Method for manufacturing wiring circuit board and manufacturing system of wiring circuit board

Abstract

To provide a method for manufacturing a wiring circuit board capable of improving dimension accuracy of the wiring circuit board, and a manufacturing system of the wiring circuit board.SOLUTION: A manufacturing system 100 of a suspension substrate 1 with a circuit comprises: a first insulation layer formation line 101 forming a first insulation layer 12 on a metal foil M; a conductor pattern formation line 102 forming a conductor pattern 13 on the first insulation layer 12; an etching device 104A forming a metal support layer 11 and an outrigger part 3 by etching the metal foil M; a measuring device 104B measuring a width W of the outrigger part 3; and a control device 104D adjusting an etching condition in the etching device 104A on the basis of a width W of the outrigger part 3 measured by the measuring device.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a method and a system for manufacturing a wired circuit board. [Background technology]

[0002] 2. Description of the Related Art Conventionally, as an example of a wired circuit board, there has been known a suspension board with circuit that includes a mounting portion on which a slider equipped with a magnetic head is mounted, and an outrigger portion that is disposed around the mounting portion (see, for example, Patent Document 1 listed below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-061202 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the suspension board with circuit as described in Patent Document 1, further improvement in dimensional accuracy is required.

[0005] The present invention provides a method and system for manufacturing a wired circuit board that can improve the dimensional accuracy of the wired circuit board. [Means for solving the problem]

[0006] The present invention [1] includes a method for manufacturing a wired circuit board having a conductor pattern with terminals and a metal portion made only of metal, the method including an etching step of etching the metal foil by spraying an etching solution onto the metal foil to form the metal portion, a measuring step of measuring dimensions of the metal portion, and an adjusting step of adjusting etching conditions in the etching step based on the dimensions of the metal portion measured in the measuring step.

[0007] According to this method, after the metal portion is formed in the etching process, the dimensions of the metal portion are measured, and the etching conditions in the etching process are adjusted based on the measured dimensions of the metal portion.

[0008] Therefore, the etching conditions in the etching process can be adjusted so that the actual measured dimensions of the metal portion approach the design values.

[0009] As a result, the dimensional accuracy of the printed circuit board can be improved.

[0010] The present invention [2] includes the method for manufacturing a wired circuit board according to [1] above, wherein the wired circuit board further has a metal support layer supporting the conductor pattern and an insulating layer disposed between the metal support layer and the conductor pattern, and the method for manufacturing the wired circuit board further includes an insulating layer formation step of forming the insulating layer on the metal foil and a conductor pattern formation step of forming the conductor pattern on the insulating layer, and in the etching step, the metal foil is etched to form the metal support layer and the metal portion.

[0011] The present invention [3] includes the method for manufacturing a wired circuit board according to [1] or [2] above, wherein the wired circuit board is a suspension board with a circuit, the suspension board with a circuit has a mounting portion on which a slider having a magnetic head is mounted and an outrigger portion arranged around the mounting portion, the metal portion is the outrigger portion, and a dimension of the metal portion is the width of the outrigger portion.

[0012] The dimensional tolerance allowed for the width of the outrigger portion is the smallest among all suspension boards with circuit.

[0013] Therefore, if the deviation between the actual width of the outrigger portion and the design value is within the range of the dimensional tolerance, it can be assumed that other parts of the suspension board with circuit (parts other than the outrigger portion) will also be within the range of the dimensional tolerance.

[0014] In this regard, according to the present invention, after the outrigger portions are formed in the etching process, the width of the outrigger portions is measured, and the etching conditions in the etching process are adjusted based on the measured width of the outrigger portions.

[0015] Therefore, the etching conditions in the etching process can be adjusted so that the actual measured width of the outrigger portion approaches the design value.

[0016] As a result, the dimensional accuracy of the suspension board with circuit can be improved.

[0017] The present invention [4] includes the method for producing a wired circuit board according to any one of the above [1] to [3], wherein the metal foil is a stainless steel foil, the etching liquid is a ferric chloride solution, and in the etching step, the etching liquid sprayed onto the metal foil is recovered, and the recovered etching liquid is sprayed again onto the metal foil.

[0018] When the metal foil is a stainless steel foil, metals contained in the stainless steel that are difficult to dissolve in the etching solution may turn into fine particles (sludge) and become mixed into the recovered etching solution.

[0019] Therefore, the etching conditions may change due to the accumulation of sludge.

[0020] In this regard, according to the present invention, after a metal portion is formed in an etching process, the width of the metal portion is measured, and the etching conditions in the etching process are adjusted based on the measured dimensions of the metal portion.

