a common structure means that, for example, even if the head chip 70-1 and the head chip 70-2 are arranged so as to be interchangeable, the function of the liquid ejecting head 10 does not change.

[0014] Fig. 2 is an external perspective view of the liquid jet head 10, and Fig. 3 is an exploded perspective view of the liquid jet head 10. As shown in Fig. 2 and Fig. 3, the liquid jet head 10 in this embodiment includes a holder G, a plurality of head chips 70, a fixing plate 29, and a plurality of screws 24. The holder G supplies inks (C, M, Y, K) from liquid containers C1 to C4 to each of the head chips 70-1 to 70-4.

[0015] As shown in FIG. 6, the holder G is a flow path structure formed by stacking a first laminate substrate G1, a second laminate substrate G2, a third laminate substrate G3, a fourth laminate substrate G4, and a fifth laminate substrate G5 in this order in the Z-axis direction from the -Z side to the +Z side. An ink flow path is formed inside the holder G, which will be described in detail later with reference to FIG. 6. In addition, as shown in FIG. 2 and FIG. 3, the holder G is formed by accommodating each component in a space formed by the first laminate substrate G1 and the fifth laminate substrate G5 that constitute the outer surface of the liquid jet head 10. Each of the first laminate substrate G1 to the fifth laminate substrate G5 is integrally formed, for example, by injection molding of a resin material. The first laminate substrate G1 to the fifth laminate substrate G5 are fixed by a plurality of screws 24.

[0016] 6, a relay board 26 is accommodated in the space formed by the first laminate board G1 and the fifth laminate board G5. The relay board 26 is laminated, for example, between the first laminate board G1 and the fifth laminate board G5 on the -Z side surface of any one of the second laminate board G2 to the fifth laminate board G5.

[0017] Relay board 26 is a board that relays drive signals and other control signals sent from control device 12. Relay board 26 is formed with four terminal parts (not shown) that are electrically connected to wiring boards 78-1 to 78-4 of head chips 70-1 to 70-4, respectively, and is also mounted with a connector 264 and other electronic components for connection to control device 12. In addition, a wiring member such as an FFC (Flexible Flat Cable) is connected to connector 264, and relay board 26 receives drive signals from control device 12 via the FFC.

[0018] The fifth laminated substrate G5 includes a flow path forming portion 234 in which a flow path is formed, and an annular outer peripheral wall portion 236 provided so as to protrude from the flow path forming portion 234 to the +Z side. The surface of the flow path forming portion 234 facing the +Z direction, the inner peripheral surface of the outer peripheral wall portion 236, and a second surface Hb of the fixing plate 29 described later define the storage space S. In this embodiment, four head chips 70-1 to 70-4 are arranged in parallel in the storage space S along the X-axis direction perpendicular to the transport direction of the medium 11. Each piezoelectric element 732 described later provided on the head chips 70-1 to 70-4 vibrates in response to a drive signal supplied from the control device 12 via the relay substrate 26 and the wiring substrate 78. The flow path forming portion 234 and the outer peripheral wall portion 236 may be provided on separate laminated substrates, that is, the holder G may include a laminated substrate that constitutes the outer peripheral wall portion 236 in which no flow path is formed.

[0019] The fixed plate 29 is a flat plate-like member. The fixed plate 29 has a first surface Ha facing the +Z direction in which the liquid is ejected from the nozzles N, and a second surface Hb opposite to the first surface Ha. FIG. 5 shows a plan view of the fixed plate 29 and the nozzle plate 74 in the XY plane when viewed in the -Z direction. The fixed plate 29 has four rectangular openings 292-1 to 292-4 elongated in the Y direction, which correspond to the nozzle plates 74 described later and provided in each of the head chips 70-1 to 70-4, formed for each head chip 70. The head chips 70-1 to 70-4 are fixed to the -Z side of the fixed plate 29 with the nozzle plates 74-1 to 74-4 described later of the head chips 70-1 to 70-4 positioned inside the openings 292-1 to 292-4. Openings 292-1 to 292-4 and head chips 70-1 to 70-4 correspond one-to-one to one another. Head chips 70-1 to 70-4 are fixed to second surface Hb of fixed plate 29 with, for example, an adhesive. As a result, nozzles N of each nozzle row L are disposed in openings 292-1 to 292-4, respectively. When openings 292-1 to 292-4 are not to be distinguished from one another, they are simply referred to as openings 292.

[0020] As shown in FIG. 4, the nozzle plate 74-1 is formed with a nozzle row L1-1 composed of a plurality of nozzles N1-1 and a nozzle row L1-2 composed of a plurality of nozzles N1-2. The nozzle plate 74-2 is formed with a nozzle row L2-1 composed of a plurality of nozzles N2-1 and a nozzle row L2-2 composed of a plurality of nozzles N2-2. The nozzle plate 74-3 is formed with a nozzle row L3-1 composed of a plurality of nozzles N3-1 and a nozzle row L3-2 composed of a plurality of nozzles N3-2. The nozzle plate 74-4 is formed with a nozzle row L4-1 composed of a plurality of nozzles N4-1 and a nozzle row L4-2 composed of a plurality of nozzles N4-2. The nozzle row L1-1, the nozzle row L1-2, the nozzle row L2-1, the nozzle row L2-2, the nozzle row L3-1, the nozzle row L3-2, the nozzle row L4-1 and the nozzle row L4-2 are arranged in the +X direction in this order.

[0021] 3 and 5, a plurality of ink introduction needles 42-1 to 42-4 are provided on the -Z side surface of the first laminate substrate G1, i.e., the surface opposite to the ejection surface 20 of the liquid ejection head 10. The ejection surface 20 includes a first surface Ha of a fixed plate 29, which will be described later, and a wall surface Hw of the nozzle plate 74. In this embodiment, a total of four ink introduction needles 42-1 to 42-4 corresponding to the four color liquid containers C1 to C4 are arranged side by side along the X-axis direction (main scanning direction) perpendicular to the transport direction of the medium 11.

[0022] Ink introduction needles 42-1 to 42-4 are hollow needle-shaped members that are inserted into liquid containers C1 to C4, respectively. An introduction hole 43 is opened at the tip of ink introduction needle 42. Ink in liquid containers C1 to C4 passes through introduction hole 43 and a flow path provided in holder G, and is introduced into head chips 70-1 to 70-4, respectively.

[0023] In the liquid jet head 10, each ink flow path, including the flow paths in the holder G and the flow paths in the head chips 70-1 to 70-4, communicates in a liquid-tight manner from the opening of the introduction hole 43 of the ink introduction needle 42 to the opening of the nozzle N. The opening of the introduction hole 43 of the ink introduction needle 42 and the opening of the nozzle N form an opening that communicates the flow paths in the liquid jet head 10 with the outside.

