Multilayer ceramic capacitor

Abstract

To ensure connectivity between an internal electrode layer and an external electrode in a multilayer ceramic capacitor having a configuration in which the width of the lead-out portion of the internal electrode layers led to the end faces of an element portion is narrower than the opposing portions of the internal electrode layers.SOLUTION: An external electrode 120 includes a base electrode layer 121, a Ni plating layer 123, and a Sn plating layer 124. The base electrode layer 121 is provided on the element portion 110. The Ni plating layer 123 is provided above the base electrode layer 121. The Sn plating layer 124 is provided on the Ni plating layer 123. The base electrode layer 121 contains Ni as a main component and also contains a dielectric material.SELECTED DRAWING: Figure 16

Description

[Technical field]

[0001] The present disclosure relates to a multilayer ceramic capacitor. [Background technology]

[0002] As a conventional multilayer ceramic capacitor, Japanese Patent Laid-Open Publication No. 2006-179873 (Patent Document 1) discloses a configuration including a laminate in which a plurality of dielectric layers and a plurality of internal electrode layers are stacked, chip protection members provided on both side surfaces of the laminate, and a pair of external electrodes provided on both end surfaces of the laminate.

[0003] The internal electrode layers each include an opposing portion that opposes an electrode layer adjacent to the internal electrode layers in the stacking direction and an extended portion that is extended from the opposing portion to an end face of the laminate. The width of the extended portion is narrower than the width of the opposing portion. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2006-179873 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the multilayer ceramic capacitor described in Patent Document 1, the width of the lead-out portions of the internal electrode layers is narrow, which reduces the contact area between the internal electrode layers and the external electrodes, thereby reducing and insufficient connectivity between the internal electrode layers and the external electrodes.

[0006] The present disclosure has been made in consideration of the above-mentioned problems, and an object of the present disclosure is to provide a multilayer ceramic capacitor that can ensure connectivity between the internal electrode layers and external electrodes in a configuration in which the width of the extraction portions of the internal electrode layers that are extracted to the end faces of the body portion is narrower than the opposing portions of the internal electrode layers. [Means for solving the problem]

[0007] A multilayer ceramic capacitor according to the present disclosure includes an element body and an external electrode. The element body has a first main surface and a second main surface opposed to each other in a thickness direction, a first side surface and a second side surface opposed to each other in a width direction, and a first end surface and a second end surface opposed to each other in a length direction. The element body includes a plurality of dielectric layers and a plurality of internal electrode layers laminated in the thickness direction. An external electrode is provided on each of the first end surface and the second end surface, and is electrically connected to the plurality of internal electrode layers. Each of the plurality of internal electrode layers has an opposing portion opposed to an internal electrode layer adjacent to each other in the thickness direction, and a lead portion connecting the opposing portion and the external electrode. In the width direction, the width of the opposing portion is larger than the width of the lead portion. The external electrode includes a base electrode layer, a Ni plating layer, and a Sn plating layer. The base electrode layer is provided on the element body. The Ni plating layer is provided above the base electrode layer. The Sn plating layer is provided on the Ni plating layer. The base electrode layer contains Ni as a main component and also contains a dielectric material. Effect of the Invention

[0008] According to the present disclosure, in a multilayer ceramic capacitor having a configuration in which the width of the extraction portion of the internal electrode layer that is extracted to the end face of the body portion is narrower than the opposing portion of the internal electrode layer, it is possible to ensure connectivity between the internal electrode layer and the external electrode. [Brief description of the drawings]

[0009] [Figure 1] 1 is a perspective view showing a schematic appearance of a multilayer ceramic capacitor according to an embodiment of the present invention; [Diagram 2] 1 is a perspective view showing a schematic diagram of an element portion of a multilayer ceramic capacitor according to an embodiment of the present invention; [Diagram 3] 3 is an exploded perspective view for illustrating a schematic configuration of the element body shown in FIG. 2. FIG. [Figure 4] 4 is a schematic cross-sectional view taken along the line IV-IV in FIG. 1. [Diagram 5] 2 is a schematic cross-sectional view taken along the line VV in FIG. 1. [Figure 6]6 is a schematic cross-sectional view taken along the line VI-VI in FIG. 4. [Figure 7] 5 is a schematic cross-sectional view taken along the line VII-VII in FIG. 4. [Figure 8] 3 is a schematic cross-sectional view for explaining details of an internal electrode layer of the multilayer ceramic capacitor according to the embodiment. FIG. [Figure 9] 4 is a schematic cross-sectional view illustrating the shape of an element portion on an end face side and the state of lead portions of internal electrode layers in a multilayer ceramic capacitor according to an embodiment. FIG. [Figure 10] 4 is a schematic cross-sectional view illustrating the outer shape of a body portion at a center portion in a longitudinal direction and the state of opposing portions of internal electrode layers in a multilayer ceramic capacitor according to an embodiment. FIG. [Figure 11] 5 is a schematic cross-sectional view for illustrating a detailed shape of an element portion of the multilayer ceramic capacitor according to the embodiment. FIG. [Figure 12] 5 is a schematic cross-sectional view for explaining a shift in the width direction of lead portions of internal electrode layers in the multilayer ceramic capacitor according to the embodiment. FIG. [Figure 13] 5 is a schematic cross-sectional view for explaining a shift in the width direction of opposing portions of internal electrode layers in the multilayer ceramic capacitor according to the embodiment. FIG. [Figure 14] 3 is a schematic cross-sectional view showing an enlarged view of an end portion in a width direction of a drawn-out portion of the multilayer ceramic capacitor according to the embodiment; FIG. [Figure 15] FIG. 2 is a schematic cross-sectional view for explaining a grain diameter of the multilayer ceramic capacitor according to the embodiment. [Figure 16] 2 is a schematic cross-sectional view showing a detailed configuration of an external electrode of the multilayer ceramic capacitor according to the embodiment; FIG. [Figure 17] 5A to 5C are diagrams illustrating a step of providing a conductive pattern on an inner layer ceramic green sheet in a manufacturing method of a multilayer ceramic capacitor according to an embodiment. [Figure 18] 5A to 5C are diagrams showing a step of arranging ceramic paste for eliminating steps in the method for manufacturing the multilayer ceramic capacitor according to the embodiment; [Figure 19] 4A to 4C are diagrams showing steps of laminating a plurality of inner layer ceramic green sheets and a plurality of outer layer ceramic green sheets in a manufacturing method of a multilayer ceramic capacitor according to an embodiment. [Figure 20] 5A to 5C are diagrams showing a step of cutting a structure in which a plurality of inner layer ceramic green sheets and a plurality of outer layer ceramic green sheets are thermocompression-bonded together in a method for manufacturing a multilayer ceramic capacitor according to an embodiment. [Figure 21] FIG. 13 is a diagram showing a region in which a ceramic paste for eliminating steps is placed in an individual laminated chip. [Figure 22] 13 is a diagram showing a state in which a segregation region occurs in a part of an internal electrode layer in a sintered element part. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the embodiments described below, the same or common parts are denoted by the same reference numerals in the drawings, and their description will not be repeated. In the drawings, the length direction of the element body portion described later is indicated by L, the width direction of the element body portion by W, and the thickness direction of the element body portion by T.