[0021] Therefore, even if the etching conditions change due to accumulation of sludge, the etching conditions can be adjusted to appropriate conditions.

[0022] As a result, the dimensional accuracy of the printed circuit board can be improved.

[0023] The present invention [5] includes the method for producing a wired circuit board according to any one of the above [1] to [4], wherein the etching condition is a spray force.

[0024] According to this method, the spray force can be adjusted to reliably reduce the deviation between the measured dimensions of the metal part and the set values.

[0025] The present invention [6] provides a manufacturing system for a wired circuit board having a metal support layer and a conductor pattern having terminals, and having a metal portion made only from the metal support layer, comprising an etching apparatus for etching a metal foil by spraying an etching solution onto the metal foil to form the metal portion, the etching apparatus having a tank for storing the etching solution, a spray nozzle, and a first pipe through which the etching solution passes from the tank to the spray nozzle, a measuring device for measuring dimensions of the metal portion, and a control device for controlling the etching apparatus, the control device adjusting the etching conditions in the etching apparatus based on the dimensions of the metal portion measured by the measuring device.

[0026] According to this configuration, after the metal portion is formed in the etching device, the dimensions of the metal portion are measured, and the etching conditions in the etching device are adjusted based on the measured dimensions of the metal portion.

[0027] Therefore, the etching conditions in the etching device can be adjusted so that the actual measured dimensions of the metal portion approach the design values.

[0028] As a result, the dimensional accuracy of the printed circuit board can be improved.

[0029] The present invention [7] includes the manufacturing system for wired circuit boards as described above in [6], wherein the wired circuit board further has a metal support layer supporting the conductor pattern and an insulating layer disposed between the metal support layer and the conductor pattern, and the manufacturing system for wired circuit boards further includes an insulating layer formation line for forming the insulating layer on the metal foil and a conductor pattern formation line for forming the conductor pattern on the insulating layer, and the etching apparatus etches the metal foil to form the metal support layer and the metal portion.

[0030] The present invention [8] includes the manufacturing system for a wired circuit board according to the above [6] or [7], wherein the wired circuit board is a suspension board with a circuit, the suspension board with a circuit has a mounting portion on which a slider having a magnetic head is mounted and an outrigger portion arranged around the mounting portion, the metal portion is the outrigger portion, and a dimension of the metal portion is the width of the outrigger portion.

[0031] According to this configuration, after the outrigger portions are formed by the etching device, the width of the outrigger portions is measured, and the etching conditions in the etching device are adjusted based on the measured width of the outrigger portions.

[0032] Therefore, the etching conditions in the etching device can be adjusted so that the actual measured width of the outrigger portion approaches the design value.

[0033] As a result, the dimensional accuracy of the suspension board with circuit can be improved.

[0034] The present invention [9] includes the system for manufacturing a wired circuit board according to any one of the above [6] to [8], wherein the metal foil is a stainless steel foil, the etching solution is a ferric chloride solution, and the etching apparatus further has a second pipe for returning the etching solution sprayed on the metal foil to the tank.

[0035] With this configuration, even if the etching conditions change due to the accumulation of sludge produced from stainless steel, the etching conditions can be adjusted to appropriate conditions.

[0036] As a result, the dimensional accuracy of the printed circuit board can be improved.

[0037] The present invention

[10] includes the system for manufacturing a wired circuit board according to any one of [6] to [9] above, wherein the etching device further includes a pump for sending the etching liquid from the tank to the spray nozzle, a valve disposed in the first pipe, a pressure sensor for detecting the pressure of the etching liquid in the first pipe, and a flow meter for detecting the flow rate of the etching liquid passing through the first pipe, and the control device adjusts the spray force as the etching condition by controlling at least one of the pump or the valve based on the dimensions of the metal part measured by the inspection device, the pressure detected by the pressure sensor, and the flow rate detected by the flow meter.