[0024] FIG. 5 is a schematic diagram showing an example of each flow path from each of the ink introduction needles 42-1 to 42-4 to each of the head chips 70-1 to 70-4. In FIG. 5, the head chip 70-1 has a common liquid chamber CW1-1 and a common liquid chamber CW1-2. The head chip 70-2 has a common liquid chamber CW2-1 and a common liquid chamber CW2-2. The head chip 70-3 has a common liquid chamber CW3-1 and a common liquid chamber CW3-2. The head chip 70-4 has a common liquid chamber CW4-1 and a common liquid chamber CW4-2. Details of the common liquid chambers CW1-1, CW1-2, CW2-1, CW2-2, CW3-1, CW3-2, CW4-1, and CW4-2 will be described later with reference to FIG. 6. Hereinafter, when there is no need to distinguish between the common liquid chambers CW1-1, CW1-2, CW2-1, CW2-2, CW3-1, CW3-2, CW4-1, and CW4-2, they will simply be referred to as the common liquid chamber CW.

[0025] In FIG. 5, the ink flow path R1 introduced from the ink introduction needle 42-1 branches into a flow path R1-1 and a flow path R1-2 at the boundary between the fourth laminate substrate G4 and the fifth laminate substrate G5. The flow path R1-1 is connected to the common liquid chamber CW1-2. The flow path R1-2 is connected to the common liquid chamber CW4-1. The ink flow path R2 introduced from the ink introduction needle 42-2 branches into a flow path R2-1 and a flow path R2-2 at the boundary between the second laminate substrate G2 and the third laminate substrate G3. The flow path R2-1 is connected to the common liquid chamber CW2-1. The flow path R2-2 is connected to the common liquid chamber CW3-1. The ink flow path R3 introduced from the ink introduction needle 42-3 branches into a flow path R3-1 and a flow path R3-2 at the boundary between the first laminate substrate G1 and the second laminate substrate G2. The flow path R3-1 is connected to the common liquid chamber CW2-2. The flow path R3-2 is connected to the common liquid chamber CW3-2. The flow path R4 for the ink introduced from the ink introduction needle 42-4 branches into a flow path R4-1 and a flow path R4-2 at the boundary between the third laminate substrate G3 and the fourth laminate substrate G4. The flow path R4-1 is connected to the common liquid chamber CW1-1. The flow path R4-2 is connected to the common liquid chamber CW4-2.

[0026] Different types of ink flow through the flow paths R1, R2, R3, and R4.

[0027] 1-2: Head chip configuration Fig. 6 and Fig. 7 are cross-sectional views of head chip 70-1, which is one of head chips 70-1 to 70-4. Fig. 7 is an enlarged view of the -X side of head chip 70-1 shown in Fig. 6, sandwiching the central axis in the Z-axis direction. Fig. 6 and Fig. 7 are cross-sectional views of head chip 70-1, but are similar to the cross-sectional views of head chips 70-2 to 70-4, since head chips 70-1 to 70-4 have the same structure.

[0028] First, the flow path structure of the head chip 70 will be described. The head chip 70 has an in-chip flow path CR provided for each nozzle row L. The head chip 70 of this embodiment has two nozzle rows L, and therefore has two in-chip flow paths CR. The in-chip flow path CR is a flow path that communicates with at least one nozzle N. The in-chip flow path CR of this embodiment includes a supply port 774 for introducing ink from a flow path in the holder G into the common liquid chamber CW, the common liquid chamber CW, and a plurality of individual flow paths IR that are connected to the common liquid chamber CW and communicate with each of the plurality of nozzles N that make up the nozzle row L. 6 and 7, the common liquid chamber CW is indicated by a dashed line, and the individual flow paths IR are indicated by a dashed line. The common liquid chamber CW extends in the Y-axis direction along the nozzle row L. The individual flow paths IR include a first communication flow path 714, a pressure chamber CB, and a second communication flow path 716, which will be described later. The in-chip channels CR communicating with the nozzles N1-1, 1-2, 2-1, 2-2, 3-1, 3-2, 4-1, and 4-2 are referred to as in-chip channels CR1-1, 1-2, 2-1, 2-2, 3-1, 3-2, 4-1, and 4-2, respectively. The in-chip channels CR1-1, 1-2, 2-1, 2-2, 3-1, 3-2, 4-1, and 4-2 include common liquid chambers CW1-1, 1-2, 2-1, 2-2, 3-1, 3-2, 4-1, and 4-2, respectively. Further, each of the intra-chip channels CR1-1, 1-2, 2-1, 2-2, 3-1, 3-2, 4-1, and 4-2 includes each of the individual channels IR1-1, 1-2, 2-1, 2-2, 3-1, 3-2, 4-1, and 4-2. For convenience of explanation, the individual channels IR2-1 to IR4-2 are not shown.

[0029] As shown in FIG. 6, in the head chip 70-1, a pressure chamber forming substrate 72 and a vibration plate 73 are laminated on the surface on the -Z side of a flow path forming substrate 71, and a nozzle plate 74-1 is laminated on the surface on the +Z side. A plurality of nozzles N are formed in the nozzle plate 74-1. On the -X side of the nozzle plate 74-1, a portion of the fixed plate 29 on the -X side of the opening 292-1 is located at a predetermined distance from the nozzle plate 74-1. Also, on the +X side of the nozzle plate 74-1, a portion of the fixed plate 29 between the opening 292-1 and the opening 292-2 is located at a predetermined distance from the nozzle plate 74-1. Note that the nozzle plate 74 is preferably formed of silicon. However, the nozzle plate 74 may be formed of any one of metals, resins, and ceramics other than silicon, or a composite material thereof.

[0030] In addition, since structures corresponding to each nozzle row L are formed in approximately line symmetry in one head chip 70, the structure of head chip 70-1 will be described below by focusing on one row of nozzles N for the sake of convenience. Here, "approximately line symmetry" means that in FIG. 6, nozzle N1-1 and nozzle N1-2 are located at symmetrical positions across the central axis in the Z-axis direction, with the design error being within the allowable range.

[0031] The flow path forming substrate 71 is a flat flow path member that constitutes a flow path of ink. In the flow path forming substrate 71 of this embodiment, a part of the common liquid chamber CW, a first communication flow path 714, and a second communication flow path 716 are formed. The part of the common liquid chamber CW includes a through portion 712 that penetrates the flow path forming substrate 71 in the Z axis direction at a position different from the first communication flow path 714 and the second communication flow path 716 in the XY plane, a non-through portion 713 that is recessed in the -Z direction from a stacking surface Hv to a wall surface Hu, and a portion that connects the non-through portion 713 to the first communication flow path 714. The first communication flow path 714 and the second communication flow path 716 are formed for each nozzle N.

[0032] The pressure chamber forming substrate 72 is a flat flow path member in which are formed a plurality of pressure chambers CB each communicating with a different nozzle N. The flow path forming substrate 71 and the pressure chamber forming substrate 72 are formed of, for example, a single crystal silicon substrate.