[0011] FIG. 1 is a perspective view showing a schematic appearance of a multilayer ceramic capacitor according to an embodiment. FIG. 2 is a perspective view showing a schematic element part of the multilayer ceramic capacitor according to an embodiment. FIG. 3 is an exploded perspective view for explaining a schematic configuration of the element part shown in FIG. 2. FIG. 4 is a schematic cross-sectional view seen from the direction of the arrows IV-IV shown in FIG. 1. FIG. 5 is a schematic cross-sectional view seen from the direction of the arrows VV shown in FIG. A multilayer ceramic capacitor 100 according to an embodiment will be described with reference to FIGS. 1 to 5.

[0012] 1 to 5, a multilayer ceramic capacitor 100 according to an embodiment includes an element body 110 and external electrodes. The multilayer ceramic capacitor 100 includes a first external electrode 120 and a second external electrode 130 as the external electrodes.

[0013] 1, the element body 110 has a substantially rectangular parallelepiped shape. The element body 110 has a first main surface 111 and a second main surface 112 facing in a thickness direction T, a first side surface 113 and a second side surface 114 facing in a width direction W intersecting the thickness direction T, and a first end surface 115 and a second end surface 116 facing in a length direction L intersecting the thickness direction T and the width direction W.

[0014] It is preferable that the corners and ridges of the element part 110 are rounded. Here, a corner is a portion where three faces of the element part 110 intersect, and a ridge is a portion where two faces of the element part 110 intersect.

[0015] 1 and 4, the first external electrode 120 is provided on the first end face 115. Specifically, the first external electrode 120 is formed over the entire first end face 115, and is formed so as to extend from the first end face 115 to the first main face 111, the second main face 112, the first side face 113, and the second side face 114.

[0016] 1 and 4, the second external electrode 130 is provided on the second end face 116. Specifically, the second external electrode 130 is formed over the entire second end face 116, and is formed so as to extend from the second end face 116 around the first main face 111, the second main face 112, the first side face 113, and the second side face 114.

[0017] The detailed configurations of the first external electrode 120 and the second external electrode 130 will be described later with reference to FIG.

[0018] As shown in FIGS. 2 and 3, the element body 110 includes a laminate 101, a first side margin portion S1, and a second side margin portion S2.

[0019] 3, the laminate 101 has a pair of main surfaces 101a, 101b facing each other in the thickness direction T, a pair of side surfaces 101c, 101d facing each other in the width direction, and a pair of end surfaces 101e, 101f facing each other in the length direction. The pair of main surfaces 101a, 101b constitute a part of the first main surface 111 and the second main surface 112 of the element body part 110. The side surface 101c is covered by a first side margin part S1, and the side surface 101d is covered by a second side margin part S2. The pair of end surfaces 101e, 101f constitute a part of the first end surface 115 and the second end surface 116 of the element body part 110.

[0020] As shown in FIGS. 3 to 5, the laminate 101 has a plurality of dielectric layers 140 and a plurality of internal electrode layers 150 alternately laminated along the thickness direction T.

[0021] The multiple internal electrode layers 150 include multiple first internal electrode layers 151 and multiple second internal electrode layers 152. The multiple first internal electrode layers 151 and the multiple second internal electrode layers 152 are laminated alternately in the thickness direction T.

[0022] The multiple first internal electrode layers 151 are extended to the first end surface 115. The multiple first internal electrode layers 151 are connected to the first external electrode 120. The multiple second internal electrode layers 152 are extended to the second end surface 116. The multiple second internal electrode layers 152 are connected to the second external electrode 130. Both end portions in the width direction W of the multiple first internal electrode layers 151 and the multiple second internal electrode layers 152 are exposed to the side surfaces 101c, 101d.

[0023] Although an example in which seven first internal electrode layers 151 and seven second internal electrode layers 152 are provided is shown in Figures 3 to 5, the number of each of the first internal electrode layers 151 and the second internal electrode layers 152 is not limited to seven.

[0024] The multiple dielectric layers 140 consist of outer layer dielectric layers located between the internal electrode layer 150 closest to the first main surface 111 in the thickness direction T and the first main surface 111, and between the internal electrode layer 150 closest to the second main surface 112 in the thickness direction T and the second main surface 112, as well as inner layer dielectric layers located between adjacent internal electrode layers 150 in the thickness direction T.

[0025] Each of the dielectric layers 140 is made of a dielectric ceramic material mainly composed of a perovskite compound containing Ba and Ti. The dielectric layer 140 may contain at least one additive selected from the group consisting of Si, Mg, Mn, V, Cr, and rare earth elements.

[0026] Each of the first internal electrode layer 151 and the second internal electrode layer 152 contains Ni as a main component. Each of the first internal electrode layer 151 and the second internal electrode layer 152 may further contain a dielectric material having the same composition as the ceramic contained in the dielectric layer 140. In addition, each of the first internal electrode layer 151 and the second internal electrode layer 152 may contain Sn at the interface with the dielectric layer 140.

[0027] 4, the laminate 101 is divided into an inner layer portion C, a first outer layer portion X1, a second outer layer portion X2, and a first end margin portion E1 and a second end margin portion E2. The inner layer portion C has a capacitance due to a first opposing portion 151C (described later) of the first internal electrode layer 151 and a second opposing portion 152C (described later) of the second internal electrode layer 152 being laminated in the thickness direction T.

[0028] The first outer layer portion X1 and the second outer layer portion X2 sandwich the inner layer portion C in the thickness direction T. The first outer layer portion X1 is located outside the inner layer portion C in the thickness direction T, and is located on the first main surface 111 side. The second outer layer portion X2 is located outside the inner layer portion C in the thickness direction T, and is located on the second main surface 112 side.

[0029] Each of the first outer layer portion X1 and the second outer layer portion X2 is an outer dielectric layer, and is made of a dielectric ceramic material mainly composed of a perovskite compound containing Ba and Ti. The first outer layer portion X1 and the second outer layer portion X2 may be made of the same dielectric ceramic material as the plurality of dielectric layers 140, or may be made of a dielectric ceramic material different from that of the plurality of dielectric layers 140. In this embodiment, the outer dielectric layer has a higher Mn content than the inner dielectric layer. That is, the first outer layer portion X1 and the second outer layer portion X2 have a higher Mn content than the dielectric layer 140 of the laminate 101 (more specifically, the inner dielectric layer of the inner layer portion C). This makes the first outer layer portion X1 and the second outer layer portion X2 dense, improving moisture resistance, and ensuring the moisture resistance of the multilayer ceramic capacitor 100.

[0030] The first end margin portion E1 and the second end margin portion E2 sandwich the inner layer portion C in the longitudinal direction L. The first end margin portion E1 is located outside the inner layer portion C in the longitudinal direction L, on the first end face 115 side. The second end margin portion E2 is located outside the inner layer portion C in the longitudinal direction L, on the second end face 116 side.

[0031] The side margins are located in the element body 110, in the width direction W, between the first side surface 113 and the multiple internal electrode layers 150, and between the second side surface 114 and the multiple internal electrode layers 150.

[0032] Specifically, the first side margin portion S1 is provided on a side surface 101c of the laminate. The first side margin portion S1 is provided so as to cover the entire side surface 101c. The first side margin portion S1 exists in the element portion 110 from one end of the internal electrode layer 150 located on one side in the width direction W to the first side surface 113.