[0038] According to this configuration, the spray force can be adjusted to reliably reduce the deviation between the actual measured dimensions of the metal portion and the set values. Effect of the Invention

[0039] According to the method for manufacturing a wired circuit board and the system for manufacturing a wired circuit board of the present invention, it is possible to improve the dimensional accuracy of the wired circuit board. [Brief description of the drawings]

[0040] [Figure 1] FIG. 1 is a plan view showing a suspension board with circuit as an example of a wired circuit board. [Diagram 2] FIG. 2 is a cross-sectional view taken along the line AA of the suspension board with circuit shown in FIG. [Diagram 3] FIG. 3 is a back view of the suspension board with circuit shown in FIG. [Figure 4]Figures 4A to 4C are process diagrams for explaining the manufacturing process of a suspension board with circuit as one embodiment of the present invention, in which Figure 4A shows a first insulating layer forming process, Figure 4B shows a conductor pattern forming process, and Figure 4C shows a second insulating layer forming process. [Diagram 5] FIG. 5 is a block diagram showing a manufacturing system for the suspension board with circuit according to one embodiment of the present invention. [Figure 6] FIG. 6 is a configuration diagram of the etching apparatus shown in FIG. [Figure 7] FIG. 7 is a block diagram for explaining the control device shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0041] 1. Circuit-attached suspension board 1 As an example of a wired circuit board, a circuit-equipped suspension board 1 will be described below. The circuit-equipped suspension board 1 is one component that constitutes a head gimbal assembly of a hard disk drive.

[0042] As shown in FIG. 1, a suspension board with circuit 1 has a mounting portion 2, an outrigger portion 3 as an example of a metal portion, and a wiring portion 4.

[0043] A slider S having a magnetic head is mounted on the mounting portion 2. The magnetic head can read data from the recording surface of the hard disk and write data to the recording surface of the hard disk. The mounting portion 2 is located at one end of the suspension board with circuit 1. In this embodiment, the mounting portion 2 has a substantially rectangular shape. The shape of the mounting portion 2 is not limited. A plurality of terminals 131A, 131B, 131C, and 131D are disposed on the mounting portion 2. The terminals 131A, 131B, 131C, and 131D will be described later.

[0044] The outrigger portion 3 is disposed around the mounting portion 2. The outrigger portion 3 surrounds the mounting portion 2. The outrigger portion 3 supports the mounting portion 2. In this embodiment, the outrigger portion 3 has a generally rectangular frame shape in a plan view. The shape of the outrigger portion 3 is not limited.

[0045] The wiring portion 4 extends in a first direction. The outrigger portion 3 is connected to one end of the wiring portion 4 in the first direction. The wiring portion 4 has a belt shape. A plurality of wirings 133A, 133B, 133C, and 133D and a plurality of terminals 132A, 132B, 132C, and 132D are arranged on the wiring portion 4. The wirings and the terminals will be described later.

[0046] As shown in FIG. 2, the suspension board with circuit 1 has a metal supporting layer 11, a first insulating layer 12 as an example of an insulating layer, a conductor pattern 13, and a second insulating layer .

[0047] (1) Metal support layer 3, the metal support layer 11 is disposed on the mounting portion 2 and the wiring portion 4. That is, the mounting portion 2 has the metal support layer 11. The metal support layer 11 supports the first insulating layer 12, the conductor pattern 13, and the second insulating layer 14 in the mounting portion 2 and the wiring portion 4. Examples of materials for the metal support layer 11 include stainless steel and copper alloys.

[0048] The outrigger portion 3 is made only of metal. The outrigger portion 3 does not have the first insulating layer 12, the conductor pattern 13, or the second insulating layer 14. The outrigger portion 3 is made only of the same metal as the metal support layer 11 of the mounting portion 2 and the wiring portion 4.

[0049] In this embodiment, the metal supporting layer 11 of the mounting portion 2 is not connected to the outrigger portion 3. The metal supporting layer 11 of the mounting portion 2 may be connected to the outrigger portion 3.

[0050] (2) First insulating layer As shown in FIG. 2, the first insulating layer 12 is disposed on the metal support layer 11 in the mounting portion 2 and the wiring portion 4. The first insulating layer 12 is disposed on the metal support layer 11 in the thickness direction of the suspension board with circuit 1. The first insulating layer 12 is disposed between the metal support layer 11 and the conductor pattern 13 in the thickness direction. The first insulating layer 12 insulates the conductor pattern 13 from the metal support layer 11. The first insulating layer 12 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0051] As shown in FIG. 1, the first insulating layer 12 has a first portion 121, a second portion 122, and a plurality of connection portions 123.

[0052] The first portion 121 is disposed on the mounting portion 2. That is, the mounting portion 2 has a first insulating layer 12.

[0053] The second portion 122 extends in the first direction from the first portion 121. The second portion 122 is disposed in the wiring portion 4.

[0054] Each connection portion 123 connects the first portion 121 and the outrigger portion 3. In other words, each connection portion 123 connects the mounting portion 2 and the outrigger portion 3. Each connection portion 123 extends from the first portion 121. A tip of each connection portion 123 is disposed on the outrigger portion 3. Each connection portion 123 has a belt shape. Note that the arrangement and shape of each connection portion 123 are not limited.