[0033] 6, the first communication flow path 714 is located on the -Z side of the common liquid chamber CW and extends in the Z axis direction. The +Z end of the first communication flow path 714 communicates with the common liquid chamber CW. The second communication flow path 716 is positioned offset in the X axis direction with respect to the first communication flow path 714 and extends in the Z axis direction. The pressure chamber CB communicates between the -Z end of the first communication flow path 714 and the -Z end of the second communication flow path 716, and extends in the X axis direction.

[0034] A vibration plate 73 is provided on the surface on the -Z side of the pressure chamber forming substrate 72 in Fig. 6. The vibration plate 73 is a flat member that can vibrate elastically, and is configured by laminating an elastic film made of an elastic material such as silicon oxide and an insulating film made of an insulating material such as zirconium oxide. The vibration plate 73, the flow path forming substrate 71, and the pressure chamber forming substrate 72 define pressure chambers CB that apply pressure to ink. In this embodiment, the rows of the pressure chambers CB aligned along the Y direction are arranged in two rows along the X direction.

[0035] A piezoelectric element 732 corresponding to the nozzle N is formed on the surface of the vibration plate 73 on the -Z side. The piezoelectric element 732 is a laminated body having a piezoelectric body interposed between electrodes facing each other. When a drive signal is supplied, the piezoelectric element 732 vibrates together with the vibration plate 73, causing the pressure in the pressure chamber CB to fluctuate and ink in the pressure chamber CB to be ejected from the nozzle N. Therefore, the piezoelectric element 732 functions as a drive element that generates a drive force for ejecting ink from the nozzle N. The piezoelectric element 732 is sealed and protected by a protection plate 76 fixed to the vibration plate 73.

[0036] An end of a wiring board 78-1 is joined to the diaphragm 73. The wiring board 78-1 is a flexible wiring board on which wiring is formed for transmitting drive signals and power supply voltage to the piezoelectric elements 732. One wiring board 78 is provided for each of the four head chips 70-1 to 70-4. Each wiring board 78 is connected to the relay board 26.

[0037] 6, a case 77 is fixed to the -Z side of the flow path forming substrate 71 and the protective plate 76. The case 77 is integrally formed, for example, by molding a resin material. The case 77 in this embodiment is a flow path member in which the remaining part of the common liquid chamber CW that was not formed in the flow path forming substrate 71 and a supply port 774 communicating with the common liquid chamber CW are formed. Ink introduced from the supply port 774 is stored in the common liquid chamber CW. The ink stored in the common liquid chamber CW is distributed and filled into the pressure chamber CB by the first communication flow path 714, and is ejected from the pressure chamber CB to the outside (medium 11 side) through the second communication flow path 716 and the nozzle N1.

[0038] The fixed plate 29 is laminated on the flow path forming substrate 71 by contacting the second surface Hb of the fixed plate 29 with the stacking surface Hv, which is the surface of the flow path forming substrate 71 located closest to the +Z direction and extending along the XY plane. The nozzle plate 74 is laminated on the flow path forming substrate 71 by contacting the stacking surface Hv with the wall surface Hn on the -Z side of the nozzle plate 74. It is preferable that the positions in the Z axis direction of the second surface Hb and the wall surface Hn are substantially the same. It is also preferable that the position in the Z axis direction of the first surface Ha of the fixed plate 29 and the position in the Z axis direction of the wall surface Hw on the +Z side of the nozzle plate 74-1 are substantially the same. Here, "substantially the same" means that they are the same within the allowable range of design error. In other words, the height in the Z axis direction of the first surface Ha of the fixed plate 29 and the height in the Z axis direction of the wall surface Hw of the nozzle plate 74 are substantially the same, based on the stacking surface Hv shown in FIG. 7. That is, in the thickness direction of the fixed plate 29, the position of the first surface Ha of the fixed plate 29 and the position of the wall surface Hw, which is the surface of the nozzle plate 74-1, are substantially the same.

[0039] 6, the +Z side end of the common liquid chamber CW1-1 and the +Z side end of the common liquid chamber CW1-2 are defined by a second surface Hb, which is the -Z side surface of the fixed plate 29. In other words, the fixed plate 29 defines a part of the common liquid chamber CW.

[0040] Moreover, the end of the second communication flow path 716 on the +Z side is defined by a wall surface Hn, which is the -Z side surface of the nozzle plate 74. The opening of the nozzle N is provided in the wall surface Hn.

[0041] 7, the flow-path forming substrate 71 has a plurality of protrusions PD-1 inside a non-penetrating portion 713 that is a part of the in-chip flow path CR1-1. In the non-penetrating portion 713, the protrusions PD-1 are a surface of the flow-path forming substrate 71 facing the +Z direction and protrude from a wall surface Hu located in the -Z direction with respect to the stacking surface Hv. The protrusions PD-1 contact a second surface Hb of the fixing plate 29. The wall surface Hu and the second surface Hb face each other.

[0042] 7, the flow channel forming substrate 71 has a plurality of protrusions PD-2 inside the non-penetrating portion 713 which is a part of the intra-chip flow channel CR1-2. The multiple protrusions PD-2 are similar to the multiple protrusions PD-1 except that they are provided in the intra-chip flow channel CR1-2 instead of the intra-chip flow channel CR1-1, and therefore a description thereof will be omitted.

[0043] As described above, the end of the common liquid chamber CW on the +Z side is defined by the second surface Hb of the fixed plate 29. That is, the portion of the stacking surface Hv of the flow path forming substrate 71 corresponding to the second surface Hb is an opening OP, and the opening OP is sealed by the second surface Hb. The head chip 70-1 includes, as the openings OP, an opening OP-1 corresponding to the common liquid chamber CW1-1 and an opening OP-2 corresponding to the common liquid chamber CW1-2. When the stacking surface Hv is viewed in the -Z direction, the multiple convex portions PD-1 are disposed inside the opening OP-1, and the multiple convex portions PD-2 are disposed inside the opening OP-2.

[0044] Fig. 8 is a plan view of the flow path forming substrate 71 viewed in the -Z direction from the line AA in Fig. 6. The convex portion PD-1 in Fig. 7 corresponds to any one of the convex portions PD-1A, PD-1B, PD-1C, and PD-1D shown in Fig. 8. Similarly, the convex portion PD-2 in Fig. 7 corresponds to any one of the convex portions PD-2A, PD-2B, PD-2C, and PD-2D shown in Fig. 8.