[0033] The second side margin portion S2 is provided on a side surface 101d of the laminate. The second side margin portion S2 is provided so as to cover the entire side surface 101d. The second side margin portion S2 exists in the element portion 110 from the other end of the internal electrode layer 150 located on the other side in the width direction W to the second side surface 114.

[0034] The first side margin portion S1 and the second side margin portion S2 are made of a dielectric ceramic material mainly composed of a perovskite compound containing Ba and Ti. The first side margin portion S1 and the second side margin portion S2 may be made of the same dielectric ceramic material as the multiple dielectric layers 140, or may be made of a dielectric ceramic material different from that of the multiple dielectric layers 140.

[0035] The first side margin portion S1 and the second side margin portion S2 may be, for example, a dielectric material manufactured by a solid phase method. In this case, no voids exist in the grains (granular matter) included in the first side margin portion S1 and the second side margin portion S2.

[0036] The first side margin portion S1 and the second side margin portion S2 may contain at least one of Si and Mg. The first side margin portion S1 and the second side margin portion S2 may also contain Mn. In this embodiment, the first side margin portion S1 and the second side margin portion S2 have a higher Mn content than the inner dielectric layer. This makes the first side margin portion S1 and the second side margin portion S2 denser, improving moisture resistance, and ensuring the moisture resistance of the multilayer ceramic capacitor 100.

[0037] Si is segregated in the first side margin portion S1 and the second side margin portion S2. The segregation of Si can be confirmed by observing the cross section by, for example, SEM / EDX. Mn can be confirmed by observing the main components Ti or Ba by EPMA or the like.

[0038] The first side margin portion S1 and the second side margin portion S2 may be composed of multiple layers. The multiple layers may not necessarily have an interface between the layers observed, and may include, for example, an embodiment in which the grain size is different between the side surface side and the internal electrode layer 150 side, that is, an embodiment in which the grain size is different in the width direction. The grain size can be measured using an electron microscope such as a TEM. For example, the area of ​​each grain within the field of view is measured in a range of about 10 μm × 10 μm. The circle equivalent diameter is calculated by converting the area of ​​each grain, and the average of the circle equivalent diameters is taken as the grain size.

[0039] As described above, the size of the multilayer ceramic capacitor 100 including the element body 110 and the first and second external electrodes 120 and 130 is not particularly limited, but may be within the following ranges, for example.

[0040] As shown in Fig. 4, the dimension in the length direction L of the multilayer ceramic capacitor 100 (length dimension L0) is, for example, not less than 0.2 mm and not more than 4.5 mm. The dimension in the thickness direction T of the multilayer ceramic capacitor 100 (thickness dimension T0) is not less than 0.125 mm and not more than 2.5 mm. As shown in Fig. 5, the dimension in the width direction W of the multilayer ceramic capacitor 100 (width dimension W0) is, for example, not less than 0.125 mm and not more than 3.2 mm.

[0041] The multilayer ceramic capacitor 100 has, for example, a length dimension L0 of 0.2 mm, a width dimension W0 of 0.125 mm, and a thickness dimension T0 of 0.125 mm, or a length dimension L0 of 0.4 mm, a width dimension W0 of 0.2 mm, and a thickness dimension T0 of 0.2 mm, or a length dimension L0 of 0.6 mm, a width dimension W0 of 0.3 mm, and a thickness dimension T0 of 0.3 mm, or a length dimension L0 of 1.0 mm, a width dimension W0 of 0.5 mm, and a thickness dimension T0 of 0.5 mm, or a length dimension L0 of 3.2 mm, a width dimension W0 of 1.6 mm, and a thickness dimension T0 of 1.6 mm, or a length dimension L0 of 4.5 mm, a width dimension W0 of 3.2 mm, and a thickness dimension T0 of 2.5 mm. Note that tolerances are taken into account in the above sizes.

[0042] Fig. 6 is a schematic cross-sectional view seen from the direction of the arrows VI-VI shown in Fig. 4. The shape of the first internal electrode layer 151 will be described with reference to Fig. 6.

[0043] As shown in FIG. 6, the first internal electrode layer 151 includes a first opposing portion 151C and a first lead portion 151X. The first opposing portion 151C faces the adjacent second internal electrode layer 152 in the thickness direction T. The first lead portion 151X connects the first opposing portion 151C and the first external electrode 120. The first lead portion 151X is led out to the first end surface 115. In the width direction W, the width W1 of the first opposing portion 151C is larger than the width W2 of the first lead portion 151X. The first opposing portion 151C and the first lead portion 151X are integrally configured.

[0044] Fig. 7 is a schematic cross-sectional view seen from the direction of the arrows VII-VII shown in Fig. 4. The shape of the second internal electrode layer 152 will be described with reference to Fig. 7.

[0045] As shown in FIG. 7, the second internal electrode layer 152 includes a second opposing portion 152C and a second lead portion 152X. The second opposing portion 152C faces the adjacent first internal electrode layer 151 in the thickness direction T. The second lead portion 152X connects the second opposing portion 152C and the second external electrode 130. The second lead portion 152X is led out to the second end surface 116. In the width direction W, the width W3 of the second opposing portion 152C is larger than the width W4 of the second lead portion 152X. The second opposing portion 152C and the second lead portion 152X are integrally configured.

[0046] When the first lead portion 151X and the second lead portion 152X are not particularly distinguished, they may simply be referred to as lead portions, and when the first opposing portion 151C and the second opposing portion 152C are not particularly distinguished, they may simply be referred to as opposing portions. Similarly, when the first internal electrode layer 151 and the second internal electrode layer 152 are not particularly distinguished, they may simply be referred to as internal electrode layers. When the first external electrode 120 and the second external electrode 130 are not particularly distinguished, they may simply be referred to as external electrodes.

[0047] 8 is a schematic cross-sectional view for explaining details of the internal electrode layers of the multilayer ceramic capacitor according to the embodiment. The details of the multilayer ceramic capacitor 100 will be explained with reference to FIG.

[0048] Within the body portion 110 in a portion sandwiched in the thickness direction T by the first external electrode 120 provided on the first main surface 111 and the second main surface 112, and within the body portion 110 in a portion sandwiched in the thickness direction T by the second external electrode 130 provided on the first main surface 111 and the second main surface 112, some of the multiple internal electrode layers 150 have a shape that bulges toward one of the first main surface 111 and the second main surface 112.

[0049] Specifically, for example, on the first end face 115 side, the lead-out side of the internal electrode layer 150 arranged closest to the first main surface 111 bulges out towards the first main surface 111 side.

[0050] On the second end face 116 side, the lead-out side of the internal electrode layer 150 arranged one layer closer to the second main face 112 than the internal electrode layer 150 arranged closest to the first main face 111 bulges out toward the first main face 111. On the other hand, the internal electrode layer 150 located closest to the second main face 112 has a flat shape.