[0055] (3) Conductive pattern 2, the conductive pattern 13 is disposed on the first insulating layer 12 in the thickness direction. The conductive pattern 13 is made of a metal. Examples of the metal include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. From the viewpoint of obtaining good electrical properties, copper is preferable.

[0056] As shown in FIG. 1, the conductor pattern 13 has a plurality of terminals 131A, 131B, 131C, and 131D, a plurality of terminals 132A, 132B, 132C, and 132D, and a plurality of wirings 133A, 133B, 133C, and 133D.

[0057] The terminals 131A, 131B, 131C, and 131D are disposed on the mounting portion 2. That is, the mounting portion 2 has a conductive pattern 13. When the slider S is mounted on the mounting portion 2, the terminals 131A, 131B, 131C, and 131D are electrically connected to the magnetic head. The terminals 131A, 131B, 131C, and 131D are aligned in a second direction. The second direction intersects with the first direction. Each of the terminals 131A, 131B, 131C, and 131D has a square land shape.

[0058] The terminals 132A, 132B, 132C, and 132D are disposed at the other end of the wiring portion 4 in the first direction. The terminals 132A, 132B, 132C, and 132D are electrically connected to, for example, a control board of a hard disk drive. The terminals 132A, 132B, 132C, and 132D are arranged in the second direction. The direction in which the terminals 132A, 132B, 132C, and 132D are arranged may be different from the direction in which the terminals 131A, 131B, 131C, and 131D are arranged. Each of the terminals 132A, 132B, 132C, and 132D has a square land shape.

[0059] The wiring 133A electrically connects the terminal 131A and the terminal 132A. One end of the wiring 133A is connected to the terminal 131A. The other end of the wiring 133A is connected to the terminal 132A. The wiring 133B electrically connects the terminal 131B and the terminal 132B. One end of the wiring 133B is connected to the terminal 131B. The other end of the wiring 133B is connected to the terminal 132B. The wiring 133C electrically connects the terminal 131C and the terminal 132C. One end of the wiring 133C is connected to the terminal 131C. The other end of the wiring 133B is connected to the terminal 132C. The wiring 133D electrically connects the terminal 131D and the terminal 132D. One end of the wiring 133D is connected to the terminal 131D. The other end of the wiring 133D is connected to the terminal 132D.

[0060] (4) Second insulating layer 2, the second insulating layer 14 covers the wirings 133A, 133B, 133C, and 133D. The second insulating layer 14 is disposed on the first insulating layer 12 in the thickness direction. The second insulating layer 14 does not cover the terminals 131A, 131B, 131C, and 131D and the terminals 132A, 132B, 132C, and 132D. The second insulating layer 14 is made of a resin. Examples of the resin include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0061] 2. Manufacturing method of suspension board with circuit Next, a method for manufacturing the suspension board with circuit 1 will be described.

[0062] The manufacturing method of the suspension board with circuit 1 includes a first insulating layer forming step (see FIG. 4A), a conductor pattern forming step (see FIG. 4B), a second insulating layer forming step (see FIG. 4C), an etching step (see FIG. 4D), a measuring step, a winding step, and an adjusting step.

[0063] (1) First insulating layer formation process 4A, in the first insulating layer forming step, a first insulating layer 12 is formed on a metal foil M. Examples of the metal foil M include a stainless steel foil and a copper alloy foil. The metal foil M is drawn out from a roll of the metal foil M.

[0064] To form the first insulating layer 12, first, a photosensitive resin solution (varnish) is applied onto the metal foil M and dried to form a coating of the photosensitive resin. Next, the coating of the photosensitive resin is exposed to light and developed. This forms the first insulating layer 12.

[0065] (2) Conductive pattern formation process As shown in FIG. 4B, in the conductive pattern forming step, conductive pattern 13 is formed on first insulating layer 12.

[0066] To form the conductive pattern 13, first, a seed layer is formed on the surface of the first insulating layer 12. The seed layer is formed by, for example, sputtering. Examples of materials for the seed layer include chromium, copper, nickel, titanium, and alloys thereof.

[0067] Next, a plating resist is attached onto the first insulating layer 12 on which the seed layer has been formed, and the plating resist is exposed to light while the portion where the conductive pattern 13 is to be formed is shielded from light.

[0068] Next, the exposed plating resist is developed, whereby the plating resist in the light-shielded areas is removed, and the seed layer is exposed in the areas where the conductive pattern 13 is to be formed. Note that the plating resist in the exposed areas, i.e., the areas where the conductive pattern 13 is not to be formed, remains.