[0045] The convex portions PD-1A, PD-1B, PD-1C, and PD-1D are arranged in the Y-axis direction in a region in the opening OP-1 that corresponds to the non-penetrating portion 713. In other words, the convex portions PD-1A, PD-1B, PD-1C, and PD-1D are aligned along the longitudinal direction of the common liquid chamber CW. It is preferable that the convex portions PD-1A, PD-1B, PD-1C, and PD-1D are arranged at equal intervals, but the intervals between the convex portions PD-1A, PD-1B, PD-1C, and PD-1D do not have to be equal. Moreover, the convex portions PD-2A, PD-2B, PD-2C, and PD-2D are arranged in the Y-axis direction in a region corresponding to the non-penetrating portion 713 in the opening OP-2. In other words, the convex portions PD-2A, PD-2B, PD-2C, and PD-2D are arranged along the longitudinal direction of the common liquid chamber CW. It is preferable that the convex portions PD-2A, PD-2B, PD-2C, and PD-2D are arranged at equal intervals, but the intervals between the convex portions PD-2A, PD-2B, PD-2C, and PD-2D do not have to be equal. Furthermore, it is preferable that the two convex portions included in each pair of the convex portion PD-1A and the convex portion PD-2A, the convex portion PD-1B and the convex portion PD-2B, the convex portion PD-1C and the convex portion PD-2C, and the convex portion PD-1D and the convex portion PD-2D are arranged at positions facing each other across the Y-axis. However, the positions at which the two protrusions in at least one pair are provided are not limited to this.

[0046] In FIG. 8, four convex portions, PD-1A, PD-1B, PD-1C, and PD-1D, are shown as the convex portion PD-1. Similarly, four convex portions, PD-1A, PD-1B, PD-1C, and PD-1D, are shown as the convex portion PD-2. However, the number of each of the convex portions PD-1 and PD-2 may be any number. Note that the liquid ejecting head 10 does not need to include the convex portion PD-1 and the convex portion PD-2. In addition, in the present embodiment, the convex portion PD-1 and the convex portion PD-2 are formed on the flow path forming substrate 71, but they may be provided so as to protrude from the second surface Hb of the fixing plate 29 in the -Z direction. However, since the convex portion PD-1 and the convex portion PD-2 can be formed together in the process of forming the common liquid chamber CW by etching the stacking surface Hv, it is preferable that the convex portion PD-1 and the convex portion PD-2 are provided as part of the flow path forming substrate 71.

[0047] In addition, in a plan view of the flow path forming substrate 71 seen in the -Z direction, a groove portion DG-1 is provided on the stacking surface Hv at a predetermined interval from the opening Op-1 so as to surround at least a part of the opening OP-1, and a groove portion DG-2 is provided at a predetermined interval from the opening Op-2 so as to surround at least a part of the opening Op-2. Each of the groove portions DG-1 and DG-2 is a groove recessed in the -Z direction from the stacking surface Hv. The groove portions DG-1 and DG-2 may be provided on the second surface Hb of the fixing plate 29 instead of the flow path forming substrate 71. In this embodiment, the groove portion DG-1 is an annular groove surrounding the opening OP-1, but a groove may not be formed in a part of the ring surrounding the opening OP-1. For example, the groove portion DG-1 may be a discontinuous annular groove as shown by a broken line, or may be a groove extending in the Y-axis direction provided only between the first communication flow path 714 and the second communication flow path 716. The same applies to the groove portion DG-2.

[0048] The flow path forming substrate 71 and the fixed plate 29 are bonded by the adhesive Gl-1 arranged between the stacking surface Hv and the second surface Hb so as to surround the opening OP-1 when viewed in the Z-axis direction. As a result, the opening Op-1 is liquid-tightly sealed by the fixed plate 29. The groove portion DG-1 is arranged at a position surrounding the adhesive Gl-1 when viewed in the Z-axis direction, and therefore functions as an escape groove for the adhesive Gl-1 as shown in FIG. 7. The adhesive Gl-1 may be provided inside the groove portion DG-1, or may be provided on the outer periphery of the groove portion DG-1 when viewed in the Z-axis direction.

[0049] Similarly, the flow path forming substrate 71 and the fixed plate 29 are bonded by an adhesive Gl-2 (not shown) disposed between the stacking surface Hv and the second surface Hb so as to surround the opening OP-2 when viewed in the Z-axis direction. This causes the opening OP-2 to be liquid-tightly sealed by the fixed plate 29. The groove portion DG-2 is disposed at a position surrounding the adhesive Gl-2 when viewed in the Z-axis direction, and therefore functions as an escape groove for the adhesive Gl-2. The adhesive Gl-2 may be provided inside the groove portion DG-2, or may be provided on the outer periphery of the groove portion DG-2 when viewed in the Z-axis direction.

[0050] The groove portion DG-2 is similar to the groove portion DG-1, except that the positional relationship in the X-axis direction is inverted.

[0051] 7, the thickness of the flow path forming substrate 71 in the Z-axis direction is preferably greater than the thickness of the fixed plate 29 in the Z-axis direction. The depth of the grooves DG-1 and DG-2 is preferably greater than the thickness of the fixed plate 29. Furthermore, the end faces of the grooves DG-1 and DG-2 in the -Z direction, i.e., the bottom faces of the grooves DG-1 and DG-2, may be substantially flush with the wall surface Hu. In this case, the step of forming the non-penetrating portion 713 by etching and the step of forming the grooves DG-1 and DG-2 can be performed in the same time.

[0052] The fixed plate 29 is made of metal. For example, the fixed plate 29 is preferably made of stainless steel (SUS), aluminum, or titanium. The first surface Ha of the fixed plate 29 is preferably a liquid-repellent surface having high liquid repellency. The first surface Ha constitutes the outer surface of the liquid ejecting head 10. Note that "high liquid repellency" means that the contact angle of the first surface Ha with respect to the ink is 55 degrees or more. More preferably, the contact angle is 60 degrees or more, and even more preferably, the contact angle is 80 degrees or more.

[0053] The second surface Hb of the fixed plate 29 is preferably a lyophilic surface having high lyophilicity with respect to liquid. Here, "high lyophilicity" means that the contact angle of the second surface Hb with respect to ink is less than 55 degrees. More preferably, the contact angle is 30 degrees or less, and even more preferably, the contact angle is 20 degrees or less.

[0054] Moreover, the fixed plate 29 is preferably grounded to the ground within the liquid ejecting device 100. By grounding the fixed plate 29, it is possible to reduce charging of the ink in the in-chip flow path CR that contacts the fixed plate 29, and reduce the generation of mist when the ink is ejected from the nozzle N.

[0055] FIG. 9 is an enlarged view of the vicinity of the nozzles N1-1 and N1-2. The opening 292-1 is defined by a side surface Hfs-1 and a side surface Hfs-2 which face each other in the X-axis direction. The side surface Hfs-1 faces the +X direction, and the side surface Hfs-2 faces the -X direction. The side surface Hfs-1 is separated from the side surface Hns-1 which is the -X side end of the nozzle plate 74-1. The side surface Hfs-2 is separated from the side surface Hns-2 which is the +X side end of the nozzle plate 74-1. At least a part of the nozzle plate 74-1 is exposed in the opening 292-1 of the fixing plate 29. Here, "the opening 292 exposes at least a part of the nozzle plate 74" means that the opening 292 exposes the multiple nozzles N formed in the nozzle plate 74 to the outside, and it does not matter if the outer edge part of the nozzle plate 74 where the multiple nozzles N are not formed is not exposed when viewed in the Z-axis direction. In this embodiment, the opening 292 exposes the entire wall surface Hw, which is the surface of the nozzle plate 74. The common liquid chamber CW1-1 and each end in the +X direction of the first communication flow path 714 communicating with the common liquid chamber CW1-1 are defined by the wall surface Hc-1.