[0051] The internal electrode layer 150 bulging toward the first main surface 111 side is not limited to the internal electrode layer 150 arranged closest to the first main surface 111 side and the internal electrode layer 150 adjacent thereto. For example, the internal electrode layer 150 arranged closest to the first main surface 111 side through the third internal electrode layer 150 on the second main surface 112 side may bulge toward the first main surface 111 side. Each of the internal electrode layers 150 from the internal electrode layer 150 arranged closest to the first main surface 111 side up to 20% of the number of stacked internal electrode layers 150 may bulge toward the first main surface 111 side.

[0052] Within the body portion 110 in the portion sandwiched in the thickness direction T by the first external electrode 120 provided on the first main surface 111 and the second main surface 112, the portion of the internal electrode layer 150 that bulges toward the first main surface 111 is not limited to the pull-out portion, and may also include the opposing portion of the portion located on the pull-out portion side.

[0053] Furthermore, a part of the internal electrode layer 150 that does not have an extraction portion provided on the first end face 115 side may bulge toward the first main face 111. In this case, the end side of the internal electrode layer 150 located opposite to the side where the extraction portion is located bulges.

[0054] The same applies to the inside of the element body 110 in the portion sandwiched in the thickness direction T between the second external electrodes 130 provided on the first main surface 111 and the second main surface 112.

[0055] By partially curving the multiple internal electrode layers 150 toward the first main surface 111, the contact area between the inner layer portion C and the first outer layer portion X1 can be increased, thereby making it possible to suppress delamination between the inner layer portion C and the first outer layer portion X1.

[0056] The first end face 115 and the second end face 116 have a shape that is recessed inward in the length direction L toward the center in the thickness direction T. This makes it possible to increase the contact area between the first end face 115 and the first external electrode 120, and the contact area between the second end face 116 and the second external electrode 130. As a result, the connection efficiency between each of the first external electrode 120 and the second external electrode 130 and the internal electrode layer 150 can be improved.

[0057] As shown in Figure 8, if the region on the first end face 115 side of the body portion 110 where adjacent internal electrode layers 150 do not overlap in the thickness direction T, i.e., the region from the end on the first end face 115 side of the region where adjacent internal electrode layers 150 overlap in the thickness direction T to the first end face 115, is defined as Lgap, the length of Lgap along the longitudinal direction L becomes larger as it moves from the first main surface 111 toward the second main surface 112.

[0058] Specifically, for example, the length of Lgap from the internal electrode layer 150 located in the fourth layer from the first main surface 111 side to the first end surface 115 is greater than the length of Lgap from the internal electrode layer 150 located in the second layer from the first main surface 111 side to the first end surface 115. At least, the Lgap from the internal electrode layer 150 located closest to the second main surface 112 side to the first end surface 115 is longer than the Lgap from the internal electrode layer 150 located closest to the first main surface 111 side to the first end surface 115.

[0059] By increasing the length of Lgap in this manner, even if a crack occurs in Lgap of the element body 110, it is possible to prevent a short circuit from occurring between the first internal electrode layer 151 and the second internal electrode layer 152 that are adjacent in the thickness direction T, and ultimately it is possible to prevent the multilayer ceramic capacitor 100 from shorting.

[0060] The above-mentioned shape and length relationship explained using Fig. 8 can be observed by exposing a cross section passing through the center of the width direction of body part 110 and parallel to the length direction L and thickness direction T by polishing or the like, and observing the cross section using an optical microscope, an electron microscope, etc. When observing with an optical microscope or an electron microscope, a bright field and a dark field are used selectively as necessary.

[0061] 9 is a schematic cross-sectional view for explaining the shape of the element part on the end face side and the state of the lead-out parts of the internal electrode layers in the multilayer ceramic capacitor according to the embodiment. Fig. 9 shows a cross section of the element part 110 parallel to the thickness direction T and width direction W on the first end face 115 side.

[0062] 9, the cross section of element body part 110 parallel to thickness direction T and width direction W has a substantially parallelogram shape. In this cross section, the corners are rounded. By making the cross section substantially parallelogram-shaped, the dimension in thickness direction T can be reduced, and the height of multilayer ceramic capacitor 100 can be reduced.

[0063] The multiple first drawn portions 151X may have a width in the width direction W that decreases toward one side in the thickness direction T. Specifically, the multiple first drawn portions 151X may have a width that decreases from the second main surface 112 side toward the first main surface 111 side. The same applies to the multiple second drawn portions 152X.

[0064] If the shortest distance in the width direction from an end of each of the first draw-out portions 151X to the first side surface 113 or the second side surface 114 is defined as Sgm, then Sgm is, for example, 90 μm or more and 110 μm or less. Note that the value of Sgm is not limited to this.

[0065] 9 can be confirmed by polishing element body 110 until first end face 115 is exposed from the first external electrode 120 side, and observing a cross section of element body 110 parallel to thickness direction T and width direction W using an optical microscope, an electron microscope, or the like. When observing with an optical microscope or an electron microscope, a bright field and a dark field are used selectively as necessary.

[0066] 10 is a schematic cross-sectional view for explaining the outer shape of the element body at the center in the longitudinal direction and the state of the opposing portions of the internal electrode layers in a multilayer ceramic capacitor according to an embodiment. Fig. 10 shows a cross section of the element body 110 parallel to the thickness direction T and width direction W at the center of the element body 110 in the longitudinal direction L.

[0067] As shown in FIG. 10, at least one of the internal electrode layers 150, from the internal electrode layer 150 arranged closest to the first main surface 111 to 20% of the number of stacked internal electrode layers 150, protrudes outward in the width direction W more than the internal electrode layer 150 located in the center in the thickness direction.

[0068] At least one of the internal electrode layers 150, from the internal electrode layer 150 arranged closest to the second main surface 112 to 20% of the number of stacked internal electrode layers 150, protrudes outward in the width direction W more than the internal electrode layer 150 located in the center in the thickness direction.

[0069] In this way, the internal electrode layer 150 protruding in the width direction is provided on the first main surface 111 side and the second main surface 112 side, so that the side surfaces 101c, 101d of the laminate 101 have an uneven shape. This increases the contact area between the side surfaces 101c, 101d and the first side margin portion S1 and the second side margin portion S2. This makes it possible to prevent the first side margin portion S1 and the second side margin portion S2 from peeling off from the laminate 101.

[0070] In a cross section of the element body 110 parallel to the thickness direction T and width direction W at the center of the element body 110 in the length direction L, the misalignment in the width direction W between internal electrode layers 150 adjacent to each other in the thickness direction T is less than 3 μm.

[0071] If the shortest distance from the end of the multiple internal electrode layers 150 (more specifically, the opposing portion) in the width direction to the first side surface 113 or the second side surface 114 is taken as Sgc, then Sgc is, for example, 10 μm or more and 20 μm or less. Note that the value of Sgc is not limited to this.

[0072] The above-mentioned Sgm is preferably 5 times or more the above-mentioned Sgc. This makes it difficult for moisture that has infiltrated into first end face 115 or second end face 116 along first side face 113 or second side face 114 to reach the drawn-out portion located at first end face 115 or second end face 116, and improves the moisture resistance reliability of multilayer ceramic capacitor 100.

[0073] In a cross-section of the body portion 110 parallel to the thickness direction T and the width direction W at the central portion of the body portion 110 in the length direction L, the first side surface 113 and the second side surface 114 have a shape that is concave inward in the width direction W as it approaches the central portion in the thickness direction T.