[0069] Next, the conductive pattern 13 is formed on the exposed seed layer by electrolytic plating. After the electrolytic plating is completed, the plating resist is peeled off.

[0070] Next, the seed layer exposed by stripping off the plating resist is removed by dry etching.

[0071] (3) Second insulating layer formation process As shown in FIG. 4C, in the second insulating layer formation step, second insulating layer 14 is formed on first insulating layer 12 and conductive pattern 13 in the same manner as first insulating layer 12 is formed.

[0072] (4) Etching process In the etching step, an etching solution is sprayed onto the metal foil M to etch the metal foil M. When the metal foil M is a stainless steel foil, the etching solution is, for example, a ferric chloride solution.

[0073] In the etching step, the metal foil M is etched to form the metal support layer 11 and the outrigger portions 3, as shown in FIGS.

[0074] In the etching step, the etching liquid sprayed onto the metal foil M is recovered, and the recovered etching liquid is sprayed onto the metal foil M again.

[0075] By the etching step, an assembly sheet having a plurality of suspension boards with circuits 1 is obtained.

[0076] (5) Measurement process After the etching step, in the measuring step, the width W (see FIG. 1) of the outrigger portion 3 of the suspension board with circuit 1 on the assembly sheet is measured. The width W of the outrigger portion 3 is an example of the dimension of a metal member.

[0077] If the actual measured value of the width W of the outrigger portion 3 deviates excessively from the design value, there is a possibility that the outrigger portion 3 will resonate when the hard disk drive in which the suspension board with circuit 1 is mounted operates. If the outrigger portion 3 resonates, it will no longer be possible to maintain the gap between the hard disk and the slider, and this may result in a malfunction of the hard disk drive.

[0078] Therefore, the dimensional tolerance allowed for the width W of the outrigger portion 3 is the smallest among all the suspension boards with circuit 1 .

[0079] Therefore, in the measurement process, the width W of the outrigger portion 3 is measured to inspect the deviation between the actual value and the design value of the width W of the outrigger portion 3. If the deviation between the actual value and the design value of the width W of the outrigger portion 3 is within the range of the dimensional tolerance, it can be assumed that other portions of the suspension board with circuit 1 (portions other than the outrigger portion 3) are also within the range of the dimensional tolerance.

[0080] (6) Winding process After the measuring step, the assembly sheet is wound up in a winding step.

[0081] (7) Adjustment process Furthermore, after the measuring step, in the adjusting step, the etching conditions in the etching step are adjusted based on the width W of the outrigger portion 3 measured in the measuring step.

[0082] In detail, based on the deviation between the actual value of the width W of the outrigger portion 3 measured in the measurement process and the set value, the etching conditions are adjusted so that the deviation between the actual value of the width W of the outrigger portion 3 and the set value is reduced.

[0083] The etching conditions include, for example, the spray force, the concentration of the etching solution, and the temperature of the etching solution. The etching conditions preferably include the spray force. By adjusting the spray force, the deviation between the actual measurement value and the set value of the width W of the outrigger portion 3 can be reliably reduced.

[0084] 3. Manufacturing system for circuit-equipped suspension boards Next, a manufacturing system 100 for carrying out the above-mentioned method for manufacturing the suspension board with circuit 1 will be described.

[0085] As shown in FIG. 5, a manufacturing system 100 for a suspension board with circuit includes a first insulating layer forming line 101, a conductive pattern forming line 102, a second insulating layer forming line 103, and an etching line 104.

[0086] (1) First insulation layer formation line In the first insulating layer forming line 101, the above-mentioned first insulating layer forming step is carried out. That is, the first insulating layer forming line 101 forms the first insulating layer 12 on the metal foil M. The first insulating layer forming line 101 has, for example, a coater, a dryer, an exposure device, and a developing device. The coater coats a photosensitive resin solution (varnish) on the metal foil M. The dryer dries the photosensitive resin solution coated on the metal foil M to form a photosensitive resin coating film on the metal foil M. The exposure device exposes the photosensitive resin coating film. The developing device develops the exposed coating film.