[0056] The sum of the distance DA in the X-axis direction between the wall surface Hfs-1 and the wall surface Hns-1, and the distance DB in the X-axis direction between the wall surface Hfs-2 and the wall surface Hns-2 is smaller than the distance DC in the X-axis direction between the wall surface Hc-1 and the wall surface Hns-1. In other words, the sum of the distance between one side surface Hns-1 of the nozzle plate 74 and one side surface Hfs-1 of the opening 292 of the fixed plate 29, which face each other, and the distance between the other side surface Hns-2 of the nozzle plate 74 and the other side surface Hfs-2 of the opening 292 of the fixed plate 29, which face each other, is shorter than the distance between the end of the opening OP-1 on the nozzle plate 74 side in the X-axis direction and the end of the nozzle plate 74 on the opening OP-1 side in the X-axis direction. The sum of the distances DA and DB is equal to the value obtained by subtracting the dimension of the nozzle plate 74 in the X-axis direction from the dimension of the opening 292 in the X-axis direction.

[0057] 1-3: Reference example 10 is an enlarged view of the vicinity of nozzle N1-1 and nozzle N1-2 in head chip 70-Z as a reference example. In head chip 70-Z, the sum of the distance DA between wall surface Hfs-1 and wall surface Hns-1 and the distance DB between wall surface Hfs-2 and wall surface Hns-2 is greater than the distance DC between wall surface Hc-1 and wall surface Hns-1.

[0058] FIG. 11 is an enlarged view of the vicinity of the nozzle N1-1 and the nozzle N1-2 in the head chip 70-Z shown in FIG. 10 when the fixed plate 29 is shifted by a predetermined amount DV1 in the -X direction relative to the nozzle plate 74-1. In FIG. 11, a gap NT occurs between the wall surface Hfs-1 and the wall surface Hc-1. For this reason, ink leaks out of the head chip 70-Z through the gap NT. On the other hand, FIG. 12 is an enlarged view of the vicinity of the nozzle N1-1 and the nozzle N1-2 in the head chip 70-1 shown in FIG. 9 when the fixed plate 29 is shifted by a predetermined amount DV2 in the -X direction relative to the nozzle plate 74-1. In FIG. 12, no gap NT occurs between the wall surface Hfs-1 and the wall surface Hc-1. 12, even if the predetermined amount DV2 were larger, the side surface Hfs-2 collides with the side surface Hns-2 before the gap NT occurs between the wall surface Hfs-1 and the wall surface Hc-1, so the fixed plate 29 cannot shift any further in the -X direction relative to the nozzle plate 74-1, and the gap NT does not occur. Therefore, ink does not leak out of the head chip 70-1.

[0059] Although the above mainly describes head chip 70-1, the same applies to the other head chips 70-2 to 70-4.

[0060] Here, head chip 70-1 is an example of a "first head chip." Head chip 70-2 is an example of a "second head chip." Furthermore, nozzle plate 74-1 provided in head chip 70-1 is an example of a "first nozzle plate." Nozzle plate 74-2 provided in head chip 70-2 is an example of a "second nozzle plate." Nozzle N1-1 provided in nozzle plate 74-1 is an example of a "first nozzle." Nozzle N2-1 provided in nozzle plate 74-2 is an example of a "second nozzle." A chip internal flow path CR1-1 communicating with at least one nozzle N1-1 is an example of a "first flow path," and a chip internal flow path CR2-1 communicating with at least one nozzle N2-1 is an example of a "second flow path." Moreover, the flow path forming substrate 71 that defines a part of the in-chip flow path CR1-1 of the head chip 70-1 is an example of a "first flow path substrate", and the not-shown flow path forming substrate 71 that defines a part of the in-chip flow path CR2-1 of the head chip 70-2 is an example of a "second flow path substrate". The lamination surface Hv on which the nozzle plate 74-1 is laminated of the flow path forming substrate 71 is an example of a "first lamination surface", and the not-shown lamination surface Hv on which the nozzle plate 74-2 is laminated of the not-shown flow path forming substrate 71 of the head chip 70-2 is an example of a "second lamination surface". Moreover, the common liquid chamber CW1-1 is an example of a "common liquid chamber communicating with a plurality of first nozzles". Moreover, the opening OP-1 is an example of a "flow path opening." The wall surface Hu that defines the intra-chip flow path CR1-1 is an example of an "opposing surface." The protrusion PD-1A is an example of a "first protrusion." The convex portion PD-1B is an example of a “second convex portion.” The Y-axis direction is an example of a “longitudinal direction of the common liquid chamber.” Moreover, the opening 292-1 is an example of a “first exposure opening.” The opening 292-2 is an example of a “second exposure opening.” Furthermore, when opening OP-1 is an example of a "flow path opening," side surface Hns-1 is an example of "one side of the first nozzle plate" and "the end portion of the first nozzle plate on the flow path opening side," side surface Hfs-1 is an example of "one side of the first exposed opening of the fixed plate," side surface Hns-2 is an example of "the other side of the first nozzle plate," side surface Hfs-2 is an example of "the other side of the first exposed opening of the fixed plate," and wall surface Hc-1 is an example of "the end portion of the flow path opening on the first nozzle plate side."

[0061] 1-4: Advantages of the First Embodiment The liquid jet head 10 according to this embodiment includes a nozzle plate 74-1 having a plurality of nozzles N1-1 for ejecting liquid, and a head chip 70-1 having an in-chip flow path CR1-1 communicating with at least one of the nozzles N1-1. The liquid jet head 10 also includes a nozzle plate 74-2 having a plurality of nozzles N2-1 for ejecting liquid, and a head chip 70-2 having an in-chip flow path CR2-1 communicating with at least one of the nozzles N2-1. The liquid jet head 10 also includes a fixing plate 29 having a first surface Ha constituting an outer surface of the liquid jet head 10, and a second surface Hb on the opposite side to the first surface Ha to which the head chips 70-1 and 70-2 are fixed. The second surface Hb of the fixing plate 29 defines a part of the in-chip flow path CR1-1 and a part of the in-chip flow path CR2-1.

[0062] Therefore, the fixing plate 29 also serves the function of defining each intra-chip flow path CR in the multiple head chips 70. As a result, it is possible to reduce the number of parts constituting the liquid jet head 10. Furthermore, when replacing a broken head chip 70 to remanufacture the liquid jet head 10, the reduction in the number of parts of the head chip 70 to be replaced leads to a reduction in the environmental impact.