[0074] 10 can be confirmed by polishing element body 110 from the first external electrode 120 side to the center in length direction L, and observing a cross section of element body 110 parallel to thickness direction T and width direction W using an optical microscope, an electron microscope, or the like. When observing with an optical microscope or an electron microscope, a bright field and a dark field are used selectively as necessary.

[0075] Fig. 11 is a schematic cross-sectional view for explaining the detailed shape of the element part of the multilayer ceramic capacitor according to the embodiment. Fig. 11 shows a cross section of the element part 110 passing through the center in the width direction W and parallel to the thickness direction T and the length direction L.

[0076] 11, at both end sides in the longitudinal direction L, the first main surface 111 and the second main surface 112 bulge outward in the thickness direction T. At both end sides in the longitudinal direction L, the element part 110 has thick portions that are thicker than a central part in the longitudinal direction L. More specifically, a region in the element part 110 where the lead-out portion overlaps in the thickness direction has a thick portion that is thicker than a central part of the element part 110 in the longitudinal direction L. The thickness h2 of the thick portions is thicker than the thickness h1 of the central part of the element part 110 in the longitudinal direction L.

[0077] As will be described later, the thick portion is formed in a region where a ceramic paste for eliminating steps is placed on the conductive paste that will become the internal electrode layer 150 in the manufacturing process.

[0078] The body portion 110 is provided so that the thickness gradually increases from an inner position to an outer position along the length direction L from the end of the inner layer portion C in the length direction L for about a length W6, and the thickness gradually decreases from the thickest position toward the end face. The length W6 is a maximum of approximately 5 μm.

[0079] By providing the thick portion as described above, as shown by the arrow AR1, the range covered by the first external electrode 120 or the second external electrode 130 from the first main surface 111 side to the end of the drawn-out portion disposed at a position closest to the first main surface 111 becomes longer than in a configuration in which no thick portion is provided. This makes it difficult for moisture that penetrates from the interface between the first external electrode 120 or the second external electrode 130 and the first main surface 111 to reach the end of the drawn-out portion. As a result, the moisture resistance reliability of the multilayer ceramic capacitor 100 can be improved.

[0080] Fig. 12 is a schematic cross-sectional view for explaining the misalignment in the width direction of the lead-out parts of the internal electrode layers in the multilayer ceramic capacitor according to the embodiment. Note that Fig. 12 is illustrated for the sake of convenience in explaining the amount of misalignment of the lead-out parts, and the shape of the element body part 110, the positions of the lead-out parts, etc. are not limited to the form shown in Fig. 12.

[0081] 12, the amount of deviation D1 in the width direction W between the first drawn portion 151X located closest to the first side surface 113 and the first drawn portion 151X located closest to the second side surface 114 is 3 μm or more. The amount of deviation in the multiple second drawn portions 152X is the same as that of the first drawn portion 151X.

[0082] In this manner, when the widthwise ends of the multiple first extraction portions 151X are not aligned in the thickness direction T but are shifted in the width direction W, a portion of the internal electrode layer 150 adjacent in the thickness direction may be brought into close proximity to one of both widthwise ends 151t1, 151t2 of the multiple first extraction portions 151X.

[0083] In this embodiment, at least one of Si and Mg is segregated at both ends 151t1, 151t2 in the width direction W of each of the multiple first lead portions 151X. Since at least one of Si and Mg is segregated at both ends 151t1, 151t2, the insulation properties of both ends 151t1, 151t2 are improved, so that even if one of both ends 151t1, 151t2 is close to the internal electrode layer 150 adjacent in the thickness direction, it is possible to suppress the occurrence of a short circuit. As a result, the reliability of the multilayer ceramic capacitor 100 can be improved. At least one of Si and Mg is also segregated at each end in the width direction on the side of the multiple second lead portions 152X, and the same effect as described above can be obtained.

[0084] In each of the plurality of first lead portions 151X and the plurality of second lead portions 152X, at least one of Si and Mg is segregated on a main surface on one side in the thickness direction. The main surface on one side in the thickness direction is a main surface on which a ceramic paste for eliminating steps is placed in a manufacturing process of the multilayer ceramic capacitor 100 described later. In this manner, by having at least one of Si and Mg segregated on the main surface on one side in the thickness direction of the lead portion, insulation from the adjacent internal electrode layers 150 can be ensured. This can improve the reliability of the multilayer ceramic capacitor 100.

[0085] The amount of segregation of at least one of Si and Mg at the end in the width direction of each of the plurality of lead portions is greater than the amount of segregation of at least one of Si and Mg at the main surface on one side in the thickness direction of the lead portion, thereby further improving the reliability of the multilayer ceramic capacitor 100.

[0086] In addition, each of the multiple internal electrode layers 150 has a non-connected end portion 150U (see Figure 22) that is not connected to an external electrode on the opposite side in the longitudinal direction to the side on which the pull-out portion is located, and at least one of Si and Mg is segregated in the non-connected end portion 150U as well.

[0087] Fig. 13 is a schematic cross-sectional view for explaining the misalignment in the width direction of the opposing parts of the internal electrode layers in the multilayer ceramic capacitor according to the embodiment. Note that Fig. 13 is illustrated for the sake of convenience in explaining the amount of misalignment of the opposing parts, and the shape of the element part 110, the positions of the opposing parts, etc. are not limited to the form shown in Fig. 13.

[0088] 13, the misalignment D2 in the width direction W between the facing portion located closest to the first side surface 113 and the facing portion located closest to the second side surface 114 among the multiple facing portions (more specifically, the multiple first facing portions 151C and the multiple second facing portions 152C) is smaller than 3 μm. The misalignment D2 is smaller than the above-mentioned misalignment D1 and satisfies the relationship D1>D2. The misalignment in the width direction between adjacent facing portions is also smaller than 3 μm.

[0089] When the thickness of the opposing portion at the end in the width direction W is T1 and the thickness of the drawn-out portion at the end in the width direction is T2 (see FIG. 12), the relationship T1>T2 may be satisfied.

[0090] FIG. 14 is an enlarged schematic cross-sectional view showing an end portion in the width direction of a drawn-out portion of the multilayer ceramic capacitor according to the embodiment.

[0091] As shown in FIG. 14, when the end of the first lead portion 151X in the width direction W is enlarged, the end of the first lead portion 151X is scattered at intervals in the width direction and extends intermittently in the width direction. In the first lead portion 151X, the gap between adjacent portions spaced apart in the width direction is filled with the dielectric layer 140. Here, when the continuity of the end of the first lead portion 151X in the width direction W is C1 and the continuity of the end of the first opposing portion 151C in the width direction W is C2, the relationship C1>C2 is satisfied. As a result, on the first opposing portion 151C side, the ratio of the dielectric layer 140 entering the gap at the end increases, and the dielectric layers 140 adjacent to each other in the thickness direction with the internal electrode layer 150 sandwiched between them are connected to each other by the dielectric layer 140 entering the gap. As a result, it is possible to suppress delamination between the internal electrode layer 150 and the dielectric layer 140. The above-mentioned continuity relationship also applies to the second drawn-out portion 152X and the second opposed portion 152C.