[0087] (2) Conductive pattern forming line In the conductor pattern forming line 102, the above-mentioned conductor pattern forming step is carried out. That is, the conductor pattern forming line 102 forms the conductor pattern 13 on the first insulating layer 12. The conductor pattern forming line 102 has, for example, a sputtering device, a plating resist laminating device, an exposure device, a developing device, an electrolytic plating device, a plating resist stripping device, and a dry etching device. The sputtering device forms a seed layer on the surface of the first insulating layer 12. The plating resist laminating device laminates a plating resist on the first insulating layer 12 on which the seed layer has been formed. The exposure device exposes the plating resist. The developing device develops the exposed plating resist. The electrolytic plating device forms the conductor pattern 13 on the seed layer exposed from the plating resist. The plating resist stripping device strips the plating resist. The dry etching device removes the seed layer exposed by stripping the plating resist.

[0088] (3) Second insulation layer formation line The second insulating layer forming line 103 performs the second insulating layer forming step described above. That is, in the second insulating layer forming line 103, a second insulating layer 14 is formed on the first insulating layer 12 and the conductive pattern 13. Like the first insulating layer forming line 101, the second insulating layer forming line 103 has, for example, a coating device, a drying device, an exposure device, and a developing device.

[0089] (4) Etching line The etching line 104 performs the above-mentioned etching process, measuring process, winding process, and adjusting process. The etching line 104 includes, for example, an etching device 104A, a measuring device 104B, a winding device 104C, and a control device 104D. In other words, the manufacturing system 100 for a suspension board with circuit includes the etching device 104A, the measuring device 104B, and the control device 104D.

[0090] (4-1) Etching equipment As shown in Fig. 6, the etching device 104A performs the above-mentioned etching process. The etching device 104A etches the metal foil M by spraying an etching solution onto the metal foil M. The etching device 104A etches the metal foil M to form a metal support layer 11 (see Fig. 3) and an outrigger portion 3 (see Fig. 3).

[0091] The etching apparatus 104A includes a tank 1041, a plurality of spray nozzles 1042, a first pipe 1043, a pump 1044, a valve 1045, a pressure sensor 1046, a flow meter 1047, and a second pipe 1048.

[0092] The tank 1041 contains an etching solution.

[0093] Each of the multiple spray nozzles 1042 sprays the etching liquid supplied from the tank 1041 toward the metal foil M.

[0094] The first pipe 1043 is a pipe for supplying the etching liquid in the tank 1041 to each of the multiple spray nozzles 1042. One end of the first pipe 1043 is connected to the tank 1041. The other end of the first pipe 1043 is connected to each spray nozzle 1042. The etching liquid flowing from the tank 1041 to each spray nozzle 1042 passes through the first pipe 1043.

[0095] The pump 1044 sends the etching liquid from the tank 1041 to each spray nozzle 1042. A known liquid sending pump can be used as the pump 1044. For example, a gear pump can be used as the pump 1044.

[0096] The valve 1045 is disposed midway through the first pipe 1043. The valve 1045 is capable of controlling the flow rate of the etching liquid passing through the first pipe 1043. Examples of the valve 1045 include a solenoid valve, a diaphragm valve, and a butterfly valve.

[0097] The pressure sensor 1046 detects the pressure of the etching liquid in the first pipe 1043. As the pressure sensor 1046, for example, an elastic pressure gauge such as a Bourdon tube or a diaphragm can be used.

[0098] The flow meter 1047 detects the flow rate of the etching liquid passing through the first pipe 1043. Examples of the flow meter 1047 include an ultrasonic flow meter, an electromagnetic flow meter, a Coriolis flow meter, and a differential pressure flow meter.

[0099] The second pipe 1048 is a pipe for returning the etching solution sprayed on the metal foil M to the tank 1041. Here, when the metal foil M is a stainless steel foil, metals contained in the stainless steel that are difficult to dissolve in the etching solution may become fine particles (sludge) and become mixed into the collected etching solution. Therefore, when the metal foil M is a stainless steel foil, a filter for collecting sludge may be disposed midway through the second pipe 1048.

[0100] (4-2) Measuring equipment As shown in Fig. 5, the measuring device 104B performs the above-mentioned measurement process. That is, the measuring device 104B measures the width W of the outrigger portion 3. Examples of the measuring method of the measuring device 104B include a laser type, an LED type, an ultrasonic type, a contact type, and a TOF (Time Of Flight) type. Examples of the measuring device 104B include an LED type in-line projection image measuring device.

[0101] (4-3) Winding device The winding device 104C performs the winding process described above. That is, in the winding process, the assembly sheet that has passed through the etching device 104A and the measuring device 104B is wound up.