[0063] Furthermore, in the liquid jet head 10 according to this embodiment, the head chip 70-1 has a layered surface Hv on which the nozzle plate 74-1 is layered, and has a flow path forming substrate 71 that defines a part of the intra-chip flow path CR1-1. The head chip 70-2 has a layered surface Hv on which the nozzle plate 74-2 is layered, and has a flow path forming substrate 71 that defines a part of the intra-chip flow path CR2-1. The second surface Hb of the fixing plate 29 is layered on the layered surface Hv of the head chip 70-1 and the layered surface Hv of the head chip 70-1.

[0064] Therefore, since multiple internal chip flow paths CR can be blocked by the same surface, the second surface Hb, of the fixed plate 29, assembly of the liquid ejection head 10 is easier than when each of the multiple internal chip flow paths CR is blocked by a separate surface of the fixed plate 29.

[0065] In addition, in the liquid jet head 10 according to this embodiment, the in-chip flow path CR1-1 and the in-chip flow path CR2-1 are independent of each other within the liquid jet head 10. As shown in Fig. 5, the in-chip flow path CR1-1 communicates with the flow path R4-1 of the holder G, and the in-chip flow path CR2-1 communicates with the flow path R2-1 of the holder G, and the flow paths R4-1 and R2-1 are independent of each other. In other words, the in-chip flow path CR1-1 and the in-chip flow path CR2-1 are independent of each other even within the holder G.

[0066] In the liquid jet head 10 according to this embodiment, the liquid flowing through the in-chip flow passage CR1-1 and the liquid flowing through the in-chip flow passage CR2-1 are different types of liquid.

[0067] Therefore, by the fixed plate 29 individually sealing the flow paths within each of the multiple head chips 70, multiple types of liquid can be made to flow within a single liquid ejection head 10, and multiple types of liquid can be ejected.

[0068] Moreover, in the liquid jet head 10 according to this embodiment, the fixing plate 29 is made of metal.

[0069] Since the fixed plate 29 is a component that is always in contact with ink and is exposed to the outside and susceptible to external forces, by making the fixed plate 29 out of metal, it is less likely to deform due to external forces and its ink resistance is improved.

[0070] In the liquid jet head 10 according to this embodiment, the first surface Ha of the fixed plate 29 is a liquid repellent surface. A portion of the second surface Hb of the fixed plate 29 that defines a part of the intra-chip flow channel CR1-1 is a liquid-philic surface.

[0071] Therefore, the ink pressure loss flowing through the in-chip flow path CR1-1 is reduced. At the same time, the wiping ability for removing dirt and ink attached to the first surface Ha of the fixed plate is improved. Furthermore, if the second surface Hb is a liquid-repellent surface, air bubbles mixed into the in-chip flow path CR1-1 tend to stick to the second surface Hb that defines the in-chip flow path CR1-1, and there is a risk that the air bubbles cannot be removed from the in-chip flow path CR1-1 by maintenance such as cleaning that forcibly discharges liquid from the nozzle N. However, in this embodiment, since the second surface Hb is a liquid-philic surface, air bubbles stuck to the second surface Hb in the in-chip flow path CR1-1 are easily transported to the nozzle N1-1 during maintenance, and the air bubbles are easily discharged from the in-chip flow path CR1-1 by maintenance. Therefore, the risk of the ink ejection from the nozzle N1-1 becoming unstable due to air bubbles stuck to the second surface Hb that could not be removed during maintenance flowing unexpectedly into the nozzle N1-1 during a printing operation or the like can be reduced. Furthermore, since the second surface Hb is a liquid-philic surface, the adhesive can be easily applied.

[0072] Furthermore, in the liquid jet head 10 according to this embodiment, the intra-chip flow path CR1-1 includes a common liquid chamber CW1-1 that communicates with the multiple nozzles N1-1. The fixed plate 29 defines a part of the common liquid chamber CW1-1.

[0073] Furthermore, in the liquid jet head 10 according to this embodiment, an opening OP-1 is provided on the stacking surface Hv of the head chip 70-1, through which a part of the common liquid chamber CW1-1 opens and which is sealed by the second surface Hb of the fixing plate 29. The flow path forming substrate 71 of the head chip 70-1 is disposed inside the opening OP-1 in a plan view, and has a protrusion PD-1A that protrudes from a wall surface Hu that is an opposing surface facing the second surface Hb of the fixing plate 29. A tip of the protrusion PD-1A contacts the second surface Hb of the fixing plate 29.

[0074] The portion of the fixed plate 29 that seals the common liquid chamber CW1-1, which has a relatively large area, is prone to denting when an external force is applied, and therefore, for example, when sealing the entire portion at once, the fixed plate 29 is likely to deform. However, by providing a protrusion PD-1A inside the common liquid chamber CW1-1, deformation of the fixed plate 29 can be suppressed.

[0075] Furthermore, in the liquid jet head 10 according to this embodiment, the flow path forming substrate 71 of the head chip 70-1 is disposed inside the opening OP-1 in a plan view, and has a convex portion PD-1B that protrudes from a wall surface Hu that is an opposing surface facing the second surface Hb of the fixed plate 29. A tip of the convex portion PD-1B contacts the second surface Hb of the fixed plate 29. The convex portion PD-1A and the convex portion PD-1B are aligned along the longitudinal direction of the common liquid chamber.

[0076] Therefore, deformation of the fixed plate 29 can be further suppressed.

[0077] 7, the protrusion PD-1 is preferably disposed in the central region when the opening OP-1 is divided into three in the X-axis direction, which is the short side direction of the common liquid chamber CW1-1, thereby making it possible to further suppress deformation of the fixed plate 29.

[0078] Furthermore, in the liquid jet head 10 according to this embodiment, the fixed plate 29 has an opening 292-1 that exposes at least a portion of the nozzle plate 74-1, and an opening 292-2 that exposes at least a portion of the nozzle plate 74-2.

[0079] Moreover, in the liquid jet head 10 according to this embodiment, the head chip 70-1 has an opening OP-1 that opens on the stacking surface Hv and is closed by the fixed plate 29. Moreover, the sum of the distance DA between one side surface Hns-1 of the nozzle plate 74-1 and one side surface Hfs-1 of the opening 292-1 of the fixed plate 29, which face each other, and the distance DB between the other side surface Hns-2 of the nozzle plate 74-1 and the other side surface Hfs-2 of the opening 292-1 of the fixed plate 29, which face each other, is smaller than the distance DC between the wall surface Hc-1 serving as the end of the opening OP-1 on the nozzle plate 74-1 side, and the wall surface Hns-1 corresponding to the end of the opening OP-1 on the nozzle plate 74-1 side.

[0080] Therefore, when head chip 70-1 is fixed to fixed plate 29, poor sealing of intra-chip flow path CR1-1 can be prevented.