[0092] The continuity of the end of the first lead portion 151X and the continuity of the end of the first opposing portion 151C can be measured as follows. First, in a cross section of the multilayer ceramic capacitor 100 parallel to the width direction and thickness direction, the first external electrode 120 is polished so that the first lead portion 151X is exposed. As the first lead portion 151X to be measured, some of the first lead portions 151X located toward the center in the thickness direction T are selected from the multiple first lead portions 151X.

[0093] At the end of the selected first drawer portion 151X in the width direction W, the measurement range is confirmed by SEM / EDX from the outermost position in the width direction W to a position inward by a length W10, and the widths W11, W12 of the region where Ni is not detected are measured. For each of the selected first drawer portions 151X, a value obtained by (W10-(W11+W12)) / W10 (i.e., a value obtained by subtracting the sum of the widths of the regions where Ni is not detected from the width of the measurement range and dividing the value after subtraction by the width of the measurement range) is calculated, and the average of about 10 of the above values ​​excluding abnormal values ​​is taken as a numerical value indicating continuity.

[0094] The length W10 may be, for example, about 20 μm, and may be set appropriately depending on the size of the multilayer ceramic capacitor 100.

[0095] The continuity of the first opposed portion 151C, the continuity of the second drawn-out portion 152X, and the continuity of the second opposed portion 152C can be calculated in the same manner as described above.

[0096] Fig. 15 is a schematic cross-sectional view for explaining the grain diameter of the multilayer ceramic capacitor according to the embodiment. Note that Fig. 15 is illustrated for convenience in order to explain the region of the element body 110 and the grain diameter in that region, and the shape of the element body 110, the position of the lead-out portion, and the like are not limited to the embodiment shown in Fig. 15. Fig. 15 also shows a state in which a plurality of dielectric layers 140 are manufactured by a solid phase method. In the following explanation, the second side margin portion S2 side will be explained, but the same applies to the first side margin portion S1 side.

[0097] As shown in FIG. 15, the region of the body part 110 between the end of the pull-out part in the width direction and the side surface close to said end can be divided into a first region R1, a second region R2, and a third region R3, in that order from the inner side in the width direction to the outer side in the width direction.

[0098] Specifically, the first region R1 is a portion between the end in the width direction of the first drawn-out portion 151X located on the second side surface 114 side and the second side margin portion S2. The second region R2 and the third region R3 configure the second side margin portion S2.

[0099] In the width direction W, the width of the first region R1 is greater than the width of the second region R2. In the width direction W, the width of the second region R2 is greater than the width of the third region R3. Specifically, the width of the first region R1 is 50 μm or more. The width of the second region R2 is 10 μm or less. The width of the third region R3 is 3 μm or less. These width dimensions are values ​​measured at the center in the thickness direction in a cross section of the element part 110 parallel to the width direction W and the thickness direction T in which the first lead portion 151X is exposed.

[0100] Here, the amount of Mn in the second side margin portion S2 is greater than that in the dielectric layer 140 (more specifically, the inner dielectric layer of the inner layer portion C) of the laminate 101. As a result, the grain diameter of the second side margin portion S2 is smaller than the grain diameter of the dielectric layer 140. Specifically, when the grain diameter of the first region R1 is gr1, the grain diameter of the second region R2 is gr2, and the grain diameter of the third region R3 is gr3, the relationship gr1>gr2>gr3 is satisfied. The grain diameter is the circle equivalent diameter described above.

[0101] As described above, when the dielectric layer 140 and the side margin portion are manufactured using a solid phase method, there are no voids in the grains, and gaps are formed between the grains. Note that the holes formed in the grains are defined as voids, and the gaps formed between the grains are defined as voids. The gaps between the grains refer to a state such as a triple point.

[0102] The amount of voids contained in the second region R2 and the third region R3 is smaller than the amount of voids contained in the first region R1.

[0103] On the other hand, when the multiple dielectric layers 140 are produced using the hydrothermal synthesis method and the side margin portion is produced using the solid phase method, the grain diameter of the dielectric layer 140 (more specifically, the dielectric layer 140 of the inner layer portion C) of the laminate 101 is smaller than the grain diameter of the second side margin portion S2. In this case, voids may be provided within the grains of the dielectric layer 140.

[0104] The pores or voids mentioned above can be observed using an electron microscope such as SEM or TEM.

[0105] Fig. 16 is a schematic cross-sectional view showing a detailed configuration of the external electrodes of the multilayer ceramic capacitor according to the embodiment. The detailed configuration of the external electrodes will be described with reference to Fig. 16. The first external electrode 120 and the second external electrode 130 have almost the same configuration.

[0106] As shown in FIG. 16, the first external electrode 120 and the second external electrode 130 include a base electrode layer 121 provided on the element part 110, a Cu plating layer 122 provided on the base electrode layer 121, a Ni plating layer 123 provided on the Cu plating layer 122, and a Sn plating layer 123 provided on the Ni plating layer 123. That is, the Ni plating layer 123 is provided above the base electrode layer 121. In the thickness of each of the first external electrode 120 and the second external electrode 130, the thickness of the base electrode layer 121 accounts for the largest proportion. Specifically, in a cross section of the multilayer ceramic capacitor 100 passing through the center in the width direction W and parallel to the thickness direction T and the length direction L, the thickness of the base electrode layer 121 accounts for the largest proportion of the thickness of the external electrode along the length direction L at the center in the thickness direction T. As described below, the base electrode layer 121 is a sintered layer containing a common material, which is a dielectric material, and by forming the base electrode layer 121 to be thick, it is possible to suppress the penetration of moisture into the element body 110 during the plating process.

[0107] The base electrode layer 121 contains a dielectric material containing Ni as a main component. When viewed in a cross section of the multilayer ceramic capacitor 100 parallel to the thickness direction T and the length direction L, the base electrode layer 121 contains a dielectric material containing a dielectric component.

[0108] The main component of the base electrode layer 121 is Ni, like the internal electrode layer 150, so there is no diffusion from the base electrode layer 121 to the internal electrode layer 150. If the main component of the base electrode layer 121 is Cu, Cu may interdiffuse from the base electrode layer 121 to the internal electrode layer 150, causing the internal electrode layer 150 located in the vicinity of the first end face 115 and the second end face 116 to expand, which may cause cracks in the element body part 110. In this embodiment, there is no expansion of the internal electrode layer 150 due to diffusion from the base electrode layer 121 to the internal electrode layer 150, and it is possible to suppress cracks in the element body part 110.

[0109] The base electrode layer 121 is fired simultaneously with the element body 110. Since the base electrode layer 121 contains a dielectric material, the shrinkage behavior of the base electrode layer 121 during firing can be made similar to that of the element body 110, and peeling of the base electrode layer 121 from the element body 110 can be suppressed. Furthermore, the connectivity between the first external electrode 120 and the second external electrode 130 and the internal electrode layer 150 can be ensured.

[0110] The Cu plating layer 122 easily adsorbs hydrogen, which can improve reliability. Ni is diffused from the base electrode layer 121 into the Cu plating layer 122. This improves the heat resistance of the Cu plating layer 122.

[0111] Since the Cu plating layer 122 is formed by plating, it does not contain glass or the dielectric material which is a common material, and the Cu plating layer 122 can be formed uniformly and thinly compared to when a Cu layer is formed by applying a paste and baking it.