[0102] (4-4) Control device As shown in FIG. 5, the control device 104D controls the etching device 104A. The control device 104D performs the adjustment process described above. The control device 104D is electrically connected to the measurement device 104B and the etching device 104A. The control device 104D adjusts the etching conditions in the etching device 104A by feedback control based on the width W of the outrigger portion 3 measured by the measurement device 104B. In this embodiment, the spray force F is adjusted as an etching condition without changing the distance between the metal foil M and each spray nozzle 1042.

[0103] In detail, the spray force F is expressed by the following formula.

[0104]

number

[0105] (In the above formula, Q is the flow rate of the etching liquid passing through the first pipe, ρ is the density of the etching liquid, and P is the pressure of the etching liquid in the first pipe.) 7, the control device 104D is electrically connected to the measurement device 104B, the pressure sensor 1046, the flow meter 1047, the pump 1044, and the valve 1045. The control device 104D can acquire the width W of the outrigger portion 3 measured by the measurement device 104B, the pressure P detected by the pressure sensor 1046, and the flow rate Q detected by the flow meter 1047. The control device 104D can control the pump 1044 and the valve 1045.

[0106] The control device 104D adjusts the spray force F by controlling at least one of the pump 1044 and the valve 1045 based on the width W of the outrigger portion 3 measured by the measuring device 104B, the pressure P detected by the pressure sensor 1046, and the flow rate Q detected by the flow meter 1047. In detail, the control device 104D monitors the pressure P detected by the pressure sensor 1046 and the flow rate Q detected by the flow meter 1047, and controls at least one of the pump 1044 or the valve 1045 so that the width W of the outrigger portion 3 measured by the measuring device 104B approaches the design value, thereby adjusting the pressure P and the flow rate Q to achieve the desired spray force F.

[0107] This makes it possible to prevent the deviation between the actual measured value and the design value of the width W of the outrigger portion 3 from exceeding the range of the dimensional tolerance.

[0108] 4. Effects (1) According to the manufacturing method for the suspension board with circuit 1 and the manufacturing system 100 for the suspension board with circuit 1, as shown in FIG. 5, after forming the outrigger portion by the etching equipment 104A (i.e., after the etching process), the width W (see FIG. 1) of the outrigger portion 3 is measured by the measuring equipment 104B (measurement process), and the etching conditions in the etching equipment 104A are adjusted by the control equipment 104D based on the measured width W of the outrigger portion 3.

[0109] Therefore, the etching conditions in the etching equipment 104A can be adjusted so that the actual measured value of the width W of the outrigger portion 3 approaches the design value.

[0110] As a result, the dimensional accuracy of the suspension board with circuit 1 can be improved.

[0111] (2) According to the manufacturing method of the suspension board with circuit 1 and the manufacturing system 100 of the suspension board with circuit 1, as shown in FIG. 6 , the metal foil M is a stainless steel foil, the etching solution is a ferric chloride solution, and the etching device 104A recovers the etching solution sprayed onto the metal foil M into the tank 1041 via the second piping 1048, and sprays the recovered etching solution again onto the metal foil M.

[0112] When the metal foil M is a stainless steel foil, metals contained in the stainless steel that are difficult to dissolve in the etching solution may turn into fine particles (sludge) and become mixed into the recovered etching solution.

[0113] Therefore, the etching conditions may change due to the accumulation of sludge.

[0114] In this regard, according to the manufacturing method of the suspension board with circuit 1 and the manufacturing system 100 of the suspension board with circuit 1, after the outrigger portions 3 are formed by the etching apparatus 104A, as shown in FIG. 5, the width W of the outrigger portions 3 is measured, and the etching conditions in the etching apparatus 104A are adjusted based on the measured width W of the outrigger portions 3.

[0115] Therefore, even if the etching conditions change due to accumulation of sludge, the etching conditions can be adjusted to appropriate conditions.

[0116] As a result, the dimensional accuracy of the suspension board with circuit 1 can be improved.

[0117] (3) According to the method for manufacturing the suspension board with circuit 1 and the system 100 for manufacturing the suspension board with circuit 1, the spray force is adjusted as an etching condition.

[0118] This makes it possible to reliably reduce the deviation between the actual measured value and the set value of the width W of the outrigger portion 3.

[0119] 5. Variations (1) The wired circuit board is not limited to the suspension board with circuit 1. The wired circuit board may be, for example, a flexible printed circuit board or a lead frame on which a semiconductor element is mounted.

[0120] (2) The metal portion is not limited to the outrigger portion 3. When the mounting portion 2 is made of only the metal support layer 11, the metal portion may be the mounting portion 2.