[0081] Furthermore, in the liquid jet head 10 according to this embodiment, in the Z-axis direction which is the thickness direction of the fixed plate 29, the position of the first surface Ha of the fixed plate 29 and the position of the wall surface Hw as the surface of the nozzle plate 74-1 are substantially the same.

[0082] Therefore, when the ejection surface 20 is wiped by the wiping member, the ejection surface 20 is formed to be substantially flush, so that dirt and ink adhering to the ejection surface 20 can be easily removed.

[0083] Furthermore, in the liquid jet head 10 according to this embodiment, a groove portion DG-1 is formed on at least one of the second surface Hb of the fixed plate 29 and the stacking surface Hv of the flow path forming substrate 71, the groove portion DG-1 being spaced apart from the opening OP-1 so as to surround at least a portion of the opening OP-1 of the chip internal flow path CR1-1 formed on the stacking surface Hv.

[0084] Therefore, the groove DG-1 acts as an escape groove for the adhesive, making it difficult for the adhesive to overflow into the flow path.

[0085] Furthermore, in the liquid jet head 10 according to this embodiment, the thickness of the flow path forming substrate 71 of the head chip 70-1 is greater than the thickness of the fixed plate 29. The grooves DG-1 are formed in the flow path forming substrate 71.

[0086] Therefore, by forming the groove portion DG-1 deeply in the flow path forming substrate 71, the amount of adhesive Gl-1 to be stored is ensured, and by not forming the groove portion DG-1 deeply in the fixed plate 29, the thickness of the fixed plate 29 can be reduced, so that the paper gap, which is the distance between the medium 11 and the wall surface Hw, can be reduced. Furthermore, the risk of deformation of the fixed plate 29 can be reduced.

[0087] Moreover, the liquid ejecting device 100 according to this embodiment includes the liquid ejecting head 10, and liquid containers C1 to C4 serving as a "liquid storage section" that stores liquid to be supplied to the liquid ejecting head 10.

[0088] 2: Second embodiment Hereinafter, the liquid ejecting apparatus 100A according to this embodiment will be described with reference to FIG.

[0089] Liquid ejecting device 100A according to this embodiment includes head chips 70-1A to 70-4A instead of head chips 70-1 to 70-4 in the first embodiment. Fig. 13 is a cross-sectional view of head chip 70-1A, which is one of head chips 70-1A to 70-4A. Head chips 70-1A to 70-4A have approximately the same structure, so head chips 70-2A to 70-4A are not shown.

[0090] 2-1: Head chip configuration Unlike the head chip 70-1, the head chip 70-1A circulates ink by discharging a portion of the ink that has passed through the pressure chamber CB to the outside of the head chip 70-1A. In this embodiment, an in-chip flow path CR1-1A is provided instead of the in-chip flow path CR1-1. Also, instead of the common liquid chamber CW1-1, a supply-side common liquid chamber CW1-1A (shown by a dashed line in FIG. 13) for supplying liquid to the multiple nozzles N1-1 and a discharge-side common liquid chamber CW1-1B (shown by a dashed line in FIG. 13) for recovering liquid not ejected from the multiple nozzles N1-1 are provided.

[0091] In the flow path forming substrate 71, a part of the common liquid chamber CW1-1A on the supply side, a first communication flow path 714, a second communication flow path 716, a third communication flow path RN1, and a part of the common liquid chamber CW1-1B on the discharge side are formed.

[0092] 13, the flow path forming substrate 71 is configured by stacking a flow path forming substrate 71-1 and a flow path forming substrate 71-2 in the Z axis direction. The flow path forming substrate 71-1 is stacked on the -Z side with respect to the flow path forming substrate 71-2. A recess CV-1 is provided on the joining surface of the flow path forming substrate 71-1 with the flow path forming substrate 71-2, which is located in the +Z direction with respect to the common liquid chamber CW1-1A and in the -Z direction with respect to the common liquid chamber CW1-1B. An opening is formed between the recess CV-1 and the common liquid chamber CW1-1A, connecting them to each other. A compliance sheet 31 is disposed on the -Z side of the recess CV-1 so as to close the opening. A compliance sheet 32 ​​is disposed on the +Z side of the recess CV-1. As a result, the flow path forming substrate 71-1 is provided with a compliance space CS-1 between the first communication flow path 713 and the common liquid chamber CW1-1B, the boundary surface on the -Z side being defined by the compliance sheet 31, and the boundary surface on the +Z side being defined by the compliance sheet 32. The compliance sheet 32 ​​is fixed to the flow path forming substrate 71-2 so as to close an opening portion that opens toward the -Z direction and is formed in the flow path forming substrate 71-2 so as to define the common liquid chamber CW1-1B.

[0093] The compliance sheet 31 is made of an elastic material and absorbs pressure fluctuations of the ink in the common liquid chamber CW1-1A. The compliance sheet 32 ​​is made of an elastic material and absorbs pressure fluctuations of the ink in the common liquid chamber CW1-1B. The compliance space CS-1 is preferably a space filled with gas and open to the atmosphere. However, as long as a predetermined amount of displacement is ensured as the amount of displacement of the compliance sheets 31 and 32, the compliance space CS-1 may be a closed space.

[0094] A pressure chamber forming substrate 72 is provided on the -Z side of the flow path forming substrate 71. The pressure chamber forming substrate 72 is a plate-shaped member that is elongated in the Y axis direction and extends substantially parallel to the XY plane, and has ink flow paths formed therein. Specifically, pressure chambers CB each having a one-to-one correspondence with the nozzle N1-1 are formed in the pressure chamber forming substrate 72. The pressure chambers CB communicate with the first communication flow path 714 and the second communication flow path 716, and are provided so as to extend in the X-axis direction, connecting the -Z side end of the first communication flow path 714 and the -Z side end of the second communication flow path 716 when viewed in the Y-axis direction.

[0095] In the head chip 70-1A, a part of the third communication channel RN1 and the +Z side end of the common liquid chamber CW1-1B are defined by a second surface Hb, which is the -Z side surface of the fixed plate 29. The second surface Hb faces the compliance sheet 32. The compliance sheet 32 ​​is an example of a "flexible member."

[0096] 13, the area of ​​the portion of the second surface Hb that defines the third communication flow path RN1 and the common liquid chamber CW1-1B is larger than the area of ​​the portion of the compliance sheet 32 ​​that defines the common liquid chamber CW1-1B. In other words, the area of ​​the portion of the second surface Hb of the fixing plate 29 that defines the in-chip flow path CR1-1A is larger than the area of ​​the portion of the compliance sheet 32 ​​that defines the in-chip flow path CR1-1A.

[0097] As illustrated in FIG. 13, a case 77 is provided on the −Z side of the flow path forming substrate 71. Specifically, in the case 77, a part of the common liquid chamber CW1-1A and a part of the common liquid chamber CW1-1B that is not included in the flow path forming substrate 71 are formed. The case 77 is also provided with a supply port 774-1 communicating with the common liquid chamber CW1-1A and a discharge port 775-1 communicating with the common liquid chamber CW1-1B. Ink is supplied to the common liquid chamber CW1-1A via the supply port 774-1. Ink stored in the common liquid chamber CW1-1B is collected via the discharge port 775-1.