[0112] The base electrode layer 121, the Cu plating layer 122, the Ni plating layer 123 and the Sn plating layer 123 can be observed using SEM / EDX in a cross section of the multilayer ceramic capacitor 100 passing through the center in the width direction W and parallel to the thickness direction T and the length direction L.

[0113] By applying heat by heat treatment after the formation of the Cu plating layer 122, interdiffusion occurs between the base electrode layer 121 and the Cu plating layer 122. By the interdiffusion, a Cu-Ni alloy layer is formed, and the heat resistance is improved. Similarly, interdiffusion also occurs from the Ni plating layer 123 to the Cu plating layer 122, but since the heat applied after the formation of the Ni plating layer 123 is low, the thickness of the diffusion layer formed between the Ni plating layer 123 and the Cu plating layer 122 is thin. Therefore, the function of the Ni plating layer 123 to suppress solder erosion can be maintained. As described above, Ni is diffused on both the base electrode layer 121 side and the Ni plating layer 123 side in the Cu plating layer 122. This can further improve the heat resistance of the Cu plating layer 122.

[0114] The diffusion layer can be detected in a cross section of the multilayer ceramic capacitor 100 that passes through the center in the width direction W and is parallel to the thickness direction T and length direction L by composition analysis such as WDX or EDX.

[0115] A method for manufacturing the multilayer ceramic capacitor 100 will now be described. First, a ceramic slurry containing ceramic powder, a binder, and a solvent is prepared in order to manufacture the multilayer ceramic capacitor 100. The ceramic powder can be synthesized by a known method such as a solid phase method or a hydrothermal synthesis method.

[0116] The ceramic slurry is formed into a sheet on a carrier film using a die coater, a gravure coater, a microgravure coater, or the like, to produce inner layer ceramic green sheets 23 and outer layer ceramic green sheets 26, which will be described later.

[0117] FIG. 17 is a diagram showing a step of providing a conductive pattern on an inner layer ceramic green sheet in a manufacturing method of a multilayer ceramic capacitor according to an embodiment.

[0118] As shown in FIG. 17, a plurality of strip-shaped conductive patterns 24 extending in a predetermined direction are formed on an inner layer ceramic green sheet 23. The strip-shaped conductive patterns 24 are arranged at intervals in an arrangement direction perpendicular to the extension direction of the conductive patterns 24. The conductive patterns 24 are portions that become the internal electrode layers 150. Each strip-shaped conductive pattern 24 is provided with a plurality of openings 24h at intervals in the extension direction of the conductive pattern 24. The conductive pattern 24 in a portion located between the openings 24h adjacent to each other in the extension direction is a portion that becomes a lead-out portion. The extension direction of the conductive patterns 24 is parallel to the width direction W. The arrangement direction is parallel to the length direction L.

[0119] The conductive pattern 24 is printed on the inner layer ceramic green sheet 23 by screen printing, inkjet printing, gravure printing or the like.

[0120] FIG. 18 is a diagram showing a step of arranging ceramic paste for eliminating steps in a method for manufacturing a multilayer ceramic capacitor according to an embodiment.

[0121] 18, ceramic paste 25 for eliminating steps is applied. Specifically, ceramic paste 25 is applied along the above-mentioned extending direction to regions on inner-layer ceramic green sheets 23 where conductive patterns 24 are not formed, and ceramic paste 25 is applied onto each conductive pattern 24 so as to fill multiple openings 24h aligned in the above-mentioned extending direction.

[0122] In order to facilitate alignment, the ceramic paste 25 is applied in a manner that partially overlaps the conductive pattern 24. In the arrangement direction in which the plurality of conductive patterns 24 are arranged, the ceramic paste 25 applied to the outside of each conductive pattern 24 preferably overlaps the conductive pattern 24 within a range of 5 μm from the end of the conductive pattern 24 in the arrangement direction.

[0123] The ceramic paste 25 is printed by, for example, screen printing, inkjet printing, or gravure printing.

[0124] The ceramic paste 25 may be made of the same material as the material of the inner layer ceramic green sheets 23, or may be made of a material containing a component different from the material of the inner layer ceramic green sheets 23. As described above, when at least one of Si and Mg is to be segregated at both ends in the width direction of the drawn-out portion and on one main surface in the thickness direction of the drawn-out portion, at least one of Si and Mg is added to the ceramic paste 25.

[0125] In the above, the case where the ceramic paste 25 is applied after the conductive pattern 24 is applied has been exemplified, but the conductive pattern 24 may be applied after the ceramic paste 25 is applied.

[0126] Fig. 19 is a diagram showing a step of laminating a plurality of inner layer ceramic green sheets and a plurality of outer layer ceramic green sheets in a manufacturing method of a multilayer ceramic capacitor according to an embodiment. Note that Fig. 19 shows a state in which a plurality of inner layer ceramic green sheets 23 and a plurality of outer layer ceramic green sheets 26 are laminated as viewed from the direction of arrow XIX shown in Fig. 18.

[0127] 19, a plurality of inner layer ceramic green sheets 23 coated with a conductive pattern 24 and a ceramic paste 25, and a plurality of outer layer ceramic green sheets 26 are laminated together. By making the outer layer ceramic green sheets 26 contain more Mn than the inner layer ceramic green sheets 23, the first outer layer portion X1 and the second outer layer portion X2 can be densified.

[0128] The plurality of inner layer ceramic green sheets 23 are sequentially stacked so that they are shifted in the arrangement direction by half the printing pitch of the conductive patterns 24. Specifically, the plurality of inner layer ceramic green sheets 23 are stacked so that the openings 24h of the conductive patterns 24 provided in the inner layer ceramic green sheets 23 adjacent to each other in the stacking direction are alternately aligned in the arrangement direction when viewed from the stacking direction. The stacking method is approximately parallel to the thickness direction T, and the arrangement direction is approximately parallel to the length direction L.

[0129] A plurality of outer layer ceramic green sheets 26 are laminated on both sides of the laminated inner layer ceramic green sheets 23 in the lamination direction.

[0130] Next, the laminated inner layer ceramic green sheets 23 and outer layer ceramic green sheets 26 are thermocompression bonded to form a structure 200 (see FIG. 20).

[0131] Fig. 20 is a diagram showing a step of cutting a structure in which a plurality of inner layer ceramic green sheets and a plurality of outer layer ceramic green sheets are thermocompression-bonded in a manufacturing method of a multilayer ceramic capacitor according to an embodiment. Note that Fig. 20 shows a schematic plan view of the structure, but for convenience, the outer layer ceramic green sheet 26 is omitted, and only the inner layer ceramic green sheet 23 on which the conductive pattern 24 is formed is shown in plan view.

[0132] As shown in Fig. 20, the structure 200 is cut along cut lines CL1 and CL2 to cut out the laminated chip 10 (see Fig. 21). The cut line CL1 is parallel to the length direction L. The cut line CL2 is parallel to the width direction W. The structure 200 is cut by push cutting using a push cutting blade, dicing using a cutting blade, laser cutting, or the like. The laminated chip is the part that becomes the laminate 101.