[0121] The metal portion may also be a part of the conductor pattern, for example, if the conductor pattern has flying leads and the flying leads are made by etching the metal support layer 11, the metal portion may be the flying leads. [Explanation of symbols]

[0122] 1. Circuit-equipped suspension board 2 Mounting section 3 Outrigger part (an example of a metal part) 11 Metal support layer 12 First insulating layer 13 Conductor Pattern 100 Manufacturing system for circuit-equipped suspension board 101 First insulating layer forming line 102 Conductor pattern forming line 104A Etching Equipment 104B Measuring equipment 104D Control device 1041 Tank 1042 Spray nozzle 1043 First Pipe 1044 Pump 1045 Valve 1046 Pressure Sensor 1047 Flowmeter 1048 Second Pipe M Metal foil W Width of outrigger part (example of dimensions of metal part)

Claims

1. A method for manufacturing a printed circuit board having a conductor pattern with terminals and a metal portion made only of metal, comprising the steps of: an etching step of etching the metal foil by spraying an etching solution onto the metal foil to form the metal portion; a measuring step of measuring a dimension of the metal portion; an adjusting step of adjusting an etching condition in the etching step based on the dimension of the metal portion measured in the measuring step; A method for manufacturing a wired circuit board, comprising:

2. The printed circuit board is A metal support layer that supports the conductor pattern; an insulating layer disposed between the metal support layer and the conductor pattern; and The method for producing the printed circuit board includes: forming an insulating layer on the metal foil; a conductor pattern forming step of forming the conductor pattern on the insulating layer; Further comprising: The method for producing a wired circuit board according to claim 1 , wherein in the etching step, the metal foil is etched to form the metal supporting layer and the metal portion.

3. The wired circuit board is a suspension board with a circuit, The suspension board with circuit is a mounting portion on which a slider having a magnetic head is mounted; an outrigger portion disposed around the mounting portion; having the metal portion is the outrigger portion, The method for producing a printed circuit board according to claim 1 , wherein the dimension of the metal portion is a width of the outrigger portion.

4. The metal foil is a stainless steel foil, The etching solution is a ferric chloride solution, 2. The method for producing a wired circuit board according to claim 1, wherein in the etching step, the etching liquid sprayed onto the metal foil is recovered, and the recovered etching liquid is sprayed onto the metal foil again.

5. The method for producing a wired circuit board according to claim 1 , wherein the etching condition is a spray force.

6. A manufacturing system for a printed circuit board having a conductor pattern with a terminal and a metal portion made only of metal, comprising: An etching apparatus for etching a metal foil by spraying an etching solution onto the metal foil to form the metal portion, the etching apparatus including a tank for storing the etching solution, a spray nozzle, and a first pipe through which the etching solution passes from the tank to the spray nozzle; a measuring device for measuring the dimensions of the metal part; A control device for controlling the etching device; Equipped with The control device includes: A system for manufacturing printed circuit boards, the system adjusting etching conditions in the etching device based on the dimensions of the metal portion measured by the measuring device.

7. The printed circuit board is a metal support layer for supporting the conductor pattern; an insulating layer disposed between the metal support layer and the conductor pattern; and The wiring circuit board manufacturing system includes: an insulating layer forming line for forming the insulating layer on the metal foil; a conductor pattern forming line for forming the conductor pattern on the insulating layer; Further equipped with The system for manufacturing a wired circuit board according to claim 6 , wherein the etching device etches the metal foil to form the metal support layer and the metal portion.

8. The wired circuit board is a suspension board with a circuit, The suspension board with circuit is a mounting portion on which a slider having a magnetic head is mounted; an outrigger portion disposed around the mounting portion; having the metal portion is the outrigger portion, 7. The system for manufacturing a printed circuit board according to claim 6, wherein the dimension of the metal portion is a width of the outrigger portion.

9. The metal foil is a stainless steel foil, The etching solution is a ferric chloride solution, The etching apparatus includes:

7. The system for manufacturing a wired circuit board according to claim 6, further comprising a second pipe for returning the etching solution sprayed on the metal foil to the tank.

10. The etching apparatus includes: a pump for pumping the etching solution from the tank to the spray nozzle; A valve disposed midway along the first pipe; a pressure sensor that detects a pressure of the etching liquid in the first pipe; a flow meter that detects a flow rate of the etching liquid passing through the first pipe; and The control device includes:

7. The system for manufacturing wired circuit boards according to claim 6, further comprising: a control unit for controlling at least one of the pump and the valve based on the dimensions of the metal portion measured by the measuring device, the pressure detected by the pressure sensor, and the flow rate detected by the flow meter, thereby adjusting the spray force as the etching condition.

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