[0098] In this embodiment, ink supplied from the liquid container 93 to the supply port 774-1 passes through the common liquid chamber CW1-1A and branches into the multiple first communication channels 714. Then, a portion of the ink that has flowed into the first communication channels 714 flows into the pressure chambers CB. In addition, a portion of the ink that has flowed into the pressure chambers CB passes through the second communication channel 716, the third communication channel RN1, and the common liquid chamber CW1-1B, and is discharged from the discharge port 775-1. When the piezoelectric element 732 is driven by a drive signal, part of the ink filled in the pressure chamber CB passes through the second communication channel 716 and is ejected from the nozzle N1-1.

[0099] 2-3: Advantages of the Second Embodiment In the liquid jet head 10A according to this embodiment, the head chip 70-1A as the "first head chip" defines a portion of the internal chip flow path CR1-1A as the "first flow path" and has a compliance sheet 32 ​​as a "flexible member" having flexibility, and the second surface Hb faces the compliance sheet 32.

[0100] Therefore, the function of absorbing pressure fluctuations by compliance sheet 32 ​​is not impaired, and fixing plate 29 can be shared by a plurality of head chips 70-1A to 70-4A.

[0101] Furthermore, in the liquid jet head 10A according to this embodiment, in a plan view, the area of ​​the portion where the second surface Hb of the fixed plate 29 defines the internal chip flow path CR1-1A is larger than the area of ​​the portion where the compliance sheet 32 ​​as a flexible member defines the internal chip flow path CR1-1A.

[0102] This allows the size of the compliance sheet 32 ​​to be reduced. [Explanation of symbols]

[0103] 10, 10A... liquid jet head, 11... medium, 12... control device, 14... transport mechanism, 18... carriage, 26... relay board, 29... fixed plate, 31... compliance sheet, 32... compliance sheet, 42... ink introduction needle, 43... introduction hole, 51... discharge port, 52... supply port, 70... head chip, 71... flow path forming substrate, 72... pressure chamber forming substrate, 73... vibration plate, 74... nozzle plate, 76... protection plate, 77 ...case, 78...wiring board, 93...liquid container, 100, 100A...liquid ejection device, 182...liquid storage section, 292...opening, 712...penetrating section, 713...non-penetrating section, 714...first communicating flow path, 716...second communicating flow path, CB...pressure chamber, CR...flow path within chip, CW...common liquid chamber, DA, DB, DC...distance, Ha...first surface, Hb...second surface, Hv...laminated surface, N, N1...nozzle, OP...opening, R1, R2, R3, R4...flow paths

Claims

1. A liquid ejection head, a first head chip including a first nozzle plate having a plurality of first nozzles for ejecting liquid and a first flow path communicating with at least one of the first nozzles; a second head chip including a second nozzle plate having a plurality of second nozzles for ejecting liquid and a second flow path communicating with at least one of the second nozzles; a fixing plate having a first surface constituting an outer surface of the liquid jet head and a second surface opposite to the first surface and to which the first head chip and the second head chip are fixed; Equipped with The second surface of the fixed plate defines a portion of the first flow path and a portion of the second flow path. A liquid jet head comprising:

2. the first head chip has a first flow path substrate having a first stacking surface on which the first nozzle plate is stacked and defining a part of the first flow path; the second head chip has a second flow path substrate having a second stacking surface on which the second nozzle plate is stacked and defining a part of the second flow path, The second surface of the fixing plate is laminated on the first laminated surface and the second laminated surface. The liquid jet head according to claim 1 .

3. the first flow path and the second flow path are independent of each other within the liquid jet head. The liquid jet head according to claim 1 .

4. The liquid flowing through the first flow path and the liquid flowing through the second flow path are different types of liquid. The liquid jet head according to claim 3 .

5. The fixing plate is made of metal. The liquid jet head according to claim 1 .

6. the first surface of the fixing plate is a liquid-repellent surface, a portion of the second surface of the fixing plate that defines the part of the first flow path is a liquid-philic surface; The liquid jet head according to claim 1 .

7. the first flow path includes a common liquid chamber communicating with the first nozzles, The fixed plate defines a portion of the common liquid chamber. The liquid jet head according to claim 2 .

8. a flow path opening, through which the portion of the common liquid chamber opens, is provided on the first stacking surface and is sealed by the second surface of the fixing plate; the first flow path substrate has a first protrusion that is disposed inside the flow path opening in a plan view and protrudes from an opposing surface that faces the second surface of the fixing plate, A tip of the first protrusion contacts the second surface of the fixing plate. The liquid jet head according to claim 7 .

9. the first flow path substrate is disposed on the inner side of the flow path opening in a plan view and has a second protrusion protruding from the opposing surface, a tip of the second protrusion contacts the second surface of the fixing plate, the first convex portion and the second convex portion are aligned along a longitudinal direction of the common liquid chamber; The liquid jet head according to claim 8 .

10. The fixing plate is a first exposure opening exposing at least a portion of the first nozzle plate; a second exposure opening exposing at least a portion of the second nozzle plate; The liquid jet head according to claim 2 .

11. the first head chip has a flow path opening that opens to the first stacking surface and is closed by the fixing plate, a distance between one side surface of the first nozzle plate and one side surface of the first exposure opening of the fixed plate, the one side surface being opposed to each other; The sum of the distance between the other side surface of the first nozzle plate and the other side surface of the first exposed opening of the fixed plate, which are opposed to each other, is the distance between the end of the flow path opening on the first nozzle plate side and the end of the first nozzle plate on the flow path opening side; The liquid jet head according to claim 10 .

12. In a thickness direction of the fixed plate, a position of the first surface of the fixed plate and a position of a surface of the first nozzle plate are substantially the same. The liquid jet head according to claim 1 .

13. At least one of the second surface of the fixed plate and the first stacking surface of the first flow path substrate has a groove portion disposed at a distance from a flow path opening so as to surround at least a part of the flow path opening of the first flow path formed on the first stacking surface of the first flow path substrate. The liquid jet head according to claim 1 .

14. The thickness of the first flow path substrate is greater than the thickness of the fixing plate, The groove portion is formed in the first flow path substrate. The liquid jet head according to claim 13 .

15. the first head chip has a flexible member that defines a part of the first flow path and has flexibility; The second surface faces the flexible member. The liquid jet head according to claim 1 .

16. In a plan view, an area of ​​a portion of the second surface of the fixed plate that defines the first flow path is larger than an area of ​​a portion of the flexible member that defines the first flow path. The liquid jet head according to claim 15 .

17. A liquid jet head according to any one of claims 1 to 16, a liquid reservoir configured to reservoir a liquid to be supplied to the liquid jet head; A liquid ejection apparatus comprising:

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