[0133] Fig. 21 is a diagram showing an area in a singulated laminated chip where a ceramic paste for eliminating steps is arranged. Fig. 21 shows a cross section of the laminated chip 10 parallel to the length direction L and width direction W, and the area in which the conductive pattern 24 is formed is indicated by a dashed line. In the laminated chip 10, the conductive pattern 24 includes an extraction region 24X that serves as an extraction portion and an opposing region 24C that serves as an opposing portion.

[0134] The ceramic paste 25 for eliminating the step overlaps the conductive pattern 24 in regions R6 and R7. Region R6 is composed of a region in which the lead-out region 24X is formed and a facing region 24C located closer to the lead-out region 24X. Region R7 is a region on the end side of the facing region 24C located on the opposite side to the side where the lead-out region 24X is located.

[0135] In this manner, the conductive pattern 24 that becomes the internal electrode layer 150 and the ceramic paste 25 that constitutes part of the dielectric layer 140 overlap in regions R6 and R7, so that a portion of the laminate 101 is raised on both sides in the longitudinal direction L, as described above.

[0136] Furthermore, at least one of Si and Mg can be added to the ceramic paste 25 for eliminating the step, so that at least one of Si and Mg can be segregated in the regions R6 and R7 of the internal electrode layer 150.

[0137] Next, ceramic paste for sides is applied to both end faces in the width direction of the laminated chip 10. Specifically, the ceramic paste is filled into a plurality of recesses (grooves) provided on the application surface of the plate, and the end faces in the width direction of the laminated chip 10 are brought into contact with the application surface. This allows the ceramic paste for sides to be applied only to the end faces by capillary action. The applied ceramic paste for sides is fired to become the first side margin portion S1 and the second side margin portion S2.

[0138] The ceramic paste for the sides may be made of the same material as that of the inner layer ceramic green sheets 23, or may be made of a material containing a component different from that of the inner layer ceramic green sheets 23. By making the ceramic paste for the sides contain more Mn than the inner layer ceramic green sheets 23, the first side margin portion S1 and the second side margin portion S2 can be densified. The ceramic powder contained in the ceramic paste for the sides is synthesized by, for example, a solid phase method.

[0139] Next, the first external electrode 120 and the second external electrode 130 are formed on both end faces (first end face 115, second end face 116) of the element body 110, respectively. Specifically, a paste containing Ni as a main component and a common material that is a dielectric material is applied to both end faces of the element body 110. As an application method, for example, a method of forming a paste layer that becomes a base electrode layer on a plate and immersing the end faces of the element body 110 in the paste layer can be adopted. After application, the element body 110 and the base electrode layer 121 are fired together. After firing, plating is performed in the following order: Cu plating, Ni plating, and Sn plating. As a plating method, electrolytic plating is preferable.

[0140] Fig. 22 is a diagram showing a state in which a segregation region occurs in a part of the internal electrode layer in the sintered element body. As shown in Fig. 22, in the internal electrode layer 150 (more specifically, the first internal electrode layer 151) of the element body 110, at least one of Si and Mg contained in the ceramic paste 25 overlapping the conductive pattern 24 is segregated in the above-mentioned regions R6 and R7.

[0141] In region R6, at least one of Si and Mg is segregated in one main surface of the first drawn portion 151X in the thickness direction and in one main surface of the first opposing portion 151C located on the first drawn portion 151X side. In particular, in both ends 151t1, 151t2 in the width direction W of the outer periphery of region R6, the amount of segregation of at least one of Si and Mg is larger than that of the inner region R8 in region R6.

[0142] In the region R7, at least one of Si and Mg is segregated in the main surface on one side of the first opposing portion 151C on the end side located opposite to the side located on the first drawn portion 151X side in the longitudinal direction L. In particular, in the first side margin portion S1, the second side margin portion S2, and the portion along the dielectric layer 140 in the outer periphery of the region R7, the amount of segregation of at least one of Si and Mg is larger than that in the inner region R9 in the region R7. That is, in the internal electrode layer, the amount of segregation of at least one of Si and Mg is larger in the substantially U-shaped unconnected end portion 150U located opposite to the side where the drawn portion is located in the longitudinal direction L and not connected to the external electrode.

[0143] Similarly to the first internal electrode layer 151, in the second internal electrode layer 152, at least one of Si and Mg is segregated.

[0144] Through the above steps, the multilayer ceramic capacitor 100 according to the embodiment can be manufactured. Furthermore, in the multilayer ceramic capacitor 100 having a configuration in which the width of the lead-out portion of the internal electrode layer 150 led to the end face of the element part 110 is narrower than the opposing portion of the internal electrode layer 150, the connectivity between the internal electrode layer 150 and the external electrode can be ensured.

[0145] In the above description of the embodiments, configurations that can be combined may be combined with each other.

[0146] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0147] 10 laminated chip, 23 inner layer ceramic green sheet, 24 conductive pattern, 24C opposing region, 24X lead-out region, 24h opening, 25 ceramic paste, 26 outer layer ceramic green sheet, 100 laminated ceramic capacitor, 101 laminate, 101a, 101b main surface, 101c, 101d side surface, 101e, 101f end surface, 110 element part, 111 first main surface, 112 second main surface, 113 first side surface, 114 second side surface, 115 first end surface, 116 second end surface, 120 first external electrode, 121 base electrode layer, 122, 123 plating layer, 130 second external electrode, 140 dielectric layer, 150 internal electrode layer, 150U non-connected end portion, 151 first internal electrode layer, 151C first opposing portion, 151X first lead-out portion, 151t2, 151t1 both ends, 152 second internal electrode layer, 152C second opposing portion, 152X second lead-out portion, 200 structure, C inner layer portion, CL1, CL2 cut line, D1, D2 displacement amount, E1 first end margin portion, E2 second end margin portion, R1 first region, R2 second region, R3 third region, R6, R7 regions, R8, R9 inner region, S1 first side margin portion, S2 second side margin portion, X1 first outer layer portion, X2 second outer layer portion.

Claims

1. an element portion having a first main surface and a second main surface opposed to each other in a thickness direction, a first side surface and a second side surface opposed to each other in a width direction, and a first end surface and a second end surface opposed to each other in a length direction, the element portion including a plurality of dielectric layers and a plurality of internal electrode layers stacked in the thickness direction; an external electrode provided on each of the first end surface and the second end surface and electrically connected to the plurality of internal electrode layers; each of the plurality of internal electrode layers has an opposing portion opposing an internal electrode layer adjacent to the internal electrode layer in the thickness direction, and a lead portion connecting the opposing portion and the external electrode; In the width direction, the width of the facing portion is larger than the width of the pull-out portion, the external electrode includes a base electrode layer provided on the element body portion, a Ni plating layer provided above the base electrode layer, and a Sn plating layer provided on the Ni plating layer, The base electrode layer comprises Ni as a main component and a dielectric material.

2. a Cu plating layer is provided on the base electrode layer, The Ni plating layer is provided on the Cu plating layer, 2. The multilayer ceramic capacitor according to claim 1, wherein a thickness of said base electrode layer accounts for the largest proportion of a thickness of said external electrodes.

3. 3. The multilayer ceramic capacitor according to claim 2, wherein Ni is diffused into the Cu plating layer.

4. 4. The multilayer ceramic capacitor according to claim 3, wherein Ni is diffused into both the base electrode layer side and the Ni plating layer side of the Cu plating layer.

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